Electronic component mounting substrate and electronic device

Abstract

An electronic component mounting substrate according to one embodiment of the present disclosure includes a substrate and a plurality of electrodes. The substrate has an electronic component mounting region. The plurality of electrodes are arranged to surround the electronic component mounting region. In addition, the substrate includes the electronic component mounting region and has at least one of a first protrusion spanning between the plurality of electrodes or a second protrusion spanning between the plurality of electrodes from the outer edge of the substrate when viewed from above.

Description

Technical Field

[0001] The present disclosure relates to a substrate for mounting electronic components, an electronic device, and an electronic module, which are mounted with electronic components, such as imaging elements such as CCD (Charge Coupled Device) type or CMOS (Complementary Metal Oxide Semiconductor) type, light-emitting elements such as LED (Light Emitting Diode), elements or integrated circuits with sensor functions such as pressure, air pressure, acceleration, gyroscope, etc. Background Art

[0002] A substrate for mounting electronic components is known, which includes a wiring substrate including an insulating layer. In addition, such a substrate for mounting electronic components may have an insulating film or insulating layer applied to the front and back surfaces (see Japanese Patent Application Publication No. 2000-188351).

[0003] There is known an electronic component mounting substrate having an electronic component mounting region on the surface of a base body and a plurality of electrodes surrounding a component mounted in the electronic component mounting region. In addition, the electronic component mounting substrate is required to be lower in height and is being thinned.

[0004] With this thinning, the substrate is being thinned, but the thinning of the substrate will lead to a decrease in the mechanical strength of the electronic component mounting substrate. Therefore, the following operation is performed, that is, the thickness of the substrate is partially thickened by lamination or bonding (see Japanese Patent Publication No. 2000-188351).

[0005] When laminating or bonding the substrate to increase the thickness of the substrate, a laminating liquid or bonding liquid is used. However, if such a liquid reaches the electrode, there is a concern that the wire may be broken. Therefore, a substrate for mounting electronic components with a low possibility of breaking and excellent mechanical strength is required. Summary of the invention

[0006] An electronic component mounting substrate according to one embodiment of the present disclosure includes a substrate and a plurality of electrodes. The substrate has an electronic component mounting region. The plurality of electrodes are arranged to surround the electronic component mounting region. In addition, the substrate includes the electronic component mounting region and has at least one of a first protrusion spanning between the plurality of electrodes or a second protrusion spanning between the plurality of electrodes from the outer edge of the substrate when viewed from above. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 (a) is a plan view showing the appearance of the electronic component mounting substrate and the electronic device according to the first embodiment of the present disclosure, Figure 1 (b) is related to Figure 1 (a) is a longitudinal sectional view corresponding to the X1-X1 line.

[0008] Figure 2 (a) is a plan view showing the appearance of an electronic component mounting substrate and an electronic device according to another aspect of the first embodiment of the present disclosure, Figure 2 (b) is related to Figure 2 (a) is a longitudinal cross-sectional view corresponding to the X2-X2 line.

[0009] Figure 3 (a) is a plan view showing the appearance of an electronic component mounting substrate and an electronic device according to a second embodiment of the present disclosure, Figure 3 (b) is related to Figure 3 (a) is a longitudinal sectional view corresponding to the line X3-X3.

[0010] Figure 4 (a) is a plan view showing the appearance of an electronic component mounting substrate and an electronic device according to a third embodiment of the present disclosure, Figure 4 (b) is related to Figure 4 (a) is a longitudinal sectional view corresponding to the X4-X4 line.

[0011] Figure 5 (a) is a plan view showing the appearance of an electronic module according to another aspect of the third embodiment of the present disclosure, Figure 5 (b) is related to Figure 5 (a) is a longitudinal sectional view corresponding to the X5-X5 line.

[0012] Figure 6 (a) is a plan view showing the appearance of the electronic component mounting substrate and the electronic device according to the fourth embodiment of the present disclosure, with the cover omitted. Figure 6 (b) is related to Figure 6 (a) is a longitudinal sectional view corresponding to the X6-X6 line.

[0013] Figure 7 (a) is a plan view showing the appearance of an electronic component mounting substrate and an electronic device according to another aspect of the fourth embodiment of the present disclosure, with the cover omitted, Figure 7 (b) is Figure 7 (a) is an enlarged view of a main portion A of a substrate for mounting an electronic component.

[0014] Figure 8 (a) and Figure 8 (b) is Figure 7 This is an enlarged modification of the main portion A of the electronic component mounting substrate shown in (a).

[0015] Fig. 9 (a) and Fig. 9 (b) is Figure 7 This is an enlarged modification of the main portion A of the electronic component mounting substrate shown in (a).

[0016] Fig.10 yes Figure 7 This is an enlarged modification of the main portion A of the electronic component mounting substrate shown in (a).

[0017] Fig.11 (a) and Fig.11 (b) is Figure 7 This is an enlarged modification of the main portion A of the electronic component mounting substrate shown in (a).

[0018] Fig.12 (a) is a plan view showing the appearance of an electronic component mounting substrate and an electronic device according to a fifth embodiment of the present disclosure, Fig.12 (b) is related to Fig.12 (a) is a longitudinal cross-sectional view corresponding to the X12-X12 line. DETAILED DESCRIPTION

[0019] <Structure of electronic component mounting substrate and electronic device>

[0020] Hereinafter, several exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the following description, a structure in which an electronic component is mounted on a substrate for mounting an electronic component is referred to as an electronic device. In addition, a structure having a housing or a member arranged to be located on the upper surface side of a substrate for mounting an electronic component or arranged to surround an electronic device is referred to as an electronic module. The substrate for mounting an electronic component, the electronic device, and the electronic module can have any direction as the top or the bottom, but for convenience, an orthogonal coordinate system xyz is defined, and the positive side in the z direction is referred to as the top.

[0021] The electronic component mounting substrate 1 according to the embodiment of the present disclosure comprises a substrate 2a, a frame 2b and a plurality of electrodes 3 (hereinafter, also referred to as electrode pads 3). The substrate 2a has an electronic component mounting area 4 (hereinafter, referred to as mounting area 4) for mounting electronic components. In addition, the plurality of electrodes 3 do not surround the mounting area 4. The substrate 2a includes the mounting area 4 and has at least one of the first protrusion 2aa spanning between the plurality of electrodes 3 or the second protrusion 2ab spanning between the plurality of electrodes 3 from the outer edge of the substrate 2a when viewed from above. In other words, the substrate 2a may have only the first protrusion 2aa, may have only the second protrusion 2ab, or may have both the first protrusion 2aa and the second protrusion 2ab.

[0022] In the substrate 2a, the portion corresponding to the first convex portion 2aa and / or the second convex portion 2ab, for example, when the substrate 2a includes a ceramic material, may be laminated with at least one layer, or may be laminated with a ceramic paste or the like. In addition, components formed as independent bodies may be joined using a bonding material or the like. In addition, in the substrate 2a, the portion corresponding to the first convex portion 2aa and / or the second convex portion 2ab, for example, when the substrate 2a includes a resin material, may be processed so that at least the region where the plurality of electrodes 3 are provided becomes a depression. In addition, components formed as independent bodies may be joined using a bonding material or the like. In addition, they may be combined.

[0023] Hereinafter, embodiments related to the present disclosure will be described.

[0024] (First embodiment)

[0025] Reference Figure 1 as well as Figure 2 An electronic device 21 and an electronic component mounting substrate 1 according to a first embodiment of the present disclosure will be described.

[0026] The substrate 2a of the electronic component mounting substrate 1 has a first substrate portion 2d and a second substrate portion 2e. The second substrate portion 2e is located on the upper surface 2da of the first substrate portion 2d. The second substrate portion 2e is located at a position corresponding to the first protrusion 2aa and / or the second protrusion 2ab. The second substrate portion 2e may have a plurality of insulating layers. For example, in the case where the substrate 2a has at least the first protrusion 2aa, the second substrate portion 2e has at least one (one) insulating layer 2c having a mounting area 4 for mounting the electronic component 10 on the upper surface. The substrate 2a has a plurality of electrode pads 3 located on the upper surface of the substrate 2a and arranged to surround the mounting area 4 when viewed from above. The first protrusion 2aa is arranged to span between the plurality of electrodes 3. At this time, it is preferable that the first protrusion 2aa does not cover at least a portion of the plurality of electrodes 3. Therefore, the plurality of electrode pads 3 have a portion exposed above. In addition, the so-called spanning between the plurality of electrodes refers to a case where there is at least an area extending further toward the plurality of electrodes 3 than the mounting area 4.

[0027] Here, the mounting area 4 is an area where at least one electronic component 10 is mounted, and can be appropriately determined, for example, the inner side of the outermost periphery of the electrode pad 3 described later, the area where the cover is mounted, or above it. In addition, the components mounted in the mounting area 4 are not limited to the electronic components 10, and may be electronic parts, for example, and the number of electronic components 10 and / or electronic parts is not specified.

[0028] The second substrate portion 2e has at least one (one layer) insulating layer 2c. The insulating layer 2c may be made of the same material as the first substrate portion 2d, or may be made of a different type of material. When the insulating layer 2c is made of the same material as the first substrate portion 2d, the difference in thermal expansion between the insulating layer 2c and the first substrate portion 2d can be reduced, and the stress caused by the difference in thermal expansion during the process of mounting electronic components and the thermal history of driving electronic modules can be reduced, so that it can be used stably. In addition, when the insulating layer 2c is made of a different type of material from the first substrate portion 2d, it is possible to reduce deformation of the substrate 2a, especially the first substrate portion 2d, when manufacturing the base 2 due to the difference in shrinkage of the insulating layer 2c made of a different type of material.

[0029] like Figure 2 As shown in the example, the base 2 may also have a substrate 2a and a frame 2b. The frame 2b may be made of the same material as the substrate 2a or a different material. When the frame 2b is made of the same material as the substrate 2a, the difference in thermal expansion between the frame 2b and the substrate 2a can be reduced, and the stress caused by the difference in thermal expansion in the process of mounting electronic components and the thermal history of driving the electronic module can be reduced, so that it can be used stably. In addition, when the frame 2b is made of a different material from the substrate 2a, the deformation of the substrate 2a during the manufacture of the base 2 can be suppressed by the deformation caused by the difference in shrinkage of the frame 2b made of a different material. Here, the frame 2b may be integrated with the substrate 2a or an independent body may be joined. When the frame 2b is integrated with the substrate 2a, since there is no joint between the frame 2b and the substrate 2a, the strength of the portion corresponding to the joint is excellent compared to the structure in which the independent body is joined. Furthermore, when the frame 2b and the substrate 2a are independent bodies, the frame 2b and the substrate 2a can be manufactured more easily than when they are formed into an integral shape, so the degree of freedom of shape is increased.

[0030] In such Figure 2 When the frame 2b is provided as in the example shown, it is possible to reduce the occurrence of scratches or foreign matter attached to the surface of the electrode pad 3 due to the processing of the mounting process of the electronic component 10. By reducing the scratches on the electrode pad 3 or the attachment of foreign matter, the connection member 13 cannot be mounted or the strength of the connection member 13 is deteriorated.

[0031] exist Figure 1 as well as Figure 2 In the example shown, the base body 2 having the substrate 2a and the frame body 2b includes a plurality of insulating layers. In addition, for example, it may be a structure formed by a mold, a structure formed by pressing a mold, or a structure having only one layer. The material constituting the insulating layer of the base body 2 includes, for example, electrically insulating ceramics or resins.

[0032] Electrically insulating ceramics used as materials for forming the insulating layer of the base 2 include, for example, alumina sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, silicon nitride sintered bodies, or glass ceramic sintered bodies. Resins used as materials for forming the insulating layer of the base 2 include, for example, thermoplastic resins, epoxy resins, polyimide resins, acrylic resins, phenolic resins, or fluorine-based resins. Fluorine-based resins include, for example, tetrafluoroethylene resins.

[0033] like Figure 2 As shown, the base 2 may include six insulating layers, or may include five or less insulating layers or seven or more insulating layers. When the insulating layers are five or less, the electronic component mounting substrate 1 can be made thinner. In addition, when the insulating layers are seven or more, the rigidity of the electronic component mounting substrate 1 can be improved.

[0034] The electronic component mounting substrate 1 has, for example, a side of the outermost periphery of 0.3 mm to 10 cm, and when viewed from above, the electronic component mounting substrate 1 may be a quadrilateral, such as a square or a rectangle. In addition, for example, the thickness of the electronic component mounting substrate 1 is 0.2 mm or more.

[0035] The substrate 2a includes a plurality of electrodes 3 (electrode pads 3) located on the upper surface of the substrate 2a and arranged to surround the mounting region 4 in a plan view. Here, the electrode pads 3 are pads electrically connected to the electronic element 10, for example.

[0036] In addition, external circuit connection electrodes may be provided on the upper surface, side surface or lower surface of the base 2 of the electronic component mounting substrate 1. The external circuit connection electrodes may also electrically connect the base 2 to an external circuit substrate or the electronic device 21 to an external circuit substrate.

[0037] Furthermore, in addition to the electrode pads 3 and / or the external circuit connection electrodes, electrodes formed between insulating layers, internal wiring conductors, and through conductors that connect the internal wiring conductors to each other may be provided on the upper or lower surface of the substrate 2. These electrodes, internal wiring conductors, or through conductors may be exposed on the surface of the substrate 2. The electrode pads 3 and / or the external circuit connection electrodes may also be electrically connected, respectively, through the electrodes, internal wiring conductors, or through conductors.

[0038] In the case where the substrate 2 includes an electrically insulating ceramic, the electrode pad 3, the electrode for connecting the external circuit, the internal wiring conductor and / or the through conductor include tungsten (W), molybdenum (Mo), manganese (Mn), palladium (Pd), silver (Ag) or copper (Cu) or an alloy containing at least one or more metal materials selected from them. In addition, it can also be composed of copper (Cu) only. In addition, in the case where multiple layers include resin, the electrode pad 3, the electrode for connecting the external circuit, the internal wiring conductor and / or the through conductor include copper (Cu), gold (Au), aluminum (Al), nickel (Ni), molybdenum (Mo), palladium (Pd) or titanium (Ti) or an alloy containing at least one or more metal materials selected from them.

[0039] The electrode pad 3, the electrode for external circuit connection, the internal wiring conductor or / and the exposed surface of the through conductor may further have a plating layer. According to this structure, the exposed surface of the electrode for external circuit connection, the conductor layer and the through conductor can be protected to reduce oxidation. In addition, according to this structure, the electrode pad 3 and the electronic component 10 can be well electrically connected via the connecting conductor 13 such as a welding wire. The plating layer may, for example, cover a Ni plating layer with a thickness of 0.5 μm to 10 μm, or may cover the Ni plating layer and a gold (Au) plating layer with a thickness of 0.5 μm to 3 μm in sequence.

[0040] With the thinning of various components such as smartphones, tablets, and PCs in recent years, the thinning of the substrate is being promoted, but the thinning of the substrate will lead to a decrease in the mechanical strength of the substrate for mounting electronic components. Therefore, it is necessary to partially thicken the thickness of the substrate by lamination or bonding. However, when lamination or bonding is performed to increase the thickness of a portion of the substrate, a lamination liquid or an adhesive liquid is used, but if such a liquid reaches the electrode, there is a concern that a disconnection will occur. Therefore, a substrate for mounting electronic components with a low possibility of disconnection and excellent mechanical strength is required. In the present disclosure, as in the above-mentioned structure, by setting the convex portion of the substrate 2a, that is, the thick portion, to span between the multiple electrodes 3, the risk of disconnection of the multiple electrodes 3 can be reduced while maintaining the mechanical strength.

[0041] In addition, it is preferable that at least a portion of the plurality of electrode pads 3 is exposed upward. In other words, the surface of the substrate 2a is not entirely covered by the insulating layer 2c, and the exposed portion of the electrode pad 3 is not covered by the insulating layer 2c. By providing the exposed portion of the electrode 3, the laminating liquid or adhesive liquid used during printing and lamination will disperse and penetrate into the electronic component mounting substrate 1. By dispersing and penetrating the laminating liquid or adhesive liquid, it is possible to reduce the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate 1. In addition, by providing the exposed portion of the electrode pad 3 not covered by the insulating layer 2c, it is possible to reduce the amount of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate. According to these circumstances, the strength of the insulating layer can be reduced, and the occurrence of undesirable conditions such as cracks and disconnections can be reduced.

[0042] like Figure 1 As shown in the example, the insulating layer 2c is located at the first convex portion 2aa, which overlaps with the mounting region 4 in a plan view. The electronic component 10 is mounted on the mounting region 4, and an adhesive is sometimes used in the process of mounting the electronic component 10. In this case, the surface of the insulating layer 2c can be made rougher than the surface of the substrate 2 not covered by the insulating layer 2c. By making the surface roughness of the insulating layer 2c rougher than the surface roughness of the substrate 2 not covered by the insulating layer 2c, the bonding strength between the adhesive and the insulating layer 1c can be improved by the anchor effect.

[0043] like Figure 1 As shown in the example, the insulating layer 2c may also be located at a position overlapping with the mounting area 4 when viewed from above, and the outer edge of the insulating layer 2c is a curve when viewed from above. That is, the outer edge of the first protrusion 2aa may have a curved portion. In this way, by having at least a portion of the outer edge of the insulating layer 2c have a curved portion when viewed from above, the boundary between the plurality of electrodes 3 and the stacked portion can be enlarged. Therefore, it is possible to reduce the situation of disconnection of the plurality of electrodes 3 while maintaining mechanical strength. In addition, since the boundary portion of the insulating layer where the strength difference is generated becomes larger, it is possible to reduce the occurrence of undesirable situations such as cracks in the electronic component mounting substrate 1 and disconnection of the internal wiring conductor caused by the cracks.

[0044] Furthermore, if Figure 1 as well as Figure 2As in the example shown, the upper end of a portion of the outer edge of the insulating layer 2c can also be located above the upper ends of the plurality of electrode pads 3. In other words, the upper end of the first protrusion 2aa can be located above the upper ends of the plurality of electrodes 3. The insulating layer 2c of the present embodiment has a mounting area 4 for mounting the electronic component 10. A plurality of electrode pads 3 are provided to surround the mounting area 4. By providing the electrode pads 3 to surround the insulating layer 2c having the mounting area 4, it is possible to reduce the occurrence of scratches, attachment of foreign matter, etc. on the surface of the electrode pads 3 due to the processing of the process of mounting the electronic component 10, etc. It is possible to reduce the occurrence of scratches on the electrode pads 3, attachment of foreign matter, etc., which results in the inability to mount the connecting member 13 and the deterioration of the strength of the connecting member 13.

[0045] <Structure of electronic device>

[0046] exist Figure 1 to Figure 2 An example of an electronic device 21 is shown. The electronic device 21 includes a substrate 1 for mounting an electronic component and an electronic component 10 mounted on the upper surface of the substrate 1 for mounting an electronic component.

[0047] The electronic device 21 has an electronic component mounting substrate 1 and an electronic component 10 mounted on a mounting area 4 of a substrate 2a of the electronic component mounting substrate 1. As an example of the electronic component 10, for example, a camera element such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting element such as an LED (Light Emitting Diode), an element with sensor functions such as pressure, air pressure, acceleration, and a gyroscope, or an integrated circuit, etc. In addition, the electronic component 10 can also be arranged on the upper surface of the substrate 2a via an adhesive material. The adhesive material, for example, uses silver epoxy or a thermosetting resin.

[0048] The electronic component 10 and the electronic component mounting substrate 1 may be electrically connected via a connecting member 13 , for example.

[0049] The electronic device 21 may include a cover 12 that covers the electronic component 10 and is bonded to the upper surface of the electronic component mounting substrate 1 .

[0050] The cover 12 is made of a highly transparent member such as glass material when the electronic element 10 is, for example, an imaging element such as CMOS, CCD or a light emitting element such as LED. In addition, the cover can also be made of a metal material, a ceramic material or an organic material when the electronic element 10 is, for example, an integrated circuit.

[0051] The lid 12 may be bonded to the electronic component mounting substrate 1 via a bonding material 14. Examples of the material constituting the bonding material 14 include thermosetting resins, low melting point glass, and brazing materials containing metal components.

[0052] As a material constituting the bonding material 14, for example, in the case of an insulating material such as a thermosetting resin or a low melting point glass, Figure 3 As shown in the example, if the bonding material 14 also covers the bonding portion between the electrode pad 3 and the connecting member 13, the bonding portion between the connecting member 13 and the electrode pad 3 can be strengthened. Therefore, the connection strength between the connecting member 13 and the electrode pad 3 (tensile strength toward the upper surface of the connecting member 13) can be improved.

[0053] When the material constituting the bonding material 14 is conductive, such as a solder containing a metal component, or when the cover 12 is made of a conductive material such as a metal material, the electronic component 10 can be shielded from electromagnetic waves, thereby reducing malfunctions caused by electromagnetic waves.

[0054] <Method for manufacturing electronic component mounting substrate and electronic device>

[0055] Next, an example of a method for manufacturing the electronic component mounting substrate 1 and the electronic device 21 of the present embodiment will be described. In addition, an example of a manufacturing method described below is a method for manufacturing the base body 2 using a multi-piece access type wiring substrate.

[0056] (1) First, a ceramic green sheet constituting the base 2 (substrate 2a, frame 2b) is formed. For example, in the case of obtaining a base 2 of an aluminum oxide (Al2O3) sintered body, powders such as silicon dioxide (SiO2), magnesium oxide (MgO) or calcium oxide (CaO) are added to the Al2O3 powder as a sintering aid, and a suitable binder, solvent and plasticizer are further added. Then, the mixture is kneaded to form a slurry. Then, a plurality of ceramic green sheets for acquisition are obtained by a molding method such as a scraper method or a calender roll method.

[0057] In addition, when the base 2 contains resin, for example, the base 2 can be formed by using a mold that can be molded into a given shape by transfer molding, injection molding, or pressing with a mold, etc. In addition, the base 2 can also be obtained by impregnating a resin in a base material containing glass fibers, such as glass epoxy resin. In this case, the base 2 can be formed by impregnating an epoxy resin precursor in a base material containing glass fibers and thermally curing the epoxy resin precursor at a given temperature.

[0058] (2) Next, the green sheet is processed by a mold or the like. Here, an opening is formed in the frame 2b. In addition, when the base 2 has a notch or the like, the notch or the like may be similarly formed at a predetermined position of the green sheet serving as the base 2.

[0059] (3) Next, the ceramic green sheets that will become the insulating layers of the base 2 are stacked and pressed. In this way, the green sheets that will become the insulating layers can be stacked to produce a ceramic green sheet stack that will become the base 2 (electronic component mounting substrate 1). In addition, at this time, a portion such as a cutout portion can be appropriately produced using a mold or the like.

[0060] The insulating layer 2c can be formed from a ceramic green sheet. Each of the insulating layers may be made of the same material as the base 2 or a different material.

[0061] (4) Next, the ceramic green sheet or ceramic green sheet laminate obtained in the above-mentioned steps (1) to (3) is coated or filled with metal paste on the parts that become electrode pads 3, external circuit connection electrodes, internal wiring conductors, and internal through-conductors by screen printing or the like. The metal paste is prepared by adding a suitable solvent and a binder to a metal powder containing the aforementioned metal material, kneading the mixture, and adjusting the viscosity to a moderate level. In addition, in order to improve the bonding strength with the substrate 2, the metal paste may also contain glass or ceramics. In addition, at this time, an insulating layer 2c can be formed by screen printing. The insulating layer 2c may be the same material as the substrate 2, or a different material.

[0062] When the base 2 is made of resin, the electrode pads 3, external circuit connection electrodes, internal wiring conductors and through conductors can be produced by sputtering, vapor deposition, etc. Alternatively, they can be produced by plating after providing a metal film on the surface.

[0063] (5) Next, dividing grooves may be provided at given positions of the green sheet using a mold, punching, or laser, etc. The dividing grooves can be formed by cutting into the multi-piece wiring board with a slicing device after firing, but may also be formed by pressing a cutter against the ceramic green sheet stack for the multi-piece wiring board, or by cutting into the ceramic green sheet stack with a slicing device, which is smaller than the thickness of the ceramic green sheet stack.

[0064] (6) Next, the ceramic green sheet stack is fired at a temperature of about 1500° C. to 1800° C. to obtain a multi-piece access wiring substrate having a plurality of bases 2 (electronic component mounting substrates 1) arranged therein. In addition, through this process, the aforementioned metal paste is fired simultaneously with the ceramic green sheets that become the bases 2 (electronic component mounting substrates 1) to form electrode pads 3, external circuit connection electrodes, internal wiring conductors, and through conductors.

[0065] (7) Next, the multiple acquisition type wiring substrate obtained by firing is divided into multiple substrates 2 (substrates 1 for mounting electronic components). In this division, there is a method of pre-forming a dividing groove along the portion that becomes the outer edge of the multiple acquisition type wiring substrate in the process (5), and breaking it along the dividing groove to divide it. In addition, there is also a method of not performing the process (5) and cutting along the portion that becomes the outer edge of the substrate 2 (substrate 1 for mounting electronic components) by slicing or the like. In addition, before or after the multiple acquisition type wiring substrate is divided into multiple substrates 2 (substrates 1 for mounting electronic components), the electrode pads 3, the external connection pads, and the exposed wiring conductors can be covered with a plating layer using an electrolytic or electroless plating method.

[0066] (8) Next, the electronic component 10 is mounted on the electronic component mounting substrate 1. The electronic component 10 is electrically joined to the electronic component mounting substrate 1 by the connecting member 13. In addition, at this time, an adhesive material or the like may be provided on the electronic component 10 or the electronic component mounting substrate 1 to fix it to the electronic component mounting substrate 1. In addition, after the electronic component 10 is mounted on the electronic component mounting substrate 1, the cover 12 may be joined by the bonding material 14.

[0067] By manufacturing the electronic component mounting substrate 1 and mounting the electronic component 10 as in the above steps (1) to (7), the electronic device 21 can be manufactured. The order of the steps (1) to (8) is not specified as long as it is a processable order. In addition to the above steps, it is also possible to manufacture by using a 3D printer, etc.

[0068] (Second embodiment)

[0069] Reference Figure 3 An electronic device 21 and an electronic component mounting substrate 1 according to a second embodiment of the present disclosure will be described.

[0070] Similar to the first embodiment, the substrate 2a of the electronic component mounting substrate 1 may also have a first substrate portion 2d and a second substrate portion 2e. The second substrate portion 2e is located on the upper surface of the first substrate portion 2d, that is, the upper surface 2da. The second substrate portion 2e is located at a position corresponding to the first convex portion 2aa and / or the second convex portion 2ab. The second substrate portion 2e may also have a plurality of insulating layers. A substrate 2a having a mounting area 4 and a plurality of electrodes 3 (electrode pads 3) are provided, and the plurality of electrodes 3 (electrode pads 3) are located on the upper surface 2 of the substrate 2a and are arranged to surround the mounting area 4 when viewed from above. In this case, the substrate 2a has at least a second convex portion 2ab. The substrate 2a has a second convex portion 2ab arranged to span between the plurality of electrode pads 3 from the outer edge of the substrate 2a, and the second convex portion 2ab has, for example, at least one (one) insulating layer 2c that becomes the second substrate portion 2e.

[0071] Here, the structure of the electronic device 21 and the basic materials / conditions / structures of the substrate 2, electrode pads 3, insulating layer 2c, electronic components 10, and other substrates 2 constituting the electronic component mounting substrate 1 are similar to those of the first embodiment, and thus description thereof is omitted.

[0072] The substrate 2a has at least one (one layer) insulating layer 2c on the second protrusion 2ab. In other words, the insulating layer 2c surrounds the outer periphery of the plurality of electrode pads 3. At least a portion of these plurality of electrode pads 3 is exposed upward. In other words, the surface of the substrate 2a is not entirely covered by the insulating layer 2c, and the exposed portion of the electrode pad 3 is not covered by the insulating layer 2c. At this time, the upper end of the second protrusion 2ab is located above the upper ends of the plurality of electrodes 3.

[0073] In the present disclosure, as in the above-mentioned structure, in addition to making the convex portion, that is, the thick portion of the substrate 2a to extend between the plurality of electrodes 3, the upper end of the convex portion is also located above the electrode 3, thereby further improving the mechanical strength.

[0074] In particular, similarly to the first embodiment, the electrode pad 3 is exposed, the surface of the substrate 2a is not entirely covered by the insulating layer 2c, and the portion where the electrode pad 3 is exposed is not covered by the insulating layer 2c. That is, by providing a portion that is not covered by the insulating layer 2c, the laminating liquid or adhesive liquid used during lamination will disperse and penetrate into the electronic component mounting substrate 1. By dispersing and penetrating the laminating liquid or adhesive liquid, it is possible to reduce the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid into the electronic component mounting substrate 1. In addition, the portion where the electrode pad 3 is exposed, that is, by providing a portion that is not covered by the first insulating layer, it is possible to reduce the amount of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate 1. According to these circumstances, the strength of the insulating layer can be reduced, and the occurrence of undesirable conditions such as cracks and disconnections can be reduced.

[0075] Furthermore, in Figure 3 In the example shown, the insulating layer 2c is located below the bonding material 14 for bonding the cover 12 to the base 2. At this time, the surface of the insulating layer 2c can be made rougher than the surface of the base 2 not covered by the insulating layer 2c. By making the surface roughness of the insulating layer 1c rougher than the surface roughness of the base 2 not covered by the insulating layer 1c, the bonding strength between the bonding material 14 and the base 2 can be improved by the anchor effect. In addition, since the cover 12 and the bonding material 14 are located at the periphery of the electronic device 21, stress from the outside of the electronic device 21 is sometimes directly applied during operation. In contrast, in this embodiment, the bonding strength between the bonding material 14 and the base 2 can be improved against stress from the outside.

[0076] In addition, if Figure 3 As shown in the example, if the bonding material 14 also covers the bonding portion between the electrode pad 3 and the connecting member 13, the bonding portion between the connecting member 13 and the electrode pad 3 can be strengthened. Therefore, the connection strength between the connecting member 13 and the electrode pad 3 (tensile strength toward the upper surface of the connecting member 13) can be improved.

[0077] (Third embodiment)

[0078] Reference Figure 4 as well as Figure 5 The electronic device 21, the electronic module 31, and the electronic component mounting substrate 1 in the third embodiment of the present disclosure are described. Figure 4 An electronic device 21 is shown. Figure 5 The electronic device 21 is shown to have a housing 32 (lens) installed in place of the cover 13 .

[0079] The electronic component mounting substrate 1 includes a substrate 2a and at least one insulating layer 2c located on the upper surface of the substrate 2a and having a mounting region 4 on which the electronic component 10 is mounted. The insulating layer 2c has an opening 5, and the plurality of electrode pads 3 are located in the opening 5.

[0080] Here, the structure of the electronic device 21 and the basic materials / conditions / structures of the substrate 2, electrode pads 3, insulating layer 2c, electronic components 10, and other substrates 2 constituting the electronic component mounting substrate 1 are similar to those of the first embodiment, and thus description thereof is omitted.

[0081] The electronic component mounting substrate 1 has a substrate 2 a and a mounting region 4 located on the upper surface of the substrate 2 a and on which the electronic component 10 is mounted, and has at least one insulating layer 2 c .

[0082] Here, the so-called mounting area 4 is an area where at least one electronic component 10 is mounted, for example, the inner side of the outermost periphery of the electrode pad 3 described later, the area where the cover is mounted, or above it, etc. In addition, the components mounted in the mounting area 4 are not limited to the electronic components 10, for example, they may also be electronic components, and the number of electronic components 10 and / or electronic components is not specified.

[0083] The substrate 2a may have at least one insulating layer 2c on the first protrusion 2aa and / or the second protrusion 2ab. The insulating layer 2c may be made of the same material as the substrate 2a or a different material. When the insulating layer 2c is made of the same material as the substrate 2a, the difference in thermal expansion between the insulating layer 2c and the substrate 2a can be reduced, and the stress caused by the difference in thermal expansion in the process of mounting electronic components and the thermal history of driving electronic modules can be reduced, so that the substrate 2a can be used stably. In addition, when the insulating layer 2c is made of a different material from the substrate 2a, the deformation of the substrate 2a when the base 2 is made can be suppressed due to the difference in shrinkage of the insulating layer 2c made of a different material.

[0084] like Figure 4 as well as Figure 5 As in the example shown in the figure, the first protrusion 2aa is connected to the second protrusion 2ab, and the plurality of electrodes 3 are surrounded by the first protrusion 2aa and the second protrusion 2ab. That is, the insulating layer 2c has an opening 5, and the plurality of electrode pads 3 are located in the opening 5. In other words, the surface of the substrate 2a is not entirely covered by the insulating layer 2c, and the exposed portion of the electrode pad 3 is not covered by the insulating layer 2c. In addition, in the case where the substrate 2a has the first substrate portion 2d and the second substrate portion 2e, a portion of the second substrate portion 2e may have an opening 5, and the electrodes may be exposed from the opening 5.

[0085] That is, by providing a portion not covered by the insulating layer 2c, the laminating liquid or adhesive liquid used during printing and lamination will be dispersed and infiltrated into the electronic component mounting substrate 1. By dispersing and infiltrating the laminating liquid or adhesive liquid, the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid into the electronic component mounting substrate 1 can be reduced. In addition, by providing a portion where the electrode pad 3 is exposed, that is, by providing a portion not covered by the first insulating layer, the amount of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate can be reduced. According to these circumstances, the strength of the insulating layer can be reduced, and the occurrence of undesirable conditions such as cracks and disconnections can be reduced.

[0086] In the present embodiment, the first insulating layer 2c has an opening, and the plurality of electrode pads 3 are located in the opening 5. In other words, the plurality of electrode pads 3 are surrounded by the insulating layer 2c. It is possible to more effectively reduce the occurrence of scratches, foreign matter, etc. on the surface of the electrode pads 3 due to the processing of the process of mounting the electronic component 10 and the cover 12. It is possible to reduce the situation where the connection member 13 cannot be mounted and the strength of the connection member 13 is deteriorated due to the scratches on the electrode pads 3 and the attachment of foreign matter.

[0087] like Figure 4 As shown in the example, the insulating layer 2c is located at a position overlapping the mounting area 4 in a plan view. In other words, the insulating layer 2c is located at a position corresponding to the first protrusion 2aa. In addition, the insulating layer 2c is located below the bonding material 14 for bonding the cover 12 to the base 2.

[0088] The surface of the insulating layer 2c can be made rougher than the surface of the base 2 not covered by the insulating layer 2c. As a method for roughening the surface of the insulating layer 2c, there are the following methods. For example, in the case where the substrate 2a includes a ceramic material, the surface roughness can be made rough by changing the amount of adhesive, solvent and plasticizer added when making the insulating layer 2c, changing the amount of adhesive, solvent and plasticizer added to the base 2a, and managing the amount of adhesive evaporation during firing. In addition, by pressing a material such as Japanese paper whose surface is rougher than the surface of the substrate 2a on the surface of the substrate 2a, it is also possible to make an insulating layer 2c with a rough surface. By making the surface of the insulating layer 2c rough, both the effect of the first embodiment and the effect of the second embodiment can be obtained. That is, if the bonding strength of the adhesive used when mounting the electronic component 10 is increased, and the bonding strength of the bonding material 14 used to bond the cover 12 to the substrate 2 is increased, and the bonding material 14 also covers the bonding portion between the electrode pad 3 and the connecting member 13, the bonding strength between the connecting member 13 and the electrode pad 3 can be enhanced.

[0089] In addition, when the insulating layer 2c is formed by the screen printing method described later, the outer edge portion of the insulating layer 2c is raised in the z direction compared to the portion further inside the outer edge portion. This raising can reduce the flow of the adhesive used when mounting the electronic component 10 into the electrode pad 3. By reducing the flow of the adhesive used when mounting the electronic component 10 into the electrode pad 3, the adhesion of foreign matter can be reduced. The situation in which the connection member 13 cannot be mounted or the strength of the connection member 13 is deteriorated due to the adhesion of foreign matter can be reduced.

[0090] Figure 5The example shown shows an electronic module 31 in which a housing 32 (lens) is installed instead of the cover 12. When a bonding material is used to bond the housing 32 and the base 2, the surface of the insulating layer 2c is roughened to bond the housing 32 and the base 2, so that the bonding strength of the bonding material can be improved by the anchoring effect. In addition, since the housing 32 is located outside the electronic device 21, it is conceivable that stress from the outside of the electronic device 21 is directly applied during operation. For such external stress, the bonding strength can be improved.

[0091] <Structure of electronic module>

[0092] exist Figure 5 An example of an electronic module 31 using the electronic component mounting substrate 1 is shown. The electronic module 31 includes an electronic device 21 and a housing 32 provided to cover the upper surface of the electronic device 21 or the electronic device 21. In the example shown below, a camera module is used as an example for the sake of explanation.

[0093] The electronic module 31 may have a housing 32 (lens holder). By having the housing 32, it is possible to further improve airtightness or reduce the situation where external stress is directly applied to the electronic device 21. The housing 32 includes, for example, resin or metal materials. In addition, when the housing 32 is a lens holder, the housing 32 may also be assembled with one or more lenses including resin, liquid, glass or quartz. In addition, the housing 32 may also have a driving device for driving up, down, left and right, and may be electrically connected to a pad or the like located on the surface of the electronic component mounting substrate 1 via a bonding material such as solder.

[0094] In addition, the housing 32 may also be provided with an opening on at least one side in four directions when viewed from above. Furthermore, an external circuit substrate may be inserted through the opening of the housing 32 to be electrically connected to the electronic component mounting substrate 1. In addition, after the external circuit substrate is electrically connected to the electronic component mounting substrate 1, the opening of the housing 32 may be sealed with a sealing material such as resin to make the interior of the electronic module 31 airtight.

[0095] like Figure 5 As shown, the electronic module 31 is sometimes directly bonded to the electronic component mounting substrate 1. In this case, the cover 12 and the bonding material 14 used as components of the electronic component 21 are not used. Therefore, by not using the two components of the cover 12 and the bonding material 14, the electronic module can be lightweight and miniaturized. In addition, the so-called not using the cover 12 and the bonding material 14 in the electronic component mounting substrate 1 means that there will be no bonding process, and the heat load process when the electronic module is made will also be reduced. Therefore, it is possible to reduce the adverse conditions caused by the thermal expansion difference of each component caused by the heat load process.

[0096] (Fourth embodiment)

[0097] Next, refer to Figures 6 to 11 The electronic component mounting substrate 1 according to the fourth embodiment of the present disclosure will be described. Figure 6 as well as Figure 7 The illustrated embodiment shows the electronic device 21 with the cover 12 and the bonding material 14 omitted. Figures 8 to 11 The embodiment shown is Figure 7 The enlarged view of the main part A of the illustrated embodiment shows another example of the opening of the insulating layer 2c.

[0098] exist Figure 6 In the example shown, the insulating layer 2c has an opening 5, and the plurality of electrode pads 3 are located in the opening 5. The difference from the third embodiment is that the shape of the opening 5 of the insulating layer 2c is different.

[0099] Even in this embodiment, by providing a portion not covered by the insulating layer 2c on the surface of the substrate 2a, the laminating liquid or adhesive liquid used in printing or laminating can be dispersed and infiltrated into the electronic component mounting substrate 1 while maintaining mechanical strength. By dispersing and infiltrating the laminating liquid or adhesive liquid used in printing or laminating into the electronic component mounting substrate 1, the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid into the electronic component mounting substrate 1 can be reduced. In addition, the exposed portion of the electrode pad 3, that is, by providing a portion not covered by the first insulating layer, the amount of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate can be reduced. According to these circumstances, the strength of the insulating layer can be reduced, and the occurrence of undesirable conditions such as cracks and disconnections can be reduced.

[0100] exist Figure 6 In the example shown, the opening 5 of the insulating layer 2c is set small. In this way, by reducing the opening 5 of the insulating layer 2c, it is possible to more effectively reduce the occurrence of scratches and foreign matter attached to the surface of the electrode pad 3 due to the handling of the electronic component 10 and the cover 12 during installation. It is possible to reduce the situation where the connection member 13 cannot be installed or the strength of the connection member 13 is deteriorated due to scratches on the electrode pad 3 and the attachment of foreign matter.

[0101] Figure 7 The embodiment shown is similar to Figure 6 The embodiment shown is different in that the shape of the opening of the insulating layer 2c is different. Figure 7 In the example shown, the end of the opening of the insulating layer 2c is linear along the linear portion of the electrode pad 3. Figure 7By making the insulating layer 2c linear, as in the embodiment of the present invention, the insulating layer 2c is located close to the electrode pad 3. Therefore, it is possible to more effectively reduce the occurrence of scratches or foreign matter attached to the surface of the electrode pad 3 due to the handling of the electronic component 10 or the cover 12 during installation. It is possible to reduce the inability to install the connecting member 13 or the deterioration of the strength of the connecting member 13 due to scratches on the electrode pad 3 or the attachment of foreign matter.

[0102] Figure 8 The embodiment shown is similar to Figure 7 The difference of the embodiment shown is that the straight line portion of the opening 5 of the insulating layer 2c is increased. Figure 8 In (a), the shape of the opening of the insulating layer 2c is also a linear shape along the shape of the linear portion of each of the plurality of electrode pads 3. Figure 8 The insulating layer 2c of (a) does not have a curved portion, but the insulating layer 2c as a whole is meandering in a shape when viewed from above. By making the insulating layer 2c meander, the laminating liquid used in printing and laminating will be dispersed and infiltrated into the electronic component mounting substrate. By dispersing and infiltrating, the strength degradation of the insulating layer, the occurrence of cracks, disconnection and other undesirable conditions can be reduced.

[0103] exist Figure 8 In the example shown, the shape of the opening of the insulating layer 2c along the shape of the straight portion of each electrode pad 3 is also referred to as a straight line. It is possible to ensure the gap between the straight portion of the electrode pad 3 and the straight portion of the insulating layer 2c to the same extent in the upper, lower, left, and right directions of the electrode pad 3. By ensuring the gap between the electrode pad 3 and the insulating layer 2c to the same extent in the upper, lower, left, and right directions of the electrode pad 3, it is possible to easily detect the offset in the manufacturing process of the electrode pad 3 and the insulating layer 2c. By easily detecting the offset in the manufacturing process, the offset can be corrected during manufacturing, which can lead to an improvement in the manufacturing process. In addition, by managing the offset in the manufacturing process, the installation area of ​​the connecting member 13 can be maintained. That is, by maintaining the installation area of ​​the connecting member 13, the mountability of the bonding member 13 can be improved.

[0104] Figure 8In the embodiment shown in (b), the opening portion of the insulating layer 2c has a curved portion when viewed from above. In other words, the outer edge of the first protrusion 2aa and / or the inner edge of the second protrusion 2ab have a curved portion when viewed from above. By having a curved portion, stress concentration when the insulating layer 2c is applied can be alleviated. In addition, by having a curved portion, when stress is applied to the insulating layer 2c during the installation process, etc., the stress can be dispersed, and the occurrence of undesirable conditions such as cracks and broken wires can be reduced. At this time, when the substrate 2a has the first protrusion 2aa and the second protrusion 2ab, the outer edge of the first protrusion 2aa and the inner edge of the second protrusion 2ab can also be similar shapes.

[0105] Figures 9 to 11 The insulating layer 2c of the embodiment shown covers a part of the plurality of electrode pads 3. Since the insulating layer 2c covers the plurality of electrode pads 3, the upper end of the insulating layer 2c is located above the upper ends of the plurality of electrode pads 3 when viewed in cross section. By locating the insulating layer 2c above the electrode pads 3 when viewed in cross section, it is possible to reduce the contact between the clamp used in the process of mounting the electronic component 10 and the cover 12 and the surface of the electrode pads 3. By reducing the contact between the clamp and the surface of the electrode pads 3, it is possible to reduce the occurrence of scratches. It is possible to reduce the situation where the connection member 13 cannot be mounted and the strength of the connection member 13 is deteriorated due to the scratches on the electrode pads 3. In addition, by covering the plurality of electrode pads 3 with the insulating layer 2c, the exposed area of ​​the electrode pads 3 can be reduced, and the amount of gold plating applied to the surface of the electrode pads 3 can be reduced. By reducing the amount of gold plating used, it is possible to suppress the cost of the electronic component mounting substrate 1 at a low cost. By reducing the exposure of the electrode pads 3 to the surface of the electronic component mounting substrate 1, it is possible to reduce the metal portion existing on the surface. This can reduce surface degradation of the electrode pad 3 .

[0106] Figures 9 and 10 The exposed portions of the plurality of electrode pads 3 in the illustrated embodiment are formed into a corrugated shape. In this case, the outer edge of the first protrusion 2aa and / or the inner edge of the second protrusion 2ab may also have a corrugated shape in a plan view. Fig. 9 The outer edge of the opening of the insulating layer 2c in the embodiment shown is wavy in shape. Fig. 9 In the embodiment, the shape of the opening 5 of the insulating layer 2c widens the electrode pad 3. Even with such a shape, the same effect as described above can be obtained. By making the electrode pad 3 further larger, the area where the connecting member 13 is mounted on the electrode pad 3 can be increased. By increasing the area where the connecting member 13 is mounted on the electrode pad 3, the mountability of the bonding member 13 can be improved.

[0107] and then, Fig. 9 The embodiment shown in (a) is the same as Fig. 9The embodiment shown in (b) is different in that the extension destination of the electrode pad 3 (the non-exposed portion of the electrode pad 3) is oriented toward the electronic component 10 mounted on the electronic component mounting substrate 1 or in the opposite direction. Fig. 9 In the embodiment shown in (b), the extension destination of the electrode pad 3 (the non-exposed portion of the electrode pad 3) is oriented toward the electronic component 10 mounted on the electronic component mounting substrate 1. By orienting the extension destination of the electrode pad 3 toward the electronic component 10, the size of the electronic component mounting substrate 1 can be reduced, and the miniaturization of the electronic device 21 can be achieved. Fig. 9 In the embodiment shown in (a), the extension destination of the electrode pad 3 (the non-exposed portion of the electrode pad 3) faces the opposite direction of the electronic component 10 mounted on the electronic component mounting substrate 1. Due to the high speed and multifunctionality of the electronic component 10, the number of terminals tends to increase. By making the extension destination of the electrode pad 3 (the non-exposed portion of the electrode pad 3) the opposite direction of the electronic component 10 mounted on the electronic component mounting substrate 1, it is possible to cope with the increase in the terminals of the electronic component 10. In other words, the high speed and multifunctionality of the electronic device can be achieved. In addition, by configuring the electrode pad 3 in which the extension destination of the electrode pad 3 (the non-exposed portion of the electrode pad 3) faces the direction of the electronic component 10 mounted on the electronic component mounting substrate 1 and the electrode pad 3 in the opposite direction, the two requirements of miniaturization, high speed and multifunctionality of the electronic device can be improved.

[0108] exist Fig.10 The embodiments shown and Fig. 9 In the illustrated embodiment, the shape of the opening of the insulating layer 2c is different. Fig.10 The size of the opening of the insulating layer 2c in the embodiment shown in the figure is fixed in the y direction. The laminating liquid or adhesive liquid used when printing and laminating the insulating layer 2c will be dispersed and infiltrated into the electronic component mounting substrate. When dispersing and infiltrating, by making the size of the opening of the insulating layer 2c in the y direction fixed, the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid diffused into the electronic component mounting substrate can be reduced. Therefore, the strength of the insulating layer can be reduced, and the occurrence of undesirable conditions such as cracks and disconnections can be reduced. In addition, since the opening of the insulating layer 2c can be set small, it is possible to more effectively reduce the occurrence of scratches, foreign matter, etc. on the surface of the electrode pad 3 due to the handling of the electronic component 10 and the cover body 12 during installation. It is possible to reduce the situation where the connecting member 13 cannot be installed and the strength of the connecting member 13 is deteriorated due to the scratches on the electrode pad 3 and the attachment of foreign matter.

[0109] exist Fig.11 The embodiments shown and Fig.10 In the illustrated embodiment, the shape of the opening of the insulating layer 2c is different. Fig.11In the embodiment shown, a portion of the shape of the opening of the insulating layer 2c is linear. In other words, the linear portion is the exposed portion of the electrode pad 3 is linear. By making the exposed portion of the electrode pad 11 linear, the mounting area of ​​the connecting member 13 can be maintained, and the opening of the insulating layer 2c can be narrowed. Therefore, it is possible to more effectively reduce the occurrence of scratches, foreign matter, etc. on the surface of the electrode pad 3 due to the handling during the installation of the electronic component 10 and the cover 12. It is possible to reduce the situation where the connecting member 13 cannot be installed or the strength of the connecting member 13 is deteriorated due to scratches on the electrode pad 3, foreign matter, etc.

[0110] exist Fig.11 In the embodiment shown in (a), the size of the insulating layer 2c in the y direction is fixed. The laminating liquid or adhesive liquid used when printing and laminating the insulating layer 2c will disperse and penetrate into the electronic component mounting substrate. When dispersing and penetrating, by making the size of the opening of the insulating layer 2c in the y direction fixed, the concentration difference caused by the diffusion of the laminating liquid or adhesive liquid in the electronic component mounting substrate can be reduced. Therefore, the strength of the insulating layer can be reduced, and the occurrence of defects such as cracks and disconnections can be reduced.

[0111] exist Fig.11 In the embodiment shown in (b), the opening of the insulating layer 2c is made smaller as it approaches the electrode pad 3. By reducing the opening of the insulating layer 2c, it is possible to more effectively reduce the occurrence of scratches and foreign matter on the surface of the electrode pad 3 due to handling during installation of the electronic component 10 and the cover 12. It is possible to reduce the inability to install the connecting member 13 and the deterioration of the strength of the connecting member 13 due to scratches on the electrode pad 3 and the attachment of foreign matter.

[0112] (Fifth embodiment)

[0113] Next, refer to Fig.12 An electronic component mounting substrate 1 according to a fifth embodiment of the present disclosure will be described.

[0114] The electronic component mounting substrate 1 has a mounting area 4 located on the upper surface of the substrate 2a and on which the electronic component 10 is mounted. In this case, at least one insulating layer 2c may be provided on the first protrusion 2aa and / or the second protrusion 2ab. For example, the substrate 2a may also have a first substrate portion 2d and a second substrate portion 2e as in other embodiments. In this case, the second substrate portion 2e is formed by the insulating layer 2c. Fig.12 The insulating layer 2c of the illustrated example includes a first layer 2ca (hereinafter, also referred to as a first insulating layer 2ca) and a second layer 2cb (hereinafter, also referred to as a second insulating layer 2cb) located on the upper surface of the first layer 2ca.

[0115] By including a first insulating layer 2ca and a second insulating layer 2cb retreating from the outer edge of the first insulating layer 2ca on the upper surface of the first insulating layer 2ca, as shown in FIG. Fig.12 In this way, the outer periphery of the insulating layer becomes step-shaped when observed in cross section. Therefore, the laminating liquid or adhesive liquid used in printing and lamination will be dispersed and infiltrated into the electronic component mounting substrate 1. By dispersing and infiltrating, the strength degradation of the insulating layer, the occurrence of cracks, disconnection and other undesirable conditions can be reduced.

[0116] Furthermore, if Fig.12 As shown in the example, a step can be provided by the outer edge of the first insulating layer 2ca and the outer edge of the second insulating layer 2cb. That is, the outer edge of the first layer 2ca can be larger than the outer edge of the second layer 2cb. At this time, it is preferable that the first layer 2ca enters between the plurality of electrodes 3 to a large extent. In the case where the step portion is located near the mounting area 4, the bonding strength can be improved by increasing the bonding area of ​​the adhesive used when mounting the electronic component 10 by an amount corresponding to the step. In addition, since the step is located in the Z-axis direction, the bonding strength can also be improved upward.

[0117] Even when the step portion formed by the outer edge of the first insulating layer 2ca and the outer edge of the second insulating layer 2cb is located near the location where the bonding material 14 for bonding to the cover 12 is provided, the bonding strength of the bonding material 14 can be improved in the same manner as described above.

[0118] In addition, the upper end of the first insulating layer 2ca is located below the upper ends of the plurality of electrode pads 3, and the upper end of the second insulating layer 2cb is located above the upper ends of the plurality of electrode pads 3. Even in this case, the risk of disconnection of the plurality of electrodes 3 can be reduced while maintaining mechanical strength. At this time, if the electrode 3 is exposed, the laminating liquid used in printing and lamination will further disperse and penetrate into the electronic component mounting substrate. Therefore, by dispersing and penetrating the laminating liquid or the adhesive liquid, it is possible to reduce the deterioration of the strength of the insulating layer, the occurrence of cracks, disconnection, and other undesirable conditions.

[0119] The upper end of the second insulating layer 2cb is located above the upper ends of the plurality of electrode pads 3. Regardless of the shape of the second insulating layer 2cb when viewed from above, the upper end of the second insulating layer 2cb is located above the upper ends of the plurality of electrode pads 3, thereby reducing the occurrence of scratches and foreign matter attached to the surface of the electrode pads 3 due to the handling of the electronic component 10 and the cover 12 during installation. By reducing the scratches and foreign matter attached to the electrode pads 3, the inability to install the connecting member 13 and the deterioration of the strength of the connecting member 13 can be reduced. In addition, in addition to the first insulating layer 2ca and the second insulating layer 2cb located on the upper surface of the first insulating layer 2ca, a third insulating layer 2cc can be added on the second insulating layer 2cb, and the same effect as the above-mentioned case where the insulating layer is two layers can be obtained.

[0120] In addition, the present disclosure is not limited to the above-mentioned examples of the embodiments, and various deformations such as numerical values ​​can be made. In addition, for example, in the examples shown in the figures, the shape of the electrode pad 3 is a rectangular shape when viewed from above, but it can also be a circular shape or other polygonal shapes. In addition, the configuration, number, shape of the electrode pad 3 in this embodiment, and the installation method of the electronic component are not specified. In addition, the various combinations of the characteristic parts in this embodiment are not limited to the above-mentioned examples of the embodiments. For example, the recessed portion may not be a square, and the corners may also be round.

[0121] Explanation of symbols

[0122] 1: Substrate for mounting electronic components;

[0123] 2: Matrix;

[0124] 2a: substrate;

[0125] 2aa: 1st convex part;

[0126] 2ab: 2nd convex part;

[0127] 2b: frame;

[0128] 2c: insulation layer;

[0129] 2ca: 1st insulating layer (1st layer);

[0130] 2cb: second insulation layer (second layer);

[0131] 2cc: 3rd insulation layer;

[0132] 2d: first substrate portion;

[0133] 2da: upper surface;

[0134] 2e: 2nd substrate part;

[0135] 3: Electrode (electrode pad);

[0136] 4: Installation area;

[0137] 5: opening;

[0138] 10: Electronic components;

[0139] 12: cover;

[0140] 13: Connecting components (for electronic components);

[0141] 14: bonding material (for bonding the cover);

[0142] 21: Electronic devices;

[0143] 31: Electronic module;

[0144] 32: Shell.

Claims

1. A substrate for mounting an electronic component, comprising: a base body having a substrate and an insulating layer, the substrate having a first surface, the insulating layer being located on the first surface and including an electronic component mounting area; and A plurality of electrodes, located on the first surface, for connecting with electronic components installed in the electronic component installation area, The insulating layer and the substrate comprise the same ceramic material, The plurality of electrodes are arranged to surround the electronic component mounting area, The plurality of electrodes are exposed on the first surface in a manner that a portion of each electrode is located within the insulating layer, The insulating layer includes a first portion located at the center of the substrate and a second portion located at an outer edge of the substrate at a distance from the first portion. At least a portion of each of the plurality of electrodes is surrounded by the first portion and the second portion.

2. The electronic component mounting substrate according to claim 1, wherein: In a cross section perpendicular to the first surface, the outer periphery of the insulating layer is in a step shape.

3. The electronic component mounting substrate according to claim 1, wherein: The insulating layer forms a first protrusion spanning between the multiple electrodes and / or a second protrusion spanning between the multiple electrodes from the outer edge of the substrate when viewed from above, and the spanning between the multiple electrodes refers to a situation where there is at least an area extending further toward the multiple electrodes than the mounting area.

4. The electronic component mounting substrate according to claim 3, wherein: The insulating layer has the first protrusion and the second protrusion, In a plan view, the outer edge of the first protrusion and the inner edge of the second protrusion have similar shapes.

5. The electronic component mounting substrate according to claim 1, wherein An upper end of the insulating layer is located above upper ends of the plurality of electrodes.

6. The electronic component mounting substrate according to claim 2, wherein: The insulating layer comprises a first layer and a second layer, The first layer is located below upper ends of the plurality of electrodes, and an upper end of the second layer is located above upper ends of the plurality of electrodes.

7. The electronic component mounting substrate according to claim 3, wherein: The insulating layer has the first protrusion and the second protrusion, The first convex portion is connected to the second convex portion, and the plurality of electrodes are surrounded by the first convex portion and the second convex portion.

8. The electronic component mounting substrate according to claim 1, wherein The surface roughness of the insulating layer is coarser than the surface roughness of the base body not covered by the insulating layer.

9. An electronic device comprising: The electronic component mounting substrate according to any one of claims 1 to 8; and An electronic component is mounted in the mounting area.

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