Preparation method of graphene heat dissipation structure and graphene heat dissipation structure

Abstract

The invention relates to the field of heat dissipation structures, and discloses a preparation method of a graphene heat dissipation structure and the graphene heat dissipation structure. The preparation method comprises the following steps: carrying out die cutting operation on a single-sided adhesive to obtain a molded single-sided adhesive layer, carrying out die cutting operation on a graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, oppositely attaching the molded graphene heat dissipation layer to a first adhesive layer, and carrying out die cutting operation on a first double-sided adhesive to obtain a molded double-sided adhesive tape; the formed double-faced adhesive tape is attached to the first adhesive layer in an opposite mode, the second double-faced adhesive tape is subjected to die cutting operation, a formed double-faced adhesive tape layer is obtained, the formed double-faced adhesive tape layer is attached to the double-faced adhesive tape and the graphene heat dissipation layer in an opposite mode, and the graphene heat dissipation structure is obtained. The width of the covered edge structure is increased, the stress dispersion performance of the covered edge structure is enhanced, the waterproof performance is improved, the covered edge layering phenomenon is avoided, the heat dissipation performance of the graphene heat dissipation layer is guaranteed, the overall structure stability is improved, and the service life is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to a preparation method of a graphene heat dissipation structure and the graphene heat dissipation structure. Background Art

[0002] Foldable smart electronic products are emerging electronic products. For example, foldable screen mobile phones have the advantages of being foldable and easy to store. Foldable smart electronic products are becoming more and more widely used. With the advancement of science and technology, smart electronic products have more and more functions, and the requirements for heat dissipation performance are getting higher and higher. Graphene heat dissipation structure is a commonly used heat dissipation structure for smart electronic products. Graphene heat dissipation structure is light and thin, has excellent heat dissipation performance, and is easy to process and shape. It is widely used in smart electronic products and can achieve the effect of rapid heat conduction and heat dissipation of smart electronic products.

[0003] However, since foldable electronic products will be folded repeatedly during use, especially foldable screen mobile phones, people use their mobile phones very frequently every day and will fold them repeatedly. The graphene heat dissipation structure is usually installed at the folding part of the foldable screen mobile phone and will also be folded repeatedly. In addition, the use environment may be in a high temperature or high humidity state. The edging structure of the existing graphene heat dissipation structure is usually formed by directly bonding the adhesive layers on the two surfaces of the graphene. It has poor stability and is prone to stratification, which greatly reduces the waterproof performance, thereby causing water seepage and damaging the graphene structure, resulting in a greatly reduced heat dissipation performance of the graphene, or even loss, which greatly reduces the service life of the graphene heat dissipation structure. Therefore, it is necessary to provide a graphene heat dissipation structure with excellent waterproof performance to improve the structural stability and service life of the graphene heat dissipation structure. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for preparing a graphene heat dissipation structure and a graphene heat dissipation structure that is beneficial to improving the waterproof performance of the graphene heat dissipation structure and obtaining a more stable structure. The graphene heat dissipation structure has good waterproof performance and a long service life.

[0005] The objective of the present invention is achieved through the following technical solutions: A method for preparing a graphene heat dissipation structure comprises the following steps: Providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer; Providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and laminating the molded graphene heat dissipation layer on the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer; Providing a first double-sided adhesive tape, performing a die-cutting operation on the first double-sided adhesive tape to obtain a molded double-sided adhesive tape, wherein the molded double-sided adhesive tape comprises a second substrate layer, a second adhesive layer and a third adhesive layer, wherein the second adhesive layer and the third adhesive layer are respectively connected to two sides of the second substrate layer, and the molded double-sided adhesive tape is attached to the first adhesive layer so that the second adhesive layer is bonded to the first adhesive layer, and a gap is left between the molded double-sided adhesive tape and the molded graphene heat dissipation layer; A second double-sided adhesive tape is provided, and a die-cutting operation is performed on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is attached to the molded double-sided adhesive strip and the molded graphene heat dissipation layer, so that the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded to partially expose the third substrate layer, thereby forming a glue-free hinge area, and obtaining a graphene heat dissipation structure.

[0006] In one embodiment, after the operation of obtaining the molded single-sided adhesive layer, a first release film is provided, the first release film is die-cut to obtain a molded first release film, and the molded first release film is laminated onto the first substrate layer.

[0007] In one embodiment, after the fifth adhesive layer is debonded to expose part of the third substrate layer to form a glue-free hinge area, foam glue is further provided, and the foam glue is die-cut to obtain shaped foam glue, and the shaped foam glue is adhered to the glue-free hinge area to bond the shaped foam glue to the third substrate layer.

[0008] In one embodiment, after the operation of laminating the molded foam adhesive pair to the glue-free hinge area so that the molded foam adhesive is bonded to the third substrate layer, a second release film is provided, and the second release film is die-cut to obtain a molded second release film, and the molded second release film pair is laminarly attached to the fifth adhesive layer and the molded foam adhesive.

[0009] In one embodiment, the molded double-sided adhesive strip is provided with a connecting edging area and a hinge edging area, and the width of the hinge edging area is greater than the width of the connecting edging area.

[0010] In one embodiment, the width of the hinge edging area is 2.1 mm to 2.5 mm, and the width of the connection edging area is 1.1 mm to 1.5 mm.

[0011] In one embodiment, the hinge edge area of ​​the molded double-sided adhesive strip is provided with an avoidance groove, and the width of the avoidance groove is 0.4 mm to 0.6 mm.

[0012] In one embodiment, the thickness of the molded double-sided adhesive strip is greater than the thickness of the graphene heat dissipation layer.

[0013] In one embodiment, the width of the gap between the molded double-sided adhesive strip and the graphene heat dissipation layer is 0.2 mm to 0.4 mm.

[0014] A graphene heat dissipation structure is made by the above-mentioned graphene heat dissipation structure preparation method.

[0015] Compared with the prior art, the present invention has at least the following advantages: The preparation method of the graphene heat dissipation structure is to obtain a molded single-sided adhesive layer, a molded graphene heat dissipation layer, a molded double-sided adhesive strip and a molded double-sided adhesive layer of corresponding shapes by die-cutting the single-sided adhesive, the graphene heat dissipation layer, the first double-sided adhesive and the second double-sided adhesive respectively, and then to prepare the graphene heat dissipation structure by laminating in sequence through a pasting and bonding process. The preparation process is simple, and each material layer can be die-cut and formed simultaneously, which is conducive to improving production efficiency. At the same time, by providing a molded double-sided adhesive strip, the molded double-sided adhesive strip is a frame strip structure, which is pasted and bonded to the outside of the graphene heat dissipation layer and is in contact with the graphene heat dissipation layer. A certain gap is left between the layers, so that when the molded double-sided adhesive layer is attached to the second side of the graphene heat dissipation layer and the molded double-sided adhesive strip, it can be bonded with the molded double-sided adhesive strip to form a reinforced edging structure on the outside of the graphene heat dissipation layer, thereby increasing the width of the edging structure and strengthening the stress dispersion performance of the edging structure, greatly improving the structural stability of the edging structure, thereby greatly improving the waterproof performance, avoiding the occurrence of edging stratification, thereby avoiding damage to the graphene heat dissipation layer, ensuring the heat dissipation performance of the graphene heat dissipation layer, and improving the overall structural stability and overall service life of the graphene heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A flowchart of the steps of a method for preparing a graphene heat dissipation structure according to an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a graphene heat dissipation structure according to one embodiment of the present invention; Figure 3 A schematic structural diagram of a graphene heat dissipation structure from another perspective according to an embodiment of the present invention; Figure 4 A partial structural schematic diagram of a graphene heat dissipation structure according to an embodiment of the present invention; Figure 5 This is a schematic structural diagram of a molded double-sided adhesive strip of a graphene heat dissipation structure according to one embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0020] For an implementation method, please refer to Figure 1 , a method for preparing a graphene heat dissipation structure, comprising the following steps: S110, providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer.

[0021] It should be noted that a single-sided adhesive roll is provided and loaded through an external feeding mechanism. According to the shape of the graphene heat dissipation structure required by the production design of different models of mobile phones, die-cutting operations are performed through a round knife mold or a flat knife mold to obtain a molded single-sided adhesive layer of a corresponding shape. Since the single-sided adhesive is a commonly used tape structure with a substrate layer and an adhesive layer, the molded single-sided adhesive layer obtained by die-cutting has a first substrate layer and a first adhesive layer, and the first adhesive layer is adhered to one side of the first substrate layer. The first adhesive layer is used for subsequent bonding to the first side of the graphene heat dissipation layer, and is coated on the outside of the graphene heat dissipation layer to protect the graphene heat dissipation layer. At the same time, it cooperates with the molded double-sided adhesive strip to form a edging structure to play a waterproof role.

[0022] S120, providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and attaching the molded graphene heat dissipation layer to the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer.

[0023] It should be noted that the graphene heat dissipation layer is prepared by graphene material and has excellent heat dissipation performance. Similarly, the graphene heat dissipation layer can be die-cut by a flat knife mold or a round knife mold to obtain a molded graphene heat dissipation layer of a corresponding shape required by the production design, and then the molded graphene heat dissipation layer is bonded to the first adhesive layer by pasting the die-cut molded graphene heat dissipation layer on the first adhesive layer. Specifically, the shape and area of ​​the graphene heat dissipation layer are smaller than the shape and area of ​​the first adhesive layer, and the graphene heat dissipation layer is pasted on the first adhesive layer. The first adhesive layer is located in the middle of the first adhesive layer, and a certain gap is left between the peripheral edge of the graphene heat dissipation layer and the peripheral edge of the first adhesive layer, ensuring that the first adhesive layer is completely covered on the outside of the first surface of the graphene heat dissipation layer, and plays a covering and protective role on the graphene heat dissipation layer to prevent the graphene heat dissipation layer from being damaged. At the same time, the first adhesive layer is at least partially protruded from the peripheral edge of the first surface of the graphene heat dissipation layer, so that the first adhesive layer has an area that is bonded to the second adhesive layer of the molded double-sided tape, thereby ensuring the subsequent normal bonding and installation with the molded double-sided tape.

[0024] S130. Provide a first double-sided adhesive tape, and perform a die-cutting operation on the first double-sided adhesive tape to obtain a molded double-sided adhesive strip, wherein the molded double-sided adhesive strip comprises a second substrate layer, a second adhesive layer and a third adhesive layer, wherein the second adhesive layer and the third adhesive layer are respectively connected to two sides of the second substrate layer, and the molded double-sided adhesive strip is attached to the first adhesive layer so that the second adhesive layer is bonded to the first adhesive layer, and a gap is left between the molded double-sided adhesive strip and the molded graphene heat dissipation layer.

[0025] It should be noted that the first double-sided adhesive tape is a commonly used double-sided adhesive tape roll, which is an adhesive tape material with adhesive layers on both sides of the substrate layer. The material is fed through an external feeding roll mechanism, and then the first double-sided adhesive tape is die-cut through a circular knife mold or a flat knife mold according to the requirements of the specific production design to obtain a molded double-sided adhesive strip of a corresponding shape. Specifically, the molded double-sided adhesive strip is an outer frame strip structure, which is attached to the first adhesive layer and is used to surround the periphery of the graphene heat dissipation layer. The peripheral edge of the molded double-sided adhesive tape is aligned with the peripheral edge of the first adhesive layer, and a certain distance is left between the molded double-sided adhesive tape and the molded graphene heat dissipation layer. The gap is avoided to avoid direct contact with the molded graphene heat dissipation layer, which is beneficial to avoid the second adhesive layer and the third adhesive layer on the molded double-sided adhesive strip from expanding in volume due to heat in a high temperature environment and squeezing the graphene heat dissipation layer, avoiding damage to the graphene heat dissipation layer structure, and is beneficial to improving the structural stability of the graphene heat dissipation layer, ensuring the heat dissipation performance, thereby improving the quality and service life of the finished product of the graphene heat dissipation structure, and at the same time, it is beneficial to increase the edge width of the graphene heat dissipation layer, improve the waterproof performance, and avoid the graphene heat dissipation layer from being affected by external moisture, thereby further ensuring the heat dissipation performance of the graphene heat dissipation layer.

[0026] S140, providing a second double-sided adhesive tape, and performing a die-cutting operation on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is attached to the molded double-sided adhesive strip and the molded graphene heat dissipation layer, so that the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded to partially expose the third substrate layer to form a glue-free hinge area, thereby obtaining a graphene heat dissipation structure.

[0027] It should be noted that, similarly, the second double-sided adhesive tape is also a commonly used tape material with adhesive layers on both sides of the substrate layer. It is fed by an external feeding roll mechanism, and then die-cut by a circular knife mold or a flat knife mold to obtain a molded double-sided adhesive layer of a corresponding shape required by the production design. The molded double-sided adhesive layer cooperates with the molded single-sided adhesive layer and is respectively bonded and coated on the first side and the outer side of the second side of the graphene heat dissipation layer. At the same time, the molded double-sided adhesive layer is also adhered and coated on the molded double-sided adhesive strip. Specifically, the fourth adhesive layer of the molded double-sided adhesive layer is bonded to the third adhesive layer of the molded double-sided adhesive strip and the second side of the graphene heat dissipation layer. Since a gap is left between the molded double-sided adhesive strip and the graphene heat dissipation layer, the fourth adhesive layer is adhered and bonded to the first adhesive layer at the gap, thereby achieving comprehensive sealing of the graphene heat dissipation layer. Protection, and by providing a molded double-sided adhesive strip, respectively cooperate with the molded single-sided adhesive layer and the molded double-sided adhesive layer to form an edge structure to ensure waterproof performance. In addition, by performing a degumming operation on the fifth adhesive layer at the corresponding position of the hinge area, specifically, the fifth adhesive layer of the hinge area can be removed by heating to the degumming temperature and then cutting off the fifth adhesive layer through a die to form a glue-free hinge area. The glue-free hinge area is used to be installed on the screen bending part of the folding screen mobile phone, and needs to be exposed to avoid being provided with an adhesive layer to avoid dust and dirt in the adhesion environment, which is beneficial to ensuring the overall cleanliness of the graphene heat dissipation structure. The adhesive structure is retained in the two end areas of the fifth adhesive layer, which can be used to extend into the interior of the mobile phone and be bonded and connected with the specific structure inside the mobile phone, so that the graphene heat dissipation structure is installed on the mobile phone to achieve heat dissipation function.

[0028] Furthermore, by providing a molded double-sided adhesive strip, a reinforced edging structure can be formed on the periphery of the graphene heat dissipation layer. Specifically, the second adhesive layer of the molded double-sided adhesive strip is bonded to the first adhesive layer, and the third adhesive layer of the molded double-sided adhesive strip is bonded to the fourth adhesive layer, thereby forming a sealed and bonded edging structure on the periphery of the graphene heat dissipation layer, which plays a sealing and protective role on the graphene heat dissipation layer, and prevents external moisture from entering the interior and affecting the performance of the graphene heat dissipation layer. Since the graphene heat dissipation layer and the molded double-sided adhesive strip both have a certain thickness, and a certain gap is left between the graphene heat dissipation layer and the molded double-sided adhesive strip, a recessed structure is formed between the graphene heat dissipation layer and the molded double-sided adhesive strip. When the molded double-sided adhesive layers are bonded, the fourth adhesive layer is sequentially bonded to the third adhesive layer and the first adhesive layer at the gap, and then bonded to the graphene heat dissipation layer. The fourth adhesive layer, the third adhesive layer and the bonded part of the first adhesive layer together form the graphene heat dissipation. The edge structure of the structure, on the one hand, the width of the edge structure is increased, and the adhesive area of ​​the edge structure is greatly increased, the bonding strength of the edge structure is greatly increased, and it is not easy to delaminate, and the structural stability is good. On the other hand, the fourth adhesive layer forms a depression between the graphene heat dissipation layer and the molded double-sided adhesive strip to form multiple bends to form a bending structure. The bending stress generated when the graphene heat dissipation structure is bent can be dispersed through the bending structure to eliminate stress, avoid further diffusion of stress, reduce the impact of the bending on the edge structure, further prevent delamination, greatly improve the structural stability of the edge structure, thereby greatly improving the waterproof performance, avoiding the occurrence of edge delamination, thereby avoiding damage to the graphene heat dissipation layer, the prepared graphene heat dissipation structure has excellent heat dissipation performance, and improves the overall structural stability and overall service life of the graphene heat dissipation structure.

[0029] In one embodiment, after the operation of obtaining the molded single-sided adhesive layer, a first release film is further provided, and the first release film is die-cut to obtain a molded first release film, and the molded first release film is attached to the first substrate layer. It can be understood that the first release film is fed by an external feeding roll mechanism, and the first release film is die-cut by a flat knife mold or a round knife mold to obtain a molded first release film. The shape and area of ​​the first release film can be set to be larger than the shape and area of ​​the single-sided adhesive layer. The first release film is attached and coated on the side of the first substrate layer away from the first adhesive layer. The first substrate layer is one side of the graphene heat dissipation structure. The first release film can be used as a surface protection film layer to protect the graphene heat dissipation structure, and the first release film is easy to lift and tear to ensure the normal use of the graphene heat dissipation structure.

[0030] In one embodiment, after the fifth adhesive layer is debonded to expose part of the third substrate layer to form a glue-free hinge area, a foam adhesive is further provided, and the foam adhesive is die-cut to obtain a molded foam adhesive, and the molded foam adhesive is attached to the glue-free hinge area to bond the molded foam adhesive to the third substrate layer. It can be understood that in this embodiment, the foam adhesive is die-cut into strips to obtain strip-shaped molded foam. There can be multiple molded foam adhesives, for example, there can be two, which are attached to the third substrate layer at intervals. Each molded foam adhesive can be used as a reinforcing rib structure to improve the mechanical strength of the glue-free hinge area, and avoid damage to the glue-free hinge area of ​​the graphene heat dissipation layer after multiple bending, which is beneficial to further improve the overall structural stability and finished product quality of the graphene heat dissipation structure and improve the service life.

[0031] In one embodiment, after the operation of attaching the molded foam adhesive pair to the adhesive-free hinge area so that the molded foam adhesive is bonded to the third substrate layer, a second release film is provided, and the second release film is die-cut to obtain a molded second release film, and the molded second release film pair is attached to the fifth adhesive layer and the molded foam adhesive. It can be understood that in this embodiment, by providing a second release film, a molded second release film is obtained after die-cutting, and the molded second release film is attached to the fifth adhesive layer and the molded foam adhesive, and completely covers the adhesive-free hinge area, that is, the second release film covers the other side of the graphene heat dissipation structure, and the second release film can be used as a surface protection film layer to protect the graphene heat dissipation structure, and the second release film is easy to lift and tear, so as to ensure the normal use of the graphene heat dissipation structure.

[0032] In one embodiment, the molded double-sided adhesive strip is provided with a connection edging area and a hinge edging area, and the width of the hinge edging area is greater than the width of the connection edging area. It can be understood that the molded double-sided adhesive strip is set as the hinge edging area corresponding to the hinge area of ​​the graphene heat dissipation structure, and the other areas are set as the connection edging area. Since the hinge area of ​​the graphene heat dissipation structure is the hinge area installed on the folding screen mobile phone, it is subject to many bends. By setting the width of the hinge edging area to be greater than the width of the connection edging area, a wider edging structure can be formed at the hinge part of the graphene heat dissipation structure, further increasing the adhesive area of ​​the edging structure of the hinge part, thereby further ensuring the structural stability of the edging, not easy to delaminate, and further improving the waterproof performance, thereby improving the overall performance and quality of the graphene heat dissipation structure.

[0033] Further, in this embodiment, the width of the hinge edging area is 2.1mm~2.5mm, and the width of the connection edging area is 1.1mm~1.5mm. It can be understood that the width of the hinge edging area is set to 2.1mm~2.5mm, and the width of the connection edging area is 1.1mm~1.5mm, which can ensure that the width of the hinge edging area is set to be greater than the width of the connection edging area, and the width is moderate, and the structural stability is good. Specifically, the width of the hinge edging area can be set to 2.1mm, 2.3mm or 2.5mm and other widths, and the width of the connection edging area can be set to 1.1mm, 1.3mm or 1.5mm and other widths, which will not be repeated in this embodiment.

[0034] In one embodiment, the hinge edge region of the molded double-sided adhesive strip is provided with an avoidance groove, and the width of the avoidance groove is 0.4mm~0.6mm. It can be understood that by providing an avoidance groove in a layer of the molded double-sided adhesive strip away from the graphene heat dissipation layer, and the width of the avoidance groove is 0.4mm~0.6mm, specifically, in the operation of die-cutting the first double-sided adhesive, the avoidance groove structure can be designed and die-cut synchronously to avoid adding process steps and affecting production efficiency. In this way, the avoidance structure can be formed on both sides of the molded double-sided adhesive strip. When the graphene heat dissipation structure is in a high temperature environment, the second adhesive layer and the third adhesive layer of the molded double-sided adhesive strip have an increased expansion volume. By providing an avoidance groove, an avoidance effect can be played, which is conducive to the deformation of the molded double-sided adhesive strip to the avoidance groove, avoiding the situation of squeezing the graphene heat dissipation layer, thereby further protecting the graphene heat dissipation layer, improving the overall heat resistance and finished product quality of the graphene heat dissipation structure, and having good practicality.

[0035] In one embodiment, the thickness of the molded double-sided adhesive strip is greater than the thickness of the graphene heat dissipation layer. It is understandable that by setting the thickness of the molded double-sided adhesive strip to be greater than the thickness of the graphene heat dissipation layer, since the graphene heat dissipation layer is a thin layer structure with a relatively thin thickness, a relatively high double-sided adhesive strip structure can be formed on the periphery of the graphene heat dissipation layer to form a waterproof wall structure with good waterproof performance, and can be used as a reinforcing rib structure of the graphene heat dissipation structure with better structural stability. The prepared graphene heat dissipation structure edge structure is not easy to delaminate and has excellent waterproof performance.

[0036] In one embodiment, the viscosity of the second adhesive layer and the viscosity of the third adhesive layer are greater than the viscosity of the first adhesive layer, the viscosity of the fourth adhesive layer, and the viscosity of the fifth adhesive layer. It can be understood that the first double-sided adhesive uses a double-sided adhesive with a larger viscosity, so that the viscosity of the first double-sided adhesive is greater than the viscosity of the second double-sided adhesive. At the same time, the viscosity of the first double-sided adhesive is also greater than the viscosity of the single-sided adhesive. In this way, the viscosity of the second adhesive layer and the third adhesive layer of the molded double-sided adhesive strip can be greater than the viscosity of the first adhesive layer, the fourth adhesive layer, and the fifth adhesive layer. Since the viscosity of the second adhesive layer and the third adhesive layer is larger, the adhesive layer structure is relatively viscous and compact, while the viscosity of the first adhesive layer and the fourth adhesive layer is smaller, and the adhesive layer structure is relatively sparse and loose. This creates a density difference between the adhesive layers, which is beneficial for the second adhesive layer and the third adhesive layer of the molded double-sided adhesive strip to be interlocked and penetrated with the first adhesive layer and the fourth adhesive layer respectively, thereby generating an adhesive adsorption force on the first adhesive layer and the fourth adhesive layer on both sides of the molded double-sided adhesive strip, which is beneficial for the molded double-sided adhesive strip to be more tightly bonded to the first adhesive layer and the fourth adhesive layer, making it less likely to delaminate, and can better seal and protect the graphene heat dissipation layer, with excellent waterproof performance, thereby making the finished product quality of the graphene heat dissipation structure higher.

[0037] In one embodiment, the width of the gap between the molded double-sided adhesive strip and the graphene heat dissipation layer is 0.2 mm to 0.4 mm. It is understandable that the width of the gap between the molded double-sided adhesive strip and the graphene heat dissipation layer is set to 0.2 mm to 0.4 mm, which is moderate to avoid the gap width being too large, thereby avoiding the width of the graphene heat dissipation structure being too large, inconvenient to install, and avoiding waste of materials. At the same time, avoiding the gap width being too small, avoiding squeezing the graphene heat dissipation layer, avoiding damage to the graphene heat dissipation layer, and ensuring the normal use of the graphene heat dissipation structure.

[0038] For an implementation method, please refer to Figure 2 , Figure 3 , Figure 4 and Figure 5, and also provides a graphene heat dissipation structure 10, which is made by the preparation method of the above graphene heat dissipation structure. The graphene heat dissipation structure 10 comprises a molded single-sided adhesive layer 100, a molded graphene heat dissipation layer 200, a molded double-sided adhesive strip 300 and a molded double-sided adhesive layer 400, wherein the molded single-sided adhesive layer 100 comprises a first substrate layer and a first adhesive layer, the first surface of the molded graphene heat dissipation layer 200 is bonded to the first adhesive layer, the molded double-sided adhesive strip 300 comprises a second substrate layer, a second adhesive layer and a third adhesive layer, the second adhesive layer and the third adhesive layer are respectively bonded to the two surfaces of the second substrate layer. The second adhesive layer is bonded to the first adhesive layer, a gap is left between the molded double-sided adhesive strip 300 and the molded graphene heat dissipation layer 200, the molded double-sided adhesive layer 400 includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, the fourth adhesive layer and the fifth adhesive layer are respectively connected to the two sides of the third substrate layer, the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer 200, and the fifth adhesive layer is provided with a glue-free hinge area 401.

[0039] It should be noted that by providing a molded double-sided adhesive strip 300 structure, a reinforced edging structure is formed on the outside of the molded graphene heat dissipation layer 200, thereby increasing the width of the edging structure and strengthening the mechanical strength of the edging structure, thereby greatly improving the structural stability of the edging structure, thereby greatly improving the waterproof performance, avoiding the occurrence of edging stratification, thereby avoiding damage to the molded graphene heat dissipation layer 200, ensuring the heat dissipation performance of the molded graphene heat dissipation layer 200, and improving the overall structural stability of the graphene heat dissipation structure and the overall service life of the finished product. High quality.

[0040] For an implementation method, please refer to Figure 2 and Figure 3 The graphene heat dissipation structure further includes a first release film 500, which is connected to a side of the first substrate layer away from the first adhesive layer. It can be understood that the release film structure can protect the product of the graphene heat dissipation structure and prevent dust from contaminating the finished product of the graphene heat dissipation structure.

[0041] For an implementation method, please refer to Figure 2 and Figure 3The graphene heat dissipation structure further includes a molded foam adhesive 600, which is disposed in the glue-free hinge area 401 and bonded to the third substrate layer. It can be understood that the molded foam adhesive 600 is in the shape of a strip, and a plurality of molded foam adhesives 600 can be provided, which are spaced apart and attached to the third substrate layer. Each molded foam adhesive 600 can be used as a reinforcing rib structure to improve the mechanical strength of the glue-free hinge area 401, and avoid the damage of the glue-free hinge area of ​​the graphene heat dissipation layer after multiple bending, which is conducive to further improving the overall structural stability and finished product quality of the graphene heat dissipation structure and improves the service life.

[0042] In one embodiment, the graphene heat dissipation structure further includes a molded second release film (not shown), which is attached to the fifth adhesive layer and the molded foam adhesive 600. It can be understood that by providing the molded second release film, the graphene heat dissipation structure can be protected from the other side and dust-proof, thereby preventing the finished graphene heat dissipation structure from being contaminated.

[0043] In one embodiment, please refer to 5, the molded double-sided adhesive strip 300 is provided with a connection edging area 301 and a hinge edging area 302, and the width of the hinge edging area 302 is greater than the width of the connection edging area 301. It can be understood that the molded double-sided adhesive strip 300 is set as the hinge edging area 302 corresponding to the hinge area of ​​the graphene heat dissipation structure, and the other areas are set as the connection edging area 301. Since the hinge area of ​​the graphene heat dissipation structure is the hinge area installed on the folding screen mobile phone, it is subject to many bends. By setting the width of the hinge edging area 302 to be greater than the width of the connection edging area 301, a wider edging structure can be formed at the hinge part of the graphene heat dissipation structure, further increasing the adhesive area of ​​the edging structure of the hinge part, thereby further ensuring the structural stability of the edging, not easy to delaminate, and further improving the waterproof performance, thereby improving the overall performance and quality of the graphene heat dissipation structure.

[0044] For an implementation method, please refer to Figure 5The hinge edge area of ​​the molded double-sided adhesive strip 300 is provided with an avoidance groove 303, and the width of the avoidance groove 303 is 0.4mm~0.6mm. It can be understood that by providing an avoidance groove 303 on a layer of the molded double-sided adhesive strip 300 away from the graphene heat dissipation layer, and the width of the avoidance groove 303 is 0.4mm~0.6mm, specifically, in the operation of die-cutting the first double-sided adhesive, the avoidance groove structure can be designed and die-cut simultaneously to avoid adding process steps and affecting production efficiency. In this way, avoidance structures can be formed on both sides of the molded double-sided adhesive strip 300. When the graphene heat dissipation structure is in a high temperature environment, the second adhesive layer and the third adhesive layer of the molded double-sided adhesive strip 300 have an increased expansion volume. By providing the avoidance groove 303, an avoidance effect can be achieved, which is conducive to the deformation of the molded double-sided adhesive strip 300 toward the avoidance groove 303, avoiding the situation of squeezing the graphene heat dissipation layer, thereby further protecting the graphene heat dissipation layer, improving the overall heat resistance and finished product quality of the graphene heat dissipation structure, and having good practicality.

[0045] Compared with the prior art, the present invention has at least the following advantages: The preparation method of the graphene heat dissipation structure is to obtain a molded single-sided adhesive layer, a molded graphene heat dissipation layer, a molded double-sided adhesive strip and a molded double-sided adhesive layer of corresponding shapes by die-cutting the single-sided adhesive, the graphene heat dissipation layer, the first double-sided adhesive and the second double-sided adhesive respectively, and then sequentially laminate them to obtain the graphene heat dissipation structure through a pasting and laminating process. The preparation process is simple, and each material layer can be die-cut and formed simultaneously, which is conducive to improving production efficiency. At the same time, by providing a molded double-sided adhesive strip, the molded double-sided adhesive strip is a frame strip structure, which is pasted and laminated to the outside of the graphene heat dissipation layer and is close to the graphene heat dissipation layer. A certain gap is left between the thermal layers, so that when the molded double-sided adhesive layer is attached to the second side of the graphene heat dissipation layer and the molded double-sided adhesive strip, it can be bonded to the molded double-sided adhesive strip to form a reinforced edging structure on the outside of the graphene heat dissipation layer, thereby increasing the width of the edging structure and strengthening the mechanical strength of the edging structure, greatly improving the structural stability of the edging structure, thereby greatly improving the waterproof performance, avoiding the occurrence of edging stratification, thereby avoiding damage to the graphene heat dissipation layer, ensuring the heat dissipation performance of the graphene heat dissipation layer, and improving the overall structural stability and overall service life of the graphene heat dissipation structure.

[0046] The following is a specific embodiment of the preparation process of the graphene heat dissipation structure 10. Example 1

[0047] Providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer; Providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and laminating the molded graphene heat dissipation layer on the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer; Providing a first double-sided adhesive tape, performing a die-cutting operation on the first double-sided adhesive tape to obtain a molded double-sided adhesive tape, wherein the molded double-sided adhesive tape comprises a second substrate layer, a second adhesive layer and a third adhesive layer, wherein the second adhesive layer and the third adhesive layer are respectively connected to two sides of the second substrate layer, and the molded double-sided adhesive tape is attached to the first adhesive layer so that the second adhesive layer is bonded to the first adhesive layer, and a gap is left between the molded double-sided adhesive tape and the graphene heat dissipation layer; A second double-sided adhesive tape is provided, and a die-cutting operation is performed on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is attached to the molded double-sided adhesive strip and the molded graphene heat dissipation layer so that the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded so that the third substrate layer is partially exposed to form a glue-free hinge area, thereby obtaining the graphene heat dissipation structure of Example 1.

[0048] Example 2 Providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer; Providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and laminating the molded graphene heat dissipation layer on the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer; Providing a first double-sided adhesive tape, performing a die-cutting operation on the first double-sided adhesive tape to obtain a molded double-sided adhesive tape, wherein the molded double-sided adhesive tape comprises a second substrate layer, a second adhesive layer and a third adhesive layer, wherein the second adhesive layer and the third adhesive layer are respectively connected to two sides of the second substrate layer, and the molded double-sided adhesive tape is attached to the first adhesive layer so that the second adhesive layer is bonded to the first adhesive layer, and a gap is left between the molded double-sided adhesive tape and the graphene heat dissipation layer; Providing a second double-sided adhesive tape, performing a die-cutting operation on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer comprises a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is attached to the molded double-sided adhesive tape and the molded graphene heat dissipation layer, so that the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded to partially expose the third substrate layer to form a glue-free hinge area; Providing foam adhesive, performing die-cutting operation on the foam adhesive to obtain shaped foam adhesive, and attaching the shaped foam adhesive to the adhesive-free hinge area so that the shaped foam adhesive is bonded to the third substrate layer to obtain the graphene heat dissipation structure of Example 2.

[0049] Comparative Example 1 Providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer; Providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and laminating the molded graphene heat dissipation layer on the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer; A second double-sided adhesive tape is provided, and a die-cutting operation is performed on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is laminated on the molded graphene heat dissipation layer so that the fourth adhesive layer is bonded to the first adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded so that the third substrate layer is partially exposed to form a glue-free hinge area, thereby obtaining the graphene heat dissipation structure of comparative example 1.

[0050] In the above embodiments, according to the production design shape requirements, the material is die-cut by a circular knife mold, and the single-sided tape, graphene heat dissipation layer, first double-sided tape and second double-sided tape used in each embodiment and comparative example are respectively the same roll of material to ensure that the materials of each material are the same. The finished graphene heat dissipation structures prepared in Example 1, Example 2 and Comparative Example 1 are folded 5000 times, respectively, and then the folded finished graphene heat dissipation structures prepared in Example 1, Example 2 and Comparative Example 1 are respectively put into red ink, soaked and left to stand at room temperature (25°C) and high temperature (60°C) for 10 hours, and the waterproof performance test is carried out. After the test is completed, the graphene heat dissipation structure is cut open to check the internal graphene dyeing. The specific test results are shown in Table 1.

[0051] Table 1 Waterproof performance test results

[0052] It can be seen from the above table that, relative to the graphene heat dissipation structure of comparative example 1, the graphene heat dissipation structures prepared in Examples 1~2 all have excellent waterproof performance, good structural stability, and are not prone to stratification, thereby effectively preventing the molded graphene heat dissipation layer from being damaged by external water bodies. The graphene heat dissipation structure has a more stable structure and a longer service life. The quality of the graphene heat dissipation structures prepared in Examples 1~2 is higher than that in comparative example 1. The above embodiments have simple preparation processes, which improve the waterproof performance of the graphene heat dissipation structure, thereby improving the service life of the graphene heat dissipation structure and the quality of the finished graphene heat dissipation structure, and are suitable for industrial production.

[0053] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a graphene heat dissipation structure, characterized in that: The following steps are involved: Providing a single-sided adhesive tape, and performing a die-cutting operation on the single-sided adhesive tape to obtain a molded single-sided adhesive layer, wherein the molded single-sided adhesive layer includes a first substrate layer and a first adhesive layer; Providing a graphene heat dissipation layer, performing a die-cutting operation on the graphene heat dissipation layer to obtain a molded graphene heat dissipation layer, and laminating the molded graphene heat dissipation layer on the first adhesive layer so that the first surface of the molded graphene heat dissipation layer is bonded to the first adhesive layer; Providing a first double-sided adhesive tape, performing a die-cutting operation on the first double-sided adhesive tape to obtain a molded double-sided adhesive tape, wherein the molded double-sided adhesive tape comprises a second substrate layer, a second adhesive layer and a third adhesive layer, wherein the second adhesive layer and the third adhesive layer are respectively connected to two sides of the second substrate layer, and the molded double-sided adhesive tape is attached to the first adhesive layer so that the second adhesive layer is bonded to the first adhesive layer, and a gap is left between the molded double-sided adhesive tape and the graphene heat dissipation layer; A second double-sided adhesive tape is provided, and a die-cutting operation is performed on the second double-sided adhesive tape to obtain a molded double-sided adhesive layer, wherein the molded double-sided adhesive layer includes a third substrate layer, a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer and the fifth adhesive layer are respectively connected to two sides of the third substrate layer, and the molded double-sided adhesive layer is attached to the molded double-sided adhesive strip and the molded graphene heat dissipation layer, so that the fourth adhesive layer is bonded to the third adhesive layer and the second side of the molded graphene heat dissipation layer, and then the fifth adhesive layer is debonded to partially expose the third substrate layer, thereby forming a glue-free hinge area, and obtaining a graphene heat dissipation structure.

2. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: After the operation of obtaining the molded single-sided adhesive layer, a first release film is provided, the first release film is die-cut to obtain a molded first release film, and the molded first release film is laminated onto the first substrate layer.

3. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: After the fifth adhesive layer is debonded to expose part of the third substrate layer to form a glue-free hinge area, foam glue is provided, and the foam glue is die-cut to obtain shaped foam glue, and the shaped foam glue is adhered to the glue-free hinge area to bond the shaped foam glue to the third substrate layer.

4. The method for preparing the graphene heat dissipation structure according to claim 3, characterized in that: After the operation of laminating the molded foam adhesive pair to the glue-free hinge area so that the molded foam adhesive is bonded to the third substrate layer, a second release film is provided, and the second release film is die-cut to obtain a molded second release film, and the molded second release film pair is laminating to the fifth adhesive layer and the molded foam adhesive.

5. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: The molded double-sided adhesive strip is provided with a connecting edging area and a hinge edging area, and the width of the hinge edging area is greater than the width of the connecting edging area.

6. The method for preparing the graphene heat dissipation structure according to claim 5, characterized in that: The width of the hinge edging area is 2.1 mm to 2.5 mm, and the width of the connection edging area is 1.1 mm to 1.5 mm.

7. The method for preparing the graphene heat dissipation structure according to claim 5, characterized in that: The hinge edge area of ​​the molded double-sided adhesive strip is provided with an avoidance groove, and the width of the avoidance groove is 0.4mm~0.6mm.

8. The method for preparing a graphene heat dissipation structure according to any one of claims 1 to 7, characterized in that: The thickness of the molded double-sided adhesive strip is greater than the thickness of the graphene heat dissipation layer.

9. The method for preparing a graphene heat dissipation structure according to any one of claims 1 to 7, characterized in that: The width of the gap between the molded double-sided adhesive strip and the graphene heat dissipation layer is 0.2 mm to 0.4 mm.

10. A graphene heat dissipation structure, characterized in that: The graphene heat dissipation structure is made by the preparation method of any one of claims 1 to 9.

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