A panel assembly device and a PCB panel assembly method

Abstract

The present invention belongs to the technical field of PCBA manufacturing, and discloses a panelizing device and a PCB panelizing method. The panelizing device is used to feed materials to SMT equipment, and specifically includes a tray conveying device, a PCB loading device, a handling device and a coordinate calibration device. The handling device can move between the station of the PCB loading device and the station of the tray conveying device, and the coordinate calibration device is connected to the handling device. The PCB panelizing method uses the above-mentioned panelizing device, including identifying the coordinates of the PCB board relative to the preset placement position, and then transporting multiple PCB boards to the same tray, and finally transporting the tray to the SMT equipment. The handling device can transport multiple PCB boards to the same tray, improve the feeding efficiency to the SMT equipment, and thus improve the production efficiency of the downstream SMT equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBA manufacturing, and in particular to a panel assembly device and a PCB panel assembly method. Background Art

[0002] In the SMT (Surface Mounting Technology) industry, in a production line, usually a single piece of single machine is provided by manual or board loading machine to enter the solder paste machine for printing, and after printing, the single board enters the placement machine for production, which cannot effectively utilize the maximum printing area of ​​the equipment, not only wasting the equipment's production capacity, but also low production efficiency. When encountering a situation where the production capacity demand is large and there are many machine models, the existing technology generally purchases multiple production lines to increase production or uses a one-to-two double-track line after the printer, which increases costs sharply and cannot significantly increase production. In particular, small PCB boards are mostly delivered in the form of multiple connected boards, and it is not ruled out that there will be single-piece X-marked boards (in the production of multiple connected boards, if one or more defective products appear in them, the defective products will be marked with an X on the surface). The X-marked boards in the feed need to be specially processed in the entire production process, and the post-production process needs to be separated from the multiple connected boards piece by piece by manual or board separation machine, which is time-consuming and increases costs.

[0003] Based on the above situation, we urgently need to design a panelization equipment and PCB panelization method to solve the above problems. Summary of the invention

[0004] An object of the present invention is to provide a panelizing device and a PCB panelizing method, which can panelize multiple PCB boards, thereby improving the feeding efficiency to the SMT equipment.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] On the one hand, a panel assembly device is disclosed for feeding materials to a SMT device, comprising:

[0007] A pallet conveying device, used for providing and conveying pallets;

[0008] PCB feeding device, used for providing PCB boards;

[0009] A handling device capable of moving between a station of the PCB loading device and a station of the tray conveying device;

[0010] A coordinate calibration device is connected to the transport device, and the coordinate calibration device can identify the coordinates of the PCB board relative to a preset placement position. The transport device can transport multiple PCB boards to the same tray.

[0011] As a preferred solution, the coordinate calibration device includes:

[0012] A first calibration mechanism is installed between the PCB loading device and the tray conveying device, and the first calibration mechanism can identify the offset coordinates of the PCB board relative to the preset placement position;

[0013] The second marking mechanism is used to identify the coordinates of the transport device relative to the preset placement position.

[0014] As a preferred solution, the second calibration mechanism includes:

[0015] A calibration plate, arranged opposite to the tray, wherein a plurality of preset identification points are arranged on the calibration plate, and the preset identification points correspond to the preset placement positions one by one;

[0016] A positioning and measuring component is installed on the transport device. When the transport device moves between the calibration plate and the pallet, the positioning and measuring component can identify the coordinates of the transport device relative to the preset identification point.

[0017] As a preferred solution, the pallet conveying device includes:

[0018] A tray loading mechanism, used for providing the tray;

[0019] A plasma cleaning mechanism, located downstream of the tray feeding mechanism, and capable of plasma cleaning the tray;

[0020] A conveying mechanism is located downstream of the plasma cleaning mechanism. The conveying mechanism is used to convey the pallet provided by the pallet loading mechanism. The conveying mechanism is sequentially provided with a feeding position, a fixed position and a discharging position. The pallet can be fixed at the fixed position, and the handling device can be moved between the working position of the PCB loading device and the fixed position.

[0021] As a preferred solution, the conveying mechanism includes:

[0022] Pedestal;

[0023] A first guide rail extending in a direction away from the tray loading mechanism;

[0024] The second guide rail is arranged parallel to the first guide rail, and the second guide rail is slidably connected to the base in a direction approaching or moving away from the first guide rail. The tray can move on the first guide rail and the second guide rail in the direction from the feed position, the fixed position to the discharge position in sequence.

[0025] As a preferred solution, a lifting mechanism is installed below the fixed position, and a baffle is installed above the fixed position. When the tray moves to the fixed position, the lifting mechanism can lift the tray and press the tray against the baffle.

[0026] As a preferred solution, the PCB feeding device includes:

[0027] A first loading mechanism, disposed on one side of the tray conveyor, the first loading mechanism being capable of providing the first type of PCB boards;

[0028] The second loading mechanism is arranged on the other side of the tray conveying device, and the second loading mechanism can provide the second type of PCB boards.

[0029] As a preferred solution, the first loading mechanism includes a carrying platform and a first lifting assembly, the carrying platform is connected to the execution end of the first lifting assembly, a plurality of stacked PCB boards of the first type are placed on the carrying platform, and the first lifting assembly can drive the carrying platform to rise and fall;

[0030] The second loading mechanism includes a rack and a second lifting assembly, the rack is connected to the execution end of the second lifting assembly, the rack is provided with a plurality of placement positions extending at intervals in the vertical direction, each of the placement positions is respectively placed with the second type of PCB board, and the second lifting assembly can drive the rack to rise and fall.

[0031] On the other hand, a PCB paneling method is also disclosed, using the above-mentioned paneling device, including:

[0032] Identifying the coordinates of the PCB board relative to the preset placement position;

[0033] Moving a plurality of the PCB boards to the same tray;

[0034] The tray is transported to the SMT equipment.

[0035] As a preferred solution, identifying the coordinates of the PCB board relative to the preset placement position includes:

[0036] Identify the offset coordinates of the PCB board relative to the preset placement position, and fine-tune the PCB board;

[0037] The coordinates of the transport device relative to the preset placement position are identified.

[0038] The beneficial effects of the present invention are: providing a panelizing device and a PCB panelizing method, the panelizing device is used to feed SMT equipment, the PCB panelizing method uses the above-mentioned panelizing device, after the coordinate calibration device identifies the coordinates of the PCB board relative to the preset placement position, the transport device can transport multiple PCB boards to the same pallet, thereby improving the feeding efficiency to the SMT equipment, thereby improving the production efficiency of downstream SMT equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0040] Figure 1 It is a structural schematic diagram of the panelizing equipment from the first perspective;

[0041] Figure 2 It is a structural schematic diagram of the second perspective of the panelizing device;

[0042] Figure 3 It is a schematic diagram of the structure of the handling device and the positioning measuring piece;

[0043] Figure 4 It is a schematic diagram of the structure of the gripping mechanism and the positioning measuring piece;

[0044] Figure 5 It is a structural schematic diagram of the tray loading mechanism and the plasma cleaning mechanism;

[0045] Figure 6 for Figure 5 A partial enlarged view of point A shown;

[0046] Figure 7 It is a structural schematic diagram of the conveying mechanism;

[0047] Figure 8 is a cross-sectional view of the first feeding mechanism;

[0048] Fig. 9 is a structural schematic diagram of the second feeding mechanism;

[0049] Fig.10 The figure is a flow chart of the PCB panelization method.

[0050] Figures 1 to 10 middle:

[0051] 1. Pallet conveying device; 11. Pallet loading mechanism; 111. First driving assembly; 112. Pallet bracket; 1121. Setting platform; 113. Second driving assembly; 114. First push plate; 12. Plasma cleaning mechanism; 121. Plasma cleaning head; 122. Third driving assembly; 13. Conveying mechanism; 131. Base; 132. First guide rail; 133. Second guide rail; 134. Fourth driving assembly; 135. Belt conveying assembly; 14. Lifting mechanism; 15. Baffle;

[0052] 2. PCB loading device; 21. First loading mechanism; 211. Loading platform; 212. First lifting assembly; 22. Second loading mechanism; 221. Storage rack; 222. Second lifting assembly; 223. Fifth driving assembly; 224. Second push plate;

[0053] 3. Handling device; 31. Three-axis driving mechanism; 311. X-axis driving assembly; 312. Y-axis driving assembly; 313. Z-axis driving assembly; 32. Grasping mechanism; 321. Self-locking suction cup; 322. Rotating driving member;

[0054] 4. Coordinate calibration device; 41. First calibration mechanism; 411. Bottom camera; 42. Second calibration mechanism; 421. Calibration plate; 422. Positioning measuring piece;

[0055] 5. Rack. DETAILED DESCRIPTION

[0056] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0057] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0060] Embodiment 1:

[0061] like Figure 1 As shown, this embodiment provides a panel assembly device, which can collage multiple PCB boards on the same tray and then feed them to the SMT equipment, specifically including a tray conveying device 1, a PCB loading device 2, a handling device 3 and a coordinate calibration device 4, wherein the tray conveying device 1 can provide and convey a tray coated with high-temperature self-adhesive silicone; the PCB loading device 2 can provide PCB boards, which can be single-piece boards, eliminating the subsequent manual or board separation machine to separate the X-boards one by one in the prior art, thereby improving production efficiency; the handling device 3 can reciprocate between the workstation of the PCB loading device 2 and the tray conveying device 1 Between the workstations; the coordinate calibration device 4 is communicatively connected with the handling device 3, and the coordinate calibration device 4 can identify the coordinates of the PCB board carried by the handling device 3 relative to the preset placement position. Specifically, a virtual machine coordinate system is arranged on the panel assembly equipment, and the handling device 3 and the coordinate calibration device 4 are both in this machine coordinate system, and based on this machine coordinate system, a plurality of preset placement positions are arranged on the pallet conveying device 1, and this preset placement position has no reference relationship with the coordinates of the pallet, so that the handling device 3 can accurately carry multiple PCB boards to the same pallet, and the specific number of PCB boards can be set according to actual needs, which is not limited in this embodiment. First, the pallet conveyor 1 and the PCB loading device 2 provide a pallet and a PCB board respectively, then the transport device 3 grabs the PCB board, and the coordinate calibration device 4 identifies the coordinates of the PCB board relative to the preset placement position, so that the transport device 3 accurately transports the PCB board to the specified position on the pallet. The transport device 3 and the coordinate calibration device 4 repeat the above actions until a preset number of PCB boards are placed on the pallet, and finally the pallet fully loaded with PCB boards is provided to the SMT equipment, thereby improving the feeding efficiency to the SMT equipment, thereby improving the production efficiency of the downstream SMT equipment.

[0062] like Figure 1 and Figure 2As shown, the coordinate calibration device 4 includes a first calibration mechanism 41 and a second calibration mechanism 42. The first calibration mechanism 41 is installed on the frame 5 and is located between the PCB loading device 2 and the pallet conveying device 1. The second calibration mechanism 42 is installed downstream of the first calibration mechanism 41. Specifically, after the handling device 3 grabs the PCB board, the first calibration mechanism 41 can identify the offset coordinates of the PCB board relative to the preset placement position, so that the handling device 3 can fine-tune the grabbed PCB board, thereby eliminating the error of grabbing the PCB board, and then the second calibration mechanism 42 can identify the coordinates of the handling device 3 relative to the preset placement position. It can be understood that the handling device 3 has mechanical errors. The second calibration mechanism 42 controls the handling device 3 to self-adjust to eliminate the errors of the handling device 3, and pastes the PCB board to the specified position on the pallet, thereby improving the relative position accuracy between multiple PCB boards.

[0063] like Figure 3 and Figure 4 As shown, specifically, the handling device 3 includes a three-axis driving mechanism 31 and a grasping mechanism 32. The three-axis driving mechanism 31 is installed on the frame 5 and is located above the pallet conveying device 1. The grasping mechanism 32 is connected to the execution end of the three-axis driving mechanism 31. The three-axis driving mechanism 31 includes an X-axis driving component 311, a Y-axis driving component 312 and a Z-axis driving component 313. The X-axis driving component 311 can be set as a gear rack driving structure driven by a motor or a screw nut driving structure. In this embodiment, the X-axis driving component 311 is a screw nut driving structure, and the Y-axis driving component 312 can be It is configured as a gear rack drive structure or a screw nut drive structure driven by a motor. The Y-axis drive assembly 312 of this embodiment is a screw nut drive structure. The X-axis drive assembly 311 is connected to the execution end of the Y-axis drive assembly 312. The Z-axis drive assembly 313 can also be configured as a gear rack drive structure or a screw nut drive structure driven by a motor. The Z-axis drive assembly 313 of this embodiment includes a motor and a belt transmission pair connected to the output end of the motor. The gripping mechanism 32 is connected to the belt, so that the three-axis drive mechanism 31 can drive the gripping mechanism 32 to move in three degrees of freedom.

[0064] In this embodiment, the gripping mechanism 32 includes a rotary drive member 322 and a self-locking suction cup 321 connected to the output end of the rotary drive member 322. The self-locking suction cup 321 is a prior art and can be self-sealed when sucked to the hole. The specific structure is not described. The rotary drive member 322 can be set as a motor or a rotary cylinder. The rotary drive member 322 of this embodiment is a motor, which is installed on the belt of the Z-axis drive assembly 313, and the self-locking suction cup 321 is connected to the output end of the motor. The first calibration mechanism 41 includes a bottom camera 411, which can also be replaced by a grating reader or a magnetic grating reader. The bottom camera 411 of this embodiment is installed on the frame 5 and is located between the PCB loading device 2 and the tray conveyor 1. When the self-locking suction cup 321 absorbs the PCB board provided by the PCB feeding device 2 and moves it to the top of the bottom camera 411, the bottom camera 411 can identify the optical point on the PCB board, and then calculate the deviation of the PCB board relative to the preset placement position, and finally the motor drives the self-locking suction cup 321 and the PCB board to rotate to correct the deviation of the PCB board, thereby eliminating the grasping error of the grasping mechanism 32. In other embodiments of the present invention, the handling device 3 can also be set as a multi-degree-of-freedom mechanical arm, and the self-locking suction cup 321 is connected to the execution end of the mechanical arm, which can also realize the function of grasping and moving the PCB board.

[0065] Specifically, the second calibration mechanism 42 includes a calibration plate 421 and a positioning measuring member 422. When the tray is fixed, the calibration plate 421 is arranged relative to the tray. A plurality of preset identification points are arranged on the calibration plate 421. The preset identification points correspond to the preset placement positions where the PCB board needs to be placed. The positioning measuring member 422 can be set as a camera, a grating reader or a magnetic grating reader. The positioning measuring member 422 of this embodiment is set as a camera. The camera and the Z-axis driving assembly 313 are mounted on the same mounting plate and connected to the execution end of the X-axis driving assembly 311. When the gripping mechanism 32 absorbs the PCB board and passes through the bottom camera 411, it moves to between the calibration plate 421 and the tray. The camera of the second calibration mechanism 42 can identify the preset identification points on the calibration plate 421, and then calculate the coordinates of the gripping mechanism 32 relative to the preset identification points. Finally, the three-axis driving mechanism 31 drives the gripping mechanism 32 to place the PCB board on the preset placement position of the tray, thereby improving the collage accuracy of the PCB board.

[0066] like Figure 5-Figure 7As shown, the pallet conveying device 1 includes a pallet loading mechanism 11, a plasma cleaning mechanism 12 and a conveying mechanism 13. The pallet loading mechanism 11 can provide a pallet. The plasma cleaning mechanism 12 is located downstream of the pallet loading mechanism 11. The plasma cleaning mechanism 12 can plasma clean the silicone surface of the pallet provided by the pallet loading mechanism 11, thereby increasing the number of times the pallet is used. The conveying mechanism 13 is located downstream of the plasma cleaning mechanism 12. The conveying mechanism 13 can convey the pallet after plasma cleaning. The conveying mechanism 13 is sequentially provided with a feed position, a fixed position and a discharge position. The feed position is connected to the discharge end of the plasma cleaning mechanism 12. When the plasma cleaning mechanism 12 cleans the pallet, the conveying mechanism 13 can convey the pallet to the fixed position for fixing. Then the transport device 3 transports multiple PCB boards to the pallet. Finally, the conveying mechanism 13 conveys the pallet carrying the PCB boards to the discharge position. It can be understood that when the tray is fixed in the fixed position, the preset placement position is located on the fixed tray, but the tray at this time only plays the role of supporting the PCB board and does not participate in the coordinate positioning of the PCB board. It is only necessary to place multiple PCB boards one by one in multiple preset placement positions in the machine coordinate system to ensure the relative position between the multiple PCB boards.

[0067] Specifically, the pallet loading mechanism 11 includes a first drive assembly 111, a pallet support 112, a second drive assembly 113 and a first push plate 114. The pallet support 112 is provided with mounting platforms 1121 spaced apart in the vertical direction. The mounting platforms 1121 are symmetrically arranged on both sides of the pallet support 112, and a pallet is placed on each pair of mounting platforms 1121. The first drive assembly 111 can be set as a motor-driven gear rack drive structure or a screw nut drive structure. The first drive assembly 111 of this embodiment is a screw nut structure, and the pallet support 112 is provided with a second drive assembly 113 and a first push plate 114. The tray bracket 112 is connected to the output end of the first drive component 111; a second drive component 113 is installed on the top of the tray bracket 112, and the second drive component 113 can be set as a cylinder push rod structure or a motor-driven chain structure. The second drive component 113 of this embodiment is a motor-driven chain structure, and the first push plate 114 is connected to the execution end of the second drive component 113. The second drive component 113 can drive the first push plate 114 to move the tray from the mounting table 1121 in a direction close to the plasma cleaning mechanism 12 and the conveying mechanism 13. The first pallet is located on the topmost pair of mounting platforms 1121, the second driving component 113 drives the first push plate 114 to push the first pallet to the feeding position of the conveying mechanism 13, the plasma cleaning mechanism 12 located at the feeding position plasma cleans the first pallet, and then the conveying mechanism 13 conveys the first pallet; the first driving component 111 drives the second pallet to rise to the position of the first push plate 114, the second driving component 113 drives the first push plate 114 to repeat the same action to convey the second pallet to the plasma cleaning mechanism 12 for cleaning, thereby improving the feeding efficiency of the pallets.

[0068] Specifically, the plasma cleaning mechanism 12 includes a plasma cleaning head 121 and a third driving assembly 122. The plasma cleaning head 121 is a prior art, and the specific structure is not described here. The third driving assembly 122 is installed at the discharge end of the tray loading mechanism 11, and can be set as a cylinder push rod structure or a motor-driven belt transmission structure. The third driving assembly 122 of this embodiment is set as a motor-driven belt transmission structure, and the plasma cleaning head 121 is installed on the belt of the belt transmission structure. The driving direction of the third driving assembly 122 is perpendicular to the conveying direction of the conveying mechanism 13. It can be understood that when the conveying mechanism 13 conveys the tray along the length direction of the tray, the third driving mechanism can drive the plasma cleaning head 121 along the width direction of the tray, so as to fully plasma clean the silicone surface of the tray.

[0069] In this embodiment, if Figure 7 As shown, the conveying mechanism 13 includes a base 131, a first guide rail 132 and a second guide rail 133. The base 131 is mounted on the frame 5. The first guide rail 132 and the second guide rail 133 are arranged in parallel and both extend in a direction away from the tray loading mechanism 11. The first guide rail 132 and the second guide rail 133 are installed with a belt conveying assembly 135. The belt conveying assembly 135 includes a motor and a plurality of rollers installed on the side walls of the first guide rail 132 and the second guide rail 133. The rollers are wound with belts. The rollers are connected to the output end of the motor, and the motor can drive the belts to rotate through the rollers. When the pallet provided by the tray loading mechanism 11 enters the feeding position of the conveying mechanism 13, the pallet is placed on the belt of the belt conveying assembly 135, so that the pallet can be driven to move in the direction from the feeding position, the fixed position to the discharging position.

[0070] As a preferred embodiment, the first guide rail 132 is fixed on the base 131, and a guide rail extending from the first guide rail 132 to the second guide rail 133 is installed on the base 131. A slider is installed at the bottom of the second guide rail 133, and the slider is slidably connected to the guide rail. The conveying mechanism 13 also includes a fourth drive assembly 134, which can be set as a cylinder push rod structure or a motor-driven lead screw nut structure. The fourth drive assembly 134 of this embodiment is set as a motor-driven lead screw nut structure, and the second guide rail 133 is connected to the execution end of the fourth drive assembly 134. The fourth drive assembly 134 can drive the second guide rail 133 to move in a direction close to or away from the first guide rail 132, thereby adjusting the distance between the first guide rail 132 and the second guide rail 133 to adapt to pallets of different widths, thereby improving versatility.

[0071] Specifically, the fixed position of the pallet conveyor 1 is provided with a lifting mechanism 14 and a baffle 15. The lifting mechanism 14 can be set to be driven by an electric push rod or a cylinder. The lifting mechanism 14 of this embodiment is driven by a cylinder. The cylinder is installed on the frame 5 and is located below the fixed position. A buffer is installed at the output end of the cylinder. The two baffles 15 are respectively installed on the first guide rail 132 and the second guide rail 133. The distance between the two baffles 15 is slightly smaller than the distance between the first guide rail 132 and the second guide rail 133. When the belt conveyor assembly 135 drives the pallet to move to the fixed position, the lifting mechanism 14 can lift the pallet and press the pallet against the baffle 15, thereby fixing the pallet in the fixed position, so that the subsequent handling device 3 can carry multiple PCB boards to the pallet in the fixed position.

[0072] like Figure 1 , Figure 8 and Fig. 9 As shown, the PCB loading device 2 includes a first loading mechanism 21 and a second loading mechanism 22, and the first loading mechanism 21 and the second loading mechanism 22 are respectively arranged on both sides of the conveying mechanism 13. The first loading mechanism 21 and the second loading mechanism 22 can respectively provide different types of PCB boards, so that the transport device 3 can transport different types of PCB boards to the same tray, thereby meeting the SMT process requirements of multiple models or positive and negative boards, and improving production efficiency.

[0073] Specifically, the first loading mechanism 21 includes a bearing platform 211 and a first lifting assembly 212. The number of bearing platforms 211 can be set according to actual needs. The two bearing platforms 211 of this embodiment are installed on the frame 5 and are located on one side of the conveying mechanism 13. Multiple stacked light panels can be placed on the bearing platform 211. The first lifting assembly 212 can be set as a motor-driven lead screw nut structure or a gear rack structure. The first lifting assembly 212 of this embodiment is a motor-driven lead screw nut structure. The nut is rotatably installed at the bottom of the frame 5. The lead screw rotates through the table of the frame 5 and is connected to the bearing platform 211. The structure is compact. When the handling device 3 takes away a PCB board on the bearing platform 211, the first lifting assembly 212 can drive the bearing platform 211 to rise a distance of the thickness of the PCB board, so as to facilitate the handling device 3 to take away the next PCB board.

[0074] Specifically, the second feeding mechanism 22 includes a rack 221, a second lifting assembly 222, a fifth driving assembly 223 and a second push plate 224. The rack 221 is provided with placement tables spaced apart in the vertical direction. The placement tables are symmetrically arranged on both sides of the rack 221. Each pair of placement tables is a placement position, and a PCB board with one side having been mounted is placed on each placement position. The second lifting assembly 222 can be set as a gear rack drive structure driven by a motor or a screw nut drive structure. The second lifting assembly 222 of this embodiment is a screw nut drive structure. The rack 221 is connected to the output end of the second lifting assembly 222; the fifth driving assembly 223 is installed on the top of the tray bracket 112, and the fifth driving assembly 223 can be set as a cylinder push rod structure or a motor-driven chain structure. The second driving assembly 113 of this embodiment is a cylinder push rod structure, and the cylinder is installed on one side of the rack 221. The second push plate 224 is connected to the output end of the cylinder through the adapter plate. The fifth driving assembly 223 can drive the second push plate 224 to push the PCB board out from the placement position in the direction close to the conveying mechanism 13. The first PCB board is located on the top pair of placement tables, and the fifth driving assembly 223 drives the second push plate 224 to push the first PCB board out, and the handling device 3 can transport the first PCB board to the tray of the conveying mechanism 13; the second lifting assembly 222 drives the second PCB board to rise to the position of the second push plate 224, and the fifth driving assembly 223 drives the second push plate 224 to repeat the same action to push the second PCB board out, thereby improving the feeding efficiency of the PCB board. In other embodiments of the present invention, the PCB feeding device 2 may also be configured as a plurality of first feeding mechanisms 21 or a plurality of second feeding mechanisms 22, and may also provide PCB boards of different models.

[0075] Embodiment 2:

[0076] like Fig.10 As shown, this embodiment provides a PCB panelization method, using the panelization equipment described in Example 1, multiple PCB boards can be collaged on the same tray, thereby improving the feeding efficiency to the SMT equipment, and further improving the production efficiency of the downstream SMT equipment. Specifically, the following steps are included:

[0077] S101: Loading the pallet.

[0078] The tray loading mechanism 11 can provide a tray coated with high-temperature self-adhesive silicone to the downstream.

[0079] S102: Plasma cleaning tray.

[0080] The plasma cleaning mechanism 12 plasma cleans the silicone surface of the provided tray, thereby increasing the number of times the tray can be used.

[0081] S103: The transport device 3 grabs the PCB board.

[0082] The handling device 3 grabs the PCB board provided by the PCB feeding device 2 .

[0083] S104: the first calibration mechanism 41 identifies the offset coordinates of the PCB board relative to the preset placement position, and the gripping mechanism 32 fine-tunes the PCB board.

[0084] When the grasping mechanism 32 absorbs the PCB board provided by the PCB loading device 2 and moves it to the top of the bottom camera 411 of the first calibration mechanism 41, the bottom camera 411 can identify the optical point on the PCB board, and then calculate the deviation of the PCB board relative to the preset coordinates of the PCB board in the machine coordinate system. Finally, the motor drives the PCB board to rotate to correct the deviation of the PCB board, thereby eliminating the grasping error of the grasping mechanism 32.

[0085] S105: The second marking mechanism 42 identifies the coordinates of the transport device 3 relative to the preset placement position.

[0086] After the transport device 3 grabs the PCB board and goes through step S104, the transport device 3 moves the PCB board to between the calibration plate 421 and the tray. The camera of the second calibration mechanism 42 can identify the preset identification points on the calibration plate 421. The preset identification points correspond to the preset placement positions one by one, and then the coordinates of the grabbing mechanism 32 relative to the preset identification points are calculated.

[0087] S201: The transport device 3 affixes the PCB boards to the tray.

[0088] After the calculation by the second calibration mechanism 42 in step S105, the three-axis driving mechanism 31 drives the grasping mechanism 32 to correct the deviation and then place the PCB board on the preset placement position of the tray, thereby improving the collage accuracy of the PCB board.

[0089] S202: Determine whether a preset number of PCB boards are mounted on the tray.

[0090] If yes, execute S300;

[0091] If not, then S103 is executed. Specifically, in this embodiment, two first feeding mechanisms 21 and two second feeding mechanisms 22 are provided, and the handling device 3 can sequentially cycle and grab PCB boards along the direction of the first first feeding mechanism 21 station, the second first feeding mechanism 21 station, the first second feeding mechanism 22 station, and the second second feeding mechanism 22 station, so as to paste different types of PCB boards on the same pallet. In other embodiments, the handling device 3 can also first take out the PCB boards provided by the first feeding mechanism 21, and then take out the PCB boards provided by the second first feeding mechanism 21, the first second feeding mechanism 22, and the second second feeding mechanism 22 in sequence, so as to paste multiple PCB boards of the same type on the same pallet.

[0092] S300: Transport the tray to the SMT equipment.

[0093] After a preset number of PCB boards are assembled on the tray, the tray is transported to the SMT equipment to complete the subsequent SMT process, thereby improving production efficiency.

[0094] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", etc., and the like, are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0095] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0096] In addition, the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A panelizing device for feeding SMT equipment, characterized in that: include: A pallet conveying device (1) for providing and conveying pallets; A PCB feeding device (2), used for providing a PCB board; A handling device (3) capable of moving between a station of the PCB loading device (2) and a station of the tray conveying device (1); A coordinate calibration device (4) connected to the transport device (3), the coordinate calibration device (4) being capable of identifying the coordinates of the PCB board relative to a preset placement position, and the transport device (3) being capable of transporting a plurality of PCB boards to the same tray; The coordinate calibration device (4) comprises: a first calibration mechanism (41) installed between the PCB loading device (2) and the tray conveying device (1), the first calibration mechanism (41) being capable of identifying the offset coordinates of the PCB board relative to the preset placement position; and a second calibration mechanism (42) installed downstream of the first calibration mechanism (41) and used for identifying the coordinates of the transport device (3) relative to the preset placement position.

2. The panelizing equipment according to claim 1, characterized in that: The second calibration mechanism (42) comprises: A calibration plate (421) is arranged opposite to the tray, and a plurality of preset identification points are arranged on the calibration plate (421), and the preset identification points correspond to the preset placement positions one by one; A positioning measuring component (422) is installed on the transport device (3). When the transport device (3) moves between the calibration plate (421) and the tray, the positioning measuring component (422) can identify the coordinates of the transport device (3) relative to the preset identification point.

3. The panelizing equipment according to claim 1, characterized in that: The pallet conveying device (1) comprises: A tray loading mechanism (11) for providing the tray; A plasma cleaning mechanism (12) is located downstream of the tray loading mechanism (11), and the plasma cleaning mechanism (12) is capable of plasma cleaning the tray; A conveying mechanism (13) is located downstream of the plasma cleaning mechanism (12), and is used to convey the tray provided by the tray loading mechanism (11). The conveying mechanism (13) is sequentially provided with a feeding position, a fixing position and a discharging position, and the tray can be fixed at the fixing position. The handling device (3) can be moved between the working position of the PCB loading device (2) and the fixing position.

4. The panelizing device according to claim 3, characterized in that: The conveying mechanism (13) comprises: Base (131); A first guide rail (132) extending in a direction away from the tray loading mechanism (11); The second guide rail (133) is arranged in parallel with the first guide rail (132), and the second guide rail (133) is slidably connected to the base (131) in a direction approaching or moving away from the first guide rail (132). The tray can move on the first guide rail (132) and the second guide rail (133) in sequence along the direction from the feeding position, the fixed position to the discharging position.

5. The panelizing equipment according to claim 3, characterized in that: A lifting mechanism (14) is installed below the fixed position, and a baffle (15) is installed above the fixed position. When the tray moves to the fixed position, the lifting mechanism (14) can lift the tray and press the tray against the baffle (15).

6. The panelizing equipment according to claim 1, characterized in that: The PCB loading device (2) comprises: A first loading mechanism (21) is arranged on one side of the tray conveying device (1), and the first loading mechanism (21) is capable of providing the PCB boards of the first type; The second loading mechanism (22) is arranged on the other side of the tray conveying device (1), and the second loading mechanism (22) can provide the second type of PCB boards.

7. The panelizing device according to claim 6, characterized in that: The first loading mechanism (21) comprises a carrying platform (211) and a first lifting component (212); the carrying platform (211) is connected to an execution end of the first lifting component (212); a plurality of stacked PCB boards of the first type are placed on the carrying platform (211); and the first lifting component (212) is capable of driving the carrying platform (211) to rise and fall; The second loading mechanism (22) comprises a storage rack (221) and a second lifting assembly (222); the storage rack (221) is connected to an execution end of the second lifting assembly (222); a plurality of placement positions extending at intervals in a vertical direction are arranged on the storage rack (221); a second type of PCB board is placed on each of the placement positions; and the second lifting assembly (222) is capable of driving the storage rack (221) to rise and fall.

8. A PCB paneling method, characterized in that: The panelizing device according to any one of claims 1 to 7 comprises: Identifying the coordinates of the PCB board relative to the preset placement position; Moving a plurality of the PCB boards to the same tray; The tray is transported to the SMT equipment.

9. The PCB panelization method according to claim 8, characterized in that: Identifying the coordinates of the PCB board relative to the preset placement position includes: Identify the offset coordinates of the PCB board relative to the preset placement position, and fine-tune the PCB board; The coordinates of the transport device (3) relative to the preset placement position are identified.

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