Method for producing a structural element and structural element

Abstract

A method for producing a structural element (10) is proposed, the structural element having a support (1) and at least one component (2), wherein the component is electrically conductively connected to the support and is mechanically fastened to the support by means of an electrically insulating connecting layer (3). For this purpose, a connecting layer (1S) is provided for the support, wherein the connecting layer is arranged on the support. The connecting layer has at least one opening (3R), in which a connecting surface (1F) of the connecting layer is exposed, wherein the connecting layer protrudes in a vertical direction beyond the exposed connecting surface or vice versa. The component with a contact layer (2S) is placed on the support in such a way that, in a top view of the support, the exposed contact surface (2F) of the contact layer covers the opening and the connecting surface located therein, wherein the exposed contact surface is spaced apart from the exposed connecting surface by a vertical distance (D). The vertical distance is reduced by a change in volume of the connecting layer, whereby the exposed contact surface and the exposed connection surface are combined in such a way that they adjoin one another directly and a direct electrical contact is formed between the contact layer and the connection layer. Such a structural element is also proposed.

Description

Technical Field

[0001] A method for producing a structural element is specified. Furthermore, a structural element is specified. Background Art

[0002] If, for example, an adhesive layer with a layer thickness of less than 5 μm, less than 3 μm, less than 1 μm or less than 0.2 μm is to be used, it is particularly demanding to form a reliable electrical connection in the joining plane in addition to a stable mechanical connection, since adhesive layers with such a small layer thickness usually lack conductive fillers. However, if the adhesive layer has conductive fillers, it usually has a very large layer thickness. In particular, for components with lateral dimensions of several micrometers, the use of thicker adhesive layers is not particularly suitable, since the use of such adhesive layers does not exclude the risk of tilting of the component in the adhesive layer. In addition, the risk of short circuits is increased when using conductive adhesive layers. Summary of the invention

[0003] The object is to provide a reliable and cost-effective method for producing a structural element. A further object is to provide a structural element having a reliable electrical connection and a stable mechanical connection between a support of the structural element and a component.

[0004] This object is achieved by a method for producing a component and a component according to the independent claims. Further embodiments and improvements of the method or the component are the subject matter of the further claims.

[0005] A method for producing a structural element with a support and at least one component is proposed, wherein the component is electrically conductively connected to the support and is mechanically fastened to the support, in particular by means of an electrically insulating connecting layer. In particular, the adhesive layer is free of electrically conductive material, for example, free of electrically conductive fillers. The adhesive layer is not intended, for example, to produce an electrical connection. Preferably, the mechanical connection is spatially separated from the electrical connection. It is possible that the structural element has a plurality of components that are mechanically fastened to a common support and electrically connected to the support.

[0006] A support is generally to be understood as a receiver structure that mechanically supports the component or components. The receiver structure can have circuits, transistors, electrical conductor tracks or other electrical components that are provided, in particular, for electrical contact and for controlling the component or components. The support is, for example, a receiver support, for example a semiconductor substrate, a silicon wafer with through-contacts if necessary, a printed circuit board with electrical conductor tracks or a receiver with an integrated circuit, transistors and / or other circuit elements.

[0007] The receiver structure is, for example, part of an electronic device or a light source. The component can be used as a detector or light source in the general lighting, ambient lighting, interior lighting or exterior lighting of a vehicle or in the headlights of a motor vehicle. It is also conceivable that the structural element consisting of the support and the component is used in an electronic device, a mobile phone, a touch pad, a laser printer, a camera, a recognition camera, a facial recognition camera display or other systems consisting of light-emitting diodes, sensors, laser diodes and / or detectors.

[0008] According to at least one embodiment of the method, a connection layer is provided to the support. The connection layer can be arranged on the support, in particular on the main body of the support. The connection layer can be an adhesive layer. The connection layer has in particular at least one opening, in which the connection surface of the connection layer is exposed. The opening can have any shape, such as a circular, quadrangular or elliptical shape. The connection layer has, for example, the shape of a closed or open frame in the surroundings of the opening. It is feasible that the connection layer has a plurality of openings, in which the connection surfaces of the connection layer are respectively exposed. In a vertical direction, the connection layer can extend beyond the exposed connection surface or beyond the connection layer, for example in a direction away from the main body of the support. However, it is also feasible on the contrary that the exposed connection surface or the connection column or the connection layer, for example, extends beyond the connection layer in a direction away from the main body of the support. The connection layer can be implemented in a structured manner. The connection layer can, for example, have sub-regions that are laterally spaced apart from each other.

[0009] The connection layer is in particular part of the wiring structure of the support. The connection layer can be implemented continuously or have a plurality of spatially separate sublayers. The connection layer can have one connection column or a plurality of connection columns, wherein the exposed connection surface is formed, for example, by the exposed surface of the associated connection column. The connection surface is in particular a metal surface.

[0010] A vertical direction is generally understood to be a direction which is oriented perpendicularly to a main extension plane of the support, in particular to the main body of the support. Conversely, a transverse direction is understood to be a direction which runs, in particular, parallel to the main extension plane of the support. The vertical direction and the transverse direction are transverse, for example perpendicular, to each other.

[0011] According to at least one embodiment of the method, the component with the contact layer is placed on the support in such a way that the exposed contact surface of the contact layer covers the opening and the connection surface in the opening in a top view of the support. The exposed contact surface of the contact layer can partially or completely cover the opening and the connection surface. The exposed contact surface is, for example, a metal surface and can be an exposed surface of a contact column of the contact layer. The contact layer is in particular a part of a wiring structure that is set to electrically contact the component or the structural element. The contact layer can have a plurality of laterally spaced openings or recesses. If the exposed connection surface or connection column or connection layer extends beyond the connection layer, it is feasible that the exposed connection surface or connection column or connection layer partially extends into one or more openings or recesses of the contact layer. Preferably, the connection layer remains spatially spaced apart from the contact layer, so that an electrical connection is not yet made between the connection layer and the contact layer for the time being.

[0012] After the component is placed on the support, the connecting layer is in particular adjacent to the component and adjacent to the support. In the region of the opening of the connecting layer, the exposed contact surface of the contact layer is spaced apart from the exposed connection surface of the connecting layer, in particular by a vertical spacing. In other words, the exposed contact surface does not directly adjoin the exposed connection surface, but is spatially separated from the connection surface by an intermediate space, wherein the intermediate space can be filled with a gaseous medium, such as air. If the exposed connection surface or the connecting column or the connecting layer protrudes beyond the connecting layer, it is possible that the connecting layer, such as the connecting column, is partially surrounded by the contact layer in a lateral direction, in particular completely surrounded. The connecting layer or the connecting column can be spatially separated from the contact layer by a lateral intermediate space, wherein the lateral intermediate space can be filled with a gaseous medium, such as air.

[0013] According to at least one embodiment of the method, the vertical spacing between the contact surface and the connection surface is reduced. The reduction of the vertical spacing can be achieved by a volume change of the connecting layer, for example by a volume reduction. The volume of the connecting layer shrinks, for example, during an annealing process, for example in a furnace. By increasing the temperature, the connecting layer can be transformed from a viscous, soft or pasty state to a hard state, for example. By this process, the proportion of liquid in the connecting layer, for example the proportion of a binder, can be reduced, thereby reducing the volume of the connecting layer and thus also reducing the vertical layer thickness of the connecting layer. In addition, a wetting reaction can be initiated within the connecting layer by heating, thereby reducing the volume of the connecting layer. As an alternative or supplementary solution, the reduction of the vertical spacing or the reduction of the volume of the connecting layer can be mechanically supported, for example, by the action of an external force. The connecting layer can be pressed together and thus compressed, for example, by the action of an external force.

[0014] In particular, the vertical spacing is reduced by the volume change of the connecting layer in such a way that the exposed contact surface and the exposed connection surface are combined, so that they are closely adjacent to each other and thus form a direct electrical contact between the contact layer and the connection layer. The overlapping surface between the connection surface and the contact surface, for example, forms a boundary surface between the corresponding component and the support, which boundary surface can be less than 75%, preferably less than 50%, less than 25% or less than 10% of the total contact surface between the support and the corresponding component. The boundary surface is especially free of the material of the connecting layer or no traces of the material of the connecting layer. The boundary surface can be, for example, a pure metal-metal surface, a pure metal-TCO surface and / or a pure TCO-TCO surface (TCO: transparent conductive oxid, radiation-transmissive conductive oxide).

[0015] According to at least one embodiment of the method, the component has a semiconductor body with an optically active region, which is provided for generating or detecting electromagnetic radiation. The component is, for example, a light-emitting diode. The semiconductor body can have a first semiconductor layer of a first charge carrier type and a second semiconductor layer of a second charge carrier type. The first semiconductor layer and the second semiconductor layer can be configured in an n-conductive or p-conductive manner, or vice versa. The active region is arranged in particular between the first semiconductor layer and the second semiconductor layer. The active region is, for example, a pn transition region. The component is, for example, a microcomponent, for example, a μLED. The component has a lateral extension, which is, for example, between 1 μm and 1 mm, for example, between 10 μm and 1 mm, between 50 μm and 1 mm, or between 1 μm and 30 μm, between 10 μm and 100 μm, or between 30 μm and 300 μm. The support can have a circuit provided for electrical contact or for controlling the component or components.

[0016] In at least one embodiment of a method for producing a structural element having a support and at least one component, which is electrically conductively connected to the support and mechanically fastened to the support by means of an electrically insulating connecting layer, a connecting layer is provided to the support. The connecting layer is arranged on the support and has at least one opening in which a connecting surface of the connecting layer is exposed. In particular, the connecting layer extends beyond the exposed connecting surface in a vertical direction. The component with the contact layer is placed on the support in such a way that, in a top view of the support, the exposed contact surface of the contact layer covers the opening and the connecting surface in the opening, wherein the exposed contact surface is spaced apart from the exposed connecting surface by a vertical spacing. Subsequently, the vertical spacing is reduced by a volume change of the connecting layer, whereby the exposed contact surface and the exposed connecting surface are combined in such a way that they are adjacent to each other and direct electrical contact is formed between the contact layer and the connecting layer.

[0017] In at least one embodiment of a method for producing a structural element having a support and at least one component, which is electrically conductively connected to the support and mechanically fastened to the support by means of an electrically insulating connecting layer, the support is provided with a connecting layer. The connecting layer is arranged on the support and has at least one opening in which the connecting surface of the connecting layer is exposed. In particular, the connecting layer extends beyond the exposed connecting surface in a vertical direction or vice versa. The latter means in particular that the exposed connecting surface of the connecting layer or the connecting layer or the connecting column extends beyond the connecting layer in a vertical direction, for example, extends beyond the connecting layer in a vertical direction away from the support or the body of the support. The component with the contact layer is placed on the support in such a way that in a top view of the support, the exposed contact surface of the contact layer covers the opening and the connecting surface in the opening, wherein the exposed contact surface is spaced apart from the exposed connecting surface by a vertical spacing. The vertical distance is then reduced by a change in volume of the connecting layer, so that the exposed contact surface and the exposed connection surface are combined in such a way that they adjoin one another directly and a direct electrical contact is formed between the contact layer and the connection layer.

[0018] Therefore, a reliable mechanical connection between the component and the support is ensured by the electrically insulating connecting layer. The electrical connection between the component and the support is achieved by the arrangement of the contact surface and the connecting surface relative to each other, that is, by the arrangement of the electrical contact position of the component and the support relative to each other. Therefore, the electrical connection and the mechanical connection between the component and the support are partially separated. Due to the reduction in the volume of the connecting layer, the contact surface and the connecting surface are not only assembled but also pressed relative to each other, thereby forming a reliable electrical connection between the support and the component. It is possible that the connecting layer and the contact layer form a welding system. However, the mechanical adhesion between the connecting layer and the contact layer can be less than the adhesion between the component and the support caused directly by the connecting layer.

[0019] In particular, compared to the use of conductive materials such as solder paste or connecting layers with conductive fillers, the risk of short circuits is minimized by the local separation of mechanical connection and electrical connection. Since the connecting layer does not contain conductive fillers, the connecting layer can be designed to be particularly thin. Expensive fillers such as gold, silver, aluminum or other metals can be abandoned. Since the connecting layer also has at least one opening or multiple openings for electrically connecting the one or more components to the support, the connecting layer does not have to be broken, for example, due to accidental or planned contour steps. The construction of the one or more openings can be performed in a separate process before the components are placed, so that the size of the openings and the spacing between the openings can be designed in a targeted manner according to the components desired for use.

[0020] According to at least one embodiment of the method, the connecting layer adjoins the component and adjoins the support immediately after the component is placed and before the vertical spacing is reduced. The connecting layer, before the volume change, has in particular an original vertical layer thickness, which is reduced during the execution of the method, wherein the vertical spacing can be reduced by reducing the vertical layer thickness of the connecting layer or by reducing the volume of the connecting layer.

[0021] Before the volume of the connecting layer is reduced, in particular before the shrinking process, the connecting layer is preferably expanded briefly in order to increase the adhesive capacity. The additional expansion of the adhesive layer can be achieved by supporting the support with the connecting layer arranged thereon in a solvent environment. This increases the viscosity of the connecting layer and thus contributes to increasing the mechanical strength between the support and the component. Since the connecting layer expands briefly, the volume of the connecting layer also increases briefly, whereby the volume of the connecting layer shrinks more drastically and a greater vertical spacing between the connection surface and the contact surface can be overcome. The connecting layer expands in particular before the component is placed on the support.

[0022] According to at least one embodiment of the method, the connecting layer has a vertical layer thickness with a constant height in the surroundings of the contact layer before the volume change. After the volume change, the connecting layer has a reduced vertical layer thickness, in particular with locally different heights, in the same surroundings of the contact layer. In this case, the layer thickness of the connecting layer can be greater in the overlapping region of the connecting layer with the component than in the region of the connecting layer without overlapping with the component. As an alternative or in addition, the layer thickness can be greater in the overlapping region of the connecting layer with the contact layer than in the region of the connecting layer without overlapping with the contact layer.

[0023] According to at least one embodiment of the method, the connecting layer has a surface facing the component, which surface is designed in a stepped manner, in particular due to the locally different heights of the connecting layer. The connecting layer has, for example, a subsurface which adjoins the component directly and represents the maximum vertical projection of the connecting layer. The connecting layer therefore does not project beyond the component in a vertical direction away from the support. In particular, the component, for example the body of the component, is not laterally surrounded or laterally covered by the connecting layer.

[0024] If the connection layer adjoins not only the contact layer but also the body of the component, or if the contact layer projects into an opening in the connection layer, the contact layer can be at least partially surrounded laterally by the connection layer. It is possible for the contact layer to have a contact pin or a plurality of contact pins which are at least partially located in the opening in the connection layer, wherein the contact pin or the plurality of contact pins are spatially spaced apart from the connection layer in a lateral direction.

[0025] According to at least one embodiment of the method, the connecting layer comprises or consists of a photostructurable material. The photostructurable material can be an adhesion-promoting photoresist. In other words, the connecting layer can consist of a photostructurable adhesion-promoting material. The connecting layer can in this case have a photostructurable component, which can also be confirmed in particular in the manufactured structural element. An opening or a plurality of openings can be formed by photostructuring the connecting layer, that is to say by photolithography.

[0026] According to at least one embodiment of the method, the exposed connection surface is formed by an exposed surface of a connection pin. The connection pin is in particular arranged in an opening of the connection layer. The connection pin can be laterally spaced apart from the connection layer before the volume change and can remain laterally spaced apart from the connection layer after the volume change.

[0027] According to at least one embodiment of the method, the exposed contact surface is formed by an exposed surface of a contact pin. The contact pin particularly extends into an opening in the connection layer. The contact pin can be laterally spaced apart from the connection layer before the volume change and can remain laterally spaced apart from the connection layer after the volume change.

[0028] After the volume change of the connection layer, the connection pin and the associated contact pin are in particular adjacent to each other. The connection pin and the contact pin, for example, constitute a through-contact extending through the connection layer in a vertical direction. Since the contact pin and the connection pin can have different cross-sections, the surface of the through-contact can have a stepped shape at the transition zone between the contact pin and the connection pin. The through-contact can be spaced apart from the connection layer in a lateral direction, for example, by an intermediate region. The intermediate region can be filled with a gaseous medium, for example air. The structural element can have a plurality of such through-contacts, wherein the one or more components are electrically conductively connected to the support via the through-contacts. However, it is feasible that such a through-contact is constituted only by the connection pin or only by the contact pin.

[0029] According to at least one embodiment of the method, the connection layer or the connection column partially extends into a recess or opening of the contact layer. The connection layer, for example the connection column, can be partially or completely surrounded by the contact layer in a transverse direction. An exposed contact surface or multiple exposed contact surfaces of the contact layer are formed in particular by a bottom surface or multiple bottom surfaces of a recess or opening of the contact layer. Such a design of the connection layer and the contact layer can also be verified on the manufactured component.

[0030] According to at least one embodiment of the method, a plurality of components are placed simultaneously on the support.

[0031] Each component has in particular a contact layer with at least one contact surface. The connection layer has a plurality of openings in which the connection surfaces of the connection layer are freely accessible. The components are electrically connected to the support, for example in a common process step, in order to reduce the volume of the connection layer.

[0032] In at least one embodiment of the structural element, the structural element comprises a support, at least one component and an electrically insulating connecting layer. The component is mechanically fastened to the support by means of the electrically insulating connecting layer. The support comprises a connecting layer with a connecting surface, wherein the connecting layer is arranged on the support and has at least one opening, and the connecting surface of the connecting layer is located in the at least one opening. The component comprises a contact layer with a contact surface, wherein, in a top view of the support, the contact surface covers the opening of the connecting layer and the connecting surface of the connecting layer located in the opening. The contact surface and the connecting surface are adjacent to each other, thereby forming a direct electrical contact between the contact layer and the connecting layer, and thereby connecting the component to the support in an electrically conductive manner.

[0033] In the case of such a structural element, the electrical connection and the mechanical connection between the component and the support are particularly partially separated. The component is mechanically fixed to the support by means of an electrically insulating connecting layer. The connecting layer, for example, an adhesive layer, can be structured in such a way that the material of the connecting layer does not remain in the one or more openings of the connecting layer. The remaining area of ​​the connecting layer is outside the opening and is particularly provided for mechanical fixation. The layer thickness and composition of the connecting layer can be selected in this case so that after removing the solvent and, if necessary, after the wetting reaction, the conductive surfaces of the connecting layer and the contact layer touch directly. Because the connecting layer is particularly free of conductive fillers, the connecting layer can be designed to be particularly thin. In addition, the local separation of mechanical fixation and electrical connection reduces the risk of short circuits within the structural element.

[0034] According to at least one embodiment of the component, the interface between the contact layer and the connecting layer is formed by an overlapping surface between the contact surface and the connecting surface. The interface is in particular free of material of the connecting layer or free of traces of material of the connecting layer.

[0035] According to at least one embodiment of the structural element, the connecting layer extends only in a vertical region, which is located in the vertical direction at the height between the support and the component. The side of the body of the component is not covered by the connecting layer in particular. The body of the component may also not be surrounded laterally by the connecting layer. In other words, the connecting layer does not extend in particular up to the vertical height of the component. It is possible that the connecting layer does not have any sub-regions that extend beyond the contact layer of the component in a direction away from the support. Overall, the connecting layer is therefore located in particular only at the vertical height between the support and the component, for example between the support and the body of the component. The side of the component is not covered or is at most partially covered or surrounded laterally by the connecting layer at the side of the contact layer.

[0036] According to at least one embodiment of the structural element, the connecting layer has, in the overlapping region with the component, a surface facing away from the abutment, which surface directly adjoins the component and marks the highest vertical projection of the connecting layer from the abutment.

[0037] According to at least one embodiment of the structural element, the connecting layer has a first sub-region and a second sub-region directly adjoining the first sub-region in a top view of the support. The first sub-region has a first surface facing away from the support, the first surface in particular directly adjoining the component and being completely covered by the component. The second sub-region has a second surface facing away from the support, the second surface, for example, not adjoining the component. The vertical spacing between the first surface and the main body of the support is in particular greater than the vertical spacing between the second surface and the main body of the support.

[0038] The first subregion has, for example, a greater layer thickness than the second subregion. It is possible that the first subregion has a smaller material thickness than the second subregion. However, the first subregion and the second subregion can consist of the same material.

[0039] According to at least one embodiment of the component, the connecting layer has a layer thickness of between 20 nm and 5 μm inclusive, between 20 nm and 2 μm inclusive, for example between 100 nm and 3 μm inclusive, for example between 20 nm and 1 μm inclusive. In this sense, the connecting layer is a thin adhesion promoting layer.

[0040] According to at least one embodiment of the structural element, the component is electrically conductively connected to the support via a through-contact. The through-contact has at least one sub-region of the contact surface and at least one sub-region of the connection surface, wherein the through-contact extends through the connection layer in a vertical direction. The sub-region is in particular an inner or outer surface of the through-contact. The through-contact is spaced apart from the connection layer in a lateral direction, in particular by an intermediate region. The intermediate region is, for example, a cavity filled with a gaseous medium.

[0041] According to at least one embodiment of the structural element or the method, the contact surface of the contact layer only partially covers the opening and the connection surface in a top view. The one or more components can be arranged on the connection layer in such an offset manner that the one or more components each only partially cover one of the openings. It is therefore possible that the connection pin is only partially covered by the associated contact pin in a top view, or vice versa. Therefore, the contact area of ​​the one or more components is shifted laterally in a targeted manner.

[0042] According to at least one embodiment of the structural element or the method, the contact between the contact layer and the connecting layer is a remelted contact connection, in particular a remelted soldered contact connection. The connecting layer and / or the contact layer can contain solder material, in particular consist of solder material or be coated with solder material.

[0043] The method described above is particularly suitable for producing the component described here. Therefore, the features described in conjunction with the component can also be used for the method and vice versa. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Further preferred embodiments of the structural element and the method are described below in conjunction with Figures 1A to 11C The embodiment explained is obtained. Among them:

[0045] Figure 1A , 1B , 1C, 1D, 1E and 1F show schematic diagrams of some method steps of a method for manufacturing a structural element;

[0046] Figure 2A , 2B , 2C and 2D show schematic diagrams of some further method steps of the method for producing a structural element;

[0047] Figure 3A , 3B , 3C, 3D, 4A, 4B, 4C, 4D, 5A, 5B, 5C, 5D, 6A, 6B, 6C, 6D, 7A, 7B, 7C, 7D, 8A, 8B, 8C, 8D, 9A, 9B, 9C and 9D show schematic diagrams of different method steps of further exemplary embodiments of a method for producing a structural element;

[0048] Fig. 10A , 10B and 10C are schematic diagrams showing some embodiments of structural elements, and

[0049] Fig.11A , 11B 11C show schematic diagrams of further method steps of a further exemplary embodiment of a method for producing a structural element.

[0050] Identical, similar or identically acting elements are provided with the same reference numerals in the figures. The figures are schematic diagrams and are therefore not absolutely true to scale. Rather, relatively small elements and in particular layer thicknesses may be shown exaggeratedly large for the sake of clarity.

[0051] exist Figure 1A Schematically shown in FIG. 1 are method steps for producing a structural element 10. A support 1 is provided, for example, with a body 1H. A connecting layer 1S is arranged on the body 1H. The connecting layer 1S can be a structured layer with a plurality of connecting pins 1C. The connecting pins 1C each have a surface 1F facing away from the body 1H, wherein the surface 1F constitutes a connecting surface 1F and as shown in FIG. Figure 1AAs shown in the figure, it is freely accessible. Figure 1A The exposed connection surface 1F shown in FIG. 1 is, in particular, a metal surface which forms a so-called connection pad of the support 1 .

[0052] and Figure 1A In contrast, the support 1 can have, depending on the functionality, a partly quite complex sequence of current-conducting and insulating layers which are shown in the figure for reasons of clarity. Figure 1A and are not shown in the following figures.

[0053] according to Figure 1B , the connection layer 3 is arranged on the support 1. The connection pin 1C with the exposed connection surface 1F is coated with the material of the connection layer 3, for example, an insulating adhesive, for example by centrifugal coating or by a so-called spin coating method. In a top view of the main body 1H, the connection layer 3 first completely covers the connection pin 1C and the connection surface 1F. The connection layer 3 can firstly adjoin the connection pin 1C and the connection surface 1F in a transverse direction. After the connection layer 3 is arranged on the support 1, it has a vertical layer thickness 3D.

[0054] according to Figure 1C In order to expose the connection pins 1C or the connection surfaces 1F, a plurality of openings 3R are produced in the connection layer 3. The connection pins 1C are exposed in particular in such a way that the connection pins 1C are laterally spaced apart from the connection layer 3 by the intermediate regions Z. Figure 1C In the embodiment, the connection layer 3 extends beyond the connection surface 1F away from the main body 1H in the vertical direction.

[0055] Preferably, the connecting layer 3 contains a photosensitive, in particular photostructurable component, so that the connecting layer 3 can be photostructured in order to produce an opening or a plurality of openings 3R. The connecting layer 3 can contain a photoresist, which is mixed with an adhesive. As an alternative, it is possible to mechanically or chemically strip the material of the connecting layer 3 in order to produce an opening or a plurality of openings 3R. When the connection surface 1F is exposed, the vertical layer thickness 3D of the connecting layer 3 remains unchanged.

[0056] In order to process the connection layer 3, for example, in the form of an adhesive layer, a possibly suitable baking step is desirable, in particular for partially removing the solvent components. It is also possible to expose, in addition to the opening 3R, the following areas of the connection layer 3, which are not provided for subsequent covering by a component. For example, a surrounding frame is formed by the connection layer 3 around the associated connection surface 1F. The surrounding frame is preferably implemented continuously, but can also be implemented interruptedly.

[0057] The support 1 has a main extension surface or a receiving surface, which is formed, for example, by a particularly planar surface of the main body 1H of the support 1 facing the connecting layer 1S. The connecting layer 3 can have an exposed adhesive surface, wherein the adhesive surface preferably extends in a plane-parallel manner to the receiving surface of the support 1. In particular, the adhesive surface is formed by the exposed surface of the connecting layer 3. The adhesive surface can be implemented continuously or have a plurality of separated sub-adhesive surfaces. The adhesive surface or the entire adhesive surface is preferably implemented flat. In particular, the exposed adhesive surface of the connecting layer 3 is raised vertically relative to the connecting surface 1F, in particular by a vertical spacing D. If the component 1 is arranged on the adhesive surface and the component 1 does not extend into the opening 3R of the connecting layer 3, the component 1 can first be spatially spaced apart from the connecting surface 1F by a vertical spacing D ( Figure 1E ).

[0058] according to Figure 1D , a component 2 or a component composite 20 consisting of a plurality of components 2 is arranged on the connecting layer 3. The component 2 or the plurality of components 2 are placed on the connecting layer 3, for example, by means of an attached punch 20H. The punch 20H can be removed afterwards before or after the component 2 or the plurality of components 2 are permanently fixed on the support 1 by means of the connecting layer 3. It is possible that the component composite 20 has a plurality of components 2 and a common matrix 20H, wherein the components 2 are arranged or formed on the matrix 20H. The matrix 20H can be a growth matrix on which the body 2H of the component 2 is epitaxially grown. After the component 2 is mechanically fixed on the support 1, the matrix 20H can remain on one component 2 or on a plurality of components 2 or be removed from the component 2.

[0059] according to Figure 1D , each component 2 has a body 2H and a contact layer 2S, the body can be a semiconductor body, wherein the component 2 is arranged on the connecting layer 3 in such a way that the contact layer 2S faces the connection layer 1S of the support 1. The contact layer 2S of the component 2 can be implemented in the form of a single contact pin 2C. It is also possible that the contact layer 2S has at least two or exactly two contact pins 2C, which are assigned to different electrical polarities of the component 2 and are provided for electrical contacting of the component 2, for example.

[0060] In a top view of the support 1, the body 2H can completely cover the contact layer 2S. The contact layer 2S or the contact pin 2C has in particular an exposed and thus freely accessible contact surface 2F. The contact layer 2S or the contact surface 2F is in particular located on the back side of the component 2, i.e. on the side of the component 2 facing the support 1.

[0061] according to Figure 1E , the component 2 or components 2 are placed on the bonding surface of the connecting layer 3. The connecting layer 3 is, for example, only located between the main body 1H of the support 1 and the component 2 or the main body 2H of the component 2. The component 2 has a side surface 4, which is especially composed of a side surface 4H of the main body 2H and a side surface 4S of the contact layer 2S. It is possible that the side surface 4H and / or the side surface 4S are not covered or laterally surrounded by the connecting layer 3 before and / or after the volume change of the connecting layer 3. The connecting layer 3 does not have any sub-areas in particular, which extend in a vertical direction from the support 1 via the contact layer 2 to or beyond the side surface 4H of the main body 2H. Therefore, the side surfaces 4, 4S and 4H extending in the vertical direction can not be covered by the material of the connecting layer 3.

[0062] exist Figure 1E , the component 2 completely covers the opening 3R of the connecting layer 3 and the connecting column 1C arranged in the opening 3R in a top view of the support 1. The component 2 is arranged on the connecting layer 3 in a calibrated manner in particular such that the contact surface 2F of the corresponding component 2 overlaps with the connecting surface 1F of the support 1 in a top view of the support 1. The contact surface 2F is spatially separated from the connecting surface 1F by a vertical spacing D in a vertical direction. In other words, a gap is located between the conductive structure located at the bottom side of the component 2 and the conductive structure located at the top side of the support 1. After the component 2 is arranged on the connecting layer 3, the component 2 is temporarily mechanically connected to the support 1 via the connecting layer 3. However, the component 2 is not yet electrically conductively connected to the support 1.

[0063] In a further step of the method, the gap is closed by: Figure 1F The vertical distance D is reduced in such a way that the contact surface 2F and the connection surface 1F directly touch each other and form an electrical contact. This forms a through-contact 12 which extends through the connection layer 3 and electrically connects the component 2 to the support 1. Figure 1F , the through-contact 12 is formed only by the connecting pin 1C.

[0064] The volume or layer thickness 3D of the connecting layer 3 is in particular reduced. The shrinkage of the connecting layer 3 is initiated, for example, by a thermal or thermomechanical process. It is appropriate for the layer thickness 3D to be reduced or reduced at least by the vertical spacing D between the contact surface 2F and the connection surface 1F.

[0065] After the volume change of the connecting layer 3, the connecting layer has at least one first sub-region 31, which is completely covered by the associated component 2, in particular by the body 2H and / or the contact layer 2S of the associated component 2, in a top view of the support 1. The first sub-region 31 is in particular a region of the connecting layer 3 which, in a top view, adjoins not only the support 1 but also the component 2. The first sub-region 31 has a surface 31F which, for example, constitutes a contact surface between the first sub-region 31 and the component 2. The surface 31F in particular marks the highest vertical protrusion of the connecting layer 3 in the surroundings of the associated component 2. Figure 1F The central opening 3R is surrounded, in particular completely surrounded, in a lateral direction by such a partial region 31 .

[0066] After the volume change of the connecting layer 3, the connecting layer has at least one second sub-region 32, which is at least partially or completely not covered by the component 2 or by all components 2 or at least not covered by one or more contact layers 2S in a top view of the support 1. The second sub-region 32 is adjacent to the first sub-region 31 in a lateral direction, in particular. The second sub-region 32 is, for example, a region of the connecting layer 3 that is adjacent to no component 2 in a vertical direction and therefore does not have a common contact surface with any component 2.

[0067] In a top view of the support 1, the second sub-region 32 is at least partially located to the side of one component 2 or a plurality of components 2. However, it is possible that the second sub-region 32 is partially or completely covered by the component 2 ( Figure 2A ). The second sub-region 32 does not, however, adjoin the component 2 and can be spaced apart from the component 2, in particular from the main body 2H of the component 2, by a vertical spacing. In particular, the first sub-region 31 is partially or completely surrounded by the second sub-region 32 in the lateral direction.

[0068] The second sub-region 32 has a surface 32F facing away from the support 1, which is slightly set back in the direction of the support 1 compared to the surface 31F of the first sub-region 31. In other words, the surface 31F of the first sub-region 31 extends vertically beyond the surface 32F of the second sub-region 32. Therefore, the surfaces 31F and 32F form two vertically offset platforms of a step on the total surface of the connecting layer 3, wherein the higher platform is adjacent to the component 2 and the lower platform is vertically spaced apart from the component 2 or at least from the body 2H of the component 2.

[0069] The first sub-region 31 has a first layer thickness 31D and the second sub-region 32 has a second layer thickness 32D. The second layer thickness 32D is in particular smaller than the first layer thickness 31D. Both the first layer thickness 31D and the second layer thickness 32D are smaller than the original layer thickness 3D of the connecting layer 3. The difference between the original layer thickness 3D and the first layer thickness 31D or the second layer thickness 32D is, for example, at least as large as or larger than the original vertical spacing D between the connecting surface 1F and the contact surface 2F. The original vertical spacing D is, for example, Figure 1E is schematically shown in FIG.

[0070] according to Figure 1E , the connecting layer 3 has a globally constant layer thickness 3D before the volume change. After the volume change, the connecting layer 3 has different layer thicknesses 31D and 32D in different sub-regions 31 and 32 ( Figure 1F ). This fact is primarily due to the fact that the first sub-region 31, due to direct wetting at the component 2, does not shrink as much after the contact surface 2F touches the connection surface 1F as the second sub-region 32, which does not adjoin the component 2 directly and is therefore not wetted directly by the component 2. It is therefore possible that the first sub-region 31 has a smaller material thickness than the second sub-region 32, even if the first sub-region 31 and the second sub-region 32 have the same material composition.

[0071] Therefore, different layer thicknesses 31D and 32D, different material thicknesses in sub-regions 31 and 32 and a vertical offset between surfaces 31F and 32F can be regarded as characteristic features of a method in which the electrical connection between two metal surfaces, that is to say between the contact surface 2F and the connecting surface 1F, is formed by a volume change of a particularly non-conductive connecting layer 3.

[0072] Further characteristic features of such a method can be derived from Figure 1E and 1F , in which it is schematically shown that the through-contact 12 or the connecting pin 1C is laterally spaced apart from the connecting layer 3 already before and especially also after the volume change of the connecting layer 3 by the intermediate region Z. The intermediate region Z is a cavity filled in particular with a gaseous medium, such as air. In the lateral direction, the through-contact 12 can be completely surrounded by the intermediate region Z.

[0073] For the sake of clarity, only the fastening and electrical contacting of the components 2 are generally described. Figures 1D to 1FAs schematically shown in , a plurality of components 2 can also be mechanically fixed to the support 1 in the same process and electrically contacted therewith. For this purpose, the connecting layer 3 can have a plurality of openings 3R, wherein the component 2 is respectively arranged at one of the openings 3R and is electrically connected to the support 1 by means of at least one through-contact 12 arranged in the associated opening 3R.

[0074] according to Figure 2A , the connection layer 3 can optionally be removed in the second subregion 32 laterally to the component 2, for example by means of an etching process, for example using an O2 plasma, in partial regions or completely. The removal of the connection layer 3 below a component 2 or below a plurality of components 2 can be omitted, so that the second subregion 32 is not removed at least in this region. Figure 2A , the connecting layer 3 is divided into a plurality of individual sublayers, wherein each of the sublayers can be assigned one-to-one to one of the components 2. In a top view of the support 1, the component 2 can partially or completely cover the sublayer of the connecting layer 3 assigned to the component. Each of the sublayers of the connecting layer 3 can have a first subregion 31 with a layer thickness 31D and a surface 31F and a second subregion 32 with a layer thickness 32D and a surface 32F.

[0075] For further processing of the structural element 10 or the component 2, encapsulation layers, passivation layers and / or further contact layers can be produced. If the connection layer 3 is at least partially removed in the second sub-region 32, the encapsulation or passivation of the individual components 2 can be simplified and reliably performed. For example, the side faces 4 of the component 2, in particular the side faces 4H and / or 4S, are completely encapsulated or passivated with an electrically insulating layer. Decoupling structures or further optical components for radiation shaping can also be produced or placed on the body 2H, for example.

[0076] The structural element 10 is Figure 2B The exemplary embodiment shown in corresponds essentially to Figure 2A . In contrast, further contact layers are explicitly shown on the body 2H. The contact layer 2S on the back side of the component 2 forms, for example, a first electrical contact location 61. The further contact layer on the front side of the component 2 forms, in particular, a second electrical contact location 62 of the component 2. The component 2 can be electrically contacted externally via the first electrical contact location 61 and the second electrical contact location 62. Figure 2BDifferently, the main body 1H of the support 1 may have a through-contact portion extending through the main body 1H, so that the through-contact 12 can be electrically contacted at the rear side of the support 1 via the through-contact portion.

[0077] Method steps Figure 2C The exemplary embodiment shown in corresponds essentially to Figure 1C . In contrast, areas of the connecting layer 3 that are not intended to be covered later by the component 2 are exposed. Therefore, the connecting layer 3 can be disassembled into a plurality of individual sublayers before the component 2 is arranged. Each of the sublayers can have an opening 3R and can be provided, for example, to receive one of the components 2. Figure 2D , the component 2 is arranged on the opening 3R of the connecting layer 3. After the volume of the connecting layer 3 is reduced, it is possible to manufacture, for example, Figure 2A Or the structural element 10 shown in 2B.

[0078] The various method steps for producing the component 10 are described in detail below. Figure 3A , 3B , 3C and 3D substantially correspond to the embodiments shown in Figure 1D , 1E , 1F or 2A. In contrast, the contact layer 2S of the corresponding component 2 is implemented in the form of a contact pin 2C, wherein the size of the contact pin 2C is selected so that it extends into the opening 3R when the component 2 is placed on the connecting layer 3. Therefore, the contact layer 2S does not directly adjoin the connecting layer 3 but is spaced apart therefrom laterally.

[0079] according to Figure 3B The main body 2H of the component 2 is adjacent to the connection layer 3. In the lateral direction, the contact layer 2S, especially the contact column 2C, is surrounded by the connection layer 3. It is feasible that the contact layer 2S is completely within the opening 3R. Figure 3B It is shown that the contact surface 2F is smaller than the connection surface 1F. By increasing the pressing pressure during the shrinking of the connection layer 3, a tighter connection can be produced between the conductive structure of the component 2 and the conductive structure of the support 1. In addition, a smaller contour step is required to be overmolded on the connection surface 1F or on the contact surface 2F. Conversely, it is possible to design the contact surface 2F larger than the connection surface 1F.

[0080] After the volume of the connection layer 3 is reduced, the through contact 12 ( Figure 3C). Due to the different cross sections of the contact column 2C and the connecting column 1C, the through contact 12 can be formed in the form of a column with an abruptly changed cross section. In other words, the through contact 12 has a side surface that has a stepped shape in some areas, wherein the step transition is located at the boundary area between the contact column 2C and the connecting column 1C. The contact column 2C and the connecting column 1C can be formed of the same material or different materials. In contrast, the through contact 12 can be formed of the same material continuously or of different materials in different sub-areas.

[0081] according to Figure 3D , the component 2 can partially or completely cover a sublayer of the connecting layer 3. If the component 2 completely covers the cover layer, the sublayer is in particular formed only by the first subregion 31 of the connecting layer 3. If the component 2 partially covers the sublayer, the sublayer can be formed by the first subregion 31 and the second subregion 32 of the connecting layer 3, wherein the first sublayer 31 is completely covered by the main body 2H of the component 2 in a top view and is directly adjacent to it. In a top view, the second subregion 32 is only laterally located with respect to the main body 2H, wherein the second subregion 32 is directly adjacent to the first subregion 31 and has a reduced layer thickness 32D compared to the subregion 31.

[0082] The various method steps for producing the component 10 are described in detail below. Figure 4A , 4B , 4C and 4D substantially correspond to the embodiments shown in Figure 1D , 1E , 1F or 2A. In contrast, the contact surface 2F has an additional contour step, wherein the contour step can be formed by structuring the contact surface 2F or by constructing a spike or a plurality of spikes on the contact surface 2F. The contour step or the plurality of contour steps extend into the opening 3R.

[0083] By means of such a contour step or tip, electrical contact can be reliably produced between the contact surface 2F and the connection surface 1F, wherein the contour step can be deformed when the contact surface 2F and the connection surface 1F are assembled. In terms of force concentration, small steps or tips are advantageous, but additional contour steps can be formed on the contact surface 2F by means of a plurality of point-shaped or line-shaped structures.

[0084] The various method steps for producing the component 10 are described in detail below. Figure 5A , 5B , 5C and 5D substantially correspond to the embodiments shown in Figure 1D , 1E , 1F or 2A. In contrast, the component 2 is arranged on the connecting layer 3 in an offset manner so that the component 2 covers only a partial area of ​​one of the openings 3R. It is therefore possible that the connecting pin 1C is only partially covered by the associated contact pin 2C in a top view, or vice versa. The contact area of ​​the component 2 is thus shifted laterally in a targeted manner.

[0085] The various method steps for producing the component 10 are described in detail below. Fig. 6A , 6B , 6C and 6D substantially correspond to the embodiments shown in Figure 1D , 1E , 1F or 2A. Different from this, the support 1 has an insulating layer 15, which is arranged between the main body 1H of the support 1 and the connecting layer 3 in a vertical direction. In particular, the connecting layer 3 is adjacent to the insulating layer 15. The connecting layer 3 and the insulating layer 15 have a plurality of common openings 3R, in which the connecting surface 1F or the connecting column 1C arranged with the connecting layer 1S is easily accessible.

[0086] After the volume reduction of the connection layer 3 and possibly after the optional removal of some subregions 32 of the connection layer 3, the insulation layer 15 can remain in the component 10. The insulation layer 15 can facilitate the passivation or encapsulation of the component 2 or the component 10, in particular if the passivation or encapsulation is carried out largely along the component periphery and / or also in the region below the component 2. As a result, all edges of the component 2 or the component 10 can be reliably covered by the passivation layer or the encapsulation layer.

[0087] The various method steps for producing the component 10 are described in detail below. Fig. 7A , 7B , 7C and 7D substantially correspond to the embodiments shown in Fig. 6A , 6B , 6C or 6D. In contrast, the fastening of a single component 2 with two contact locations 61 and 62 on the back side is only schematically shown. In contrast, it is possible that a plurality of such components 2 are fastened to the support 1 and are electrically contacted. The contact locations 61 and 62 can be set for electrically contacting the component 2 and are assigned to different electrical polarities of the component 2. It is also possible that the contact locations 61 and / or 62 are provided for forming a signal path or a plurality of signal paths for an integrated circuit.

[0088] In a top view of the support 1, the component 2 covers two openings 3R, wherein a connection surface 1F is exposed in each opening 3R. Fig. 7A As shown in , the insulating layer 15 is arranged between the body 1H of the support 1 and the connecting layer 1S. The connecting surface 1F or the connecting layer 1S can have a subregion which is covered by the connecting layer 3 in a plan view of the support 1 or is partially embedded therein.

[0089] according to Figure 7C and 7D , the connecting layer 3 can have a second sub-region 32 with a layer thickness 32D, which is arranged between the contact locations 61 and 62 in a top view of the support 1 and is completely covered by the component 2 and is vertically spaced apart therefrom. In particular, the connecting layer 3 adjoins the component 2 only in the region of the contact layer 2S. The body 2H of the component 2 does not have any locations adjoining the connecting layer 3 in a direct relationship, for example.

[0090] according to Fig.7D The connecting layer 3 can be removed in order to partially expose the connecting layer 1S. An associated component 2 can be electrically contacted externally via the exposed region of the connecting layer 1S.

[0091] The various method steps for producing the component 10 are described in detail below. Fig. 8A , 8B , 8C and 8D substantially correspond to the embodiments shown in Fig. 7A , 7B , 7C or 7D. In contrast, the connecting layer 3 not only adjoins the contact layer 2S but also adjoins the body 2H of the component 2. For example, when the volume of the connecting layer 3 is reduced, the component 2 is pressed into the connecting layer 3 so that the connecting layer 3 is pressed into the body 2H of the component 2. Figure 8B The main body 2H, which is also spatially separated from the connecting layer 3, is now arranged according to Figure 8C It comes into contact with the connecting layer 3 and thus directly adjoins it.

[0092] The various method steps for producing the component 10 are described in detail below. Fig.9A , 9B , 9C and 9D substantially correspond to the embodiments shown in Figure 3A , 3B, 3C or 3D. In contrast, the connection layer 1S is not structured and is constructed continuously. The connection layer 1S can be partially embedded in the main body 1H of the support 1. In the vertical direction, the front surface of the connection layer 1S can end flush with the front surface of the main body 1H of the support 1.

[0093] The structural element 10 is Fig. 10A The exemplary embodiment shown in corresponds essentially to Figure 1F In contrast, the structural element 10 shown in Fig. 10A , the body 2H of the component 2 has a first semiconductor layer 21, a second semiconductor layer 22 and an active region 23 therebetween. The body 2H of the component 2 can be a semiconductor body which is particularly designed for generating or detecting electromagnetic radiation. The component 2 is, for example, a light emitting diode.

[0094] As for Figure 1F A further difference is that the connecting layer 1S has a plurality of separate sub-layers which are partially embedded in the body 1H of the support 1, wherein in each of the openings 3R a connecting pin 1C protrudes beyond the associated sub-layer.

[0095] The structural element 10 is Fig. 10B The embodiment shown in corresponds to Figure 3C The structural element 10 shown in FIG. 1 comprises a plurality of components 2 , each of which has a body 2H with an active region 23 and semiconductor layers 21 and 22 .

[0096] The structural element 10 is Fig. 10C The embodiment shown in corresponds to Fig. 9C The structural element 10 shown in FIG. 1 comprises a plurality of components 2 , each of which has a body 2H with an active region 23 and semiconductor layers 21 and 22 .

[0097] The various method steps for producing the component 10 are described in detail below. Fig.11A , 11B The embodiment shown in 11C corresponds substantially to that in Figure 1D , 1E Or the embodiment shown in 1F. Different from this, the exposed connection surface 1F or connection column 1C or connection layer 1S protrudes beyond the connection layer 3, that is, protrudes in a direction away from the main body 1H of the support 1.

[0098] according to Figure 1D , 1E and 1F, the contact layer 2S can be implemented flat. In contrast, the contact layer 2S is formed according to Fig.11A , 11B The contact layer 2S and 11C have a plurality of openings or recesses. The contact layer 2S is partially stepped. The bottom surface of the opening or recess forms an exposed contact surface 2F. The exposed connection surface 1F is located within the opening or recess assigned to the contact layer 2S. The connection column 1C or the exposed connection surface 1F particularly extends into the opening assigned to the contact layer 2S. In the vertical direction, the exposed connection surface 1F or the connection column 1C is spatially separated from the contact layer 2S, particularly from the exposed contact surface 2F, by a spacing D.

[0099] according to Fig. 11B , the connection layer 1S or the connection column 1C is partially or completely surrounded by the contact layer 2 and / or the connection layer 3 in the lateral direction. If the layer thickness 3D of the connection layer 3 is reduced, for example, by shrinking, the distance D can be reduced to zero, so that the connection surface 1F directly adjoins the contact surface 2F. Such a structural element 10 is, for example, Fig. 11C is schematically shown in FIG.

[0100] and Figures 1C to 11C It is possible that there is no lateral spacing or intermediate region Z between the connection layer 1S and the contact pin 2C or the connection pin 1C. In this case, the connection layer 1S can directly adjoin the contact pin 2C and / or directly adjoin the connection pin 1C either before or after the layer thickness 3D of the connection layer 3 is reduced, or both before and after the layer thickness 3D of the connection layer 3 is reduced.

[0101] Furthermore, in all embodiments, it is possible that the electrical and mechanical connection between the connection layer 1S and the contact layer 2S is a welded connection. The connection layer 1S and / or the contact layer 2S can, for example, consist of a welding material or be coated with a welding material. In this case, this can be a remelted welded contact between the connection layer 1S and the contact layer 2S.

[0102] Priority is claimed from German patent application 10 2019 111 816.6, the disclosure content of which is hereby incorporated by reference.

[0103] The invention is not restricted to the invention by the description of the exemplary embodiments. Rather, the invention comprises every new feature and every combination of features, which in particular includes every combination of features in the claims, even if this feature or this combination itself is not explicitly pointed out in the claims or the exemplary embodiments.

[0104] Reference numerals list

[0105] 10 Structural elements

[0106] 1 Support

[0107] 1H Main body of the support

[0108] 1S Connection layer

[0109] 1C Connecting column

[0110] 1F Connection surface

[0111] 12 Penetration contact

[0112] 15 Insulation layer of support

[0113] 2 Components

[0114] 2H Main body of component / semiconductor body of component

[0115] 21. First semiconductor layer

[0116] 22. Second semiconductor layer

[0117] 23 Active area of ​​semiconductor body

[0118] 2S contact layer

[0119] 2C Contact Column

[0120] 2F contact surface

[0121] 20 Component composite structure

[0122] 20H Matrix / convex mold for composite structures of components

[0123] 3 Connection Layer

[0124] 31 Connect the first sub-region of the layer

[0125] 31F Surface of the first sub-region

[0126] 32 The second sub-area of ​​the connection layer

[0127] 32F Surface of the second sub-region

[0128] Vertical layer thickness of 3D connection layers

[0129] 3R Opening

[0130] 4 Sides of the component

[0131] 4H Side of the main body of the component

[0132] 4S contact layer side

[0133] 61 First contact position

[0134] 62 Second contact position

[0135] D The vertical distance between the connection surface and the contact surface

[0136] Z is the middle area between the connection layer and the contact pin or connecting pin.

Claims

1. A method for producing a structural element (10), comprising a support (1) and at least one component (2), the at least one component being electrically conductively connected to the support and mechanically fastened to the support by means of an electrically insulating connecting layer (3), the method comprising the following steps: A) providing a coupling layer (1S) for the support (1), wherein: The connecting layer (3) is arranged on the support and has at least one opening (3R), a connecting surface (1F) of the connecting layer (1S) is exposed in the at least one opening, and wherein the connecting layer (3) protrudes beyond the exposed connecting surface (1F) in a vertical direction or vice versa; B) placing the component (2) with the contact layer (2S) on the support (1) in such a way that, in a top view of the support (1), the exposed contact surface (2F) of the contact layer (2S) covers the opening and the connection surface (1F) located therein, wherein the exposed contact surface (2F) is spaced apart from the exposed connection surface (1F) by a vertical distance (D); and C) reducing the vertical distance (D) by a change in volume of the connecting layer (3), whereby the exposed contact surface (2F) and the exposed connection surface (1F) are combined in such a way that they are adjacent to one another and direct electrical contact is formed between the contact layer (2S) and the connection layer (1S).

2. The method according to claim 1, wherein the connecting layer (3) is adjacent to the component (2) and adjacent to the support (1) after the component (2) is placed and before the vertical distance (D) is reduced.

3. The method according to claim 1, wherein before the volume change, the connecting layer (3) has a vertical layer thickness (3D), and the reduction of the vertical spacing (D) is achieved by shrinking the vertical layer thickness (3D) of the connecting layer (3) or by shrinking the volume of the connecting layer (3). 4 . The method according to claim 3 , wherein the connecting layer ( 3 ) is briefly expanded before the shrinking process in order to increase the adhesiveness.

5. The method according to claim 1, wherein - before the volume change, the connecting layer (3) has a vertical layer thickness (3D) with a constant height in the vicinity of the contact layer (2S), and After the volume change, the connecting layer (3) has a reduced vertical layer thickness (3D) with locally different heights in the same surroundings of the contact layer (2S), wherein: The layer thickness (3D) is greater in the overlapping region of the connecting layer (3) and the component (2) than in the region of the connecting layer (3) without overlapping with the component (2), or The layer thickness (3D) is greater in the overlapping region of the connecting layer (3) and the contact layer (2S) than in the region of the connecting layer (3) without overlapping with the contact layer (2S). 6 . The method according to claim 1 , wherein the connecting layer ( 3 ) comprises a photostructurable material and the opening ( 3R) is formed by photostructuring of the connecting layer ( 3 ).

7. The method according to claim 1, wherein the exposed coupling surface (1F) is formed by an exposed surface of a coupling column (1C), wherein: - the connection column (1C) is arranged in the opening (3R) of the connection layer (3), and The connecting column (1C) is laterally spaced apart from the connecting layer before the volume change of the connecting layer (3) and remains laterally spaced apart from the connecting layer after the volume change of the connecting layer (3).

8. The method according to claim 1, wherein the exposed contact surface (2F) is formed by an exposed surface of a contact pin (2C), wherein: - the contact pillar (2C) extends into the opening (3R) of the connection layer (3), and The contact pillar (2C) is laterally spaced apart from the connection layer before the volume change of the connection layer (3) and remains laterally spaced apart from the connection layer after the volume change of the connection layer (3).

9. The method according to any one of claims 1 to 8, wherein a plurality of components (2) are placed simultaneously on the support (1), wherein: - each component (2) has a contact layer (2S) with at least one contact surface (2F), the connecting layer (3) has a plurality of openings (3R), in which the connection surface (1F) of the connection layer (1S) is freely accessible, and The component (2) is electrically connected to the carrier (1) in a common process step in order to reduce the volume of the connecting layer (3). 10 . The method according to claim 1 , wherein the reduction of the vertical distance (D) is mechanically supported by an external force.

11. A structural element (10) comprising a support (1), at least one component (2) and an electrically insulating connecting layer (3), wherein - the component (2) is mechanically fastened to the support (1) by means of the electrically insulating connecting layer (3), The support (1) has a connection layer (1S) with a connection surface (1F), wherein: The connecting layer (3) is arranged on the support and has at least one opening (3R), and the connecting surface (1F) of the connecting layer (1S) is located in the at least one opening. the component (2) has a contact layer (2S) with a contact surface (2F), wherein, in a plan view of the support (1), the contact surface (2F) covers the opening of the connecting layer (3) and the connection surface (1F) of the connection layer (1S) located in the opening, - the contact surface (2F) and the connection surface (1F) are adjacent to each other, thereby forming a direct electrical contact between the contact layer (2S) and the connection layer (1S), and thereby connecting the component (2) to the support (1) in an electrically conductive manner, and The connecting layer (3) extends only in a vertical region which is located in a vertical direction at a height between the support (1) and the component (2), so that the side surface (4H) of the body (2H) of the component (2) is not covered by the connecting layer (3).

12. A structural element (10) comprising a support (1), at least one component (2) and an electrically insulating connecting layer (3), wherein - the component (2) is mechanically fastened to the support (1) by means of the electrically insulating connecting layer (3), The support (1) has a connection layer (1S) with a connection surface (1F), wherein: The connecting layer (3) is arranged on the support and has at least one opening (3R), and the connecting surface (1F) of the connecting layer (1S) is located in the at least one opening. the component (2) has a contact layer (2S) with a contact surface (2F), wherein, in a plan view of the support (1), the contact surface (2F) covers the opening of the connecting layer (3) and the connection surface (1F) of the connection layer (1S) located in the opening, the contact surface (2F) and the connection surface (1F) adjoin one another directly, thereby forming a direct electrical contact between the contact layer (2S) and the connection layer (1S) and thereby connecting the component (2) to the carrier (1) in an electrically conductive manner, The connecting layer (3) comprises, in a plan view of the support (1), a first sub-region (31) and a second sub-region (32) directly adjoining the first sub-region (31), the first sub-region (31) has a first surface (31F) facing away from the support (1), the first surface directly adjoining the component (2) and being completely covered by the component (2), the second sub-region (32) has a second surface (32F) facing away from the support (1), the second surface not adjoining the component (2), and - The vertical distance between the first surface (31F) and the main body (1H) of the support (1) is greater than the vertical distance between the second surface (32F) and the main body (1H) of the support (1).

13. A structural element (10) comprising a support (1), at least one component (2) and an electrically insulating connecting layer (3), wherein - the component (2) is mechanically fastened to the support (1) by means of the electrically insulating connecting layer (3), The support (1) has a connection layer (1S) with a connection surface (1F), wherein: The connecting layer (3) is arranged on the support and has at least one opening (3R), and the connecting surface (1F) of the connecting layer (1S) is located in the at least one opening. the component (2) has a contact layer (2S) with a contact surface (2F), wherein, in a plan view of the support (1), the contact surface (2F) covers the opening of the connecting layer (3) and the connection surface (1F) of the connection layer (1S) located in the opening, the contact surface (2F) and the connection surface (1F) adjoin one another directly, thereby forming a direct electrical contact between the contact layer (2S) and the connection layer (1S) and thereby connecting the component (2) to the carrier (1) in an electrically conductive manner, the component (2) is electrically conductively connected to the support (1) via a through-contact (12), the through-contact (12) has at least one sub-region of the contact surface (2F) and at least one sub-region of the connection surface (1F), The through-contact (12) extends through the connection layer (3) in a vertical direction, and The through-contact (12) is spaced apart from the connecting layer (3) in a lateral direction by an intermediate region (Z), wherein the intermediate region (Z) is a cavity filled with a gaseous medium.

14. The structural element (10) according to any one of claims 11 to 13, wherein the boundary surface between the contact layer (2S) and the connection layer (1S) is formed by an overlapping surface between the contact surface (2F) and the connection surface (1F), wherein: The boundary surface is free of material of the connecting layer (3) or of traces of material of the connecting layer (3).

15. A structural element (10) according to any one of claims 11 to 13, wherein the connecting layer (3) has a surface (31F) facing away from the support (1) in the overlapping area with the component (2), the surface directly adjoining the component (2) and marking the highest vertical protrusion of the connecting layer (3) from the support (1). 16 . The structural element ( 10 ) according to claim 11 , wherein the connecting layer ( 3 ) is a thin adhesion promoting layer having a layer thickness (3D) of between 20 nm and 2 μm inclusive.

17. The structural element (10) according to any one of claims 11 to 13, wherein The component (2) has a semiconductor body (2H) with an optically active region (23) which is provided for generating or detecting electromagnetic radiation, and The support (1) has an electrical circuit which is provided for electrical contacting or for actuating the component (2).

18. The structural element (10) according to any one of claims 11 to 13, wherein the contact surface (2F) of the contact layer (2S) only partially covers the opening (3R) and the connection surface (1F) in a plan view.

19. The structural element (10) according to any one of claims 11 to 13, wherein the contact between the contact layer (2S) and the connection layer (1S) is a remelted contact connection.

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