A micro-hole processing method and its application in preparing micro-porous ceramic substrate

Abstract

The present invention discloses a micro-hole processing method and its application in preparing a micro-porous ceramic substrate. The micro-hole processing method comprises: clamping a part to be processed on a drilling platform, and adjusting the processing equipment before processing; according to the drilling parameters of the part to be processed, the processing equipment performs first depth processing of each micro-hole at each micro-hole position to be processed of the part to be processed; according to the drilling parameters, a cyclic drilling method is adopted to perform second depth processing of each micro-hole on the basis of the first depth of each micro-hole until a target hole is drilled through; the present invention proposes a micro-hole processing method and its application in preparing a micro-porous ceramic substrate, which is beneficial to improving the quality of fine micro-holes and reducing the scrap rate by adopting the cyclic drilling method of the target hole.

Description

Technical Field

[0001] The present application relates to the technical field of micro-hole processing, and in particular to a micro-hole processing method and its application in preparing a micro-hole ceramic substrate. Background Art

[0002] When producing vertical probe cards, the ceramic plates that make up the probe cards need to be punched. As the requirements for precision become higher and higher, the quality level required for processing tiny holes becomes higher and higher.

[0003] In the prior art, generally, a CNC machine tool is used to punch holes in a ceramic plate in a traditional way or by a laser punching method. However, for fine holes with higher requirements, since the spacing between the two holes may be less than 10 microns, when punching, the structure of the part is changed by punching it through at one time, resulting in changes in the stress-bearing part of the part. Especially when the hole depth is relatively large, the tool is thin and long, and has poor rigidity, so it is easy to deflect during drilling and produce vibration. In addition, when drilling the second micro hole near the perforated side, it is easy to cause defects such as edge cracking, resulting in a high scrap rate. In addition, when using the existing machine tool punching method, since the drilling equipment in the prior art moves back and forth along three guide rails, the guide rails are usually made of metal materials. The guide rails are greatly affected by the ambient temperature during use, and the thermal expansion and contraction phenomenon is serious, which makes it difficult to ensure the micro hole processing accuracy and easy to cause hole deviation. If the laser punching method is used, the biggest problem is the low energy utilization rate, which is easy to increase the processing cycle and waste resources seriously. Summary of the invention

[0004] The present invention mainly aims at the above problems, and proposes a micro-hole processing method and its application in preparing micro-hole ceramic substrates. By adopting the method of cyclic drilling of target holes, it is beneficial to improve the quality of fine micro-holes and reduce the scrap rate.

[0005] To achieve the above objectives, on the one hand, the present invention provides a micro-hole processing method, the micro-hole processing method comprising:

[0006] Clamp the parts to be processed on the drilling platform and adjust the processing equipment before processing;

[0007] According to the drilling parameters of the part to be processed, the processing equipment performs first depth processing of each micro-hole at each micro-hole position to be processed of the part to be processed;

[0008] According to the drilling parameters, a cyclic drilling method is adopted to perform second depth processing of each micro hole on the basis of the first depth of each micro hole until the target hole is drilled through.

[0009] Furthermore, the drilling tool of the processing equipment is a PCD tool.

[0010] Furthermore, the micro-hole processing method also includes returning the drilling tool to the origin after each cycle.

[0011] Furthermore, the micro-hole processing method also includes detecting the wear degree of the tool after each cycle of processing to determine whether to perform a tool replacement process step or continue the processing process step.

[0012] Furthermore, the depth of each drilling is 0.5-2 microns.

[0013] Furthermore, the value of each processing depth is set according to the distribution and density of micropores of the part to be processed.

[0014] To achieve the above object, on the other hand, the present invention provides an application of a micro-pore processing method in preparing a micro-porous ceramic substrate.

[0015] Compared with the prior art, the present invention provides a micro-hole processing method and its application in the preparation of micro-porous ceramic substrates. By adopting a cyclic punching method, repeatability and small cutting are achieved, ensuring uniform force on the tool, extending the service life of the tool, and avoiding tool ablation due to large tool cutting volume. In addition, each small cutting can reduce the risk of edge cracking between the two micro-holes to a smaller extent, and at the same time can reduce the pause time of the guide rail, always keeping the guide rail in a preheated state, avoiding thermal expansion and contraction and accumulating errors, which would cause parts to be scrapped. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a step diagram of micro-hole processing disclosed in this application.

[0017] Figure 2 This is a flow chart of micro-hole processing disclosed in this application. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0019] The present invention provides a micro-hole processing method, such as Figure 1 , Figure 2 As shown, in one embodiment, the micro-hole processing method includes the following steps:

[0020] Step 1: Select the parts to be processed and cut them into sheets of appropriate size according to requirements;

[0021] The part to be processed is the material that needs to be processed with micro-holes. The micro-hole processing method of this embodiment is a method of generating micro-holes on the part to be processed by drilling equipment such as a CNC machine tool.

[0022] In this embodiment, the part to be processed is an alumina (96%) ceramic substrate with a thickness of 1 mm, the diameter of the processed holes is 0.005 mm, the number is 35 (7×5), and the spacing between adjacent processed holes is 0.01 mm.

[0023] Step 2: Clamp the parts to be processed on the drilling platform and adjust the processing equipment before processing;

[0024] Before machining, it is necessary to analyze the parts to be machined and understand the general situation of the parts to be machined, including the workpiece material, process requirements, etc., and then determine the CNC machining process of the parts, such as the machining route and the tools used. After that, write a program sheet, input the program into the machine tool, perform graphic simulation, and verify the correctness of the programming. Before simulation, it is necessary to select a suitable tool and perform trial cutting and tool calibration. Since it is micro-hole machining, the selected tool is small and prone to wear. In this embodiment, a hard PCD tool is preferably used.

[0025] Step three, according to the drilling parameters of the part to be processed, the processing equipment performs first depth processing on each micro-hole position to be processed of the part to be processed.

[0026] According to the drilling parameters, a cyclic drilling method with lower cutting parameters is adopted to perform second depth processing of each micro hole on the basis of the first depth of each micro hole until the target hole is drilled through.

[0027] In this embodiment, the processing depth of each micro-hole of the part to be processed is set to N sections, the drilling sequence is set, and a cyclic drilling method is adopted to perform multiple cyclic drillings. The value of each processing depth is set according to the distribution and density of the micro-holes of the part to be processed, such as Figure 1 As shown, the drilling is cyclically performed in the direction indicated by the arrow, with a drilling depth of 0.5-2 microns each time until the target hole is drilled through. Through repetitive and small cutting, the tool force is evenly distributed, the tool service life is extended, and tool ablation due to large tool cutting volume is avoided. In addition, each small cutting can reduce the risk of edge cracking between the two microholes to a greater extent, reduce the traction force between adjacent holes, and reduce the duration of the guide rail pause. The guide rail is always kept in a preheated state to avoid thermal expansion and contraction and accumulation of errors, which may cause parts to be scrapped.

[0028] When the hole depth of the machined part is large, the part can be divided into 1 / 2N sections for front drilling and 1 / 2N sections for back drilling, and the above-mentioned cycle drilling method can be used to drill holes on the front and back sides respectively.

[0029] In the above drilling process, an air gun is used for blowing to prevent debris from accumulating in the hole and affecting the processing.

[0030] Furthermore, the micro-hole processing method also includes returning the drilling tool to the origin after each cycle.

[0031] After each cycle, it will be reset to zero. This is done to set a fixed reference and ensure the consistency of the reference point position. That is, after each cycle, the accumulated error value can be removed and the original path can be returned to the first processing hole, thereby accurately connecting the processing path of the first processing; in addition, even if a power outage occurs during processing, the initial processing position can be found by performing the return to origin operation again.

[0032] Furthermore, the micro-hole processing method also includes detecting the wear of the tool after each cycle of processing to determine whether to perform a tool replacement process step or continue the processing step.

[0033] Due to the large number of microholes, the tool will be severely worn after being used for a certain period of time and number of times, and needs to be replaced when the tool enters the rapid wear stage. The wear detection used may include: resistance measurement, tool-workpiece distance measurement, optical measurement, discharge current measurement, X-ray measurement, computer image processing, etc.

[0034] The invention also provides an application of the micro-pore processing method in preparing a micro-pore ceramic substrate.

[0035] In the specification and claims of the present application, the words "include / comprise" and the words "have / include" and their variations are used to specify the existence of stated features, values, steps or components, but do not exclude the existence or addition of one or more other features, values, steps, components or combinations thereof.

[0036] Some features of the present invention are described in different embodiments for clarity of description, however, these features may also be described in combination in a single embodiment. Conversely, some features of the present invention are described in only a single embodiment for brevity, however, these features may also be described in different embodiments alone or in any suitable combination.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro-hole processing method, characterized in that: The micro-hole processing method comprises: Clamp the parts to be processed on the drilling platform and adjust the processing equipment before processing; According to the drilling parameters of the part to be processed, the processing equipment performs first depth processing of each micro-hole at each micro-hole position to be processed of the part to be processed; According to the drilling parameters, a cyclic drilling method is adopted to perform second depth processing of each micro hole on the basis of the first depth of each micro hole until the target hole is drilled through; The processing depth of each micro-hole of the part to be processed is set to N sections, the drilling sequence is set, and the cyclic drilling method is adopted to perform multiple cyclic drillings. The value of each processing depth is set according to the distribution and density of the micro-holes of the part to be processed; The tool wear is checked after each cycle of processing to determine whether to perform a tool change process or continue the processing process; Each of the microholes comprises at least two rows of microholes, each row of microholes has no less than two microholes, and the drilling sequence is that the drilling directions of any two adjacent rows of microholes are opposite; The depth of each drilling is 0.5-2 microns, so as to reduce the risk of edge cracking between any two adjacent micro-holes, reduce the traction between adjacent holes, reduce the dwell time of the guide rail used to drive the drilling tool on the processing equipment, keep the guide rail in a preheated state, and reduce the precision error caused by thermal expansion and contraction of the guide rail; The parts to be processed are divided into 1 / 2N sections for front drilling and 1 / 2N sections for back drilling, and the front and back sides of the parts to be processed are drilled respectively by using the cycle drilling; The part to be processed is a ceramic substrate.

2. A micro-hole processing method according to claim 1, characterized in that: The drilling tool of the processing equipment is a PCD tool.

3. A micro-hole processing method according to claim 1, characterized in that: The micro-hole processing method also includes returning the drilling tool to the origin after each cycle.

4. An application of the micropore processing method according to any one of claims 1 to 3 in preparing a microporous ceramic substrate.

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