Laser processing parameter determination method, device, electronic equipment and storage medium

Abstract

The present invention provides a method, device, electronic device and storage medium for determining laser processing parameters, and relates to the field of laser processing technology, wherein the method for determining laser processing parameters comprises: obtaining a laser processing quality target; determining a candidate influencing parameter sequence according to the correlation between the laser processing quality target and the influencing parameter; performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchanging a candidate first parameter in the parameter upper limit sequence with a candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence; obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; and determining the laser processing parameters based on the response reference value and the response result value. The method can improve the accuracy of determining laser processing parameters.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a method, device, electronic equipment and storage medium for determining laser processing parameters. Background Art

[0002] With the development of laser processing technology, the requirements for laser processing quality are getting higher and higher. The relationship between laser processing quality and laser processing parameters is inseparable. The appropriate selection of laser processing parameters can improve the laser processing quality. Inappropriate selection of laser processing parameters will have a greater impact on the laser processing quality. However, there are many laser processing parameters, and the degree of influence is difficult to determine. How to accurately determine the laser processing parameters is becoming more and more important.

[0003] The method for determining laser processing parameters in the prior art has the problem of low accuracy. Summary of the invention

[0004] The present invention provides a method, device, electronic device and storage medium for determining laser processing parameters, so as to solve the defect of low accuracy in determining laser processing parameters in the prior art and achieve the purpose of improving the accuracy in determining laser processing parameters.

[0005] The present invention provides a method for determining laser processing parameters, comprising: obtaining a laser processing quality target; determining a candidate influencing parameter sequence according to the correlation between the laser processing quality target and the influencing parameter; performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchanging a candidate first parameter in the parameter upper limit sequence with a candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, wherein the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; and determining the laser processing parameters based on the response reference value and the response result value.

[0006] The present invention provides a method for determining laser processing parameters, wherein the response result value includes a first response result value and a second response result value, and obtaining the response result value based on the first experimental parameter sequence and the second experimental parameter sequence includes: performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain the first response result value corresponding to the first experimental parameter sequence; and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain the second response result value corresponding to the second experimental parameter sequence; performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence.

[0007] The present invention provides a method for determining laser processing parameters, wherein the parameter vector analysis of each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value comprises: performing a parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence; performing a parameter vector analysis twice on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value, respectively; performing a parameter vector analysis twice on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value, respectively; and obtaining a response reference value based on the first response reference value, the second response reference value, the third response reference value and the fourth response reference value.

[0008] The present invention provides a method for determining laser processing parameters, wherein the response reference value includes a first sub-value and a second sub-value, and obtaining the response reference value based on the first response reference value, the second response reference value, the third response reference value and the fourth response reference value includes: adjusting the first response reference value and the second response reference value according to the constraint condition of the response reference value to obtain the first sub-value; and adjusting the third response reference value and the fourth response reference value to obtain the second sub-value.

[0009] The present invention provides a method for determining laser processing parameters. The method for determining the laser processing parameters based on the response reference value and the response result value includes: if the error between a candidate response result value in the first response result value sequence and the second sub-value is less than or equal to an error threshold, then determining the influencing parameter corresponding to the candidate response result value as the laser processing parameter.

[0010] The present invention provides a method for determining laser processing parameters. The method for determining the laser processing parameters based on the response reference value and the response result value includes: if the error between the candidate response result value in the first response result value sequence and the first sub-value is greater than the error threshold, then determining the laser processing parameters based on the second response result value sequence.

[0011] According to a method for determining laser processing parameters provided by the present invention, determining the laser processing parameters based on the second response result value sequence includes: if the error between a candidate response result value in the second response result value sequence and the first sub-value is less than or equal to the error threshold, then determining the influencing parameter corresponding to the candidate response result value as the laser processing parameter.

[0012] The present invention also provides a laser processing parameter determination device, comprising: a laser processing quality target acquisition module, used to acquire the laser processing quality target; a candidate influencing parameter sequence determination module, used to determine the candidate influencing parameter sequence according to the association relationship between the laser processing quality target and the influencing parameter; a response reference value acquisition module, used to perform parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; an experimental parameter sequence acquisition module, used to exchange the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; a response result value acquisition module, used to obtain a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; a laser processing parameter determination module, used to determine the laser processing parameters based on the response reference value and the response result value.

[0013] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of any of the above-mentioned methods for determining laser processing parameters are implemented.

[0014] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of any of the above-mentioned methods for determining laser processing parameters are implemented.

[0015] The laser processing parameter determination method, device, electronic device and storage medium provided by the present invention obtain the laser processing quality target; determine the candidate influencing parameter sequence according to the correlation between the laser processing quality target and the influencing parameter; perform parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchange the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; obtain a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; determine the laser processing parameter based on the response reference value and the response result value. By adjusting the upper and lower limits of the influencing parameter to obtain the experimental parameter sequence, the response result value can be obtained based on the experimental parameter sequence, and the laser processing parameter is determined based on the response result value and the response reference value obtained from the original parameter sequence, thereby improving the accuracy of the laser processing parameter determination. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is one of the scene application diagrams of the method for determining laser processing parameters provided by the present invention;

[0018] Figure 2 It is one of the flow charts of the method for determining laser processing parameters provided by the present invention;

[0019] Figure 3 This is the second flow chart of the method for determining laser processing parameters provided by the present invention;

[0020] Figure 4 This is the third flow chart of the method for determining laser processing parameters provided by the present invention;

[0021] Figure 5 is the parameter correspondence of the method for determining laser processing parameters provided by the present invention;

[0022] Figure 6 This is the fourth flow chart of the method for determining laser processing parameters provided by the present invention;

[0023] Figure 7 It is a structural schematic diagram of the laser processing parameter determination device provided by the present invention;

[0024] Figure 8 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The laser processing parameter determination method provided in this application can be applied to Figure 1 In the application environment shown, it is specifically applied to a laser processing parameter determination system. The laser processing parameter determination system includes a laser processing device 102 and a server 104, wherein the laser processing device 102 communicates with the server 104 through a network. The server 104 performs a laser processing parameter determination method, specifically, the laser processing device 102 sends a laser processing quality target to the server 104, and accordingly, the server 104 obtains the laser processing quality target; according to the association relationship between the laser processing quality target and the influencing parameter, a candidate influencing parameter sequence is determined; parameter vector analysis is performed on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; the candidate first parameter in the parameter upper limit sequence is exchanged with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the ranking of the above-mentioned candidate first parameter in the parameter upper limit sequence is the same as the ranking of the above-mentioned candidate second parameter in the second experimental parameter sequence; based on the above-mentioned first experimental parameter sequence and the above-mentioned second experimental parameter sequence, a response result value is obtained; based on the response reference value and the response result value, the laser processing parameter is determined. The laser processing equipment 102 may be, but is not limited to, various laser marking machines, laser welding machines, laser cutting machines or dicing machines, and the server 104 may be implemented as an independent server or a server cluster consisting of multiple servers.

[0027] Combine the following Figure 2-Figure 4 The laser processing parameter determination method of the present invention is described.

[0028] In one embodiment, Figure 2 As shown, a method for determining laser processing parameters is provided, and the method is applied to Figure 1 The server in the example is used to illustrate the following steps:

[0029] Step 202, obtaining the laser processing quality target.

[0030] The laser processing quality target refers to the quality-related target in the laser processing process, such as the ablation rate, roughness or depth of laser processing.

[0031] Specifically, the server may receive a trigger operation of the laser processing quality target at the local end, and in response to the operation, obtain the laser processing quality target; or the server may receive the laser processing quality target sent by the laser processing equipment.

[0032] In one embodiment, the laser processing equipment receives a setting operation of a certain laser processing quality target, and in response to the operation, sends the laser processing quality target to the server, and the server obtains the laser processing quality target accordingly.

[0033] Step 204: Determine a candidate influencing parameter sequence according to the association between the laser processing quality target and the influencing parameters.

[0034] The influencing parameters refer to the parameters that can affect the quality target of laser processing. The selection of the parameters will affect whether the quality target of laser processing can meet the quality requirements or the degree to which the quality requirements can be met.

[0035] Specifically, after acquiring the laser processing quality target, the server selects an influencing parameter sequence that may affect the laser processing quality target from among multiple types or multiple influencing parameters according to the association between the laser processing quality target and the influencing parameters.

[0036] In one embodiment, the candidate influencing parameter sequence can be determined based on the material, laser beam, medium, focusing lens or nozzle, etc. For example, from the laser beam, a parameter sequence consisting of pulse width, pulse wavelength and repetition frequency is selected as the candidate influencing parameter sequence.

[0037] Step 206, performing parameter vector analysis on each candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence.

[0038] Specifically, after determining the candidate influence parameter sequence, the server performs parameter vector analysis on each candidate influence parameter in the sequence, vectorizes each candidate influence parameter, and performs relevant calculations on each vectorized candidate influence parameter to obtain a response reference value.

[0039] In one embodiment, the candidate impact parameter sequence is expressed as:

[0040] V=(A,B,C,D,E,…) (1)

[0041] Set the upper and lower interval values ​​of each parameter in the above candidate influencing parameter sequence to obtain the parameter upper limit sequence V H and parameter lower limit sequence V L , where the parameter upper limit sequence V H It is expressed as:

[0042] V H =(A H ,B H ,C H ,D H ,E H ,…) (2)

[0043] Parameter lower limit sequence V L It is expressed as:

[0044] V L =(A L ,B L ,C L ,D L ,E L ,…) (3)

[0045] According to the constraint conditions of the response reference value, parameter vector analysis is performed on the parameter upper limit sequence and the parameter lower limit sequence in the above candidate influencing parameter sequence to obtain the response reference value.

[0046] In one embodiment, the constraint condition of the response reference value can be expressed as the total effect estimate obtained when all the vector parameters change at the same time and the dispersion between the response reference values ​​during repeated experiments. The total effect estimate obtained when all the vector parameters change at the same time is expressed as D s The dispersion between the response reference values ​​during repeated experiments is expressed as d s , the constraint condition of the response reference value is expressed as D s / d s , this constraint needs to satisfy D s / d s ≥5 / 1, where all vector parameters change simultaneously and the total effect estimate D s It is expressed as:

[0047]

[0048] The dispersion d between the response reference values ​​during repeated experiments s It is expressed as:

[0049]

[0050] Among them, R H1 and R H2 Respectively represent the response results obtained when the candidate influencing parameters of the first and second pre-experiments are both taken as the upper limit of the interval; RL1 and R L2 They respectively indicate the response results obtained when the candidate influencing parameters of the first and second pre-experiments are both at the lower limit of the interval.

[0051] Through the above constraints D s / d s ≥5 / 1, select the value within the constraint conditions and get the response reference value:

[0052]

[0053]

[0054] Step 208, swap the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, wherein the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence.

[0055] Specifically, the server converts a certain upper limit parameter in the parameter upper limit sequence into a parameter in the same sorting position in the parameter lower limit sequence to form a first experimental parameter sequence and a second experimental parameter sequence. H =(A H ,B H ,C H ,D H ,E H ,…), and the parameter lower limit sequence V L =(A L ,B L ,C L ,D L ,E L ,…), assuming that the parameter to be determined is A, then A H and A L The positions are exchanged to obtain the first experimental parameter sequence W1=(A L ,B H ,C H ,D H ,E H ,…), the second experimental parameter sequence is W2=(A H ,B L ,C L ,D L ,E L ,…).

[0056] Step 210: obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence.

[0057] Specifically, after obtaining the first experimental parameter sequence and the second experimental parameter sequence, the server obtains the intermediate response result value x through the first experimental parameter sequence W1. i , and, the intermediate response result value y is obtained through the second experimental parameter sequence W2 i , traverse each parameter in the above sequence and get the response result value:

[0058] x=(x1,x2,x3,x4,x5,…) (8)

[0059] y=(y1,y2,y3,y4,y5,…) (9)

[0060] Step 212, determining laser processing parameters based on the response reference value and the response result value.

[0061] Specifically, after obtaining the above-mentioned response reference value and response result value, the server determines the laser processing parameters by comparing the response reference value and the response result value.

[0062] In one embodiment, the parameter with the highest degree of influence is represented as Red X, and the parameter with the second highest degree of influence is represented as Pink X. i or i and the response reference value R H or R L The laser processing parameters are determined by comparison.

[0063] In the above-mentioned method for determining laser processing parameters, the laser processing quality target is obtained; according to the correlation between the laser processing quality target and the influencing parameters, a candidate influencing parameter sequence is determined; parameter vector analysis is performed on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; the candidate first parameter in the parameter upper limit sequence is exchanged with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; based on the first experimental parameter sequence and the second experimental parameter sequence, a response result value is obtained; based on the response reference value and the response result value, the laser processing parameters are determined. By adjusting the upper and lower limits of the influencing parameters, an experimental parameter sequence is obtained, so that a response result value can be obtained based on the experimental parameter sequence, and the laser processing parameters are determined based on the response result value and the response reference value obtained from the original parameter sequence, thereby improving the accuracy of laser processing parameter determination.

[0064] In one embodiment, Figure 3As shown, the response result value includes a first response result value and a second response result value. Based on the first experimental parameter sequence and the second experimental parameter sequence, the response result value obtained includes:

[0065] Step 302, performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value corresponding to the first experimental parameter sequence; and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value corresponding to the second experimental parameter sequence.

[0066] Specifically, assuming that the first experimental parameter sequence is W1=(A L ,B H ,C H ,D H ,E H ,…), then the parameter vector analysis is performed on the sequence, and the first response result value is x1; the second experimental parameter sequence is W2=(A H ,B L ,C L ,D L ,E L ,…), perform parameter vector analysis on the sequence and obtain the second response result value y1.

[0067] Step 304, performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence.

[0068] Specifically, when the server takes the first parameter A as the candidate experimental parameter, it obtains the corresponding response result value, and then takes B in the first experimental parameter sequence and B in the second experimental parameter sequence as candidate experimental parameters, and performs parameter vector analysis, that is, W3=(A H ,B L ,C H ,D H ,E H ,…) parameter vector analysis yields x2 and W4=(A L ,B H ,C L ,D L ,E L ,…) perform parameter vector analysis to obtain y2, and so on. After many experiments and traversing the entire parameter, we obtain the first response result value sequence x=(x1,x2,x3,x4,x5,…) and the second response result value sequence y=(y1,y2,y3,y4,y5,…).

[0069] In this embodiment, by performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence, a first response result value corresponding to the first experimental parameter sequence is obtained; and, by performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence, a second response result value corresponding to the second experimental parameter sequence is obtained. By performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and by performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence, the purpose of accurately obtaining a response result value sequence can be achieved.

[0070] In one embodiment, Figure 4 As shown, parameter vector analysis is performed on each candidate influencing parameter sequence, and the response reference values ​​obtained include:

[0071] Step 402: Perform parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence.

[0072] Specifically, after determining the influencing parameters, the server uses the preset value range to determine the upper and lower limits of each candidate influencing parameter, and performs parameter vector analysis on each determined candidate influencing parameter, thereby obtaining the parameter upper limit sequence and parameter lower limit sequence corresponding to the candidate influencing parameter sequence. For example, assuming that the candidate influencing parameter sequence is represented as V = (A, B, C, D, E, ...), the parameter upper limit sequence is represented as V H =(A H ,B H ,C H ,D H ,E H ,…), the parameter lower limit sequence is represented by V L =(A L ,B L ,C L ,D L ,E L ,…).

[0073] Step 404 , performing two parameter vector analyses on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value respectively.

[0074] Specifically, after obtaining the parameter upper limit sequence, the server performs two parameter vector analyses on each parameter in the parameter upper limit sequence in the same experimental scenario to obtain two response reference values. For example, assuming that the parameter upper limit sequence is represented by V H =(A H ,B H ,C H ,D H,E H ,…), then after two parameter vector analyses, two response reference values ​​are obtained, expressed as R H1 and R H2 It can be understood that the above experimental scenario is a pre-experiment before the main experiment.

[0075] Step 406: perform two parameter vector analyses on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value respectively.

[0076] Specifically, after obtaining the parameter lower limit sequence, the server performs two parameter vector analyses on each parameter in the parameter upper limit sequence in the same experimental scenario to obtain two response reference values. For example, assuming that the parameter lower limit sequence is represented by V L =(A L ,B L ,C L ,D L ,E L ,…), then after two parameter vector analyses, two response reference values ​​are obtained, expressed as R L1 and R L2 It can be understood that the above experimental scenario is also a pre-experiment before the main experiment.

[0077] Step 408: Obtain a response reference value based on the first response reference value, the second response reference value, the third response reference value, and the fourth response reference value.

[0078] Specifically, after the server obtains the first response reference value, the second response reference value, the third response reference value and the fourth response reference value, the response reference value is obtained by the average of the first response reference value and the second response reference value and the average of the third response reference value and the fourth response reference value. The response reference value is expressed as the above formulas (6) and (7).

[0079] In this embodiment, parameter vector analysis is performed on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence, and parameter vector analysis is performed twice on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value, respectively. Parameter vector analysis is performed twice on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value, respectively. Based on the first response reference value, the second response reference value, the third response reference value and the fourth response reference value, a response reference value is obtained, which can achieve the purpose of accurately obtaining the response reference value.

[0080] In one embodiment, the response reference value includes a first sub-value and a second sub-value. Based on the first response reference value, the second response reference value, the third response reference value and the fourth response reference value, obtaining the response reference value includes: adjusting the first response reference value and the second response reference value according to the constraint condition of the response reference value to obtain the first sub-value; and adjusting the third response reference value and the fourth response reference value to obtain the second sub-value.

[0081] Specifically, the constraint condition of the response reference value can be expressed as the total effect estimate obtained when all the above vector parameters change simultaneously and the discreteness between the response reference values ​​in the repeated experiment. The calculation of the first sub-value is as shown in the above formula (6), and the calculation of the second sub-value is as shown in the above formula (7).

[0082] In this embodiment, the first response reference value and the second response reference value are adjusted through the constraint conditions of the response reference value to obtain the first sub-value; and the third response reference value and the fourth response reference value are adjusted to obtain the second sub-value, which can achieve the purpose of accurately determining the first sub-value and the second sub-value.

[0083] In one embodiment, determining the laser processing parameters based on the response reference value and the response result value includes: if the error between the candidate response result value in the first response result value sequence and the second sub-value is less than or equal to the error threshold, determining the influencing parameter corresponding to the candidate response result value as the laser processing parameter.

[0084] The error threshold refers to the critical value of the error. A value less than or equal to the critical value indicates that the error is within the error range, and a value greater than the critical value indicates that the error is outside the error range.

[0085] Specifically, the candidate response result value x in the first response result value sequence i The error calculation is performed with the second sub-value. When the calculation result is less than or equal to the error threshold, the influencing parameter corresponding to the candidate response result value is determined as the laser processing parameter. Assume that the candidate response result value is represented by x i , the second subvalue is represented by R L , then the error calculation formula is expressed as:

[0086]

[0087] Specifically, when the error W is less than or equal to 10%, it is considered that i The corresponding parameters are laser processing parameters, for example, the candidate response result value x3 and the second sub-value R L If the error is less than or equal to 10%, the influencing parameter C is determined as the laser processing parameter.

[0088] In this embodiment, if the error between the candidate response result value in the first response result value sequence and the second sub-value is less than or equal to the error threshold, the influencing parameter corresponding to the candidate response result value is determined as the laser processing parameter, thereby achieving the purpose of accurately determining the laser processing parameter.

[0089] In one embodiment, the candidate response result value x in the first response result value sequence i With the first subvalue R H If the error is less than or equal to the error threshold, then the candidate response result value x i The corresponding influencing parameter is not the main influencing parameter Red X that needs to be determined, and is not the secondary influencing parameter Pink X.

[0090] In one embodiment, determining the laser processing parameters based on the response reference value and the response result value includes: if the error between the candidate response result value in the first response result value sequence and the first sub-value is greater than the error threshold, determining the laser processing parameters based on the second response result value sequence.

[0091] Specifically, when the server determines the candidate response result value x i With the first subvalue R H When the error is greater than the error threshold, the laser processing parameters are determined based on the second response result value sequence y=(y1, y2, y3, y4, y5, ...).

[0092] In this embodiment, if the error between the candidate response result value in the first response result value sequence and the first sub-value is greater than the error threshold, the laser processing parameters are determined based on the second response result value sequence, thereby achieving the purpose of accurately determining the laser processing parameters based on the second response result value sequence.

[0093] In one embodiment, determining the laser processing parameters based on the second response result value sequence includes: if the error between the candidate response result value in the second response result value sequence and the first sub-value is less than or equal to the error threshold, determining the influencing parameter corresponding to the candidate response result value as the laser processing parameter.

[0094] Specifically, when the candidate response result value y in the second response result value sequence y=(y1, y2, y3, y4, y5, ...) i With the first subvalue R H If the error is less than or equal to the error threshold, the candidate response result value y i The corresponding influencing parameters are determined as laser processing parameters. For example, y4 and the first sub-value R H If the error is less than or equal to the error threshold of 10%, the influencing parameter D in the candidate influencing parameter sequence is determined as the laser processing parameter.

[0095] In this embodiment, if the error between a candidate response result value in the second response result value sequence and the first sub-value is less than or equal to an error threshold, the influencing parameter corresponding to the candidate response result value is determined as the laser processing parameter, thereby achieving the purpose of accurately determining the laser processing parameter using the second response result value sequence y = (y1, y2, y3, y4, y5, ...).

[0096] In one embodiment, the second response result value sequence y=candidate response result value y in (y1, y2, y3, y4, y5, ...) i With the second subvalue R L If the error is less than or equal to the error threshold, the candidate response result value y is determined i The corresponding influencing parameters are laser processing parameters with weaker influence.

[0097] In one embodiment, in one embodiment, the candidate response result value y in the second response result value sequence y=(y1, y2, y3, y4, y5, ...) i With the second subvalue R L If the error is greater than the error threshold, the candidate response result value y is determined i The corresponding influencing parameters are laser processing parameters with a weaker influence, and the number of the laser processing parameters with a weaker influence is at least one.

[0098] In one embodiment, the quality target of laser processing is determined as the material ablation rate (in units of mm^3 / s) during picosecond laser ablation of cemented carbide. By determining the test parameters related to the material ablation rate, in the following example, Figure 5 As shown, the parameters can be controlled and adjusted, such as laser power or pulse frequency, which are called control parameters; some are uncontrollable or inherent properties, such as material properties, ambient temperature or humidity, which are called inherent parameters; some are controllable, but once the processing equipment is determined, the parameters are also determined, such as nozzle diameter or focusing lens, which are called constant parameters. Candidate test parameters are selected from the above control parameters, constant parameters and inherent parameters: laser power (parameter A, unit: W), pulse mode (parameter B, unit: none), ratio of pulse overlap rate to spot overlap rate (parameter C, unit: %), scanning strategy: (parameter D, unit: none). The above parameters are used for preliminary experiments and main experiments. The reference value of the response result is obtained, and the relationship between each parameter and other parameters is checked in detail. The controllable parameters and the set value range are shown in Table 1 below:

[0099] Table 1 Controllable parameters and setting ranges

[0100]

[0101] Specifically, the results of the preliminary experiment are shown in Table 2 below:

[0102] Table 2 Preliminary experimental results

[0103]

[0104]

[0105] Specifically, using the above-mentioned laser processing parameter determination method, D s =0.0148mm^3 / s, d s =0.0004mm^3 / s, the ratio of the two satisfies the constraint condition D s / d s ≥5 / 1, the confidence level of the main and secondary factors that can be obtained through the main experiment is 95%, ensuring that at least one important parameter exists in the system.

[0106] Specifically, the main experimental results are obtained as follows: Figure 6 The main experimental results are shown in Table 3 below:

[0107] Table 3 Main experimental results

[0108]

[0109] It can be seen that the above-mentioned laser processing parameter determination method can identify the highest influencing parameters and other influencing parameters. Analysis shows that the first group of influencing parameters corresponding to laser power and the third group of influencing parameters corresponding to pulse repetition rate and spot overlap are the main influencing factors for picosecond laser processing of cemented carbide materials. The second group of influencing parameters corresponding to pulse mode have the second greatest influence, and the fourth group of scanning strategies have relatively less influence.

[0110] The laser processing parameter determination device provided by the present invention is described below. The laser processing parameter determination device described below and the laser processing parameter determination method described above can be referred to each other.

[0111] In one embodiment, Figure 7As shown, a laser processing parameter determination device 700 is provided, comprising: a laser processing quality target acquisition module 702, a candidate influencing parameter sequence determination module 704, a response reference value acquisition module 706, an experimental parameter sequence acquisition module 708, a response result value acquisition module 710 and a laser processing parameter determination module 712, wherein: the laser processing quality target acquisition module 702 is used to acquire the laser processing quality target; the candidate influencing parameter sequence determination module 704 is used to determine the candidate influencing parameter sequence according to the association relationship between the laser processing quality target and the influencing parameter; the response reference value acquisition module 706 is used to parameterize each candidate influencing parameter in the candidate influencing parameter sequence. Vector analysis to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; an experimental parameter sequence obtaining module 708 is used to exchange the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; a response result value obtaining module 710 is used to obtain a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; a laser processing parameter determination module 712 is used to determine the laser processing parameters based on the response reference value and the response result value.

[0112] In one embodiment, the response result value obtaining module 710 is used to perform parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value corresponding to the first experimental parameter sequence; and, perform parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value corresponding to the second experimental parameter sequence; perform vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and, perform vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence.

[0113] In one embodiment, the response reference value obtaining module 706 is used to perform parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence; perform parameter vector analysis twice on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value, respectively; perform parameter vector analysis twice on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value, respectively; obtain a response reference value based on the first response reference value, the second response reference value, the third response reference value and the fourth response reference value.

[0114] In one embodiment, the response reference value obtaining module 706 is used to adjust the first response reference value and the second response reference value according to the constraint conditions of the response reference value to obtain the first sub-value; and adjust the third response reference value and the fourth response reference value to obtain the second sub-value.

[0115] In one embodiment, the laser processing parameter determination module 712 is used to determine the influencing parameter corresponding to the candidate response result value as the laser processing parameter if the error between the candidate response result value in the first response result value sequence and the second sub-value is less than or equal to the error threshold.

[0116] In one embodiment, the laser processing parameter determination module is used to determine the laser processing parameter based on the second response result value sequence if the error between the candidate response result value in the first response result value sequence and the first sub-value is greater than the error threshold.

[0117] In one embodiment, the laser processing parameter determination module 712 is used to determine the influencing parameter corresponding to the candidate response result value as the laser processing parameter if the error between the candidate response result value in the second response result value sequence and the first sub-value is less than or equal to the error threshold. Figure 8 An example of a physical structure diagram of an electronic device is shown in FIG. Figure 8 As shown, the electronic device may include: a processor 810, a communication interface 820, a memory 830 and a communication bus 840, wherein the processor 810, the communication interface 820 and the memory 830 communicate with each other through the communication bus 840. The processor 810 may call the logic instructions in the memory 830 to execute the laser processing parameter determination method, which includes: obtaining the laser processing quality target; determining the candidate influencing parameter sequence according to the association relationship between the laser processing quality target and the influencing parameter; performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchanging the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, wherein the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; determining the laser processing parameter based on the response reference value and the response result value.

[0118] In addition, the logic instructions in the above-mentioned memory 830 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0119] On the other hand, the present invention also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium, and the computer program includes program instructions. When the program instructions are executed by a computer, the computer can execute the laser processing parameter determination method provided by the above-mentioned methods, and the method includes: obtaining a laser processing quality target; determining a candidate influencing parameter sequence based on the correlation between the laser processing quality target and the influencing parameter; performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchanging the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, and the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; and determining the laser processing parameters based on the response reference value and the response result value.

[0120] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to execute the above-mentioned laser processing parameter determination methods, the methods comprising: obtaining a laser processing quality target; determining a candidate influencing parameter sequence based on the correlation between the laser processing quality target and the influencing parameter; performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; exchanging the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, the order of the candidate first parameter in the parameter upper limit sequence being the same as the order of the candidate second parameter in the second experimental parameter sequence; obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; and determining the laser processing parameters based on the response reference value and the response result value.

[0121] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0122] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for determining laser processing parameters, characterized in that: include: Obtain laser processing quality targets; Determining a candidate influencing parameter sequence according to the correlation between the laser processing quality target and the influencing parameter; Influencing parameters refer to parameters that can affect the quality target of laser processing; Performing parameter vector analysis on each candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; Exchanging the candidate first parameter in the parameter upper limit sequence with the candidate second parameter in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, wherein the order of the candidate first parameter in the parameter upper limit sequence is the same as the order of the candidate second parameter in the second experimental parameter sequence; Based on the first experimental parameter sequence and the second experimental parameter sequence, obtaining a response result value; Determining the laser processing parameters based on the response reference value and the response result value; The response result value includes a first response result value and a second response result value, and obtaining the response result value based on the first experimental parameter sequence and the second experimental parameter sequence includes: Performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain the first response result value corresponding to the first experimental parameter sequence; and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain the second response result value corresponding to the second experimental parameter sequence; Performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence; The performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value comprises: Performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence; Performing two parameter vector analyses on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value respectively; Performing parameter vector analysis twice on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value respectively; A response reference value is obtained based on the first response reference value, the second response reference value, the third response reference value, and the fourth response reference value.

2. The method for determining laser processing parameters according to claim 1, characterized in that: The response reference value includes a first sub-value and a second sub-value, and obtaining the response reference value based on the first response reference value, the second response reference value, the third response reference value, and the fourth response reference value includes: According to the constraint condition of the response reference value, the first response reference value and the second response reference value are adjusted to obtain the first sub-value; and the third response reference value and the fourth response reference value are adjusted to obtain the second sub-value.

3. The method for determining laser processing parameters according to claim 2, characterized in that: The determining the laser processing parameter based on the response reference value and the response result value comprises: If the error between a candidate response result value in the first response result value sequence and the second sub-value is less than or equal to an error threshold, the influencing parameter corresponding to the candidate response result value is determined as the laser processing parameter.

4. The method for determining laser processing parameters according to claim 3, characterized in that: The determining the laser processing parameter based on the response reference value and the response result value comprises: If the error between the candidate response result value in the first response result value sequence and the first sub-value is greater than the error threshold, the laser processing parameter is determined based on the second response result value sequence.

5. The method for determining laser processing parameters according to claim 4, characterized in that: Determining the laser processing parameters based on the second response result value sequence includes: If the error between a candidate response result value in the second response result value sequence and the first sub-value is less than or equal to the error threshold, the influencing parameter corresponding to the candidate response result value is determined as the laser processing parameter.

6. A laser processing parameter determination device, characterized in that: include: A laser processing quality target acquisition module is used to acquire the laser processing quality target; A candidate influencing parameter sequence determination module is used to determine a candidate influencing parameter sequence according to the association between the laser processing quality target and the influencing parameter; the influencing parameter refers to a parameter that can affect the laser processing quality target; A response reference value obtaining module is used to perform parameter vector analysis on each candidate influencing parameter sequence to obtain a response reference value; the candidate influencing parameter sequence includes a parameter upper limit sequence and a parameter lower limit sequence; an experimental parameter sequence obtaining module, used for exchanging the candidate first parameters in the parameter upper limit sequence with the candidate second parameters in the parameter lower limit sequence to obtain a first experimental parameter sequence and a second experimental parameter sequence, wherein the order of the candidate first parameters in the parameter upper limit sequence is the same as the order of the candidate second parameters in the second experimental parameter sequence; A response result value obtaining module, used for obtaining a response result value based on the first experimental parameter sequence and the second experimental parameter sequence; A laser processing parameter determination module, used to determine the laser processing parameter based on the response reference value and the response result value; The response result value includes a first response result value and a second response result value, and obtaining the response result value based on the first experimental parameter sequence and the second experimental parameter sequence includes: Performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain the first response result value corresponding to the first experimental parameter sequence; and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain the second response result value corresponding to the second experimental parameter sequence; Performing parameter vector analysis on each candidate first experimental parameter in the first experimental parameter sequence to obtain a first response result value sequence, and performing parameter vector analysis on each candidate second experimental parameter in the second experimental parameter sequence to obtain a second response result value sequence; The performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a response reference value comprises: Performing parameter vector analysis on each candidate influencing parameter in the candidate influencing parameter sequence to obtain a parameter upper limit sequence and a parameter lower limit sequence corresponding to the candidate influencing parameter sequence; Performing two parameter vector analyses on each parameter in the parameter upper limit sequence to obtain a first response reference value and a second response reference value respectively; Performing parameter vector analysis twice on each parameter in the parameter lower limit sequence to obtain a third response reference value and a fourth response reference value respectively; A response reference value is obtained based on the first response reference value, the second response reference value, the third response reference value, and the fourth response reference value.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the steps of the method for determining laser processing parameters according to any one of claims 1 to 5 are implemented.

8. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for determining laser processing parameters according to any one of claims 1 to 5 are implemented.

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