Electromigration test circuit, test device and method

Abstract

The present application provides an electromigration test circuit, including a test module, a data acquisition module and a control module, wherein the test module is used to apply a test signal of preset parameters to a sample to be tested according to an output control signal; the data acquisition module is connected to the test module, and is used to control the sample to be tested to access the corresponding test loop according to a switch action signal, and collect the electromigration test parameter information of the sample to be tested; the control module is connected to both the test module and the data acquisition module, and is used to generate an output control signal according to a received test trigger signal to control the test module to generate a test signal; and / or generate a switch action signal according to the test trigger signal to control the data acquisition module to operate so that the sample to be tested is connected to the corresponding test loop. In the above test circuit, the life prediction equation of the sample to be tested is generated based on the control module and the data acquisition module, which can relatively accurately evaluate the service life of the sample, greatly improving the test efficiency.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit reliability, and in particular to an electromigration test circuit, a test device and a method. Background Art

[0002] As electronic products continue to develop towards miniaturization and multifunctionality, the electromigration problem of interconnect structures in integrated circuits has become increasingly prominent and has become an important factor affecting the reliability and durability of electronic products. The miniaturization of interconnect structure size has led to a significant increase in current density, which has accelerated the electromigration failure of the interconnect structure.

[0003] Existing electromigration monitoring systems and methods basically monitor electromigration tests under DC current stress conditions, and require manual extraction of life failure data for reliability life modeling. They lack an integrated reliability life assessment module and have obvious disadvantages such as a single stress loading method and poor applicability of the monitoring mode. In actual working environments, the interconnection structure in integrated circuits does not work under a single DC stress condition, but often needs to bear AC stress. Existing electromigration test systems cannot meet the reliability evaluation requirements under AC environments, nor can they evaluate the life of interconnection structures. Summary of the invention

[0004] Based on this, it is necessary to provide an electromigration test circuit, a test device and a method to address the above technical issues, so as to solve the problem that traditional electromigration detection systems and methods cannot meet the life assessment of interconnection structures under AC working environments.

[0005] On the one hand, the present application provides an electromigration test circuit, including a test module, a data acquisition module and a control module, wherein the test module is used to apply a test signal with preset parameters to a sample to be tested according to an output control signal, wherein the test signal includes a current signal, and the preset parameters are not limited to at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency; the data acquisition module is connected to the test module and is used to control the sample to be tested to access a corresponding test circuit according to a switch action signal, and to collect electromigration test parameter information of the sample to be tested, wherein the electromigration test parameter information is not limited to at least one of a voltage value, a current density value and a test temperature; the control module is connected to both the test module and the data acquisition module and is used to generate the output control signal according to the received test trigger signal. signal to control the test module to generate the test signal; and / or generate the switch action signal according to the test trigger signal to control the action of the data acquisition module to connect the sample to be tested to the corresponding test circuit; the control module is also configured to: obtain the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal, obtain the life time of the sample to be tested according to the resistance value, obtain life data based on the life times of several samples to be tested, and generate a life prediction equation for the sample to be tested according to the life data, the preset parameters and the electromigration test parameter information; wherein, when the resistance value is greater than the preset resistance threshold, it is determined that the sample to be tested has electromigration failure, and the life data includes but is not limited to at least one of the failure number, failure probability and life time.

[0006] In the electromigration test circuit described in the above embodiment, a test module is set to apply a test current signal with preset parameters to the sample to be tested, including an AC signal and a DC signal, thereby realizing the integration of AC and DC stresses and greatly broadening the application scope of the test circuit; the voltage value of the sample to be tested is collected in real time by the data acquisition module, and data is processed together with the test current signal through the control module to obtain the real-time resistance value of the sample to be tested. Through continuous monitoring, when the real-time resistance value is greater than the preset resistance threshold, the sample to be tested is determined to be failed, thereby obtaining the life time of the sample to be tested. The control module generates a life prediction equation for the sample to be tested based on the life time, preset parameters and electromigration test parameter information of several samples to be tested. The subsequent sample to be tested can relatively accurately evaluate the service life through the life prediction equation without the need for long-term experimental verification, thereby greatly improving the test efficiency.

[0007] In one embodiment, the test module includes:

[0008] A test chamber, used to provide a preset test temperature for the sample to be tested;

[0009] A multifunctional power supply is connected to both the control module and the sample to be tested, and is used to apply the test signal to the sample to be tested according to the output control signal.

[0010] In one embodiment, the data acquisition module includes:

[0011] A switch array, comprising a plurality of controllable switch units, any of which is connected to the control module and the sample to be tested, and any of which is actuated according to the switch action signal to connect the corresponding sample to be tested to the corresponding test loop;

[0012] The acquisition device is connected to the switch array and the control module, and is used to acquire the electromigration test parameter information of the sample to be tested, and send the acquired data to the control module.

[0013] In one embodiment, the life time is the time difference between the first moment and the second moment;

[0014] The first moment is the moment when the acquisition device is started; the second moment is the moment when the sample to be tested fails.

[0015] In one embodiment, the control module obtains preset quantile life information of the sample to be tested based on the obtained life data and a preset life distribution model, and the preset life distribution model includes but is not limited to at least one of an exponential distribution model, a Weibull distribution model and a lognormal distribution model.

[0016] In one embodiment, it also includes:

[0017] The control module obtains the life prediction equation according to the preset quantile life information, the preset parameters and the electromigration test parameter information based on a preset life equation model, and the preset life equation model includes but is not limited to the Black equation.

[0018] A second aspect of the present application provides an electromigration testing device, comprising:

[0019] The test circuit as described in any of the preceding embodiments.

[0020] The third aspect of the present application provides an electromigration testing method, comprising:

[0021] Generate an output control signal according to the received test trigger signal to control the test module to apply a test signal with preset parameters to the sample to be tested, wherein the preset parameters are not limited to at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency;

[0022] Generate a switch action signal according to the test trigger signal to control the sample to be tested to access the corresponding test circuit to obtain electromigration test parameter information of the sample to be tested, wherein the electromigration test parameter information includes but is not limited to at least one of a voltage value, a current density value and a test temperature;

[0023] A life prediction equation of the sample to be tested is generated according to the preset parameters and the electromigration test parameter information.

[0024] In one embodiment, the step of generating a life prediction equation of the sample to be tested according to the preset parameters and the corresponding electromigration test parameter information includes:

[0025] Obtaining the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal;

[0026] Obtaining the life time of the sample to be tested according to the resistance value;

[0027] Acquiring lifespan data based on the lifespans of a number of the samples to be tested;

[0028] According to the obtained life data, based on a preset life distribution model, obtaining preset quantile life information of the sample to be tested;

[0029] According to the preset quantile lifetime information, the preset parameters and the electromigration test parameter information, based on a preset lifetime equation model, a lifetime prediction equation of the sample to be tested is obtained.

[0030] In one embodiment, it also includes:

[0031] A test trigger signal is obtained, where the test trigger signal is used to set the preset parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A schematic diagram of the structure of an electromigration test circuit in an embodiment provided in the present application;

[0034] Figure 2 A graph showing the change in resistance of an interconnect structure over time during an electromigration test in an embodiment provided in the present application;

[0035] Figure 3A schematic diagram of a flow chart of an electromigration testing method in an embodiment provided in the present application;

[0036] Figure 4 A schematic flow chart of an electromigration testing method in another embodiment provided in the present application. DETAILED DESCRIPTION

[0037] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0039] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0040] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0041] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0042] Electromigration is the atomic migration phenomenon of metal atoms under the action of electric current and temperature. The moving electrons and the main metal atoms exchange momentum with each other. When the metal atoms migrate along the direction of the electron flow, cavities will be formed at the original position. At the same time, the metal atoms migrate and accumulate to form hillock-like protrusions. The former will cause the interconnection structure to open or break, while the latter will cause a short circuit between the interconnection structures, thus affecting the normal operation of the chip. Electromigration is more likely to occur on lines with high current density and high frequency changes, such as power supply and clock lines. The electromigration phenomenon can cause open circuit or short circuit failures in the circuits of electronic products, leading to failure of the electronic circuits. Electromigration is a slow failure process that usually takes months or even years to show up. Therefore, in order to evaluate the service life of electronic products, it is necessary to estimate the electromigration failure time of the interconnection structure.

[0043] Traditional electromigration monitoring systems and methods basically monitor electromigration tests under DC current stress conditions, and require manual extraction of life failure data for reliability life modeling. They lack an integrated reliability life assessment module and have obvious disadvantages such as a single stress loading method and poor applicability of the monitoring mode. In actual working environments, the interconnection structure in integrated circuits does not work under a single DC stress condition, but often needs to bear AC stress. Existing electromigration test systems cannot meet the reliability evaluation requirements under AC environments, nor can they evaluate the life of interconnection structures.

[0044] Therefore, in order to solve the above problems, it is necessary to propose an electromigration test circuit, a test device and a method, which will be described below through specific embodiments.

[0045] In one embodiment provided in the present application, Figure 1As shown, an electromigration test circuit is provided, including a test module 100, a data acquisition module 200 and a control module 300, wherein the test module 100 is used to apply a test signal with preset parameters to a sample to be tested according to an output control signal, wherein the test signal includes a current signal, and the preset parameters include but are not limited to at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency; the data acquisition module 200 is connected to the test module 100, and is used to control the sample to be tested to access the corresponding test circuit according to the switch action signal, and collect electromigration test parameter information of the sample to be tested, wherein the electromigration test parameter information includes but is not limited to at least one of a voltage value, a current density value and a test temperature; the control module 300 is connected to both the test module 100 and the data acquisition module 200, and is used to collect the electromigration test parameter information of the sample to be tested according to the received test signal. The test trigger signal generates the output control signal to control the test module 100 to generate the test signal; and / or generates a switch action signal according to the test trigger signal to control the data acquisition module 200 to operate so that the sample to be tested is connected to the corresponding test loop; the control module 300 is also configured to: obtain the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal, obtain the life time of the sample to be tested according to the resistance value of the sample to be tested, obtain life data based on the life times of several samples to be tested, and generate a life prediction equation for the sample to be tested according to the life data, preset parameters and electromigration test parameter information; wherein, when the resistance value of the sample to be tested is greater than the preset resistance threshold, it is determined that the sample to be tested has electromigration failure, and the life data includes but is not limited to at least one of the number of failures, failure probability and life time.

[0046] Specifically, first, the control module 300 is connected to the test module 100 through communication, and controls the test module 100 to generate a test signal with preset parameters by sending a control signal to the test module 100. In some embodiments, in order to facilitate subsequent measurements, the test signal can be a current signal, and the current signal can be flexibly configured according to the test requirements, and outputs an AC current signal or a DC current signal with a preset waveform, preset amplitude, preset frequency and preset duty cycle to the sample to be tested, so as to meet the electromigration test requirements under different stress working environments; secondly, the voltage signal of the sample to be tested is collected through the data acquisition module 200, and the control module 300 calculates the resistance value of the sample to be tested according to the ratio of voltage to current. Under normal circumstances, the resistance value of the sample to be tested will be affected by electromigration. It increases slowly until it suddenly increases and exceeds a certain preset resistance threshold. At this time, it can be determined that the interconnect structure has a short circuit failure due to electromigration, and the interconnect structure has failed. The time from the start of measurement to the failure of the interconnect structure is the life time of the sample to be tested. In addition, factors affecting the electromigration process of the sample to be tested also include the external ambient temperature and the current density carried by the sample to be tested. The higher the temperature, the greater the current density, the more intense the electromigration process, and the shorter the corresponding life time. Therefore, for the same type of interconnect structure to be tested, different test conditions can be set to obtain multiple groups of life times through actual measurement, and the failure conditions of multiple samples to be tested can be counted at the same time, including but not limited to the number of failures, failure probability, etc., to generate life data of the sample to be tested together with the life time.

[0047] As an example, electromigration acceleration experiments of copper pillar bump interconnects were conducted at different current density conditions at ambient temperatures of 100°C, 125°C, and 150°C. Considering that devices using copper pillar bump packaging usually have high requirements for interconnect performance, the failure criterion is that the resistance value exceeds the initial value by about 10% when the solder is fully alloyed. After three groups of experiments under each experimental condition, the average life time at failure is taken, and the life time shown in the following table can be obtained.

[0048] Table 1 Average lifespan of copper pillar bumps under different temperature and current density conditions

[0049]

[0050] It can be seen from Table 1 that when the temperature is the highest 150°C and the current density is the maximum 3×10 4 A / cm 2 When the temperature is the lowest at 100°C and the current density is the lowest at 2×10 4 A / cm 2 The longest lifespan is 2446.3h.

[0051] Further, the control module 300 obtains preset quantile life information of the sample to be tested based on the obtained life data and a preset life distribution model, wherein the preset life distribution model includes but is not limited to at least one of an exponential distribution model, a Weibull distribution model, and a lognormal distribution model. Then, based on a specific life equation model, a life prediction equation is generated, wherein the life equation model can adopt the Black equation.

[0052] As an example, taking the log-normal distribution model as an example, under different electromigration test conditions, the median life T 0.5 Obey Black's equation:

[0053]

[0054] Among them, A is the preset constant, j is the current density, n is the current influence index, E a is the activation energy, k is the Boltzmann constant, and T is the test temperature. Under different test temperatures T and current densities j, the activation energy and current influence index are both fixed values, and the life time T is obtained by measurement. 0.5 By substituting the corresponding current density and test temperature into the Black equation, we can establish the current influence index n and activation energy E a By substituting two different sets of data into the equation, we can solve for n and E. a , and then put it into the Black equation to obtain the life prediction equation of the sample to be tested which is only related to the test temperature and current density.

[0055] In the electromigration test circuit described in the above embodiment, by setting the test module 100 to apply a test current signal with preset parameters to the sample to be tested, including an AC signal and a DC signal, the integration of AC and DC stresses is realized, which greatly broadens the application scope of the test circuit; the voltage value of the sample to be tested is collected in real time by the data acquisition module 200, and data is processed together with the test current signal through the control module 300, so as to obtain the real-time resistance value of the sample to be tested. Through continuous monitoring, when the real-time resistance value is greater than the preset resistance threshold, the sample to be tested is determined to be failed, thereby obtaining the life time of the sample to be tested. The control module generates a life prediction equation for the sample to be tested based on the life time, preset parameters and electromigration test parameter information of several samples to be tested. The subsequent sample to be tested can relatively accurately evaluate the service life through the life prediction equation, without the need for long-term experimental verification, thereby greatly improving the test efficiency.

[0056] As an example, please refer to Figure 1The test module 100 includes a test box 110 and a multifunctional power supply 120, wherein the test box 110 is used to provide a preset test temperature for the sample to be tested; the multifunctional power supply 120 is connected to the control module 300 and the sample to be tested, and is used to apply a test signal to the sample to be tested according to the output control signal.

[0057] Specifically, since the electromigration process is closely related to the ambient temperature, in order to obtain a stable test temperature environment, it is necessary to provide a separate test box 110 for the sample to be tested so that the test work is always kept at a constant temperature. At the same time, the data acquisition module 200 collects the internal temperature of the test box 110 through a temperature sensor and transmits it to the control module 300 as an input variable for subsequently establishing a life prediction equation. In some embodiments, since the electromigration process is slow, the method of increasing the working environment temperature can be used to speed up the electromigration process and obtain a more demanding life time; in addition, the multi-function power supply 120 generates an AC current signal or a DC current signal with a preset waveform, preset amplitude, preset frequency and preset duty cycle according to the control signal provided by the control module 300.

[0058] As an example, please refer to Figure 1 The data acquisition module 200 includes a switch array 210 and a collection device 220, wherein the switch array 210 includes a plurality of controllable switch units, any of which is connected to the control module 300 and the sample to be tested, and any of which is actuated according to a switch action signal to connect the corresponding sample to be tested to the corresponding test circuit; the collection device 220 is connected to both the switch array 210 and the control module 300, and is used to collect the electromigration test parameter information of the sample to be tested, and send the acquired data to the control module 300.

[0059] Specifically, the switch array 210 is set to control the access of the sample to be tested to the test circuit, and supports simultaneous testing of multiple samples to be tested. The control module 300 controls the switch array 210 by sending a switch action signal to activate the corresponding controllable switch unit to connect the corresponding connected sample to be tested to the test circuit. After the test starts, the acquisition device 220 continuously transmits the detected voltage signal of the sample to be tested back to the control module 300.

[0060] In one embodiment provided in the present application, Figure 2 As shown in the figure, the resistance value of the sample to be tested gradually increases with the increase of test time. After exceeding a certain time (greater than 1000h in the figure), the resistance value suddenly changes and increases sharply, indicating that the sample to be tested has a short circuit fault and the interconnection structure in the electronic circuit fails at the same time. The time from the beginning to the failure is the life time of the sample to be tested.

[0061] In one embodiment provided in the present application, an electromigration testing device is also provided, including the test circuit described in any of the aforementioned embodiments, specifically including a test module 100, a data acquisition module 200 and a control module 300, wherein the test module 100 is used to apply a test signal with preset parameters to the sample to be tested according to the output control signal, and the test signal includes a current signal, and the preset parameters include but are not limited to at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency; the data acquisition module 200 is connected to the test module 100, and is used to control the sample to be tested to access the corresponding test circuit according to the switch action signal, and collect electromigration test parameter information of the sample to be tested, and the electromigration test parameter information is not limited to at least one of a voltage value, a current density value and a test temperature; the control module 300, connected to the test module 100 and the data acquisition module 200 are all connected, and are used to generate the output control signal according to the received test trigger signal to control the test module 100 to generate the test signal; and / or generate a switch action signal according to the test trigger signal to control the data acquisition module 200 to operate, so that the sample to be tested is connected to the corresponding test loop; the control module 300 is also configured to: obtain the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal, obtain the life time of the sample to be tested according to the resistance value of the sample to be tested, obtain life data based on the life times of several samples to be tested, and generate a life prediction equation for the sample to be tested according to the life data, preset parameters and electromigration test parameter information; wherein, when the resistance value of the sample to be tested is greater than the preset resistance threshold, it is determined that the sample to be tested has electromigration failure, and the life data includes but is not limited to at least one of the failure number, failure probability and life time.

[0062] In one embodiment provided in the present application, Figure 3 As shown, an electromigration testing method is provided, comprising:

[0063] Step 22, generating an output control signal according to the received test trigger signal, and controlling the test module to apply a test signal with preset parameters to the sample to be tested;

[0064] The test signal includes a current signal, and the preset parameters include but are not limited to at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency.

[0065] Specifically, the test trigger signal is used to set the preset parameters of the test signal, including current waveform, waveform duty cycle, current amplitude and current frequency. The above parameters are key factors affecting the electromigration life of the sample to be tested. When the preset parameters are set, the electromigration test begins when the power supply is started.

[0066] Step 24, generating a switch action signal according to the test trigger signal, controlling the sample to be tested to access a corresponding test circuit, so as to obtain electromigration test parameter information of the sample to be tested;

[0067] The electromigration test parameter information includes but is not limited to at least one of a voltage value, a current density value and a test temperature.

[0068] Specifically, the electromigration life time is closely related to the test temperature and current density. The higher the temperature and the greater the current density, the faster the electromigration process and the shorter the life time.

[0069] Step 26: Generate a life prediction equation for the sample to be tested according to the preset parameters and the electromigration test parameter information.

[0070] In one embodiment provided in the present application, Figure 4 As shown, step 26, the step of generating a life prediction equation of the sample to be tested according to the preset parameters and the corresponding electromigration test parameter information, comprises:

[0071] Step 262, obtaining the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal;

[0072] Step 264, obtaining the life time of the sample to be tested according to the resistance value;

[0073] Specifically, refer to Figure 2 In the embodiment, when the resistance value suddenly changes and exceeds the preset resistance threshold, it can be determined that the interconnect structure has failed, and the time from the start of the test to the failure is the life time of the sample to be tested.

[0074] Step 266, obtaining life data based on the life times of a plurality of the samples to be tested;

[0075] Step 268, obtaining preset quantile life information of the sample to be tested according to the obtained life data and based on a preset life distribution model;

[0076] Step 2610, according to the preset quantile lifetime information, the preset parameters and the electromigration test parameter information, based on a preset lifetime equation model, obtain a lifetime prediction equation for the sample to be tested.

[0077] It should be noted that in the embodiments provided in the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the system embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0078] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0079] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above integrated units may be implemented in the form of hardware.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution, which should be included in the scope of the claims of the present invention.

Claims

1. An electromigration test circuit, characterized in that: include: A test module, used for applying a test signal with preset parameters to the sample to be tested according to the output control signal, wherein the test signal includes a current signal, and the preset parameters include at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency; A data acquisition module, connected to the test module, for controlling the sample to be tested to access the corresponding test circuit according to the switch action signal, and collecting electromigration test parameter information of the sample to be tested, wherein the electromigration test parameter information includes but is not limited to at least one of a voltage value, a current density value and a test temperature; a control module connected to both the test module and the data acquisition module, and configured to generate the output control signal according to the received test trigger signal, so as to control the test module to generate the test signal; and / or Generate the switch action signal according to the test trigger signal to control the action of the data acquisition module so that the sample to be tested is connected to the corresponding test circuit; The control module is further configured to: obtain the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal, obtain the life time of the sample to be tested according to the resistance value, obtain life data based on the life times of several samples to be tested, and generate a life prediction equation for the sample to be tested according to the life data, the preset parameters and the electromigration test parameter information; When the resistance value is greater than a preset resistance threshold, it is determined that the sample to be tested has electromigration failure, and the life data includes but is not limited to at least one of the number of failures, the probability of failure and the life time.

2. The test circuit according to claim 1, characterized in that: The test module includes: A test chamber, used to provide a preset test temperature for the sample to be tested; A multifunctional power supply is connected to both the control module and the sample to be tested, and is used to apply the test signal to the sample to be tested according to the output control signal.

3. The test circuit according to claim 2, characterized in that: The data acquisition module comprises: A switch array, comprising a plurality of controllable switch units, any of which is connected to the control module and the sample to be tested, and any of which is actuated according to the switch action signal to connect the corresponding sample to be tested to the corresponding test loop; The acquisition device is connected to the switch array and the control module, and is used to acquire the electromigration test parameter information of the sample to be tested, and send the acquired data to the control module.

4. The test circuit according to any one of claims 1 to 3, characterized in that: The life time is the time difference between the first moment and the second moment; The first moment is the moment when the acquisition device is started; the second moment is the moment when the sample to be tested fails.

5. The test circuit according to any one of claims 1 to 3, characterized in that: The control module obtains preset quantile life information of the sample to be tested based on the obtained life data and a preset life distribution model, wherein the preset life distribution model includes but is not limited to at least one of an exponential distribution model, a Weibull distribution model and a lognormal distribution model.

6. The test circuit according to claim 5, characterized in that: Also includes: The control module obtains the life prediction equation according to the preset quantile life information, the preset parameters and the electromigration test parameter information based on a preset life equation model, and the preset life equation model includes but is not limited to the Black equation.

7. An electromigration testing device, characterized in that: include: A test circuit as claimed in any one of claims 1 to 6.

8. An electromigration test method, using the test circuit according to any one of claims 1 to 6 for testing, characterized in that: include: Generate an output control signal according to the received test trigger signal to control the test module to apply a test signal with preset parameters to the sample to be tested, wherein the preset parameters include at least one of a preset waveform, a preset amplitude, a preset duty cycle and a preset frequency; Generate a switch action signal according to the test trigger signal to control the sample to be tested to access the corresponding test circuit to obtain electromigration test parameter information of the sample to be tested, wherein the electromigration test parameter information includes but is not limited to at least one of a voltage value, a current density value and a test temperature; A life prediction equation of the sample to be tested is generated according to the preset parameters and the electromigration test parameter information.

9. The testing method according to claim 8, characterized in that: The step of generating a life prediction equation of the sample to be tested according to the preset parameters and the corresponding electromigration test parameter information comprises: Obtaining the resistance value of the sample to be tested according to the voltage value of the sample to be tested and the current value of the test signal; Obtaining the life time of the sample to be tested according to the resistance value; Acquiring lifespan data based on the lifespans of a number of the samples to be tested; According to the obtained life data, based on a preset life distribution model, obtaining preset quantile life information of the sample to be tested; According to the preset quantile lifetime information, the preset parameters and the electromigration test parameter information, based on a preset lifetime equation model, a lifetime prediction equation of the sample to be tested is obtained.

10. The testing method according to claim 8 or 9, characterized in that: Also includes: A test trigger signal is obtained, where the test trigger signal is used to set the preset parameters.

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