Cutting equipment, LED detection system and LED detection method

Abstract

The present invention discloses a cutting device, an LED detection system and an LED detection method. The LED detection method comprises the following steps: S selects the LED to be detected; S repeatedly heats the LED to expand and contract the silver glue and the packaging part; S conveys the packaging part along the radial direction of the packaging part for the first time to break the packaging part into a head and a tail, and the head is separated from the bracket; wherein the epoxy resin located in the cup mouth groove is a part of the head; S determines the silver glue coverage area of ​​the bottom surface of the cup mouth groove; wherein, if the coverage area is less than 6%, the LED is an unqualified product; if the coverage area is between 6% and 8%, the LED is a secondary product; if the coverage area is above 8%, the LED is a qualified product. By adopting the above-mentioned LED detection method, the connection strength between the silver glue and the bracket can be conveniently detected, so as to avoid the application of secondary products or unqualified products in harsh environments, resulting in the need for frequent maintenance or replacement of LEDs in the future.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and in particular to a cutting device, an LED detection system and an LED detection method. Background Art

[0002] In the related art, refer to Figure 1 , LED100 includes a bracket 110, a layer of silver glue 120, a chip 130 and a packaging part 140. The bracket 110 has a cup mouth surface 111, and the cup mouth surface 111 is provided with a cup mouth groove 112. The bottom surface 1121 of the cup mouth groove 112 has silver glue 120, and the chip 130 is fixed to the silver glue 120. The packaging part 140 is made of epoxy resin, and the epoxy resin is packaged on the bracket 110, that is, it is bonded to the inner peripheral surface of the cup mouth groove 112, the cup mouth surface 111 and the outer side surface of the bracket 110. Among them, when the chip 130 is fixed, the LED100 enters the oven for baking at 170 degrees, and the silver glue 120 is cured, so that the silver glue 120 is firmly bonded to the bottom surface 1121, and the silver glue 120 is firmly bonded to the chip 130. However, in this link, the silver glue 120 and the bracket 110 are prone to poor bonding problems, such as high voltage and virtual connection problems. If such LED 100 is used in a harsh environment, the LED cannot be used for a long time, causing users to frequently replace the LED. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an LED detection method, which can conveniently detect whether an LED is qualified and avoid unqualified LEDs from being put into use.

[0004] The invention also provides a cutting device.

[0005] The present invention also provides an LED detection system having the cutting device.

[0006] According to the LED detection method of the embodiment of the present invention, the LED includes a bracket, silver glue, a chip and a packaging part, the bracket is provided with a cup-mouth groove, the silver glue is pasted on the bottom surface of the cup-mouth groove, the chip is pasted on the silver glue, and the packaging part is packaged inside the cup-mouth groove and outside the bracket, comprising the following steps:

[0007] S100 selects the LED to be tested;

[0008] S200 repeatedly heats the LED to expand and contract the silver glue and the packaging part;

[0009] S300 cutting the packaging part for the first time along the radial direction of the packaging part so that the packaging part is broken into a head part and a tail part, and the head part is separated from the bracket; wherein the epoxy resin located in the cup mouth groove is a part of the head part;

[0010] S400 determines the silver paste coverage area of ​​the bottom surface of the cup groove; if the coverage area is less than the first preset area, the LED is an unqualified product; if the coverage area is between the first preset area and the second preset area, the LED is a secondary product; if the coverage area is above the second preset area, the LED is a qualified product.

[0011] The LED detection method according to the embodiment of the present invention has at least the following beneficial effects: the first step is to use a reflow furnace to repeatedly heat the LED, about five times. During the repeated heating of the LED, the silver glue and the packaging part both expand and contract, and the connection between the packaging part, the silver glue and the cup-mouth groove is destroyed; the second step is to use a tool to cut the packaging part along the cup-mouth surface of the bracket, that is, the radial direction of the packaging part. The tool only needs to cut in about two millimeters, and the packaging part is broken into two parts (the packaging part is similar to glass, and when it is damaged, it is easy to break), respectively, the head and the tail, the tail is still fixed on the bracket, and the head is separated from the bracket; wherein, the epoxy resin located in the cup-mouth groove is part of the head, therefore, the epoxy resin in the cup-mouth groove is also separated from the bracket (this application scheme is based on the fact that the LED is heated multiple times, the silver glue and the packaging part are severely damaged, so the epoxy resin in the cup-mouth groove will be separated). When the head is separated from the bracket, the silver glue will be pulled apart. The third step is to detect the coverage area of ​​the silver glue on the bottom surface of the cup groove; if the coverage area is less than the first preset area, the LED is an unqualified product, so all LEDs produced in the same batch as the LED need to be scrapped; if the coverage area is between the first preset area and the second preset area, the LED is a secondary product, and the use environment of the LED will not be too harsh, such as indoor use, and the LEDs produced in the same batch as the LED can be used, reducing the scrapping of the LED; if the coverage area is above the second preset area, the LED is a qualified product, the product can be used in a harsher environment, and the LED still has a longer life. In summary, by adopting the above-mentioned LED detection method, the connection strength between the silver glue and the bracket can be easily detected, avoiding the use of secondary products or unqualified products in a harsher environment, resulting in the need for frequent repair or replacement of LEDs.

[0012] According to some embodiments of the present invention, in the step S100, a plurality of the LEDs are prepared; in the step S200, after each heating, the LEDs are reserved from entering the next heating; in the step S400, the LEDs obtained after m consecutive heatings are detected, and if the LEDs are qualified products, the detection is stopped; if the LEDs are unqualified products or inferior products, the LEDs obtained by the previous heating are continuously detected until qualified products are detected or the LEDs obtained by m heatings are completely detected; wherein, the LEDs obtained by m heatings are the LEDs obtained by the last few heatings.

[0013] According to some embodiments of the present invention, in the step S100, a plurality of the LEDs are prepared; in the step S200, after each heating, the LEDs are reserved and do not enter the next heating; in the step S400, the LEDs cut for the first time are the LEDs obtained by the mth reciprocal heating;

[0014] The LED detection method includes the following steps: cutting the packaging part for a second time along the radial direction of the packaging part so that the packaging part is broken into a head and a tail; if the epoxy resin in the cup mouth groove is separated from the head synchronously, the packaging of the cup mouth groove by the packaging part is unqualified; if the epoxy resin in the cup mouth groove is not separated from the head synchronously, the packaging of the cup mouth groove by the packaging part is qualified; wherein, the LED cut for the second time is the LED obtained by the initial n heatings.

[0015] According to some embodiments of the present invention, in the step S200, at least one heating temperature is between 250 degrees and 280 degrees.

[0016] According to the cutting device of the embodiment of the present invention, the LED comprises a bracket, silver glue, a chip and a packaging part, the cup mouth surface of the bracket is provided with a cup mouth groove, the silver glue is pasted on the bottom surface of the cup mouth groove, the chip is pasted on the silver glue, and the packaging part is packaged inside the cup mouth groove and outside the bracket, including:

[0017] Positioning mechanism, used for positioning the LED;

[0018] The cutting mechanism comprises a first driving member and a cutter, wherein the first driving member is used to drive the cutter to cut the packaging portion along the radial direction of the LED; wherein, along the vertical direction of the cup mouth surface, the distance between the cutter and the cup mouth surface is between 0 mm and 2.5 mm.

[0019] The cutting device according to the embodiment of the present invention has at least the following beneficial effects: the positioning mechanism positions the bottom of the LED, and the part of the LED to be cut is located outside the positioning mechanism. After the LED is positioned, the first driving member drives the cutter to move along the radial direction of the packaging part, that is, along the cup mouth surface of the bracket 110, so as to cut the packaging part of the LED. As can be seen from the above, the setting of the cutting device facilitates the cutting of the packaging part of the LED, and thus facilitates the detection of the LED.

[0020] According to some embodiments of the present invention, the cutting device also includes a vibration plate, the vibration plate includes a main body and a conveying track, the conveying track is connected to the main body, and the main body is used to convey the LED in sequence along the length direction of the conveying track; the positioning mechanism includes a positioning jig, a limiting member and a second driving member, the positioning jig has a positioning channel for positioning the LED, one end of the positioning channel is connected to one end of the conveying track, the second driving member is connected to the limiting member, and the second driving member is used to drive the limiting member to move to the positioning channel so that the LED slides along the positioning channel to a preset position.

[0021] According to some embodiments of the present invention, the positioning jig includes a first jig, a second jig and a third driving member, the positioning channel is defined between the first jig and the second jig, and the third driving member is connected to the first jig for driving the first jig away from or close to the second jig.

[0022] According to some embodiments of the present invention, the height of the top of the first jig is lower than the height of the top of the second jig, and the tool is located above the first jig.

[0023] According to an embodiment of the present invention, the LED detection system includes: the above-mentioned cutting device; a detection module, wherein the detection module includes a camera and a display module, and the camera is used to take real-time pictures of the LED after cutting and upload them to the display module.

[0024] The LED detection system according to the embodiment of the present invention has at least the following beneficial effects: after the LED is cut, the camera takes a picture of the cut LED and transmits the corresponding picture to the display. The staff can clearly observe the condition of the LED through the display and determine whether the LED is a qualified product.

[0025] According to some embodiments of the present invention, the detection system further includes a recognition module, and the recognition module is used to detect the silver paste coverage inside the LED after cutting, and calculate the coverage area of ​​the silver paste.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0028] Figure 1 A schematic diagram of the structure of an LED according to an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of a flow chart of an LED detection method according to an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of a portion of the structure of a cutting device according to an embodiment of the present invention;

[0031] Figure 4 for Figure 3 A magnified schematic diagram of the middle A area;

[0032] Figure 5 is a schematic diagram of a top view of the structure of a cutting device according to an embodiment of the present invention;

[0033] Figure 6 It is a schematic structural diagram of a vibration plate according to an embodiment of the present invention.

[0034] Reference numerals:

[0035] LED 100, bracket 110, cup mouth surface 111, cup mouth groove 112, bottom surface 1121, silver glue 120, chip 130, packaging part 140, head part 141, tail part 142;

[0036] Cutting device 200, positioning mechanism 210, positioning fixture 211, first fixture 2111, second fixture 2112, third driving member 2113, positioning channel 2114, limit member 212, second driving member 213, cutting mechanism 220, first driving member 221, tool 222, vibration plate 230, main body 231, conveying track 232. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0038] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0040] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0041] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0042] Reference Figure 1 The LED 100 includes a bracket 110, a silver glue 120, a chip 130 and a packaging part 140. The cup mouth surface 111 of the bracket 110 is provided with a cup mouth groove 112. The silver glue 120 is pasted on the bottom surface of the cup mouth groove 112. The chip 130 is pasted on the silver glue 120. The packaging part 140 is packaged inside the cup mouth groove 112 and outside the bracket 110.

[0043] According to the present invention, a method for detecting LED 100 is disclosed, referring to Figures 2 to 4, including the following steps: S100 selects the LED 100 to be tested; S200 repeatedly heats the LED 100 to expand and contract the silver glue 120 and the packaging part 140; S300 cuts the packaging part 140 for the first time along the radial direction of the packaging part 140 to break the packaging part 140 into a head 141 and a tail 142, and the head 141 is separated from the bracket 110; wherein, the epoxy resin located in the cup mouth groove 112 is a part of the head 141; S400 determines the silver glue 120 coverage area of ​​the bottom surface 1121 of the cup mouth groove 112; wherein, if the coverage area is less than the first preset area, the LED 100 is an unqualified product; if the coverage area is between the first preset area and the second preset area, the LED 100 is a secondary product; if the coverage area is above the second preset area, the LED 100 is a qualified product.

[0044] Specifically, in the first step, the LED 100 is repeatedly heated in a reflow oven, about five times. During the repeated heating of the LED 100, the silver glue 120 and the packaging part 140 are both thermally expanded and contracted, and the connection between the packaging part 140, the silver glue 120 and the cup mouth groove 112 is destroyed; in the second step, the packaging part 140 is cut along the cup mouth surface 111 of the bracket 110, that is, the radial direction of the packaging part 140, and the cutter only needs to cut about two millimeters, and the packaging part 140 is broken into two parts (the packaging part 140 The epoxy resin in the cup groove 112 is a part of the head 141, so the epoxy resin in the cup groove 112 is also separated from the bracket 110 (the present application is based on the LED 100 being heated multiple times, the silver glue 120 and the packaging part 140 being severely damaged, so the epoxy resin in the cup groove 112 will be separated). When the head 141 is separated from the bracket 110, the silver glue 120 will be pulled apart. The third step is to detect the coverage area of ​​the silver glue 120 on the bottom surface 1121 of the cup mouth groove 112; if the coverage area is smaller than the first preset area, LED100 is an unqualified product, and therefore, all LED100 produced in the same batch as LED100 need to be scrapped; if the coverage area is between the first preset area and the second preset area, LED100 is a secondary product, and the use environment of LED100 is not too harsh, such as indoor use, and LED100 produced in the same batch as LED100 can be used, reducing the scrapping of LED100; if the coverage area is above the second preset area, LED100 is a qualified product, and the product can be used in a harsher environment, and LED100 still has a longer lifespan.

[0045] In summary, by adopting the above-mentioned LED100 detection method, the connection strength between the silver glue 120 and the bracket 110 can be easily detected, thereby avoiding the use of inferior products or unqualified products in harsh environments, resulting in the need for frequent maintenance or replacement of LED100.

[0046] It should be noted that the first preset area is approximately 60% of the total area of ​​the bottom surface of the cup mouth groove 112 , and the second preset area is approximately 80% of the total area of ​​the bottom surface of the cup mouth groove 112 .

[0047] In some embodiments, in step S100, multiple LED100 to be tested are randomly selected from LED100 produced in the same batch; in the process of step S200, multiple LED100 are simultaneously placed in a reflow oven for heating, wherein after each heating of LED100 is completed, several LED100 are reserved and do not enter the next heating until the last heating of LED100 is completed; in step S400, the LED100 obtained for the last time is tested; for example, 25 LED100 are randomly selected, and 5 LED100 are reserved after each heating is completed until the LED100 is heated five times, wherein 5 LED100 are retained after each heating, and in step S400, the LED100 obtained for the fifth time is tested.

[0048] Furthermore, in the process of step S400, if the LED 100 is detected as an unqualified product or a substandard product, the staff can detect the LED 100 obtained by the adjacent heating, that is, the LED 100 obtained by the fourth heating, and determine the product status of the LED 100 obtained by the fourth heating. If it is still unqualified, the LED 100 obtained by the third heating can be detected again to determine the product status of the LED 100 obtained by the third heating. By repeatedly detecting the LED 100 obtained by m times of heating, it is determined whether the silver glue 120 of the LED 100 is directly separated from the bracket 110 due to excessive heating, and the breaking of the silver glue 120 is not obvious, resulting in inaccurate LED 100 detection results.

[0049] Furthermore, the LED100 detection method also includes the following steps: cutting the packaging part 140 of the LED100 obtained after the first n times of heating for a second time along the radial direction of the packaging part 140, so that the packaging part 140 is broken into a head part 141 and a tail part 142, and the head part 141 is separated from the bracket 110; wherein, if the epoxy resin inside the cup mouth groove 112 is separated from the head part 141, the packaging of the cup mouth groove 112 by the packaging part 140 is unqualified; if the epoxy resin inside the cup mouth groove 112 is not separated from the head part 141, the packaging of the cup mouth groove 112 by the packaging part 140 is qualified.

[0050] It should be noted that the LED100 obtained by heating once or several times before cutting is used to judge whether the connection strength between the packaging part 140 and the cup mouth groove 112 is qualified, for example, the LED100 obtained by heating twice before cutting; the LED100 obtained by heating several times after cutting is used to judge whether the connection strength between the silver glue 120 and the cup mouth groove 112 is qualified, for example, the LED100 obtained by heating twice after cutting.

[0051] In some embodiments, in step S200, at least one of the heating temperatures is between 250 degrees and 280 degrees. After the LED 100 is soldered to the circuit board, the circuit board and the LED 100 need to be heated in a reflow oven at a temperature of about 260 degrees, so that the flux evaporates, ensuring that the LED 100 and the circuit board can be more firmly fixed together. In the present application, the LED 100 is heated at a temperature between 250 degrees and 280 degrees, and it is determined whether the LED 100 meets the requirements after being subjected to the temperature in this range. In this way, it is ensured that after the LED 100 is put into use, the silver glue 120 and the bracket 110 still have a good connection strength.

[0052] A second aspect of the present invention discloses a cutting device 200, referring to Figures 3 to 5 The cutting device 200 includes a positioning mechanism 210 and a cutting mechanism 220. The positioning mechanism 210 is used to position the LED 100. The cutting mechanism 220 includes a first driving member 221 and a tool 222. The first driving member 221 is connected to the tool 222 and is used to drive the tool 222 to move along the radial direction of the packaging portion 140. In particular, along the vertical direction of the cup mouth surface 111, the distance between the tool 222 and the cup mouth surface 111 is between 0 mm and 2.5 mm.

[0053] Specifically, the positioning mechanism 210 positions the bottom of the LED 100, and makes the part of the LED 100 that needs to be cut be located outside the positioning mechanism 210. After the LED 100 is positioned, the first driving member 221 drives the cutter 222 to move along the radial direction of the packaging part 140, that is, to move along the cup surface 111 of the bracket 110, so as to cut the packaging part 140 of the LED 100. As can be seen from the above, the setting of the cutting device 200 facilitates the cutting of the packaging part 140 of the LED 100, and further facilitates the inspection of the LED 100.

[0054] It should be noted that along the vertical direction of the cup mouth surface 111, the distance between the tool 222 and the cup mouth surface 111 is between 0 mm and 2.5 mm. In this way, when the packaging part 140 breaks, the epoxy resin in the cup mouth groove 112 remains connected to the head 141 of the packaging part 140, thereby enabling the detection of LED100 to be implemented.

[0055] In some embodiments, the cutting device 200 further includes a vibration plate 230 (see Figure 6 ), the vibration plate 230 includes a main body 231 and a conveying track 232, the conveying track 232 is connected to the main body 231, and the main body 231 allows the LED 100 to be sequentially conveyed along the length direction of the conveying track 232. The positioning mechanism 210 includes a positioning fixture 211, a positioning member 212, and a second driving member 213. The positioning fixture 211 defines a positioning channel 2114, and one end of the positioning channel 2114 is connected to one end of the conveying track 232. The positioning member 212 is slidably connected to the positioning fixture 211, and the second driving member 213 is connected to the positioning member 212. The second driving member 213 is used to drive the positioning member 212 to slide to the positioning channel 2114, so that the LED 100 slides along the positioning channel 2114 to a preset position.

[0056] Specifically, the staff places multiple LEDs 100 to be inspected in the main body 231. Under the vibration of the main body 231, multiple LEDs 100 on the side to be inspected are transported along the length direction of the conveying track 232, and the LEDs 100 in the conveying track 232 slide into the positioning channel 2114 of the positioning fixture 211 through the discharge end of the conveying track 232, and abut against the positioning member 212. At this time, the LEDs 100 are just in the preset position, and the blade of the cutter 222 is just facing the LEDs 100 at the preset position. Thereafter, the first driving member 221 drives the cutter 222 to move toward the LEDs 100 at the preset position, thereby cutting the LEDs 100 so that the LEDs 100 can be inspected later. After the LED 100 is cut, the vibration plate 230 continues to transport the LED 100 to the positioning channel 2114. Under the action of the next LED 100, the LED 100 that has been cut continues to move along the positioning channel 2114 until it slides off the positioning fixture 211 through the end of the positioning channel 2114 away from the conveying track 232. As can be seen from the above, the cutting device 200 adopts the above structure, and the staff can conveniently complete the cutting of a large number of LEDs 100.

[0057] In some embodiments, the positioning fixture 211 includes a first fixture 2111, a second fixture 2112, and a third driving member 2113. The first fixture 2111 and the second fixture 2112 are both arranged vertically and parallel to each other. The first fixture 2111 and the second fixture 2112 are arranged at intervals, and the above-mentioned positioning channel 2114 is defined between the right side of the first fixture 2111 and the left side of the second fixture 2112. The third driving member 2113 is connected to the first fixture 2111 and is used to drive the first fixture 2111 away from or close to the second fixture 2112. Specifically, when the lamp is transported to the preset position along the positioning channel 2114, the third driving member 2113 drives the first fixture 2111 to move toward the second fixture 2112, so that the first fixture 2111 and the second fixture 2112 press the LED 100 at the preset position, and the subsequent tool 222 can better cut the LED 100.

[0058] Furthermore, the side of the first fixture 2111 close to the second fixture 2112 has an arc groove that matches the LED 100, and the side of the second fixture 2112 close to the first fixture 2111 has an arc groove that matches the LED 100. When the LED 100 moves to the preset position, the LED 100 is just located between the two arc grooves. The third driving member 2113 drives the first fixture 2111 to move close to the second fixture 2112, so that the outer peripheral surface of the LED 100 just fits the above two arc grooves, so that the positioning fixture 211 can clamp the preset position of the LED 100 more stably, and the subsequent tool 222 can better cut the LED 100.

[0059] Furthermore, the height of the top of the first fixture 2111 is lower than the height of the top of the second fixture 2112, and the cutter 222 is located above the first fixture 2111. Thus, space is reserved above the first fixture 2111 for the cutter 222 to work, so that the cutter 222 can cut the LED 100 along the cup surface 111 of the bracket 110. The second fixture 2112 is set high enough, so when the cutter 222 cuts the LED 100, the side of the second fixture 2112 can better support the LED 100, so that the cutter 222 can better cut the LED 100.

[0060] According to the third aspect of the present invention, an LED100 detection system is disclosed, including a detection module and the above-mentioned cutting device 200. The detection module includes a camera and a display module. The camera is used to take real-time pictures of the LED100 after cutting and upload them to the display module.

[0061] Specifically, after the LED 100 is cut, the camera takes a picture of the cut LED 100 and transmits the corresponding picture to the display. The staff can clearly observe the condition of the LED 100 through the display and determine whether the LED 100 is a qualified product.

[0062] Furthermore, the detection system also includes an identification module, which is used to detect the coverage of the silver glue 120 inside the LED 100 after cutting, and calculate the coverage area of ​​the silver glue 120. Through the setting of the identification module, the detection system can automatically determine whether the LED 100 is a qualified product, saving the labor of the staff.

[0063] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. An LED detection method, wherein the LED comprises a bracket, silver glue, a chip and a packaging part, wherein the bracket is provided with a cup-mouth groove, the silver glue is pasted on the bottom surface of the cup-mouth groove, the chip is pasted on the silver glue, and the packaging part is packaged inside the cup-mouth groove and outside the bracket, characterized in that: The steps include: S100 selects the LED to be tested; S200 repeatedly heats the LED to expand and contract the silver glue and the packaging part; S300 cutting the packaging part for the first time along the radial direction of the packaging part so that the packaging part is broken into a head part and a tail part, and the head part is separated from the bracket; wherein the epoxy resin located in the cup mouth groove is a part of the head part; S400 determines the silver paste coverage area of ​​the bottom surface of the cup groove; if the coverage area is less than a first preset area, the LED is an unqualified product; if the coverage area is between the first preset area and the second preset area, the LED is a substandard product; if the coverage area is greater than the second preset area, the LED is a qualified product; In the step S100, a plurality of the LEDs are prepared; in the step S200, a plurality of the LEDs are reserved after each heating so as not to enter the next heating; in the step S400, the LEDs obtained by the last heating are detected, and if the LEDs are qualified products, the detection is stopped; if the LEDs are unqualified products or inferior products, the LEDs obtained by the previous heating are continuously detected until qualified products are detected or the LEDs obtained by heating are completely detected; The heating temperature is between 250 and 280 degrees.

2. The LED detection method according to claim 1, characterized in that: The LED detection method includes the following steps: cutting the packaging part for a second time along the radial direction of the packaging part so that the packaging part is broken into a head and a tail; if the epoxy resin in the cup mouth groove is separated from the head synchronously, the packaging of the cup mouth groove by the packaging part is unqualified; if the epoxy resin in the cup mouth groove is not separated from the head synchronously, the packaging of the cup mouth groove by the packaging part is qualified; wherein, the LED cut for the second time is the LED obtained by the initial heating several times.

3. Cutting equipment, characterized in that, The cutting device is used to implement the LED detection method described in claim 1 or 2, wherein the LED comprises a bracket, silver glue, a chip and a packaging part, the bracket has a cup mouth surface with a cup mouth groove, the silver glue is pasted on the bottom surface of the cup mouth groove, the chip is pasted on the silver glue, and the packaging part is packaged inside the cup mouth groove and outside the bracket, and is characterized in that it comprises: Positioning mechanism, used for positioning the LED; A cutting mechanism, the cutting mechanism comprising a first driving member and a cutter, the first driving member being used to drive the cutter to cut the packaging portion along the radial direction of the LED; wherein along the vertical direction of the cup mouth surface, the distance between the cutter and the cup mouth surface is between 0 mm and 2.5 mm; The cutting device further comprises a vibration plate, wherein the vibration plate comprises a main body and a conveying track, wherein the conveying track is connected to the main body, and the main body is used to sequentially convey the LEDs along the length direction of the conveying track; The positioning mechanism includes a positioning fixture, a limiting member and a second driving member, wherein the positioning fixture has a positioning channel for positioning the LED, one end of the positioning channel is connected to one end of the conveying track, and the second driving member is connected to the limiting member, and the second driving member is used to drive the limiting member to move to the positioning channel, so that the LED slides along the positioning channel to a preset position; The positioning fixture comprises a first fixture, a second fixture and a third driving member, the positioning channel is defined between the first fixture and the second fixture, and the third driving member is connected to the first fixture and is used to drive the first fixture away from or close to the second fixture; The side of the first fixture close to the second fixture has an arc groove adapted to the LED, and the side of the second fixture close to the first fixture has an arc groove adapted to the LED. When the LED moves to a preset position, the LED is just located between the two arc grooves.

4. The cutting device according to claim 3, characterized in that: The height of the top of the first jig is lower than the height of the top of the second jig, and the tool is located above the first jig. 5.LED detection system, characterized in that, include: The cutting device according to any one of claims 3 or 4; The detection module includes a camera and a display module. The camera is used to take pictures of the cut LED in real time and upload them to the display module.

6. The detection system according to claim 5, characterized in that: The detection system also includes an identification module, which is used to detect the silver paste coverage inside the LED after cutting and calculate the coverage area of ​​the silver paste.

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