Display panel and method for manufacturing display panel
By setting through the substrate openings in the display panel and filling a low-modulus elastic layer, combined with the connection lines and film layer design of the same material, the problem of flexible tensile display technology requiring high stress deformation in wearable devices is solved, the effect of small stress and large deformation is achieved, and the tensile performance and reliability of the display panel are improved.
Patent Information
- Application Number
- CN202111667824.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-31
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2041-12-31
AI Technical Summary
The existing flexible stretchable display technology requires greater stress in wearable devices to produce smaller deformation, affecting its application effect.
An opening through the flexible substrate is provided in the display panel, and a first elastic layer with a small elastic modulus is filled with, combined with the second elastic layer covering the stretched area, ensuring that the connecting line and the film layer are composed of the same or similar materials, and avoiding signal line breakage caused by mismatch of elastic modulus.
It realizes greater deformation of the display panel under smaller stress, improves the application performance of flexible stretchable display technology, and ensures the reliability and packaging effect of the connecting wire.
Smart Images

Figure CN114361224B_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a method for manufacturing the display panel. Background Art
[0002] Flexible stretchable display technology can realize the stretchable deformation display of display devices in three dimensions: horizontal, longitudinal and vertical directions, and has broad application prospects in wearable display products. The display area of the display panel can be composed of pixel island areas and stretching areas located between the pixel island areas. Summary of the Invention
[0003] The purpose of the embodiments of the present invention is to provide a display panel and a method for preparing a display panel, which can achieve flexible stretching of the display panel by applying only a small stress under the same degree of deformation conditions, which is conducive to the application of flexible stretchable display technology in the wearable field.
[0004] To solve the above technical problems, an embodiment of the present invention provides a display panel, which is provided with multiple pixel island areas and a stretching area located between adjacent pixel island areas; the display panel includes: a flexible substrate and a pixel circuit film layer covering the pixel island areas, and a first elastic layer and a connecting line covering the stretching area; the flexible substrate is provided with an opening penetrating the flexible substrate in the stretching area, and at least a portion of the first elastic layer is filled in the opening of the flexible substrate; the elastic modulus of the first elastic layer is smaller than the elastic modulus of the flexible substrate; the pixel circuit film layer and the connecting line are located on the same side of the flexible substrate, and the pixel circuit film layers covering the multiple pixel island areas are electrically connected via the connecting line.
[0005] The display panel also includes a second elastic layer covering the pixel islands and stretchable areas. The second elastic layer is located on the side of the pixel circuit film layer away from the flexible substrate, and the connecting wires are located between the first and second elastic layers. The elastic modulus of the second elastic layer is lower than that of the flexible substrate. In this solution, the second elastic material encapsulates the pixel islands and stretchable areas of the display panel, protecting the connecting wires from water and oxygen corrosion, ensuring the encapsulation of the display panel. Furthermore, since the second elastic layer is also formed from an elastic material, the tensile properties of the entire display panel are improved.
[0006] Preferably, the elastic modulus of the first elastic layer is the same as the elastic modulus of the second elastic layer.
[0007] Preferably, the material of the first elastic layer is the same as that of the second elastic layer.
[0008] The display panel also includes a display structure film layer covering the pixel island region and an encapsulation structure film layer. The display structure film layer is located on the side of the pixel circuit film layer away from the flexible substrate, and the encapsulation structure film layer is located between the display structure film layer and the second elastic layer. In this solution, the encapsulation structure film layer encapsulates at least the pixel island region of the display panel, thereby protecting the organic light-emitting materials in the display structure film layer from water and oxygen corrosion.
[0009] Preferably, the first surface of the first elastic layer, which is adjacent to the connecting wire, is flush with the surface of the packaging structure film layer, which is distal to the flexible substrate. The connecting wire is electrically connected to the pixel circuit film layer via a via that penetrates the packaging structure film layer and the display structure film layer. In this solution, the first surface of the first elastic layer is flush with the surface of the packaging structure film layer, which is distal to the flexible substrate. Thus, when forming the connecting wire on the first elastic layer, the height difference between the first surface of the first elastic layer and the surface of the packaging structure film layer, which is distal to the flexible substrate, prevents the connecting wire from breaking, thereby ensuring the reliability of the connecting wire.
[0010] Preferably, the flexible substrate area does not overlap with the stretching area, the pixel circuit film area does not overlap with the stretching area, the display structure film area does not overlap with the stretching area, and the packaging structure film area does not overlap with the stretching area. In this solution, the flexible substrate, pixel circuit film area, display structure film area, and packaging structure film area are all located outside the stretching area, avoiding cracking of the signal line due to a mismatch in the elastic modulus of the first elastic layer in the stretching area.
[0011] Furthermore, a through-hole is provided on the connecting line, exposing the first elastic layer. The second elastic layer fills the through-hole and contacts the first elastic layer. This solution further relieves stress during display panel deformation by providing a through-hole on the signal line and filling the through-hole with the second elastic layer. Furthermore, the second elastic layer fills the through-hole and contacts the first elastic layer, further strengthening the bonding between the first and second elastic layers.
[0012] In addition, part or all of the orthographic projection of the connecting line on the flexible substrate is located within the opening.
[0013] Preferably, the orthographic projection of the connecting line on the flexible substrate overlaps with the orthographic projection of the first elastic layer on the flexible substrate, and part or all of the overlapping portion is located within the opening.
[0014] Preferably, the second surface of the first elastic layer away from the connecting line is flush with the side of the flexible substrate away from the pixel circuit film layer, and the thickness of the first elastic layer is greater than or equal to the sum of the thickness of the flexible substrate and the pixel circuit film layer.
[0015] An embodiment of the present invention provides a method for preparing a display panel, wherein the display panel is provided with multiple pixel island areas and a stretching area located between adjacent pixel island areas; the method comprises: providing a rigid substrate; forming a flexible substrate on one side of the rigid substrate, the flexible substrate covering the pixel island areas and the stretching area; forming a pixel circuit film layer on a side of the flexible substrate away from the rigid substrate, the pixel circuit film layer covering the pixel island areas; forming an opening penetrating the flexible substrate on the flexible substrate in the stretching area; forming a first elastic layer in the stretching area, at least a portion of the first elastic layer filling the opening; the elastic modulus of the first elastic layer is less than the elastic modulus of the flexible substrate; forming a connecting line on a side of the first elastic layer away from the rigid substrate, the pixel circuit film layers covering the multiple pixel island areas being electrically connected via the connecting line.
[0016] Furthermore, after forming the connecting wires on the side of the first elastic layer away from the rigid substrate, the method further includes forming a second elastic layer in the pixel island region and the stretching region. The second elastic layer is located on the side of the pixel circuit film layer away from the flexible substrate, with the connecting wires located between the first and second elastic layers. The elastic modulus of the second elastic layer is less than that of the flexible substrate. In this solution, the second elastic material encapsulates the pixel island region and the stretching region of the display panel, thereby protecting the connecting wires from water and oxygen corrosion and ensuring the encapsulation effect of the resulting display panel. Furthermore, since the second elastic layer is also formed from an elastic material, it not only ensures the encapsulation effect of the display panel but also improves the stretchability of the resulting display panel.
[0017] Preferably, the elastic modulus of the first elastic layer is the same as the elastic modulus of the second elastic layer;
[0018] Preferably, the material of the first elastic layer is the same as that of the second elastic layer.
[0019] Furthermore, after forming a connecting line on the side of the first elastic layer away from the rigid substrate and before forming the second elastic layer in the pixel island region and the stretching region, the method further includes: creating a through hole in the connecting line, exposing the first elastic layer. In this solution, a through hole is created in the signal line and filled with the second elastic layer to further relieve stress during deformation of the fabricated display panel. The second elastic layer fills the through hole and contacts the first elastic layer, further strengthening the bonding between the first and second elastic layers.
[0020] In addition, after forming the display structure film layer on the side of the pixel circuit film layer away from the flexible substrate, and before forming the second elastic layer in the pixel island region and the stretching region, the method further includes: forming the display structure film layer on the side of the pixel circuit film layer away from the flexible substrate, the display structure film layer covering the pixel island region; forming the encapsulation structure film layer on the side of the display structure film layer away from the pixel circuit film layer, the encapsulation structure film layer covering the pixel island region, and the second elastic layer being located on the side of the encapsulation structure film layer away from the flexible substrate. In this solution, the encapsulation structure film layer encapsulates the pixel island region of the display panel, thereby protecting the organic light-emitting materials and the like in the display structure film layer from water and oxygen corrosion.
[0021] Preferably, part or all of the orthographic projection of the connecting wire on the flexible substrate is located in the opening.
[0022] Preferably, the orthographic projection of the connecting line on the flexible substrate overlaps with the orthographic projection of the first elastic layer on the flexible substrate, and part or all of the overlapping portion is located within the opening.
[0023] Preferably, the flexible substrate and the stretchable region do not overlap, nor do the pixel circuit film layers. Furthermore, the display structure film layers and the packaging structure film layers do not overlap. In this solution, the flexible substrate, pixel circuit film layers, display structure film layers, and packaging structure film layers are all located outside the stretchable region, preventing cracking of the signal lines due to a mismatch in elastic modulus with the first elastic layer in the stretchable region.
[0024] Preferably, the second surface of the first elastic layer away from the connecting line is flush with the side of the flexible substrate away from the pixel circuit film layer, and the thickness of the first elastic layer is greater than or equal to the sum of the thickness of the flexible substrate and the pixel circuit film layer.
[0025] Preferably, the first surface of the first elastic layer proximate to the connecting wire is flush with the surface of the packaging structure film layer distal from the flexible substrate, and the connecting wire is electrically connected to the pixel circuit film layer via a via extending through the packaging structure film layer and the display structure film layer. In this solution, the first surface of the first elastic layer is flush with the surface of the packaging structure film layer distal from the flexible substrate. Thus, when forming the connecting wire on the first elastic layer, the height difference between the first surface of the first elastic layer and the surface of the packaging structure film layer distal from the flexible substrate prevents the connecting wire from breaking, thereby ensuring the reliability of the connecting wire.
[0026] In addition, after forming the second elastic layer in the pixel island region and the stretching region, the method further includes: peeling off the rigid substrate.
[0027] The display panel provided in an embodiment of the present invention is provided with multiple pixel island regions and a stretching region located between adjacent pixel island regions. The display panel includes: a flexible substrate and a pixel circuit film layer covering the pixel island regions, and a first elastic layer and a connecting line covering the stretching region. The flexible substrate is provided with an opening penetrating the flexible substrate in the stretching region, and at least a portion of the first elastic layer is filled in the opening of the flexible substrate. The pixel circuit film layers covering the multiple pixel island regions are electrically connected via the connecting line. Because the flexible substrate is provided with an opening penetrating the flexible substrate in the stretching region and at least a portion of the first elastic layer is filled in the opening of the flexible substrate, the Young's modulus of the first elastic layer is much smaller than the Young's modulus of the flexible substrate (generally formed of a flexible material such as polyimide PI). Therefore, the display panel of this embodiment can produce a large deformation with only a small amount of stress applied, which is conducive to the application of flexible and stretchable display technology in the wearable field. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0029] Figure 1 is a schematic diagram of the division of the display area in an embodiment of the display panel according to the present invention;
[0030] Figure 2 is a schematic diagram of a top view of a display panel according to an embodiment of the display panel of the present invention;
[0031] Figure 3 According to the present invention Figure 2 The cross-sectional view at the position of panel AA' is shown in the middle;
[0032] Figure 4 is a schematic top view of the structure in which a through hole is provided for a connecting line in an embodiment of a display panel according to the present invention;
[0033] Figure 5 According to the present invention Figure 2 The cross-sectional view at the position of panel BB' is shown in the middle;
[0034] Figure 6 is a schematic flow chart of an embodiment of a method for manufacturing a display panel according to the present invention;
[0035] Figure 7 According to the present invention Figure 6 A partial process flow chart of a method for manufacturing a display panel is shown;
[0036] Figure 8is a schematic flow chart of another embodiment of a method for manufacturing a display panel according to the present invention;
[0037] Figure 9 According to the present invention Figure 8 Part of the process flow chart of the method for preparing the display panel is shown. DETAILED DESCRIPTION
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.
[0039] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.
[0040] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, each embodiment of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will appreciate that in each embodiment of the present invention, many technical details are provided to help readers better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.
[0042] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.
[0043] like Figure 1As shown, the display area of the display panel can be composed of a pixel island area 10 and a stretching area 20 located between the pixel island areas 10. Polyimide (PI) and the like are often used as substrate materials for the pixel island areas 10 and the stretching areas 20. Since the Young's modulus of substrate materials such as polyimide materials is relatively large, usually 3 to 4 GPa, a larger stress needs to be applied to produce a smaller deformation, which is not conducive to the application of flexible stretchable display technology in the wearable field.
[0044] Based on the above problems discovered by the inventors, the present invention provides an embodiment of a display panel, which can produce a larger deformation with a smaller stress, which is conducive to the application of flexible and stretchable display technology in the wearable field.
[0045] Combine Figure 2 and Figure 3 As shown, Figure 3 For the Figure 2 In the cross-sectional view taken along line AA, the display panel is provided with a plurality of pixel island regions 10 and a stretching region 20 located between adjacent pixel island regions 10. The display panel includes: a flexible substrate 1 and a pixel circuit film layer 2 covering the pixel island regions 10, and a first elastic layer 61 and a connecting line 200 covering the stretching region 20. The flexible substrate 1 is provided with an opening 60 penetrating the flexible substrate 1 in the stretching region 20, and at least a portion of the first elastic layer 61 is filled in the opening 60 of the flexible substrate 1. The elastic modulus of the first elastic layer 61 is less than the elastic modulus of the flexible substrate 1. The pixel circuit film layers 2 covering the plurality of pixel island regions 10 are electrically connected via the connecting line 200.
[0046] The aforementioned multiple pixel island regions 10 may comprise part or all of the pixel island regions in the display panel. The flexible substrate 1 covering the pixel island regions 10 may include: part or all of the flexible substrate 1 covers part or all of the pixel island regions 10. The pixel circuit film layer 2 covering the pixel island regions 10 may include: part or all of the pixel circuit film layer 2 covers part or all of the pixel island regions 10. The first elastic layer 61 covering the stretch region 20 may include: part or all of the first elastic layer 61 covers part or all of the stretch region 20. The connecting line 200 covering the stretch region 20 may include: part or all of the connecting line 200 covers part or all of the stretch region 20. The flexible substrate 1 having an opening 60 penetrating the stretch region 20 may include: the flexible substrate 1 having one or more openings 60 penetrating the stretch region 20. The region where the opening 60 is located may completely overlap with the stretch region 20, or the region where the opening 60 is located may be located within the stretch region 20. At least a portion of the first elastic layer 61 is filled in the opening 60 of the flexible substrate 1 , which may include: a portion or all of the first elastic layer 61 is filled in a portion or all of the opening 60 .
[0047] Each pixel island region 10 may have a pixel island structure 100, and adjacent pixel island structures 100 are electrically connected via stretchable connecting wires 200. Multiple pixel island regions 10 may be arranged in an array, and the area where the connecting wires 200 are located may be referred to as a bridge area.
[0048] The flexible substrate 1 may comprise a flexible material such as PI. To enhance the substrate's water and oxygen isolation, an inorganic layer 11 may be formed on top of the flexible substrate 1, or multiple alternating inorganic-organic film layers may be formed (not shown). Along the thickness direction Z of the display panel, the thickness of the first elastic layer 61 may be greater than or equal to the thickness of the flexible substrate 1. The smaller the elastic modulus of the first elastic layer 61, the greater the stretchability of the display panel.
[0049] Since the flexible substrate is provided with an opening penetrating the flexible substrate in the stretching region, at least a portion of the first elastic layer is filled in the opening of the flexible substrate. The Young's modulus of the first elastic layer 61 is much smaller than the Young's modulus of the flexible substrate 1 (generally formed of a flexible material such as polyimide PI). Therefore, the display panel of this embodiment only needs to apply a small stress to produce a large deformation, which is conducive to the application of flexible stretchable display technology in the wearable field.
[0050] Optionally, the pixel circuit film layer 2 may include: an active layer 21, a gate insulating layer 22, a gate layer 23, an interlayer insulating layer 24, a source / drain electrode layer 25, and a planarization layer 26. The active layer 21 may be located on the side of the inorganic layer 11 away from the flexible substrate 1, or directly on the flexible substrate 1. The gate insulating layer 22 may be located on the side of the active layer 21 away from the flexible substrate 1. The gate layer 23 may be located on the side of the gate insulating layer 22 away from the flexible substrate 1. The interlayer insulating layer 24 may be located on the side of the gate layer 23 away from the flexible substrate 1. The source / drain electrode layer 25 may be located on the side of the interlayer insulating layer 24 away from the flexible substrate 1. The source / drain electrode layer 25 may be connected to the source and drain regions of the active layer 21 via vias penetrating the interlayer insulating layer 24 and the gate insulating layer 22. The planarization layer 26 may be located on the side of the interlayer insulating layer 24 and the source / drain electrode layer 25 away from the flexible substrate 1. The pixel circuit film layer 2 may further include an anode layer 27, which may be located on the side of the planarization layer 26 away from the flexible substrate 1. The pixel circuit film layer 2 may further include a pixel definition layer 28, which may be located on the side of the planarization layer 26 away from the flexible substrate 1. The pixel definition layer 28 may have at least one pixel opening. The pixel opening exposes the anode layer 27. The anode layer 27 may be electrically connected to the source and drain electrode layer 25 via a via extending through the planarization layer 26. The pixel circuit film layer 2 may further include a support column 29, which may be located on the side of the pixel definition layer 28 away from the flexible substrate 1. This embodiment only illustrates one exemplary structure of the pixel circuit film layer; pixel circuit film layers with other structures are also within the scope of protection of this embodiment.
[0051] The inventors found that in the process of preparing the pixel island structure 100, the process of preparing the pixel circuit film layer 2 in the pixel island structure 100 involves high-temperature processes such as baking (OVEN) PI and pre-dehydrogenation process before excimer laser annealing (ELA). The temperature can be as high as 450°C or above, and the curing temperature of the pixel definition layer and the support can reach 250°C, which can easily lead to the vitrification of the elastic material (the vitrification temperature of the elastic material is about 80°C), which will affect the tensile properties of the display panel and is not conducive to the application of stretchable display panels in the wearable field.
[0052] Based on the above problems discovered by the inventors, on the basis of the above embodiments, optionally, after the pixel circuit film layer 2 is formed on one side of the flexible substrate 1, an opening 60 is formed on the flexible substrate 1 in the stretching area 20, penetrating the flexible substrate 1, and then a first elastic layer 61 is formed in the stretching area 20. At least a portion of the first elastic layer 61 is filled in the opening 60, thereby avoiding the problem of vitrification of the first elastic layer 61 caused by the high-temperature curing process during the formation of the pixel circuit film layer 2, and reducing the risk of vitrification of the first elastic layer 61.
[0053] like Figure 2 As shown, the inventors discovered that the pixel island structures 100 of adjacent pixel island regions 10 are electrically connected via stretchable connecting wires 200 located in the stretching region 20. Therefore, after the connecting wires 200 are prepared, the PI substrate can be removed by etching, then filled with elastic material, and then subjected to vapor deposition and packaging to achieve a flexible stretchable display. In other words, except for the PI film layer below the location of the connecting wires 200, the film layer above the connecting wires 200 in the stretching region 20, as well as the film layer in other locations of the stretching region 20 except for the location of the connecting wires 200, are replaced with an elastic material with a smaller Young's modulus, thereby improving the stretchability of the display panel and facilitating the application of flexible stretchable display technology in the wearable field. However, the inventors also discovered that in this structure, because a substrate material such as polyimide (PI) remains beneath the connecting line 200, it is inevitable that two materials with different elastic moduli, such as the PI substrate material and the elastic material, remain beneath the signal line in the stretching region 20. Since the elastic modulus of the PI substrate material is approximately 3-4 GPa, while the elastic modulus of the elastic material is approximately 5 MPa, the elastic modulus of the two differ significantly. During the stretching display process, due to the mismatch in the elastic moduli of the two substrate materials in the stretching region 20, the deformation mismatch of the film layer in the stretching region 20 can easily lead to breakage of the signal line.
[0054] Based on the above-mentioned problems discovered by the inventors, and on the basis of the above-mentioned embodiment, optionally, along the thickness direction of the flexible substrate 1, part or all of the orthographic projection of the connecting wire 200 on the flexible substrate 1 is located within the opening 60. Part or all of the orthographic projection of the connecting wire 200 on the flexible substrate 1 being located within the opening 60 may include part or all of the orthographic projection of the connecting wire 200 (i.e., at least one connecting wire 200) on the flexible substrate 1 being located within the opening 60. The pixel circuit film layer 2 and the connecting wire 200 may be located on the same side of the flexible substrate 1. The connecting wire 200 and the first elastic layer 61 may be stacked along the thickness direction Z of the display panel. Optionally, the orthographic projection of the connecting wire 200 on the flexible substrate 1 and the orthographic projection of the first elastic layer 61 on the flexible substrate 1 overlap, and part or all of the overlapping portion is located within the opening 60.
[0055] Since the flexible substrate 1 is provided with an opening 60 penetrating the flexible substrate 1 along the thickness direction Z of the flexible substrate 1, at least a portion of the first elastic layer 61 fills the opening 60 of the flexible substrate 1, and part or all of the projection of the connecting wire 200 on the flexible substrate 1 along the thickness direction Z of the flexible substrate 1 is located within the opening 60, there is only one base material with a single elastic modulus, namely, the first elastic layer 61, beneath part or all of the connecting wire 200 (i.e., part or all of at least one connecting wire). This avoids signal line breakage caused by a mismatch in the elastic moduli of the two base materials beneath part or all of the connecting wire 200, thereby reducing the risk of breaking the connecting wire 200.
[0056] Optionally, the elastic material forming the first elastic layer 61 includes one or more of polydimethylsiloxane (PDMS), silicone rubber (Ecoflex00-30), polyurethane (Polyurethane), butyl rubber (isobutylene isoPrenerubber, IIR), polyolefin elastomer (Polyolefin elastomer), styrene-based thermoplastic elastomer (StyreneicBlock Copolymers), acrylic elastomer (Acrylic elastomer), etc.
[0057] In some embodiments, the display panel may also include: a second elastic layer 62 covering the pixel island area 10 and the stretching area 20, the second elastic layer 62 is located on the side of the pixel circuit film layer 2 away from the flexible substrate 1, and the connecting line 62 is located between the first elastic layer 61 and the second elastic layer 62.
[0058] Optionally, the elastic material forming the second elastic layer 62 includes one or more of polydimethylsiloxane (PDMS), silicone rubber (Ecoflex 00-30), polyurethane, isobutylene isoPrenerubber (IIR), polyolefin elastomer, styrene-based thermoplastic elastomer, acrylic elastomer, etc. The second elastic layer 62 encapsulates the pixel island region 10 and stretchable region 20 of the display panel, thereby protecting the display structure film layer and connecting wires 200 from water and oxygen corrosion, ensuring the encapsulation effect of the display panel. Furthermore, since the second elastic layer 62 is also formed of an elastic material, the risk of signal line breakage is reduced. Thus, while ensuring the encapsulation effect of the display panel, the stretchability of the entire display panel is also improved.
[0059] Optionally, the elastic modulus of the second elastic layer 62 is less than the elastic modulus of the flexible substrate 1. Optionally, the elastic modulus of the first elastic layer 61 and the elastic modulus of the second elastic layer 62 are the same or different. Optionally, the materials of the first elastic layer 61 and the second elastic layer 62 are the same or different. Optionally, the materials of the first elastic layer 61 and the second elastic layer 62 are both transparent. Specifically, setting the materials of the first elastic layer 61 and the second elastic layer 62 to be the same further ensures the uniformity of the elastic modulus of the stretching region 20, avoiding the problem of breaking the connecting line 200 due to the mismatch of the elastic moduli of the first elastic layer 61 and the second elastic layer 62. At the same time, because the first elastic layer 61 and the second elastic layer 62 are made of the same material, the bonding force between the two film layers is strong and the film layer cracking is less likely to occur. In this embodiment, the materials of the first elastic layer 61 and the second elastic layer 62 are both transparent, which can further improve the light transmittance of the entire display panel, facilitating the use of the display panel in high-light-transmittance scenarios, such as using the display panel as a window.
[0060] In some embodiments, the display panel may further include: a display structure film layer 3 covering the pixel island region 10 , wherein the display structure film layer 3 is located on a side of the pixel circuit film layer 2 away from the flexible substrate 1 .
[0061] The display structure film layer 3 covering the pixel island area 10 may include: part or all of the display structure film layer 3 covering part or all of the pixel island area 10. Specifically, the display structure film layer 3 may include a light-emitting functional layer 31 such as an organic light-emitting functional layer or an inorganic light-emitting functional layer. The light-emitting functional layer 31 is located in the pixel opening. The light-emitting functional layer 31 may be located on the side of the anode layer 27 away from the planarization layer 26. The display structure film layer 3 may also include a cathode layer 32. The light-emitting functional layer 31 may be located between the anode layer 27 and the cathode layer 32. The cathode layer 33 may cover the light-emitting functional layer 31, the support column 29 and the pixel definition layer 28. In this embodiment, only one structural example of the display structure film layer 3 is shown, and display structure film layers 3 with other structures are also within the protection scope of this embodiment. The support column 29 is used to support the evaporation mask when evaporating the light-emitting material.
[0062] Alternatively, the anode layer 27 may be formed of a single metal element or alloy, such as aluminum (Al), chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), or silver (Ag). Alternatively, the anode layer 27 may be formed of a laminated film of a metal film composed of a single metal element or alloy and a conductive material (transparent conductive film) having visible light transmittance, such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO), or zinc oxide (AZO) doped with aluminum (Al), or zinc oxide (GZO) doped with gallium (Ga). Since the cathode layer 32 is generally located on the light-emitting side of the light-emitting sub-pixel, the cathode layer 32 is generally a transparent conductive film, such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO).
[0063] In some embodiments, the display panel further includes: an encapsulation structure film layer 4 covering the pixel island region 10 , and the encapsulation structure film layer 4 is located between the display structure film layer 3 and the second elastic layer 62 .
[0064] The encapsulation structure film layer 4 covering the pixel island area 10 may include part or all of the encapsulation structure film layer 4 covering part or all of the pixel island area 10. The encapsulation structure film layer 4 may include a thin film encapsulation layer, and the encapsulation structure film layer 4 may include at least one inorganic layer and at least one organic layer alternately stacked along the thickness direction Z of the display panel. The thin film encapsulation adopts an inorganic-organic-inorganic stacking structure, and generally adopts a 3-layer or 5-layer thin film encapsulation for encapsulation. The side of the encapsulation structure film layer 4 away from the flexible substrate 1 is flat. The inorganic layer can have the function of isolating water and oxygen. The organic layer can have the function of buffering stress and reducing the risk of fracture of the inorganic layer. The organic layer can have a flattening effect. The encapsulation structure film layer 4 encapsulates the pixel island area 10 of the display panel, thereby preventing the display structure film layer from being corroded by water and oxygen.
[0065] Optionally, the first surface of the first elastic layer 61 close to the connecting line 200 is flush with the surface of the packaging structure film layer 4 away from the flexible substrate 1, and the connecting line 200 is electrically connected to the pixel circuit film layer 2 through a via hole passing through the packaging structure film layer 4 and the display structure film layer 3.
[0066] The first surface of the first elastic layer 61 is flush with the surface of the encapsulation structure film layer 4 away from the flexible substrate 1, and the connecting wire 200 is located on the first surface of the first elastic layer 61. Specifically, the first elastic layer 61 fills the area between two adjacent pixel island structures 100, so that the first surface of the first elastic layer 61 is flush with the surface of the encapsulation structure film layer 4 away from the flexible substrate 1. In this way, when forming the connecting wire 200 located on the first elastic layer 61, the height difference between the first surface of the first elastic layer 61 and the surface of the encapsulation structure film layer 4 away from the flexible substrate 1 will not cause the connecting wire 200 to break, thereby ensuring the reliability of the connecting wire 200.
[0067] The connecting line 200 is formed after the pixel circuit film layer 2, the encapsulation structure film layer 4, and the display structure film layer 3 are prepared. In this way, not only is the problem of vitrification of the first elastic layer 61 caused by the high-temperature process during the preparation of the pixel circuit film layer 2 avoided, but the influence of the high-temperature process on the first elastic layer 61 during the preparation of the encapsulation structure film layer 4 is also avoided, which can further reduce the risk of vitrification of the first elastic layer 61.
[0068] Optionally, the area where the flexible substrate 1 is located does not overlap with the stretching area 20, the area where the pixel circuit film layer 2 is located does not overlap with the stretching area 20, the area where the display structure film layer 3 is located does not overlap with the stretching area 20, and the area where the packaging structure film layer 4 is located does not overlap with the stretching area 20.
[0069] In this embodiment, the flexible substrate 1, pixel circuit film layer 2, display structure film layer 3, and encapsulation structure film layer 4 are not located within the stretch region 20 to prevent signal line cracking caused by a mismatch in the elastic modulus of the first elastic layer 61 in the stretch region 20. Only the first elastic layer 61, connecting wires 200, and second elastic layer 62, filling the gaps between adjacent pixel island structures 100, remain in the stretch region 20. The connecting wires 200 electrically connect the source and drain layers 25 of the pixel circuit film layer 2 of two adjacent pixel island structures 100.
[0070] In this embodiment, any pixel island structure 100 may include a flexible substrate 1, a pixel circuit film layer 2, a display structure film layer 3, and an encapsulation structure film layer 4. A pixel island structure 100 may include one or more light-emitting sub-pixels. These sub-pixels may include red, green, and blue light-emitting sub-pixels.
[0071] In another embodiment, in other examples, such as Figure 4As shown, a through hole is formed in the connecting line 200, exposing the first elastic layer 61. The second elastic layer 62 fills the through hole and contacts the first elastic layer 61. Specifically, while ensuring that the resistance of the connecting line 200 remains unchanged, a through hole is appropriately formed in the signal line, and the second elastic layer 62 fills the through hole to further relieve stress during display panel deformation. Furthermore, the second elastic layer 62 fills the through hole and contacts the first elastic layer 61, further strengthening the bonding force between the first and second elastic layers 61, 62. Multiple through holes can be spaced apart along the extension direction of the connecting line 200. Multiple through holes can be evenly spaced along the extension direction of the connecting line 200. The connecting line 200 can have a curved shape, such as an S-shape or a wavy shape. The cross-section of the through hole can include circular or elliptical shapes, and the cross-section of the through hole can be perpendicular to the thickness direction Z of the display panel. The extension direction of the through hole can be parallel to the thickness direction Z of the display panel.
[0072] Optionally, the second surface of the first elastic layer 61, distal to the connecting line 200, is flush with the side of the flexible substrate 1 distal to the pixel circuit film layer 2. Along the thickness direction Z of the display panel, the thickness of the first elastic layer 61 is greater than or equal to the sum of the thicknesses of the flexible substrate 1 and the pixel circuit film layer 2. This prevents breakage of the connecting line 200 due to a height difference between the first surface of the first elastic layer 61 and the surface of the pixel circuit film layer 2 distal to the flexible substrate 1 when the connecting line 200 is formed on the first elastic layer 61. The thickness of the first elastic layer 61 can be adjusted as needed and is not limited in this embodiment of the present invention. Optionally, the first surface of the first elastic layer 61, proximal to the connecting line 200, is flush with the surface of the planarization layer 26 distal to the flexible substrate 1. Optionally, the connecting line 200 is electrically connected to the pixel circuit film layer 2 via a via extending through the planarization layer 26.
[0073] Figure 5 For the Figure 2 From the cross-sectional view cut along line BB′, it can be seen that the stretching region 2 only includes the first elastic layer 61 and the second elastic layer 62 in addition to the conductive wires, which can greatly improve the stretching performance of the display panel.
[0074] An embodiment of the present invention further provides an embodiment of a display device, including any of the above-mentioned display panels. The display device described here can be a mobile phone, a tablet, a computer, etc., and is particularly suitable for wearable electronic devices, such as: augmented reality (AR) devices, virtual reality (VR) devices, watches, etc.
[0075] The embodiment of the present invention also provides a method for manufacturing a display panel. The display panel is provided with a plurality of pixel island regions and a stretching region located between adjacent pixel island regions. Figure 6 and Figure 7 As shown, the preparation method comprises:
[0076] Step S11: providing a rigid substrate.
[0077] Among them, the rigid substrate 1000 may include a glass substrate, etc., and the display panel is prepared on the glass substrate. After the entire display panel is prepared, the rigid substrate needs to be peeled off, and the display panel and other structural film layers (such as touch layer, polarizer, support layer, etc.) need to be bonded and assembled to form the display device in the above embodiment.
[0078] Step S12: forming a flexible substrate on one side of the rigid substrate, wherein the flexible substrate covers the pixel island area and the stretching area.
[0079] Step S13: forming a pixel circuit film layer on a side of the flexible substrate away from the rigid substrate, wherein the pixel circuit film layer covers the pixel island area.
[0080] Step S14: forming an opening penetrating the flexible substrate on the flexible substrate in the stretching area.
[0081] Before forming the opening 60 penetrating the flexible substrate 1 on the flexible substrate 1 in the stretching region 20, an etch stop layer is formed on the side of the pixel circuit film layer 2 away from the rigid substrate 1000. The etch stop layer does not cover the flexible substrate to be etched, so that the flexible substrate is etched to form the desired opening, and then the etch stop layer is removed. The etch stop layer may include a transparent conductive film, such as indium zinc oxide (IZO). The flexible substrate is etched after the pixel circuit film layer is formed. Otherwise, if the flexible substrate is etched before the pixel circuit film layer is formed, a film layer will be formed inside the opening of the flexible substrate when the pixel circuit film layer is prepared after etching the flexible substrate. Then, the film layer inside the opening of the flexible substrate is etched. Since the film thickness of the flexible substrate is relatively thick, the step difference at the opening of the flexible substrate is large, resulting in the problem of film layer residue in the opening of the flexible substrate.
[0082] Step S15: forming a first elastic layer in the stretching area, wherein at least a portion of the first elastic layer fills the opening.
[0083] During filling, the height of the first elastic layer 61 is greater than or equal to the height of the surrounding film layer away from the flexible substrate 1. This improves the flatness of the surface of the filled first elastic layer 61 away from the rigid substrate 1000, preventing the filled height of the first elastic layer 61 from being lower than the height of the surrounding film layer away from the flexible substrate 1, which would cause the middle region of the filled first elastic layer to be recessed relative to the adjacent pixel island regions. The high flatness of the surface of the first elastic layer 61 away from the rigid substrate 1000 facilitates uniform stress distribution on the connecting wire 200, preventing stress concentration on uneven areas of the connecting wire.
[0084] Step S16: forming a connecting line on a side of the first elastic layer away from the rigid substrate, and electrically connecting the pixel circuit film layers covering the plurality of pixel island regions through the connecting line.
[0085] For the above steps S11 and S16, Figure 7 The method for preparing the display panel is described in detail:
[0086] A flexible substrate 1 is formed on a rigid substrate 1000. The rigid substrate 1000 includes an area corresponding to the pixel island region 10 and an area corresponding to the stretch region 20. An opening 60 is formed through the flexible substrate 1 in the stretch region 20. A first elastic layer 61 is formed in the stretch region 20, at least partially filling the opening 60. A connecting line 200 is then formed on the side of the first elastic layer 61 facing away from the rigid substrate 1000. In this embodiment, the pixel circuit film layer 2 is formed on the side of the flexible substrate 1 facing away from the rigid substrate before the first elastic layer 61 is formed in the stretch region 200. This avoids the problem of vitrification of the first elastic layer 61 caused by the high-temperature curing process during the formation of the pixel circuit film layer 2, thereby reducing the risk of vitrification of the first elastic layer 61. Since the Young's modulus of the first elastic layer 61 is much smaller than the Young's modulus of the flexible substrate 1 (generally formed of flexible materials such as polyimide PI), the display panel formed according to the preparation method of this embodiment only needs to apply a small stress to produce a large deformation, which is conducive to the application of flexible stretchable display technology in the wearable field.
[0087] Optionally, along the thickness direction of the flexible substrate 1, part or all of the orthographic projection of the connecting wire 200 on the flexible substrate 1 is located within the opening 60. In this way, only one base material with a single elastic modulus, namely, the first elastic layer 61, exists beneath part or all of the connecting wires 200 (i.e., part or all of at least one connecting wire). This avoids signal line breakage caused by a mismatch in the elastic moduli of the two base materials beneath part or all of the connecting wires 200.
[0088] The embodiment of the present invention also provides another method for preparing a display panel. Figure 8 and Figure 9 As shown, the preparation method comprises:
[0089] Step S21: providing a rigid substrate.
[0090] Step S22: forming a flexible substrate on one side of the rigid substrate, wherein the flexible substrate covers the pixel island area and the stretching area.
[0091] Step S23: forming a pixel circuit film layer on a side of the flexible substrate away from the rigid substrate, wherein the pixel circuit film layer covers the pixel island area.
[0092] Step S24: forming a display structure film layer on a side of the pixel circuit film layer away from the flexible substrate, wherein the display structure film layer covers the pixel island area.
[0093] Step S25: forming a packaging structure film layer on a side of the display structure film layer away from the pixel circuit film layer, wherein the packaging structure film layer covers the pixel island area.
[0094] Step S26: forming an opening penetrating the flexible substrate on the flexible substrate in the stretching area.
[0095] Step S27 : forming a first elastic layer in the stretching area, wherein at least a portion of the first elastic layer fills the opening.
[0096] Step S28: forming a connecting line on a side of the first elastic layer away from the rigid substrate, and electrically connecting the pixel circuit film layers covering the plurality of pixel island regions through the connecting line.
[0097] Step S29: forming a second elastic layer in the pixel island region and the stretching region, wherein the second elastic layer is located on a side of the display structure film layer away from the flexible substrate.
[0098] Step S30: peeling off the rigid substrate.
[0099] Regarding the above steps S21 and S30, in combination with the attached Figure 9 The method for preparing the display panel is described in detail:
[0100] In this embodiment, the pixel circuit film layer 2, the encapsulation structure film layer 4, and the display structure film layer 3 are first prepared before the first elastic layer 61 and the second elastic layer 62 are prepared. This not only avoids the problem of vitrification of the first elastic layer 61 and the second elastic layer 62 caused by the high-temperature curing process during the preparation of the pixel circuit film layer 2, but also avoids the problem of vitrification of the first elastic layer 61 and the second elastic layer 62 caused by the high-temperature curing process during the preparation of the encapsulation structure film layer 4. This can further reduce the risk of vitrification of the first elastic layer 61 and the second elastic layer 62.
[0101] It should be noted that steps S26 and S27 may be performed before step S24; or before step S25.
[0102] Optionally, the elastic modulus of the second elastic layer 62 is less than the elastic modulus of the flexible substrate 1. Optionally, the elastic modulus of the first elastic layer 61 and the elastic modulus of the second elastic layer 62 are the same or different. Optionally, the materials of the first elastic layer 61 and the second elastic layer 62 are the same or different. Optionally, the materials of the first elastic layer 61 and the second elastic layer 62 are both transparent.
[0103] Optionally, the area where the flexible substrate 1 is located does not overlap with the stretch region 20; the area where the pixel circuit film layer 2 is located does not overlap with the stretch region 20; the area where the display structure film layer 3 is located does not overlap with the stretch region 20; and the area where the encapsulation structure film layer 4 is located does not overlap with the stretch region 20. In this embodiment, the flexible substrate 1, pixel circuit film layer 2, display structure film layer 3, and encapsulation structure film layer 4 are all located outside the stretch region 20, avoiding a mismatch in elastic modulus with the first elastic layer 61 in the stretch region 20, which could cause cracking in the signal line 200. The first elastic layer 61, connecting line 200, and second elastic layer 62 are retained only in the stretch region 20, thereby avoiding a mismatch in elastic modulus between the two substrate materials in the stretch region 20, which could cause signal line breakage and reduce the risk of breaking the connecting line 200.
[0104] Optionally, the second surface of the first elastic layer 61 away from the connecting line 200 is flush with the side of the flexible substrate 1 away from the pixel circuit film layer 2, and along the thickness direction Z of the display panel, the thickness of the first elastic layer 61 is greater than or equal to the sum of the thickness of the flexible substrate 1 and the thickness of the pixel circuit film layer 2.
[0105] Optionally, the first surface of the first elastic layer 61 close to the connecting line 200 is flush with the surface of the packaging structure film layer 4 away from the flexible substrate 1, and the connecting line 200 is electrically connected to the pixel circuit film layer 2 through a via hole passing through the packaging structure film layer 4 and the display structure film layer 3.
[0106] The first surface of the first elastic layer 61 is flush with the surface of the encapsulation structure film layer 4 away from the flexible substrate 1, and the connecting wire 200 is located on the first surface of the first elastic layer 61. Specifically, the first elastic layer 61 fills the area between two adjacent pixel island structures 100, so that the first surface of the first elastic layer 61 is flush with the surface of the encapsulation structure film layer 4 away from the flexible substrate 1. In this way, when forming the connecting wire 200 located on the first elastic layer 61, the height difference between the first surface of the first elastic layer 61 and the surface of the encapsulation structure film layer 4 away from the flexible substrate 1 will not cause the connecting wire 200 to break, thereby ensuring the reliability of the connecting wire 200.
[0107] It can be seen that the embodiment of the display panel preparation method in the present application is used to prepare the display panel embodiment in the present application. Therefore, the technical details in the display panel embodiment can be applied to the embodiment of the display panel preparation method, and the technical details in the display panel preparation method can also be applied to the display panel embodiment.
[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
Claims
1. A display panel, characterized in that: The display panel is provided with a plurality of pixel island regions and a stretching region located between adjacent pixel island regions; The display panel includes: a flexible substrate and a pixel circuit film layer covering the pixel island region, and a first elastic layer and a connecting line covering the stretch region; the flexible substrate is provided with an opening penetrating the flexible substrate in the stretch region, and at least a portion of the first elastic layer fills the opening in the flexible substrate; the elastic modulus of the first elastic layer is smaller than the elastic modulus of the flexible substrate; The pixel circuit film layer and the connecting line are located on the same side of the flexible substrate, the pixel circuit film layers covering the multiple pixel island areas are electrically connected through the connecting line, and the connecting line is in contact with the first elastic layer; part or all of the positive projection of the connecting line on the flexible substrate is located within the opening.
2. The display panel according to claim 1, wherein: The display panel also includes: a second elastic layer covering the pixel island area and the stretching area, the second elastic layer is located on the side of the pixel circuit film layer away from the flexible substrate, the connecting line is located between the first elastic layer and the second elastic layer; the connecting line is in contact with the second elastic layer; the elastic modulus of the second elastic layer is smaller than the elastic modulus of the flexible substrate.
3. The display panel according to claim 2, wherein: The elastic modulus of the first elastic layer is the same as the elastic modulus of the second elastic layer.
4. The display panel according to claim 2, wherein: The material of the first elastic layer is the same as that of the second elastic layer.
5. The display panel according to claim 2, wherein: The display panel also includes: a display structure film layer and an encapsulation structure film layer covering the pixel island area, the display structure film layer is located on the side of the pixel circuit film layer away from the flexible substrate, and the encapsulation structure film layer is located between the display structure film layer and the second elastic layer.
6. The display panel according to claim 5, wherein: The first surface of the first elastic layer close to the connecting line is flush with the surface of the packaging structure film layer away from the flexible substrate; the connecting line is electrically connected to the pixel circuit film layer through a via hole penetrating the packaging structure film layer and the display structure film layer.
7. The display panel according to any one of claims 2 to 6, wherein: A through hole is formed on the connecting line, and the through hole exposes the first elastic layer. The second elastic layer fills the through hole and contacts the first elastic layer.
8. The display panel according to claim 1, wherein: An orthographic projection of the connecting line on the flexible substrate overlaps with an orthographic projection of the first elastic layer on the flexible substrate, and part or all of the overlapping portion is located within the opening.
9. The display panel according to claim 1, wherein: The second surface of the first elastic layer away from the connecting line is flush with the side of the flexible substrate away from the pixel circuit film layer, and the thickness of the first elastic layer is greater than or equal to the sum of the thickness of the flexible substrate and the thickness of the pixel circuit film layer.
10. The display panel according to claim 1, wherein Part or all of the first elastic layer covers the entire stretch area.
11. A method for preparing a display panel, characterized in that: The display panel is provided with a plurality of pixel island regions and a stretching region located between adjacent pixel island regions, and the method includes: Provide a rigid substrate; forming a flexible substrate on one side of the rigid substrate, wherein the flexible substrate covers the pixel island region and the stretching region; forming a pixel circuit film layer on a side of the flexible substrate away from the rigid substrate, wherein the pixel circuit film layer covers the pixel island area; forming an opening penetrating the flexible substrate on the flexible substrate in the stretching region; forming a first elastic layer in the stretching area, wherein at least a portion of the first elastic layer fills the opening; and an elastic modulus of the first elastic layer is smaller than an elastic modulus of the flexible substrate; A connecting line is formed on a side of the first elastic layer away from the rigid substrate, and the pixel circuit film layers covering the multiple pixel island areas are electrically connected via the connecting line. The connecting line is in contact with the first elastic layer; and part or all of the positive projection of the connecting line on the flexible substrate is located within the opening.
12. The method for manufacturing a display panel according to claim 11, wherein: After forming a connection line on a side of the first elastic layer away from the rigid substrate, the method further includes: A second elastic layer is formed in the pixel island area and the stretching area, the second elastic layer is located on the side of the pixel circuit film layer away from the flexible substrate, and the connecting line is located between the first elastic layer and the second elastic layer; the elastic modulus of the second elastic layer is smaller than the elastic modulus of the flexible substrate.
13. The method for manufacturing a display panel according to claim 12, wherein: The elastic modulus of the first elastic layer is the same as the elastic modulus of the second elastic layer.
14. The method for manufacturing a display panel according to claim 12, wherein: The material of the first elastic layer is the same as that of the second elastic layer.
15. The method for manufacturing a display panel according to claim 12, wherein: After forming a connection line on a side of the first elastic layer away from the rigid substrate and before forming a second elastic layer in the pixel island area and the stretching area, the method further includes: A through hole is provided on the connecting line, and the through hole exposes the first elastic layer.
16. The method for manufacturing a display panel according to claim 12, wherein: After forming the pixel circuit film layer on the side of the flexible substrate away from the rigid substrate and before forming the second elastic layer in the pixel island area and the stretching area, the method further includes: forming a display structure film layer on a side of the pixel circuit film layer away from the flexible substrate, wherein the display structure film layer covers the pixel island area; A packaging structure film layer is formed on a side of the display structure film layer away from the pixel circuit film layer, the packaging structure film layer covers the pixel island area, and the second elastic layer is located on a side of the packaging structure film layer away from the flexible substrate.
17. The method for manufacturing a display panel according to claim 16, wherein: A part or all of the orthographic projection of the connecting line on the flexible substrate is located in the opening.
18. The method for manufacturing a display panel according to claim 16, wherein: An orthographic projection of the connecting line on the flexible substrate overlaps with an orthographic projection of the first elastic layer on the flexible substrate, and part or all of the overlapping portion is located within the opening.
19. The method for manufacturing a display panel according to claim 16, wherein: The second surface of the first elastic layer away from the connecting line is flush with the side of the flexible substrate away from the pixel circuit film layer, and the thickness of the first elastic layer is greater than or equal to the sum of the thickness of the flexible substrate and the thickness of the pixel circuit film layer.
20. The method for manufacturing a display panel according to claim 16, wherein: The first surface of the first elastic layer close to the connecting line is flush with the surface of the packaging structure film layer away from the flexible substrate, and the connecting line is electrically connected to the pixel circuit film layer through a via hole penetrating the packaging structure film layer and the display structure film layer.
21. The method for manufacturing a display panel according to claim 16, wherein: After forming the second elastic layer in the pixel island region and the stretching region, the method further includes: The rigid substrate is peeled off.
Citation Information
Patent Citations
Display panel, display device and manufacturing method of display panel
CN111341210A
Stretchable display panel, manufacturing method thereof and display device
CN111864067A
Stretchable display panel
CN113724590A