A multi-mode compatibility test device for HSBP backplane and PCIE Switch board

Abstract

The invention relates to the technical field of server board testing, and discloses a multi-mode compatibility testing device for an HSBP backplane and a PCIE Switch board, comprising a machine platform, an operating platform at the machine platform, a detection component, an HSBP carrier board component and a PCIE Switch carrier board component at the operating platform, the detection component is electrically connected to the HSBP carrier board component and the PCIE Switch carrier board component respectively, the HSBP carrier board component comprises an HSBP clamping plate, the PCIE Switch carrier board component comprises a PCIE Switch clamping plate, the HSBP clamping plate and the PCIE Switch clamping plate are separately arranged, the HSBP clamping plate is vertically arranged at the operating platform, the PCIE Switch clamping plate is horizontally arranged at the operating platform, a positioning column for fixing an external docking connector is arranged on one side of the PCIE Switch clamping plate, and an open clamping surface of the HSBP clamping plate abuts against a side of the PCIE Switch clamping plate provided with the positioning column.

Description

Technical Field

[0001] The present invention relates to the technical field of server board testing, and in particular to a multi-mode compatibility testing device for a HSBP backplane and a PCIE Switch board. Background Art

[0002] For the joint test of HSBP backplane and PCIE Switch board, three test modes are required: 1. HSBP backplane is DUT, PCIE Switch board is the companion test, 2. PCIE Switch board is DUT, HSBP backplane is the companion test, 3. Both HSBP backplane and PCIE Switch board are DUT, and they remain integrated after the test. For the above three test modes, the existing fixture can only be implemented in two steps: the first step is to plug the HSBP backplane and PCIE Switch board into one on a simple tooling. The docking connector used during the connection is a high-density connector with a large plug-in force. The second step is to put the joint body into the test fixture, plug the 24x hard disk interface through the quick clamp, and then power on the test. The above actions must be repeated for each test, which increases the operator's operating actions and affects the test efficiency, so it needs to be improved. Summary of the invention

[0003] The main purpose of the present invention is to provide a multi-mode compatibility testing device for HSBP backplane and PCIE Switch board, which can quickly detect the HSBP backplane and PCIE Switch board in different modes and improve the detection efficiency.

[0004] To achieve the above-mentioned purpose, the present invention proposes a multi-mode compatibility testing device for HSBP backplane and PCIE Switch board, comprising a machine platform, a working platform at the machine platform, a detection component, a HSBP carrier board component and a PCIE Switch carrier board component are arranged at the working platform, the detection component is electrically connected to the HSBP carrier board component and the PCIE Switch carrier board component respectively, the HSBP carrier board component comprises an HSBP clamping plate, the PCIE Switch carrier board component comprises a PCIE Switch clamping plate, the HSBP clamping plate and the PCIE Switch clamping plate are separately arranged, the HSBP clamping plate is vertically arranged at the working platform, the PCIE Switch clamping plate is horizontally arranged at the working platform, a positioning column for fixing an external docking connector is arranged on one side of the PCIE Switch clamping plate, and the open clamping surface of the HSBP clamping plate is against the side of the PCIE Switch clamping plate provided with the positioning column.

[0005] Specifically, the detection component includes a detection mounting plate, a hard disk module, a plug-in module, and a plug-in control component. The detection mounting plate is provided at the rear of the upper surface of the working platform, and a plug-in assembly plate is provided at one end of the detection mounting plate close to the HSBP clamping plate. The plug-in module is provided at the plug-in assembly plate and the plug-in head is arranged toward the HSBP clamping plate. The hard disk module is provided on the upper surface of the detection mounting plate, and the hard disk module is electrically connected to the plug-in module. The plug-in control component controls the detection mounting plate to approach or move away from the HSBP clamping plate.

[0006] Specifically, the plug-in and pull-out control component includes a plug-in and pull-out handle, a plug-in and pull-out transmission rod, a plug-in and pull-out transmission head, a plug-in and pull-out slide rail and a plug-in and pull-out slider. The plug-in and pull-out handle is arranged on the front side of the machine, one end of the plug-in and pull-out handle is transmission-connected to the front end of the plug-in and pull-out transmission rod, the rear end of the plug-in and pull-out transmission rod is connected to the lower end of the plug-in and pull-out transmission head, the plug-in and pull-out slide rail is arranged on the upper surface of the working platform, the plug-in and pull-out slide rail extends toward the HSBP clamping plate, the plug-in and pull-out slider is slidably arranged on the plug-in and pull-out slide rail, a plug-in and pull-out transmission hole corresponding to the plug-in and pull-out transmission head is provided at the working platform, the upper surface of the plug-in and pull-out transmission head is located in the plug-in and pull-out transmission hole and is flush with the working platform, the middle part of the lower surface of the detection mounting plate is connected to the upper surface of the plug-in and pull-out transmission head, the side of the lower surface of the detection mounting plate is connected to the upper surface of the plug-in and pull-out slider, and the plug-in and pull-out handle drives the detection mounting plate to move closer to or away from the HSBP clamping plate.

[0007] Specifically, the HSBP carrier assembly also includes a splint mounting plate, which is arranged in the middle of the upper surface of the working platform, and a mounting surface is provided on one side of the splint mounting plate facing the PCIE Switch splint, and the HSBP splint is arranged on one side of the mounting surface.

[0008] Specifically, the HSBP splint includes a HSBP back plate and a HSBP pressure plate. The back side of the HSBP back plate is fixedly connected to the mounting surface. The HSBP pressure plate is hinged to the upper end of the HSBP back plate. The front side of the HSBP back plate and the rear side of the HSBP pressure plate form a fixed space for the HSBP back plate. The upper end of the splint mounting plate is provided with avoidance holes corresponding to the hinged joint of the HSBP pressure plate and the HSBP back plate. The HSBP back plate is provided with plug-in holes corresponding to the detection component.

[0009] Specifically, the PCIE Switch carrier assembly also includes a splint assembly plate and an assembly control component. The splint assembly plate is arranged at the front of the upper surface of the working platform, and the back of the PCIE Switch splint is arranged on the upper surface of the splint assembly plate. The assembly control component controls the splint assembly plate to move closer to or away from the HSBP splint.

[0010] Specifically, the assembly control component includes an assembly handle, an assembly transmission rod, an assembly slide rail and an assembly slider. The front side of the working platform is provided with a handle assembly seat corresponding to the assembly handle. One end of the assembly handle is transmission-connected to the front end of the assembly transmission rod, and the rear end of the assembly transmission rod is connected to the splint assembly plate. The assembly slide rail is provided on the upper surface of the working platform and extends toward the HSBP splint. The assembly slider is slidably provided on the assembly slide rail. The lower surface of the splint assembly plate is connected to the upper surface of the assembly slider. The assembly handle drives the splint assembly plate to move closer to or away from the HSBP splint.

[0011] Specifically, a placement groove is provided on the upper surface of the PCIE Switch splint, and a pressing buckle is provided at the end of the PCIE Switch splint. The pressing buckle includes a pressing seat, a pressing handle and a pressing head. The pressing seat is provided on the upper surface of the PCIE Switch splint, the pressing handle is hinged to the pressing seat, the pressing head is provided at one end of the pressing handle close to the placement groove, and the end of the pressing plate away from the placement groove extends to the outside of the PCIE Switch splint.

[0012] Specifically, the machine includes a bottom box, which is provided with an installation opening that opens upward. The working platform is arranged at the upper end of the bottom box and covers the installation opening to form a cavity. The side walls of the bottom box are provided with heat dissipation holes that communicate with the cavity. A cooling fan is provided at the opening of the heat dissipation holes.

[0013] Specifically, a handle is provided on the side wall of the bottom box, and the handle is fixedly connected to the bottom box.

[0014] The technical solution of the present invention places the detection component, HSBP carrier component and PCIE Switch carrier component by setting up a working platform, and adopts separately set HSBP clamp and PCIE Switch clamp, so as to reduce test tooling and test steps under different test modes, save test time and tooling costs, and greatly improve test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0016] Figure 2 for Figure 1 An enlarged schematic diagram of point A.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the detection component of the present invention.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the HSBP splint of the present invention.

[0019] Figure 5 It is a schematic diagram of the three-dimensional structure of the PCIE Switch clamp of the present invention.

[0020] Figure 6 for Figure 5 An enlarged schematic diagram of point A.

[0021] Figure 7 This is one of the three-dimensional structural schematic diagrams of the working platform of the present invention.

[0022] Figure 8 This is the second schematic diagram of the three-dimensional structure of the working platform of the present invention.

[0023] The reference numerals include: 10. machine; 11. working platform; 12. bottom box; 13. heat dissipation hole; 14. cooling fan; 15. lifting handle; 20. detection assembly; 21. detection mounting plate; 22. hard disk module; 23. plug-in module; 24. plug-in handle; 25. plug-in transmission rod; 26. plug-in transmission head; 27. plug-in slide rail; 28. plug-in slider; 30. HSBP carrier assembly; 31. HSBP splint; 32. splint mounting plate; 33. HSBP back plate; 34. HSBP pressure plate; 35. avoidance hole; 40. PCIE Switch carrier assembly; 41. PCIE Switch splint; 42. splint assembly plate; 43. assembly handle; 44. assembly transmission rod; 45. assembly slide rail; 46. assembly slider; 47. placement slot; 48. pressure seat; 49. pressure handle; 50. pressure head. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the present invention, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0027] like Figures 1 to 8As shown, a multi-mode compatibility testing device for a HSBP backplane and a PCIE Switch board includes a machine 10, a working platform 11 at the machine 10, a detection component 20, a HSBP carrier component 30 and a PCIE Switch carrier component 40 are provided at the working platform 11, the detection component 20 is electrically connected to the HSBP carrier component 30 and the PCIE Switch carrier component 40 respectively, the HSBP carrier component 30 includes a HSBP clamping plate 31, the PCIE Switch carrier component 40 includes a PCIE Switch clamping plate 41, the HSBP clamping plate 31 and the PCIE Switch clamping plate 41 are separately arranged, the HSBP clamping plate 31 is vertically arranged at the working platform 11, the PCIE Switch clamping plate 41 is horizontally arranged at the working platform 11, a positioning column for fixing an external docking connector is provided on one side of the PCIE Switch clamping plate 41, and the open clamping surface of the HSBP clamping plate 31 is against the side of the PCIE Switch clamping plate 41 provided with the positioning column.When the HSBP backplane is the DUT and the PCIE Switch board is the accompanying test board, the HSBP backplane is mainly replaced, the HSBP backplane to be tested is placed at the HSBP clamping plate 31, and the accompanying test PCIE Switch board is placed at the PCIE Switch clamping plate 41. When the first HSBP backplane is tested, the detection component 20 is first separated from the HSBP carrier board component 30, and then the PCIE Switch carrier board component 40 is separated from the HSBP carrier board component 30, and then the HSBP backplane is taken out from the HSBP clamping plate 31, and then a new HSBP backplane to be tested is placed at the HSBP clamping plate 31, and then the PCIE Switch carrier board component 40 is connected to the HSBP carrier board component 30, and finally the detection component 20 is connected to the HSBP carrier board component 30 to achieve detection; when the HSBP backplane is the accompanying test board and the PCIE Switch board is the DUT, the PCIE Switch board is mainly replaced, the HSBP backplane to be tested is placed at the HSBP clamping plate 31, and the accompanying test PCIE The switch board is placed at the PCIE Switch clamp 41. When the first PCIE Switch clamp completes the detection, the detection component 20 is first separated from the HSBP carrier board component 30, and then the PCIE Switch carrier board component 40 is separated from the HSBP carrier board component 30, and then the PCIE Switch board is taken out from the PCIE Switch clamp 41, and then the PCIE Switch board to be tested is re-placed at the PCIE Switch clamp 41, and then the PCIE Switch carrier board component 40 is connected to the HSBP carrier board component 30, and finally the detection component 20 is connected to the HSBP carrier board component 30 to achieve detection; when the HSBP backplane and the PCIE Switch board are both DUTs, the main thing is to replace the combination of the HSBP backplane and the PCIE Switch board, place the connector at the positioning column, and then put the HSBP backplane and PCIE Switch board to be tested into the HSBP clamp 31 and PCIE Switch clamp 41 respectively, and at the same time, the connector connects the HSBP backplane and PCIE The switch boards are connected to form a union. When the first union is tested, the test component 20 is first separated from the HSBP carrier assembly 30, and then the clamping piece at the HSBP clamp 31 is opened, and then the PCIE Switch carrier assembly 40 is separated from the HSBP carrier assembly 30, so that the HSBP backplane is separated from the HSBP clamp 31, and then the PCIE Switch board is taken out from the PCIE Switch clamp 41, and then the union is taken out, and the above steps are repeated to continue testing the next union, thereby reducing test tools and test steps in different test modes, saving test time and tooling costs, and greatly improving test efficiency.

[0028] The detection assembly 20 includes a detection mounting plate 21, a hard disk module 22, a plug-in module 23, and a plug-in control component. The detection mounting plate 21 is provided at the rear of the upper surface of the working platform 11, and a plug-in assembly plate is provided at one end of the detection mounting plate 21 close to the HSBP clamping plate 31. The plug-in module 23 is arranged at the plug-in assembly plate and the plug-in head is arranged toward the HSBP clamping plate 31. The hard disk module 22 is arranged on the upper surface of the detection mounting plate 21. The hard disk module 22 is electrically connected to the plug-in module 23. The plug-in control component controls the detection mounting plate 21 to move closer to or away from the HSBP clamping plate 31; the plug-in control component includes a plug-in handle 24, a plug-in transmission rod 25, a plug-in transmission head 26, a plug-in slide rail 27 and a plug-in slide block 28. The plug-in handle 24 is arranged on the front side of the machine 10, and the plug-in handle One end of the hand 24 is connected to the front end of the plug-in transmission rod 25 for transmission, and the rear end of the plug-in transmission rod 25 is connected to the lower end of the plug-in transmission head 26. The plug-in slide rail 27 is arranged on the upper surface of the working platform 11, and the plug-in slide rail 27 extends toward the HSBP clamping plate 31. The plug-in slider 28 is slidably arranged on the plug-in slide rail 27. A plug-in transmission hole corresponding to the plug-in transmission head 26 is provided at the working platform 11. The upper surface of the plug-in transmission head 26 is located in the plug-in transmission hole and is flush with the working platform 11. The middle part of the lower surface of the detection mounting plate 21 is connected to the upper surface of the plug-in transmission head 26, and the side of the lower surface of the detection mounting plate 21 is connected to the upper surface of the plug-in slider 28. The plug-in handle 24 drives the detection mounting plate 21 to move closer to or away from the HSBP clamping plate 31. During the inspection, the plug-in handle 24 drives the inspection mounting plate 21 to move along the plug-in rail 27 toward the HSBP clamp 31, and then the plug-in head is inserted into the socket on the HSBP backplane located at the HSBP clamp 31, so as to realize the electrical connection between the inspection component 20 and the HSBP backplane and the PCIE Switch board, so as to facilitate the inspection of the HSBP backplane and the PCIE Switch board. At the same time, after the inspection is completed, the plug-in handle 24 drives the inspection mounting plate 21 to move along the plug-in rail 27 away from the HSBP clamp 31, and then drives the plug-in head to separate from the socket on the HSBP backplane, so as to realize the disconnection of the inspection component 20 from the HSBP backplane and the PCIE Switch board, so as to facilitate the removal or placement of the HSBP backplane or the PCIE Switch board or the combination.

[0029] The HSBP carrier assembly 30 also includes a clamping plate mounting plate 32, which is arranged in the middle of the upper surface of the working platform 11, and a mounting surface is provided on the side of the clamping plate mounting plate 32 facing the PCIE Switch clamping plate 41, and the HSBP clamping plate 31 is arranged on one side of the mounting surface; the HSBP clamping plate 31 includes a HSBP support plate 33 and a HSBP pressure plate 34, the back side of the HSBP support plate 33 is fixedly connected to the mounting surface, the HSBP pressure plate 34 is hinged to the upper end of the HSBP support plate 33, the front side of the HSBP support plate 33 and the rear side of the HSBP pressure plate 34 form a fixed space for the HSBP backplane, the upper end of the clamping plate mounting plate 32 is provided with a avoidance hole 35 corresponding to the hinge of the HSBP pressure plate 34 and the HSBP support plate 33, and the HSBP support plate 33 is provided with a plug-in hole corresponding to the detection component 20. When testing the HSBP backplane, first open the HSBP pressure plate 34 upwards, place the HSBP backplane into the HSBP support plate 33, and then press the HSBP pressure plate 34 downwards to fix the HSBP backplane in a fixed space, so as to facilitate fast and stable placement of multiple HSBP backplanes.

[0030] The PCIE Switch carrier assembly 40 also includes a splint assembly plate 42 and an assembly control component. The splint assembly plate 42 is arranged at the front part of the upper surface of the working platform 11, and the back of the PCIE Switch splint 41 is arranged on the upper surface of the splint assembly plate 42. The assembly control component controls the splint assembly plate 42 to approach or move away from the HSBP splint 31; the assembly control component includes an assembly handle 43, an assembly transmission rod 44, an assembly slide rail 45 and an assembly slider 46. The front side of the working platform 11 is provided with a handle assembly seat corresponding to the assembly handle 43, one end of the assembly handle 43 is transmission-connected to the front end of the assembly transmission rod 44, and the rear end of the assembly transmission rod 44 is connected to the splint assembly plate 42. The assembly slide rail 45 is arranged on the upper surface of the working platform 11 and extends toward the HSBP splint 31. The assembly slider 46 is slidably arranged on the assembly slide rail 45, and the lower surface of the splint assembly plate 42 is connected to the upper surface of the assembly slider 46. The assembly handle 43 drives the splint assembly plate 42 to approach or move away from the HSBP splint 31. During the inspection, the assembly handle 43 is used to drive the splint assembly plate 42 to move along the assembly rail 45 toward the HSBP splint 31, thereby realizing the electrical connection between the PCIE Switch board and the HSBP backplane, so as to facilitate the inspection of the HSBP backplane and the PCIE Switch board. At the same time, after the inspection is completed, the assembly handle 43 drives the splint assembly plate 42 to move along the assembly rail 45 away from the HSBP splint 31, so as to realize the separation between the PCIE Switch splint 41 and the HSBP splint 31, so as to facilitate the removal or placement of the HSBP backplane or the PCIE Switch board or the combination.

[0031] The upper surface of the PCIE Switch clamp 41 is provided with a placement groove 47, and the end of the PCIE Switch clamp 41 is provided with a buckle, which includes a pressure seat 48, a pressure handle 49 and a pressure head 50. The pressure seat 48 is provided on the upper surface of the PCIE Switch clamp 41, the pressure handle 49 is hinged to the pressure seat 48, and the pressure head 50 is provided at one end of the pressure handle 49 close to the placement groove 47, and the end of the pressure plate away from the placement groove 47 extends to the outside of the PCIE Switch clamp 41. The PCIE Switch board located in the placement groove 47 is fixed by the pressure head 50. When the PCIE Switch board in the placement groove 47 needs to be taken out, the pressure head 50 is lifted by pressing the pressure handle 49 downward, thereby facilitating the pick-up and placement operation of the PCIE Switch board.

[0032] The machine 10 includes a bottom box 12, and a mounting opening is provided at the bottom box 12, and the working platform 11 is provided at the upper end of the bottom box 12 and covers the mounting opening to form a cavity. The side wall of the bottom box 12 is provided with a heat dissipation hole 13, and the heat dissipation hole 13 is communicated with the cavity. A heat dissipation fan 14 is provided at the opening of the heat dissipation hole 13. The heat dissipation hole 13 and the heat dissipation fan 14 are provided to dissipate heat from the cavity, and then the detection component 20, the HSBP carrier component 30 and the PCIE Switch carrier component 40 at the working platform 11 are cooled.

[0033] The side wall of the bottom box 12 is provided with a lifting handle 15, and the lifting handle 15 is fixedly connected to the bottom box 12. By providing the lifting handle 15 to facilitate the movement of the bottom box 12, efficient application in multiple scenarios is achieved.

[0034] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A multi-mode compatibility test device for HSBP backplane and PCIE Switch board, characterized in that: It includes a machine platform, an operating platform at the machine platform, a detection component, a HSBP carrier component and a PCIE Switch carrier component are arranged at the operating platform, the detection component is electrically connected to the HSBP carrier component and the PCIE Switch carrier component respectively, the HSBP carrier component includes an HSBP clamping plate, the PCIE Switch clamping plate includes a PCIE Switch clamping plate, the HSBP clamping plate and the PCIE Switch clamping plate are separately arranged, the HSBP clamping plate is vertically arranged at the operating platform, the PCIE Switch clamping plate is horizontally arranged at the operating platform, a positioning column for fixing an external docking connector is arranged on one side of the PCIE Switch clamping plate, and an open clamping surface of the HSBP clamping plate abuts against a side of the PCIE Switch clamping plate provided with the positioning column; The detection assembly includes a detection installation plate, a hard disk module, a plug-in module, and a plug-in control component. The detection installation plate is provided at the rear of the upper surface of the working platform. The end of the detection installation plate close to the HSBP clamping plate is provided with a plug-in assembly plate. The plug-in module is provided at the plug-in assembly plate and the plug-in head is provided toward the HSBP clamping plate. The hard disk module is provided on the upper surface of the detection installation plate. The hard disk module is electrically connected to the plug-in module. The plug-in control component controls the detection installation plate to approach or move away from the HSBP clamping plate. The HSBP carrier assembly also includes a clamping plate mounting plate, which is arranged in the middle of the upper surface of the working platform, and a mounting surface is arranged on one side of the clamping plate mounting plate facing the PCIE Switch clamping plate, and the HSBP clamping plate is arranged on one side of the mounting surface; The PCIE Switch carrier assembly also includes a splint assembly plate and an assembly control component. The splint assembly plate is arranged at the front of the upper surface of the working platform, and the back of the PCIE Switch splint is arranged on the upper surface of the splint assembly plate. The assembly control component controls the splint assembly plate to move closer to or away from the HSBP splint.

2. A HSBP backplane and PCIE Switch board multi-mode compatibility test device according to claim 1, characterized in that: The plug-in and pull-out control component includes a plug-in and pull-out handle, a plug-in and pull-out transmission rod, a plug-in and pull-out transmission head, a plug-in and pull-out slide rail and a plug-in and pull-out slider. The plug-in and pull-out handle is arranged on the front side of the machine, one end of the plug-in and pull-out handle is connected to the front end of the plug-in and pull-out transmission rod, the rear end of the plug-in and pull-out transmission rod is connected to the lower end of the plug-in and pull-out transmission head, the plug-in and pull-out slide rail is arranged on the upper surface of the working platform, the plug-in and pull-out slide rail extends toward the HSBP clamping plate, the plug-in and pull-out slider is slidably arranged on the plug-in and pull-out slide rail, a plug-in and pull-out transmission hole corresponding to the plug-in and pull-out transmission head is provided at the working platform, the upper surface of the plug-in and pull-out transmission head is located in the plug-in and pull-out transmission hole and is flush with the working platform, the middle part of the lower surface of the detection mounting plate is connected to the upper surface of the plug-in and pull-out transmission head, the side of the lower surface of the detection mounting plate is connected to the upper surface of the plug-in and pull-out slider, and the plug-in and pull-out handle drives the detection mounting plate to move closer to or away from the HSBP clamping plate.

3. A HSBP backplane and PCIE Switch board multi-mode compatibility test device according to claim 2, characterized in that: The HSBP splint includes a HSBP back plate and a HSBP pressure plate. The back side of the HSBP back plate is fixedly connected to the mounting surface. The HSBP pressure plate is hinged to the upper end of the HSBP back plate. The front side of the HSBP back plate and the rear side of the HSBP pressure plate form a fixed space for the HSBP back plate. The upper end of the splint mounting plate is provided with a avoidance hole corresponding to the hinge between the HSBP pressure plate and the HSBP back plate. The HSBP back plate is provided with a plug-in hole corresponding to the detection component.

4. A HSBP backplane and PCIE Switch board multi-mode compatibility test device according to claim 3, characterized in that: The assembly control component includes an assembly handle, an assembly transmission rod, an assembly slide rail and an assembly slider. A handle assembly seat corresponding to the assembly handle is provided on the front side of the working platform. One end of the assembly handle is transmission-connected to the front end of the assembly transmission rod, and the rear end of the assembly transmission rod is connected to the splint assembly plate. The assembly slide rail is provided on the upper surface of the working platform and extends toward the HSBP splint. The assembly slider is slidably provided on the assembly slide rail. The lower surface of the splint assembly plate is connected to the upper surface of the assembly slider. The assembly handle drives the splint assembly plate to move closer to or away from the HSBP splint.

5. The multi-mode compatibility test device for HSBP backplane and PCIE Switch board according to claim 4, characterized in that: A placement slot is provided on the upper surface of the PCIE Switch splint, and a pressing buckle is provided at the end of the PCIE Switch splint. The pressing buckle includes a pressing seat, a pressing handle and a pressing head. The pressing seat is provided on the upper surface of the PCIE Switch splint, the pressing handle is hinged to the pressing seat, the pressing head is provided at one end of the pressing handle close to the placement slot, and the end of the pressing plate away from the placement slot extends to the outside of the PCIE Switch splint.

6. The multi-mode compatibility test device for HSBP backplane and PCIE Switch board according to claim 1, characterized in that: The machine comprises a bottom box, which is provided with a mounting opening which opens upwards. The working platform is arranged at the upper end of the bottom box and covers the mounting opening to form a cavity. The side wall of the bottom box is provided with a heat dissipation hole which communicates with the cavity. A heat dissipation fan is arranged at the opening of the heat dissipation hole.

7. The multi-mode compatibility test device for HSBP backplane and PCIE Switch board according to claim 6, characterized in that: A lifting handle is provided on the side wall of the bottom box, and the lifting handle is fixedly connected to the bottom box.

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