A plasma cleaning protection device and method for hard-soft board

Abstract

The present invention discloses and provides a plasma cleaning protection device and method for a rigid-flexible board. The present invention can well protect the rigid-flexible board and prevent the rigid-flexible board from being damaged during plasma cleaning. The present invention includes two substrates, a through-hole area is provided on the substrate, a baffle adapted to the flexible board is provided in the through-hole area, both ends of the baffle are connected to the hole wall of the through-hole area, and a plurality of positioning holes are provided on the substrate and around the through-hole area, wherein each positioning hole on one substrate is provided with a hollow rivet, and the positioning hole on the other substrate passes through the hollow rivet, so that the two substrates are overlapped, and the rigid-flexible board is located between the two substrates when in use, the hard board of the rigid-flexible board is exposed to the outside through the through-hole area, and the soft board of the rigid-flexible board is completely clamped by the baffles on the two substrates. The present invention is applied to the technical field of PCB / FPC production technology.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB / FPC production, and in particular to a plasma cleaning protection device and method for a rigid-flexible board. Background Art

[0002] As electronic products develop towards high density, miniaturization and high reliability, flexible printed circuits (FPC) with free bending, winding and folding characteristics have received attention. The development of flexible printed circuits and PCB hard boards has given birth to a new product, the soft-hard combination board. "The so-called soft-hard combination board is a circuit board with FPC characteristics and PCB characteristics formed by combining a flexible circuit board and a hard circuit board through processes such as pressing and other processes according to relevant process requirements. When producing a soft-hard combination board, the soft board area has no adhesive layer, which is easy to bubble and lead to scrapping later. There is also a very important process, which is the cleaning of the hole wall after drilling. Whether it is mechanical drilling or laser drilling, it is needed. The process often used for hole wall cleaning is plasma cleaning. When the soft board area is large, plasma cleaning often leads to a series of problems such as bubbling, deformation, and burning of the soft board area. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a plasma cleaning protection device and method for a soft-hard bonded board. The plasma cleaning protection device and method can well protect the soft-hard bonded board and prevent the soft-hard bonded board from being damaged during plasma cleaning.

[0004] The technical solution adopted by the present invention is: the present invention includes two substrates, a through hole area is provided on the substrate, a baffle adapted to the soft board is provided in the through hole area, both ends of the baffle are connected to the hole wall of the through hole area, and a plurality of positioning holes are provided on the substrate and around the through hole area, wherein each of the positioning holes on one of the substrates is provided with a hollow rivet, and the positioning hole on the other substrate passes through the hollow rivet, so that the two substrates are overlapped, and when in use, the hard-soft board is located between the two substrates, the hard board of the hard-soft board is exposed to the outside through the through hole area, and the soft board of the hard-soft board is completely clamped by the baffles on the two substrates.

[0005] Furthermore, a plurality of through hole regions are provided on the substrate, and each of the through hole regions is provided with a baffle adapted to the soft board.

[0006] Furthermore, the through hole area is a square hole.

[0007] Furthermore, both ends of the baffle are connected to the hole wall of the square hole, and the baffle divides the square hole into two small square holes of the same size.

[0008] Furthermore, the baffle and the substrate are integrally arranged.

[0009] Furthermore, the baffle is a long strip plate, and the front and rear ends of the baffle are connected to the hole walls of the through hole area. The left and right side surfaces of the baffle are inclined surfaces, the top of the inclined surface is located on the upper surface of the baffle, and the bottom of the inclined surface is located on the upper surface of the baffle. The tops of the inclined surfaces on the left and right sides of the baffle are close to each other, and the bottoms of the inclined surfaces on the left and right sides of the baffle are far away from each other. When in use, the lower surface of the baffle is attached to the soft board of the soft-hard combination board.

[0010] Furthermore, the hole wall of the through hole area is set to be inclined.

[0011] The plasma cleaning protection method using the plasma cleaning protection device of the soft-hard combination board comprises the following steps:

[0012] a. Installing the hollow rivet in the positioning hole on the first substrate;

[0013] b. The positioning holes on the rigid-flexible board are sleeved on the hollow rivets, and the rigid-flexible board is placed on the first substrate through the positioning of the hollow rivets;

[0014] c. The positioning hole of another substrate is sleeved on the hollow rivet;

[0015] d. After the two substrates clamp the rigid-flexible board, the hollow rivets are riveted tightly, the rigid board of the rigid-flexible board is exposed to the outside through the through-hole area, and the flexible board of the rigid-flexible board is completely clamped by the baffles on the two substrates;

[0016] e. The drilling positions on the hard board are cleaned by plasma gas, avoiding direct contact between the soft board and the plasma gas;

[0017] f. After cleaning, remove the hollow rivets, remove the substrate, and take out the hard-soft board after plasma cleaning.

[0018] Furthermore, the closest distance between the outer edge of the baffle and the outer edge of the soft board is 0.5 mm-100 mm.

[0019] Furthermore, the substrate and the rigid-flex board are drilled at the same time, so that the positioning holes of the rigid-flex board and the positioning holes are consistent in size and position, and the drilling size is 0.5mm-10mm.

[0020] The beneficial effect of the present invention is that: since the present invention adopts a partition protection design, the soft board area is prevented from directly contacting the plasma gas when the soft and hard board is plasma cleaned, thereby solving a series of problems such as bubbling, deformation, and burning of the soft board area. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a plasma cleaning protection device;

[0022] Figure 2 is a schematic diagram of the plasma cleaning protection device from another perspective;

[0023] Figure 3 Schematic diagram of a rigid-flex board in an embodiment;

[0024] Figure 4 This is a schematic diagram of drilling holes in the substrate and the rigid-flex board together.

[0025] Figure 5 It is a schematic diagram of the processing substrate slot;

[0026] Figure 6 It is a schematic diagram after installing the hollow rivet on the substrate;

[0027] Figure 7 It is a schematic diagram of the substrate and the rigid-flexible board combined by hollow rivets;

[0028] Figure 8 It is a schematic diagram of the substrate and the rigid-flexible board after being assembled and riveted by rivets.

[0029] Fig. 9 It is a schematic diagram when the left and right sides of the baffle are not set as inclined surfaces;

[0030] Fig.10 It is a schematic diagram when the left and right sides of the baffle are set as inclined surfaces;

[0031] Fig.11 It is the whole process flow chart of the present invention. DETAILED DESCRIPTION

[0032] like Figure 1 and Figure 2 As shown, in this embodiment, the present invention includes two substrates 1, a through-hole area 2 is provided on the substrate 1, a baffle 3 adapted to the soft board is provided in the through-hole area 2, both ends of the baffle 3 are connected to the hole wall of the through-hole area 2, and a plurality of positioning holes 4 are provided on the substrate 1 and around the through-hole area 2, wherein each of the positioning holes 4 on one of the substrates 1 is provided with a hollow rivet 5, and the positioning holes 4 on the other substrate 1 pass through the hollow rivet 5, so that the two substrates 1 are arranged overlappingly, and the hard-soft board 7 is located between the two substrates 1 when in use, and the hard-soft board 8 of the hard-soft board 7 is exposed to the outside through the through-hole area 2, and the soft board 9 of the hard-soft board is completely clamped by the baffles 3 on the two substrates 1. In this embodiment, the substrate 1 is cut into the same size as the hard-soft board 7.

[0033] In this embodiment, four through-hole regions 2 are provided on the substrate 1 , and each through-hole region 2 is provided with a baffle 3 adapted to the soft board.

[0034] In this embodiment, the through hole area 2 is a square hole.

[0035] In this embodiment, both ends of the baffle plate 3 are connected to the hole wall of the square hole, and the baffle plate 3 divides the square hole into two small square holes of the same size.

[0036] In this embodiment, the baffle 3 and the substrate 1 are integrally formed.

[0037] In this embodiment, if Fig.10 As shown, the baffle 3 is a long strip plate, and the front and rear ends of the baffle 3 are connected to the hole wall of the through-hole area 2. The left and right side surfaces of the baffle 3 are inclined surfaces 6, and the top of the inclined surface 6 is located on the upper surface of the baffle 3, and the bottom of the inclined surface 6 is located on the upper surface of the baffle 3. The tops of the inclined surfaces 6 on the left and right sides of the baffle 3 are close to each other, and the bottoms of the inclined surfaces 6 on the left and right sides of the baffle 3 are far away from each other. When in use, the lower surface of the baffle 3 is abutted against the soft board 9 of the hard-flexible board 7, and the hole wall of the through-hole area 2 is set to be inclined. The design of the inclined surface 6 can better ensure that the carrier body will not enter the gap between the baffle 3 and the soft board 9, which can not only avoid the hard-flexible board from being damaged by the excessive pressing force of the two substrates 1, but also avoid the direct contact between the soft board area and the plasma gas, thereby solving a series of problems such as bubbling, deformation, and burning of the soft board area. Fig. 9 As shown, if the left and right side surfaces of the baffle plate 3 are not set as inclined surfaces 6, high-pressure vortex gas will be formed at the right angle, and the high-pressure vortex gas will more easily enter the gap between the baffle plate 3 and the soft plate 9, causing the soft plate area to directly contact with the plasma gas, which is very likely to damage the soft plate 9.

[0038] like Figures 3 to 8 As shown, the plasma cleaning protection method using the plasma cleaning protection device of the soft-hard combination board includes the following steps:

[0039] a. Installing the hollow rivet 5 in the positioning hole 4 on the first substrate 1;

[0040] b. The positioning holes on the rigid-flexible board 7 are sleeved on the hollow rivets 5, and the rigid-flexible board 7 is placed on the first substrate 1 through the positioning of the hollow rivets 5;

[0041] c. The positioning hole 4 of another substrate 1 is sleeved on the hollow rivet 5;

[0042] d. After the two substrates 1 clamp the rigid-flexible board 7, the hollow rivet 5 is riveted tightly with the edges turned up, the hard board 8 of the rigid-flexible board 7 is exposed to the outside through the through-hole area 2, and the soft board 9 of the rigid-flexible board is completely clamped by the baffles 3 on the two substrates 1;

[0043] e. Cleaning the drilling positions on the hard board 8 by plasma gas, avoiding direct contact between the soft board 9 and the plasma gas;

[0044] f. After cleaning, remove the hollow rivet 5, then remove the substrate 1, and take out the hard-flex board 7 after plasma cleaning.

[0045] In this embodiment, the closest distance between the outer edge of the baffle 3 and the outer edge of the soft board 9 is 0.5 mm-100 mm.

[0046] In this embodiment, the substrate 1 and the rigid-flex board 7 are drilled simultaneously, so that the positioning holes of the rigid-flex board 7 and the positioning holes 4 are consistent in size and position, and the drilling size is 0.5 mm-10 mm.

[0047] like Fig.11 As shown, first determine the size of the rigid-flex board, clarify the soft board area, prepare two substrates of the same size as the rigid-flex board (the substrate material can be arbitrary), then drill holes in the rigid-flex board and the substrate together. The drilling positions need to be the same and evenly distributed in the soft board area. Then use laser cutting to cut out the hard board position corresponding to the rigid-flex board on the substrate. The cut position should be smaller than the hard board, especially the intersection of the hard and soft parts, which should be as far away from the soft board area as possible. Then install a hollow rivet of the same size as the drilled hole on the substrate 1, and then connect the rigid-flex board and the two substrates 1 together through the hollow rivet, and then rivet the hollow rivet flanging and tightening, and then send it into the plasma cleaning equipment for cleaning. When the rigid-flex board is plasma cleaned, the soft board area is prevented from direct contact with the plasma gas, thereby solving a series of problems such as bubbling, deformation, and burning of the soft board area.

[0048] Although the embodiments of the present invention are described with practical solutions, they do not constitute limitations on the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A plasma cleaning protection device for a rigid-flexible board, characterized in that: The invention comprises two substrates (1), wherein a through hole region (2) is provided on the substrate (1), a baffle (3) adapted to a soft board is provided in the through hole region (2), both ends of the baffle (3) are connected to the hole wall of the through hole region (2), and a plurality of positioning holes (4) are provided on the substrate (1) and around the through hole region (2), wherein each positioning hole (4) on one substrate (1) is provided with a hollow rivet (5), and the positioning hole (4) on the other substrate (1) passes through the hollow rivet (5), so that the two substrates (1) are arranged overlapping, and when in use, the hard-soft board (7) is located between the two substrates (1), the hard board (8) of the hard-soft board (7) is exposed to the outside through the through hole region (2), and the soft board (9) of the hard-soft board is completely clamped by the baffles (3) on the two substrates (1). The substrate (1) is provided with a plurality of through-hole areas (2), each of which is provided with a baffle (3) adapted to the soft board; the through-hole area (2) is a square hole; the baffle (3) and the substrate (1) are integrally arranged; the baffle (3) is a long strip plate, the front and rear ends of the baffle (3) are connected to the hole wall of the through-hole area (2), the left and right side surfaces of the baffle (3) are inclined surfaces (6), the top of the inclined surface (6) is located on the upper surface of the baffle (3), the bottom of the inclined surface (6) is located on the upper surface of the baffle (3), the tops of the inclined surfaces (6) on the left and right sides of the baffle (3) are close to each other, and the bottoms of the inclined surfaces (6) on the left and right sides of the baffle (3) are far away from each other, and when in use, the lower surface of the baffle (3) is abutted against the soft board (9) of the hard-soft board (7).

2. The plasma cleaning protection device for a rigid-flexible board according to claim 1, characterized in that: Both ends of the baffle plate (3) are connected to the hole wall of the square hole, and the baffle plate (3) divides the square hole into two small square holes of the same size.

3. A plasma cleaning protection device for a rigid-flexible board according to claim 1 or 2, characterized in that: The hole wall of the through hole area (2) is arranged to be inclined.

4. A plasma cleaning protection method using the plasma cleaning protection device for a rigid-flexible board as claimed in claim 1, characterized in that: The plasma cleaning protection method comprises the following steps: a. Installing the hollow rivet (5) in the positioning hole (4) on the first substrate (1); b. The positioning holes on the rigid-flexible board (7) are sleeved onto the hollow rivets (5), and the rigid-flexible board (7) is placed on the first substrate (1) by positioning the hollow rivets (5); c. The positioning hole (4) of another substrate (1) is sleeved onto the hollow rivet (5); d. After the two substrates (1) clamp the rigid-flexible board (7), the hollow rivet (5) is riveted tightly with the edges turned up, the hard board (8) of the rigid-flexible board (7) is exposed to the outside through the through-hole area (2), and the soft board (9) of the rigid-flexible board is completely clamped by the baffles (3) on the two substrates (1); e. Cleaning the drilling positions on the hard board (8) by plasma gas, thereby preventing the soft board (9) from directly contacting the plasma gas; f. After cleaning is completed, the hollow rivet (5) is removed, and then the substrate (1) is removed, and the hard-flex board (7) cleaned by plasma cleaning is taken out.

5. The plasma cleaning protection method according to claim 4, characterized in that: The closest distance between the outer edge of the baffle (3) and the outer edge of the soft plate (9) is 0.5 mm to 100 mm.

6. The plasma cleaning protection method according to claim 4, characterized in that: The substrate (1) and the rigid-flexible board (7) are drilled simultaneously, so that the positioning holes of the rigid-flexible board (7) and the positioning holes (4) are consistent in size and position, and the drilling size is 0.5 mm-10 mm.

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