Debugging method, device and storage medium of laser processing equipment

Abstract

The present application relates to a debugging method, device and storage medium for laser processing equipment, the method comprising: obtaining a test file, the test file comprising at least one layer of a preset number, each layer being provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, each layer corresponding to a set of control parameters for the laser processing equipment; controlling the laser processing equipment to perform cutting processing on the corresponding test area of ​​the preset test plate according to the test pattern and the control parameters; obtaining detection result data after the preset test plate is cut; determining whether there is an abnormal defect in the optical path of the laser processing equipment according to the detection result data, if there is an abnormal defect, giving a prompt for the user to readjust the optical path of the laser processing equipment, if there is no abnormal defect, storing the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a debugging method, device and storage medium for laser processing equipment. Background Art

[0002] With the development of automation technology, the application of laser processing equipment is becoming more and more extensive. For example, laser processing equipment can realize punching or cutting of PCB and other plates. The principle is to use a high-power laser beam to irradiate the plate, so that the irradiated part of the plate is heated and evaporated, thereby forming a hole or a slit.

[0003] Before using laser processing equipment to process plates, it is usually necessary to debug or test the laser processing equipment. In the prior art, debugging of laser processing equipment is mainly used to adjust the optical path of the laser processing equipment. For example, it can be done by drilling holes and then observing the errors of the hole diameter in multiple directions to determine whether there are any abnormalities in the optical path. However, the inventors realized that in the process of laser cutting, the cutting process and control parameters of different plates are not the same. For example, for the same cutting depth, the control parameters corresponding to different plates are different. The relationship between the control parameters and the cutting depth of a specific plate is tested bit by bit. It can be seen that the debugging efficiency of the prior art is relatively low. Summary of the invention

[0004] The embodiments of the present invention provide a debugging method, device and storage medium for laser processing equipment, which can detect the laser processing equipment before the laser processing equipment processes a preset plate, and can detect whether there is an abnormality in the optical path of the laser processing equipment, and can also efficiently obtain the corresponding relationship between the cutting depth of the preset plate and the control parameters, thereby improving the detection efficiency of the laser processing equipment.

[0005] In a first aspect, the present application provides a debugging method for laser processing equipment, the method comprising:

[0006] Acquire a test file, wherein the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing device;

[0007] According to the test pattern and the control parameters, controlling the laser processing equipment to perform cutting processing on the corresponding test area of ​​the preset test plate;

[0008] Obtaining test result data after cutting of the preset test plate;

[0009] Based on the detection result data, determine whether there are abnormal defects in the optical path of the laser processing equipment. If there are abnormal defects, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there are no abnormal defects, the correspondence between the control parameters and the cutting depth after the preset test plate is cut is stored.

[0010] In combination with the first aspect, in a feasible implementation method, the control parameters corresponding to each of the layers include fixed control parameters and gradient control parameters, and the fixed control parameters corresponding to all the layers remain unchanged, and the gradient control parameters increase or decrease according to a preset rule based on the order of the layers.

[0011] In combination with the first aspect, in a feasible implementation manner, the gradient control parameter is increased or decreased according to a preset fixed step size based on the order of the layers.

[0012] In combination with the first aspect, in a feasible implementation method, the laser light adding device includes an XY two-dimensional galvanometer, and each of the layers is provided with two test areas for a preset test plate, one of the test areas corresponds to a first test pattern whose cutting direction is the same as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is the same as the Y-axis of the XY two-dimensional galvanometer.

[0013] In combination with the first aspect, in a feasible implementation manner, the first test pattern and the second test pattern are a plurality of parallel cutting lines.

[0014] In combination with the first aspect, in a feasible implementation, the step of obtaining the test result data after the preset test plate is cut and processed includes:

[0015] The preset test plate after cutting is cut into slices, and the cutting marks of each test pattern are located on the cutting surface, and the size data of the cutting marks are obtained through a microscope.

[0016] In combination with the first aspect, in a feasible implementation, the step of storing the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut includes:

[0017] The control parameter and the cutting depth are fitted into a preset functional relationship and stored.

[0018] In a second aspect, the present application provides a debugging device for laser processing equipment, characterized in that the device comprises:

[0019] A first acquisition unit is used to acquire a test file, wherein the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing device;

[0020] A driving control unit, configured to control the laser processing device to perform cutting processing on a corresponding test area of ​​the preset test plate according to the test pattern and the control parameter;

[0021] A second acquisition unit is used to acquire the test result data of the preset test plate after cutting and processing;

[0022] an analysis and processing unit, configured to determine whether an optical path of the laser processing equipment has an abnormal defect according to the detection result data; and

[0023] The storage unit is used to store the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut when there is no abnormal defect.

[0024] In conjunction with the second aspect, in a feasible implementation manner, the control parameter corresponding to each layer includes a fixed control parameter and a gradual control parameter, and the fixed control parameters corresponding to all the layers remain unchanged, and the gradual control parameters are increased or decreased according to a preset rule according to the order of the layers;

[0025] The laser light adding device includes an XY two-dimensional galvanometer, and each of the layers is provided with two test areas for a preset test plate, wherein one of the test areas corresponds to a first test pattern whose cutting direction is in the same direction as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is in the same direction as the Y-axis of the XY two-dimensional galvanometer;

[0026] The storage unit is used to fit the control parameter and the cutting depth into a preset functional relationship and store the relationship.

[0027] In a third aspect, the present application provides a computer-readable storage medium, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the debugging method of the laser processing device described in the first aspect above.

[0028] The debugging method, device and storage medium of the laser processing equipment provided by the present application first obtain a test file, which includes multiple layers, each layer corresponds to a control parameter, and each layer also includes a test area and a test pattern for a preset test plate. Then, according to the control parameters and the test pattern, the preset test plate is cut and processed, and then the detection result data after the cutting process is obtained. At this time, it is first determined based on the detection result data whether there is an abnormality in the optical path of the laser processing equipment. When there is no abnormality, the correspondence between the control parameter and the cutting depth can be stored, so as to detect whether there is an abnormality in the optical path of the laser processing equipment, and the correspondence between the cutting depth of the preset plate and the control parameter can be efficiently obtained, thereby improving the detection efficiency of the laser processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0030] Figure 1 It is a schematic diagram of the application environment provided by the embodiment of the present application;

[0031] Figure 2 It is a flowchart of a debugging method of laser processing equipment provided in an embodiment of the present application;

[0032] Figure 3 is a schematic diagram of a processing shape of a test file in an embodiment of the present application;

[0033] Figure 4 is a schematic diagram of cutting marks when there is an optical path abnormality in the laser processing equipment in the embodiment of the present application;

[0034] Figure 5 is a schematic diagram of cutting marks when there is no optical path abnormality in the laser processing equipment in the embodiment of the present application;

[0035] Figure 6 is a schematic diagram of the cutting depths of various cutting marks on the cutting surface of a preset test plate in an embodiment of the present application;

[0036] Figure 7 It is a functional block diagram of a debugging device for laser processing equipment in an embodiment of the present application;

[0037] Figure 8 It is a structural diagram of a computer device in an embodiment of the present application. DETAILED DESCRIPTION

[0038] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0039] It should be clear that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0041] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0042] It should be understood that, although the terms first, second, third, etc. may be used to describe the terminal in the embodiments of the present invention, these terminals should not be limited to these terms. These terms are only used to distinguish the terminals from each other. For example, without departing from the scope of the embodiments of the present invention, the first terminal may also be referred to as the second terminal, and similarly, the second terminal may also be referred to as the first terminal.

[0043] The word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0044] See also Figure 1 , which is a schematic diagram of the application environment of an embodiment of the present application.

[0045] The application environment of the embodiment of the present application includes a working platform 1, a preset test plate 2 and a laser processing device 3.

[0046] The function of the laser processing equipment 3 is to realize laser drilling, laser cutting and other operations for the preset test plate. The laser processing equipment 3 includes necessary lasers and optical path components. The laser is used to generate lasers, and the optical path components can include but are not limited to multiple reflection components, and the reflection components are arranged on the optical path of the laser output by the laser. Generally, the laser processing equipment 3 is mainly used for processing two-dimensional plates. For example, the laser processing equipment 3 can realize operations such as window opening on PCB boards. In order to realize the processing of two-dimensional plates, the laser processing equipment usually includes a two-dimensional galvanometer and a focusing mirror, so that the two-dimensional cutting path can be planned.

[0047] Before the laser processing equipment 3 of the present application processes the actual plate to be processed (such as a PCB board), it can test the preset test plate 2, which is made of the same material as the actual plate to be processed. In the application environment of the present application, the laser processing equipment 3 performs a processing test on the preset test plate 2, which is mainly used to detect whether there is an optical path abnormality in the laser processing equipment 3, and at the same time obtain the corresponding relationship between the control parameters and the cutting depth under the material conditions of the current preset test plate, so that when the actual plate to be processed is subsequently processed, the control parameters of the laser processing equipment 3 can be quickly adjusted according to the required cutting depth.

[0048] Before the laser processing equipment 3 in the application environment of the present application performs test processing on the preset test plate 2 to realize the debugging of the laser processing equipment, the following processing needs to be completed:

[0049] First, it is necessary to preliminarily adjust the optical path inside the laser processing device 3. Next, it is necessary to install the two-dimensional galvanometer and the focusing mirror, and adjust the optical path of the focusing mirror and the two-dimensional galvanometer. At this time, the laser processing device 3 is reset.

[0050] Then adjust the working platform 1 to be flush with the plane of the two-dimensional galvanometer, and keep the X and Y directions of the working platform 1 consistent with the X and Y directions of the two-dimensional galvanometer respectively.

[0051] Finally, the preset test plate 2 is placed on the working platform 1, and the surface of the preset test plate 2 is flush with the surface of the working platform 1, that is, the preset test plate 2 is evenly adsorbed on the surface of the working platform 1. At this time, the distance between the focusing mirror and the working platform 1 should be set to the theoretical focal length of the focusing mirror.

[0052] The laser processing device 3 in the present application includes a memory and a processor, wherein the memory stores computer program instructions, and the processor implements the following steps when executing the computer program to debug the laser processing device, including the detection of optical path anomalies and the acquisition of depth control relationships:

[0053] S1, obtaining a test file, wherein the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing equipment;

[0054] S2, according to the test pattern and the control parameters, controlling the laser processing equipment to perform cutting processing on the corresponding test area of ​​the preset test plate;

[0055] S3, obtaining the test result data after the preset test plate is cut and processed;

[0056] S4, based on the detection result data, determine whether there is an abnormal defect in the optical path of the laser processing equipment. If there is an abnormal defect, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there is no abnormal defect, the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut is stored.

[0057] The following further elaborates on S1 to S4.

[0058] Among them, S1 obtains the test file.

[0059] Specifically, the laser processing device 3 in the embodiment of the present application can, but is not limited to, control the cutting head in the form of laser cutting control software to perform cutting operations on the preset test plate 2. The function of the test file is to be read by the laser processing device 3 to identify the control parameters and process used by the laser processing device 3 to cut the set path of the plate.

[0060] In one embodiment of the present application, the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each layer corresponds to a set of control parameters of the laser processing equipment.

[0061] Specifically, for the test patterns in each test area in the same layer, the control parameters are the same, and the control parameters can be, but are not limited to, the power of the laser processing equipment 3, the laser pulse time, the frequency, the moving speed of the cutting head and other parameters. For the relationship between the control parameters of multiple layers, specifically in order to examine the relationship between certain control parameters and the final cutting depth, the other predetermined number of control parameters can be kept unchanged, and the control parameters to be examined can be set to change with the layer. Among them, the fixed parameters are called fixed control parameters, and the changing control parameters are called gradual control parameters, that is, the control parameters corresponding to each layer include fixed control parameters and gradual control parameters, and the fixed control parameters corresponding to all layers remain unchanged, while the gradual control parameters are increased or decreased according to the preset rules according to the order of the layers, for example, they can be, but are not limited to, increasing or decreasing according to a preset fixed step size.

[0062] The test pattern specifies the cutting path of the laser processing equipment, that is, specifies the shape of the cutting mark after the preset test plate 2 is finally cut. The test pattern can be a closed figure or a non-closed figure. For the laser processing equipment 3 with a two-dimensional galvanometer, in order to facilitate the detection of optical path anomalies, two test areas for the preset test plate can be provided in each layer, one of which corresponds to a first test pattern whose cutting direction is in the same direction as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is in the same direction as the Y-axis of the XY two-dimensional galvanometer. Furthermore, both the first test pattern and the second test pattern can be a plurality of parallel cutting lines.

[0063] Figure 3 This is a schematic diagram of a specific test file. Figure 3 The test file in has a total of 10 layers from 1 to 10, and each layer includes two test areas and two corresponding test patterns. For example, layer 1 has test patterns 1A and 1B, 1A is the four parallel cutting lines in the X-axis cutting direction of the two-dimensional galvanometer (also referred to as the horizontal direction in the embodiment of the present application), and 1B is the four parallel cutting lines in the Y-axis cutting direction of the two-dimensional galvanometer (also referred to as the vertical direction in the embodiment of the present application). By analogy, there are two test patterns 10A and 10B in layer 10. The control parameters for cutting the test patterns in the same layer are consistent, and the control parameters can be power, laser pulse time, frequency, cutting head movement speed, etc. Figure 3The test file in the example can be, but is not limited to, to examine the corresponding relationship between the cutting head moving speed and the cutting depth. In different layers, the cutting head moving speed can be set to change in a gradual manner, while other control parameters remain unchanged. For example, the cutting head moving speed corresponding to layer 1 is 100mm / s, and the adjacent layers are accumulated in steps of 100, then the speed corresponding to layer 10 is 1000mm / s. Each test pattern is set to multiple parallel cutting lines, which is convenient for observing the cutting results of the same test pattern in the same layer, and also for observing the cutting results of different layers.

[0064] S2, according to the test pattern and the control parameters, controlling the laser processing equipment to perform cutting processing in the corresponding test area of ​​the preset test plate.

[0065] S3, obtaining the test result data after the preset test plate is cut and processed.

[0066] In one embodiment of the present application, the preset test plate after cutting can be cut into slices, and the cutting marks of each test pattern can be located on the cutting surface, and the size data of the cutting marks can be obtained through a microscope. The size data of the cutting marks can be used as the test result data after the preset test plate is processed. The test result data can be input into the laser processing equipment for sorting. The above-mentioned size data of the cutting marks can be, but not limited to, the seam width and depth of the cutting groove.

[0067] S4, based on the detection result data, determine whether there is an abnormal defect in the optical path of the laser processing equipment. If there is an abnormal defect, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there is no abnormal defect, the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut is stored.

[0068] In the embodiment of the present application, the detection result data is used to determine whether there is an abnormal defect in the optical path of the laser light adding device, and the size of the cutting mark can be used to judge. Specifically, but not limited to, it can be judged based on whether the seam width and cutting depth of the cutting grooves of multiple parallel cutting lines in the same test pattern in the same layer are consistent, and whether the cutting depth and seam width of two different cutting directions (i.e., horizontal and vertical) of the same layer are consistent. For example, Figure 4 For example, the horizontal and vertical light spots are both elliptical, and the horizontal slit width is not completely consistent, which means that there is an abnormality in the optical path of the laser processing equipment and further debugging is required. Figure 5 In the diagram, both the horizontal and vertical light spots are close to the standard circle, and the slit width is consistent, which means that the optical path of the laser processing equipment has been debugged and there are no abnormal defects.

[0069] When there is no abnormality in the optical path of the laser processing equipment, the corresponding relationship between the control parameter and the cutting depth can be stored for subsequent retrieval and use in the actual plate processing. In a specific embodiment, the control parameter and the cutting depth can be fitted into a preset functional relationship and stored. Figure 6 For example, the cutting surface of the preset test plate 2 after cutting, 1b~5b are the cross-sections of the cutting grooves corresponding to the 5 groups of test patterns. Among the control parameters corresponding to the 5 groups of test patterns, only the moving speed of the cutting head keeps a gradual change, that is, the moving speed corresponding to 1b can be 100mm / s, the moving speed corresponding to 2b is 200mm / s, and the corresponding moving speed corresponding to 5b is 500mm / s. In this embodiment, the fitting relationship between the moving speed and the cutting depth is set as a linear function relationship. Assuming that the cutting depth corresponding to 1b is 50um, the cutting depth corresponding to 2b is 45um, and the cutting depth corresponding to 3b is 40um, it is easy to infer that when the moving speed is 350mm / s, the corresponding cutting depth should be about 37.5mm when other control parameters remain unchanged. The fitting relationship between the specific control parameter and the cutting depth can also be other function fitting relationships, which will not be given examples here.

[0070] See also Figure 2 , which is a flow chart of a debugging method for laser processing equipment provided in an embodiment of the present application.

[0071] Specifically, the debugging method of the laser processing equipment in the embodiment of the present application includes:

[0072] S21, obtaining a test file, wherein the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing equipment;

[0073] S22, controlling the laser processing device to perform cutting processing on a corresponding test area of ​​the preset test plate according to the test pattern and the control parameter;

[0074] S23, obtaining the test result data after the preset test plate is cut and processed;

[0075] S24, based on the detection result data, determine whether there are abnormal defects in the optical path of the laser processing equipment. If there are abnormal defects, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there are no abnormal defects, the corresponding relationship between the control parameters and the cutting depth after the preset test plate is cut is stored.

[0076] Steps S21-S24 are further described in a more detailed embodiment of the present application.

[0077] Among them, S21, obtains the test file.

[0078] Specifically, the laser processing device 3 in the embodiment of the present application can, but is not limited to, control the cutting head in the form of laser cutting control software to perform cutting operations on the preset test plate 2. The function of the test file is to be read by the laser processing device 3 to identify the control parameters and process used by the laser processing device 3 to cut the set path of the plate.

[0079] In one embodiment of the present application, the test file includes a preset number of multiple layers, each layer corresponds to a set of control parameters of the laser processing equipment, and each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area.

[0080] Specifically, for the test patterns in each test area in the same layer, the control parameters are the same, and the control parameters can be, but are not limited to, the power, laser pulse time, frequency, cutting head moving speed and other parameters in the laser processing equipment 3. For the relationship between the control parameters of multiple layers, specifically in order to examine the relationship between certain control parameters and the final cutting depth, other predetermined number of parameters can be kept unchanged, and the control parameters to be examined can be set to change with the layer. Among them, the fixed parameters are called fixed control parameters, and the changing control parameters are called gradual control parameters, that is, the control parameters corresponding to each layer include fixed control parameters and gradual control parameters, and the fixed control parameters corresponding to all layers remain unchanged, while the gradual control parameters are increased or decreased according to the preset rules according to the order of the layers, for example, they can be, but are not limited to, increased or decreased according to a preset fixed step size.

[0081] The test pattern specifies the cutting path of the laser processing equipment, that is, specifies the shape of the cutting mark after the preset test plate 2 is finally cut. The test pattern can be a closed figure or a non-closed figure. For the laser processing equipment 3 with a two-dimensional galvanometer, in order to facilitate the detection of optical path anomalies, two test areas for the preset test plate can be provided in each layer, one of which corresponds to a first test pattern whose cutting direction is in the same direction as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is in the same direction as the Y-axis of the XY two-dimensional galvanometer. Furthermore, both the first test pattern and the second test pattern can be a plurality of parallel cutting lines. Figure 3 It is a schematic diagram of a specific test file. Figure 3The test file in has a total of 10 layers from 1 to 10, and each layer includes two test areas and two corresponding test patterns. For example, layer 1 has test patterns 1A and 1B, 1A is the four parallel cutting lines in the X-axis cutting direction of the two-dimensional galvanometer (also referred to as the horizontal direction in the embodiment of the present application), and 1B is the four parallel cutting lines in the Y-axis cutting direction of the two-dimensional galvanometer (also referred to as the vertical direction in the embodiment of the present application). By analogy, there are two test patterns 10A and 10B in layer 10. The control parameters for cutting the test patterns in the same layer are consistent, and the control parameters can be power, laser pulse time, frequency, cutting head movement speed, etc. Figure 3 The test file in the example can be, but is not limited to, to examine the corresponding relationship between the cutting head moving speed and the cutting depth. In different layers, the cutting head moving speed can be set to change in a gradual manner, while other control parameters remain unchanged. For example, the cutting head moving speed corresponding to layer 1 is 100mm / s, and the adjacent layers are accumulated in steps of 100, then the speed corresponding to layer 10 is 1000mm / s. Each test pattern is set to multiple parallel cutting lines, which is convenient for observing the cutting results of the same test pattern in the same layer, and also for observing the cutting results of different layers.

[0082] S22, according to the test pattern and the control parameters, controlling the laser processing equipment to perform cutting processing in the corresponding test area of ​​the preset test plate.

[0083] S23, obtaining the test result data after the preset test plate is cut and processed.

[0084] In one embodiment of the present application, the preset test plate after cutting can be cut into slices, and the cutting marks of each test pattern can be located on the cutting surface, and the size data of the cutting marks can be obtained through a microscope. The size data of the cutting marks can be used as the test result data after the preset test plate is processed. The test result data can be input into the laser processing equipment for sorting. The above-mentioned size data of the cutting marks can be, but not limited to, the seam width and depth of the cutting groove.

[0085] S24, based on the detection result data, determine whether there are abnormal defects in the optical path of the laser processing equipment. If there are abnormal defects, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there are no abnormal defects, the corresponding relationship between the control parameters and the cutting depth after the preset test plate is cut is stored.

[0086] In the embodiment of the present application, the detection result data is used to determine whether there is an abnormal defect in the optical path of the laser light adding device, and the size of the cutting mark can be used to judge. Specifically, but not limited to, it can be judged based on whether the seam width and cutting depth of the cutting grooves of multiple parallel cutting lines in the same test pattern in the same layer are consistent, and whether the cutting depth and seam width of two different cutting directions (i.e., horizontal and vertical) of the same layer are consistent. For example, Figure 4 For example, the horizontal and vertical light spots are both elliptical, and the horizontal slit width is not completely consistent, which means that there is an abnormality in the optical path of the laser processing equipment and further debugging is required. Figure 5 In the diagram, both the horizontal and vertical light spots are close to the standard circle, and the slit width is consistent, which means that the optical path of the laser processing equipment has been debugged and there are no abnormal defects.

[0087] When there is no abnormality in the optical path of the laser processing equipment, the corresponding relationship between the control parameter and the cutting depth can be stored for subsequent retrieval and use in the actual plate processing. In a specific embodiment, the control parameter and the cutting depth can be fitted into a preset functional relationship and stored. Figure 6 For example, the cutting surface of the preset test plate 2 after cutting, 1b~5b are the cross-sections of the cutting grooves corresponding to the 5 groups of test patterns. Among the control parameters corresponding to the 5 groups of test patterns, only the moving speed of the cutting head keeps a gradual change, that is, the moving speed corresponding to 1b can be 100mm / s, the moving speed corresponding to 2b is 200mm / s, and the corresponding moving speed corresponding to 5b is 500mm / s. In this embodiment, the fitting relationship between the moving speed and the cutting depth is set as a linear function relationship. Assuming that the cutting depth corresponding to 1b is 50um, the cutting depth corresponding to 2b is 45um, and the cutting depth corresponding to 3b is 40um, it is easy to infer that when the moving speed is 350mm / s, the corresponding cutting depth should be about 37.5mm when other control parameters remain unchanged. The fitting relationship between the specific control parameter and the cutting depth can also be other function fitting relationships, which will not be given examples here.

[0088] The debugging method of the laser processing equipment provided by the above-mentioned application first obtains a test file, which includes multiple layers, each layer corresponds to a control parameter, and each layer also includes a test area and a test pattern for a preset test plate. Then, according to the control parameters and the test pattern, the preset test plate is cut and processed, and then the detection result data after the cutting process is obtained. At this time, it is first determined whether there is an abnormality in the optical path of the laser processing equipment based on the detection result data. When there is no abnormality, the correspondence between the control parameter and the cutting depth can be stored, so as to detect whether there is an abnormality in the optical path of the laser processing equipment, and to efficiently obtain the correspondence between the cutting depth of the preset plate and the control parameter, thereby improving the detection efficiency of the laser processing equipment.

[0089] Figure 7 It is a functional block diagram of a debugging device for laser processing equipment provided in an embodiment of the present application.

[0090] The above-mentioned debugging device 700 comprises:

[0091] A first acquisition unit 701 is used to acquire a test file, wherein the test file includes at least one layer of a preset number, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing device;

[0092] A driving control unit 702, configured to control the laser processing device to perform cutting processing on a corresponding test area of ​​the preset test plate according to the test pattern and the control parameters;

[0093] The second acquisition unit 703 is used to acquire the test result data after the preset test plate is cut and processed;

[0094] An analysis and processing unit 704 is used to determine whether there is an abnormal defect in the optical path of the laser processing equipment according to the detection result data; and

[0095] The storage unit 705 is used to store the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut when there is no abnormal defect.

[0096] An embodiment of the present application further provides a computer-readable storage medium, the storage medium including a stored program, wherein when the program is running, the device where the storage medium is located is controlled to execute the above-mentioned debugging method for the laser processing equipment.

[0097] The present application embodiment also provides a computer device 800, such as Figure 8As shown. The computer device 800 of this embodiment includes: a processor 801, a memory 802, and a computer program 803 stored in the memory and executable on the processor 801. When the processor 801 executes the computer program 803, the method of the laser light adding device in the embodiment is implemented. To avoid repetition, it is not described one by one here. Alternatively, when the computer program is executed by the processor 801, the functions of each model / unit in the debugging device in the embodiment are implemented. To avoid repetition, it is not described one by one here.

[0098] The computer device 800 may be a desktop computer, a notebook, a PDA, a cloud server, a laser processing device, or other computing device. The computer device may include, but is not limited to, a processor 301 and a memory 302. Those skilled in the art will appreciate that Figure 8 This is only an example of the computer device 800 and does not constitute a limitation of the computer device 800. The computer device 800 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the computer device may also include input and output devices, network access devices, buses, etc.

[0099] The processor 801 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0100] The memory 802 may be an internal storage unit of the computer device 800, such as a hard disk or memory of the computer device 800. The memory 802 may also be an external storage device of the computer device 300, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the computer device 800. Further, the memory 802 may also include both an internal storage unit of the computer device 800 and an external storage device. The memory 802 is used to store computer programs and other programs and data required by the computer device. The memory 802 may also be used to temporarily store data that has been output or is to be output.

[0101] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0102] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0103] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (Processor) to perform some steps of the above-mentioned method of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), disk or optical disk and other media that can store program codes.

[0104] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for debugging laser processing equipment, characterized in that: The method comprises: Acquire a test file, wherein the test file includes a preset number of multiple layers, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing device; According to the test pattern and the control parameters, controlling the laser processing equipment to perform cutting processing on the corresponding test area of ​​the preset test plate; Obtaining cutting marks after cutting the preset test plate; According to the cutting marks of the multiple cutting lines in the same test pattern in any of the layers, it is determined whether there is an abnormal defect in the optical path of the laser processing equipment. If there is an abnormal defect, a prompt is given to allow the user to readjust the optical path of the laser processing equipment. If there is no abnormal defect, the corresponding relationship between the control parameter and the cutting depth after the cutting process of the preset test plate is stored; The control parameters corresponding to each layer include fixed control parameters and gradual control parameters, and the fixed control parameters corresponding to all the layers remain unchanged, and the gradual control parameters increase or decrease according to a preset rule based on the order of the layers.

2. The method according to claim 1, characterized in that The gradient control parameter is increased or decreased according to a preset fixed step size based on the order of the layers.

3. The method according to claim 1, characterized in that The laser processing equipment includes an XY two-dimensional galvanometer, and each of the layers is provided with two test areas for a preset test plate, wherein one of the test areas corresponds to a first test pattern whose cutting direction is in the same direction as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is in the same direction as the Y-axis of the XY two-dimensional galvanometer.

4. The method according to claim 3, characterized in that: The first test pattern and the second test pattern are a plurality of parallel cutting lines.

5. The method according to claim 1, characterized in that The step of storing the corresponding relationship between the control parameter and the cutting depth of the preset test plate after cutting includes: The control parameter and the cutting depth are fitted into a preset functional relationship and stored.

6. A debugging device for laser processing equipment, characterized in that: The device comprises: A first acquisition unit is used to acquire a test file, wherein the test file includes a preset number of multiple layers, each of the layers is provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, and each of the layers corresponds to a set of control parameters of the laser processing device; A driving control unit, configured to control the laser processing device to perform cutting processing on a corresponding test area of ​​the preset test plate according to the test pattern and the control parameter; A second acquisition unit is used to acquire cutting marks after the preset test plate is cut; an analysis and processing unit, configured to determine whether there is an abnormal defect in the optical path of the laser processing device according to the cutting marks of the plurality of cutting lines in the same test pattern in any of the layers; and A storage unit, for storing the corresponding relationship between the control parameter and the cutting depth of the preset test plate after cutting when there is no abnormal defect; The control parameters corresponding to each layer include fixed control parameters and gradual control parameters, and the fixed control parameters corresponding to all the layers remain unchanged, and the gradual control parameters increase or decrease according to a preset rule based on the order of the layers.

7. The device according to claim 6, characterized in that The laser processing equipment includes an XY two-dimensional galvanometer, and each of the layers is provided with two test areas for a preset test plate, wherein one of the test areas corresponds to a first test pattern whose cutting direction is in the same direction as the X-axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern whose cutting direction is in the same direction as the Y-axis of the XY two-dimensional galvanometer; The storage unit is used to fit the control parameter and the cutting depth into a preset functional relationship and store the relationship.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the debugging method for the laser processing equipment according to any one of claims 1 to 5.

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