Automatic pre-separation mechanism and separation method for electronic device pins

By using a combination technology of lifting heating plate and separation needle in the automatic pre-separation mechanism of electronic device pins, the problem of insulating paint falling off when the thermistor pin is separated is solved, which significantly reduces the defect rate.

CN114156029BActive Publication Date: 2025-03-14WUXI NOVO AUTOMATION TECH CORP LTD
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Patent Information

Application Number
CN202111665387.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-30
Publication Date
2025-03-14
Estimated Expiration
2041-12-30

AI Technical Summary

Technical Problem

In the prior art, the pin separation of the thermistors has the problem that the surface insulating paint is prone to fall off, resulting in a high product defect rate.

Method used

An electronic device pin automatic pre-separation mechanism is adopted, including a fixture board, a lifting heating plate, a separation pressure plate assembly, etc. The pins are heated by the lifting heating plate to soften the insulating paint, and the separation needle pre-separates the pins.

Benefits of technology

This method can effectively prevent the insulating paint covered with pins from falling off during separation, reduce the defect rate, and ensure that the insulating paint will not be damaged during subsequent separation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses an automatic pre-separation mechanism and a separation method for the pins of electronic devices. The automatic pre-separation mechanism includes a jig plate, a lifting and heating plate, and a separation plate assembly. The jig plate is provided with a product jig. The lifting and heating plate can be lifted and assembled on the side of the jig plate facing the pins of the electronic device. The separation plate assembly includes a lower pressing plate arranged above the lifting and heating plate and a second lifting and driving assembly for driving the lower pressing plate to lift and lower. The bottom of the lower pressing plate is provided with a plurality of limit grooves for limiting the pins of the electronic device at intervals. A separation needle for pre-separating the pins of the electronic device can be telescopically assembled in each limit groove. The above-mentioned automatic pre-separation mechanism first heats the pin part of the electronic device and then performs pre-separation. Not only is the structure simple and compact, and the design is ingenious; it can also ensure that the insulating paint covering the pins of the electronic device will not be damaged, which greatly reduces the defective rate during the processing of the electronic device.
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Description

Technical Field

[0001] The invention belongs to the technical field of automation equipment, and in particular to an automatic pre-separation mechanism and a separation method for electronic device pins. Background Art

[0002] Thermistor is a sensor resistor whose resistance value changes with temperature. It is widely used in temperature measurement and temperature control instruments. During the production process of thermistor, due to its process reasons, the insulating paint of the two pins are adhered together, which requires the two pins to be separated later. The existing method is to directly separate the two pins through an automatic bifurcation mechanism. In the specific operation process, this method is very likely to cause the insulating paint coating on the pins to fall off, resulting in a high defective rate of the product. Summary of the invention

[0003] The purpose of the present invention is to provide an automatic pre-separation mechanism and a separation method for electronic device pins, so as to solve the problem that the surface insulating paint is easy to fall off when the pins of thermistors are separated in the prior art.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] An automatic pre-separation mechanism for electronic device pins, comprising:

[0006] A jig plate is provided with a product jig, and the product jig is provided with a plurality of electronic components, wherein the pins of the plurality of electronic components are arranged toward the same side.

[0007] The lifting and heating plate can be lifted and assembled on the pin-facing side of the electronic device of the jig plate. The lifting and heating plate is connected to a first lifting driving device for driving the lifting and lowering thereof, and a heating device is arranged inside the lifting and heating plate.

[0008] A separation pressure plate assembly is installed on the vertical plate, and the separation pressure plate assembly includes a lower pressure plate arranged above the lifting and heating plate and a second lifting drive assembly that drives the lower pressure plate to rise and fall. A plurality of limit grooves for limiting the pins of electronic devices are arranged at intervals at the bottom of the lower pressure plate, and a separation needle for pre-separating the pins of the electronic device can be telescopically assembled in each limit groove.

[0009] Furthermore, the separation pressure plate assembly also includes an upper pressure plate located directly above the lower pressure plate, and the second lifting drive assembly includes an upper pressure plate drive assembly and a lower pressure plate drive assembly, the upper pressure plate drive assembly is connected to the upper pressure plate, and the lower pressure plate drive assembly is connected to the lower pressure plate, and a groove is opened on one side surface of the lower pressure plate, the separation needle passes through the groove and a coil spring is provided outside the part located in the groove, and upper limit sleeves and lower limit sleeves are provided at both ends of the coil spring. The structure of two pressure plates can facilitate the installation and debugging of the equipment, and at the same time can ensure the stroke accuracy of the separation needle.

[0010] Preferably, the separation needle is provided with an upper limit step for limiting the upper limit sleeve and a lower limit step for limiting its downward stroke.

[0011] Preferably, a plurality of pressure rods facing downward and arranged corresponding to the separation needles are installed on the upper pressure plate, and a buffer spring is arranged between the pressure rods and the upper pressure plate.

[0012] Furthermore, a transverse movement module is installed on the top of the vertical plate, a camera bracket is installed on the output flange of the transverse movement module, and a detection camera component for detecting whether the two pins of the electronic device are separated is installed on the camera bracket.

[0013] Furthermore, the limiting groove is a "V"-shaped groove opening downward, and the bottom end of the separation needle is located at the center of the "V"-shaped groove.

[0014] Preferably, the upper pressure plate driving assembly includes an upper pressure plate transmission screw and a lower pressure plate transmission screw rotatably mounted on the vertical plate, the upper pressure plate transmission screw is connected to the upper pressure plate servo motor via a transmission assembly consisting of a synchronous pulley and a synchronous belt assembly, the lower pressure plate transmission screw is connected to the lower pressure plate servo motor via a transmission assembly consisting of a synchronous pulley and a synchronous belt, the upper pressure plate and the lower pressure plate are respectively connected to the upper pressure plate transmission screw and the lower pressure plate transmission screw via a screw nut.

[0015] Furthermore, positioning grooves for positioning the two ends of the product jig are provided at both ends of the jig plate, and clamping mechanisms for clamping and fixing the two ends of the product jig in the positioning grooves are also provided at both ends of the jig plate.

[0016] Furthermore, the fixture plate is connected to a two-axis driving assembly that drives it to move in both horizontal and height directions.

[0017] A method for automatically separating pins of an electronic device comprises the following steps:

[0018] 1) Pre-separation, pre-separating the pins of the electronic device by the above-mentioned automatic pre-separation mechanism for the pins of the electronic device, specifically comprising the following steps:

[0019] The lifting heating plate rises to the height of contacting the pins of the electronic device and heats the pins of the electronic device.

[0020] The lower pressing plate descends to position the pins of the electronic device through the limiting groove, and is heated to a preset time to soften the insulating paint coated on the outside of the pins of the electronic device to facilitate separation;

[0021] The separation pin extends to pre-separate the two pins of the electronic device;

[0022] The separation needle rises;

[0023] 2) Secondary separation: the pins of the electronic components that have been pre-separated are automatically separated to the required angle by the pin bifurcation equipment of the electronic components.

[0024] The beneficial effect of the present invention is that, compared with the prior art, the electronic device pin automatic pre-separation mechanism first heats the pin part of the electronic device to soften the insulating paint, and then pre-separates the two pins through the separation needle. Not only is the structure simple and compact, but also the design is ingenious; it can also ensure that the insulating paint coated on the pins of the electronic device will not be damaged during the subsequent separation at a set angle, greatly reducing the defect rate in the processing of electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional structural schematic diagram of an automatic pre-separation mechanism for electronic device pins provided by an embodiment of the present invention;

[0026] Figure 2 It is another three-dimensional structural schematic diagram of the automatic pre-separation mechanism for electronic device pins provided by one embodiment of the present invention;

[0027] Figure 3 It is a front view of an automatic pre-separation mechanism for electronic device pins provided by one embodiment of the present invention;

[0028] Figure 4 It is a side view of an automatic pre-separation mechanism for electronic device pins provided by one embodiment of the present invention;

[0029] Figure 5 It is a rear view of an automatic pre-separation mechanism for electronic device pins provided by an embodiment of the present invention;

[0030] Figure 6 yes Figure 3 Sectional view along AA direction;

[0031] Figure 7 yes Figure 6 A partial enlarged view of point C in the middle;

[0032] Figure 8 yes Figure 3A partial enlarged view of point B in the middle;

[0033] Fig. 9 It is a structural schematic diagram of a separation pin of an automatic pre-separation mechanism for electronic device pins provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on the other component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] See also Figure 1 and Figure 2 As shown, in this embodiment, an automatic pre-separation mechanism for the pins of an electronic device includes a bottom plate 1, a vertical plate 2, a jig plate 3, a lifting heating plate 4, an upper pressing plate 5 and a lower pressing plate 6. The vertical plate 2 is vertically fixed on the bottom plate 1. The bottom plate 1 is equipped with a horizontal moving seat 7 through a support guide composed of a linear guide and a slider. The horizontal moving seat 7 is connected to a horizontal driving cylinder. The jig plate 3 can be lifted and lowered on the horizontal moving seat 7 through a support guide composed of a linear guide and a slider. A first lifting cylinder 8 is installed on the bottom plate 1, and the piston rod of the first lifting cylinder 8 is connected to the jig plate 3. Positioning grooves for positioning the two ends of the product jig 9 are provided at both ends of the jig plate 3, and a pressing cylinder 10 for pressing and fixing the two ends of the product jig 9 in the positioning groove is also provided at both ends of the jig plate 3. A plurality of thermistors 11 are provided on the product jig 9, and the pins of the plurality of thermistors 11 are arranged facing the same side.

[0037] The lifting and heating plate 4 can be lifted and assembled on the side of the pin of the thermistor 11 of the fixture plate 3. The lifting and heating plate 4 is connected to a second lifting cylinder 12 for driving its lifting and lowering, and an electric heating device 13 is arranged in the lifting and heating plate 4. The upper pressure plate 5 and the lower pressure plate 6 can both be lifted and arranged on the front side of the vertical plate 2. The upper pressure plate 5 is located directly above the lower pressure plate 6, and the lower pressure plate 6 is located directly above the lifting and heating plate 4. The back side of the vertical plate 2 is respectively rotatably and vertically installed with an upper pressure plate transmission screw 14 and a lower pressure plate transmission screw 15. The upper pressure plate transmission screw 14 is connected to the upper pressure plate servo motor 16 through a transmission assembly composed of a synchronous pulley and a synchronous belt assembly. The lower pressure plate transmission screw 15 is connected to the lower pressure plate servo motor 17 through a transmission assembly composed of a synchronous pulley and a synchronous belt. The upper pressure plate 5 and the lower pressure plate 6 are respectively connected to the upper pressure plate transmission screw 14 and the lower pressure plate transmission screw 15 through a screw nut transmission.

[0038] See also Figures 3 to 8 As shown, the bottom of the lower pressing plate 6 is provided with a plurality of limit grooves 18 for limiting the pins of the thermistor 11 at intervals, and the limit grooves 18 are "V"-shaped grooves with openings facing downwards. A separation needle 19 for pre-separating the pins of the thermistor 11 can be telescopically installed at the center of each limit groove 18 on the lower pressing plate 6. A groove 20 is provided on one side of the lower pressing plate 6. The separation needle 19 is provided through the groove 20 and a coil spring 21 is sleeved outside the portion of the separation needle 19 located in the groove 20. An upper limit sleeve 22 and a lower limit sleeve 23 are provided at both ends of the coil spring 21. The separation needle 19 is provided with an upper limit step 24 for limiting the upper limit sleeve 22 and a lower limit step 25 for limiting the downward stroke of the separation needle 19. A plurality of pressing rods 26 facing downwards and corresponding to the separation needles 19 are installed on the upper pressing plate 5, and a buffer spring 27 is provided between the pressing rod 26 and the upper pressing plate 5.

[0039] A transverse movement module 28 is installed on the top of the vertical plate 2, and a camera bracket 29 is installed on the output flange of the transverse movement module 28. A detection camera component 30 for detecting whether the two pins of the thermistor 11 are separated is installed on the camera bracket 29.

[0040] The specific actions of the above-mentioned electronic device pin automatic pre-separation mechanism to pre-separate the pins of the thermistor 11 include the following steps:

[0041] Step 1), the horizontal driving cylinder and the first lifting cylinder 8 drive the vertical plate 2 to move to the specified position;

[0042] Step 2), the lifting heating plate 4 rises to a height that contacts the pins of the thermistor 11, the lower pressing plate 6 descends to position the pins of the thermistor 11 through the limit groove 18, and the lifting heating plate 4 heats the pins of the thermistor 11 to a set time.

[0043] Step 3), the upper pressing plate 5 descends and presses down the corresponding separation pin 19 through the pressing rod 26, and the separation pin 19 extends to contact and press down the insulating varnish connection part of the two pins of the thermistor 11, so as to pre-separate the two pins.

[0044] It should be noted that the automatic magnet picking and placing device of the magnetic positioning fixture in this embodiment can also be used for other semiconductor devices, such as resistors, MOS tubes, sensors, capacitors and other products, on automated equipment such as detection and counting, and can also be used for detection and counting of long strip products in other similar fields and other related automated equipment.

[0045] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above examples. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An automatic pre-separation mechanism for electronic device pins, characterized in that: These include, A jig plate is provided with a product jig, and the product jig is provided with a plurality of electronic components, wherein the pins of the plurality of electronic components are arranged toward the same side. The lifting and heating plate can be lifted and assembled on the pin-facing side of the electronic device of the jig plate. The lifting and heating plate is connected to a first lifting driving device for driving the lifting and lowering thereof, and a heating device is arranged inside the lifting and heating plate. A separation plate assembly is mounted on the vertical plate, the separation plate assembly comprises a lower plate arranged above the lifting heating plate and a second lifting drive assembly driving the lower plate to lift and lower, a plurality of limit grooves for limiting the pins of the electronic device are arranged at intervals at the bottom of the lower plate, and a separation needle for pre-separating the pins of the electronic device can be telescopically assembled in each limit groove; The vertical plate is vertically fixed on the bottom plate, the bottom plate is equipped with a horizontal moving seat through a support guide composed of a linear guide rail and a slider, the horizontal moving seat is connected to a horizontal driving cylinder, the bottom plate is installed with a first lifting cylinder, and the piston rod of the first lifting cylinder is connected to the fixture plate; The electronic device is a thermistor, the separation platen assembly further comprises an upper platen located directly above the lower platen, the second lifting drive assembly comprises an upper platen drive assembly and a lower platen drive assembly, the upper platen drive assembly is connected to the upper platen, and the lower platen drive assembly is connected to the lower platen; The upper pressing plate is provided with a plurality of pressing rods facing downwards and arranged corresponding to the separation needles, and a buffer spring is arranged between the pressing rods and the upper pressing plate; The horizontal driving cylinder and the first lifting cylinder drive the vertical plate to move to a specified position; the lifting heating plate rises to a height that contacts the pins of the thermistor, the lower pressing plate descends to position the pins of the thermistor through the limiting grooves, the lifting heating plate heats the pins of the thermistor to a set time, the upper pressing plate descends to press down the corresponding separation pin through the pressing rod, the separation pin extends to contact and press down the insulating paint connection part of the two pins of the thermistor to pre-separate the two pins.

2. The automatic pre-separation mechanism for electronic device pins according to claim 1, characterized in that: A groove is provided on one side surface of the lower pressure plate, the separation needle is arranged through the groove and a coil spring is sleeved outside the portion of the separation needle located in the groove, and an upper limit sleeve and a lower limit sleeve are provided at both ends of the coil spring.

3. The automatic pre-separation mechanism for electronic device pins according to claim 2, characterized in that: The separation needle is provided with an upper limit step for limiting the upper limit sleeve and a lower limit step for limiting its downward stroke.

4. The automatic pre-separation mechanism for electronic device pins according to claim 1, characterized in that: A transverse movement module is installed on the top of the vertical plate, a camera bracket is installed on the output flange of the transverse movement module, and a detection camera component for detecting whether two pins of the electronic device are separated is installed on the camera bracket.

5. The automatic pre-separation mechanism for electronic device pins according to claim 1, characterized in that: The limiting groove is a "V"-shaped groove opening downward, and the bottom end of the separation needle is located at the center of the "V"-shaped groove.

6. The automatic pre-separation mechanism for electronic device pins according to claim 2, characterized in that: The upper pressure plate driving assembly includes an upper pressure plate transmission screw and a lower pressure plate transmission screw rotatably mounted on the vertical plate, the upper pressure plate transmission screw is connected to the upper pressure plate servo motor via a transmission assembly consisting of a synchronous pulley and a synchronous belt assembly, the lower pressure plate transmission screw is connected to the lower pressure plate servo motor via a transmission assembly consisting of a synchronous pulley and a synchronous belt, the upper pressure plate and the lower pressure plate are respectively connected to the upper pressure plate transmission screw and the lower pressure plate transmission screw via a screw nut.

7. The automatic pre-separation mechanism for electronic device pins according to claim 1, characterized in that: Both ends of the jig plate are provided with positioning grooves for positioning the two ends of the product jig, and both ends of the jig plate are also provided with clamping mechanisms for clamping and fixing the two ends of the product jig in the positioning grooves.

8. The automatic pre-separation mechanism for electronic device pins according to claim 1, characterized in that: The jig plate is connected to a two-axis driving assembly that drives it to move in two directions, horizontally and vertically.

9. A method for automatically separating pins of an electronic device, characterized in that: It includes the following steps: 1) Pre-separation, pre-separating the pins of the electronic device by the automatic pre-separation mechanism for the pins of the electronic device according to any one of claims 1 to 8, specifically comprising the following steps: The lifting heating plate rises to the height of contacting the pins of the electronic device and heats the pins of the electronic device. The lower pressing plate descends to position the pins of the electronic device through the limiting groove, and is heated to a preset time to soften the insulating paint coated on the outside of the pins of the electronic device to facilitate separation; The separation needle extends to pre-separate the two pins of the electronic device; The separation needle rises; 2) Secondary separation: the pins of the electronic components that have been pre-separated are automatically separated to the required angle by the pin bifurcation equipment of the electronic components.

Citation Information

Patent Citations

  • Automatic pre-separation mechanism for electronic device pins

    CN216928213U