Lead positioning device and assembly method for organic film capacitor processing

Abstract

The present invention discloses a lead positioning device for processing an organic film capacitor. The organic film capacitor includes a capacitor housing, a capacitor core group and a lead. The lead positioning device includes a first positioning tool body, a second positioning tool body and a positioning plug plate. The first positioning tool body is provided with a first vertical through hole. Positions other than the two ends of the first vertical through hole are respectively provided with sinking platforms. The upper part of the two sinking platforms jointly forms a housing installation space. The sinking platforms are provided with lead limiting through holes. The side walls of the first vertical through hole are provided with plug plate through holes. The second positioning tool body is provided with a second vertical through hole. The positioning plug plate passes through the two plug plate through holes. The second positioning tool body is placed above the positioning plug plate. The present invention can achieve high-precision positioning of the lead by designing the first positioning tool body, the second positioning tool body and the positioning plug plate that cooperate with each other, and the lead does not need to be bent, so as to better protect the lead.

Description

Technical Field

[0001] The invention relates to an organic film capacitor processing device, and in particular to a lead positioning device and an assembling method for processing an organic film capacitor. Background Art

[0002] Organic film capacitors are widely used in various power electronic circuits. For lead-inserted products, the lead spacing and the distance between the lead and the edge of the shell will affect whether the product can be properly installed on the PCB board. If the dimensional tolerance of the product lead position is not properly controlled and the deviation is too large, the product will not be able to be plugged into the board.

[0003] The leads of organic film capacitors are mainly spot-welded to the electrodes of the capacitor core group inside the capacitor. The leads and the capacitor core group form a relatively fixed positional relationship. Therefore, the lead spacing is mainly affected by the length of the capacitor core group and the lead welding position, while the distance between the leads and the edge of the capacitor casing is mainly affected by the position and distance between the capacitor core group and the capacitor casing.

[0004] Since the leads eventually extend out of the product body, the lead spacing and the distance between the leads and the edge of the capacitor casing that are actually assessed are actually the spacing of the leads that are finally exposed outside the product and the distance between them and the edge of the capacitor casing. This spacing and distance will be affected by the assembly position of the capacitor core group in the capacitor casing and the position offset of the capacitor core group during the subsequent potting operation.

[0005] The traditional lead positioning method is actually a correction method, that is, the lead position is not accurately positioned in the first half of the lead welding and pouring, but relies on the correction of the lead before the last pouring (surface filling) to make the lead position meet the tolerance requirements. The specific method is: after the capacitor core group (leads have been welded) is installed in the capacitor shell and poured with a certain height of potting material (after solidification), a correction block with lead perforations that can be embedded in the capacitor shell is inserted into the part of the upper part of the product that has not been poured, and the lead is bent through the through hole on the correction block to make its position meet the requirements of the product lead spacing and the distance between the lead and the edge of the capacitor shell; then, the correction block is removed from the product, and the remaining part of the upper part of the product is filled with potting material.

[0006] The above-mentioned traditional lead positioning method has the following defects:

[0007] (1) The lead wire is bent and corrected by a correction block, which may cause a certain degree of damage to the lead wire during the correction process;

[0008] (2) After the lead is calibrated, the lead position is not positioned again. The lead position may shift during subsequent operations such as injection and curing, thus affecting the final effect of the calibration. The lead position deviation that can be achieved by the calibration fluctuates greatly, and the product lead position size exceeds the tolerance frequently, resulting in a high scrap rate.

[0009] (3) The lead position is not positioned during lead welding and capacitor core assembly, and mainly relies on later correction. When the lead position deviation is too large and the space size of the lead bending is limited, this correction method will be difficult to achieve the purpose, resulting in a large number of lead size deviations;

[0010] (4) The lead correction is performed at the end of the pouring process. The entire pouring process is discontinuous. Multiple pouring may cause interfaces to appear inside the potting material (different curing times), which will have an adverse effect on the potting effect. In addition, the production efficiency of this operation will also be reduced. Summary of the invention

[0011] The object of the present invention is to provide a lead positioning device and an assembly method for processing an organic film capacitor in order to solve the above-mentioned problem. The device and the method have high positioning accuracy for the lead and will not damage the lead.

[0012] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0013] A lead positioning device for processing an organic film capacitor, the organic film capacitor comprising a capacitor housing, a capacitor core group and a lead, the lead positioning device for processing an organic film capacitor comprising a first positioning tool body, a second positioning tool body and a positioning plug plate, the first positioning tool body is a rectangular parallelepiped and its transverse long side direction is set as the X direction and the transverse wide side direction is set as the Y direction, the first positioning tool body is provided with a first vertical through hole, the first positioning tool body is provided with a sinking platform at positions other than the two ends of the first vertical through hole in the X direction, the upper part of the two sinking platforms jointly forms a shell installation space for installing the capacitor shell, the sinking platform is provided with a vertical and for For the lead limiting through hole for limiting the lead, the first vertical through hole is respectively provided with a plug-in plate through hole for the horizontal positioning plug-in plate to pass through on the side walls on both sides of the Y direction, and the upper hole wall of the plug-in plate through hole is higher than the surface of the sinking platform; the second positioning tool body is a rectangular parallelepiped and is placed in the shell installation space, the second positioning tool body is provided with a second vertical through hole for installing the capacitor core group, the second vertical through hole is provided with vertical limiting grooves for limiting the lead on the hole walls at both ends in the X direction, the positioning plug-in plate passes through two of the plug-in plate through holes, the second positioning tool body is placed above the positioning plug-in plate, and the two limiting grooves respectively correspond to the two lead limiting through holes.

[0014] Preferably, in order to facilitate the operation of the second positioning tool body, the first positioning tool body is provided with notches at both ends in the X direction, and the second positioning tool body is provided with handles extending outward at both ends in the X direction, and the two handles pass through the two notches respectively and are located above the two sinking platforms.

[0015] Preferably, in order to guide the lead so as to facilitate quick installation of the lead, the first positioning tool body is provided with downwardly extending positioning columns at the lower parts of both ends of the X-direction, and one side surface of the positioning column is provided with a vertical guide groove for guiding the lead, and the guide groove corresponds to and is connected with the lead limiting through hole.

[0016] Preferably, in order to facilitate rapid installation of the second positioning fixture body and the capacitor housing, vertical expansion holes are respectively provided on the first positioning fixture body at the four corners of the housing installation space.

[0017] Preferably, in order to achieve a better limiting function for the capacitor core group, the vertical height of the side plates of the second positioning tool body on both sides in the Y direction is higher than the height of the side plates at both ends in the X direction.

[0018] Preferably, in order to prevent the positioning plug plate from falling, a blocking bar for blocking the positioning plug plate from passing through the plug plate through hole is provided at one end of the positioning plug plate.

[0019] Preferably, in order to ensure strength and reduce weight, the first positioning fixture body, the second positioning fixture body and the positioning plug plate are all made of aluminum alloy.

[0020] A method for assembling an organic film capacitor using the lead positioning device comprises the following steps:

[0021] Step 1: Pass the positioning plug plate through the two plug plate through holes;

[0022] Step 2: placing the second positioning tool body in the housing installation space, with the bottom surface of the second positioning tool body being in contact with the upper surface of the positioning plug plate;

[0023] Step 3, embedding the capacitor core group into the second vertical through hole of the second positioning tool body, so that the end surface of the capacitor core group close to the open end of the capacitor housing faces downward and fits with the upper surface of the positioning plug plate;

[0024] Step 4, pass the two leads through the two lead limiting through holes of the first positioning tool body from bottom to top, so that the upper ends of the leads correspond to the lead welding positions on the outer walls of the two ends of the capacitor core group; in this step, in order to better temporarily fix the leads, the leads can be temporarily fixed by clamping with a rubber cushion or by hand support to assist in spot welding;

[0025] Step 5, placing the entire lead positioning device, the capacitor core group and the lead on a spot welding workbench, performing spot welding operations, and spot welding the lead at both ends of the capacitor core group;

[0026] Step 6, removing the second positioning fixture body from the first positioning fixture body, and removing the positioning plug plate from the plug plate through hole;

[0027] Step 7, sleeve the capacitor shell outside the capacitor core group and embed it into the shell installation inner cavity of the first positioning tool body, so that the open end surface of the capacitor shell faces downward and fits with the upper surface of the sinking platform;

[0028] Step 8, inverting the first positioning tool body, the capacitor core group, the capacitor housing and the lead wires together, so that the bottom surface of the capacitor housing is placed on a flat table;

[0029] Step 9, pouring sealant into the capacitor housing through the first vertical through hole of the first positioning tool body;

[0030] Step 10: After potting is completed and solidified, the first positioning tool body is separated from the organic film capacitor to complete the assembly of the organic film capacitor.

[0031] The beneficial effects of the present invention are:

[0032] The present invention can realize high-precision positioning of the lead wire by designing the first positioning tool body, the second positioning tool body and the positioning plug plate that cooperate with each other, and does not need to bend the lead wire, thereby better protecting the lead wire; more specific advantages are as follows:

[0033] The lead wire can be positioned throughout the entire process of spot welding and product potting, so the lead wire positioning accuracy is high, and the tolerance range of the lead wire spacing and the distance from the edge of the capacitor shell can be controlled within 0.1mm, which can completely solve the lead wire size out-of-tolerance problems such as lead wire spacing and lead position offset, and the qualified rate of lead wire size can reach 100%;

[0034] When positioning the lead, the bending correction of the lead is avoided, thereby avoiding possible damage to the lead and effectively protecting the lead;

[0035] During the potting process, the lead wire is fixed so that the position of the capacitor core group rigidly connected to the lead wire is fixed, and a certain distance is maintained between the lead wire and the inner wall of the surrounding side, the inner bottom surface and the upper opening end of the capacitor shell to avoid being close to the inner wall of the capacitor shell, which is very conducive to the filling of the potting material and the full wrapping of the capacitor core group, and can greatly improve the potting quality of the product;

[0036] The step of correcting the lead during the potting process is avoided, so that the potting process can be carried out continuously, the production cycle is shortened, and the potting interface that may be formed due to multiple potting is also avoided, which is beneficial to improving the potting effect of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional diagram of the first positioning tool body of the lead positioning device for processing organic thin film capacitors according to the present invention;

[0038] Figure 2 It is a three-dimensional diagram of the second positioning tool body of the lead positioning device for processing organic thin film capacitors according to the present invention;

[0039] Figure 3 It is a three-dimensional diagram of a positioning plug board of the lead positioning device for processing organic thin film capacitors according to the present invention;

[0040] Figure 4 This is one of the three-dimensional diagrams of the lead positioning device for processing organic thin film capacitors according to the present invention when in use;

[0041] Figure 5 This is the second stereoscopic diagram of the lead positioning device for processing organic thin film capacitors according to the present invention when in use. DETAILED DESCRIPTION

[0042] The present invention will be further described below in conjunction with the accompanying drawings:

[0043] like Figure 1-Figure 5As shown, the organic film capacitor of the present invention comprises a capacitor housing 6, a capacitor core group 4 and a lead 5. The lead positioning device for processing an organic film capacitor of the present invention comprises a first positioning tool body 1, a second positioning tool body 2 and a positioning plug plate 3. The first positioning tool body 1 is a rectangular parallelepiped and its transverse long side direction is set as the X direction and the transverse wide side direction is set as the Y direction. The first positioning tool body 1 is provided with a first vertical through hole 14. The first positioning tool body 1 is provided with sinking platforms 11 at positions other than the two ends of the first vertical through hole 14 in the X direction. The upper parts of the two sinking platforms 11 jointly form a shell installation space for installing the capacitor housing 6 (not shown in the figure). The sinking platform 11 is provided with a vertical and A lead limiting through hole 13 is used to limit the lead 5, and the first vertical through hole 14 is respectively provided with a plug-in plate through hole 10 for the horizontal positioning plug-in plate 3 to pass through on the side walls on both sides of the Y direction, and the upper hole wall of the plug-in plate through hole 10 is higher than the surface of the sinking platform 11; the second positioning tool body 2 is a rectangular parallelepiped and is placed in the shell installation space, and the second positioning tool body 2 is provided with a second vertical through hole 24 for installing the capacitor core group 4, and the second vertical through hole 24 is provided with vertical limiting grooves 22 for limiting the lead 5 on the hole walls at both ends in the X direction, the positioning plug-in plate 3 passes through the two plug-in plate through holes 10, and the second positioning tool body 2 is placed above the positioning plug-in plate 3, and the two limiting grooves 22 correspond to the two lead limiting through holes 13 respectively.

[0044] like Figure 1-Figure 5 As shown, the present invention also discloses the following multiple more optimized specific structures. According to actual needs, the above structure can be superimposed and combined with one or more of the following structures to form a more optimized technical solution.

[0045] In order to facilitate the operation of the second positioning tool body 2, the first positioning tool body 1 is provided with notches 12 at both ends in the X direction, and the second positioning tool body 2 is provided with outwardly extending handles 21 at both ends in the X direction. The two handles 21 pass through the two notches 12 respectively and are located above the two sinking platforms 11.

[0046] In order to guide the lead 5 so as to facilitate quick installation of the lead 5, the first positioning tool body 1 is provided with downwardly extending positioning columns 16 at the lower parts of both ends in the X direction, and a side surface of the positioning column 16 is provided with a vertical guide groove 15 for guiding the lead 5, and the guide groove 15 corresponds to and is connected with the lead limiting through hole 13.

[0047] In order to facilitate the rapid installation of the second positioning fixture body 2 and the capacitor housing 6 , vertical expansion holes 17 are respectively provided on the first positioning fixture body 1 at the four corners of the housing installation space.

[0048] In order to achieve a better limiting function for the capacitor core group 4 , the vertical height of the side plates 23 on both sides of the second positioning tool body 2 in the Y direction is higher than the height of the side plates at both ends in the X direction, and a "U"-shaped gap 20 is formed between the two ends of the two side plates 23 .

[0049] In order to prevent the positioning plug board 3 from falling, a blocking bar 30 for blocking the positioning plug board 3 from passing through the plug board through hole 10 is provided at one end of the positioning plug board 3 .

[0050] In order to ensure strength and reduce weight, the first positioning fixture body 1, the second positioning fixture body 2 and the positioning plug plate 3 are all made of aluminum alloy.

[0051] like Figure 1-Figure 5 As shown, the method for assembling an organic thin film capacitor using the lead positioning device of the present invention comprises the following steps:

[0052] Step 1, pass the positioning plug plate 3 through the two plug plate through holes 10;

[0053] Step 2: placing the second positioning fixture body 2 in the housing installation space, with the bottom surface of the second positioning fixture body 2 being in contact with the upper surface of the positioning plug plate 3;

[0054] Step 3, embed the capacitor core group 4 into the second vertical through hole 24 of the second positioning fixture body 2, so that the end surface of the capacitor core group 4 close to the open end of the capacitor housing 6 faces downward and fits with the upper surface of the positioning plug plate 3;

[0055] Step 4: Pass the two leads 5 through the two lead limiting through holes 13 of the first positioning tool body 1 from bottom to top, so that the upper ends of the leads 5 correspond to the lead welding positions on the outer walls of the two ends of the capacitor core group 4; clamp the leads 5 and the positioning columns 16 with a clip with a rubber cushion;

[0056] Step 5: Place the entire lead positioning device, the capacitor core group 4 and the lead 5 on a spot welding workbench (not shown) and perform spot welding to spot weld the lead 5 at both ends of the capacitor core group 4. Figure 4 As shown;

[0057] Step 6: Remove the second positioning fixture body 2 from the first positioning fixture body 1, and remove the positioning plug plate 3 from the plug plate through hole 10;

[0058] Step 7, put the capacitor housing 6 on the outside of the capacitor core group 4 and embed it into the housing installation inner cavity of the first positioning tool body 1, so that the open end surface of the capacitor housing 6 faces downward and fits with the upper surface of the sinking platform 11;

[0059] Step 8: Invert the first positioning tool body 1, the capacitor core group 4, the capacitor housing 6 and the lead wire 5 together, so that the bottom surface of the capacitor housing 6 is placed on a flat table (not shown in the figure), as shown in FIG. Figure 5 As shown;

[0060] Step 9, pouring sealant into the capacitor housing 6 through the first vertical through hole 14 of the first positioning tool body 1;

[0061] Step 10: After potting is completed and solidified, the first positioning tool body 1 is separated from the organic film capacitor composed of the capacitor core group 4, the capacitor housing 6 and the lead 5 to complete the assembly of the organic film capacitor.

[0062] The above embodiments are only preferred embodiments of the present invention and are not limitations of the technical solutions of the present invention. Any technical solution that can be implemented on the basis of the above embodiments without creative work should be deemed to fall within the scope of protection of the patent of the present invention.

Claims

1. A lead positioning device for processing an organic film capacitor, the organic film capacitor comprising a capacitor housing, a capacitor core group and a lead, characterized in that: The lead positioning device for processing organic film capacitors includes a first positioning tool body, a second positioning tool body and a positioning plug plate. The first positioning tool body is a rectangular parallelepiped and its transverse long side direction is set as the X direction and its transverse wide side direction is set as the Y direction. The first positioning tool body is provided with a first vertical through hole. The end walls of the first positioning tool body at both ends of the first vertical through hole in the X direction are respectively provided with sinking platforms. The upper part of the two sinking platforms jointly forms a shell installation space for installing the capacitor shell. The sinking platform is provided with a vertical lead limiting through hole for limiting the lead. The first vertical through hole is provided with a plug plate through hole on both sides of the Y direction for the transverse positioning plug plate to pass through. The upper hole wall of the plug plate through hole is higher than the surface of the sinking platform. The mounting body is in the shape of a rectangular parallelepiped and is placed in the shell installation space, the second positioning tool body is provided with a second vertical through hole for installing the capacitor core group, the second vertical through hole is provided with vertical limiting grooves for limiting the lead on the hole walls at both ends in the X direction, the positioning plug plate passes through the two plug plate through holes, the second positioning tool body is placed above the positioning plug plate, and the two limiting grooves correspond to the two lead limiting through holes respectively; the first positioning tool body is provided with downwardly extending positioning columns at the lower parts of the two ends in the X direction, and a side surface of the positioning column is provided with a vertical guide groove for guiding the lead, and the guide groove corresponds to and communicates with the lead limiting through hole; the first positioning tool body is provided with vertical expansion holes at the positions of the four corners of the cavity wall of the shell installation space.

2. The lead positioning device for processing organic thin film capacitors according to claim 1, characterized in that: The first positioning fixture body is provided with notches at both ends in the X direction, and the second positioning fixture body is provided with handles extending outward at both ends in the X direction. The two handles pass through the two notches respectively and are located above the two sinking platforms.

3. The lead positioning device for processing organic thin film capacitors according to claim 1 or 2, characterized in that: The vertical heights of the side plates on both sides of the second positioning tool body in the Y direction are higher than the heights of the side plates at both ends in the X direction.

4. The lead positioning device for processing organic thin film capacitors according to claim 1 or 2, characterized in that: One end of the positioning plug plate is provided with a blocking bar used to block the positioning plug plate from passing through the plug plate through hole.

5. The lead positioning device for processing organic thin film capacitors according to claim 1 or 2, characterized in that: The first positioning fixture body, the second positioning fixture body and the positioning plug plate are all made of aluminum alloy.

6. A method for assembling an organic thin film capacitor using the lead positioning device according to claim 1, characterized in that: The following steps are involved: Step 1: Pass the positioning plug plate through the two plug plate through holes; Step 2: placing the second positioning tool body in the housing installation space, with the bottom surface of the second positioning tool body being in contact with the upper surface of the positioning plug plate; Step 3, embedding the capacitor core group into the second vertical through hole of the second positioning tool body, so that the end surface of the capacitor core group close to the open end of the capacitor housing faces downward and fits with the upper surface of the positioning plug plate; Step 4, passing the two leads through the two lead limiting through holes of the first positioning tool body from bottom to top, respectively, so that the upper ends of the leads correspond to the lead welding positions on the outer walls of both ends of the capacitor core group; Step 5, placing the entire lead positioning device, the capacitor core group and the lead on a spot welding workbench, performing spot welding operations, and spot welding the lead at both ends of the capacitor core group; Step 6, removing the second positioning fixture body from the first positioning fixture body, and removing the positioning plug plate from the plug plate through hole; Step 7, sleeve the capacitor shell outside the capacitor core group and embed it into the shell installation inner cavity of the first positioning tool body, so that the open end surface of the capacitor shell faces downward and fits with the upper surface of the sinking platform; Step 8, inverting the first positioning tool body, the capacitor core group, the capacitor housing and the lead wires together, so that the bottom surface of the capacitor housing is placed on a flat table; Step 9, pouring sealant into the capacitor housing through the first vertical through hole of the first positioning tool body; Step 10: After potting is completed and solidified, the first positioning tool body is separated from the organic film capacitor to complete the assembly of the organic film capacitor.

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