A semiconductor sensor reverse packaging process

Abstract

The present invention provides a semiconductor sensor reverse packaging process. The semiconductor sensor reverse packaging process includes reverse packaging pins, reverse packaging base islands, reverse packaging chips, and reverse packaging plastic sleeves, and includes the following steps: S1 preferentially aligns the reverse packaging chip with the connection surface of the reverse packaging base island; S2 solders the circuit end of the reverse packaging chip to the circuit end of the reverse packaging base island; S3 fixes the top of the reverse packaging base island in the reverse concave structure of the pin. The semiconductor sensor reverse packaging process provided by the present invention has the characteristics of reverse molding during plastic packaging of components, and structurally keeps the semiconductor sensor chip at the bottom position of the frame, so that after the semiconductor chip in the plastic package enters the ceramic substrate, the sensor part is still in the front direction of the overall module to realize the function of the sensor. At the same time, the reverse packaging process can realize the normal line signal connection between sensor components and other general PCB circuit boards, and will not be affected by interference from other external signals.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a reverse packaging process for a semiconductor sensor. Background Art

[0002] Chips are an important component of semiconductor devices. During the processing of semiconductors, the semiconductor chip and the carrier need to be welded to form a stable connection. The lead is the output end of the semiconductor chip information. After the semiconductor chip is welded, the two leads of the semiconductor need to be welded. After welding, the chip needs to be packaged.

[0003] At present, the electronic components of the patch products use semiconductor chips on the top of the base island and the pins. Figure 1 As shown, the Hall sensor is different from the general PCB front SMT patch process. It is necessary to embed the components into the pits of the ceramic substrate, and the sensor semiconductor chip in the component package needs to be in the direction of the base island and the bottom of the pin to realize its sensor function normally.

[0004] Therefore, it is necessary to provide a semiconductor sensor reverse packaging process to solve the above technical problems. Summary of the invention

[0005] The invention provides a semiconductor sensor reverse packaging process, which solves the problem that it is inconvenient to embed components into a pit of a ceramic substrate in the conventional semiconductor chip at the top of the base island and the pin.

[0006] In order to solve the above technical problems, the semiconductor sensor reverse packaging process provided by the present invention includes reverse packaging pins, reverse packaging base islands, reverse packaging chips, and reverse packaging plastic sleeves, and includes the following steps:

[0007] S1 preferentially aligns the reverse sealing chip with the connection surface of the reverse sealing base island;

[0008] S2 solders the circuit end of the reverse encapsulation chip to the circuit end of the reverse encapsulation base island;

[0009] S3 fixes the top of the anti-sealing base island in the reverse concave structure of the pin, and connects the output end of the anti-sealing base island to the input end of the anti-sealing pin by soldering;

[0010] S4 reversely plastic-seales the assembled reverse-sealed chip and the outer sides of the reverse-sealed base island to form a reverse-sealed plastic sleeve.

[0011] Preferably, the reverse encapsulation base island and the reverse encapsulation chip are located below the reverse encapsulation pins to form a reverse encapsulation structure.

[0012] Preferably, the output end of the reverse sealing pin is located outside the reverse sealing plastic sleeve, and the bottom end of the reverse sealing pin is located below the bottom of the reverse sealing plastic sleeve.

[0013] Preferably, the semiconductor sensor needs to use a material leveling device to evenly spread the soldering raw materials during soldering packaging, and the material leveling device includes a material leveling plate, a material storage slot is provided on the material leveling plate, and an adjustment slot, a telescopic slot, a positioning slot, a connecting hole, a contraction slot and a linkage slot are respectively provided on the material leveling plate; a hexagonal nut, the hexagonal nut is arranged inside the adjusting slot, the bottom end of the hexagonal nut is fixedly connected with an adjusting screw shaft, the surface of the adjusting screw shaft is threadedly connected with a lifting frame, one side of the lifting frame is fixedly connected with a positioning pointer, and the positioning pointer A positioning ruler plate is fixedly connected to the inner wall of the groove; a telescopic tube, the outer surface of which is fixed to the inner side of the lifting frame; a linkage plate, the surface of which is slidably connected to the inner wall of the linkage groove, a linkage shaft is fixedly connected to the bottom of the linkage plate, a tightening spring is sleeved on the outer surface of the linkage shaft, and a support frame is fixedly connected to the bottom of the linkage shaft; a sealing baffle, the sealing baffle is sleeved on the inner side of the support frame, the surface of the sealing baffle is slidably connected to the bottom of the telescopic tube; a linkage frame, the linkage frame is sleeved on the outer side of the sealing baffle.

[0014] Preferably, the expansion slot and the positioning slot are both located at the bottom of the material balancing plate, and the expansion slot is communicated with the interior of the positioning slot through the connecting hole.

[0015] Preferably, the contraction groove is located outside the material storage trough, and the interior of the contraction groove is communicated with the interior of the expansion groove.

[0016] Preferably, the bottom end of the adjusting screw shaft passes through the material balancing plate and extends to the inside of the telescopic groove, and the surface of the adjusting screw shaft is rotationally connected to the surface of the material balancing plate.

[0017] Preferably, the surface of the lifting frame is slidably connected to the inner wall of the telescopic slot, and the surface of the positioning scale plate is matched with the surface of the positioning pointer.

[0018] Preferably, the surface of the telescopic tube is slidably connected to the inner surface of the contraction groove, and the difference between the inner diameter of the telescopic tube and the inner diameter of the contraction groove is between 1 mm and 2 mm.

[0019] Preferably, the bottom end of the linkage shaft passes through the material balancing plate and extends to the interior of the telescopic slot, the surface of the linkage shaft is slidingly connected to the material balancing plate, the top of the tightening spring is fixed to the bottom of the linkage plate, and the bottom of the tightening spring is fixed to the bottom of the inner wall of the linkage slot.

[0020] Compared with the related art, the semiconductor sensor reverse packaging process provided by the present invention has the following beneficial effects:

[0021] The present invention provides a semiconductor sensor reverse packaging process, which adopts reverse molding during plastic packaging of components, and structurally keeps the semiconductor sensor chip at the bottom position of the frame, so that after the semiconductor chip in the plastic package enters the ceramic substrate, the sensor part is still in the front direction of the overall module, realizing the function of the sensor, and at the same time, the reverse packaging process can realize the normal line signal connection between sensor components and other general PCB circuit boards, and will not be affected by interference from other external signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the prior art;

[0023] Figure 2 A schematic diagram of the reverse packaging structure of the semiconductor sensor reverse packaging process provided by the present invention;

[0024] Figure 3 for Figure 2 The wiring diagram of the anti-sealed base island part is shown;

[0025] Figure 4 A chip mounting direction identification diagram for the reverse packaging process of the semiconductor sensor provided by the present invention;

[0026] Figure 5 A schematic diagram of the structure of a material balancing device in a semiconductor sensor reverse packaging process provided by the present invention;

[0027] Figure 6 for Figure 5 An enlarged schematic diagram of part A is shown;

[0028] Figure 7 for Figure 5 An enlarged schematic diagram of part B is shown.

[0029] Numbers in the figure: 1a, original pin, 2a, original base island, 3a, original plastic cover, 1b, reverse-sealed pin, 2b, reverse-sealed base island, 21b, reverse-sealed chip, 3b, reverse-sealed plastic cover, 1, material equalizing plate, 11, material storage trough, 12, adjustment slot, 13, telescopic slot, 14, positioning slot, 15, connecting hole, 16, contraction slot, 17, linkage slot, 2, hexagonal nut, 21, adjustment screw shaft, 22, lifting frame, 23, positioning pointer, 24, positioning ruler, 3, telescopic tube, 4, linkage plate, 41, linkage shaft, 42, tightening spring, 43, support frame, 5, sealing baffle, 6, linkage frame. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0031] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 ,in, Figure 1 It is a structural schematic diagram of the prior art; Figure 2 A schematic diagram of the reverse packaging structure of the semiconductor sensor reverse packaging process provided by the present invention; Figure 3 for Figure 2 The wiring diagram of the anti-sealed base island part is shown; Figure 4 A chip mounting direction identification diagram for the reverse packaging process of the semiconductor sensor provided by the present invention; Figure 5 A schematic diagram of the structure of a material balancing device in a semiconductor sensor reverse packaging process provided by the present invention; Figure 6 for Figure 5 An enlarged schematic diagram of part A is shown; Figure 7 for Figure 5 An enlarged schematic diagram of part B is shown.

[0032] A semiconductor sensor reverse packaging process includes reverse packaging pins 1b, reverse packaging base islands 2b, reverse packaging chips 21b, and reverse packaging plastic sleeves 3b, and includes the following steps:

[0033] S1 preferentially aligns the reverse sealing chip 21b with the connection surface of the reverse sealing base island 2b;

[0034] S2: soldering the circuit end of the reverse encapsulation chip 21b to the circuit end of the reverse encapsulation base island 2b;

[0035] S3 fixes the top of the reverse sealing base island 2b in the reverse concave structure of the pin 1b, and the output end of the reverse sealing base island 2b is soldered to the input end of the reverse sealing pin 1b;

[0036] S4 reversely plastic-seals the outer sides of the assembled reverse-sealed chip 21b and reverse-sealed base island 2b to form a reverse-sealed plastic sleeve 3b.

[0037] Reverse molding is performed when components are plastic-sealed to structurally keep the semiconductor sensor chip at the bottom of the frame. This allows the sensor part to be on the front side of the entire module after the semiconductor chip in the plastic package enters the ceramic substrate, thus realizing the sensor function. At the same time, the reverse molding process can realize the normal line signal connection between sensor components and other general PCB circuit boards without being affected by interference from other external signals.

[0038] The reverse encapsulation base island 2b and the reverse encapsulation chip 21b are located below the reverse encapsulation pin 1b to form a reverse encapsulation structure.

[0039] The output end of the reverse sealing pin 1b is located outside the reverse sealing plastic sleeve 3b, and the bottom end of the reverse sealing pin 1b is located below the bottom of the reverse sealing plastic sleeve 3b.

[0040] The semiconductor sensor needs to use a material leveling device to evenly spread the soldering raw materials during soldering packaging. The material leveling device includes a material leveling plate 1, on which a material storage tank 11 is provided. The material leveling plate 1 is provided with an adjusting slot 12, a telescopic slot 13, a positioning slot 14, a connecting hole 15, a contraction slot 16 and a linkage slot 17; an inner hexagonal nut 2, which is arranged inside the adjusting slot 12, and the bottom end of the inner hexagonal nut 2 is fixedly connected with an adjusting screw shaft 21, and the surface of the adjusting screw shaft 21 is threadedly connected with a lifting frame 22, and one side of the lifting frame 22 is fixedly connected with a positioning pointer 23, and the positioning slot 1 4 is fixedly connected with a positioning ruler plate 24 on its inner wall; a telescopic tube 3, the outer surface of which is fixed to the inner side of the lifting frame 22; a linkage plate 4, the surface of which is slidably connected to the inner wall of the linkage groove 17, the bottom of which is fixedly connected with a linkage shaft 41, the outer surface of which is sleeved with a tightening spring 42, the bottom of which is fixedly connected with a support frame 43; a sealing baffle 5, which is sleeved on the inner side of the support frame 43, and the surface of which is slidably connected to the bottom of the telescopic tube 3; a linkage frame 6, which is sleeved on the outer side of the sealing baffle 5.

[0041] When semiconductor chips are packaged, welding is required. After welding, the two leads of the semiconductor need to be welded. During welding, the flux needs to be evenly dropped and collected to ensure the stability and quality of welding.

[0042] The traditional material distribution structure is an integrated structure, the size of the material trough cannot be adjusted and it is inconvenient to adjust when the materials need to be dropped one by one;

[0043] By arranging a retractable telescopic tube 3 on the material balancing plate 1, it is convenient to adjust the discharge amount of the storage tank 11, so as to facilitate the weighing of flux particles of different doses to meet the dosage requirements of different welding needs. The sealing baffle 5 that can be adjusted horizontally and slides conveniently allows the flux particles inside the storage tank 11 to be discharged one by one, and conveniently discharges the material from the bottom of the material balancing plate 1, making it more convenient and quick to discharge the evenly weighed flux particles.

[0044] The expansion slot 13 and the positioning slot 14 are both located at the bottom of the material balancing plate 1 , and the expansion slot 13 is connected to the inside of the positioning slot 14 through the connecting hole 15 .

[0045] The lifting frame 22 extends to the interior of the positioning slot 14 through the connecting hole 15, so as to facilitate the synchronous lifting and lowering adjustment of the positioning pointer 23, so as to ensure the stability of reading when the positioning pointer 23 moves up and down.

[0046] The contraction groove 16 is located outside the material storage groove 11 , and the interior of the contraction groove 16 is communicated with the interior of the telescopic groove 13 .

[0047] The linkage groove 17 is located above the telescopic groove 13 , which facilitates the upward and downward movement adjustment of the linkage shaft 41 , thereby facilitating the support frame 43 to drive the sealing baffle 5 to move upward and form a movable seal with the bottom end of the telescopic tube 3 .

[0048] The contraction groove 16 provides space for the lifting and lowering adjustment of the telescopic tube 3. The telescopic tube 3 is located outside the material storage tank 11, which is convenient for storing materials and avoids the phenomenon of material jamming after the telescopic tube 3 is lifted and lowered.

[0049] The bottom end of the adjusting screw shaft 21 penetrates the material balancing plate 1 and extends to the inside of the telescopic groove 13 , and the surface of the adjusting screw shaft 21 is rotationally connected to the surface of the material balancing plate 1 .

[0050] The adjusting screw shaft 21 can be stably rotated and adjusted on the material balancing plate 1 , and the adjusting screw shaft 21 itself will not move up and down, so as to ensure the stability of the up and down movement adjustment of the lifting frame 22 .

[0051] The surface of the lifting frame 22 is slidably connected to the inner wall of the telescopic slot 13 , and the surface of the positioning scale plate 24 is matched with the surface of the positioning pointer 23 .

[0052] The bottom of the lifting frame 22 and the bottom of the telescopic tube 3 are in the same plane to facilitate the horizontal adjustment of the sealing baffle 5, avoid the sealing baffle 5 from conflicting with the lifting frame 22 or the telescopic tube 3 during horizontal movement adjustment, and improve the stability of equipment operation.

[0053] The surface of the telescopic tube 3 is slidably connected to the inner surface of the contraction groove 16 , and the difference between the inner diameter of the telescopic tube 3 and the inner diameter of the contraction groove 16 is between 1 mm and 2 mm.

[0054] The bottom end of the linkage shaft 41 passes through the material balancing plate 1 and extends to the inside of the telescopic groove 13. The surface of the linkage shaft 41 is slidingly connected to the material balancing plate 1. The top of the tightening spring 42 is fixed to the bottom of the linkage plate 4, and the bottom of the tightening spring 42 is fixed to the bottom of the inner wall of the linkage groove 17.

[0055] The tightening spring 42 exerts an upward elastic force on the linkage plate 4, and the linkage plate 4 exerts an upward pulling force on the support frame 43 through the linkage shaft 41, thereby pulling the inner sealing baffle 5 upward through the support frame 43, and keeping the sealing baffle 5 from moving. The top of the sealing baffle 5 always contacts the bottom of the telescopic tube 3, thereby achieving sealing of the bottom of the telescopic tube 3 to ensure stability during material storage and material distribution.

[0056] When in use, a hexagonal wrench is inserted into the inner hexagonal nut 2, and the inner hexagonal nut 2 is twisted, so that the inner hexagonal nut 2 drives the adjusting screw shaft 21 to rotate, and the adjusting screw shaft 21 drives the lifting frame 22 to move up and down for adjustment, and the lifting frame 22 drives the telescopic tube 3 thereon to move up and down for adjustment synchronously, thereby facilitating the adjustment of the storage range of the storage tank 11;

[0057] When the telescopic tube 3 is moved up and down for adjustment, the sealing baffle 5 maintains close contact with the bottom of the telescopic tube 3 under the elastic force of the tightening spring 42, thereby ensuring the sealing of the material storage trough 11 when storing materials. When the lifting frame 22 moves, it simultaneously drives the positioning pointer 23 to move, and the positioning distance between the positioning pointer 23 and the positioning scale plate 24 changes accordingly, thereby facilitating the observation of the adjusted height and distance, and facilitating positioning at the specified distance according to needs, making the positioning more accurate.

[0058] Compared with the related art, the semiconductor sensor reverse packaging process provided by the present invention has the following beneficial effects:

[0059] Reverse molding is performed when components are plastic-sealed to structurally keep the semiconductor sensor chip at the bottom of the frame. This allows the sensor part to be on the front side of the entire module after the semiconductor chip in the plastic package enters the ceramic substrate, thus realizing the sensor function. At the same time, the reverse molding process can realize the normal line signal connection between sensor components and other general PCB circuit boards without being affected by interference from other external signals.

[0060] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor sensor reverse packaging process, including reverse packaging pins, reverse packaging base islands, reverse packaging chips, and reverse packaging plastic sleeves, characterized in that: The following steps are involved: S1 first aligns the reverse sealing chip with the connection surface of the reverse sealing base island; S2 solders the circuit end of the reverse encapsulation chip to the circuit end of the reverse encapsulation base island; S3 fixes the top of the anti-sealing base island in the reverse concave structure of the pin, and connects the output end of the anti-sealing base island to the input end of the anti-sealing pin by soldering; S4 reversely plastic-sealing the assembled reverse-sealed chip and the outer side of the reverse-sealed base island to form a reverse-sealed plastic sleeve; The semiconductor sensor needs to use a material balancing device to evenly spread the soldering raw materials when soldering and packaging. The material balancing device includes a material balancing plate, a material storage tank is provided on the material balancing plate, and an adjustment slot, a telescopic slot, a positioning slot, a connecting hole, a contraction slot and a linkage slot are respectively provided on the material balancing plate; An internal hexagonal nut, the internal hexagonal nut is arranged inside the adjusting groove, the bottom end of the internal hexagonal nut is fixedly connected with an adjusting screw shaft, the surface of the adjusting screw shaft is threadedly connected with a lifting frame, one side of the lifting frame is fixedly connected with a positioning pointer, and the inner wall of the positioning groove is fixedly connected with a positioning ruler plate; a telescopic tube, the outer surface of which is fixed to the inner side of the lifting frame; A linkage plate, the surface of which is slidably connected to the inner wall of the linkage groove, the bottom of which is fixedly connected to a linkage shaft, the outer surface of which is sleeved with a tightening spring, and the bottom of which is fixedly connected to a support frame; A sealing baffle, the sealing baffle is sleeved on the inner side of the support frame, and the surface of the sealing baffle is slidably connected to the bottom of the telescopic tube; A linkage frame, wherein the linkage frame is sleeved on the outer side of the sealing baffle; The telescopic groove and the positioning groove are both located at the bottom of the material balancing plate, and the telescopic groove is connected to the interior of the positioning groove through the connecting hole; The contraction groove is located outside the material storage groove, and the interior of the contraction groove is communicated with the interior of the telescopic groove.

2. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The reverse encapsulation base island and the reverse encapsulation chip are located below the reverse encapsulation pins to form a reverse encapsulation structure.

3. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The output end of the reverse sealing pin is located outside the reverse sealing plastic sleeve, and the bottom end of the reverse sealing pin is located below the bottom of the reverse sealing plastic sleeve.

4. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The bottom end of the adjusting screw shaft penetrates the material balancing plate and extends to the inside of the telescopic groove, and the surface of the adjusting screw shaft is rotationally connected to the surface of the material balancing plate.

5. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The surface of the lifting frame is slidably connected to the inner wall of the telescopic slot, and the surface of the positioning ruler plate is matched with the surface of the positioning pointer.

6. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The surface of the telescopic tube is slidably connected to the inner surface of the contraction groove, and the difference between the inner diameter of the telescopic tube and the inner diameter of the contraction groove is between 1 mm and 2 mm.

7. The semiconductor sensor reverse packaging process according to claim 1, characterized in that: The bottom end of the linkage shaft passes through the material balancing plate and extends to the inside of the telescopic slot. The surface of the linkage shaft is slidingly connected to the material balancing plate. The top of the tightening spring is fixed to the bottom of the linkage plate, and the bottom of the tightening spring is fixed to the bottom of the inner wall of the linkage slot.

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