Terminal structure, package, and method for manufacturing terminal structure

Abstract

The substrate (10) is made of insulating ceramic and has a main surface (MS) provided with a groove (TR), and the groove (TR) includes a flat surface (FP) connected to the main surface (MS). The first pad (21) is provided on the main surface (MS) of the substrate (10) and is made of metal. The lead (321) is provided on the first pad (21) in a manner electrically connected to the first pad (21). The first pad (21) has a side surface (FS) on the outer insertion surface of the flat surface (FP) of the groove (TR). In at least one cross-section perpendicular to the main surface (MS) of the substrate (10), the first pad (21) has a first thickness (T1) at the midpoint in a direction parallel to the main surface (MS), and has a second thickness (T2) on the side surface (FS), and satisfies the thickness condition that the second thickness (T2) is greater than half of the first thickness (T1).

Description

Technical Field

[0001] The present invention relates to a terminal structure, a package, and a method for manufacturing the terminal structure, and in particular to a terminal structure having leads arranged on pads, a package having the terminal structure, and a method for manufacturing the terminal structure. Background Art

[0002] International Publication No. 2014 / 192687 (Patent Document 1) discloses a package for storing components intended to improve frequency characteristics in a high frequency band. The package has a recess between a lead terminal joined to a wiring conductor and a ground terminal joined to a ground layer. The recess makes it easy to arbitrarily set the capacitive coupling between the wiring conductor and the ground layer.

[0003] Japanese Patent Publication No. 2003-283033 (Patent Document 2) discloses a package for housing optical semiconductor elements. The package has lead terminals and a metallized layer that are joined to each other by solder. As the package is miniaturized, the number of locations for setting the metallized layer decreases, and the joining area between the metallized layer and the lead terminals becomes smaller. As a result, the joining strength between the metallized layer and the lead terminals may deteriorate. Therefore, the lead terminals are joined to the metallized layer attached to the inner surface of the groove. As a method for forming the metallized layer, a method is exemplified in which a metal paste obtained by adding a mixed organic solvent or a solvent to powders such as W, Mo, and Mn is applied to the inner surface of the groove with a pen.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2014 / 192687

[0007] Patent Document 2: Japanese Patent Application Publication No. 2003-283033 Summary of the invention

[0008] (Problems to be solved by the invention)

[0009] The technology of International Publication No. 2014 / 192687 is useful for improving frequency characteristics in a high frequency band, in other words, for widening the bandwidth. On the other hand, in this technology, as pointed out in Japanese Patent Application Laid-Open No. 2003-283033, the bonding strength of the lead terminal may be insufficient.

[0010] According to the technology of Japanese Patent Publication No. 2003-283033, it is necessary to form a metallized layer with a lead terminal soldered on the inner surface of the groove. In the application with a pen as an example of this method, uneven application is likely to occur, resulting in greater quality deviation. In order to suppress uneven application, a more advanced coating process is required, resulting in a significant increase in the labor for manufacturing.

[0011] The present invention has been made to solve the above-mentioned problems, and its object is to provide a terminal structure, a package, and a method for manufacturing a terminal structure that can cope with widening of the width and improve the bonding strength of the lead without significantly increasing the labor for manufacturing.

[0012] (Methods for solving problems)

[0013] A terminal structure of one embodiment comprises a substrate, a first pad and a lead. The substrate is made of an insulating ceramic and has a main surface provided with a groove, and the groove includes a flat surface connected to the main surface. The first pad is arranged on the main surface of the substrate and is made of metal. The lead is arranged on the first pad in a manner electrically connected to the first pad. The first pad has a side surface on the outer plug-in surface of the flat surface of the groove. In at least one cross-section perpendicular to the main surface of the substrate, the first pad has a first thickness at the midpoint in a direction parallel to the main surface, and has a second thickness on the side surface, and satisfies a thickness condition that the second thickness is greater than half of the first thickness.

[0014] (Effects of the Invention)

[0015] According to one embodiment, first, by providing a groove on the main surface of the substrate, the capacitive coupling between the wiring paths can be adjusted. This makes it possible to cope with broadbandization. Second, by satisfying the aforementioned thickness condition, it is possible to avoid the first pad having too small a thickness on the side. Thus, when force is applied to the lead, the first pad is difficult to be damaged near the side. Therefore, the bonding strength of the lead to the first pad can be improved. Third, the side of the first pad is located on the outer plug surface of the flat surface of the groove. Thus, in the manufacture of the terminal structure, the side of the first pad can be formed along with the process of forming the groove. Therefore, the side with a sufficient thickness as described above can be formed without much labor during manufacturing. Based on the above, it is possible to cope with broadbandization and improve the bonding strength of the lead without significantly increasing the labor used for manufacturing.

[0016] The objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a plan view schematically showing the structure of the high-frequency module in accordance with the first embodiment of the present invention.

[0018] Figure 2 It is a plan view schematically showing the structure of the package in the first embodiment of the present invention.

[0019] Figure 3 This is a circuit diagram schematically showing the configuration of the terminal structure in the first embodiment of the present invention.

[0020] Figure 4 It is along Figure 2 A schematic partial cross-sectional view taken along line IV-IV.

[0021] Figure 5 So with Figure 4 The field of view is parallel to the field of view. Figure 3 A schematic diagram of a portion of a circuit constructed with terminals.

[0022] Figure 6 It is a partial plan view schematically showing the structure of the terminal structure in the first embodiment of the present invention.

[0023] Figure 7 It is along Figure 6 A schematic partial cross-sectional view taken along line VII-VII.

[0024] Figure 8 It is along Figure 6 A schematic partial cross-sectional view taken along line VIII-VIII.

[0025] Fig. 9 So with Figure 7 The same field of view shows a partial cross-sectional view of the structure of Comparative Example 1.

[0026] Fig.10 So with Figure 7 The same field of view shows a partial cross-sectional view of the structure of Comparative Example 2.

[0027] Fig.11 It is schematically shown Figure 7 A partial cross-sectional view of a first variation of FIG.

[0028] Fig.12 It is schematically shown Figure 7 A partial cross-sectional view of a second variation of FIG.

[0029] Fig.13 It is a partial plan view schematically showing the structure of the terminal structure in the second embodiment of the present invention.

[0030] Fig.14 It is schematically shown Fig.13 A partial top view of a modified example of .

[0031] Fig.15 It is a partial plan view schematically showing the structure of the terminal structure in the third embodiment of the present invention.

[0032] Fig.16 It is along Fig.15 A schematic partial cross-sectional view taken along line XVI-XVI.

[0033] Fig.17It is a partial plan view schematically showing the structure of the terminal structure in the fourth embodiment of the present invention.

[0034] Fig.18 It is along Fig.17 A schematic partial cross-sectional view taken along line XVIII-XVIII.

[0035] Fig.19 It is a partial plan view schematically showing a first step of a method for manufacturing a terminal structure in accordance with a fifth embodiment of the present invention.

[0036] Fig. 20 It is along Fig.19 A schematic partial cross-sectional view taken along line XX-XX.

[0037] Fig.21 This is a partial cross-sectional view schematically showing a second step of the method for manufacturing a terminal structure in accordance with the fifth embodiment of the present invention.

[0038] Fig. 22 This is a partial cross-sectional view schematically showing a third step of the method for manufacturing a terminal structure in accordance with the fifth embodiment of the present invention.

[0039] Fig.23 It is shown Fig.19 A schematic partial top view of a modified example of .

[0040] Fig.24 It is shown Fig. 20 The figure of the modified example is along Fig.23 A schematic partial cross-sectional view along line XXIV-XXIV.

[0041] Fig.25 This is a partial cross-sectional view schematically showing the structure of a terminal structure in Embodiment 6 of the present invention.

[0042] Fig.26 It is a partial plan view schematically showing a first step of a method for manufacturing a terminal structure in accordance with a seventh embodiment of the present invention.

[0043] Fig. 27 It is along Fig.26 A schematic partial cross-sectional view along line XXVII-XXVII.

[0044] Fig.28 It is a partial plan view schematically showing the second step of the method for manufacturing the terminal structure in the seventh embodiment of the present invention.

[0045] Fig.29 It is along Fig.28 A schematic partial cross-sectional view along line XXIX-XXIX.

[0046] Fig.30 This is a partial cross-sectional view schematically showing a third step of the method for manufacturing a terminal structure in accordance with the seventh embodiment of the present invention.

[0047] Fig.31 It is shown Fig.26 A schematic partial top view of a modified example of .

[0048] Fig.32 It is shown Fig. 27 The figure of the modified example is along Fig.31 A schematic partial cross-sectional view along line XXXII-XXXII. DETAILED DESCRIPTION

[0049] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0050] <Implementation method 1>

[0051] Figure 1 This is a plan view schematically showing the structure of the high-frequency module 701 in the first embodiment. In order to make the figure easier to see, only the outer edge of the cover 730 is shown by two-dot chain lines. Figure 2 It is a plan view schematically showing the structure of a package 501 for obtaining a high-frequency module 701 .

[0052] High frequency module 701( Figure 1 ) has a package 501 ( Figure 2 ), cover 730 and internal circuit 750. Internal circuit 750 has IC (integrated circuit) 751. IC751 can have a high operating frequency, specifically, can have an operating frequency of more than 55GHz. Internal circuit 750 can also have optical component 752, in which case, high frequency module 701 and package 501 are optical module and optical package respectively. Optical component 752 is, for example, a laser diode.

[0053] The package 501 has a terminal structure 301 and a housing 530. The housing 530 has a frame 532 and a plate 531 supporting the frame 532. The frame 532 surrounds the space on the plate 531, thereby forming a chamber CV. The cover 730 seals the chamber CV. The internal circuit 750 is installed in the chamber CV. In the case where the package 501 is an optical package, in order to ensure a path for receiving light from an optical fiber (not shown) arranged outside the package 501 or sending light to the optical fiber, an opening 535 is provided in the frame 532 of the housing 530. A cylindrical member for fixing the optical fiber may also be installed in the opening 535. A light-transmitting material may also be installed inside the cylindrical member.

[0054] The terminal structure 301 is mounted on the frame 532. The terminal structure 301 has a portion located inside the chamber CV and a portion located outside the chamber CV. Thus, the terminal structure 301 constitutes an electrical path connecting the inside and outside of the chamber CV. In order to obtain this structure, the terminal structure 301 passes through the through hole TH provided in the frame 532 of the housing 530.

[0055] The terminal structure 301 includes a signal terminal 311, a signal terminal 312, a ground terminal 316, and a ground terminal 317 inside the chamber CV, and also includes a signal lead 321, a signal lead 322, a ground lead 326, and a ground lead 327 outside the chamber CV. The terminal structure 301 includes a signal terminal 311a, a signal terminal 312a, a ground terminal 316a, and a ground terminal 317a inside the chamber CV, and also includes a signal lead 321a, a signal lead 322a, a ground lead 326a, and a ground lead 327a outside the chamber CV.

[0056] Figure 3 3 is a circuit diagram schematically showing a terminal structure 301. In the present embodiment, the terminal structure 301 constitutes a differential line CA and a differential line CB. The differential line CA includes a signal terminal 311, a signal terminal 312, a ground terminal 316, a ground terminal 317, a signal lead 321, a signal lead 322, a ground lead 326, a ground lead 327, a signal line 331, a signal line 332, a ground line 336, and a ground line 337. The signal line 331 is a wiring between the signal terminal 311 and the signal lead 321. The signal line 332 is a wiring between the signal terminal 312 and the signal lead 322. The ground line 336 is a wiring between the ground terminal 316 and the ground lead 326. The ground line 337 is a wiring between the ground terminal 317 and the ground lead 327. Similarly, the differential line CB includes a signal terminal 311a, a signal terminal 312a, a ground terminal 316a, a ground terminal 317a, a signal lead 321a, a signal lead 322a, a ground lead 326a, a ground lead 327a, a signal line 331a, a signal line 332a, a ground line 336a, and a ground line 337a. The signal line 331a is a wiring between the signal terminal 311a and the signal lead 321a. The signal line 332a is a wiring between the signal terminal 312a and the signal lead 322a. The ground line 336a is a wiring between the ground terminal 316a and the ground lead 326a. The ground line 337a is a wiring between the ground terminal 317a and the ground lead 327a.

[0057] Since the structure of the differential line CB can be the same as that of the differential line CA, only the differential line CA will be described in detail below. In addition, as a modification, the number of differential lines can be other than 2. In addition, as a modification, a line different from the differential line can also be constructed.

[0058] In addition, in this specification, the word "ground" is added to the name of the component that is assumed to be at the ground potential (more generally, the reference potential) when using the high-frequency module 701. These components do not need to have different potentials, and thus can be connected to each other. Specifically, the set of ground wire 336 and ground wire 337 can be integrated.

[0059] Figure 4 It is along Figure 2 A schematic partial cross-sectional view taken along line IV-IV. Figure 5 is and Figure 4 FIG. 3 schematically shows a circuit composed of a signal terminal 311, a signal line 331, and a signal lead 321, corresponding to a field of view parallel to a field of view. The signal line 331 is a wiring extending in the thickness direction (in the figure, longitudinal direction) and the in-plane direction (in the figure, transverse direction) inside the terminal structure 301. In addition, the circuit composed of the signal terminal 312, the signal line 332, and the signal lead 322, the circuit composed of the ground terminal 316, the ground lead 326, and the ground line 336, and the circuit composed of the ground terminal 317, the ground lead 327, and the ground line 337 are also substantially the same.

[0060] Figure 6 This is a partial plan view schematically showing the structure of the terminal structure 301 in the first embodiment. Figure 7 as well as Figure 8 Along the Figure 6 A schematic partial cross-sectional view of the line VII-VII and the line VIII-VIII. Figure 6 In order to facilitate the viewing of the figure, the brazing material 90 is not shown. Figure 7 as well as Figure 8 ). In addition, line VII-VII ( Figure 6 ) is parallel to the edge ED, line VIII-VIII( Figure 6 ) is perpendicular to the edge ED.

[0061] As described above, the terminal structure 301 has a signal lead 321, a signal lead 322, a ground lead 326, and a ground lead 327, and also has a substrate 10, a signal pad 21 (first pad), a signal pad 22 (fourth pad), a ground pad 26 (second pad), a ground pad 27 (third pad), and a solder 90. In addition, a plated film for improving the wettability of the solder may be provided on the surface of the signal pad and the ground pad. In addition, a plated film for preventing oxidation may be provided on the surface of the signal lead, the ground lead, and the solder.

[0062] The substrate 10 is made of insulating ceramic. The substrate 10 has a main surface MS ( Figure 7 The main surface MS includes a straight edge ED ( Figure 6 ).

[0063] The signal pads 21 and the signal pads 22 are pads for signal lines, and the ground pads 26 and the ground pads 27 are pads for grounding. In addition, the terminal structure 301 may have a connection layer 25 that connects the ground pads 26 and the ground pads 27 to each other. The signal pads 21, the signal pads 22, the ground pads 26, the ground pads 27, and the connection layer 25 are made of metal and are provided on the main surface MS of the substrate 10. The signal pad 21 is arranged between the ground pads 26 and the ground pads 27. The signal pad 22 is arranged between the signal pads 21 and the ground pads 27 on the main surface MS of the substrate 10.

[0064] A trench TR is provided on the main surface MS of the substrate 10. The trench TR includes a flat surface FP connected to the main surface MS as its side wall. Figure 7 In the example shown, the groove TR is substantially perpendicular to the main surface MS. The groove TR includes a portion between the signal pad 21 and the signal pad 22, a portion between the signal pad 21 and the ground pad 26, and a portion between the signal pad 22 and the ground pad 27. The main surface MS has a groove spacing ST ( Figure 7 ) The groove TR is divided into two ends. At least a portion of the interior of the groove TR is a region having a dielectric constant lower than the dielectric constant of the ceramic substrate. The region may be filled with a substance, which may be a gas. Alternatively, the region may be a vacuum. The groove preferably has a depth of 50 μm or more, and more preferably has the above region over a depth of 50 μm or more.

[0065] The signal pad 21 has a side surface FS on a virtual external insertion surface of the flat surface FP of the trench TR. Figure 7As shown, in at least one cross-section perpendicular to the main surface MS of the substrate 10, the signal pad 21 has a thickness T1 (first thickness) at the midpoint in the lateral direction (in the direction parallel to the main surface MS), and has a thickness T2 (second thickness) on the side surface FS. The thickness T1 is preferably not less than 10 μm, and more preferably not less than 25 μm. In addition, the thickness T1 is preferably not more than 100 μm. In the present embodiment, the thickness condition that the thickness T2 is greater than half of the thickness T1 is satisfied. In addition, the thickness T2 is further preferably not less than 70% of the thickness T1. In the present embodiment, the above-mentioned lateral direction is the direction along the edge ED. In addition, the signal pad 21 has a side surface FS that satisfies the thickness condition at each of its two ends in the lateral direction. In addition, the thickness T1 is the size of the signal pad 21, ignoring the electrode in the through hole connected to the signal pad 21 (not shown in the present embodiment), and also ignoring the solder 90 and the plated film attached to the signal pad 21. In addition, it is preferred that Figure 7 In the lateral direction of the signal pad 21 , the thickness of the signal pad 21 at a position 10 μm inside the end of the signal pad 21 is larger than half of the thickness T1 .

[0066] Considering the above neglect of the size, the lower surface of the signal pad 21 (the surface facing the substrate 10) is typically a flat surface without corners. Here, the "flat surface" may also include a portion having a slight curvature mainly for manufacturing reasons. Here, the "slight curvature" is, for example, a curvature with a radius of curvature greater than or equal to the pad width WP described later. In addition, typically, Figure 7 In such a cross-sectional view, the thickness of the signal pad 21 has a maximum value at the substantially central portion of the signal pad 21 (more generally, the portion away from both ends of the signal pad 21), and is substantially constant or gradually decreases from this portion toward both ends. More typically, Figure 7 In such a cross-sectional view, the minimum thickness of the signal pad 21 is thickness T2. In this case, the thickness of the signal pad 21 is greater than or equal to T2 and less than or equal to T1. Figure 7 In such a cross-sectional view, the thickness of the signal pad 21 is preferably within a range of ±30% from the average value.

[0067] In this embodiment, the side surface FS of the signal pad 21 extends to the edge ED ( Figure 6 ). A cross-sectional view perpendicular to the main surface MS of the substrate 10 and including the edge ED Figure 7 The cross-sections are roughly the same, so the aforementioned thickness conditions are met in both cross-sections.

[0068] The signal pad 21 has a pad width WP as a width dimension in the lateral direction (specifically, on the edge ED in the present embodiment). The pad width WP is preferably greater than 250 μm and less than 500 μm. In addition, the pad width WP is greater than the width of the signal lead 321, and preferably, the signal pad 21 has a margin of more than 100 μm on both sides of the signal lead 321. In the present embodiment, it is preferred that the margins on both sides are substantially the same. In other words, in the lateral direction, the center of the signal lead 321 is preferably substantially consistent with the center of the signal pad 21. In addition, the pad width WP is preferably greater than 40% and less than 95% of the distance between the center of the signal pad 21 and the center of the signal pad 22 in the lateral direction.

[0069] In this embodiment, the pad width WP and the trench spacing ST ( Figure 7 ) are equal. The aforementioned thickness condition is preferably satisfied in at least any cross-section perpendicular to the main surface MS of the substrate 10 and parallel to the edge ED and within 30% of the pad width WP from the edge ED. More preferably, the aforementioned thickness condition is satisfied in at least any cross-section perpendicular to the main surface MS of the substrate 10 and parallel to the edge ED and within 50% of the pad width WP from the edge ED.

[0070] In addition, the structure of the signal pad 22 may be the same as the structure of the above-mentioned signal pad 21. Unlike the signal pads 21 and 22, the ground pads 26 and 27 may be located away from the trench TR.

[0071] The signal lead 321 is bonded to the signal pad 21 by solder 90 so as to be electrically connected to the signal pad 21. The portion of the signal lead 321 bonded to the signal pad 21 is preferably along a direction perpendicular to the edge ED, in other words, along the line VII-VII ( Figure 6 ) extends in a direction perpendicular to the direction of the solder 90. The solder 90 is made of a material different from that of the signal pad 21, and preferably has a melting point lower than that of the signal pad 21, such as silver solder. The signal lead 322 is joined to the signal pad 22 via the solder 90 in a manner electrically connected to the signal pad 22. The ground lead 326 is joined to the ground pad 26 via the solder 90 in a manner electrically connected to the ground pad 26. The ground lead 327 is joined to the ground pad 27 via the solder 90 in a manner electrically connected to the ground pad 27. The width of the signal lead 321 ( Figure 6 as well as Figure 7 The width of the signal lead 322 may be the same as that of the ground lead 326 and the ground lead 327. The width of each of the ground lead 326 and the ground lead 327 may be greater than that of the signal lead 321.

[0072] Fig. 9 So with Figure 7The same field of view shows a partial cross-sectional view of the structure of a terminal structure 300A as Comparative Example 1. In the terminal structure 300A, the pad width WP of the signal pad 21 is smaller than the trench interval ST, and the signal pad 21 is away from the trench TR. Fig. 9 In the cross-sectional view of FIG. 1 , the thickness of the signal pad 21 at both ends is less than half of the thickness T1 at the midpoint in the lateral direction (in the direction parallel to the main surface MS). Typically, Fig. 9 The thickness of the signal pad 21 is less than 1 μm in the longitudinal direction. Such a structure is typical when the signal pad 21 away from the trench TR is formed by screen printing as described above. The reason for this is that in screen printing, the thickness tends to become quite small at the end of the pattern.

[0073] When the external force F( Figure 8 ) is applied to the signal lead 321, stress is applied to the signal pad 21 connected to the signal lead 321. In the terminal structure 300A, the signal pad 21 is easily damaged due to this stress. The reason is that, as a first reason, since the pad width WP is small, the stress per unit area applied to the signal pad 21 is likely to become large. As a second reason, since the two ends of the signal pad 21 are thin, it is difficult to relax the stress at these two ends, and as a result, the ends of the signal pad 21 are likely to become the starting point of damage.

[0074] Fig.10 So with Figure 7 The same field of view shows a partial cross-sectional view of the structure of the terminal structure 300B as comparative example 2. In the terminal structure 300B, the pad width WP of the signal pad 21 is substantially the same as the groove spacing ST. Therefore, the above-mentioned first reason described in association with the terminal structure 300A as comparative example 1 does not conform to the terminal structure 300B. On the other hand, in this comparative example 2, the signal pad 21 has a thickness T2 that is substantially zero (for example, a thickness of less than 1 μm) on the outer plug surface of the flat surface FP of the groove TR, so the above-mentioned second reason also conforms to the terminal structure 300B. Therefore, the signal pad 21 is also easily damaged in the terminal structure 300B. In addition, it is more difficult to manufacture to make the portion where the thickness of the signal pad 21 is substantially zero and the side wall of the groove TR in the lateral direction with high precision as in the terminal structure 300B.

[0075] According to the present embodiment, first, by providing the groove TR on the main surface MS of the substrate 10, the capacitive coupling between the wiring paths can be adjusted. Thus, it is possible to cope with broadband. Second, by satisfying the aforementioned thickness condition (thickness T2>thickness T1 / 2), it is possible to avoid the signal pad 21 having too small a thickness on the side FS. Thus, when force is applied to the signal lead 321, the signal pad 21 is difficult to be damaged near the side FS. Therefore, the bonding strength of the signal lead 321 can be improved. Third, the side FS of the signal pad 21 is located on the outer insertion surface of the flat surface FP of the groove TR. Thus, in the manufacture of the terminal structure 301, the side FS of the signal pad 21 can be formed along with the process of forming the groove TR. Therefore, the side FS with a sufficient thickness as described above can be formed without much labor during manufacturing. According to the above, it is possible to cope with broadband, and the bonding strength of the signal lead 321 can be improved without significantly increasing the labor used for manufacturing.

[0076] In addition, in the present embodiment, the aforementioned thickness condition is satisfied in a cross section perpendicular to the main surface MS of the substrate 10 and including the edge ED. Thus, when a force is applied to the signal lead 321, the signal pad 21 is less likely to be damaged near the edge ED of the substrate 10. The aforementioned thickness condition is preferably satisfied in at least any cross section perpendicular to the main surface MS of the substrate 10 and within 30% of the pad width WP from the edge ED. Thus, when a force is applied to the signal lead 321, the signal pad 21 is less likely to be damaged near the edge ED of the substrate 10.

[0077] The signal pad 21 for the signal line is arranged between the ground pad 26 and the ground pad 27. This can prevent leakage of electromagnetic fields from the signal wiring including the signal pad 21. Therefore, it is possible to cope with a further increase in bandwidth.

[0078] The groove TR includes a portion between the signal pad 21 and the signal pad 22, a portion between the signal pad 21 and the ground pad 26, and a portion between the signal pad 22 and the ground pad 27. Thus, excessive capacitive coupling between the signal line passing through the signal pad 21 and the signal line passing through the signal pad 22 can be avoided. Furthermore, excessive capacitive coupling between the signal line passing through the signal pad 21 and the ground line passing through the ground pad 26, and between the signal line passing through the signal pad 22 and the ground line passing through the ground pad 27 can be avoided. Therefore, it is possible to further cope with broadbanding.

[0079] Fig.11 is schematically shown as Figure 7 FIG. 3 is a partial cross-sectional view of a terminal structure 302 according to a first modification example. In the terminal structure 302, the solder 90 extends onto the side surface FS of the signal pad 21. In this modification example, substantially the same effects as those of the first embodiment described above can be obtained.

[0080] Fig.12 is schematically shown as Figure 7 A partial cross-sectional view of a terminal structure 303 of a second variant. In the terminal structure 303, the flat surface FP and the side surface FS are inclined at an angle AG from a surface perpendicular to the main surface MS. In this variant, the thickness T2 is defined as the thickness of the side surface FS along the thickness direction ( Fig.12 That is, the product of the length of the side surface FS along the flat surface FP and cosAG is the thickness T2. If the angle AG is small enough, the same effect as that of the first embodiment can be obtained in this modification. The angle AG is preferably less than 30°. In addition, it is preferred that Fig.12 In the lateral direction, the thickness of the signal pad 21 at a position 10 μm inside (10 μm closer to the midpoint) from the end of the signal pad 21 (in the figure, the upper end of the side surface FS) is greater than half of the thickness T1.

[0081] In the present embodiment described above, a differential line CA ( Figure 3 ) is a pair of pads for use as signal pads 21 and signal pads 22. As a modified example, a single line may be provided instead of a differential line. In this case, the signal pad 22 and the signal lead 322 may be omitted. In addition, in the above description, the side FS of the signal pad 21 extends to the edge ED ( Figure 6 ), but as a modification, the side surface FS may not reach the edge ED.

[0082] In addition, in each of the above-mentioned cross-sectional views, the surfaces of the signal pad 21, the signal pad 22, the ground pad 26, and the ground pad 27 are on the same plane as the portion of the main surface MS of the substrate 10 where these pads are not formed. Such a form can typically be obtained by forming a paste layer that becomes these pads on a raw sheet that becomes the substrate 10 by screen printing during manufacturing, and then punching these paste layers into the raw sheet before the firing process. As a modified example, the surface of each pad can also be raised from the portion of the main surface MS where these pads are not formed, and such a form can be obtained by weakening or omitting the above-mentioned punching. Alternatively, such a form can be obtained by performing a printing process of the paste layer that becomes each pad after the firing process of the substrate 10.

[0083] <Implementation method 2>

[0084] Fig.133 is a partial top view schematically showing the structure of the terminal structure 304 in the second embodiment. In the present embodiment, the groove TR includes a portion between the connection layer 25 and the signal pad 21, and a portion between the connection layer 25 and the signal pad 22. Furthermore, the signal pad 21 is completely surrounded by the edge ED and the groove TR on the main surface of the substrate 10. Specifically, the signal pad 21 has a quadrilateral shape having one side formed by the edge ED and three sides formed by the groove TR. In addition, Fig.13 In the example shown, the trench TR is not formed on the main surface of the base 10 in the region in the diagonal direction from the signal pad 21. As a modified example, the terminal structure 305 ( Fig.14 ), a trench TR is also formed on the main surface of the base 10 in a region in a diagonal direction from the signal pad 21.

[0085] In addition, since the configuration other than the above is substantially the same as that of the above-mentioned first embodiment, the same reference numerals are given to the same or corresponding elements, and the description thereof will not be repeated.

[0086] According to the present embodiment, the trench TR includes a portion between the connection layer 25 and the signal pad 21, and a portion between the connection layer 25 and the signal pad 22. Thus, it is possible to avoid excessive capacitive coupling between the connection layer 25 having a ground potential and the signal line passing through the signal pad 21 and the signal line passing through the signal pad 22. Therefore, it is possible to further cope with wider bandwidth.

[0087] The signal pad 21 is completely surrounded by the edge ED and the trench TR on the main surface MS. Thus, capacitive coupling can be suppressed around the entire periphery of the signal pad 21. Therefore, a decrease in the characteristic impedance of the wiring passing through the signal pad 21 can be further suppressed.

[0088] <Implementation method 3>

[0089] Fig.15 This is a partial plan view schematically showing the structure of the terminal structure 306 in the third embodiment. Fig.16 It is along Fig.15 A schematic partial cross-sectional view taken along line XVI-XVI.

[0090] The terminal structure 306 includes a signal pad 21A (first pad) and a signal pad 22A (fourth pad) instead of the terminal structure 301 ( Figure 6 as well as Figure 7: The signal pad 21 and the signal pad 22 of Embodiment 1. In this embodiment, the trench TR includes the portion between the signal pad 21A and the signal pad 22A, but does not include the portion between the signal pad 21A and the ground pad 26 and the portion between the signal pad 22A and the ground pad 27. Therefore, the main surface MS of the substrate 10 is flat between the signal pad 21A and the ground pad 26 and between the ground pad 27 and the signal pad 22A. As a result, the signal pad 21A, unlike the signal pad 21, has a side surface FS that satisfies the thickness condition (thickness T2>thickness T1 / 2) described in Embodiment 1 only at one end (in the figure, the right end that is in contact with the trench TR) in the lateral direction (specifically, in the direction along the edge ED). The thickness of the other end (in the figure, the left end) is less than half of the thickness T1, typically less than 1 μm.

[0091] In a plane layout parallel to the main surface MS (refer to Fig.15 ), the signal pad 21A includes a first region R1 between the signal lead 321 and the trench TR, and a second region R2 separated from the first region R1 by the signal lead 321. The first region R1 is along a virtual straight line ( Fig.15 The dimension line in the virtual straight line has a minimum distance DT between the signal lead 321 and the trench TR. The dimension DM of the second region R2 along the one virtual straight line is preferably greater than the minimum distance DT. In this case, in the lateral direction, the center of the signal lead 321 is offset from the center of the signal pad 21A, and the offset is, for example, 10 μm or more and 25 μm or less. In other words, the difference between the dimension DM and the minimum distance DT is, for example, 20 μm or more and 50 μm or less.

[0092] The structure of the signal pad 22A may be the same as that of the signal pad 21A. Specifically, the structure of the signal pad 22A may be symmetrical to that of the signal pad 21A in the horizontal direction.

[0093] In addition, since the configuration other than the above is substantially the same as that of the above-mentioned first embodiment, the same reference numerals are given to the same or corresponding elements, and the description thereof will not be repeated.

[0094] According to this embodiment, it is also possible to provide the side surface FS that satisfies the thickness condition described in Embodiment 1. Thus, effects similar to those of Embodiment 1 can be obtained.

[0095] In particular, when the dimension DM is larger than the minimum distance DT, the second region R2 of the signal pad 21A becomes larger, so when a force is applied to the signal lead 321, the second region R2 of the signal pad 21A is difficult to be damaged. On the other hand, the first region R1 of the signal pad 21A is difficult to be damaged by satisfying the aforementioned thickness condition. Based on the above, both the first region R1 and the second region R2 of the signal pad 21A are difficult to be damaged. Therefore, the bonding strength of the signal lead 321 to the signal pad 21A can be improved.

[0096] <Implementation method 4>

[0097] Fig.17 It is a partial plan view schematically showing the structure of the terminal structure 307 in the fourth embodiment. Fig.18 It is along Fig.17 A schematic partial cross-sectional view taken along line XVIII-XVIII.

[0098] The terminal structure 307 includes a signal pad 21B (first pad) and a signal pad 22B (fourth pad) instead of the terminal structure 301 ( Figure 6 as well as Figure 7 : The signal pad 21 and the signal pad 22 of Embodiment 1. In the present embodiment, the groove TR includes the portion between the signal pad 21B and the ground pad 26 and the portion between the signal pad 22B and the ground pad 27, but does not include the portion between the signal pad 21B and the signal pad 22B. Therefore, the main surface MS of the substrate 10 is flat between the signal pad 21B and the signal pad 22B. As a result, the signal pad 21B is different from the signal pad 21 in that only one end (in the figure, the left end connected to the groove TR) in the lateral direction (specifically, along the direction of the edge ED) has a side surface FS that satisfies the thickness condition (thickness T2>thickness T1 / 2) described in Embodiment 1. The thickness of the other end (in the figure, the right end) is less than half of the thickness T1, typically less than 1 μm.

[0099] In a plane layout parallel to the main surface MS (refer to Fig.17 ), the signal pad 21B includes a first region R1 between the signal lead 321 and the trench TR, and a second region R2 separated from the first region R1 by the signal lead 321. The first region R1 is along a virtual straight line ( Fig.17 The dimension line in FIG. 2 shows a dimension line in FIG. 3 ), and has a minimum distance DT between the signal lead line 321 and the trench TR. The dimension DM of the second region R2 along the one virtual straight line is preferably greater than the minimum distance DT.

[0100] The structure of the signal pad 22B may be the same as that of the signal pad 21B. Specifically, the structure of the signal pad 22B may be symmetrical to that of the signal pad 21B in the horizontal direction.

[0101] In addition, since the configuration other than the above is substantially the same as that of the above-mentioned first embodiment, the same reference numerals are given to the same or corresponding elements, and the description thereof will not be repeated.

[0102] According to this embodiment, it is also possible to provide the side surface FS that satisfies the thickness condition described in Embodiment 1. Thus, effects similar to those of Embodiment 1 can be obtained.

[0103] In particular, when the dimension DM is larger than the minimum distance DT, the second region R2 of the signal pad 21B becomes larger, so when a force is applied to the signal lead 321, the second region R2 of the signal pad 21B is difficult to be damaged. On the other hand, the first region R1 of the signal pad 21B is difficult to be damaged by satisfying the aforementioned thickness condition. Based on the above, both the first region R1 and the second region R2 of the signal pad 21B are difficult to be damaged. Therefore, the bonding strength between the signal lead 321 and the signal pad 21B can be improved.

[0104] <Implementation method 5>

[0105] In this embodiment, the terminal structure 301 ( Figure 6 as well as Figure 7 : An example of the manufacturing method of embodiment 1) is described.

[0106] Fig.19 It is a partial top view schematically showing the first step. Fig. 20 It is along Fig.19 A schematic partial cross-sectional view taken along line XX-XX of FIG. 2 is a schematic partial cross-sectional view of FIG. 2 . In addition, the two-dot chain line in the figure indicates a region removed by laser processing described later.

[0107] A first green sheet 11G including a portion to be the substrate 10 is formed. The first green sheet 11G has a first surface F1 and a second surface F2 opposite to the first surface F1. On the first surface F1 of the first green sheet 11G, a portion including signal pads 21 and signal pads 22 ( Figure 6 as well as Figure 7 ) of the paste layer 20P. In addition, on the first surface F1 of the first green sheet 11G, the ground pads 26, the ground pads 27 and the connection layer 25 ( Figure 6 as well as Figure 7) paste layer 26P, paste layer 27P and paste layer 25P. Printing can be performed using screen printing technology. In addition, a second green sheet 12G including a portion that becomes the substrate 10 is formed. The first green sheet 11G and the second green sheet 12G are stacked in a manner such that the second surface F2 of the first green sheet 11G and the second green sheet 12G face each other, thereby forming a stacked body 81. In addition, the number of the plurality of green sheets in the stacked body 81 is arbitrary, and Fig. 20 A third green sheet 13G is also stacked in the middle.

[0108] Fig.21 1 is a partial cross-sectional view schematically showing the second step of the manufacturing method of the terminal structure 301 in the fifth embodiment. A step of removing a portion of the laminate 81 by laser processing is performed. By removing a portion of the first green sheet 11G through this step, a surface that becomes at least a portion of the flat surface FP of the groove TR is formed on the first green sheet 11G. In addition, by removing a portion of the paste layer 20P through the above-mentioned step, the paste layer 20P is patterned into the paste layer 21P and the paste layer 22P that become the signal pad 21 and the signal pad 22, respectively. In addition, accompanying this, a surface that becomes the side surface FS of the signal pad 21 is formed on the paste layer 21P. After the above-mentioned laser processing, the laminate 81 is fired.

[0109] Fig. 22 1 is a partial cross-sectional view schematically showing the third step. Fig.21 ) to form a sintered body 89. Specifically, the base 10 is formed from the first green sheet 11G, the second green sheet 12G, and the third green sheet 13G. In addition, the signal pad 21, the signal pad 22, the ground pad 26, the ground pad 27, and the connection layer 25 are formed from the paste layer 21P, the paste layer 22P, the paste layer 26P, the paste layer 27P, and the paste layer 25P, respectively.

[0110] Reference Figure 7 After that, the signal lead wire 321 is mounted on the signal pad 21 by using solder 90 so as to be electrically connected to the signal pad 21. Other leads are mounted in the same manner. Through the above, the terminal structure 301 is obtained.

[0111] In addition, Fig.21 In the process, the bottom of the groove TR is shallower than the second surface F2, but the groove TR may be deeper than the second surface F2, for example, it may be located in the second green sheet 12G or the third green sheet 13G. In addition, the above-mentioned manufacturing method can be applied not only to the first embodiment but also to the second to fourth embodiments by adjusting the range of laser processing.

[0112] According to the present embodiment, the groove TR is formed by laser processing after forming the stacked body 81. Thus, the pattern of the groove TR can be arbitrarily selected. Fig.13 or Fig.14 As shown, even a layout in which a part of the main surface of the base body 10 is entirely surrounded by the edge ED and the trench TR can be adopted.

[0113] Fig.23 It is shown Fig.19 A schematic partial top view of a modified example of . Fig.24 Show Fig. 20 A variation of Fig.23 A schematic partial cross-sectional view taken along line XXIV-XXIV of FIG. 2 is shown in FIG. 2. In this modification, a paste layer 21P and a paste layer 22P are printed instead of the paste layer 20P ( Fig.19 as well as Fig. 20 ). First page F1( Fig.24 ) There is an area between the paste layer 21P and the paste layer 22P where the paste layer is not printed, and this area is removed by laser processing. By providing such an area, Fig. 20 In particular, when the paste contains a precious metal, the manufacturing cost can be greatly reduced by this saving.

[0114] <Implementation method 6>

[0115] Fig.25 FIG. 2 is a partial cross-sectional view schematically showing the structure of the terminal structure 308 in the sixth embodiment. The terminal structure 308 includes at least one wiring layer 30. Fig.25 The example shown has a wiring layer 31 and a wiring layer 32. The wiring layer 30 is provided in the base body 10 away from the main surface MS and parallel to the main surface MS. Fig.25 In addition, the terminal structure 308 has an electrode 41 formed in the through hole for connecting the signal pad 21 and the signal pad 22 to the wiring layer 30 in the thickness direction. In addition, the terminal structure 308 has an electrode 42 formed in the through hole for connecting the wiring layer 31 and the wiring layer 32 in the thickness direction. In addition, as described in Embodiment 1, the electrode 41 is formed with respect to the thickness T1 ( Figure 7 ) is ignored.

[0116] When the manufacturing of the terminal structure 308 includes a lamination process of a plurality of green sheets as described in the fifth embodiment, the terminal structure 308 is formed in the thickness direction ( Fig.25In the longitudinal direction (in the thickness direction), the paste layer that becomes the wiring layer 30 is arranged between the raw sheets. Assuming that the bottom of the groove TR must also be arranged between the raw sheets, the position of the bottom of the groove TR is included in the existence range of the wiring layer 30 in the thickness direction. In this case, the freedom of adjustment of the capacitive coupling based on the groove TR is limited. In the present embodiment, in the thickness direction, the bottom of the groove TR can deviate from any one of the wiring layers 30. Thereby, the freedom of adjustment of the capacitive coupling is improved. Such a configuration can be easily obtained by, for example, the manufacturing method described in embodiment 5. In addition, the depth of the bottom of the groove TR does not have to be uniform, such as Fig.25 As shown, the bottom portion TB1 and the bottom portion TB2 may have different depths from each other.

[0117] In addition, the features described in this embodiment can also be applied to any of the above-mentioned embodiments 1 to 5.

[0118] <Implementation method 7>

[0119] In this embodiment, the terminal structure 301 ( Figure 6 as well as Figure 7 : An example of a manufacturing method of embodiment 1) that is different from the aforementioned embodiment 5 is described.

[0120] Fig.26 It is a partial top view schematically showing the first step. Fig. 27 It is along Fig.26 A schematic partial cross-sectional view taken along line XXVII-XXVII of FIG. In addition, the two-dot chain line in the figure shows a region removed by punching to be described later.

[0121] A first green sheet 11G including a portion to be the substrate 10 is formed. The first green sheet 11G has a first surface F1 and a second surface F2 opposite to the first surface F1. On the first surface F1 of the first green sheet 11G, a portion including signal pads 21 and signal pads 22 ( Figure 6 as well as Figure 7 ) of the paste layer 20P. In addition, on the first surface F1 of the first green sheet 11G, the ground pads 26, the ground pads 27 and the connection layer 25 ( Figure 6 as well as Figure 7 ) paste layer 26P, paste layer 27P and paste layer 25P. Printing can be performed using screen printing technology. Through these printings, a composite layer 11C including the first green sheet 11G, the paste layer 20P, the paste layer 26P, the paste layer 27P and the paste layer 25P is formed.

[0122] Fig.28 It is a partial top view schematically showing the second step. Fig.29 It is along Fig.28A schematic partial cross-sectional view taken along line XXIX-XXIX of FIG. A step of removing a portion of the composite layer 11C by punching is performed. A portion of the first green sheet 11G is removed by this step, thereby forming a surface that becomes at least a portion of the flat surface FP of the groove TR on the first green sheet 11G. In addition, a portion of the paste layer 20P is removed by the above-mentioned step, thereby patterning the paste layer 20P into a paste layer 21P and a paste layer 22P that become the signal pad 21 and the signal pad 22, respectively. Along with this, a surface that becomes the side surface FS of the signal pad 21 is formed on the paste layer 21P.

[0123] Fig.30 1 is a partial cross-sectional view schematically showing the third step. A second green sheet 12G including a portion to be the base 10 is formed. After the punching process described above, the first green sheet 11G and the second green sheet 12G are stacked in such a manner that the second surface F2 of the first green sheet 11G and the second green sheet 12G face each other, thereby forming a stacked body 84. The number of the plurality of green sheets in the stacked body 84 is arbitrary. Fig.30 A third green sheet 13G and a fourth green sheet 14G are also stacked. Fig.30 In the example shown, the region of the first green sheet 11G subjected to the punching process becomes the groove TR, and the position of the bottom of the groove TR corresponds to the position of the second surface F2 of the first green sheet 11G in the thickness direction. In addition, as a modified example, the second green sheet 12G may also be subjected to the punching process, thereby enabling the position of the bottom of the groove TR to be set to a position between the second green sheet 12G and the third green sheet 13G.

[0124] After the above lamination process, the laminated body 84 ( Fig.30 ) is fired. Thus, a fired body 89 ( Fig. 22 Specifically, the substrate 10 is formed from the first green sheet 11G, the second green sheet 12G, the third green sheet 13G, and the fourth green sheet 14G. In addition, the signal pad 21, the signal pad 22, the ground pad 26, the ground pad 27, and the connection layer 25 are formed from the paste layer 21P, the paste layer 22P, the paste layer 26P, the paste layer 27P, and the paste layer 25P, respectively.

[0125] Reference Figure 7 After that, the signal lead wire 321 is mounted on the signal pad 21 by using solder 90 so as to be electrically connected to the signal pad 21. Other leads are mounted in the same manner. Through the above, the terminal structure 301 is obtained.

[0126] According to this embodiment, the groove TR of the base body 10 can be formed by punching as a simple process. In addition, the punching process is performed on the first green sheet 11G before the lamination process. Fig.13 or Fig.14 ) in which a portion of the main surface of the substrate 10 is entirely surrounded by the edge ED and the groove TR, the portion of the first green sheet 11G thus surrounded is separated from the other portions. Therefore, the manufacturing method of this embodiment is particularly suitable for obtaining the terminal structures described in the above-mentioned embodiments 1, 3, and 4.

[0127] Fig.31 It is shown Fig.26 A schematic partial top view of a modified example of . Fig.32 Show Fig. 27 A variation of Fig.31 In this modification, the paste layer 21P and the paste layer 22P are printed instead of the paste layer 20P ( Fig.26 as well as Fig. 27 ). First page F1( Fig.32 ) There is an area between the paste layer 21P and the paste layer 22P where the paste layer is not printed, and this area is removed by punching. By providing such an area, Fig. 27 In particular, when the paste contains a precious metal, the manufacturing cost can be greatly reduced by this saving.

[0128] In addition, in the above-mentioned embodiments, the case where the shape of the signal pad is a quadrilateral is described, but other shapes may be used. In addition, in embodiments 5 and 7, the process of forming the groove by processing the green sheet is described, but as a modified example, before forming the groove, the green sheet may be fired to form a fired body. In this case, the signal pad is formed on the fired body, and then the groove is formed.

[0129] <Experiment>

[0130] As shown in Table 1 below, the terminal structure 301 ( Figure 6 as well as Figure 7 ) corresponding to the embodiment, and the terminal structure 300A ( Fig. 9 ) and the corresponding comparative example 1 and the terminal structure 300B ( Fig.10 ) corresponding to Comparative Example 2, and evaluated the bonding strength of the signal lead 321 to the signal pad 21.

[0131] [Table 1]

[0132] Comparative Example 1 Comparative Example 2 Example Groove spacing ST 0.45mm 0.45mm 0.45mm Pad width WP 0.38mm 0.45mm 0.45mm Position relationship between groove and pad Separation Slightly separated continuous Thickness T1 at the center of the pad 37μm 37μm 36μm Thickness T2 of the side of the pad Less than 1μm Less than 1μm 28μm Sample quantity 26 26 47 Average value of bonding strength 8.0N 9.9N 11.2N Minimum bonding strength 3.5N 3.9N 4.9N

[0133] In Comparative Example 1, Comparative Example 2, and the embodiment, the trench interval ST is set to 0.45 mm. On the other hand, the pad width WP is set to 0.38 mm in Comparative Example 1, and is set to 0.45 mm in Comparative Example 2 and the embodiment. The trench TR and the signal pad 21 are separated from each other by about several tens of μm in Comparative Example 1, slightly separated from each other (about several μm) in Comparative Example 2, and continuous with each other in the embodiment.

[0134] The length of the signal pad 21 and the trench TR ( Figure 6 The longitudinal dimension in the middle is generally set to 0.64 mm. The width of the signal lead 321 ( Figure 7 , Fig. 9 as well as Fig.10 The lateral dimension in the middle is generally set to 0.2 mm, and the thickness of the signal lead 321 ( Figure 7 , Fig. 9 as well as Fig.10 The length of the portion of the signal lead 321 that is bonded to the signal pad 21 ( Figure 6 The longitudinal length in the middle of the pad is set to 0.58 mm. In the embodiment, the thickness T1 at the center of the pad is 36 μm, and the thickness T2 at the side of the pad is 28 μm. Therefore, the thickness T2 at the side of the pad is about 78% of the thickness T1 at the center of the pad, which is larger than half of the thickness T1.

[0135] For each terminal structure, Figure 8 As shown in FIG. 1 , an external force F is applied to the front end of the signal lead 321 along the thickness direction of the terminal structure. In addition, for the convenience of the experiment, before applying the external force F, as shown in FIG. Figure 8 As shown by the double-dashed line, the signal lead 321 was plastically deformed. The bonding strength of the signal lead 321 was measured by the external force F required to peel off the signal lead 321 of each sample. In addition, the average value and the minimum value between the samples were calculated for Comparative Example 1, Comparative Example 2 and the embodiment.

[0136] The bonding strength of Comparative Example 1 is the lowest. As a first reason, it can be inferred that since the pad width WP is small, the stress per unit area applied to the signal pad 21 tends to increase. As a second reason, it can be inferred that since the two ends of the signal pad 21 are thin, it is difficult for the stress relaxation at these two ends to work, and as a result, the ends of the signal pad 21 tend to become the starting point of damage. In Comparative Example 2, it can be inferred that since the pad width WP of the signal pad 21 is roughly the same as the groove spacing ST, the above-mentioned first reason is not met, and the bonding strength is slightly improved. In the embodiment, it can be inferred that since not only the above-mentioned first reason is not met, but also the second reason is not met, the bonding strength is greater than that of Comparative Examples 1 and 2.

[0137] In addition, as in Comparative Example 2 ( Fig.10 : The terminal structure 300B) is made such that the portion where the thickness of the signal pad 21 is substantially zero and the side wall of the groove TR are roughly consistent with each other in manufacturing, which is difficult. In this experiment, after manufacturing a plurality of samples, a sample corresponding to Comparative Example 2 was extracted from these samples, thereby obtaining a sample corresponding to Comparative Example 2. If the terminal structure of Comparative Example 2 is mass-produced, a low yield rate can be expected. In contrast, such a yield rate problem is not envisioned for Comparative Example 1 and the embodiment.

[0138] While the present invention has been described in detail, the above description is in all aspects illustrative and the present invention is not limited thereto. It should be understood that numerous modifications not shown here are conceivable without departing from the scope of the present invention.

[0139] Explanation of symbols

[0140] 10: Matrix

[0141] 11C: Composite layer

[0142] 11G: First green sheet

[0143] 12G: Second raw film

[0144] 13G: The third raw film

[0145] 14G: The fourth raw film

[0146] 20P: Paste layer

[0147] 21, 21A, 21B: signal pads (first pads)

[0148] 21P: Paste layer

[0149] 22, 22A, 22B: signal pad (fourth pad)

[0150] 22P: Paste layer

[0151] 25: Connection layer

[0152] 25P: Paste layer

[0153] 26: Ground pad (second pad)

[0154] 26P: Paste layer

[0155] 27: Ground pad (third pad)

[0156] 27P: Paste layer

[0157] 30~32: Wiring layer

[0158] 41, 42: Electrode

[0159] 81, 84: Laminated body

[0160] 89: Sintered body

[0161] 90: Brazing material

[0162] 301~308: Terminal structure

[0163] 311, 311a: Signal terminals

[0164] 312, 312a: Signal terminals

[0165] 316, 316a: Ground terminal

[0166] 317, 317a: Ground terminal

[0167] 321, 321a, 322, 322a: Signal leads

[0168] 326, 326a, 327, 327a: Ground lead

[0169] 331, 331a, 332, 332a: signal lines

[0170] 336, 336a, 337, 337a: Ground wire

[0171] 501: Encapsulation

[0172] 530: Shell

[0173] 531: plate body

[0174] 532: Frame

[0175] 535: Opening

[0176] 701: High frequency module

[0177] 730: Cover

[0178] 750: Internal Circuit

[0179] 752: Optical components

[0180] CA: Differential Line

[0181] CB: Differential Line

[0182] CV: Chamber

[0183] TR: Groove.

Claims

1. A terminal structure, wherein: The terminal structure includes a base body, the base body is made of insulating ceramic and has a main surface provided with a groove. The groove includes a flat surface connected to the main surface, The terminal structure further comprises: A first pad is provided on the main surface of the substrate and is made of metal; and A lead is disposed on the first pad in a manner electrically connected to the first pad, The first pad has a side surface on the external insertion surface of the flat surface of the groove. In at least one cross-section perpendicular to the main surface of the substrate, the first pad has a first thickness at a midpoint in a direction parallel to the main surface, and has a second thickness on the side surface, and satisfies a thickness condition that the second thickness is greater than half of the first thickness.

2. The terminal structure according to claim 1, wherein: The main surface of the substrate includes a linear edge, and the side surface of the first pad extends to the edge. The thickness condition is satisfied in a cross section perpendicular to the main surface of the substrate and including the edge.

3. The terminal structure according to claim 2, wherein: The first pad has a width dimension at the edge, and the thickness condition is satisfied at least in any cross section perpendicular to the main surface of the base body and within 30% of the width dimension from the edge.

4. The terminal structure according to claim 2 or 3, wherein: The first pad is completely surrounded by the edge and the groove on the main surface.

5. The terminal structure according to any one of claims 1 to 3, wherein: The terminal structure further includes at least one wiring layer provided in the base body away from the main surface and extending parallel to the main surface, and the bottom of the groove is offset from any one of the at least one wiring layer in terms of position in the thickness direction.

6. The terminal structure according to any one of claims 1 to 3, wherein: The terminal structure further includes a second pad and a third pad, the second pad and the third pad are provided on the main surface of the base and are made of metal, the first pad is arranged between the second pad and the third pad, The first pad is a pad for a signal line, and the second pad and the third pad are pads for grounding.

7. The terminal structure according to claim 6, wherein: The terminal structure further includes a fourth pad for a signal line made of metal between the first pad and the third pad on the main surface of the base body. The groove includes a portion between the first pad and the fourth pad, and the main surface of the base is flat between the first pad and the second pad and between the third pad and the fourth pad.

8. The terminal structure according to claim 7, wherein: In a planar layout parallel to the main surface, the first pad includes a first area between the lead and the groove, and a second area separated from the first area by the lead, the first area having a minimum distance between the lead and the groove along a virtual straight line, and the size of the second area along the virtual straight line is greater than the minimum distance.

9. The terminal structure according to claim 6, wherein: The terminal structure further includes a fourth pad for a signal line made of metal between the first pad and the third pad on the main surface of the base body. The groove includes a portion between the first pad and the second pad and a portion between the fourth pad and the third pad, and the main surface of the base is flat between the first pad and the fourth pad.

10. The terminal structure according to claim 9, wherein: In a planar layout parallel to the main surface, the first pad includes a first area between the lead and the groove, and a second area separated from the first area by the lead, the first area having a minimum distance between the lead and the groove along a virtual straight line, and the size of the second area along the virtual straight line is greater than the minimum distance.

11. The terminal structure according to claim 6, wherein: The terminal structure further includes a fourth pad for a signal line made of metal between the first pad and the third pad on the main surface of the base body. The trench includes a portion between the first pad and the fourth pad, a portion between the first pad and the second pad, and a portion between the fourth pad and the third pad.

12. The terminal structure according to claim 11, wherein: The terminal structure further includes a connection layer provided on the main surface and connecting the second pad and the third pad to each other, and the groove includes a portion between the connection layer and the first pad and a portion between the connection layer and the fourth pad.

13. A package comprising: The terminal structure according to any one of claims 1 to 12; a frame body on which the terminal structure is installed; and The plate body supports the frame body.

14. A method for manufacturing a terminal structure, which is the method for manufacturing a terminal structure according to any one of claims 1 to 12, The method for manufacturing the terminal structure includes the steps of forming a first green sheet including a portion to be the base and a second green sheet, wherein the first green sheet has a first surface and a second surface opposite to the first surface. The manufacturing method of the terminal structure also includes: a step of printing a paste layer including a portion to be the first pad on the first surface of the first green sheet; A step of forming a laminated body by laminating the first green sheet and the second green sheet in such a manner that the second surface of the first green sheet and the second green sheet face each other; as well as A step of removing a portion of the laminate by laser processing; The step of removing a portion of the stacked body includes: a step of removing a portion of the first green sheet to form a surface that becomes at least a portion of the flat surface of the groove in the first green sheet; and a step of removing a portion of the paste layer to form a surface to be the side surface of the first pad in the paste layer, The manufacturing method of the terminal structure also includes: After the step of removing a portion of the laminate, a step of firing the laminate; and After the step of firing the laminated body, a step of mounting the lead on the first pad so as to be electrically connected to the first pad.

15. A method for manufacturing a terminal structure, which is the method for manufacturing a terminal structure according to any one of claims 1 to 12, The method for manufacturing the terminal structure includes the steps of forming a first green sheet including a portion to be the base and a second green sheet, wherein the first green sheet has a first surface and a second surface opposite to the first surface. The manufacturing method of the terminal structure also includes: a step of printing a paste layer including a portion to be the first pad on the first surface of the first green sheet, thereby forming a composite layer including the first green sheet and the paste layer; as well as a step of removing a portion of the composite layer by punching, The process of removing a portion of the composite layer comprises: a step of removing a portion of the first green sheet to form a surface that becomes at least a portion of the flat surface of the groove in the first green sheet; and a step of removing a portion of the paste layer to form a surface to be the side surface of the first pad in the paste layer, The manufacturing method of the terminal structure also includes: After the step of removing a portion of the composite layer, a step of stacking the first green sheet and the second green sheet so that the second surface of the first green sheet and the second green sheet face each other to form a stacked body; a step of firing the laminate; and After the step of firing the laminated body, a step of mounting the lead on the first pad so as to be electrically connected to the first pad.

Images