Optical component and assembly method thereof

Abstract

The present invention provides an optical component, which includes: at least two components connected together by a welding structure, at least one of the at least two components includes an optical element, and the optical element includes a lens, a filter element or a photosensitive element arranged in a light-sensitive path; wherein the at least two components include a first component with a first mounting surface and a second component with a second mounting surface, and the welding structure includes a welding pin arranged on the first mounting surface and a groove arranged on the second mounting surface, and the groove has a filling material, the filling material is a welding material consistent with the welding pin, and the surface of the filling material in the groove is lower than the second mounting surface. The present invention also provides an optical component assembly method based on the welding structure. The firmness and stability of the camera module can be improved, and its optical performance is also more stable.

Description

Technical Field

[0001] The present invention relates to the field of optical technology, and in particular to an optical component and an assembling method thereof. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been rapidly developed and improved, and in recent years, camera modules have been widely used in many fields such as medical, security, industrial production, etc. At present, in the field of consumer electronics (such as the field of mobile phones), glue is generally used for the assembly of camera modules. For example, in the process of making a camera module, the optical lens, photosensitive component (including photosensitive chip and circuit board) and color filter component (including color filter and its bracket) can be made separately first, and then these optical components are bonded with glue to form an integral camera module. Among them, the color filter bracket usually has a top surface for supporting and assembling the optical lens, so the color filter bracket is sometimes also called a lens base.

[0003] However, in recent years, with the rapid development of smart phones, the demand for mobile phone cameras and the pursuit of imaging quality have increased day by day, and the competition in camera modules has become increasingly fierce, which has led to great development in the structure and performance of camera modules. In this context, the shortcomings of the traditional glue-based camera module assembly scheme have begun to emerge. First, in the existing camera module assembly scheme, the glue often needs to be cured by baking. The expansion coefficient of the glue is relatively high. During the baking and curing process, there will be a certain degree of variation, resulting in the actual thickness of the glue being inconsistent with the designed thickness (or, the actual thickness of the glue may be uncontrollable), which causes the two assembled optical components to tilt or shift the back focus. Problems. Secondly, when the camera module is working normally, there may be uneven heating in the camera module. Due to the increase in local deformation caused by the thermal expansion of the glue, the relative position of the lens and the photosensitive chip (i.e., the image sensor) may change. The above problems may cause the actual resolution of the camera module to decrease, the field of view (FOV) to be seriously affected, and other problems. In particular, for high-definition camera modules, which may have the characteristics of high resolution and large chip size, the above-mentioned performance degradation problems such as resolution and field of view caused by glue expansion will be more obvious. In addition, the use of glue to assemble camera modules is prone to debonding during actual operation, which makes rework more difficult and affects the production yield and production efficiency of the product.

[0004] Therefore, there is an urgent need for an assembly solution for a camera module (or similar optical components) that can overcome the above-mentioned defects, have better optical performance stability and structural reliability during assembly and use, and can improve production efficiency and production yield. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and to provide an assembly solution for a camera module (or similar optical components) that has better optical performance stability and structural reliability during assembly and use and can improve production efficiency and production yield.

[0006] To solve the above technical problems, the present invention provides an optical component, comprising: at least two components connected together by a welding structure, at least one of the at least two components comprises an optical element, and the optical element comprises a lens, a filter element or a photosensitive element arranged in a light-sensitive path; wherein the at least two components comprise a first component having a first mounting surface and a second component having a second mounting surface, the welding structure comprises a welding pin arranged on the first mounting surface and a groove arranged on the second mounting surface, the groove comprises a filling material, the filling material is a welding material consistent with the welding pin, and the surface of the filling material in the groove is lower than the second mounting surface.

[0007] Wherein, the thermal conductivity of the welding material is lower than 100 W / mK.

[0008] Among them, the first component is a photosensitive chip, the photosensitive chip includes the photosensitive element and a non-photosensitive structure area surrounding the photosensitive element, and the first mounting surface is the back side of the photosensitive chip; the second component is a circuit board, and the second mounting surface is the upper surface of the circuit board.

[0009] Among them, the first component is a filter assembly, the filter assembly includes a lens base and the filter element installed on the lens base, and the first mounting surface is the bottom surface of the lens base; the second component is a photosensitive assembly, the photosensitive assembly includes a circuit board and a photosensitive chip installed on the circuit board, and the second mounting surface is the upper surface of the circuit board.

[0010] Among them, the first component is a lens assembly, which includes a lens barrel and at least one lens installed in the lens barrel, and the first mounting surface is the bottom surface of the lens assembly; the second component is a filter assembly, which includes a lens base and the filter element installed on the lens base, and the second mounting surface is the top surface of the lens base; the lens base is separately molded and installed on the circuit board, or the lens base is a molded lens base directly molded on the surface of the circuit board through a molding process.

[0011] Among them, the first component is a lens assembly, which includes a motor, a lens barrel and at least one lens installed in the lens barrel, the lens barrel is installed in a carrier of the motor, and the first mounting surface is the bottom surface of the motor; the second component is a filter assembly, which includes a lens base and the filter element installed on the lens base, and the second mounting surface is the top surface of the lens base.

[0012] Among them, the optical component is a multi-camera module, the first component is a camera module, and the first mounting surface is the outer surface of the camera module; the second component is a multi-camera bracket, which includes at least one accommodating hole for accommodating the camera module, and the second mounting surface is the inner surface of the multi-camera bracket forming the accommodating hole.

[0013] Wherein, the welding material is a welding material composed of a multi-component alloy.

[0014] Wherein, the welding material is thermoplastic plastic.

[0015] Wherein, the welding material is PMMA plastic, PC plastic or ABS plastic, and the welding pin and the filling material in the groove are connected as a whole by laser heating or ultrasonic heating.

[0016] Wherein, the ratio of the depth of the filling material in the groove to the depth of the groove is 0.75-0.85.

[0017] Wherein, the thermoplastic plastic is mixed with a light absorber.

[0018] Wherein, the ratio of the depth of the groove to the height of the second component is not greater than 0.25; wherein the height of the second component is the dimension of the second component in the normal direction of the second mounting surface.

[0019] Wherein, in the welding structure, the welding pin and the filling material in the groove are connected as a whole by laser heating.

[0020] Among them, the optical component is a camera module, and the camera module also includes at least two components connected together by a grooveless welding structure; the at least two components include a third component having a third mounting surface and a fourth component having a fourth mounting surface; the grooveless welding structure includes a welding pin arranged on the first mounting surface and a welding pad arranged on the second mounting surface, and the manufacturing material of the welding pad is consistent with that of the welding pin.

[0021] Wherein, the circuit board is a PCB board or a ceramic substrate.

[0022] At least one of the at least two components has a circuit structure, and the welding pin or the welding material filled in the groove is electrically separated from the circuit structure.

[0023] Wherein, the circuit board and the photosensitive chip are electrically connected through a wire bonding process.

[0024] According to another aspect of the present application, a method for assembling an optical component is also provided, comprising: step 1) preparing a first component and a second component that are separated from each other, at least one of the first component and the second component comprising an optical element, the optical element comprising a lens, a filter element or a photosensitive element arranged in a light-sensitive path; the first component having a first mounting surface, the first mounting surface being provided with a welding pin, the second component having a second mounting surface, the second mounting surface being provided with a groove, the groove having a filling material, the filling material being a welding material consistent with the welding pin, and the surface of the filling material in the groove being lower than the second mounting surface; step 2) aligning the welding pin and extending it into the groove; and step 3) heating the welding pin and the filling material in the groove by laser so that the welding pin and the filling material are fused and solidified together after fusion, thereby fixing the first component to the second component.

[0025] Wherein, in the step 1), the first component and the second component are respectively a photosensitive chip and a circuit board; or respectively a filter component and a photosensitive component; or respectively a lens component and a filter component.

[0026] Wherein, the optical component is a multi-camera module, and the multi-camera module includes multiple camera modules and a metal bracket fixing the multiple camera modules together. In the step 1), the first component and the second component are the camera module and the metal bracket respectively.

[0027] Wherein, the step 2) further includes: aligning the welding pin and extending it into the groove so that a preset welding gap is maintained between the first mounting surface and the second mounting surface, and the welding gap is 0.05-0.3 mm.

[0028] Wherein, in step 3), the diameter of the cross-section of the laser beam used for heating is 0.1-0.3 mm, the surface area of ​​the filling material is larger than the spot area of ​​the laser, and the surface area of ​​the filling material is 0.15-0.75 mm 2 .

[0029] Among them, between step 1) and step 2), it also includes: step 1a), when the first component is not arranged at a position close to the second component, pre-irradiating the surface of the filling material of the second component with a laser, so that the surface of the filling material melts or the temperature rises to a temperature close to the melting point; in step 3), the laser is incident on and irradiates the welding pin from the welding gap between the first mounting surface and the second mounting surface, so that the welding pin is partially melted, and at the same time, a part of the heat is conducted to the filling material through the welding pin, so that the filling material that has been pre-irradiated is partially melted, thereby connecting the welding pin and the filling material as one.

[0030] Wherein, in the step 1a), during the pre-irradiation process, the spot coverage area of ​​the laser does not exceed the range of the groove.

[0031] The incident angle of the pre-irradiated laser in step 1a) is greater than the incident angle of the laser in step 3), wherein the incident angle is the angle between the incident direction of the laser and the second mounting surface.

[0032] Compared with the prior art, the present invention has at least one of the following technical effects:

[0033] 1. This application can improve the firmness and stability of the camera module, while making its optical performance more stable.

[0034] 2. This application can solve various problems such as debonding and difficulty in rework caused by glue bonding.

[0035] 3. This application can improve the production yield and production efficiency of camera modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A cross-sectional schematic diagram of a photosensitive component assembled by a welding structure in one embodiment of the present application is shown;

[0037] Figure 2 A cross-sectional schematic diagram of a camera module assembled by a welding structure in one embodiment of the present application is shown;

[0038] Figure 3 A cross-sectional schematic diagram of a camera module with a driving component assembled by a welding structure in one embodiment of the present application is shown;

[0039] Figure 4 A dual-camera module assembled by welding structure in one embodiment of the present application is shown;

[0040] Figure 5 A cross-sectional schematic diagram of a photosensitive component assembled by a welding structure in a modified embodiment of the present application is shown;

[0041] Figure 6 A periscope camera module assembled based on a welding structure in one embodiment of the present application is shown;

[0042] Figure 7 A schematic diagram showing laser irradiation of a welding groove in a pre-irradiation step in one embodiment of the present application is shown;

[0043] Figure 8 A schematic diagram showing a laser irradiation welding structure in step S3 in one embodiment of the present application is shown;

[0044] Fig. 9 The figure shows the positional relationship between the laser spot and the groove in the pre-irradiation step in one embodiment of the present application;

[0045] Fig.10 A schematic diagram showing a welding structure with laser incident at a small angle. DETAILED DESCRIPTION

[0046] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0048] In the drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The drawings are only examples and are not drawn strictly to scale.

[0049] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0050] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those of ordinary skill in the art.

[0051] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this article have the same meaning as commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0052] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0053] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0054] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a photosensitive component assembled by a welding structure in one embodiment of the present application. Figure 1 In this embodiment, the photosensitive component 11 includes a circuit board 2 and a photosensitive chip 1. The photosensitive chip 1 includes a photosensitive element (i.e., an element constituting a photosensitive area) and a non-photosensitive structural area surrounding the photosensitive element. The non-photosensitive structural area can be used to arrange electrodes for data input and output, and the electrodes can be pads (sometimes also called pads). The back side of the photosensitive chip 1 is a first mounting surface 6, and the first mounting surface 6 is provided with a welding pin 3. The upper surface of the circuit board 2 is a second mounting surface 7, and the second mounting surface 7 is provided with a groove 5, and the groove 5 is filled with a welding material consistent with the welding pin 3 (the welding material in the groove 5 is Figure 1 The filling material 4 in the groove 5 is slightly lower than the second mounting surface 7. Further, in one embodiment, the ratio of the depth of the filling material 4 in the groove to the depth of the groove can be 0.75-0.85. The depth of the filling material 4 refers to the distance from the surface of the welding material in the groove 5 to the bottom of the groove 5. In this embodiment, the welding pin 3 and the welding material in the groove 5 can be integrated by laser welding, so that the first mounting surface 6 and the second mounting surface 7 are fixed together, that is, the back side of the photosensitive chip 1 and the upper surface of the circuit board 2 are assembled together. The welding pin 3 and the groove 5 containing the welding material can constitute the welding structure. The welding structure can have multiple ones, so as to improve the reliability of the mechanical connection for assembling the circuit board and the photosensitive chip together.

[0055] Further, Figure 2FIG. 1 is a cross-sectional schematic diagram of a camera module assembled by a welding structure in one embodiment of the present application. Figure 2 This embodiment provides a camera module, which includes a lens assembly 8, a circuit board 2, a photosensitive chip 1, a filter element 9 and a lens base 10. The circuit board 2 can be implemented as a PCB board or a ceramic substrate. The photosensitive chip 1 and the circuit board 2 can be assembled into a photosensitive assembly 11 through a welding structure 12. The specific assembly method can be referred to Figure 1 The corresponding embodiments are not described in detail here. In this embodiment, the filter element 9 (such as a filter) is installed on the lens base 10 to form a filter assembly 13. The bottom surface of the filter assembly 13 can be assembled with the circuit board 2 (that is, with the photosensitive assembly 11) through the welding structure 12. Specifically, the bottom surface of the lens base 10 can be used as a first mounting surface, and the welding pins can be arranged on the first mounting surface. The upper surface of the circuit board 2 can be used as a second mounting surface, and the welding grooves can be arranged on the second mounting surface. There can be multiple pairs of welding pins and grooves, and they are arranged one by one. Through laser welding, the welding pins and the welding materials in the grooves can be integrated, so that the first mounting surface and the second mounting surface are assembled together, that is, the photosensitive assembly 11 and the bottom surface of the lens base 10 are assembled together. Further, in this embodiment, the top surface of the lens base 10 can be assembled with the lens assembly 8 through the welding structure 12. The lens assembly 8 may include a lens barrel 14 and at least one lens 15 installed in the lens barrel 14. The bottom surface of the lens assembly 8 (e.g., the bottom surface of the lens barrel) may be used as a first mounting surface, and welding pins may be arranged on the first mounting surface. The top surface of the lens base 10 of the filter assembly 13 may be used as the second mounting surface, and welding grooves may be arranged on the second mounting surface. There may be multiple pairs of welding pins and grooves, and they may be arranged one by one. By laser welding, the welding pins and the welding materials in the grooves may be integrated, so that the first mounting surface and the second mounting surface are assembled together, that is, the top surface of the lens base 10 of the filter assembly 13 and the bottom surface of the lens assembly 8 are assembled together. In this embodiment, the assembly of multiple components containing optical elements is involved. Among them, the optical element may be understood as a lens, a filter element, or a photosensitive element arranged in a photosensitive path. In this embodiment, the components containing optical elements are assembled together by welding structure 12 to replace the traditional assembly method based on glue bonding, which can effectively improve the reliability of the mechanical connection of the camera module and better ensure that the optical performance of the camera module is not negatively affected by the expansion of glue. Furthermore, using welding structure instead of glue can also solve various problems such as debonding and difficulty in rework caused by glue bonding, and improve the production yield and production efficiency of the camera module.

[0056] Specifically, in the prior art, conventional camera modules are often fixed together by gluing, but there are some problems with using glue. The coefficient of thermal expansion (CTE) of glue is large. When the temperature changes greatly, the expansion degree and expansion speed are large, and deformation is easy to occur. During the baking and curing process, the temperature changes significantly. After the glue is deformed by heat, the hardness increases after cooling and curing. For example, when the lens assembly is connected to the lens holder by glue, and the lens holder is connected to the circuit board by glue, due to certain deformation during the glue curing process, the actual thickness of the glue may be unevenly distributed, resulting in low surface flatness. When the lens assembly or the lens base is pasted, the lens module is prone to tilt, causing light path deflection. On the other hand, the low surface flatness of the glue is also prone to problems such as loose bonding, which can easily reduce the production yield. At the same time, the resolution of the camera module is more sensitive to changes in the thickness of the glue, and the thickness change caused by the deformation of the glue will cause the problem of back focus offset. For another example, in the prior art, the photosensitive chip and the circuit board are usually connected with glue, and the coefficients of thermal expansion (CTE) of the photosensitive chip, the circuit board and the glue are quite different. When the ambient temperature changes, the three will deform to different degrees. During the manufacturing process, the ambient temperature will change many times, which will cause the glue to deform and squeeze the photosensitive chip. At the same time, the expansion degree of the circuit board is large, and the hardness of the glue cooling and curing is large, resulting in the stress generated by the deformation of the circuit board and the stress generated by the deformation of the glue being transmitted to the photosensitive chip together. Therefore, the photosensitive chip is easily deformed by external forces, resulting in excessive field curvature of the camera module. In the above embodiment of the present invention, the lens assembly can be welded to the lens base, the lens base can be welded to the circuit board, and the photosensitive chip can be welded to the circuit board. After welding is completed, the lens of the lens assembly and the filter element are sequentially arranged in the photosensitive path of the photosensitive chip. On this photosensitive path, since each element is connected based on a welding structure, various problems caused by glue bonding can be avoided, thereby avoiding the relative position between the optical elements from being misaligned or deviated due to the expansion and deformation of the glue, thereby effectively ensuring the optical performance of the camera module during assembly and use.

[0057] Furthermore, in the above embodiment, since the camera module is a miniature component, laser welding can be used as the welding method. Laser welding is an efficient and precise welding method that uses a high-energy-density laser beam as a heat source. In the present invention, the laser welding process is of a heat conduction type, that is, the laser radiation heats the surface of the workpiece, and the surface heat diffuses to the inside through heat conduction. By controlling the width, energy, peak power and repetition frequency of the laser pulse and other parameters, the welding workpiece (i.e., the workpiece composed of the welding material) is melted to form a specific molten pool. With laser welding, the heat-affected zone is small, the deformation is small, the welding space is limited, the range of weldable materials is large, small and closely spaced components can be welded, and automatic high-speed welding is easy, etc., so it is particularly suitable for the assembly of camera modules.

[0058] Furthermore, in one embodiment of the present application, the welding structure includes a welding pin and a corresponding groove, the depth of the groove can be much lower than the height of the component, the material of the welding pin is a multi-component alloy with a low thermal conductivity, the groove can be filled with an alloy of the same material as the welding pin, and the height of the surface of the filled alloy can be slightly lower than the top surface of the component to be welded (for example, the second component with the second mounting surface described above), and after laser welding, the welding pin and the alloy in the groove are welded together to achieve a fixed connection between the two. The multi-component alloy can be Sn-3.0Ag-0.5Cu, binary alloy Sn-Bi, Sn-58Bi, Sn-29Bi-0.5Cu (SBC2905), etc. On the other hand, in this embodiment, the connection between the welding pin and the corresponding groove can be dedicated to mechanical connection, that is, the two do not need to be electrically connected. In this way, the reliability of the mechanical connection between the welding pin and the corresponding groove can be better improved, while avoiding the problems caused by glue bonding. In this embodiment, when the ratio of the depth of the groove to the height of the second component is not greater than 0.25, it can be considered that the depth of the groove is much lower than the height of the component. Here, the height of the component is the dimension of the component (e.g., the second component) in the normal direction of its mounting surface (e.g., the second mounting surface).

[0059] Still reference Figure 1 In one embodiment of the present application, when welding the photosensitive chip 1 and the circuit board 2, a plurality of welding pins 3 are selectively arranged at the bottom of the photosensitive chip 1, and grooves 5 corresponding to the welding pins 3 on the photosensitive chip 2 are arranged on the board surface (i.e., the second mounting surface 7) of the circuit board 2. The depth of the groove 5 is much lower than the height of the circuit board 2 (when the ratio of the depth of the groove 5 to the height of the circuit board 2 is not greater than 0.25, it can be regarded that the depth of the groove 5 is much lower than the height of the circuit board 2). The groove 5 is filled with the same metal as the welding pin 3, and the height of the upper surface of the filled metal (i.e., the filling material 4) is slightly lower than the board surface (i.e., the second mounting surface 7) of the circuit board 2. After laser welding, through the interaction between the laser and the metal, the metal absorbs the laser and converts it into heat energy, causing the metal to melt and then cool and crystallize, so that the welding pins at the bottom of the photosensitive chip 1 are welded to the metal in the groove 5 of the circuit board 2, so that the photosensitive chip 1 and the circuit board 2 can be fixedly connected. In this embodiment, in order to achieve better conduction between the photosensitive chip 1 and the circuit board 2, after welding, gold wires are still needed to electrically connect the photosensitive chip 1 and the circuit board 2, that is, electrical conduction between the photosensitive chip 1 and the circuit board 2 is achieved through wire bonding.

[0060] In one embodiment of the present application, when welding the lens module and the lens base, a plurality of welding pins are selectively provided at the bottom of the lens module, and the upper surface of the lens base is provided with grooves corresponding to the welding pins of the lens module one by one, and the depth of the grooves is much lower than the height of the lens base, and the grooves are filled with a metal of the same material as the welding pins, and the height of the filled metal is slightly lower than the top surface of the lens base. After laser welding, the welding pins at the bottom of the lens module are welded together with the metal in the grooves on the upper surface of the lens base.

[0061] In one embodiment of the present application, when welding the lens base and the circuit board, a plurality of welding pins are selectively provided at the bottom of the lens base, and grooves corresponding to the welding pins on the lens base are provided on the upper surface of the circuit board, and the depth of the grooves is much lower than the height of the circuit board. The grooves are filled with a metal of the same material as the welding pins, and the height of the filled metal is slightly lower than the board surface of the circuit board. After laser welding, the welding pins at the bottom of the lens base are welded together with the metal in the grooves on the upper surface of the circuit board.

[0062] In the above embodiment, since the photosensitive chip, circuit board, lens base, and lens module have different sizes and weights, the number of welding pins and the depth of the corresponding grooves should be reasonably selected according to the actual situation during welding. On the basis of ensuring the firmness of the connection between each component, the least raw materials should be used for welding, which saves costs and is beneficial to the environment.

[0063] In the above embodiment, a groove is provided on the second mounting surface, in which welding material is filled and the surface of the welding material is lower than the surface of the second component to be assembled, and the material filled with the welding pin and the groove is the same welding material. This design can, on the one hand, make the welding structure provided on the first mounting surface and the second mounting surface more firmly integrated together, and on the other hand, can also make the liquid welding material formed after the welding pin is partially melted during the welding process to be accommodated or partially accommodated in the groove, thereby avoiding the increase in the height of the camera module (or optical component) caused by the thickness of the connecting material itself, and also can avoid the liquid welding material overflowing to both sides and contaminating the optical element, causing the problem of spots on the captured image.

[0064] Further, Figure 3 FIG. 1 is a cross-sectional schematic diagram of a camera module with a driving component assembled by a welding structure in one embodiment of the present application. Figure 3In this embodiment, the camera module includes a driving component 16 (such as a motor), and the bottom surface of the housing of the driving component 16 (i.e., the motor) may be provided with a plurality of welding pins, and a groove corresponding to the welding pins is provided on the lens base 10, and the groove is filled with a metal of the same material as the welding pin, and the height of the filled metal is slightly lower than the top surface of the lens base. In this embodiment, the driving component and the lens base can be welded together by laser welding. When the driving component 16 is a motor, the motor may have a housing and a carrier, and the carrier may move relative to the housing under the drive of the driving element. The optical lens may be installed in the motor carrier. The optical lens may include a lens barrel 14 and at least one lens 15 installed in the lens barrel 14. The bottom surface of the motor (i.e., the bottom surface of the motor housing) may be used as the first mounting surface, and the welding pins may be provided on the first mounting surface. The top surface of the lens base 10 may be used as the second mounting surface, and the welding groove may be provided on the second mounting surface.

[0065] Furthermore, the welding structure of the present invention can also be used in a multi-camera module. Taking a dual-camera module as an example, Figure 4 FIG. 1 shows a dual-camera module assembled by welding structure in one embodiment of the present application. Figure 4 In this embodiment, the dual-camera module includes a first camera module 17, a second camera module 18 and a metal bracket 19. The first camera module 17 and the second camera module 18 may both include a lens assembly, a filter assembly and a photosensitive assembly. The lens assembly may include an optical lens and a driving component. The driving component has a plurality of metal welding pins, at least a portion of which is arranged on the side of the driving component, and a plurality of metal pins are also arranged on the side of the photosensitive assembly connected to the metal bracket 19. A plurality of grooves corresponding to the metal welding pins are processed on the inner side surface of the metal bracket 19 connected to the camera module, and the depth of the groove is much lower than the thickness of the metal bracket (here, the thickness is the size of the plate 19a constituting the metal bracket in the normal direction of its second mounting surface 7). The groove is filled with a metal of the same material as the metal welding pin, and the surface of the filled metal (i.e., the filling material) is slightly lower than the second mounting surface of the metal bracket 19 (i.e., the inner side surface of the plate constituting the metal bracket). After laser welding, the welding pins of the driving component are welded to the metal in the groove on the inner surface of the metal bracket 9, and the welding pins of the photosensitive component are also welded to the metal in the groove on the inner surface of the metal bracket 9 (i.e., the second mounting surface), thereby fixing the first camera module 17 and the second camera module 18 together through the metal bracket 9. Figure 4In this embodiment, the metal bracket 19 has two accommodating holes, and the first camera module 17 and the second camera module 18 are respectively installed in one accommodating hole of the metal bracket 19 through the welding structure 12. The welding structure 12 can be set on the outer side surface of the lens assembly and the inner side surface of the metal bracket 19, or on the outer side surface of the photosensitive assembly and the inner side surface of the metal bracket 19, or on the outer side surface of the filter assembly and the inner side surface of the metal bracket 19. The inner side surface of the metal bracket is the inner side surface of the plate material constituting the metal bracket, that is, the surface of the metal bracket 19 forming the accommodating hole.

[0066] Further, Figure 5 A cross-sectional schematic diagram of a photosensitive component assembled by a welding structure in a modified embodiment of the present application is shown. Figure 5 In this embodiment, the welding structure may include a welding pin 3 and a welding pad 20. The welding pad 20 is arranged at a position corresponding to the welding pin 3. The welding pin 3 and the welding pad 20 are made of the same material, which is also a metal with a low thermal conductivity such as iron and lead. This can prevent the high thermal conductivity metal material from being changed by the laser, resulting in a decrease in welding performance (for example, welding cracks). After laser welding, the welding pin 3 and the welding pad 20 are welded together, which can achieve the two (for example, the photosensitive chip 1 and the circuit board 2, such as Figure 5 Fixed connections and electrical connections as shown).

[0067] Furthermore, in some embodiments of the present application, the welding material of the welding structure may also be plastic. For example, PMMA plastic, PC plastic, ABS plastic and other thermoplastic plastics. The basic principle of plastic laser welding is similar to that of metal laser welding. During the welding process, the light beam generated by the laser is focused on the area to be welded to form a heat action zone. The plastic in the heat action zone is melted. In the subsequent solidification process, the melted material forms a joint, and the parts to be welded are connected through the solidified joint.

[0068] In laser welding of metal materials, YAG laser or CO2 laser is generally used as the light source. Since plastic laser welding does not require high light source power, but has high requirements for controllability and ease of operation, semiconductor laser can be used. In one embodiment of the present application, the welding structure can use plastic containing light absorber as welding material. The absorber can be carbon black, which can absorb almost all laser energy of infrared wavelength, thereby greatly improving the heat absorption effect of plastic, making the material in the heat action zone melt faster and more effectively. There are three ways to add absorbent: one is to directly infiltrate the absorbent into the material to be welded, the second is to infiltrate the absorbent into the surface of the plastic to be welded, and the third is to spray or print the absorbent at the contact point of the plastic parts to be welded. The comprehensive advantages of plastic laser welding include: fast speed; high welding accuracy; convenient welding machine automation and precision CNC; relatively low cost, etc.

[0069] Furthermore, the welding structure of the present invention can also be used for assembling a periscope camera module. Figure 6 The figure shows a periscope camera module assembled based on a welding structure in one embodiment of the present application. Figure 6In this embodiment, the periscope camera module includes a light redirection mechanism 21, a lens assembly 8, a filter assembly 13 and a photosensitive assembly 11, wherein the lens assembly 8 includes an optical lens and a driving component 25 for driving the optical lens to move. The filter assembly 13 may include a lens base 10 and a filter 9. The photosensitive assembly 11 may include a photosensitive chip 1 and a second circuit board 23. The light redirection mechanism 21 may include a reflective prism that can deflect the incident light by about 90 degrees. A first circuit board 22 may be provided on the side of the lens assembly 8, and a second circuit board 23 may be provided at the photosensitive chip 1; a bent flexible circuit board 24 is connected between the first circuit board 22 and the second circuit board 23, and a plurality of metal welding pins are symmetrically provided at both ends of the flexible circuit board 24. A plurality of grooves may be provided on the mounting surfaces corresponding to the first circuit board 22 and the second circuit board 23, and the depth of the grooves is much lower than the height (i.e., thickness) of the first circuit board 22 and the second circuit board 23. The grooves are filled with metal of the same material as the metal welding pins, and the height of the filled metal (i.e., the surface height of the filling material) is slightly lower than the board surface of the first circuit board 22 and the second circuit board 23 (i.e., the mounting surfaces of the first circuit board 22 and the second circuit board 23 respectively). After laser welding, the welding pins of the flexible circuit board 24 are welded together with the metal in the corresponding grooves of the first circuit board 22 and the second circuit board 23. The lens assembly 8 includes an optical lens and a driving component 25 (such as a driving motor). The bottom surface of the driving component 25 (referring to the mounting surface connected to the first circuit board) may have a plurality of metal welding pins. A plurality of grooves corresponding to the metal welding pins are processed on the surface of the first circuit board connected to the lens assembly. The depth of the grooves is much lower than the height of the first circuit board. The grooves are filled with metal of the same material as the metal welding pins. The height of the filled metal is slightly lower than the board surface of the first circuit board (i.e., the mounting surface of the first circuit board). After laser welding, the welding pins of the driving component 25 are welded to the metal in the grooves of the first circuit board 22. Similarly, a plurality of welding pins are selectively arranged at the bottom of the photosensitive chip 1, and grooves corresponding to the welding pins on the photosensitive chip 1 are arranged on the surface of the second circuit board 23 (i.e., the mounting surface of the second circuit board), and the depth of the grooves is much lower than the height of the second circuit board 23. The grooves are filled with a metal having the same material as that of the welding pins, and the height of the filled metal is slightly lower than the surface of the second circuit board 23 (i.e., the mounting surface of the second circuit board). After laser welding, the welding pins on the back side of the photosensitive chip (to the side facing away from the photosensitive side) are welded together with the metal in the grooves of the second circuit board 23.To sum up, in this embodiment, the lens assembly 8 and the first circuit board 22, the first circuit board 22 and the flexible circuit board 24, the second circuit board 23 and the flexible circuit board 24, and the photosensitive chip 1 and the second circuit board 23 can all be connected through the welding structure 12 (the connection here refers to the structural connection and fixation, which may not include electrical connection).

[0070] Furthermore, the present application also provides a camera module assembly method, which includes the following steps.

[0071] Step S1, metal welding pins are set on the lens assembly, lens base and the bottom of the photosensitive chip. The material of the welding pins can be a metal with low thermal conductivity such as iron and lead. The lens assembly, lens base and photosensitive chip with welding pins can be called the first component, and the first component needs to be installed together with the second component. The first component has a first mounting surface, and the second component has a second mounting surface, and the first mounting surface matches the second mounting surface.

[0072] Step S2, processing grooves corresponding to the welding pins on the upper surface of the lens base and the circuit board, the depth of the grooves is much lower than the height of the component. The component here refers to the second component with a second mounting surface.

[0073] Step S3, filling the groove with a metal that is the same as the material of the welding pin, and the height of the filled metal is slightly lower than the top surface height of the component (referring to the second component).

[0074] Step S4, selecting appropriate power density, laser pulse energy and width, and using laser welding to weld the lens assembly and lens base, the photosensitive chip and the circuit board, and the lens base and the circuit board together to form a camera module.

[0075] Furthermore, the present application also provides an optical component assembly method, which includes the following steps.

[0076] Step S10, prepare a first component and a second component separated from each other, at least one of the first component and the second component includes an optical element, the optical element includes a lens, a filter element or a photosensitive element arranged in a light-sensitive path; the first component has a first mounting surface, the first mounting surface is provided with a welding pin, the second component has a second mounting surface, the second mounting surface is provided with a groove, the groove has a filling material, the filling material is a welding material consistent with the welding pin, and the surface of the filling material in the groove is lower than the second mounting surface.

[0077] Step S20, aligning the welding pin and extending it into the groove.

[0078] Step S30 , heating the welding pin and the filling material in the groove by laser, so that the welding pin and the filling material are fused and solidified together after fusion, thereby fixing the first component to the second component.

[0079] Among them, the first component and the second component are respectively a photosensitive chip and a circuit board; or respectively a filter component and a photosensitive component; or respectively a lens component and a filter component.

[0080] Furthermore, in another embodiment of the present application, the optical component is a multi-camera module, and the multi-camera module includes multiple camera modules and a metal bracket that fixes the multiple camera modules together, and the first component and the second component are the camera module and the metal bracket, respectively. Specifically, the metal bracket may have multiple accommodating holes, and a camera module is installed in each accommodating hole. At least one (it can be multiple or one) camera module is installed in the corresponding accommodating hole of the metal bracket through the welding structure. The metal bracket can be a belt-type or a closed type. The top of the belt-type metal bracket does not have a supporting surface for supporting the camera module, while the top of the closed metal bracket has a supporting surface for supporting the camera module, thereby forming a closed structure at the top. In this embodiment, whether it is a belt-type metal bracket or a closed metal bracket, the welding structure is arranged on the side of the metal bracket.

[0081] Furthermore, in one embodiment of the present application, the step S20 may further include: aligning the welding pin and extending it into the groove so that a preset welding gap is maintained between the first mounting surface and the second mounting surface, and the welding gap is 0.05-0.3 mm. The welding gap is also a welding channel for laser incidence during welding. Figure 2 , Figure 3 and Figure 4 In the figure, a welding channel 12a of a part of the welding structure is marked. Preferably, the welding gap can be 0.15mm.

[0082] Further, in one embodiment of the present application, in step S30, the cross-sectional diameter of the laser beam used for heating is 0.1-0.3 mm (here, the cross-sectional diameter of the laser beam can be understood as the beam waist diameter of the laser beam), and the cross-sectional area of ​​the laser beam can be 0.03-0.27 mm 2 The surface area of ​​the filling material can be 0.15-0.75mm 2 Preferably, the spot diameter of the laser can be 0.2 mm, and the surface area of ​​the filling material can be 0.5 mm 2 .

[0083] A preset welding gap is maintained between the first mounting surface and the second mounting surface, and the welding gap is 0.05-0.3 mm. This welding gap can serve as a laser channel allowing the laser beam to pass through. The laser beam can irradiate the filling material in the welding groove at a certain oblique angle, and the laser spot formed on the surface of the filling material can be elliptical. A part of the laser beam can also irradiate the welding pin, so that the welding pin and the filling material are partially melted. After the melted welding material solidifies again, the welding pin and the filling material in the groove are connected as a whole, thereby realizing the welding fixation between the first mounting surface and the second mounting surface.

[0084] Furthermore, in one embodiment of the present application, a method for welding and fixing a first component and a second component by secondary laser irradiation is provided. In this embodiment, between step S1 and step S2, step S1a is also included.

[0085] Step S1a, when the first component is far away from the second component, pre-irradiate the surface of the filling material of the second component with laser, so that the surface of the filling material melts or the temperature rises to a temperature close to the melting point. Figure 7 FIG. 1 is a schematic diagram showing a laser irradiation welding groove in a pre-irradiation step in an embodiment of the present application. Figure 7 During the pre-irradiation process, the first component is far from the position of the second component, that is, the first component has not been arranged above the second component, or the first component is far away from the second component, so that the laser 26 can be incident on the surface of the welding material in the groove 5 at a nearly vertical angle. Further, in the step S3, the laser is incident and irradiated on the welding pin from the welding gap between the first mounting surface and the second mounting surface, so that the welding pin is partially melted, and at the same time, a part of the heat is conducted to the filling material through the welding pin, so that the filling material after pre-irradiation is partially melted, thereby connecting the welding pin and the filling material as a whole. Figure 8 A schematic diagram of the laser irradiation welding structure in step S3 in one embodiment of the present application is shown. In step S3, the first component 1 has been arranged close to the second component 2, and only a narrow welding gap (welding gap is about 0.05-0.3mm) is left between the two. At this time, the welding laser 26 can only be incident at an angle close to the horizontal (that is, the incident laser is close to parallel to the second mounting surface).

[0086] Further, in one embodiment of the present application, the incident angle of the pre-irradiated laser in step S1a is much greater than the incident angle of the laser in step S3, wherein the incident angle is the angle between the incident direction of the laser and the second mounting surface. Figure 7 and Figure 8In step S1a, the incident angle of the laser can be close to vertical, while in step S3, the incident angle of the laser is almost zero (its incident angle can be, for example, about 1°).

[0087] Furthermore, in one embodiment of the present application, in the step S1a, during the pre-irradiation process, the spot coverage area of ​​the laser does not exceed the range of the groove. Fig. 9 The figure shows the positional relationship between the laser spot and the groove in the pre-irradiation step in one embodiment of the present application. During the pre-irradiation process, the first component is far away from the second component, that is, the first component has not been arranged above the second component, or the first component is far away from the second component, so that the laser can be incident on the surface of the welding material in the groove 5 at a nearly vertical angle. Therefore, as long as the cross-sectional size of the laser beam is reasonably designed, it can be ensured that the coverage area of ​​the laser spot 26a does not exceed the range of the groove 5.

[0088] When performing laser welding, the laser channel is often very narrow (for example, the welding gap may be only 0.05-0.3mm), which means that the laser often has to be incident at a very small angle to the position to be welded. In this application, the welding point position (the contact position between the welding pin and the filling material) is usually located in the groove, which may cause many hidden dangers and is not conducive to improving production efficiency and production yield. First, the energy loss is large, which is not conducive to improving production efficiency. Fig.10 A schematic diagram showing the welding structure of laser at a small angle. Fig.10 It can be seen that due to the extremely small incident angle of the laser, the light spot 26a irradiated by the laser to the groove is in the shape of a long and narrow ellipse, and only part of the energy can be irradiated to the surface of the welding material in the groove 5, resulting in a large energy loss. Second, too small an incident angle may cause the shape of the laser spot to become long and narrow, making it difficult to limit the spot within the range of the groove, which may cause certain damage to the structural parts of the second component to be welded and the first component. Third, too small an incident angle may cause the energy received by the welding pin to be much higher than the energy received by the pad. When the energy provided by the laser is large, the welding pin may melt excessively and break or leave hidden dangers of breakage. When the energy provided by the laser is small, it may cause the connection reliability and firmness of the contact position between the welding pin and the filling material to decrease. Fourth, too small an incident angle may make it difficult to evenly distribute the laser energy to the surface of the pad (i.e., the filling material) in the groove, which may lead to a decrease in product consistency and is not conducive to improving product yield. In the above embodiment, before moving the first part to its welding position, the pad in the groove of the second part is first laser preheated, which can effectively utilize laser energy and improve welding efficiency; avoid laser damage to non-welding positions; avoid welding pins breaking or leaving hidden dangers of breaking during secondary irradiation; and also help to improve product consistency.

[0089] It should be noted that when the welding material is plastic, such as PMMA plastic, PC plastic or ABS plastic, the welding pin and the filling material in the groove can also be connected together by ultrasonic heating (that is, ultrasonic addition is used instead of laser heating to achieve welding fixation between the first mounting surface and the second mounting surface).

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that any modification or equivalent replacement of the technical solutions of the present invention does not depart from the spirit and scope of the technical solutions of the present invention and should be included in the scope of the claims of the present invention.

Claims

1. An optical component, characterized in that: include: At least two components connected together by a welding structure, at least one of the at least two components comprises an optical element, and the optical element comprises a lens, a filter element or a photosensitive element arranged in a light sensing path; The at least two components include a first component having a first mounting surface and a second component having a second mounting surface, the welding structure includes a welding pin disposed on the first mounting surface and a groove disposed on the second mounting surface, the groove has a filling material, the filling material is a welding material consistent with the welding pin, and the surface of the filling material in the groove is lower than the second mounting surface; In the second component, the groove is open on the front side, and its back side and side sides are closed; The front side is a side facing the first component, and the back side is a side facing away from the first component; the opening of the groove is shielded by the first component, and the welding pin is located below the first mounting surface and points to the second mounting surface, and a preset welding gap is maintained between the first mounting surface and the second mounting surface; The welding structure is formed according to the following method: first, when the first component is far away from the second component, the surface of the filling material of the second component is pre-irradiated with a laser, so that the surface of the filling material melts or the temperature rises to a temperature close to the melting point, wherein the pre-irradiated light spot coverage area does not exceed the range of the groove; then, the welding pin is aligned and extended into the groove, so that a preset welding gap is maintained between the first mounting surface and the second mounting surface; finally, the laser is incident on and irradiated to the welding pin from the welding gap between the first mounting surface and the second mounting surface, and a part of the heat is conducted to the filling material through the welding pin, so that the pre-irradiated filling material is partially melted, thereby connecting the welding pin and the filling material as a whole.

2. The optical component according to claim 1, characterized in that The thermal conductivity of the solder material is lower than 100 W / mK.

3. The optical component according to claim 1, characterized in that The first component is a photosensitive chip, the photosensitive chip includes the photosensitive element and a non-photosensitive structure area surrounding the photosensitive element, and the first mounting surface is the back side of the photosensitive chip; The second component is a circuit board, and the second mounting surface is an upper surface of the circuit board.

4. The optical component according to claim 1, characterized in that The first component is a filter assembly, the filter assembly includes a lens base and the filter element mounted on the lens base, and the first mounting surface is the bottom surface of the lens base; The second component is a photosensitive component, which includes a circuit board and a photosensitive chip installed on the circuit board, and the second mounting surface is the upper surface of the circuit board.

5. The optical component according to claim 1, characterized in that The first component is a lens assembly, the lens assembly includes a lens barrel and at least one lens installed in the lens barrel, and the first mounting surface is the bottom surface of the lens assembly; The second component is a filter assembly, which includes a lens base and the filter element installed on the lens base, and the second mounting surface is the top surface of the lens base; the lens base is molded separately and installed on the circuit board, or the lens base is a molded lens base directly molded on the surface of the circuit board through a molding process.

6. The optical component according to claim 1, characterized in that The first component is a lens assembly, which includes a motor, a lens barrel, and at least one lens installed in the lens barrel, the lens barrel is installed in a carrier of the motor, and the first mounting surface is a bottom surface of the motor; The second component is a filter assembly, which includes a lens base and the filter element installed on the lens base, and the second mounting surface is the top surface of the lens base.

7. The optical component according to claim 1, characterized in that The optical component is a multi-camera module, the first component is a camera module, and the first mounting surface is an outer surface of the camera module; The second component is a multi-camera bracket, which includes at least one accommodating hole for accommodating the camera module, and the second mounting surface is the inner side surface of the multi-camera bracket forming the accommodating hole.

8. The optical component according to claim 1, characterized in that The welding material is a welding material composed of a multi-component alloy.

9. The optical component according to claim 1, characterized in that: The welding material is thermoplastic.

10. The optical component according to claim 9, characterized in that The welding material is PMMA plastic, PC plastic or ABS plastic, and the welding pin and the filling material in the groove are connected as one by laser heating.

11. The optical component according to claim 1, characterized in that The ratio of the depth of the filling material in the groove to the depth of the groove is 0.75-0.

85.

12. The optical component according to claim 10, characterized in that The thermoplastic has a light absorber mixed therein.

13. The optical component according to claim 1, characterized in that The ratio of the depth of the groove to the height of the second component is not greater than 0.25; wherein the height of the second component is the dimension of the second component in the normal direction of the second mounting surface.

14. The optical component according to claim 1, characterized in that The optical component is a camera module, and the camera module also includes at least two components connected together by a groove-free welding structure; The at least two components connected together by the grooveless welding structure include a third component having a third mounting surface and a fourth component having a fourth mounting surface; the grooveless welding structure includes a welding pin arranged on the first mounting surface and a welding pad arranged on the second mounting surface, and the manufacturing material of the welding pad is consistent with that of the welding pin.

15. The optical component according to claim 3, characterized in that The circuit board is a PCB board or a ceramic substrate.

16. The optical component according to claim 1, characterized in that At least one of the at least two components has a circuit structure, and the welding pin or the welding material filled in the groove is electrically separated from the circuit structure.

17. The optical component according to claim 3, characterized in that The circuit board and the photosensitive chip are electrically connected through a wire bonding process.

18. An optical component assembly method, characterized in that: include: Step 1) preparing a first component and a second component separated from each other, at least one of the first component and the second component comprises an optical element, the optical element comprises a lens, a filter element or a photosensitive element arranged in a light sensing path; the first component has a first mounting surface, the first mounting surface is provided with a welding pin, the second component has a second mounting surface, the second mounting surface is provided with a groove, the groove has a filling material, the filling material is a welding material consistent with the welding pin, and the surface of the filling material in the groove is lower than the second mounting surface; in the second component, the groove is open on the front side, and its back side and side sides are closed; The front side is a side facing the first component, and the back side is a side facing away from the first component; When the first component is not arranged to a position close to the second component, pre-irradiating the surface of the filling material of the second component with a laser, so that the surface of the filling material melts or the temperature rises to a temperature close to the melting point, wherein the pre-irradiated light spot covers an area not exceeding the range of the groove; Step 2) aligning the welding pin and extending it into the groove so that the opening of the groove is shielded by the first component, wherein the welding pin is located below the first mounting surface and points to the second mounting surface, and a preset welding gap is maintained between the first mounting surface and the second mounting surface; as well as Step 3) The laser is incident on the welding gap between the first mounting surface and the second mounting surface and irradiates the welding pin, so that the welding pin is partially melted, and at the same time, a part of the heat is conducted to the filling material through the welding pin, so that the filling material that has been pre-irradiated is partially melted, thereby connecting the welding pin and the filling material as a whole, and then fixing the first component to the second component.

19. The optical component assembly method according to claim 18, characterized in that: In the step 1), the first component and the second component are respectively a photosensitive chip and a circuit board; or respectively a filter component and a photosensitive component; or respectively a lens component and a filter component.

20. The optical component assembly method according to claim 18, characterized in that: The optical component is a multi-camera module, which includes multiple camera modules and a metal bracket that fixes the multiple camera modules together. In step 1), the first component and the second component are the camera module and the metal bracket, respectively.

21. The optical component assembly method according to claim 18, characterized in that: The step 2) also includes: the welding gap is 0.05-0.3 mm.

22. The optical component assembly method according to claim 18, characterized in that: In step 3), the diameter of the cross-section of the laser beam is 0.1-0.3 mm, the surface area of ​​the filling material is larger than the spot area of ​​the laser, and the surface area of ​​the filling material is 0.15-0.75 mm 2 .

23. The optical component assembly method according to claim 18, characterized in that: The incident angle of the pre-irradiated laser in step 1) is greater than the incident angle of the laser in step 3), wherein the incident angle is the angle between the incident direction of the laser and the second mounting surface.

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