Display device substrate, display device, electronic device, and manufacturing method thereof

Abstract

A display device substrate, a display device, an electronic device and a manufacturing method thereof, wherein a first substrate (2) comprises: a first base material (10) having an insulating layer (12); and a partition wall (5) arranged on the insulating layer (12), wherein the insulating layer (12) and the partition wall (5) are formed of a resin material, and the hardness of the partition wall (5) is higher than that of the insulating layer (12). A protective film (13) for protecting the insulating layer (12) is arranged on the surface of the insulating layer (12). A portion of the protective film (13) is located between the partition wall (5) and the insulating layer (12).

Description

[0001] The present application is a divisional application of an application filed on September 14, 2016, with application number 201610825873.5 and invention name “Substrate for display device, display device, electronic device and manufacturing method thereof”. Technical Field

[0002] The present invention relates to a substrate for a display device, a display device, an electronic device, and a method for manufacturing the substrate for a display device. Background Art

[0003] Electrophoretic display devices that move charged particles in a dispersion medium are widely used. The screen of the electrophoretic display device flickers less, so it is used in display devices for reading electronic books, etc. The electrophoretic display device is disclosed in Patent Document 1. According to the description, the electrophoretic display device has a pair of substrates provided with electrodes. Then, a dispersion medium containing colored charged particles is provided between the electrodes. Partition walls are provided in a grid shape between the substrates, and the partition walls are used to separate the space. In addition, the partition walls are used to maintain the distance between the substrates.

[0004] Colored charged particles are charged in the space. Then, a voltage is applied to a pair of electrodes provided on opposing substrates to induce the colored charged particles to one electrode. Next, the position of the colored charged particles is changed by changing the voltage of the electrode.

[0005] A pixel electrode is provided on one side of the substrate, and the pixel electrode becomes a pixel. Then, by controlling the position of the colored charged particles in units of pixels, a predetermined pattern can be displayed.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2007-240679 Summary of the invention

[0009] (Problems to be solved by the invention)

[0010] In patent document 1, an insulating film covered with an inorganic material is provided on the surface of a substrate. Then, a partition wall is provided on the insulating film. The material of the partition wall is a cardo polymer, which is a type of resin material. After a dispersion medium is provided in the space within the partition wall, a pair of substrates are integrated. When the pair of substrates are integrated, a load is applied between the substrates. At this time, since the partition wall and the insulating film are made of materials of different properties, they cannot be firmly bonded. Therefore, when a load is applied to the partition wall, there is a possibility that the partition wall and the insulating film are peeled off or shifted. At this time, the partition wall collapses or is squeezed, and therefore a substrate for a display device that can suppress the partition wall from collapsing or being squeezed even when a load is applied between the substrates is desired.

[0011] (Methods for solving problems)

[0012] The present invention has been made to solve at least the above-mentioned problems, and can be implemented as the following aspects or application examples.

[0013] [Application example 1]

[0014] This application example relates to a substrate for a display device, characterized in that the substrate for the display device comprises: a substrate having an insulating layer; and a partition wall arranged on the insulating layer, the insulating layer and the partition wall are formed of a resin material, and the hardness of the partition wall is higher than that of the insulating layer.

[0015] According to this application example, a display device substrate includes a substrate, and an insulating layer is provided on the substrate. Then, a partition wall is provided on the insulating layer. The insulating layer and the partition wall are formed of a resin material. Therefore, compared with a case where one of the insulating layer and the partition wall is an inorganic material, the insulating layer and the partition wall can be fixed with high strength. Moreover, the partition wall has a higher hardness than the insulating layer, and thus has strength. As a result, even when a load is applied to the partition wall, it is possible to suppress the partition wall from falling or being squeezed.

[0016] [Application Example 2]

[0017] In the display device substrate of the above application example, it is preferable that a protective film for protecting the insulating layer is provided on a surface of the insulating layer.

[0018] According to this application example, a protective film for protecting the insulating layer is provided on the surface of the insulating layer. Therefore, since the insulating layer does not contact the chemical liquid constituting the display device, it is possible to prevent the chemical liquid and the insulating layer from being damaged.

[0019] [Application example 3]

[0020] In the display device substrate of the above application example, preferably, the protective film has an opening, and the partition wall is provided to close the opening.

[0021] According to this application example, by providing the partition wall to block the opening of the protective film, the protective film can be used to suppress the contact between the chemical liquid constituting the display device and the insulating layer, and the resin partition wall and the resin insulating layer can be brought into contact and fixed.

[0022] [Application example 4]

[0023] In the display device substrate of the above application example, preferably, the substrate includes one pixel electrode corresponding to one pixel, and the partition wall is provided to surround the pixel electrode.

[0024] According to this application example, a pixel electrode is provided on a substrate for each pixel. Then, a partition wall is provided to surround the pixel electrode. In this case, the area surrounded by the partition wall becomes smaller than when the partition wall surrounds a plurality of pixel electrodes. Therefore, since the area inside the partition wall is smaller, the strength of the partition wall can be increased. As a result, even if a load is applied to the partition wall, the partition wall can be prevented from falling or being crushed.

[0025] [Application example 5]

[0026] In the display device substrate of the above application example, it is preferable that a circuit portion electrically connected to the pixel electrode is provided between the substrate and the insulating layer.

[0027] According to this application example, the circuit portion electrically connected to the pixel electrode is provided between the substrate and the insulating layer. Therefore, it is possible to suppress the circuit portion from being corroded by a chemical solution or the like constituting the display device.

[0028] [Application Example 6]

[0029] In the display device substrate of the above application example, preferably, the insulating layer is a planarization layer.

[0030] According to this application example, by using the insulating layer as a planarization layer, the pixel electrode can be made into a flat shape, and the display quality can be improved.

[0031] [Application Example 7]

[0032] This application example relates to a display device, characterized in that the display device comprises: a substrate for the display device described above; a transparent sealing member supported by a partition wall; an opposing electrode arranged on the transparent sealing member; a circuit portion connected to a pixel electrode between the substrate and an insulating layer; and an electrophoretic dispersion liquid sealed in a space formed by the partition wall, the transparent sealing member and the substrate.

[0033] According to this application example, the display device includes a display device substrate, and the transparent sealing member is supported by a partition wall. Then, an opposing electrode is arranged on the transparent sealing member. A partition wall is arranged on the display device substrate, and an electrophoretic dispersion liquid is arranged in a pixel area surrounded by the partition wall. Therefore, the partition wall is located between the display device substrate and the opposing electrode. Even if a load is applied to the partition wall, the partition wall is difficult to topple or squeeze, so the display device substrate, the transparent sealing member and the opposing electrode can be easily assembled.

[0034] [Application Example 8]

[0035] The present application example relates to an electronic device, characterized in that the electronic device includes: the display device described above; and a control unit that controls the display device.

[0036] According to this application example, in the electronic device, the control unit controls the display device. Moreover, even if the display device applies a load to the partition wall, the partition wall is difficult to fall or break, so it becomes a device that is easy to assemble the display device substrate and the transparent sealing member. Therefore, the electronic device can be set as a device having a display device that is easy to assemble the display device substrate and the transparent sealing member.

[0037] [Application Example 9]

[0038] This application example relates to a method for manufacturing a substrate for a display device, characterized in that an insulating layer of a resin material is provided on the substrate, a protective film is provided on the insulating layer, a portion of the protective film is removed, and a partition wall of a resin material is provided at a position where the portion of the protective film has been removed, covering the insulating layer.

[0039] According to this application example, an insulating layer of a resin material is provided on a substrate. Then, a protective film is provided on the insulating layer, and a portion of the protective film is removed. Therefore, a portion of the insulating layer is exposed. A partition wall of a resin material is provided to cover the exposed insulating layer. Therefore, since the insulating layer of the resin material and the partition wall of the resin material are connected, the insulating layer and the partition wall can be firmly connected. As a result, even if a load is applied to the partition wall in a subsequent process, the partition wall can be prevented from falling or being squeezed. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic perspective view showing the structure of the electrophoretic display device according to the first embodiment.

[0041] Figure 2 It is a schematic plan view showing the structure of an electrophoretic display device.

[0042] Figure 3 It is a partially schematic exploded perspective view showing the structure of an electrophoretic display device.

[0043] Figure 4 It is a schematic side cross-sectional view showing the structure of an electrophoretic display device.

[0044] Figure 5 This is a schematic top view of the main parts for explaining the relationship between pixels and partition walls.

[0045] Figure 6 It is an electrical control block diagram of an electrophoretic display device.

[0046] Figure 7 It is a schematic side cross-sectional view showing the structure of an electrophoretic display device.

[0047] Figure 8 It is a schematic side cross-sectional view showing the structure of an electrophoretic display device.

[0048] Fig. 9is a flow chart of a method for manufacturing an electrophoretic display device.

[0049] Fig.10 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0050] Fig.11 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0051] Fig.12 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0052] Fig.13 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0053] Fig.14 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0054] Fig.15 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0055] Fig.16 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0056] Fig.17 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0057] Fig.18 It is a schematic diagram for explaining a method for manufacturing an electrophoretic display device.

[0058] Fig.19 It is a schematic side cross-sectional view showing the structure of the electrophoretic display device according to the second embodiment.

[0059] Fig. 20 It is a schematic perspective view showing the structure of an electronic book according to a third embodiment.

[0060] Fig.21 This is a simplified three-dimensional diagram showing the structure of a watch.

[0061] Description of Reference Numerals

[0062] 1. An electrophoretic display device as a display device; 2. A first substrate as a substrate for a display device; 5. A partition wall; 6. A pixel region; 7. A first semiconductor element as a circuit portion; 10. A first base material as a substrate; 12. An insulating layer; 13. A protective film; 14. A pixel electrode; 15. An electrophoretic dispersion liquid; 22. A common electrode as a counter electrode; 23. A sealing layer as a transparent sealing member; 26, 44, 53, a control portion; 38. An electronic book as an electronic device; 43, 52, a display portion as a display device; 45, 54, a signal driving portion as a driving device; 48. A wristwatch as an electronic device. DETAILED DESCRIPTION

[0063] In this embodiment, an electrophoretic display device and a characteristic example of manufacturing the electrophoretic display device are described with reference to the drawings. It should be noted that each component in each drawing is set to a size that can be recognized in each drawing, and therefore each component is used as a unit for illustration with different scales.

[0064] (First Embodiment)

[0065] according to Figures 1 to 18 The electrophoretic display device according to the first embodiment will be described. Figure 1 is a schematic perspective view showing the structure of an electrophoretic display device. Figure 2 It is a schematic plan view showing the structure of an electrophoretic display device.

[0066] like Figure 1 As shown, the electrophoretic display device 1 as a display device is a structure in which a first substrate 2 and a second substrate 3 as substrates for the display device overlap. The thickness direction of the first substrate 2 and the second substrate 3 is set to the Z direction, and the direction along the side of the first substrate 2 is set to the X direction and the Y direction. The second substrate 3 is located on the +Z direction side. When an observer observes the electrophoretic display device 1, it is observed from the +Z direction side. The surface on the +Z direction side of the second substrate 3 is the image display surface 3a. The first substrate 2 is shaped to be longer in the -Y direction than the second substrate 3. On the -Y direction side of the first substrate 2, a flexible cable 4 is provided on the surface on the +Z direction side. The flexible cable 4 is connected to a driving circuit not shown in the figure, and power and driving signals are supplied via the flexible cable 4.

[0067] like Figure 2 As shown, the electrophoretic display device 1 has partition walls 5 between the first substrate 2 and the second substrate 3. The partition walls 5 have a lattice shape and partition the pixel regions 6. The size of the partition walls 5 is not particularly limited, but in this embodiment, for example, the width is 3 to 5 μm and the height is 30 μm.

[0068] Regarding the pixel regions 6 in the figure, 15 are arranged in the X direction and 10 are arranged in the Y direction for easy viewing of the figure. The number of pixel regions 6 is not particularly limited, but in the present embodiment, for example, 320 are arranged in the X direction and 250 are arranged in the Y direction. The size of the pixel region 6 is not particularly limited, but in the present embodiment, for example, the length in the X direction is 50 to 100 μm and the length in the Y direction is 50 to 100 μm. The size of the electrophoretic display device 1 is also not particularly limited, but in the present embodiment, for example, the length of the first substrate 2 in the X direction is 30 to 50 mm and the length in the Y direction is 20 to 40 mm.

[0069] On the first substrate 2, a first semiconductor element 7 as a circuit portion is provided in each pixel region 6. The first semiconductor element 7 is a switching element that switches the voltage applied to the pixel region 6. The first semiconductor element 7 is provided in each pixel region 6, so the number of the first semiconductor elements 7 is the same as the number of the pixel regions 6. Then, when a predetermined pattern is displayed on the image display surface 3a, one pixel region 6 becomes one pixel 8. On the surface on the +Z direction side of the first substrate 2, a signal distribution unit 9 is provided between the second substrate 3 and the flexible cable 4. The signal distribution unit 9 switches the signal output to the first semiconductor element 7.

[0070] Figure 3 1 is a partially exploded perspective view showing the structure of the electrophoretic display device, and is a view in which a part of the electrophoretic display device 1 is exploded along the Z direction. Figure 3 As shown, the first substrate 2 has a first base material 10. Glass, plastic, ceramic, silicon, etc. can be used as the material of the first base material 10. The first base material 10 is arranged on the opposite side of the image display surface 3a viewed from the +Z direction, so it can also be an opaque material.

[0071] An element layer 11 is provided on the first substrate 10. A voltage supply line 7a, a control signal line 7b, a first semiconductor element 7, a first through electrode 7d, etc. are provided in the element layer 11. The first semiconductor element 7 is a TFT (Thin Film Transistor) element, which is an element for switching. An insulating layer 12 is provided on the element layer 11, and a protective film 13 and a pixel electrode 14 are provided on the insulating layer 12 in sequence. The insulating layer 12 is a layer for insulating the element layer 11 from the pixel electrode 14. The protective film 13 is a layer for protecting the insulating layer 12. The first through electrode 7d of the element layer 11 is connected to the pixel electrode 14. The pixel electrode 14 is separated in units of pixel areas 6. The first substrate 2 is constituted by partition walls 5, the first substrate 10, the element layer 11, the insulating layer 12, the protective film 13, the pixel electrode 14, etc.

[0072] The material of the element layer 11 is not particularly limited as long as it can form a semiconductor, and silicon, germanium, gallium arsenide, gallium arsenic phosphide, silicon nitride, silicon carbide, etc. can be used. The material of the insulating layer 12 is not particularly limited as long as it has insulating properties and is easy to form, and a resin material can be used. In this embodiment, for example, a positive photosensitive acrylic resin is used as the material of the insulating layer 12. By setting it as a positive type, an opening that exposes a part of the insulating layer 12 can be easily formed. In addition, the insulating layer 12 has the function of a flattening layer that prevents the unevenness of the element layer 11 from being reflected in the pixel area 6.

[0073] The material of the pixel electrode 14 is not particularly limited as long as it is a conductive material. In addition to copper, aluminum, nickel, gold, silver, and ITO (indium tin oxide), a material in which a nickel film or a gold film is laminated on a copper foil, or a material in which a nickel film or a gold film is laminated on an aluminum foil can be used. In this embodiment, for example, ITO is used as the material of the pixel electrode 14.

[0074] A partition wall 5 is provided on the protective film 13 and the insulating layer 12, and an electrophoretic dispersion liquid 15 is filled in the pixel area 6 divided by the partition wall 5. The material of the partition wall 5 is not particularly limited as long as it has appropriate strength, is easy to form, and does not dissolve into the electrophoretic dispersion liquid 15. A material obtained by adding a crosslinking agent to a resin material such as a polyester resin, a polyolefin resin, an acrylic resin, or an epoxy resin can be used. In the present embodiment, for example, a negative photosensitive epoxy resin is used as the material of the partition wall 5. By setting it to a negative type, a convex shape can be easily formed. The partition wall 5 is provided to block the opening of the protective film 13. By Figure 3 It can be seen that the width of the opening of the protective film 13 is narrower than the width of the bottom of the partition wall 5. As a result, a portion where the partition wall 5 and the insulating layer 12 are joined without the protective film 13 is generated, and the joining can be made into a strong structure. In addition, the partition wall 5 and the insulating layer 12 are joined on both sides of the opening through the protective film 13, which can prevent the insulating layer 12 from being damaged by the electrophoretic dispersion liquid 15 from the opening.

[0075] The material of the protective film 13 is not particularly limited as long as it has insulating properties and does not dissolve into the electrophoretic dispersion liquid 15. In the present embodiment, for example, silicon nitride is used as the material of the protective film 13. The protective film 13 is used to prevent the insulating layer 12 from dissolving into the electrophoretic dispersion liquid 15. Thus, the electrophoretic dispersion liquid 15 is prevented from being altered, and the insulating layer 12 is prevented from being degraded.

[0076] The electrophoretic dispersion 15 has white charged particles 16 as charged particles and black charged particles 17 as charged particles, and the white charged particles 16 and the black charged particles 17 are dispersed in a dispersion medium 18. The material of the white charged particles 16 is not particularly limited as long as it is white, can be charged, and can be formed into microparticles. As the material of the white charged particles 16, for example, particles, polymers, and colloids composed of white pigments such as titanium dioxide, zinc white, and antimony trioxide can be used. In the present embodiment, for example, titanium dioxide particles are used as the white charged particles 16 to be positively charged.

[0077] As the black charged particles 17, there is no particular limitation as long as they are black, can be charged, and can be formed into tiny particles. As the material of the black charged particles 17, for example, particles, polymers, and colloids composed of black pigments such as aniline black, carbon black, and titanium oxynitride can be used. In the present embodiment, for example, titanium oxynitride is used as the black charged particles 17 with a negative charge. In the white charged particles 16 and the black charged particles 17, charge control agents such as electrolytes, surfactants, metal soaps, resins, rubbers, oils, varnishes, and composites can be used for these particles as needed. In addition, dispersants such as titanium-based coupling agents, aluminum-based coupling agents, and silane-based coupling agents, lubricants, stabilizers, and the like can also be added to the white charged particles 16 and the black charged particles 17.

[0078] The dispersion medium 18 is not particularly limited as long as it is a material with fluidity and is difficult to deteriorate. As the material of the dispersion medium 18, water, methanol, ethanol, isopropanol, butanol, octanol, alcohol solvents such as methyl cellosolve, esters such as ethyl acetate and butyl acetate, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, aliphatic hydrocarbons such as pentane, hexane, octane, cyclohexane, alicyclic hydrocarbons such as methyl cyclohexane can be used. In addition, aromatic hydrocarbons such as benzene, toluene, xylene, and benzenes with long-chain alkyl groups can be used as the material of the dispersion medium 18. As benzenes with long-chain alkyl groups, hexylbenzene, heptylbenzene, octylbenzene, nonylbenzene, decylbenzene, undecylbenzene, dodecylbenzene, tridecylbenzene, tetradecylbenzene, etc. can be used. In addition, halogenated hydrocarbons such as dichloromethane, trichloromethane, carbon tetrachloride, 1,2-dichloroethane can be used as the dispersion medium 18. In addition, oils and silicone oils can be used as the material of the dispersion medium 18. These substances may be used alone or as a mixture, and may also be blended with a surfactant such as a carboxylate.

[0079] The second substrate 3 is provided on the partition wall 5 and the electrophoretic dispersion liquid 15. The second substrate 3 has a second base material 21. A common electrode 22 as a counter electrode is provided on the second base material 21, and a sealing layer 23 as a transparent sealing member for sealing the electrophoretic dispersion liquid 15 is provided on the common electrode 22. The common electrode 22 is a common electrode provided over a plurality of pixel regions 6. Therefore, the common electrode 22 is opposed to a plurality of pixel electrodes 14. The sealing layer 23 side of the second substrate 3 is bonded to the partition wall 5. In addition, the sealing layer 23 has a function of insulating the partition wall 5 from the common electrode 22.

[0080] The material of the second substrate 21 is not particularly limited as long as it has light transmittance, strength, and insulation. Glass and resin materials can be used as the material of the second substrate 21. In this embodiment, for example, a glass plate is used as the material of the second substrate 21.

[0081] The common electrode 22 is not particularly limited as long as it is a transparent conductive film. For example, MgAg, IGO (Indium-gallium oxide), ITO (Indium Tin Oxide), ICO (Indium-cerium oxide), IZO (Indium-zinc oxide), etc. can be used as the common electrode 22. In the present embodiment, for example, ITO is used as the common electrode 22.

[0082] The material of the sealing layer 23 is not particularly limited as long as it can be bonded to the partition wall 5, has light transmittance and insulation and does not deteriorate the electrophoretic dispersion liquid 15. For example, polyurethane, polyurea, polyurea-polyurethane, urea-formaldehyde, melamine-formaldehyde resin, polyamide, polyester, polysulfonamide, polycarbonate, polysulfinic acid ester, epoxy resin, acrylic resin such as polyacrylate, polymethacrylate, polyvinyl acetate, gelatin, phenolic resin, vinyl resin, etc. can be used as the material of the sealing layer 23. In the present embodiment, for example, ultraviolet curing acrylic resin and epoxy resin are used.

[0083] Figure 4 FIG. 2 is a schematic side cross-sectional view showing the structure of an electrophoretic display device. Figure 4 As shown, the electrophoretic display device 1 is used by applying a voltage between the pixel electrode 14 and the common electrode 22. Furthermore, the voltage is switched between the pixel electrode 14 and the common electrode 22 for use.

[0084] The common electrode 22 is set to a low voltage relative to the pixel electrode 14. At this time, the black charged particles 17 have a negative voltage, so the black charged particles 17 are induced to the pixel electrode 14. The white charged particles 16 have a positive voltage, so the white charged particles 16 are induced to the common electrode 22. As a result, the black charged particles 17 are gathered on the first substrate 2, and the white charged particles 16 are gathered on the second substrate 3. When the electrophoretic display device 1 is observed from the second substrate 3 side, the white charged particles 16 can be seen through the second substrate 3. Therefore, the pixel area 6 is displayed in white.

[0085] The first semiconductor element 7 is provided in the element layer 11. The first semiconductor element 7 has a semiconductor film 7e, and a source region 7h, a channel formation region 7k, and a drain region 7j are sequentially arranged in the semiconductor film 7e. A gate insulating film 7f is provided on the semiconductor film 7e, and a gate electrode 7g is provided on the gate insulating film 7f. A source electrode 7n is connected to the source region 7h, and the source electrode 7n is connected to the voltage supply line 7a. A first drain electrode 7p is provided to be connected to the drain region 7j, and a first through electrode 7d is provided to be connected to the first drain electrode 7p. The first through electrode 7d is connected to the pixel electrode 14, so that the first semiconductor element 7 is electrically connected to the pixel electrode 14. The gate electrode 7g is connected to the control signal line 7b.

[0086] The main material of the partition wall 5 is epoxy resin, and the main material of the insulating layer 12 is acrylic resin. In addition, the insulating layer 12 is bonded to a portion of the partition wall 5. Therefore, the bonding between the insulating layer 12 and the partition wall 5 is the bonding of the same resin materials to each other, and the insulating layer 12 and the partition wall 5 can be fixed with higher strength than when one of the insulating layer 12 and the partition wall 5 is an inorganic material. The hardness of the partition wall 5 is 2 GPa, and the hardness of the insulating layer 12 is 0.5 GPa. The partition wall 5 has a higher hardness than the insulating layer 12, and therefore has strength. Therefore, even when a load is applied to the partition wall 5 in the process of assembling the first substrate 2 and the second substrate 3, deformation of the partition wall 5 can be prevented, and the partition wall 5 is formed into a shape that bites into the insulating layer 12 side, so that the partition wall 5 is not easily peeled off from the insulating layer 12. As a result, it is possible to suppress the partition wall 5 from falling or being squeezed.

[0087] The hardness of the insulating layer 12 before curing is about 15 mPa / s, and the hardness of the partition wall 5 before curing is about 2000 mPa / s. Therefore, the material of the insulating layer 12 can be easily formed into a thinner film than the material of the partition wall 5. However, the insulating layer 12 is more easily dissolved into the electrophoretic dispersion liquid 15 than the partition wall 5, so a protective film 13 is provided to cover the insulating layer 12. Since the insulating layer 12 and the electrophoretic dispersion liquid 15 are not in contact with each other by the protective film 13, the electrophoretic dispersion liquid 15 and the insulating layer 12 can be prevented from being damaged.

[0088] A portion of the protective film 13 is located between the partition wall 5 and the insulating layer 12. Specifically, the width of the partition wall 5 on the insulating layer 12 side is set to a first width 5a. Then, the partition wall 5 is joined to the insulating layer 12 at the center of the partition wall 5 in the width direction of the partition wall 5. The width at which the partition wall 5 and the insulating layer 12 are joined is set to a second width 5b. For example, the second width 5b is 1 / 3 the length of the first width 5a. Then, the protective film 13 enters between the partition wall 5 and the insulating layer 12 from both side surfaces of the partition wall 5. The length of the portion of the protective film 13 that enters between the partition wall 5 and the insulating layer 12 from the side surface of the partition wall 5 is set to a third width 5c. For example, the third width 5c is 1 / 3 the length of the first width 5a. At this time, the protective film 13 exists on the insulating layer 12, and a portion of the partition wall 5 exists on the protective film 13. Therefore, the insulating layer 12 is covered by the partition wall 5 and the protective film 13, so the insulating layer 12 is not exposed in the surface in contact with the electrophoretic dispersion liquid 15. As a result, it is possible to suppress the insulating layer 12 from coming into contact with the electrophoretic dispersion liquid 15 .

[0089] Figure 5 2 is a schematic top view of the main part for explaining the relationship between the pixel and the partition wall, and is a view of the first substrate 2 viewed from the image display surface 3a side. Figure 5 As shown, in the first substrate 2, one pixel electrode 14 is provided corresponding to one pixel 8. Then, the partition wall 5 is arranged to surround the pixel electrode 14 relative to one pixel 8. It should be noted that the partition wall 5 may not surround the entire circumference of the pixel electrode 14 but may be partially missing. Then, the electrophoretic dispersion liquid 15 may also be moved between the pixels 8 at the missing position. The partition wall 5 is arranged to surround the pixel electrode 14. At this time, the area surrounded by the partition wall 5 can be reduced compared to when the partition wall 5 surrounds a plurality of pixel electrodes 14. Then, the strength of the partition wall 5 can be increased. Therefore, even if a load is applied to the partition wall 5, it is possible to prevent the partition wall 5 from tipping over or being squeezed.

[0090] Figure 6 This is the electrical control block diagram of the electrophoretic display device. Figure 6 As shown, the electrophoretic display device 1 is used by being connected to a control device 24. The control device 24 includes an input unit 25, and the input unit 25 is connected to a device that outputs an image signal representing an image displayed on the electrophoretic display device 1, and inputs the image signal. The input unit 25 is connected to a control unit 26. Furthermore, the control unit 26 is connected to a storage unit 27, a first waveform forming unit 28, a second waveform forming unit 29, and a signal distribution unit 9.

[0091] The control unit 26 is a part that controls the first waveform forming unit 28, the second waveform forming unit 29, and the signal distribution unit 9. The storage unit 27 stores information other than the image signal that is used when the signal output to the electrophoretic display device 1 is formed based on the image signal. The first waveform forming unit 28 is connected to the first semiconductor element 7 via the flexible cable 4, the signal distribution unit 9, and the control signal line 7b, and outputs a data signal in units of pixels to the first semiconductor element 7. The first semiconductor element 7 is connected to the pixel electrode 14, and outputs a voltage corresponding to the data signal to the pixel electrode 14. The second waveform forming unit 29 is connected to the common electrode 22 via the flexible cable 4 and the signal distribution unit 9, and outputs a voltage waveform to the common electrode 22.

[0092] The signal distribution unit 9 distributes the driving signal to the first semiconductor element 7 and switches the voltage waveform output to the pixel electrode 14. The signal distribution unit 9 also transmits the voltage waveform output to the common electrode 22.

[0093] Figure 7 as well as Figure 8 FIG. 2 is a schematic side cross-sectional view showing the structure of an electrophoretic display device. Figure 7 As shown, the common electrode 22 is set to a low voltage relative to the pixel electrode 14. At this time, the black charged particles 17 have a negative voltage, so the black charged particles 17 are induced to the pixel electrode 14. The white charged particles 16 have a positive voltage, so the white charged particles 16 are induced to the common electrode 22. As a result, the black charged particles 17 are gathered on the first substrate 2, and the white charged particles 16 are gathered on the second substrate 3. When the electrophoretic display device 1 is observed from the second substrate 3 side, the white charged particles 16 can be seen through the second substrate 3. Therefore, the pixel area 6 is displayed in white.

[0094] like Figure 8 As shown, the common electrode 22 is set to a high voltage relative to the pixel electrode 14. At this time, the black charged particles 17 have a negative voltage, so the black charged particles 17 are induced to the common electrode 22. Since the white charged particles 16 have a positive voltage, the white charged particles 16 are induced to the pixel electrode 14. As a result, the white charged particles 16 are gathered on the first substrate 2, and the black charged particles 17 are gathered on the second substrate 3. When the electrophoretic display device 1 is observed from the second substrate 3 side, the black charged particles 17 can be seen through the second substrate 3. Therefore, the pixel area 6 is displayed in black.

[0095] Next, through Figures 9 to 18 A method for manufacturing the above-mentioned electrophoretic display device 1 will be described. Fig. 9 is a flow chart of a method for manufacturing an electrophoretic display device, Figures 10 to 18 is a schematic diagram for explaining a method for manufacturing an electrophoretic display device. Fig. 9In the flowchart of FIG. 1 , step S1 corresponds to the upper electrode installation step. This step is a step of installing the common electrode 22 and the sealing layer 23 on the second substrate 21 .

[0096] Next, the process proceeds to step S2 . Step S2 is a device placement step. This step is a step of placing the device layer 11 on the first substrate 10 .

[0097] Next, the process proceeds to step S3 . Step S3 is an insulating layer providing step. This step is a step of providing the insulating layer 12 on the element layer 11 .

[0098] Next, the process proceeds to step S4 . Step S4 is a protective film providing step. This step is a step of providing the protective film 13 on the insulating layer 12 .

[0099] Next, the process proceeds to step S5 . Step S5 is a lower electrode providing step. This step is a step of providing the first penetration electrode 7 d and the pixel electrode 14 on the protective film 13 .

[0100] Next, the process proceeds to step S6 . Step S6 is a partition wall installation step. This step is a step of installing the partition wall 5 on the first substrate 2 .

[0101] Next, the process proceeds to step S7 . Step S7 is a dispersion liquid filling step. This step is a step of filling the pixel region 6 with the electrophoretic dispersion liquid 15 .

[0102] Next, the process proceeds to step S8 . Step S8 is a substrate assembly process. This process is a process of bonding the partition wall 5 and the second substrate 3 .

[0103] Through the above steps, the process of manufacturing the electrophoretic display device 1 is completed.

[0104] Next, use Figures 10 to 18 , corresponding to Fig. 9 The steps are shown to explain the manufacturing method in detail.

[0105] First, the second substrate 3 is manufactured. Fig.10 1 is a diagram corresponding to the upper electrode setting process of step S1. Fig.10 As shown, a second substrate 21 is prepared. A glass plate is ground and polished to a predetermined thickness to reduce the surface roughness. Next, a common electrode 22 is provided on the second substrate 21. An ITO film having a film thickness of about 100 nm is formed on the second substrate 21 using a film forming method such as a sputtering method. Next, the ITO film is patterned by a photolithography method and an etching method to form a common electrode 22.

[0106] Next, a sealing layer 23 is provided on the common electrode 22. The sealing layer 23 can be provided using various printing methods such as inkjet printing, offset printing, screen printing, relief printing such as flexographic printing, gravure printing, etc. In addition, spin coating, roll coating, die coating, slit coating, curtain coating, spray coating, horizontal coating, dip coating, etc. can also be used.

[0107] Next, the first substrate 2 is manufactured. Fig.11 is a diagram corresponding to the component setting process of step S2. Fig.11 As shown, in step S2, a first substrate 10 is prepared. The first substrate 10 is also made of a glass plate ground and polished to a predetermined thickness to reduce the surface roughness. An element layer 11 is formed on the first substrate 10. The method for forming the element layer 11 is well known, so a detailed description is omitted and a general manufacturing method is described. There are many methods for forming the element layer 11, and there is no particular limitation.

[0108] First, a base insulating film 30 of SiO2 (not shown) is formed on the first substrate 10 by CVD (chemical vapor deposition). Next, an amorphous silicon film with a film thickness of about 50 nm is formed on the base insulating film by CVD or the like. The amorphous silicon film is crystallized by laser crystallization or the like to form a polycrystalline silicon film. Thereafter, a semiconductor film 7e is formed as an island-shaped polycrystalline silicon film by photolithography and etching or the like.

[0109] Next, SiO2 with a film thickness of about 100 nm is formed by CVD method or the like so as to cover the semiconductor film 7e and the base insulating film, and is used as the gate insulating film 7f. A Mo film with a film thickness of about 500 nm is formed on the gate insulating film 7f by sputtering method or the like, and an island-shaped gate electrode 7g is formed by photolithography and etching method. Impurity ions are injected into the semiconductor film by ion implantation method to form a source region 7h, a drain region 7j and a channel formation region 7k. A SiO2 film with a film thickness of about 800 nm is formed so as to cover the gate insulating film 7f and the gate electrode 7g, and is used as the first interlayer insulating film 11m.

[0110] Next, a contact hole reaching the source region 7h and a contact hole reaching the drain region 7j are formed on the first interlayer insulating film 11m. After that, a Mo film having a thickness of about 500 nm is formed on the first interlayer insulating film 11m and in the contact holes by sputtering or the like, and patterned by photolithography and etching to form a source electrode 7n, a first drain electrode 7p, and wiring (not shown).

[0111] A Si3N4 film with a thickness of about 800 nm is formed to cover the first interlayer insulating film 11m, the source electrode 7n, the first drain electrode 7p and the wiring to form a second interlayer insulating film 11r. The second interlayer insulating film 11r is patterned by photolithography and etching to form contact holes.

[0112] Fig.12 3 is a diagram corresponding to the insulating layer setting process of step S3. Fig.12 As shown, in step S3, an insulating layer 12 is provided on the second interlayer insulating film 11r. First, a resin film of the material to be the insulating layer 12 is provided. On the element layer 11, a solution formed by dissolving an acrylic resin is applied to the element layer 11 and dried and solidified. The resin film can be provided using various printing methods such as inkjet, offset printing, screen printing, flexographic printing, gravure printing, and other relief printing, gravure printing, and other gravure printing. In addition, spin coating, roller coating, die coating, slit coating, curtain coating, spray coating, horizontal coating, dip coating, etc. can also be used. Next, the resin film is patterned by photolithography and etching. Thus, the outer shape of the insulating layer 12 and the shape of the through hole 12a are patterned. Next, the insulating layer 12 is etched using an etching solution to form the through hole 12a.

[0113] Fig.13 as well as Fig.14 4 is a diagram corresponding to the protective film setting process of step S4. Fig.13 As shown, in step S4, a SiN film having a thickness of about 500 nm is formed on the insulating layer 12 and in the through hole 12a by using a film forming method such as evaporation or CVD. Fig.14 As shown, the SiN film is patterned and etched to form a protective film 13. The first drain electrode 7p is exposed in the through hole 12a. Furthermore, the insulating layer 12 is exposed at the position where the partition wall 5 is provided. The etching method is not particularly limited, but dry etching is used in this embodiment.

[0114] Fig.15 1 is a diagram corresponding to the lower electrode setting process of step S5. Fig.15 As shown, in step S5, an ITO film having a film thickness of about 500 nm is formed on the insulating layer 12, the protective film 13, and in the through hole 12a by using a film forming method such as a sputtering method. Furthermore, the ITO film is etched by a photolithography method and an etching method to form a pixel electrode 14 and a first through electrode 7d. The insulating layer 12 and the protective film 13 are exposed at a predetermined position where the partition wall 5 is set. The etching method is not particularly limited, but a dry etching method is used in this embodiment.

[0115] Fig.16 1 is a diagram corresponding to the partition wall installation process of step S6. Fig.16 As shown, in step S6, a partition wall 5 is provided on the exposed insulating layer 12 and the protective film 13. First, a photosensitive resin material that becomes the material of the partition wall 5 is applied on the pixel electrode 14. As a coating method, various printing methods such as offset printing, screen printing, and letterpress printing can be used for the setting. In addition, coating methods such as spin coating and roller coating can also be used. Next, the photosensitive resin material is heated and dried to solidify it. Next, the photosensitive resin material is patterned and etched by photolithography to form the partition wall 5. The partition wall 5 of the resin material is provided by covering the insulating layer 12 at the position where a part of the protective film 13 is removed. The first substrate 2 is completed by this process.

[0116] Fig.17 1 is a diagram corresponding to the dispersion liquid filling process of step S7. Fig.17 As shown, in step S7, the first substrate 2 provided with the partition wall 5 is set in a container not shown. Then, the white charged particles 16 and the black charged particles 17 are added to the dispersion medium 18 and stirred to prepare the electrophoretic dispersion liquid 15. Next, the electrophoretic dispersion liquid 15 is supplied to the pixel area 6 using a supply device such as a syringe. The supply method of the electrophoretic dispersion liquid 15 can also use various printing methods and inkjet methods. The electrophoretic dispersion liquid 15 is supplied to the extent of overflowing from the pixel area 6.

[0117] Fig.18 is a diagram corresponding to the substrate assembly process of step S8. Fig.18 As shown, in step S8, the second substrate 3 is arranged on the partition wall 5. First, the first substrate 2 supplied with the electrophoretic dispersion liquid 15 is arranged in a decompression chamber. Next, the second substrate 3 is mounted on the partition wall 5. Next, the decompression chamber is decompressed and the second substrate 3 is pressurized on the first substrate 2. While maintaining this state, ultraviolet rays are irradiated to the sealing layer 23. The sealing layer 23 is an ultraviolet curing type and can also function as an adhesive to temporarily fix the partition wall 5 and the second substrate 3. Next, the second substrate 3 is fixed to the partition wall 5 by heating the first substrate 2 on which the second substrate 3 is arranged and curing the sealing layer 23. The electrophoretic display device 1 is completed through the above steps.

[0118] As described above, according to this embodiment, the following effects are achieved.

[0119] (1) According to the present embodiment, an insulating layer 12 is provided on the first substrate 10. Then, a partition wall 5 is provided on the insulating layer 12. Both the insulating layer 12 and the partition wall 5 are formed of a resin material. Therefore, compared with a case where one of the insulating layer 12 and the partition wall 5 is an inorganic material and the other is a resin material, the insulating layer 12 and the partition wall 5 can be fixed with high strength. Moreover, the partition wall 5 has a higher hardness than the insulating layer 12, and thus has a higher strength. As a result, even when a load is applied to the partition wall 5, it is possible to prevent the partition wall 5 from peeling off from the insulating layer 12 and falling or being crushed.

[0120] (2) According to the present embodiment, the protective film 13 for protecting the insulating layer 12 is provided on the surface of the insulating layer 12. Therefore, the electrophoretic dispersion liquid 15 is prevented from contacting the insulating layer 12. Furthermore, the electrophoretic dispersion liquid 15 and the insulating layer 12 can be prevented from being damaged by each other.

[0121] (3) According to the present embodiment, a portion of the protective film 13 is located between the partition wall 5 and the insulating layer 12. That is, the partition wall 5 blocks the opening of the protective film 13. Therefore, the insulating layer 12 is not exposed in the pixel region 6. As a result, the electrophoretic dispersion liquid 15 can be prevented from contacting the insulating layer 12.

[0122] (4) According to the present embodiment, one pixel electrode 14 is provided on the first substrate 2 corresponding to one pixel 8. Then, the partition wall 5 is provided to surround the pixel electrode 14. In this case, compared with the case where the partition wall 5 surrounds a plurality of pixel electrodes 14, since the area of ​​the position surrounded by the partition wall 5 is narrow, the strength of the partition wall 5 can be improved. Therefore, even if a load is applied to the partition wall 5, it is possible to suppress the partition wall 5 from falling or being crushed.

[0123] (5) According to the present embodiment, the insulating layer 12 and the partition wall 5 are made of resin material and have similar thermal expansion coefficients. Therefore, even when the temperature changes greatly during the manufacturing process of the electrophoretic display device 1, the partition wall 5 is not easily peeled off from the insulating layer 12.

[0124] (6) According to the present embodiment, the insulating layer 12 and the partition walls 5 have high adhesion. Therefore, even when the electrophoretic dispersion liquid 15 is heated and expanded, it is possible to suppress the partition walls 5 from being peeled off from the insulating layer 12 .

[0125] (Second Embodiment)

[0126] Next, use Fig.19 An embodiment of an electrophoretic display device will be described. Fig.19 1 is a schematic side cross-sectional view showing the structure of the electrophoretic display device. This embodiment is different from the first embodiment in that the protective film 13 is not located between the insulating layer 12 and the partition wall 5. It should be noted that the description of the same points as the first embodiment will be omitted.

[0127] That is, in this embodiment, if Fig.19 As shown, the electrophoretic display device 33 includes a first substrate 34 and a second substrate 3, and is structured to clamp the electrophoretic dispersion liquid 15 using the first substrate 34 and the second substrate 3. In the first substrate 34, a protective film 35 is provided on the insulating layer 12, and is provided on the upper part of the partition wall 5 and the side of the partition wall 5. It should be noted that the protective film 35 on the side of the partition wall 5 only needs to be provided to such an extent that the insulating layer 12 is not exposed at the boundary between the partition wall 5 and the insulating layer 12, and does not necessarily need to be provided on the entire side of the partition wall 5. The protective film 35 is not clamped by the insulating layer 12 and the partition wall 5. Therefore, the entire bottom surface of the partition wall 5 is in contact with and fixed to the insulating layer 12. Therefore, the area where the bottom surface of the partition wall 5 is in contact with the insulating layer 12 is larger than that of the first substrate 2 of the first embodiment, so that the partition wall 5 can be made less likely to peel off from the insulating layer 12.

[0128] After the partition wall 5 is provided on the insulating layer 12, the protective film 35 is formed by a CVD method or the like. Then, the pixel electrode 14 is formed after the first drain electrode 7p is exposed in the contact hole. Fig.19 In the embodiment, a protective film 35 is also provided on the upper part of the partition wall 5, but the protective film 35 on the upper part of the partition wall 5 can also be deleted.

[0129] (Third Embodiment)

[0130] Next, use Fig. 20 as well as Fig.21 An embodiment of an electronic device equipped with an electrophoretic display device will be described. Fig. 20 This is a simplified three-dimensional diagram showing the structure of an electronic book. Fig.21 It is a simplified three-dimensional diagram showing the structure of a watch. Fig. 20 As shown, an electronic book 38 as an electronic device has a plate-shaped housing 39. A cover 41 is provided on the housing 39 via a hinge 40. In addition, operation buttons 42 and a display unit 43 as a display device are provided on the housing 39. The operator can operate the operation button 42 to operate the content displayed on the display unit 43.

[0131] A control unit 44 and a signal driving unit 45 for driving a data signal to the display unit 43 are provided inside the housing 39. The control unit 44 outputs display data to the signal driving unit 45, and also outputs a timing signal when the display data is converted into a data signal. The signal driving unit 45 generates a data signal based on the display data and outputs it to the display unit 43. In addition, the control unit 44 outputs a display control signal synchronized with the data signal output by the signal driving unit 45 to the display unit 43. The display unit 43 generates a signal required for electrophoretic display in a signal distribution circuit inside the display unit 43 based on the input display control signal and the data signal, so that a display corresponding to the display data output by the control unit 44 to the display unit 43 can be performed. It should be noted that the operation of the operator based on the operation button 42 is timely signalized and transmitted to the control unit 44, and is reflected in the output signal of the control unit 44. Either the electrophoretic display device 1 or the electrophoretic display device 33 is used in the display unit 43. Therefore, the electronic book 38 can be configured as an electrophoretic display device having a structure in which the partition wall 5 is difficult to fall down and can be easily assembled, and is applied to the display unit 43 .

[0132] like Fig.21 As shown, a wristwatch 48 as an electronic device has a plate-shaped housing 49. The housing 49 has a strap 50, and the operator can wrap the strap 50 around the wrist to fix the wristwatch 48 on the wrist. In addition, an operation button 51 and a display unit 52 as a display device are provided on the housing 49. The operator can operate the operation button 51 to operate the content displayed on the display unit 52.

[0133] A control unit 53 for controlling the watch 48 and a signal driving unit 54 for driving a signal to the display unit 52 are provided inside the housing 49. The control unit 53 outputs display data and necessary timing signals to the signal driving unit 54. It should be noted that the necessary timing signal may also include a signal directly output from the control unit 53 to the display unit 52. The signal driving unit 54 outputs the signal required for display to the display unit 52, thereby enabling the display unit 52 to display content corresponding to the display data. Moreover, either the electrophoretic display device 1 or the electrophoretic display device 33 is used in the display unit 52. Therefore, the watch 48 can be set as an electrophoretic display device having a structure that makes the partition wall 5 difficult to topple over and easy to assemble, and is applied to the display unit 52.

[0134] It should be noted that the present embodiment is not limited to the above-mentioned embodiment, and various changes and improvements can be made by a person having ordinary knowledge in the art within the technical concept of the present invention. Modifications are as follows.

[0135] (Variant 1)

[0136] In the first embodiment, white charged particles 16 and black charged particles 17 are provided in the electrophoretic dispersion liquid 15. Red, green, blue, etc. charged particles may be used instead of the white charged particles 16 and the black charged particles 17. According to this structure, color display can be performed by displaying red, green, blue, etc. In addition, only charged particles of one color may be used in the electrophoretic dispersion liquid 15.

[0137] (Variant 2)

[0138] In the first embodiment, one pixel electrode 14 is provided in one pixel region 6. A plurality of pixel electrodes 14 may be provided in one pixel region 6. Display can be segmented.

[0139] (Variant 3)

[0140] In the first embodiment, the white charged particles 16 are positively charged and the black charged particles 17 are negatively charged. Alternatively, the white charged particles 16 may be negatively charged and the black charged particles 17 may be positively charged. This may be a charge state that is easily controllable.

[0141] (Variant 4)

[0142] In the first embodiment, the shape of the pixel region 6 is a quadrilateral. The shape of the pixel region 6 may also be a circle, an ellipse, a polygon, or a shape including an arc and a straight line. At this time, the partition wall 5 is formed of a resin material, so the shape of the partition wall 5 can be easily matched with the shape of the pixel region 6.

[0143] (Variant 5)

[0144] In the first embodiment, the first substrate 2 and the second substrate 3 are bonded after the electrophoretic dispersion liquid 15 is provided in the pixel region 6 of the first substrate 2. Alternatively, the electrophoretic dispersion liquid 15 may be provided in the pixel region 6 after the first substrate 2 and the second substrate 3 are bonded so that the pixel region 6 is connected. The process sequence may be easy to manufacture.

[0145] (Variant 6)

[0146] In the first embodiment, the first semiconductor element 7 is provided on the first substrate 2. Alternatively, the first semiconductor element 7 is not provided on the first substrate 2, but only the pixel electrode 14 is provided. Furthermore, a driving circuit for directly applying a voltage to the pixel electrode 14 may be provided. The structure of the first substrate 2 becomes simple, so that it can be easily manufactured.

[0147] The entire contents of Tokugan Application No. 2015-184810 filed with the Japan Patent Office on September 18, 2015 are incorporated herein by reference.

Claims

1. A substrate for a display device, the substrate being in contact with an electrophoretic dispersion liquid, the substrate comprising: a substrate including an insulating layer formed of a resin material; a protective film disposed on a surface of the insulating layer to protect the insulating layer from contact with the electrophoretic dispersion liquid, wherein the protective film has an opening; A partition wall is provided on the insulating layer, the partition wall being formed of a resin material and forming a separated space, wherein the partition wall is provided to block the opening, and the width of the opening of the protective film is narrower than the width of the bottom of the partition wall.

2. The display device substrate according to claim 1, wherein The insulating layer is formed using a positive photosensitive acrylic resin.

3. The display device substrate according to claim 1, wherein The partition wall includes a material formed by adding a cross-linking agent to a resin material.

4. The display device substrate according to claim 3, wherein The resin material is polyester resin, polyolefin resin, acrylic resin or epoxy resin.

5. The display device substrate according to claim 1, wherein The partition wall includes negative photosensitive epoxy resin.

6. The display device substrate according to claim 1, wherein The hardness of the partition wall is higher than that of the insulating layer.

7. The display device substrate according to claim 1, wherein The substrate includes pixel electrodes corresponding to pixels, and the partition walls are arranged to surround the pixel electrodes.

8. The display device substrate according to claim 7, wherein The circuit portion is electrically connected to the pixel electrode, and the insulating layer is disposed between the circuit portion and the pixel electrode.

9. The display device substrate according to claim 1, wherein The insulating layer is a planarization layer.

10. A display device, comprising: The display device substrate according to claim 1; a transparent sealing member supported by the partition wall; as well as an opposing electrode disposed on the transparent sealing member; The electrophoretic dispersion liquid is sealed in a space formed by the partition wall, the transparent sealing member, and the substrate.

11. An electronic device comprising: The display device according to claim 10; as well as A control unit controls the display device.

12. A method for manufacturing a display device, comprising the steps of: providing a second substrate including a second base material, a common electrode, and a transparent sealing member in sequence; Providing a first substrate including a first base material and a component layer; providing an insulating layer of a positive photosensitive acrylic resin material on the element layer; providing a protective film on the surface of the insulating layer; removing a portion of the protective film; as well as A partition wall made of a resin material is provided at a position where a portion of the protective film is removed, covering the insulating layer, the partition wall forming a partitioned space; filling the separated spaces with an electrophoretic dispersion; bonding the transparent sealing member of the second substrate to the partition wall; The width of the portion where the protective film is partially removed is narrower than the width of the bottom of the partition wall.

13. The method of claim 12, wherein: The partition wall includes a material formed by adding a cross-linking agent to a resin material.

14. The method of claim 13, wherein: The resin material is polyester resin, polyolefin resin, acrylic resin or epoxy resin.

15. The method of claim 12, wherein: The partition wall comprises a negative photosensitive epoxy resin material.

16. The method of claim 15, further comprising the steps of: The photosensitive resin material of the partition wall is patterned using a photolithography method.

17. The method of claim 12, further comprising the steps of: The photosensitive resin material of the insulating layer is patterned using a photolithography method.

18. The method of claim 12, wherein: The protection film includes silicon nitride (SiN).

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