Liquid cooling head and liquid cooling device

Abstract

A liquid cooling head includes a base plate, a heat sink, a partition and an upper cover. The base plate has an opening, and the heat sink, partition and upper cover are fixed to the base plate. The partition divides the opening into a plurality of cooling chambers, and each cooling chamber is provided with a coolant inlet, a coolant outlet, a pump and an electronic control device. The coolant inlet and the coolant outlet are formed in the upper cover, the pump is arranged between the partition and the upper cover, and connected to the coolant outlet, and the electronic control device drives the pump to rotate so that the coolant flows through the cooling chamber to cool at least one heat source under the heat sink.

Description

Technical Field

[0001] The present invention relates to a liquid cooling head, and in particular to a liquid cooling type heat dissipation device having a liquid cooling head. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs becomes more and more important.

[0003] Electronic components such as CPUs generate heat when running and require proper cooling to achieve optimal performance. In order to keep CPUs and other electronic components running at an ideal temperature, liquid cooling or air cooling is currently commonly used.

[0004] In the current water cooling method, the working fluid flows into the water cooling head through the pipe, and the water cooling head contacts the surface of the electronic components such as the CPU to take away the heat generated by the CPU and other electronic components, thereby reducing the operating temperature of the CPU and other electronic components and improving work efficiency.

[0005] However, how to further improve the performance of the water cooling head will help to improve the performance and efficiency of electronic products, which is eagerly anticipated by relevant personnel in the relevant technical field. Summary of the invention

[0006] The invention summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This invention summary is not a complete overview of the present disclosure, and it is not intended to point out the important / critical elements of the embodiments of the present invention or to define the scope of the present invention.

[0007] An object of the present invention is to provide a liquid cooling head and a liquid cooling heat dissipation device having the liquid cooling head, so as to effectively improve the heat dissipation efficiency of the liquid cooling head and effectively reduce the production cost through modular production.

[0008] To achieve the above-mentioned purpose, a technical implementation of the content of the present invention relates to a liquid cooling head including a base plate, a heat sink, a partition and an upper cover plate. The base plate has an opening, and the heat sink, the partition and the upper cover plate are fixed to the base plate. The partition divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a coolant inlet, a coolant outlet, a pump and an electronic control device. The coolant inlet and the coolant outlet are formed in the upper cover plate, the pump is arranged between the partition and the upper cover plate, and is connected to the coolant outlet, and the electronic control device drives the pump to rotate so that the coolant flows through the cooling chamber to cool at least one heat source under the heat sink.

[0009] In some embodiments, the liquid cooling head further includes an outer cover plate to fix the electronic control device around the pump to drive the pump to rotate.

[0010] In some embodiments, the partition includes a horizontal baffle and a vertical baffle connected to the horizontal baffle. The vertical baffle divides the opening into cooling chambers and is disposed on both sides of the vertical baffle.

[0011] In some embodiments, each cooling chamber is provided with a liquid inlet and a liquid outlet on the partition, and the pump is located above the liquid outlet.

[0012] In some embodiments, a plurality of guide plates are disposed below the liquid inlet to guide the cooling liquid.

[0013] In some embodiments, the guide vane and the vertical baffle form an angle to guide the cooling liquid to flow toward the vertical baffle. In some embodiments, the angle is about 30 degrees to 60 degrees.

[0014] In some embodiments, the closer the guide vane is to the vertical baffle, the larger the spacing between them is, and the farther the guide vane is from the vertical baffle, the smaller the spacing between them is. In some embodiments, the closer the guide vane is to the vertical baffle, the longer the guide vane is, and the farther the guide vane is from the vertical baffle, the shorter the guide vane is.

[0015] In some embodiments, each cooling cavity is further provided with a skived fin.

[0016] According to another embodiment of the present invention, a liquid-cooled heat dissipation device is disclosed, comprising the aforementioned liquid cooling head and a first heat dissipation tower. The cooling chamber comprises a first cooling chamber and a second cooling chamber. The first heat dissipation tower comprises a first liquid inlet and a first liquid outlet. The first liquid inlet is connected to the coolant outlet of the second cooling chamber, and the first liquid outlet is connected to the coolant inlet of the first cooling chamber, so that the coolant enters the first heat dissipation tower from the second cooling chamber, and then flows into the first cooling chamber after heat dissipation.

[0017] In some embodiments, the liquid-cooled heat dissipation device further includes a second heat dissipation tower, wherein the second heat dissipation tower includes a second liquid inlet and a second liquid outlet. The second liquid inlet is connected to the coolant outlet of the first cooling chamber, and the second liquid outlet is connected to the coolant inlet of the second cooling chamber, so that the coolant enters the second heat dissipation tower from the first cooling chamber, and then flows into the second cooling chamber after heat dissipation.

[0018] In some embodiments, the liquid cooling device further includes a fan disposed between the first cooling tower and the second cooling tower.

[0019] In some embodiments, the first heat sink and the second heat sink respectively include a lower water tank, an upper water tank, a plurality of flat water pipes and a plurality of heat sink fins. The flat water pipes are connected between the lower water tank and the upper water tank, and the heat sink fins surround the flat water pipes and are also located between the lower water tank and the upper water tank.

[0020] In some embodiments, the liquid cooling device further includes an upper water tank cover and a lower water tank cover. The upper water tank cover is disposed between the upper water tank and the heat dissipation fins, and the lower water tank cover is disposed between the lower water tank and the heat dissipation fins. The upper water tank cover and the lower water tank cover each include a plurality of elastic fastening members, and the upper water tank and the lower water tank each include a fixing flange, and the elastic fastening members are bent and pressed on the corresponding fixing flanges.

[0021] In some embodiments, the first heat dissipation tower and the second heat dissipation tower have the same size and are symmetrically connected to two sides of the liquid cooling head.

[0022] In some embodiments, the liquid-cooled heat dissipation device further includes a return pipe connected between the first coolant outlet of the first cooling chamber and the second coolant inlet of the second cooling chamber.

[0023] Therefore, the aforementioned liquid cooling head and liquid cooling heat sink can use a single cooling tower or multiple cooling towers to dissipate heat according to actual needs, and adjust the required heat dissipation efficiency and performance according to the heat generated by the heat source. The parts of the liquid cooling head and the liquid cooling heat sink are symmetrical and shared, which can also reduce production costs and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows:

[0025] Figure 1 FIG. 1 is an exploded schematic diagram of a liquid cooling head according to an embodiment of the present invention.

[0026] Figure 2 for Figure 1 A schematic diagram of the structure of the component part in the opening of the bottom plate of the liquid cooling head is shown.

[0027] Figure 3 FIG. 4 is a schematic diagram of a liquid cooling device according to an example of another embodiment of the present invention.

[0028] Figure 4 It is a schematic diagram of a liquid cooling device according to another example of another embodiment of the present invention.

[0029] Figure 5A Schematic diagram of an explosion of part of the heat sink of a liquid-cooled heat sink.

[0030] Figure 5B Schematic diagram of another exploded portion of the heat sink of the liquid-cooled heat sink.

[0031] Description of reference numerals:

[0032] 100: Liquid cooling head

[0033] 110: Outer cover

[0034] 120: Electronic control device

[0035] 122: First electronically controlled motor

[0036] 124: Second electronically controlled motor

[0037] 130: Upper cover

[0038] 132: First coolant inlet

[0039] 134: First coolant outlet

[0040] 136: Second coolant inlet

[0041] 138: Second coolant outlet

[0042] 140: Pump

[0043] 142: First Pump

[0044] 144: Second Pump

[0045] 150: Partition

[0046] 152: Horizontal baffle

[0047] 153: Liquid inlet

[0048] 154: Guide vane

[0049] 155: Liquid inlet

[0050] 156: Guide vane

[0051] 157: Liquid outlet

[0052] 158: Vertical baffle

[0053] 159: Liquid outlet

[0054] 160: Bottom plate

[0055] 162: Opening

[0056] 170: Heat sink

[0057] 172: The first skived fin

[0058] 174: Second skived fin

[0059] 200: Cooling chamber

[0060] 201: Angle

[0061] 202: Interval

[0062] 203: Interval

[0063] 204: Interval

[0064] 205: Interval

[0065] 206: Guide vane length

[0066] 207: Guide vane length

[0067] 210: First cooling chamber

[0068] 220: Second cooling chamber

[0069] 300: Liquid cooling device

[0070] 310: The first cooling tower

[0071] 312: First liquid inlet

[0072] 314: First liquid outlet

[0073] 316: Lower water tank

[0074] 317: Cooling fins

[0075] 318: Flat water pipe

[0076] 319: Water tank

[0077] 320: Reflux pipe

[0078] 330: Fan

[0079] 341: Radiator cover

[0080] 342: Elastic fastener

[0081] 349: Fixed flange

[0082] 351: Lower water tank cover

[0083] 352: Elastic fastener

[0084] 359: Fixed flange

[0085] 400: Liquid cooling device

[0086] 410: Second cooling tower

[0087] 412: Second liquid inlet

[0088] 414: Second liquid outlet

[0089] 416: Lower water tank

[0090] 417: Cooling fins

[0091] 418: Flat water pipe

[0092] 419: Water tank DETAILED DESCRIPTION

[0093] The following is a detailed description of the embodiments with the help of the drawings in the specification, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structure operation is not intended to limit the order of its execution. Any device with equal technical effects produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in their original size. For ease of understanding, the same or similar components in the following description will be indicated by the same symbols.

[0094] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

[0095] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0096] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0097] Figure 1 FIG. 1 is an exploded schematic diagram of a liquid cooling head according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of the component part in the opening of the bottom plate of the liquid cooling head. Figure 3 is a schematic diagram of a liquid cooling device, and Figure 4 is a schematic diagram of another liquid cooling device. Figure 5A and Figure 5B A partial exploded diagram of a heat sink for a liquid-cooled heat sink.

[0098] See first Figure 1 to Figure 2 , it should be noted that in order to clearly illustrate the components in the opening of the bottom plate of the liquid cooling head, Figure 2The horizontal baffles of the partition are omitted to facilitate illustration of the components in the floor opening.

[0099] As shown in the figure, the liquid cooling head 100 includes a bottom plate 160, a heat sink 170, a partition 150, an upper cover 130 and an outer cover 110. The bottom plate 160 has an opening 162, the heat sink 170 is fixed to the bottom plate 160, and the partition 150 is also fixed on the bottom plate 160, and divides the opening 162 into a plurality of cooling chambers 200, such as a first cooling chamber 210 and a second cooling chamber 220. The upper cover 130 is also fixed on the bottom plate 160. Each cooling chamber 200 is configured with a coolant inlet, a coolant outlet, a pump 140 and an electronic control device 120. For example, the first cooling chamber 210 is configured with a first coolant inlet 132, a first coolant outlet 134, a first pump 142 and a first electronically controlled motor 122, and the second cooling chamber 220 is configured with a second coolant inlet 136, a second coolant outlet 138, a second pump 144 and a second electronically controlled motor 124.

[0100] Taking the first cooling cavity 210 as an example, the first coolant inlet 132 and the first coolant outlet 134 are both formed in the upper cover plate 130, and the first pump 142 is disposed between the partition plate 150 and the upper cover plate 130 and connected to the first coolant outlet 134, for example, the first pump 142 is fluidly connected to the first coolant outlet 134. The first electronically controlled motor 122 of the electronic control device 120 is used to drive the first pump 142 to rotate so that the coolant flows through the first cooling cavity 210 to cool at least one heat source under the heat sink 170, for example, a heat generating device such as a central processing unit or an electronic component.

[0101] Similarly, the second coolant inlet 136 and the second coolant outlet 138 of the second cooling chamber 220 are also formed in the upper cover plate 130, and the second pump 144 is disposed between the partition plate 150 and the upper cover plate 130 and connected to the second coolant outlet 138, for example, the second pump 144 is fluidically connected to the second coolant outlet 138. The second electronically controlled motor 124 of the electronic control device 120 is used to drive the second pump 144 to rotate so that the coolant flows through the second cooling chamber 220 to cool at least one heat source below the heat sink 170, such as a heat generating device such as a central processing unit or an electronic component.

[0102] The outer cover 110 can effectively fix the first electric control motor 122 and the second electric control motor 124 of the electric control device 120 so that they are respectively located around the first pump 142 and the second pump 144 to drive the first pump 142 and the second pump 144. The first pump 142 and the second pump 144 are located between the upper cover 130 and the partition 150 to drive the coolant, and the first electric control motor 122 and the second electric control motor 124 are arranged on the outer side of the upper cover 130, fixed and sealed on the upper cover 130 by the outer cover 110, so that the first electric control motor 122 and the second electric control motor 124 are isolated from the coolant and will not contact the coolant, thereby improving the service life and safety of the first electric control motor 122 and the second electric control motor 124.

[0103] In some embodiments, the partition 150 includes a horizontal baffle 152 and a vertical baffle 158, the vertical baffle 158 is connected to the bottom of the horizontal baffle 152, and the vertical baffle 158 separates the opening 162 into a first cooling cavity 210 and a second cooling cavity 220, and the first cooling cavity 210 and the second cooling cavity 220 are respectively arranged on both sides of the vertical baffle 158.

[0104] In some embodiments, the first cooling cavity 210 and the second cooling cavity 220 are respectively provided with a skived fin, for example, a first skived fin 172 and a second skived fin 174 are respectively provided in the first cooling cavity 210 and the second cooling cavity 220 , and are isolated from each other by a vertical baffle 158 .

[0105] In some embodiments, a liquid inlet 153, a liquid outlet 157, a liquid inlet 155, and a liquid outlet 159 are respectively formed on the partition 150. The liquid inlet 153 and the liquid outlet 157 are arranged corresponding to the first cooling chamber 210, and the liquid inlet 155 and the liquid outlet 159 are arranged corresponding to the second cooling chamber 220. The first pump 142 is located above the liquid outlet 157, and the second pump 144 is located above the liquid outlet 159. In some embodiments, the first pump 142 and the second pump 144 are centrifugal pumps, but the present invention is not limited thereto.

[0106] In some embodiments, a plurality of guide plates 154 and 156 are disposed below the liquid inlet holes 153 and 155 to guide the flow of the coolant. The guide plates 154 and / or the guide plates 156 form an angle 201 with the vertical baffle plate 158 to guide the coolant to flow toward the vertical baffle plate 158, that is, toward the center of the heat sink 170, thereby effectively reducing the temperature of the heat source.

[0107] In some embodiments, the angle 201 is approximately 30 degrees to 60 degrees.

[0108] In some embodiments, the closer the guide vanes 154 and / or the guide vanes 156 are to the vertical baffle 158, the larger the intervals between them are arranged, and the farther they are from the vertical baffle 158, the smaller the intervals between them are arranged. For example, interval 202 is greater than interval 203, interval 203 is greater than interval 204, and interval 204 is greater than interval 205. In addition, the closer the guide vanes 154 and / or the guide vanes 156 are to the vertical baffle 158, the longer the guide vanes are, and the farther they are from the vertical baffle 158, the shorter the guide vanes are. For example, guide vane length 206 is greater than guide vane length 207, but the present invention is not limited thereto.

[0109] Therefore, the coolant can enter the liquid cooling head 100 from the first coolant inlet 132, then pass through the partition 150 downward through the liquid inlet hole 153, and be guided by the guide plate 154 to the first skived fins 172 in the first cooling chamber 210 to take away the heat on the first skived fins 172, and then be driven by the first pump 142 to be sucked upward from the liquid outlet 157 and discharged from the liquid cooling head 100 from the first coolant outlet 134.

[0110] Similarly, the coolant can enter the liquid cooling head 100 through the second coolant inlet 136, then pass through the partition 150 downward through the liquid inlet hole 155, and be guided by the guide plate 156 to the second skived fins 174 in the second cooling chamber 220 to remove the heat from the second skived fins 174, and then be driven by the second pump 144 to be sucked upward through the liquid outlet 159 and discharged from the liquid cooling head 100 through the second coolant outlet 138.

[0111] Next Read Figure 3 The liquid cooling heat dissipation device 300 includes the aforementioned liquid cooling head 100 and a first heat dissipation tower 310. The first heat dissipation tower 310 includes a first liquid inlet 312 and a first liquid outlet 314. The first liquid inlet 312 is connected to the second coolant outlet 138 of the second cooling chamber 220, and the first liquid outlet 314 is connected to the first coolant inlet 132 of the first cooling chamber 210, so that the coolant enters the first heat dissipation tower 310 from the second cooling chamber 220, and then flows into the first cooling chamber 210 after heat dissipation. On the other side of the liquid cooling head 100, a reflux pipe 320 can be used to connect the first coolant outlet 134 and the second coolant inlet 136, so that the coolant enters the liquid cooling head 100 again. However, the present invention is not limited to this, and an internal reflux pipe can also be used between the first coolant outlet 134 and the second coolant inlet 136 to allow the coolant to reflux in the liquid cooling head 100.

[0112] See also Figure 4As shown in the figure, the liquid cooling heat sink 400 includes the aforementioned liquid cooling heat sink 300 and a second heat sink 410. The second heat sink 410 includes a second liquid inlet 412 and a second liquid outlet 414. The second liquid inlet 412 is connected to the first cooling liquid outlet 134 of the first cooling chamber 210, and the second liquid outlet 414 is connected to the second cooling liquid inlet 136 of the second cooling chamber 220, so that the cooling liquid enters the second cooling tower 410 from the first cooling chamber 210, and then flows into the second cooling chamber 220 after heat dissipation.

[0113] In some embodiments, the liquid cooling device 400 further includes a fan 330, which is disposed between the first cooling tower 310 and the second cooling tower 410, or on one side of the first cooling tower 310 and / or the second cooling tower 410. In some embodiments, the fan 330 is an axial flow fan, such as an 80-inch axial flow fan, but the present invention is not limited thereto.

[0114] In some embodiments, the first heat dissipation tower 310 includes a lower water tank 316, an upper water tank 319, a plurality of flat water pipes 318, and a plurality of heat dissipation fins 317. The flat water pipes 318 are connected between the lower water tank 316 and the upper water tank 319, and are fluidly connected to the lower water tank 316 and the upper water tank 319, and the heat dissipation fins 317 surround the flat water pipes 318 and are also located between the lower water tank 316 and the upper water tank 319. The second heat dissipation tower 410 includes a lower water tank 416, an upper water tank 419, a plurality of flat water pipes 418, and a plurality of heat dissipation fins 417. The flat water pipes 418 are connected between the lower water tank 416 and the upper water tank 419, and are fluidly connected to the lower water tank 416 and the upper water tank 419, and the heat dissipation fins 417 surround the flat water pipes 418 and are also located between the lower water tank 416 and the upper water tank 419.

[0115] In some embodiments, the first heat dissipation tower 310 and the second heat dissipation tower 410 of the liquid-cooled heat dissipation device 400 further include an upper water tank cover and a lower water tank cover. The first heat dissipation tower 310 will be taken as an example for description below, and the second heat dissipation tower 410 will not be described in detail.

[0116] See also Figure 3 , Figure 5A and Figure 5BThe first heat sink 310 of the liquid cooling heat sink 300 further includes an upper water tank cover 341 and a lower water tank cover 351. The upper water tank cover 341 is disposed between the upper water tank 319 and the heat dissipation fins 317, while the lower water tank cover 351 is disposed between the lower water tank 316 and the heat dissipation fins 317. The upper water tank cover 341 has a plurality of elastic fastening members 342, such as elastic claws, and the upper water tank 319 has a fixing flange 349, and the elastic fastening members 342 are bent and pressed on the fixing flange 349 of the upper water tank 319, so that the upper water tank 319 can be quickly pressed and stably fixed on the upper water tank cover 341 and the heat dissipation fins 317, and the flat water pipe 318 is fluidly connected. In addition, the lower water tank cover 351 includes a plurality of elastic fasteners 352, such as elastic claws, and the lower water tank 316 includes a fixed flange 359, and the elastic fasteners 352 are bent and pressed onto the fixed flange 359 of the lower water tank 316, so that the lower water tank 316 can be quickly pressed and stably fixed under the lower water tank cover 351 and the heat dissipation fins 317, and fluidly connected to the flat water pipe 318.

[0117] In some embodiments, the first heat dissipation tower 310 and the second heat dissipation tower 410 have the same size, share common parts, and are symmetrically connected to two sides of the liquid cooling head 100 .

[0118] In view of this, the liquid cooling head and liquid cooling heat sink can use a single cooling tower or multiple cooling towers according to actual needs to dissipate heat, and adjust the required heat dissipation efficiency and performance according to the heat generated by the heat source. The parts of the liquid cooling head and the liquid cooling heat sink are symmetrical and shared, which can also reduce production costs and improve product quality. The setting of the upper and lower water tanks can increase the storage of the required coolant, effectively improving the heat dissipation efficiency and heat dissipation performance.

[0119] The above are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made according to the claims and the invention description of the present invention are still within the scope of the present invention. In addition, any embodiment or claim of the present invention is not required to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract and title are only used to assist in searching patent documents, and are not used to limit the claims of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0120] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be based on what is defined in the claims.

Claims

1. A liquid cooling head, characterized in that: Include: a bottom plate having an opening; A heat sink fixed to the bottom plate; a partition plate fixed on the bottom plate and dividing the opening into a plurality of cooling chambers; as well as An upper cover plate is fixed on the base plate, wherein each of the cooling chambers is provided with a cooling liquid inlet, a cooling liquid outlet, a pump and an electronic control device, the cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is arranged between the partition plate and the upper cover plate and connected to the cooling liquid outlet, and the electronic control device drives the pump to rotate so that a cooling liquid flows through the cooling chamber to cool at least one heat source below the heat sink, wherein the partition plate comprises a horizontal baffle and a vertical baffle, the vertical baffle is connected to the horizontal baffle, the vertical baffle separates the opening into the cooling chambers, and is arranged on both sides of the vertical baffle, each of the cooling chambers is provided with a liquid inlet hole and a liquid outlet hole on the partition plate, and the pump is located above the liquid outlet hole, and a plurality of guide vanes are arranged below the liquid inlet hole to guide the cooling liquid, and the guide vane and the vertical baffle form an angle to guide the cooling liquid to flow in the direction of the vertical baffle.

2. The liquid cooling head according to claim 1, characterized in that: The utility model also comprises an outer cover plate for fixing the electric control device around the pump, thereby driving the pump to rotate.

3. The liquid cooling head according to claim 1, characterized in that: The angle is between 30 degrees and 60 degrees.

4. The liquid cooling head according to claim 3, characterized in that: The closer the guide vanes are to the vertical baffle, the larger the spacing between them is, and the farther the guide vanes are from the vertical baffle, the smaller the spacing between them is.

5. The liquid cooling head according to claim 4, characterized in that: The closer the guide vane is to the vertical baffle, the longer the guide vane is, and the farther the guide vane is from the vertical baffle, the shorter the guide vane is.

6. The liquid cooling head according to claim 1, characterized in that: Each of the cooling chambers is provided with a scraped fin.

7. A liquid cooling heat dissipation device, characterized in that: Include: The liquid cooling head according to any one of claims 1 to 6, wherein the cooling chamber comprises a first cooling chamber and a second cooling chamber; and A first heat dissipation tower, wherein the first heat dissipation tower comprises a first liquid inlet and a first liquid outlet, the first liquid inlet is connected to the coolant outlet of the second cooling chamber, and the first liquid outlet is connected to the coolant inlet of the first cooling chamber, so that the coolant enters the first heat dissipation tower from the second cooling chamber, and then flows into the first cooling chamber after heat dissipation.

8. The liquid cooling heat dissipation device according to claim 7, characterized in that: Also includes: A second heat dissipation tower, wherein the second heat dissipation tower comprises a second liquid inlet and a second liquid outlet, the second liquid inlet is connected to the coolant outlet of the first cooling chamber, and the second liquid outlet is connected to the coolant inlet of the second cooling chamber, so that the coolant enters the second heat dissipation tower from the first cooling chamber, and then flows into the second cooling chamber after heat dissipation.

9. The liquid cooling heat dissipation device according to claim 8, further comprising: A fan is arranged between the first heat dissipation tower and the second heat dissipation tower.

10. The liquid cooling heat dissipation device according to claim 9, characterized in that: The first heat dissipation tower and the second heat dissipation tower respectively include: Lower the water tank; One on the water tank; A plurality of flat water pipes connected between the lower water tank and the upper water tank; and A plurality of heat dissipation fins surround the flat water pipe and are located between the lower water tank and the upper water tank.

11. The liquid cooling heat dissipation device according to claim 10, characterized in that: Also includes: an upper water tank cover plate, disposed between the upper water tank and the heat dissipation fins; and A lower water tank cover is arranged between the lower water tank and the heat dissipation fins, wherein the upper water tank cover and the lower water tank cover respectively include a plurality of elastic fastening parts, and the upper water tank and the lower water tank respectively include a fixed flange, and the elastic fastening parts are respectively bent and pressed on the corresponding fixed flanges.

12. The liquid cooling heat dissipation device according to claim 9, characterized in that: The first heat dissipation tower and the second heat dissipation tower have the same size and are symmetrically connected to two sides of the liquid cooling head.

13. The liquid cooling heat dissipation device according to claim 7, characterized in that: Also includes: A reflux pipe is connected between the coolant outlet of the first cooling chamber and the coolant inlet of the second cooling chamber.

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