Closed housing for heat dissipation of electronic products

Abstract

The present invention discloses a closed shell for heat dissipation of electronic products, comprising: a closed shell, in which the hardware of the electronic product is placed and a circulation space is reserved; a primary heat dissipation component, which comprises a first heat dissipation narrow box body with an open bottom composed of a heat dissipation plate and a first heat conduction narrow box body composed of a heat conduction plate that is connected from top to bottom; the first heat dissipation narrow box body is arranged on the top of the closed shell body and its bottom is connected to the long groove; the first heat conduction narrow box body passes through the long groove from the inside of the closed shell body and extends to the inside of the first heat dissipation narrow box body; a secondary heat dissipation component, which is a fan arranged on the left and right walls of the closed shell body, and the fans are all facing the hardware of the electronic product. The present invention can greatly improve the heat dissipation performance of the hardware of the electronic product in the closed shell body without affecting the protective characteristics of the closed shell body.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic products, and more specifically, to a closed housing for heat dissipation of electronic products. Background Art

[0002] General electronic products such as power electronic devices, large-scale integrated circuits, high-power transistors, etc., will generate different degrees of heat energy when working. This heat energy will increase the temperature of the product, which will bring the following hazards to the electronic products: when the temperature changes, the materials of the electronic products will expand or contract, causing problems with the fit, sealing and internal stress changes between parts; the components of electronic products have a certain operating temperature range. If the temperature limit is exceeded, it will cause the working state of the electronic products to change, shorten the service life, or even damage. Therefore, electronic products need to be equipped with reasonable heat dissipation design to reduce the operating temperature of the product and control the temperature of all components inside the electronic product so that it can work normally at the working environment temperature and not exceed the specified maximum allowable temperature, avoiding failures caused by high temperature or reduced product reliability.

[0003] However, electronic products require certain protection when working, even closed protection. The hardware circuits of electronic products in a closed shell cannot form effective internal and external air circulation, and can only radiate the heat generated by the heating parts to the shell, or conduct heat to the shell through mutual contact to solve the temperature rise contradiction; for electronic product hardware whose heating parts cannot contact the shell and generate a lot of heat during operation, it is difficult for the heat to be quickly transferred to the outside of the shell, and the accumulated temperature in the closed shell rises, which will seriously affect the stability and service life of the electronic components. Summary of the invention

[0004] An object of the present invention is to solve at least the above problems and to provide at least the advantages which will be described hereinafter.

[0005] Another object of the present invention is to provide a closed shell for dissipating heat of electronic products, which can greatly improve the heat dissipation performance of the electronic product hardware in the closed shell without affecting the protective characteristics of the closed shell.

[0006] In order to achieve these purposes and other advantages according to the present invention, a closed housing for heat dissipation of electronic products is provided, comprising:

[0007] A closed shell, in which the hardware of the electronic product is placed and a circulation space is reserved, and the top of the closed shell is provided with several long grooves running through;

[0008] A primary heat dissipation assembly, comprising a first heat dissipation narrow box body with an open bottom composed of heat dissipation plates and a first heat conductive narrow box body with a through-hole composed of heat conductive plates; the first heat dissipation narrow box body is arranged on the top of the closed shell body and its bottom is connected to the long groove, and air holes are arranged on the side wall of the first heat dissipation narrow box body; the first heat conductive narrow box body passes through the long groove from the inside of the closed shell body and extends to the inside of the first heat dissipation narrow box body; the middle and lower parts of adjacent first heat conductive narrow boxes are connected by connecting plates of the same height; the middle and lower parts of the first heat conductive narrow boxes at both ends are also connected to the left and right side walls of the closed shell body by connecting plates of the same height;

[0009] The secondary heat dissipation component is a fan arranged on the left side wall and the right side wall of the closed shell, and the fans are all facing the hardware of the electronic product.

[0010] Preferably, a thermally conductive silicone sheet is filled in the gap between the first heat dissipating narrow box body and the first heat conducting narrow box body.

[0011] Preferably, a detachable cover is further provided on the upper portion of the first heat dissipation narrow box.

[0012] Preferably, the closed shell includes an upper shell and a lower shell connected by fasteners; the first-level heat dissipation assembly is arranged on the upper shell, and the second-level heat dissipation assembly is arranged in the lower shell.

[0013] Preferably, the front side wall and the rear side wall of the closed shell are provided with openings, and the openings are provided with stress heat dissipation components cooperating therewith; the stress heat dissipation component comprises: a straightened first nickel-titanium shape memory alloy block, a straightened second nickel-titanium shape memory alloy block and a heat conductive combination plate; the heat conductive combination plate connects the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block, and the heat conductive combination plate comprises a plurality of second heat dissipation narrow boxes with bottom grooves composed of heat dissipation plates and a plurality of second heat conductive narrow boxes with top and bottom penetrations composed of heat conductive plates; the bottoms of the plurality of second heat dissipation narrow boxes are connected into one body through the heat dissipation plates; the second heat conductive narrow box is clamped at the groove, extending outward from the inside of the closed shell to the inside of the second heat dissipation narrow box.

[0014] Preferably, U-shaped rubber plugs are provided on the top of the first nickel-titanium shape memory alloy block and on the bottom of the second nickel-titanium shape memory alloy block, and metal gaskets are provided at the contact portions between the U-shaped rubber plugs and the closed shell.

[0015] Preferably, a thermally conductive silicone sheet is filled in the gap between the second heat dissipating narrow box body and the second heat conducting narrow box body.

[0016] The present invention has at least the following beneficial effects:

[0017] First, the closed housing for heat dissipation of electronic products provided by the present invention can greatly improve the heat dissipation performance of the electronic product hardware in the closed housing without affecting the protective characteristics of the closed housing;

[0018] Second, the closed housing for heat dissipation of electronic products provided by the present invention is provided with a two-stage heat dissipation assembly. A small part of the heat generated by the electronic product hardware in the working state is radiated to the inner wall of the closed housing, and a large part is radiated to the first heat-conducting narrow box of the first-stage heat dissipation assembly. The heat radiated to the first heat-conducting narrow box is discharged through the first heat dissipation narrow box; the second-stage heat dissipation assembly can not only dissipate heat independently, but also enhance the heat dissipation performance of the first-stage heat dissipation assembly. The fans on the left and right sides form a rotating upward airflow above the hardware of the electronic product, so that most of the heat generated by the electronic product hardware in the working state is radiated to the heat-conducting narrow box, thereby accelerating the discharge of heat;

[0019] Third, the closed shell for heat dissipation of electronic products provided by the present invention is also provided with a stress heat dissipation component. When the temperature in the closed shell reaches a certain value, the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block of the stress heat dissipation component are deformed, and an air outlet is temporarily opened on the front and rear side walls of the closed shell to quickly discharge heat out of the closed shell until the temperature in the closed shell drops, and the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block return to their original shape, closing the openings on the front and rear side walls of the closed shell;

[0020] Fourthly, the first narrow heat-conducting boxes, the second narrow heat-conducting boxes, the first narrow heat-dissipating boxes and the second narrow heat-dissipating boxes of the closed shell for heat dissipation of electronic products provided by the present invention are all formed in a grid shape, which greatly increases the radiation area and improves the heat dissipation efficiency, thereby improving the stability of the electronic product and extending the service life of the electronic product.

[0021] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of a closed housing for heat dissipation of electronic products in one technical solution of the present invention;

[0023] Figure 2 It is a schematic structural diagram of the stress heat dissipation component described in one technical solution of the present invention. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below in conjunction with the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.

[0025] It should be understood that terms such as “having”, “including” and “comprising” used herein do not specify the existence or addition of one or more other elements or combinations thereof.

[0026] like Figure 1 , 2 As shown, the present invention provides a closed housing for heat dissipation of electronic products, comprising:

[0027] A closed housing 1, in which the hardware 2 of the electronic product is placed and a circulation space is reserved, and the top of the closed housing 1 is provided with several long grooves running through;

[0028] A primary heat dissipation component, comprising a first heat dissipation narrow box body 3 with an open bottom composed of heat dissipation plates and a first heat conductive narrow box body 4 composed of heat conductive plates that penetrates from top to bottom; the first heat dissipation narrow box body 3 is arranged on the top of the closed shell body 1 and its bottom is connected to the long groove, and air holes are arranged on the side wall 3 of the first heat dissipation narrow box body; the first heat conductive narrow box body 4 passes through the long groove from the inside of the closed shell body 1 and extends to the inside of the first heat dissipation narrow box body 3; the middle and lower parts of adjacent first heat conductive narrow boxes 4 are connected by connecting plates of the same height; the middle and lower parts of the first heat conductive narrow boxes 4 at both ends are also connected to the left and right side walls of the closed shell body 1 by connecting plates of the same height;

[0029] The secondary heat dissipation component is a fan 7 arranged on the left and right walls of the closed shell 1, and the fan 7 is facing the hardware of the electronic product.

[0030] In the above technical solution, a first-level heat dissipation component is arranged on the top of the closed shell 1, and the width of several first heat dissipation narrow boxes 3 in the first-level heat dissipation component is equal to the width of the long groove, and the side walls of the first heat dissipation narrow boxes 3 are provided with air holes, and the first heat dissipation narrow boxes 3 and the closed shell 1 form a relatively closed space, and the air holes are arranged on the side walls of the first heat dissipation narrow boxes 3 to prevent dust from entering the closed shell 1 from top to bottom due to gravity. Several heat dissipation narrow boxes 3 form a grid shape, which can increase the heat dissipation area, and a first heat conductive narrow box 4 is arranged in the first heat dissipation narrow box 3, and several of the first heat conductive narrow boxes also form a grid shape to increase the radiation surface, and the heat conductive narrow box The thermal conductivity of the body 4 is much higher than that of air, and the heat generated by the electronic product can be quickly absorbed and dissipated outside the closed shell through the first heat dissipation narrow box 3, thereby achieving the effect of efficient heat dissipation; the closed shell 1 is also provided with a fan 7 facing the hardware of the electronic product, and the motor of the fan 7 is arranged outside the closed shell 1 to prevent the motor of the fan 7 from generating heat when working and increasing the total heat in the closed shell 1. After the cold air generated by the fan 7 exchanges heat on the hardware surface of the electronic product, the hot air forms a rotating rising airflow above the hardware of the electronic product, and its heat is further absorbed by the first heat-conducting narrow box 4 and discharged from the closed shell 1 through the first heat dissipation narrow box 3.

[0031] In one of the technical solutions, a thermally conductive silicone sheet is filled in the gap between the first heat dissipating narrow box 3 and the first heat conductive narrow box 4 to reduce the thermal resistance generated between the first heat conductive narrow box 4 and the first heat dissipating narrow box 3, and heat can be transferred at the gap, effectively improving the heat transfer efficiency.

[0032] In one of the technical solutions, a detachable cover 5 is further provided on the upper portion of the first heat dissipation narrow box 3 to prevent dust from accumulating on the surface of the first heat dissipation narrow box 3 and affecting its heat dissipation effect. The cover 5 can be removed during use for better heat dissipation.

[0033] In one of the technical solutions, the closed shell 1 includes an upper shell and a lower shell connected by fasteners; the first-level heat dissipation assembly is arranged on the upper shell, and the second-level heat dissipation assembly is arranged in the lower shell, which is convenient for the installation of the first heat-conducting narrow box 4 and the maintenance and replacement of the fan 7.

[0034] In one of the technical solutions, openings are provided on the front side wall and the rear side wall of the closed shell 1, and stress heat dissipation components cooperating therewith are provided at the openings; the stress heat dissipation component includes: a straightened first nickel-titanium shape memory alloy block 9, a straightened second nickel-titanium shape memory alloy block 12 and a heat conduction and heat dissipation combination plate; the heat conduction and heat dissipation combination plate connects the first nickel-titanium shape memory alloy block 9 and the second nickel-titanium shape memory alloy block 12, and the heat conduction and heat dissipation combination plate includes a plurality of second heat dissipation narrow boxes 11 with grooves at the bottom composed of heat dissipation plates and a plurality of second heat conduction narrow boxes 10 with through-holes from top to bottom composed of heat conduction plates; the bottoms of the plurality of second heat dissipation narrow boxes 11 are connected into one body through heat dissipation plates; the second heat conduction narrow box 10 is clamped at the groove and extends outward from the inside of the closed shell 1 to the inside of the second heat dissipation narrow box 11.

[0035] In the above technical solution, the front and rear side walls of the closed shell 1 are further provided with a stress heat dissipation component. When the temperature inside the closed shell reaches a certain value, the first nickel-titanium shape memory alloy block 9 and the second nickel-titanium shape memory alloy block 12 of the stress heat dissipation component are deformed, and an air outlet is temporarily opened on the front and rear side walls of the closed shell 1 to quickly discharge heat out of the closed shell 1 until the temperature inside the closed shell 1 drops, and the first nickel-titanium shape memory alloy block 9 and the second nickel-titanium shape memory alloy block 12 return to their original shapes, closing the openings on the front and rear side walls of the closed shell 1, wherein the first The nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block are sintered in a temperature range higher than room temperature into a cylinder with a height less than the height required to fill the opening, and then straightened in cold water into a cylinder with the height required to fill the opening. When the temperature in the closed shell 1 reaches above 40°C, the first nickel-titanium shape memory alloy block 9 and the second nickel-titanium shape memory alloy block 12 will return to their original heights, and a temporary air outlet will be opened on the side wall of the closed shell 1. When the temperature drops, the openings on the front and rear side walls of the closed shell continue to be closed.

[0036] In one of the technical solutions, a U-shaped rubber plug 8 is provided on the top of the first nickel-titanium shape memory alloy block 9 and on the bottom of the second nickel-titanium shape memory alloy block 12, and a metal gasket is provided at the contact portion between the U-shaped rubber plug 8 and the closed shell 1. The first nickel-titanium shape memory alloy block 9 and the second nickel-titanium shape memory alloy block 12 are in soft contact with the side wall of the closed shell 1 to facilitate the opening and closing of the temporary air outlet.

[0037] In one of the technical solutions, a thermally conductive silicone sheet is filled in the gap between the second heat dissipating narrow box 11 and the second heat conductive narrow box 10, so that heat can be transferred at the gap, effectively improving the heat transfer efficiency of the heat conductive composite plate.

[0038] The number of devices and processing scales described here are used to simplify the description of the present invention. Applications, modifications and variations of the closed housing for heat dissipation of electronic products of the present invention are obvious to those skilled in the art.

[0039] As described above, according to the present invention, the present invention at least includes the following beneficial effects:

[0040] First, the closed housing for heat dissipation of electronic products provided by the present invention can greatly improve the heat dissipation performance of the electronic product hardware in the closed housing without affecting the protective characteristics of the closed housing;

[0041] Second, the closed housing for heat dissipation of electronic products provided by the present invention is provided with a two-stage heat dissipation assembly. A small part of the heat generated by the electronic product hardware in the working state is radiated to the inner wall of the closed housing, and a large part is radiated to the first heat-conducting narrow box of the first-stage heat dissipation assembly. The heat radiated to the first heat-conducting narrow box is discharged through the first heat dissipation narrow box; the second-stage heat dissipation assembly can not only dissipate heat independently, but also enhance the heat dissipation performance of the first-stage heat dissipation assembly. The fans on the left and right sides form a rotating upward airflow above the hardware of the electronic product, so that most of the heat generated by the electronic product hardware in the working state is radiated to the heat-conducting narrow box, thereby accelerating the discharge of heat;

[0042] Third, the closed shell for heat dissipation of electronic products provided by the present invention is also provided with a stress heat dissipation component. When the temperature in the closed shell reaches a certain value, the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block of the stress heat dissipation component are deformed, and an air outlet is temporarily opened on the front and rear side walls of the closed shell to quickly discharge heat out of the closed shell until the temperature in the closed shell drops, and the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block return to their original shape, closing the openings on the front and rear side walls of the closed shell;

[0043] Fourthly, the first narrow heat-conducting boxes, the second narrow heat-conducting boxes, the first narrow heat-dissipating boxes and the second narrow heat-dissipating boxes of the closed shell for heat dissipation of electronic products provided by the present invention are all formed in a grid shape, which greatly increases the radiation area and improves the heat dissipation efficiency, thereby improving the stability of the electronic product and extending the service life of the electronic product.

[0044] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes, and they can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A closed housing for heat dissipation of electronic products, characterized in that: include: A closed shell, in which the hardware of the electronic product is placed and a circulation space is reserved, and the top of the closed shell is provided with several long grooves running through; The first-level heat dissipation component comprises a first heat dissipation narrow box body with an open bottom composed of a heat dissipation plate and a first heat-conducting narrow box body that is connected from top to bottom and composed of a heat-conducting plate; the first heat dissipation narrow box body is arranged on the top of the closed shell body and its bottom is connected with the long groove, the width of the first heat dissipation narrow box body is equal to the width of the long groove, and the side wall of the first heat dissipation narrow box body is provided with air holes, and the first heat dissipation narrow box body and the closed shell body form a relatively closed space; the first heat-conducting narrow box body passes through the long groove from the inside of the closed shell body and extends to the inside of the first heat dissipation narrow box body; the middle and lower parts of adjacent first heat-conducting narrow boxes are connected by connecting plates of the same height; the middle and lower parts of the first heat-conducting narrow boxes at both ends are also connected to the left and right side walls of the closed shell body by connecting plates of the same height; a plurality of first heat dissipation narrow boxes are arranged in a grid shape along the length direction of the closed shell body, the number of the first heat-conducting narrow boxes is equal to the number of the first heat dissipation narrow boxes and a plurality of the first heat-conducting narrow boxes also form a grid shape; A secondary heat dissipation component, which is a fan disposed on the left and right walls of the closed housing, the fans are both facing the hardware of the electronic product, and the motor of the fan is disposed outside the closed housing; Wherein, the closed shell includes an upper shell and a lower shell connected by fasteners; the first-level heat dissipation component is arranged on the upper shell, and the second-level heat dissipation component is arranged in the lower shell.

2. The closed housing for heat dissipation of electronic products as claimed in claim 1, characterized in that: A thermally conductive silicone sheet is filled in the gap between the first heat dissipation narrow box body and the first heat conduction narrow box body.

3. The closed housing for heat dissipation of electronic products as claimed in claim 2, characterized in that: A detachable cover is also provided on the upper portion of the first heat dissipation narrow box.

4. The closed housing for heat dissipation of electronic products as claimed in claim 3, characterized in that: The front side wall and the rear side wall of the closed shell are provided with openings, and the openings are provided with stress heat dissipation components matched therewith; the stress heat dissipation component comprises: a straightened first nickel-titanium shape memory alloy block, a straightened second nickel-titanium shape memory alloy block and a heat conduction and heat dissipation combination plate; the heat conduction and heat dissipation combination plate connects the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block, and the heat conduction and heat dissipation combination plate comprises a plurality of second heat dissipation narrow boxes with grooves at the bottom composed of heat dissipation plates and a plurality of second heat conduction narrow boxes with through-holes at the top and bottom composed of heat conduction plates; the bottoms of the plurality of second heat dissipation narrow boxes are connected into one body through the heat dissipation plate; the second heat conduction narrow box is clamped on the The groove extends outward from the inside of the closed shell to the inside of the second heat dissipation narrow box, wherein the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block are sintered in a temperature range higher than room temperature into a cylinder with a height less than the height required to fill the opening, and then straightened in cold water into a cylinder with the height required to fill the opening. When the temperature in the closed shell reaches above 40°C, the first nickel-titanium shape memory alloy block and the second nickel-titanium shape memory alloy block return to their original height, and a temporary air outlet is opened on the side wall of the closed shell. When the temperature drops, the openings on the front and rear side walls of the closed shell continue to be closed.

5. The closed housing for heat dissipation of electronic products as claimed in claim 4, characterized in that: A U-shaped rubber plug is provided on the top of the first nickel-titanium shape memory alloy block and the bottom of the second nickel-titanium shape memory alloy block, and a metal gasket is provided at the contact portion between the U-shaped rubber plug and the closed shell.

6. The closed housing for heat dissipation of electronic products as claimed in claim 5, characterized in that: A thermally conductive silicone sheet is filled in the gap between the second heat dissipation narrow box body and the second heat conduction narrow box body.

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