Circuit boards and electronic devices

Abstract

The present application discloses a circuit board and electronic equipment, belonging to the field of communication technology. The method comprises: a conductive substrate, a base and a board-to-board connector; wherein a through hole is provided in the base, and the conductive substrate is provided in the through hole; a first conductive connection layer is provided between the conductive substrate and the board-to-board connector, and the conductive substrate inputs current to the board-to-board connector through the first conductive connection layer, and the board-to-board connector is used to output current to the battery module.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a circuit board and an electronic device. Background Art

[0002] At present, the frequency of application programs in electronic devices is relatively high, and the power consumption of electronic devices is becoming increasingly large, making it difficult for electronic devices to maintain daily battery life. Generally, the charging time of electronic devices can be greatly shortened by increasing the charging power of electronic devices. Due to the increase in the charging power of electronic devices, electronic devices require wider flexible printed circuits (Flexible Printed Circuit, FPC) to ensure that electronic devices can pass larger charging currents.

[0003] However, in the above method, the FPC is too wide, which makes the middle frame of the electronic device avoid the FPC area larger. Therefore, the overall structural strength of the electronic device is low. At the same time, the increase in the FPC area leads to a smaller adhesive area between the battery and the middle frame, resulting in poor battery firmness. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board and an electronic device that can solve the problem of a large FPC area.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a circuit board, comprising: a conductive substrate, a base and a board-to-board connector (i.e., a BTB connector); wherein a through hole is provided in the base, and the conductive substrate is provided in the through hole; a first conductive connection layer is provided between the conductive substrate and the board-to-board connector, and the conductive substrate inputs current to the board-to-board connector through the first conductive connection layer, and the board-to-board connector is used to output current to a battery module.

[0007] In a second aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the method described in the first aspect.

[0008] In an embodiment of the present application, the circuit board includes a conductive substrate, a base (such as an insulator) and a board-to-board connector. By setting a through hole in the base, setting the conductive substrate in the through hole of the base, and setting a conductive connection layer between the conductive substrate and the board-to-board connector, the current can be output to the battery module. In this solution, since the intermediate medium layer and the bottom adhesive layer in the circuit board are hollowed out and replaced with a conductive substrate (such as a high-conductivity metal body), that is, the flow medium in the circuit board is a high-conductivity metal body, there is no need to increase the width of the circuit board, and the flow capacity per unit width of the circuit board is also improved. That is, this solution improves the flow capacity of the circuit board by setting a conductive substrate at the through hole in the circuit board, avoiding widening the FPC so that the middle frame of the electronic device avoids the FPC area, thereby avoiding the increase in the FPC area resulting in a reduction in the adhesive area of ​​the battery and the middle frame, thereby improving the firmness of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is one of the structural schematic diagrams of a circuit board provided in an embodiment of the present application;

[0010] Figure 2 This is one of the structural schematic diagrams of a T-shaped high-electricity metal body provided in an embodiment of the present application;

[0011] Figure 3 This is the second structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0012] Figure 4 This is a third structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0013] Figure 5 This is a fourth structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0014] Figure 6 This is a fifth structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0015] Figure 7 This is the sixth structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0016] Figure 8 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0019] The circuit board provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0020] With the rapid development of mobile Internet and the popularization of 5G communication, applications in electronic devices are frequently used, and the power consumption of electronic devices is becoming larger and larger, making it difficult to maintain the battery life for daily needs. Usually, the user's anxiety about insufficient power is solved by increasing the charging power, so the requirements for fast charging are getting higher and higher. With the popularity of 120W fast charging, the charging current of electronic devices increases. Since FPC is designed according to the thinnest thickness without affecting the thickness of the whole machine, FPC is getting wider and wider compared with before, and most of the FPC passes through the bottom of the battery compartment. Therefore, when the FPC becomes wider, the connection reliability of the adhesive area between the battery and the bottom of the alloy middle frame is poor.

[0021] In order to solve the above technical problems, in the embodiment of the present application, the middle dielectric layer and the bottom adhesive layer of the circuit board can be hollowed out and replaced with a conductive substrate, thereby improving the current carrying capacity per unit width of the circuit board. That is, in the embodiment of the present application, the poor strength of the alloy middle frame caused by the excessive width of the hollowing out of the circuit board area at the bottom of the alloy middle frame is avoided, and the reliability between the battery and the alloy middle frame is improved while improving the current carrying capacity of the FPC without increasing the width of the FPC.

[0022] The present application embodiment provides a circuit board, Figure 1 FIG. 1 shows a schematic diagram of the structure of a circuit board provided in an embodiment of the present application. Figure 1 As shown, the circuit board 10 provided in the embodiment of the present application may include: a conductive substrate 11 , a base 12 and a board-to-board connector 13 .

[0023] In an embodiment of the present application, a through hole is provided in the above-mentioned base 12, and the above-mentioned conductive substrate 11 is provided in the through hole, and the conductive substrate is used for passing current; a first conductive connection layer is provided between the above-mentioned conductive substrate and the board-to-board connector, and the conductive substrate inputs current to the board-to-board connector through the first conductive connection layer, and the board-to-board connector is used to output current to the battery module.

[0024] Optionally, in the embodiment of the present application, the circuit board can be any of the following: a flexible printed circuit board FPC, a printed circuit board (PCB) (such as a single-sided board, a double-sided board or a multi-layer board), etc. The specific one can be determined according to actual use requirements, and the embodiment of the present application does not limit it.

[0025] Optionally, in the embodiment of the present application, the conductive substrate may be a metal body with high conductivity or a liquid with high conductivity.

[0026] Optionally, in the embodiment of the present application, the metal body with high conductivity can be any one of the following: copper core aluminum stranded wire, copper alloy, chromium zirconium copper strip, etc. The specific one can be determined according to actual use requirements, and the embodiment of the present application does not limit it.

[0027] Optionally, in the embodiment of the present application, the substrate may be any of the following: mica insulator, solid insulator (such as plastic, rubber, glass or ceramic), liquid insulator (such as natural mineral oil, silicone oil or trichlorobiphenyl) or gas insulator (such as air, carbon dioxide or sulfur hexafluoride), etc. The specific substrate may be determined according to actual use requirements, and the embodiment of the present application does not limit it.

[0028] Optionally, in the embodiment of the present application, the first conductive connection layer may be any one of the following: a copper foil layer, an aluminum foil layer, a silver foil layer or a gold foil layer, etc. The specific one may be determined according to actual use requirements, and the embodiment of the present application does not limit it.

[0029] Optionally, in the embodiment of the present application, the conductive substrate includes a first metal body 14 and a second metal body 15 .

[0030] In the embodiment of the present application, the first metal body and the second metal body are connected in a T-shaped manner.

[0031] Optionally, in the embodiment of the present application, the T-shaped fitting connection between the first metal body and the second metal body may specifically be: the first metal body and the second metal body are ultrasonically welded and connected.

[0032] Optionally, in the embodiment of the present application, the conductive materials of the first metal body and the second metal body may be the same or different, which may be determined according to actual use requirements and are not limited in the embodiment of the present application.

[0033] For example, Figure 2 As shown, the T-shaped high-dielectric metal body may include a substrate 12, a single-layer copper foil 14 (i.e., a first metal body) disposed at the bottom of the through hole, and a second metal body 15 disposed on the single-layer copper foil. The second metal body and the single-layer copper foil are welded and bonded by ultrasonic welding, and the thickness of the second metal body is three times the thickness of the single-layer copper foil.

[0034] It should be noted that, in order to more clearly illustrate the structure of the T-shaped high-conductivity metal body, Figure 2 It is illustrated by a cross-sectional view of the structure of a T-shaped high-conductivity metal.

[0035] In the embodiment of the present application, the conductive substrate is divided into a first metal body and a second metal body, and the first metal body and the second metal body are connected in a T-shaped manner, thereby improving the firmness of the conductive substrate and improving the current carrying capacity per unit width of the circuit board.

[0036] Optionally, in the embodiment of the present application, the circuit board further includes a second conductive connection layer 16, and the second conductive connection layer is disposed in the through hole.

[0037] In the embodiment of the present application, the through hole includes a groove, the conductive connection layer in the groove is a first metal body, and the second metal body is vertically arranged on the first metal body.

[0038] It should be noted that the conductive connection layer in the groove is a part of the second conductive connection layer; and the description of the second conductive connection layer can refer to the description of the first conductive connection layer, which will not be repeated here.

[0039] Optionally, in the embodiment of the present application, combined with Figure 2 ,like Figure 3 As shown, the circuit board may include a second copper foil layer 16, a through hole 17 in a base 12, and an insulating cover film 18, wherein the through hole includes a groove 19, the copper foil layer in the groove is a first metal body 14, and the second metal body 15 is vertically arranged on the first metal body, and the insulating cover glue 18 is bonded and connected to the base 12.

[0040] It should be noted that, in order to more clearly illustrate the structure of the circuit board in the embodiment of the present invention, Figure 3 It is shown in the plan view of the circuit board structure.

[0041] In an embodiment of the present application, the conductive connection layer in the groove of the circuit board is used as the first metal body, and the second metal body is vertically arranged on the first metal body, that is, the second metal body is directly bonded and connected to the conductive connection layer in the groove, thereby improving the firmness of the second metal body and improving the current carrying capacity per unit width of the circuit board.

[0042] Optionally, in the embodiment of the present application, the length of the first metal body is greater than the length of the second metal body, and the thickness of the second metal body is greater than the thickness of the second copper foil layer.

[0043] It should be noted that the second conductive connection layer includes the conductive connection layer in the groove, that is, the thickness of the second metal body is greater than the thickness of the first metal body.

[0044] Optionally, in an embodiment of the present application, the thickness of the second metal body is greater than the thickness of the second conductive connection layer. Specifically, the thickness of the second metal body is N times the thickness of the second conductive connection layer, where N is an integer greater than 1.

[0045] In the embodiment of the present application, since the length of the first metal body is greater than the length of the second metal body, the firmness between the second metal body and the circuit board is improved, and the thickness of the second metal body is greater than the thickness of the first metal body, thereby improving the current capacity per unit width of the circuit board.

[0046] Optionally, in the embodiment of the present application, combined with Figure 3 ,like Figure 4 As shown, the flexible printed circuit board may include a top insulating double-sided tape 20, an insulating cover film and adhesive 21, a first copper foil and electroplating layer 22, a substrate insulating layer 23, a second copper foil layer and electroplating 24, and a T-shaped high conductivity metal and ultrasonic welding area 25, wherein the T-shaped high conductivity metal body and ultrasonic welding area 25 include a T-shaped high conductivity metal body wide surface copper foil 25-1, a T-shaped high conductivity metal body wide surface insulating cover glue and adhesive 25-2 and a T-shaped high conductivity metal body narrow surface 25-3 and a substrate 12.

[0047] It should be noted that in order to more clearly illustrate the structure of the flexible printed circuit board, Figure 4 It is illustrated by a plan view of the structure of a circuit board.

[0048] The embodiment of the present application provides a circuit board, the circuit board includes a conductive substrate, a base and a board-to-board connector, by setting a through hole in the base, setting the conductive substrate in the through hole of the base, and outputting the current to the battery module through the board-to-board connector. In this solution, since the intermediate medium layer and the bottom adhesive layer in the circuit board are hollowed out and replaced with a conductive substrate (such as a high-conductivity metal body), that is, the flow medium in the circuit board is a high-conductivity metal body, the flow capacity per unit width of the circuit board can be improved without increasing the width of the circuit board. That is, this solution improves the flow capacity of the circuit board by setting a conductive substrate at the through hole in the circuit board, avoiding widening the FPC so that the middle frame of the electronic device avoids the FPC area, thereby avoiding the increase in the FPC area resulting in a reduction in the adhesive area of ​​the battery and the middle frame, thereby improving the firmness of the battery.

[0049] Optionally, in the embodiment of the present application, the circuit board further includes a board-to-board connector and a third conductive connection layer 26 .

[0050] In the embodiment of the present application, the third conductive connection layer is bonded and connected to the second metal body, and the third conductive connection layer is extended to the bending area of ​​the board-to-board connector.

[0051] It should be noted that, for the description of the third conductive connection layer, reference may be made to the description of the first conductive connection layer or the second conductive connection layer, which will not be repeated here.

[0052] For example, in combination Figure 4 ,like Figure 5 As shown, the flexible printed circuit board may include a top insulating double-sided adhesive 20, an insulating cover film and adhesive 21, a first copper foil and electroplating layer 22, a substrate insulating layer 23, a second copper foil layer and electroplating 24, a T-shaped high conductivity metal and ultrasonic welding area 25, a substrate 12 and a third copper foil 26. The T-shaped high conductivity metal body and ultrasonic welding area 25 include a T-shaped high conductivity metal body wide copper foil 25-1, a T-shaped high conductivity metal body wide insulating cover adhesive and adhesive 25-2, and a T-shaped high conductivity metal body narrow surface 25-3.

[0053] It should be noted that, in order to more clearly illustrate the structure of the circuit board in the embodiment of the present invention, Figure 5 It is illustrated in a side cross-sectional view of the structure of a circuit board.

[0054] In the embodiment of the present invention, since the third conductive connection layer is added to the second metal body and extended to the bending area of ​​the BTB, the current carrying capacity of the bending area of ​​the BTB is improved and the bonding strength between the second metal body and the circuit board is increased.

[0055] Optionally, in the embodiment of the present application, combined with Figure 1 ,like Figure 6 As shown, the width of the bending area of ​​the above-mentioned circuit board is smaller than the width of the circuit board's current flow area.

[0056] In the embodiment of the present application, since the width of the bending area of ​​the circuit board is smaller than the width of the current flow area, that is, the middle frame avoidance area of ​​the circuit board is reduced, the adhesive area between the battery and the middle frame bracket in the electronic device is small, resulting in poor firmness of the battery. In this way, the firmness of the electronic device is improved.

[0057] Optionally, in the embodiment of the present application, the circuit board further includes a reinforcing steel sheet 27 .

[0058] In the embodiment of the present application, the above-mentioned reinforcing steel sheet 27 is bonded to the outer surface of the first insulator 1 of the circuit board, and the inner surface of the first insulator is bonded to the third conductive connection layer of the circuit board. The third conductive connection layer is connected to the second conductive connection layer 16 through the narrow surface of the T-shaped conductive substrate, and the second conductive connection layer is connected to the board-to-board connector.

[0059] For example, in combination Figure 4 ,like Figure 7 As shown, the circuit board may include a current flow area 1 below the battery, a narrow surface 2 of a T-shaped high-conductivity metal body, a wide surface 3 of a T-shaped high-conductivity metal body, a reinforcing steel sheet 27, a board-to-board connector 13, a second layer of copper foil 26 and a third layer of copper foil 26, wherein the third layer of copper foil is a layer of copper foil added on the narrow surface 2 of the T-shaped high-conductivity metal body.

[0060] It should be noted that, in order to more clearly illustrate the structure of the circuit board in the embodiment of the present invention, Figure 7 It is illustrated in a side cross-sectional view of the structure of a circuit board.

[0061] An embodiment of the present application provides an electronic device, Figure 8 FIG. 1 is a schematic diagram showing the structure of an electronic device provided by an embodiment of the present application. Figure 8 As shown, the electronic device 28 provided in the embodiment of the present application may include a circuit board 10 .

[0062] It should be noted that the circuit board 10 may be the circuit board described in the above embodiment. For the description of the circuit board 10 , reference may be made to the description in the above embodiment, which will not be repeated here.

[0063] An embodiment of the present application provides an electronic device, the electronic device includes a circuit board, and the circuit board is provided with a through hole in an insulator, and the intermediate dielectric layer and the bottom adhesive layer of the circuit board are hollowed out and replaced with a conductive substrate. In this solution, since the intermediate dielectric layer and the bottom adhesive layer in the circuit board are hollowed out and replaced with a conductive substrate, there is no need to increase the width of the circuit board in the electronic device to increase the current capacity per unit width of the circuit board, and the problem of a small adhesive area between the battery and the alloy middle frame of the electronic device due to the circuit board in the electronic device being too wide is avoided, thereby preventing the battery and the adhesive area at the bottom of the alloy middle frame from being poorly connected. Therefore, the overall structural strength of the electronic device is improved, and the current capacity of the electronic device is improved.

[0064] Optionally, in an embodiment of the present application, the electronic device further includes a battery module.

[0065] In an embodiment of the present application, the battery module is connected to a board-to-board connector in a circuit board, and the battery module is used to power the electronic device using the current output by the board-to-board connector.

[0066] In the embodiment of the present application, the battery module in the electronic device can be connected to the board-to-board connector in the circuit board, so that the large current passing through the circuit board can charge the electronic device.

[0067] In the embodiment of the present application, the electronic device can be connected to the battery module through the board-to-board connector in the circuit board, so that the electronic device can receive a larger current and improve the charging efficiency of the electronic device.

[0068] Optionally, in an embodiment of the present application, the electronic device further includes a first insulator and a second insulator.

[0069] In the embodiment of the present application, the first insulator is bonded to the first outer surface of the circuit board, and the second insulator is bonded to the second outer surface of the circuit board.

[0070] Optionally, in the embodiment of the present application, the first outer surface of the circuit board is the upper surface of the circuit board, and the second outer surface of the circuit board can be the upper surface of the circuit board; or the second outer surface of the circuit board is the lower surface of the circuit board, and the first outer surface of the circuit board is the lower surface of the circuit board. The specific surface can be determined according to actual use requirements, and the embodiment of the present application does not limit it.

[0071] In the embodiment of the present application, an insulator is bonded to the first outer surface and the second outer surface of the circuit board, thereby enhancing the bonding strength between the circuit board and the electronic device.

[0072] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0073] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0074] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A circuit board, characterized in that: The circuit board comprises: a conductive substrate, a base body and a board-to-board connector; Wherein, a through hole is provided in the base body, and the conductive substrate is provided in the through hole; A first conductive connection layer is provided between the conductive substrate and the board-to-board connector, the conductive substrate inputs current to the board-to-board connector through the first conductive connection layer, and the board-to-board connector is used to output current to the battery module; The circuit board also includes a reinforcing steel sheet; The reinforcing steel sheet is bonded to the outer surface of the first insulator of the circuit board, the inner surface of the first insulator is bonded to the third conductive connection layer of the circuit board, the third conductive connection layer is connected to the second conductive connection layer of the circuit board through a conductive substrate, and the second conductive connection layer is connected to the board-to-board connector; The conductive substrate includes a first metal body and a second metal body; The first metal body and the second metal body are connected in a T-shaped manner; the third conductive connection layer is connected in a T-shaped manner, and the third conductive connection layer is extended to the bending area of ​​the board-to-board connector.

2. The circuit board according to claim 1, characterized in that: The circuit board further comprises a second conductive connection layer, wherein the second conductive connection layer is disposed in the through hole; The through hole includes a groove, the conductive connection layer in the groove is the first metal body, and the second metal body is vertically arranged on the first metal body.

3. The circuit board according to claim 1, characterized in that: The length of the first metal body is greater than the length of the second metal body; The thickness of the second metal body is greater than the thickness of the second conductive connection layer.

4. The circuit board according to claim 1, characterized in that: The circuit board also includes a board-to-board connector and a third conductive connection layer.

5. The circuit board according to claim 1, characterized in that: The width of the bending area of ​​the circuit board is smaller than the width of the current flow area of ​​the circuit board.

6. An electronic device, characterized in that: Comprising the circuit board as claimed in any one of claims 1 to 5.

7. The electronic device according to claim 6, characterized in that: The electronic device further comprises a battery module; The battery module is connected to the board-to-board connector in the circuit board, and the battery module is used to use the current output by the board-to-board connector to power the electronic device.

8. The electronic device according to claim 6 or 7, characterized in that: The electronic device further comprises a first insulator and a second insulator; The first insulator is in contact with the first outer surface of the circuit board, and the second insulator is in contact with the second outer surface of the circuit board.

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