Display panel and its manufacturing method, display device

Abstract

The embodiment of the present invention discloses a display panel and a manufacturing method thereof, and a display device; the display panel includes a substrate, a first circuit layer located on a first side of the substrate, a second circuit layer located on a second side of the substrate, and a conductive film located on a side of the display panel, the conductive film is electrically connected to the first circuit layer and the second circuit layer, the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the first circuit layer, and the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the second circuit layer. The present invention independently manufactures a flexible conductive film, and utilizes a bonding process to electrically connect the flexible conductive film to the first circuit layer and the second circuit layer, so as to realize circuit conduction on the front and back sides of the display panel. The flexible conductive film has a large elongation at break, is easy to bend and bond, and is easy to transfer and bond, which reduces the process difficulty, realizes a narrow frame, improves the yield rate of the side conductive circuit, and improves the quality of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In recent years, the development trend of display panels is towards borderless display, especially borderless display panels used in spliced ​​displays, which have better display effects and are favored by users. In order to reduce the borders, the current mainstream method is to introduce a double-sided process and use the side printing technology of conductive silver glue to achieve the conduction of the front and back wiring of the display panel. However, the pad printing or transfer process of the conductive silver glue is difficult, resulting in low precision of the conductive silver glue after side printing, or additional laser etching process is required on the side, resulting in low yield of the side conductive lines, which reduces the quality of the display panel.

[0003] Therefore, there is an urgent need for a display panel and a manufacturing method thereof, and a display device to solve the above technical problems. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, and a display device, which can alleviate the current technical problem of low yield of side conductive lines.

[0005] The present invention provides a display panel, comprising:

[0006] substrate;

[0007] A first circuit layer, located on a first side of the substrate;

[0008] A second circuit layer is located on the second side of the substrate; and

[0009] A conductive film, located on a side of the display panel, the conductive film being electrically connected to the first circuit layer and the second circuit layer;

[0010] The elongation at break of the conductive film is greater than the elongation at break of the metal wire in the first circuit layer, and the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the second circuit layer.

[0011] Preferably, the conductive film includes a plurality of conductive units arranged at intervals, and the conductive units include a plurality of openings.

[0012] Preferably, the conductive film is a conductive metal.

[0013] Preferably, the first circuit layer includes multiple first wires and multiple first terminals corresponding to the multiple first wires, and the second circuit layer includes multiple second wires and multiple second terminals corresponding to the multiple second wires; wherein one of the conductive units is electrically connected to one of the first terminals and one of the second terminals.

[0014] Preferably, the display panel further includes: a first conductive adhesive located between the conductive unit and the first terminal; a second conductive adhesive located between the conductive unit and the second terminal; and an adhesive layer located between the display panel and the conductive film; wherein the adhesive layer is a non-conductive medium.

[0015] Preferably, the distance between two adjacent conductive units is 6 μm to 30 μm, the width of the conductive unit is 6 μm to 30 μm, and the ratio of the diameter of the opening to the width of the conductive unit is 1:2 to 1:3.

[0016] Preferably, the display panel further comprises an organic protective layer located on a side of the conductive film away from the substrate.

[0017] The present invention also provides a method for manufacturing a display panel, comprising:

[0018] providing a substrate;

[0019] forming a sacrificial layer on the substrate;

[0020] forming a conductive metal layer on the sacrificial layer;

[0021] Using a laser lift-off process, the sacrificial layer is separated from the conductive metal layer to form a conductive film;

[0022] The conductive film is bonded to the side of the target display panel by using a bonding process, so that the conductive film is electrically connected to the target circuit layer.

[0023] Preferably, the step of forming a conductive metal layer on the sacrificial layer comprises: forming a conductive metal film layer on the sacrificial layer; and forming a plurality of openings on the conductive metal film layer by an etching process to form the conductive metal layer.

[0024] The present invention further provides a display device, comprising at least two spliced ​​screens, wherein the spliced ​​screens comprise any of the above-mentioned display panels.

[0025] Beneficial effects of the present invention: The present invention independently manufactures a flexible conductive film, and utilizes a bonding process to electrically connect the flexible conductive film to the first circuit layer and the second circuit layer, thereby achieving circuit conduction between the front and back sides of the display panel. The flexible conductive film has a large elongation at break, is easy to bend and bond, and is easy to transfer and bond, thereby reducing the difficulty of the process, achieving a narrow frame, improving the yield of the side conductive circuits, and improving the quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 is a structural schematic diagram of a first structure of a display panel provided by an embodiment of the present invention;

[0028] Figure 2 yes Figure 1 A structural diagram of a perspective A;

[0029] Figure 3 is a structural schematic diagram of a second structure of a display panel provided by an embodiment of the present invention;

[0030] Figure 4 yes Figure 3 A structural diagram of a perspective A;

[0031] Figure 5 is a schematic structural diagram of a third structure of a display panel provided by an embodiment of the present invention;

[0032] Figure 6 is a schematic structural diagram of a fourth structure of a display panel provided by an embodiment of the present invention;

[0033] Figure 7 is a flowchart of the steps of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0034] Figures 8A to 8D is a first flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0035] Figures 9A to 9B is a second flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0036] Fig.10 is a third flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0037] Fig.11 It is a schematic diagram of the structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0039] In recent years, the development trend of display panels is towards borderless display, especially borderless display panels used in spliced ​​displays, which have better display effects and are favored by users. In order to reduce the borders, the current mainstream method is to introduce a double-sided process and use the side printing technology of conductive silver glue to achieve the conduction of the front and back wiring of the display panel. However, the pad printing or transfer process of the conductive silver glue is difficult, resulting in low precision of the conductive silver glue after side printing, or additional laser etching process is required on the side, resulting in low yield of the side conductive lines, which reduces the quality of the display panel.

[0040] See also Figures 1 to 6 , an embodiment of the present invention provides a display panel 100, comprising:

[0041] Substrate 200;

[0042] A first circuit layer 300 is located on a first side of the substrate 200;

[0043] A second circuit layer 400 is located on the second side of the substrate 200; and

[0044] A conductive film 500 , located on a side of the display panel 100 , wherein the conductive film 500 is electrically connected to the first circuit layer 300 and the second circuit layer 400 ;

[0045] The elongation at break of the conductive film 500 is greater than the elongation at break of the metal wire in the first circuit layer 300 , and the elongation at break of the conductive film 500 is greater than the elongation at break of the metal wire in the second circuit layer 400 .

[0046] The present invention independently manufactures a flexible conductive film and utilizes a bonding process to electrically connect the flexible conductive film with a first circuit layer and a second circuit layer, thereby realizing circuit conduction between the front and back sides of a display panel. The flexible conductive film has a large elongation at break and is easy to bend and bond, and is easy to transfer and bond, thereby reducing the difficulty of the process, achieving a narrow frame, improving the yield of the side conductive circuits, and improving the quality of the display panel.

[0047] The technical solution of the present invention is now described in conjunction with specific embodiments.

[0048] In this embodiment, please refer to Figure 1 The display panel 100 includes a first circuit layer 300, a second circuit layer 400, and a substrate 200 located between the first circuit layer 300 and the second circuit layer 400. The display panel 100 also includes a conductive film 500 located on the side of the display panel 100, and the conductive film 500 is electrically connected to the first circuit layer 300 and the second circuit layer 400; wherein the elongation at break of the conductive film 500 is greater than the elongation at break of the metal wire in the first circuit layer 300, and the elongation at break of the conductive film 500 is greater than the elongation at break of the metal wire in the second circuit layer 400. The flexible conductive film 500 is independently manufactured, and the manufactured conductive film 500 can be more convenient to have a flexible property. By using the bonding process, the circuit conduction of the front and back sides of the display panel 100 is realized. The flexible conductive film 500 has a large elongation at break, is easy to bend and bond, and is easy to transfer and bond, which reduces the process difficulty and realizes a narrow frame.

[0049] In some embodiments, if the conductive film 500 is only wires, the flexibility and bendability need to be further improved.

[0050] See also Figure 2 The conductive film 500 includes a plurality of conductive units 510 arranged at intervals, and the conductive units 510 include a plurality of openings 520 .

[0051] By using yellow light and wet etching process when manufacturing the conductive film 500, the conductive film 500 can be patterned to form a plurality of openings 520, thereby further improving the elongation at break of the conductive film 500 and reducing stress. The greater the elongation at break, the less likely it is to be broken, and the corresponding flexibility and fit are higher, thereby improving the flexibility of the conductive film 500, further improving the bending properties, further strengthening the fit, reducing the process difficulty, and achieving a narrow frame.

[0052] In some embodiments, the elongation at break of the conductive film 500 is greater than 10%, the elongation at break of the metal wires in the first circuit layer 300 is less than 5%, and the elongation at break of the metal wires in the second circuit layer 400 is less than 5%.

[0053] In some embodiments, the conductive unit 510 includes a first bending area and a first straight area, and the number density of the openings 520 in the first bending area is greater than the number density of the openings 520 in the first straight area. Increasing the number density of the openings 520 in the bending area and the first straight area improves the flexibility of the conductive film 500 in the bending area and the first straight area, and further improves the bending characteristics.

[0054] In some embodiments, the size of the opening 520 in the first bending region is larger than the size of the opening 520 in the first straight region. Increasing the size of the opening 520 in the bending region improves the flexibility of the conductive film 500 in the bending region and further improves the bending properties.

[0055] In some embodiments, the thickness of the conductive film 500 is 0.1 μm to 1 μm, which is much thinner than the thickness of general silver paste materials, which is conducive to improving bending, further strengthening the fitting, reducing the difficulty of the process, and achieving a narrow frame.

[0056] In some embodiments, if the material of the conductive film 500 is a traditional silver paste material, it still faces the technical problem of inconvenient transfer.

[0057] The conductive film 500 is a conductive metal, such as a low-resistance metal such as Cu, Ag, etc., which can be a pure metal or an alloy. The metal is easy to pattern and thin metal has good flexibility, so as to further improve the elongation at break of the conductive film 500, improve the flexibility of the conductive film 500, further improve the bending property, further strengthen the bonding, reduce the process difficulty, and achieve a narrow frame.

[0058] In some embodiments, when the metal wires on the front and back of the display panel 100 are connected to the conductive film 500, precise alignment is required. If only the wires are connected, the process required is more difficult, which is not conducive to improving production efficiency.

[0059] See also Figure 3 , Figure 4 The first circuit layer 300 includes a plurality of first conductive wires 310 and a plurality of first terminals 320 corresponding to the plurality of first conductive wires 310; the second circuit layer 400 includes a plurality of second conductive wires 410 and a plurality of second terminals 420 corresponding to the plurality of second conductive wires 410; wherein a conductive unit 510 is electrically connected to a first terminal 320 and a second terminal 420.

[0060] The first terminal 320 and the second terminal 420 are arranged on the front and back of the display panel 100, and the conductive unit 510 is electrically connected to the first wire 310 through the first terminal 320, and the conductive unit 510 is electrically connected to the second wire 410 through the second terminal 420, so as to realize the electrical connection between the first wire 310 and the second wire 410, and finally realize the circuit conduction between the front and back of the display panel 100, which is easy to bend and fit, reduces the process difficulty, improves the production efficiency, and realizes a narrow frame.

[0061] In some embodiments, see Figure 3 , Figure 4 The first terminal 320 and the conductive unit 510, as well as the second terminal 420 and the conductive unit 510, can be electrically connected by melting the metal by heating without using other materials. The materials of the first terminal 320, the second terminal 420 and the conductive unit 510 can be the same material, which is beneficial to connection stability and circuit uniformity.

[0062] In some embodiments, the first terminal 320 and the conductive unit 510, as well as the second terminal 420 and the conductive unit 510, are electrically connected by molten metal, which may require a relatively high temperature and a corresponding cooling system, which requires additional expenses.

[0063] See also Figure 5 The display panel 100 further includes a first conductive adhesive 610 located between the conductive unit 510 and the first terminal 320 , and a second conductive adhesive 620 located between the conductive unit 510 and the second terminal 420 .

[0064] The connection to the corresponding points is performed by using conductive adhesive, and the material of the first conductive adhesive 610 and the second conductive adhesive 620 can be ACF (Anisotropic Conductive Film), which facilitates the bonding and conduction between the terminals and improves production efficiency.

[0065] In some embodiments, the first terminal 320 may be located between the first wire 310 and the conductive unit 510, and the second terminal 420 may be located between the second wire 410 and the conductive unit 510; the first terminal 320 may be located between the substrate 200 and the conductive unit 510, and the second terminal 420 may be located between the second wire 410 and the conductive unit 510. For example, the second terminal 420 may be located between the substrate 200 and the conductive unit 510. The first conductive adhesive 610 and the second conductive adhesive 620 are also located between the corresponding terminals and the conductive unit 510. It can be determined according to different specific actual processes. Here, taking the first terminal 320 being located between the first wire 310 and the conductive unit 510 as an example, please refer to Figures 2 to 5 .

[0066] In some embodiments, see Figure 5 A non-conductive adhesive layer 630 may be provided on the side of the display panel 100 corresponding to the conductive film 500. The adhesive layer 630 is located between the display panel 100 and the conductive film 500. The adhesive layer 630 is a non-conductive medium, which provides better insulation properties, reduces the risk of short circuit with other circuits, and further strengthens the adhesion between the conductive film 500 and the display panel 100.

[0067] In some embodiments, the distance between two adjacent conductive units 510 is 6 μm to 30 μm, the width of the conductive unit 510 is 6 μm to 30 μm, and the ratio of the diameter of the opening 520 to the width of the conductive unit 510 is 1:2 to 1:3.

[0068] By setting the size of the opening 520 , the line width and the line spacing, the bending flexibility of the conductive film 500 is improved, and the conductive film 500 is easy to bend and fit, which reduces the process difficulty, improves the production efficiency, and realizes a narrow frame.

[0069] In some embodiments, the side surface of the display panel 100 is easily squeezed or collided, which may cause damage to the conductive film 500 .

[0070] See also Figure 6 The display panel 100 further includes an organic protective layer 700 located on a side of the conductive film 500 away from the substrate 200 .

[0071] The conductive film 500 is protected by utilizing the elasticity and film protection function of the organic protective layer 700 .

[0072] In some embodiments, the organic protective layer 700 is an insulating material, such as epoxy resin or polyimide, and can be black and opaque or colorless and transparent, and can be used according to actual needs. The thickness of the organic protective layer 700 is 3 μm to 20 μm.

[0073] In some embodiments, the organic protective layer 700 can be cured by thermal curing to enhance protection.

[0074] In some embodiments, the organic protective layer 700 may further include an ultraviolet curable material, and the organic protective layer 700 may be cured by ultraviolet light to enhance protection.

[0075] In some embodiments, see Figure 1 The display panel 100 further includes a light emitting device layer 910 located on a side of the first circuit layer 300 away from the substrate 200 .

[0076] The light emitting device layer 910 may include a plurality of light emitting units and a packaging layer, wherein the light emitting units are Mico LEDs or MIni LEDs.

[0077] In some embodiments, the display panel 100 includes a plurality of thin film transistors, and the thin film transistors preferably have a Top gate structure. Preferably, the active layer of the thin film transistors is a high-mobility metal oxide semiconductor such as IGZO, IGTO, or IGZTO.

[0078] In some embodiments, see Figure 1 The display panel 100 further includes a cover plate 920 located on the light emitting device layer 910 .

[0079] The present invention independently manufactures a flexible conductive film and utilizes a bonding process to electrically connect the flexible conductive film with a first circuit layer and a second circuit layer, thereby realizing circuit conduction between the front and back sides of a display panel. The flexible conductive film has a large elongation at break and is easy to bend and bond, and is easy to transfer and bond, thereby reducing the difficulty of the process, achieving a narrow frame, improving the yield of the side conductive circuits, and improving the quality of the display panel.

[0080] See also Figure 7 The embodiment of the present invention further provides a method for manufacturing a display panel 100, comprising:

[0081] S100, providing a substrate 101;

[0082] S200, forming a sacrificial layer 800 on the substrate 101;

[0083] S300, forming a conductive metal layer 501 on the sacrificial layer 800;

[0084] S400, using a laser lift-off process to separate the sacrificial layer 800 from the conductive metal layer 501 to form a conductive film 500;

[0085] S500 , using a lamination process, laminating the conductive film 500 to the side surface of the target display panel 100 , wherein the conductive film 500 is electrically connected to the target circuit layer.

[0086] The present invention independently manufactures a flexible conductive film and utilizes a bonding process to electrically connect the flexible conductive film with a first circuit layer and a second circuit layer, thereby realizing circuit conduction between the front and back sides of a display panel. The flexible conductive film has a large elongation at break and is easy to bend and bond, and is easy to transfer and bond, thereby reducing the difficulty of the process, achieving a narrow frame, improving the yield of the side conductive circuits, and improving the quality of the display panel.

[0087] The technical solution of the present invention is now described in conjunction with specific embodiments.

[0088] S100, provide a substrate 101, see Fig. 8A .

[0089] In some embodiments, the substrate 101 may be a glass substrate 101 , which will be peeled off in subsequent steps.

[0090] S200, forming a sacrificial layer 800 on the substrate 101, see Figure 8B .

[0091] In some embodiments, the sacrificial layer 800 is used to form a fracture when peeling off the substrate 101, which is beneficial to peeling off.

[0092] In some embodiments, the sacrificial layer 800 can be prepared by a chemical deposition film forming process.

[0093] In some embodiments, the sacrificial layer 800 may be amorphous silicon. The sacrificial layer 800 may have a thickness of 10 nm to 30 nm.

[0094] S300, forming a conductive metal layer 501 on the sacrificial layer 800, see Figure 8C .

[0095] In some embodiments, step S300 includes:

[0096] S310, forming a conductive metal film layer 502 on the sacrificial layer 800, see Fig.9A .

[0097] S320, using an etching process, forming a plurality of openings 520 on the conductive metal film layer 502 to form the conductive metal layer 501, see Fig. 9B .

[0098] In some embodiments, step S320 includes:

[0099] S321 , using an etching process to form the conductive metal film layer 502 into a plurality of spaced conductive units 510 , and forming a plurality of openings 520 on the conductive units 510 to form the conductive metal layer 501 .

[0100] In some embodiments, if the conductive film 500 is only wires, the flexibility and bendability need to be further improved.

[0101] The conductive film 500 includes a plurality of conductive units 510 disposed at intervals, and the conductive units 510 include a plurality of openings 520 .

[0102] By using yellow light and wet etching process when manufacturing the conductive film 500, the conductive film 500 can be patterned to form a plurality of openings 520, thereby further improving the elongation at break of the conductive film 500, reducing stress, improving the flexibility of the conductive film 500, further improving the bending properties, further strengthening the fitting, reducing the process difficulty, and achieving a narrow frame.

[0103] In some embodiments, step S300 further includes:

[0104] S330, forming an organic protective layer 700 on the conductive metal layer 501, see Fig.10 .

[0105] In some embodiments, the side surface of the display panel 100 is easily squeezed or collided, which may cause damage to the conductive film 500 .

[0106] The display panel 100 further includes an organic protection layer 700 located on a side of the conductive film 500 away from the substrate 200 .

[0107] The conductive film 500 is protected by utilizing the elasticity and film protection function of the organic protective layer 700 .

[0108] In some embodiments, the organic protective layer 700 is an insulating material, such as epoxy resin or polyimide, and can be black and opaque or colorless and transparent, and can be used according to actual needs. The thickness of the organic protective layer 700 is 3 μm to 20 μm.

[0109] S400, using a laser lift-off process, the sacrificial layer 800 is separated from the conductive metal layer 501 to form a conductive film 500, see Fig.8D .

[0110] In some embodiments, Fig.8DIn the figure, the dotted arrow represents the laser. The substrate 101 is subjected to a laser lift-off process, so that light is irradiated from the back of the glass to separate the conductive film 500 from the glass substrate 101. Preferably, the wavelength of the laser is 308 nm, and the energy density of the laser is less than 200 mJ / cm 2 .

[0111] S500, using a laminating process, laminating the conductive film 500 to the side of the target display panel 100, wherein the conductive film 500 is electrically connected to the target circuit layer, see Figure 1 .

[0112] In some embodiments, the specific structure of the target display panel 100 can be found in any of the above-mentioned embodiments of the display panel 100 and Figures 1 to 6 The display panel 100 includes a substrate 200, a first circuit layer 300 located on a first side of the substrate 200, and a second circuit layer 400 located on a second side of the substrate 200, and the target circuit layers are the first circuit layer 300 and the second circuit layer 400.

[0113] In some embodiments, the display panel 100 further includes a light emitting device layer 910 located on a side of the first circuit layer 300 away from the substrate 200 .

[0114] The light emitting device layer 910 may include a plurality of light emitting units and a packaging layer, wherein the light emitting units are Mico LEDs or MIni LEDs.

[0115] In some embodiments, the display panel 100 includes a plurality of thin film transistors, and the thin film transistors preferably have a Top gate structure. Preferably, the active layer of the thin film transistors is a high-mobility metal oxide semiconductor such as IGZO, IGTO, or IGZTO.

[0116] In some embodiments, the display panel 100 further includes a cover plate 920 located on the light emitting device layer 910 .

[0117] The flexible conductive film 500 is independently manufactured, and the manufactured conductive film 500 can be more conveniently flexible. By utilizing the bonding process, the circuit conduction between the front and back of the display panel 100 is achieved. The flexible conductive film 500 has a large elongation at break, is easy to bend and bond, and is easy to transfer and bond, which reduces the process difficulty and achieves a narrow frame.

[0118] The present invention independently manufactures a flexible conductive film and utilizes a bonding process to electrically connect the flexible conductive film with a first circuit layer and a second circuit layer, thereby realizing circuit conduction between the front and back sides of a display panel. The flexible conductive film has a large elongation at break and is easy to bend and bond, and is easy to transfer and bond, thereby reducing the difficulty of the process, achieving a narrow frame, improving the yield of the side conductive circuits, and improving the quality of the display panel.

[0119] See also Fig.11 The embodiment of the present invention further provides a display device 10, comprising at least two spliced ​​screens 20, wherein the spliced ​​screens 20 include any of the above-mentioned display panels 100.

[0120] For the specific structure of the display panel 100, please refer to any of the above-mentioned embodiments of the display panel 100 and Figures 1 to 6 , I will not go into details here.

[0121] In this embodiment, the spliced ​​screen 20 may further include a middle frame, frame glue, etc., which are not limited here.

[0122] The embodiment of the present invention discloses a display panel and a manufacturing method thereof, and a display device; the display panel includes a substrate, a first circuit layer located on a first side of the substrate, a second circuit layer located on a second side of the substrate, and a conductive film located on a side of the display panel, the conductive film is electrically connected to the first circuit layer and the second circuit layer, the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the first circuit layer, and the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the second circuit layer. The present invention independently manufactures a flexible conductive film, and utilizes a bonding process to electrically connect the flexible conductive film to the first circuit layer and the second circuit layer, so as to realize circuit conduction on the front and back sides of the display panel. The flexible conductive film has a large elongation at break, is easy to bend and bond, and is easy to transfer and bond, which reduces the process difficulty, realizes a narrow frame, improves the yield rate of the side conductive circuit, and improves the quality of the display panel.

[0123] The above is a detailed introduction to a display panel and a manufacturing method thereof, and a display device provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A display panel, characterized in that: include: substrate; A first circuit layer, located on a first side of the substrate; A second circuit layer, located on a second side of the substrate; and A conductive film, located on a side of the display panel, the conductive film being electrically connected to the first circuit layer and the second circuit layer; The elongation at break of the conductive film is greater than the elongation at break of the metal wire in the first circuit layer, and the elongation at break of the conductive film is greater than the elongation at break of the metal wire in the second circuit layer; The conductive film includes a plurality of conductive units arranged at intervals, and the conductive units include a plurality of openings formed in a pattern; The conductive unit includes a first bending area and a first straight area. The number density of the openings in the first bending area is greater than the number density of the openings in the first straight area. The size of the openings in the first bending area is greater than the size of the openings in the first straight area.

2. The display panel according to claim 1, characterized in that: The conductive film is a conductive metal.

3. The display panel according to claim 1, characterized in that: The first circuit layer includes a plurality of first conductive lines and a plurality of first terminals corresponding to the plurality of first conductive lines, and the second circuit layer includes a plurality of second conductive lines and a plurality of second terminals corresponding to the plurality of second conductive lines; Wherein, a conductive unit is electrically connected to a first terminal and a second terminal.

4. The display panel according to claim 3, characterized in that: The display panel further includes: A first conductive adhesive is located between the conductive unit and the first terminal; A second conductive adhesive is located between the conductive unit and the second terminal; An adhesive layer, located between the display panel and the conductive film; Wherein, the bonding layer is a non-conductive medium.

5. The display panel according to claim 1, characterized in that: The distance between two adjacent conductive units is 6 μm to 30 μm, the width of the conductive unit is 6 μm to 30 μm, and the ratio of the diameter of the opening to the width of the conductive unit is 1:2 to 1:

3.

6. The display panel according to claim 1, characterized in that: The display panel further includes an organic protection layer located on a side of the conductive film away from the substrate.

7. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming a sacrificial layer on the substrate; forming a conductive metal layer on the sacrificial layer; Using a laser lift-off process, the sacrificial layer is separated from the conductive metal layer to form a conductive film; Using a laminating process, laminating the conductive film to a side surface of a target display panel so that the conductive film is electrically connected to a target circuit layer; The step of forming a conductive metal layer on the sacrificial layer comprises: forming a conductive metal film layer on the sacrificial layer; Using an etching process, a plurality of openings are formed on the conductive metal film layer to form the conductive metal layer, wherein the conductive film includes a plurality of conductive units arranged at intervals, and the conductive units include a first bending area and a first straight area, the number density of the openings in the first bending area is greater than the number density of the openings in the first straight area, and the size of the openings in the first bending area is greater than the size of the openings in the first straight area.

8. A display device, characterized in that: The invention comprises at least two spliced ​​screens, wherein the spliced ​​screens comprise the display panel according to any one of claims 1 to 6.

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