Layered devices and methods for pressure management

Abstract

The present application relates to a layered device. The device includes two base films, a conductive pattern attached to a first base film facing a second base film, and a bonding layer bonding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern includes an exposed portion aligned with the opening in the bonding layer. The device also includes a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least a portion of the space created by the opening in the bonding layer. The present invention also relates to a method for producing a layered device.

Description

Technical Field

[0001] The present application relates to the field of layered devices for electronics. The present application also relates to a method for producing a layered device. Background Art

[0002] Pressure processing techniques are used in the manufacture of layered devices to create sealed and thin electronic devices and potentially form them onto surfaces. These techniques include thermoforming, vacuum forming, lamination, and many other techniques that involve the use of heat and pressure. In pressure processing, components of the device that are fragile or located in exposed areas may be easily damaged by the pressure applied to the structure from the opposite side. SUMMARY OF THE INVENTION

[0004] The device according to the invention is characterized by what is stated in claim 1 .

[0005] The method is characterized by what is stated in claim 19 .

[0006] The term "comprises / comprising" is used in this specification to indicate that the following features or elements are included, but does not exclude the existence of one or more additional features or elements.

[0007] It will be further understood that reference to "a" or "an" item refers to one or more of those items.

[0008] Unless otherwise stated, the expressions "film" and "layer" in this specification are understood to refer to a structure whose lateral dimensions are significantly greater than its thickness. In this sense, a film can be considered a "thin" structure.

[0009] According to a first aspect of the present invention, a device is provided. The device may be a layered device, a layered electronic device, a laminated device, a laminated electronic device or any other suitable device including a circuit. The device comprises a first base film and a second base film positioned parallel to the first base film at a predetermined distance. The first base film and the second base film each comprise two surfaces, one of which faces a corresponding surface of the other film. The first and second base films may be first and second substrates. The words "first" and "second" are used interchangeably and are only used for clarity, for example, if the device is placed horizontally, the first and second base films may each be a bottom film or a top film, etc.

[0010] The device includes a conductive pattern attached to a surface of the first base film facing the second base film. The device also includes a bonding layer that at least partially fills the space between the first base film and the second base film, surrounds a portion of the conductive pattern and bonds the first base film and the second base film together. The bonding layer at least partially connects the first and second base films to each other. The connection can be adhesion or any other type of bonding, such as a non-adhesive layer that bonds the first and second base films together after forming or heat treating.

[0011] The bonding layer includes an opening, the conductive pattern includes at least one exposed portion aligned with the opening in the bonding layer. The device also includes a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least a portion of a space formed by the opening in the bonding layer.

[0012] Openings in the bonding layer and exposed portions of the conductive pattern may be required in various electronic applications to provide access to the conductive pattern and possible connection points. The device according to the first aspect is arranged to undergo thermoforming, vacuum forming, lamination or any other pressure-based and possibly temperature-based manufacturing process. In these processes, if pressure is applied uniformly to the first and second base films, the exposed portions of the conductive pattern that are not covered by the bonding layer due to the opening may be exposed and damaged due to the force of the first and second base films pressing into each other, and due to the brittleness of the conductive pattern. The device according to the first aspect includes at least one spacer that fills at least a portion of the space formed by the opening, thereby providing protection against damage and breakage of the conductive pattern during high pressure processing.

[0013] In one embodiment, at least one end of the exposed portion of the conductive pattern in the device according to the first aspect is in a loose state and detached from the first base film, for example, if the opening in the adhesive layer is adjacent to the boundary of one of the first and / or second base films, so that the exposed portion is located at the edge of the conductive pattern and is therefore only fixed by the adhesive layer and attached to the first base film on one side. This can make it easier to access the exposed portion of the conductive pattern, for example for providing a connection point.

[0014] According to one embodiment, the spacer includes two or more structures rigidly fixed to the first base film and the exposed portion of the conductive pattern, and wherein the structures are positioned adjacent to each other at a predetermined distance.

[0015] The structure according to the embodiment may include posts, spacers or any other structure suitable for preventing excessive pressure from being applied to the conductive pattern during further manufacturing. Two or more structures may also be placed adjacent to an element of the conductive pattern to provide better protection. These structures may be aligned in height so that their upper sides are positioned on substantially the same horizontal plane, thereby forming a discontinuous surface for the upper layer to be pressed against, thereby uniformly protecting the conductive pattern from damage.

[0016] In one embodiment, the spacer structure comprises a material selected from the group consisting of UV crosslinkable polymer inks, heat crosslinkable polymer inks, and thermosetting inks. These materials provide a combination of rigidity, flexibility, and temperature resistance required for protection during the thermoforming process. These materials may also be UV cured.

[0017] In alternative embodiments, the spacer may have a solid shape that is not separated into individual structures.

[0018] According to one embodiment, the spacer includes a release coating that uniformly fills at least a portion of the space formed by the opening in the bonding layer.

[0019] The release coating can provide protection for the conductive pattern and can be used in applications where the conductive pattern has one or more loose ends after thermoforming so that the release coating can be removed (stripped off). However, the posts or other spacing structures from the previous embodiments that are rigidly fixed to the first base film may be more durable and provide higher durability and temperature resistance.

[0020] The release coating may comprise a polymer matrix, a UV or heat cross-linkable polymer. The release coating may be cured by temperature or UV radiation after it is printed and before the device is processed and the coating is stripped. In addition to or as an alternative to cross-linking, the release coating may also comprise a solvent or water-based solution, wherein the solvent or water is evaporated during the drying process after the printing process.

[0021] In further embodiments, the spacer may include a combination of two or more separate spacer structures positioned adjacent to each other rigidly secured to the first base film and a release coating.

[0022] In one embodiment, the first base film and the second base film are non-conductive. This can provide insulation for the conductive pattern between them. The non-conductive first base film and the second base film may include a material selected from the group consisting of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, polyvinyl chloride, polyethylene 2,6-naphthoate, polyimide, polypropylene, polyethylene, and any combination thereof.

[0023] In one embodiment, the first base film and / or the second base film are transparent. Unless otherwise stated, the expression "transparent" in this specification is understood to refer to the optical transparency of the base film or its parts and materials in the relevant wavelength range under discussion. Transparent material or structure refers to a material or structure that allows light or conventional electromagnetic radiation at this relevant wavelength to propagate through this material or structure. The relevant wavelength range may depend on the application in which the laminated transparent film is to be used. In one embodiment, the relevant wavelength range is a visible wavelength range of about 390-700 nanometers. In one embodiment, a preferred wavelength range is 850-1550 nanometers.

[0024] In addition, the transparency of the base film or its parts mainly refers to the transparency of the laminated film or its parts in the thickness direction, so in order to be "transparent", a sufficient part of the light energy incident on the base film or its parts should be transmitted through the base film in the thickness direction. This part may depend on the application in which the base film is to be used. In one embodiment, the transmittance of the first and / or second base film or its parts is 20-99.99% of the light energy vertically incident on the laminated film at the position where the transparent conductor material is present. In one embodiment, the transmittance is 20% or more, or 30% or more, or 40% or more, or 50% or more, or 60% or more, or 70% or more, or 80% or more, 90% or more. The transmittance can be measured according to standard JIS-K7361, ASTM D1003.

[0025] In one embodiment, the conductive pattern comprises a network of conductive high aspect ratio molecular structures (HARM structures).

[0026] Conductive "HARM structures" refer to conductive "nanostructures", that is, structures with one or more characteristic dimensions on the nanoscale (i.e., less than or equal to about 100 nanometers). "High aspect ratio" refers to the fact that there is a significant difference in the size of the conductive structure in two perpendicular directions. For example, the length of the nanostructure may be tens or hundreds of times higher than its thickness and / or width. In a HARM structure network, a large number of said nanostructures are interconnected to form a network of electrically interconnected molecules. From a macroscopic point of view, the HAMS network forms a solid monolithic material in which the individual molecular structures are unoriented or non-oriented (i.e., essentially randomly oriented) or oriented. Various types of HARMS networks can be produced in the form of thin transparent layers with reasonable resistivity.

[0027] In one embodiment, the conductive HARM-structures comprise metal nanowires, such as silver nanowires.

[0028] In one embodiment, the conductive HARM-structure network comprises a carbon nanostructure. In one embodiment, the carbon nanostructure comprises a carbon nanotube, a carbon nanobud, a carbon nanobelt or any combination thereof. In one embodiment, the carbon nanostructure comprises a carbon nanobud, i.e. a carbon nanobud molecule. The carbon nanobud or carbon nanobud molecule has a fullerene or fullerene-like molecule covalently bonded to the side of the tubular carbon molecule. The carbon nanostructure (especially the carbon nanobud) has advantages from the electrical, optical (transparency) and mechanical (robustness combined with flexibility and / or deformability) point of view.

[0029] In one embodiment, the conductive pattern includes at least one set of conductive traces. The conductive traces can be used in various layered electronic devices. In some cases, the conductive traces are particularly fragile and may be easily broken by the pressure applied through the first and second base films, which creates an additional need for protective structures such as spacers according to the first aspect.

[0030] In one embodiment, the device also includes a second conductive pattern attached to the surface of the second base film facing the first base film, wherein the conductive pattern attached to the surface of the first base film facing the second base film is the first conductive pattern. This embodiment provides a device having at least two conductive patterns facing each other and connected to the relative base film. In this embodiment, the spacer protects the first and second conductive patterns from damage, which may be caused by the pressure applied, for example, in thermoforming or lamination. The spacer can also protect the conductive traces from shorting each other.

[0031] In alternative embodiments, the second conductive pattern may be attached to an opposite side of the first base film or an opposite side of the second base film.

[0032] In one embodiment, the first and second conductive patterns are aligned to be separated in the planes of the parallel first and second base films. In this embodiment, the conductive patterns are separated so that they can be insulated from each other and are not damaged during high voltage processing. For example, in applications such as contact sensors, the electrodes can be located on different planes and do not overlap.

[0033] In one embodiment, the bonding layer that at least partially fills the space between the first base film and the second base film and surrounds part of the conductive pattern comprises an adhesive. The bonding layer may also comprise an adhesion promoter selected from the group consisting of acrylic adhesives, silicon adhesives, polymer adhesives, cross-linked polymers, epoxy adhesives, polycarbonates, thermoplastic polyurethanes (TPUs), and any combination thereof.

[0034] The adhesive may be an optically clear adhesive (OCR), which is advantageous in devices requiring a transparent film, such as devices having a display.

[0035] In one embodiment, the adhesive layer is further configured to insulate the portion of the conductive pattern it surrounds. The adhesive can act as an insulator for the conductive pattern, thereby eliminating the need to add other insulating structures or to separate the conductive elements from each other.

[0036] In one embodiment, the spacer fills at least a portion of the space between the exposed portion of the conductive pattern and the second base film. The spacer can also further insulate the exposed portion of the conductive pattern and replace the adhesive in the opening without having adhesive properties and being easy to remove or allowing the components of the device to be loose or detachable (detachable).

[0037] In one embodiment, the spacer comprises a mechanically rigid material capable of withstanding a pressure of at least 5200 bar at a temperature of up to 25° C. In one embodiment, the material is capable of withstanding the pressure at a temperature of up to 180° C. These mechanically rigid materials may comprise a UV curable polymer matrix, a screen printing ink, a water-based polymer matrix or other suitable material. Examples of suitable materials are Nor-Cote UVS-161 for rigidly fixed spacers, and in the case of release coatings Kiwomask S 110, Kiwomask S 111 or Kiwomask S 150.

[0038] In one embodiment, the device comprises three or more base films attached to each other in a stacked manner by an adhesive. In this embodiment, as described in the first aspect, each adjacent pair of base films may include a conductive pattern and a spacer in each layer of adhesive opening.

[0039] In one exemplary embodiment, a touch sensor comprising the device of any previous embodiment is provided. The exposed portion of the conductive pattern comprises at least one electrode of the touch sensor. In other embodiments, touch switches, touch sensors, solar panels, heating elements and other devices can advantageously incorporate the device according to the first aspect.

[0040] In one embodiment, the thickness of the first or second basement membrane is 1-5000 μm, or 10-2000 μm, or 30-500 μm, or 50-300 μm. This preferred size is applicable to most applications of devices, such as contact switches, contact sensors, heating elements and solar cells. However, in some applications, the basement membrane may also be thicker. The first basement membrane and the second basement membrane may have the same or different thicknesses.

[0041] In a second aspect, a method for producing a layered electronic device is provided. The method includes providing a first base film and a second base film positioned parallel to the first base film at a predetermined distance, applying a conductive pattern to a surface of the first base film facing the second base film, printing a spacer on the first base film and a portion of the conductive pattern, preparing a bonding layer by cutting the bonding layer into a predetermined shape including an opening, placing the bonding layer between the first base film and the second base film to at least partially fill the space between the first base film and the second base film, and surrounding the portion of the conductive pattern, aligning the opening in the bonding layer with the position of the spacer printed on the first base film and the portion of the conductive pattern, and treating the resulting layered structure at a predetermined pressure and temperature. The bonding layer may include an adhesive or a thermoplastic film that can melt at a predetermined temperature.

[0042] Can be placed between the first and second basement membranes by various ways.In one embodiment, bonding layer is with pattern printing on the first basement membrane and conductive pattern.The pattern of the bonding layer of printing can comprise one or more openings, therefore in this embodiment, preparation bonding layer and the operation that is placed between the film can be carried out in one step.

[0043] The operation before processing the obtained layered structure can provide a layered device as described in any embodiment of the first aspect. The layered structure obtained by processing finally completes the production of the layered device. According to some embodiments, the processing may include molding, thermoforming, lamination or other pressure treatment techniques. The benefits of the method include production efficiency and improved obtained layered structure, which is particularly protected during the final pressure treatment step.

[0044] In one embodiment, the conductive pattern is applied to the surface of the first base film facing the second base film by depositing the conductive material and etching the conductive material to produce the pattern. In one embodiment, the conductive pattern is also applied to the surface of the second base film. In one embodiment, after the conductive material has been deposited on the first base film and / or the second base film, the conductive pattern is formed in the conductive material.

[0045] In one embodiment, depending on the material of the conductive pattern, various processes available in the art can be used to deposit the conductive material. For example, the conductive material can be deposited by sputtering, printing, electroplating, deposition from a vapor phase, deposition in a force field, deposition from a solution using spraying or spin drying, or by any other suitable method.

[0046] For patterning, various processes can be used. In one embodiment, a laser process, an etching process, direct printing, a mechanical process, a firing process, or any combination thereof is used for patterning. In one embodiment, the laser process is laser ablation. In one embodiment, the etching process is a photolithography process. In one embodiment, the pattern is formed while or after depositing the conductive material on the first and / or second base film.

[0047] According to one embodiment, the operation of applying the conductive pattern and printing the spacers is performed on the second base film before adding the bonding layer between the first base film and the second base film. The conductive pattern on the second base film can face the first base film, or be applied on the opposite surface of the second base film. The operation of the method can also be performed multiple times to create a laminated or multilayer device, the device includes a spacer between the base films to strengthen the exposed portion of the conductive pattern during the pressure treatment.

[0048] In one embodiment, the pressure treatment of the resulting layered structure comprises thermoforming at a temperature of 130-200°C.

[0049] In one embodiment, pressure treatment of the resulting layered structure comprises lamination in vacuum at a temperature of 50-300° C. or 150-300° C. or 170-190° C. According to further embodiments, pressure treatment may comprise a combination of techniques such as thermoforming, lamination, and the like.

[0050] In one embodiment, the method further comprises creating at least one loose end of the conductive pattern by die cutting or laser cutting a portion of the conductive pattern corresponding to the portion of the conductive pattern on which the spacers are printed.

[0051] Producing a loose or detachable end of the conductive pattern prior to processing may provide easier access to the exposed portion of the conductive pattern, for example, if the conductive pattern includes an electrode, for providing a connection point to the electrode.

[0052] In one embodiment, the method further comprises cooling the device after the pressure treatment. The cooling operation may be required to fix the shape, for example after thermoforming or any other process.

[0053] It should be understood that the above benefits and advantages may relate to one embodiment or may relate to several embodiments. These embodiments are not limited to embodiments that solve any or all of the problems shown or embodiments that have any or all of the benefits and advantages.

[0054] The embodiments described above can be used in any combination with each other. Several embodiments can be combined together to form another embodiment. The method, layered device, use or touch-sensitive film involved in the present application can include at least one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The included drawings are used to provide a further understanding of the layered device and its production method, which illustrate embodiments and together with the description help explain the above principles. In the drawings:

[0057] Figure 1a schematically illustrates a cross-sectional view of a layered device according to one embodiment;

[0058] Figure 1b is a schematic cross-sectional view of a layered device with spacers removed according to one embodiment;

[0059] Figure 1c is a schematic cross-sectional view of a layered device having a spacer structure according to one embodiment;

[0060] Figure 1d is a schematic cross-sectional view of a layered device with a combined spacer according to one embodiment;

[0061] Figure 2aschematically illustrates a top view of a device with a lift-off spacer according to one embodiment;

[0062] Figure 2b is a schematic top view of a device having a spacer structure according to one embodiment;

[0063] Figure 3 schematically illustrates a cross-sectional view of a flexible layered device including a loose conductive structure according to one embodiment; and

[0064] Figure 4 is a block diagram of a method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0066] Reference will now be made in detail to the described example embodiments, examples of which are illustrated in the accompanying drawings.

[0067] The following description discloses some embodiments in detail so that those skilled in the art can utilize layered devices and methods based on the present disclosure. Not all steps of the embodiments are discussed in detail, because some steps are obvious to those skilled in the art based on this description.

[0068] For simplicity, in the case of repeated components, the item numbering will be maintained in the following exemplary embodiments.

[0069] The present invention generally relates to layered electronic devices, such as contact switches, contact sensors, contact displays, heating elements, solar cells, etc. In these devices, when pressure treatment such as pressure forming, thermoforming, lamination or any other technology is used in manufacturing, it is usually desirable to provide electrical contact with the layered device by exposing a portion of its conductive element. However, due to the forces generated during the pressure treatment, the exposed portion is easily damaged during the pressure treatment. The device according to an embodiment of the present invention includes an additional spacing element, which prevents such damage and protects the exposed portion of the conductive element. A method according to one aspect provides a method for manufacturing a layered device using a spacer.

[0070] Figure 1a A cross-sectional view of a layered device 100 according to an example embodiment is schematically shown. The device includes a first base film 101, a second base film 102 disposed parallel to the first base film 101, a conductive pattern 104 attached to a surface of the first base film 101 facing the second base film 102, and an adhesive layer 103 therebetween.

[0071] The first and second base films 101, 102 may be non-conductive substrates that insulate the conductive pattern 104. The base films 101, 102 may include a material selected from the group consisting of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, polyvinyl chloride, polyethylene 2,6-naphthoate, polyimide, polypropylene, polyethylene, and any combination thereof.

[0072] According to one embodiment, the conductive pattern 104 is schematically shown as a set of conductive traces. Conductive traces are commonly used in layered electronic devices such as touch sensors. However, the conductive pattern 104 may have any other suitable arrangement of conductive elements.

[0073] The conductive pattern 104 may include a network of conductive high aspect ratio molecular structures (HARM-structures) and may be used in transparent films due to the advantageous properties of some HARM-structures.

[0074] The bonding layer 103 at least partially fills the space between the first base film 101 and the second base film 102, thereby surrounding a portion of the conductive pattern 104 and bonding the first base film 101 and the second base film 102 together. The bonding layer 103 may include an adhesive. The bonding layer 103 may also include an adhesion promoter selected from the following: acrylic adhesive, silicon adhesive, polymer adhesive, cross-linking polymer, epoxy resin adhesive, polycarbonate, thermoplastic polyurethane (TPU) and any combination thereof. The adhesive may be an optically clear adhesive (OCR), which is used for devices requiring a transparent film, such as a device with a display.

[0075] The adhesive layer 103 includes an opening 107, which may be located at a side, such as Figure 1a , or within the perimeter of the device 100. In one embodiment, the openings 107 are arranged at the perimeter of the bonding layer 103 to provide access points.

[0076] The conductive pattern 104 includes at least one exposed portion aligned with the opening 107 in the adhesive layer 103 . Figure 1a-1d The cross-sectional view of FIG. 1 is oriented so that the opening 107 and the exposed portion of the conductive pattern 104 face the viewer.

[0077] The structure provides an access point for the conductive pattern 104, however, if the device 100 is subjected to pressure forming, thermoforming, lamination, or other types of pressure treatments, the exposed portion of the conductive pattern 104 may be damaged by the pressure. This is at least in part because of the opening 107 in the bonding layer 103 required to provide access. The opening 107 exposes a portion of the conductive pattern 104 and removes the support provided by the bonding layer 103 elsewhere in the device 100.

[0078] The device 100 further includes a spacer 105 attached to the first base film 101 and the exposed portion of the conductive pattern 104 , wherein the spacer 105 fills at least a portion of a space created by the opening 107 in the adhesive layer 103 . Figure 1a-1b An embodiment is illustrated in which the spacer 105 comprises a release coating 105 that uniformly fills at least a portion of the space created by the opening 107 in the bonding layer 103. The release coating 105 may comprise a polymer matrix, a UV or heat cross-linkable polymer, or a solvent-based or water-based solution.

[0079] The release coating 105 may have a temporary purpose and may be removed, for example, by stripping, or, if it comprises a solvent-based or water-based solution, partially evaporating. It may be removed after the device fabrication is completed by pressure treatment at a predetermined temperature. The pressure treatment may include thermoforming at a temperature of 130-200° C., or lamination in a vacuum at a temperature of 170-190° C., or any other suitable pressure-based process that seals and / or forms the layers of the device together and onto the surface. Figure 1b The device 100 is shown after thermoforming, wherein the release coating 105 is removed, leaving a space 105 ′, which may be later filled with a filler or remain empty.

[0080] Figure 1c-1d An embodiment is shown in which the spacer includes two or more structures 106 rigidly fixed to the first base film 101 and the exposed portion of the conductive pattern 104. These structures 106 are positioned adjacent to each other at a predetermined distance.

[0081] exist Figure 1c In the illustrated embodiment, the structures 106 are also aligned in height so that their upper surfaces are substantially in the same plane as the lower surface of the second base film 102. Figure 1c In the illustrated embodiment, the structures 106 are shaped as columns, however any other suitable shape may be used for the spacing structures 106 .

[0082] The rigid fixing structure 106 may include a material selected from the group consisting of UV crosslinkable polymer inks, heat crosslinkable polymer inks, and thermosetting inks. These materials may be rigid enough to withstand a pressure of at least 5200 bar at temperatures up to 250° C. while protecting the conductive pattern 104 from damage during the pressure treatment.

[0083] Figure 1d The layered device 100 is shown to include a combination of rigidly fixed pillar or spacer structures 106 and a release additional coating 105". In some embodiments, solid unitary structures can be rigidly fixed to the first base film 101 if the protection against pressure provided by these structures is sufficient.

[0084] Figure 2a is a schematic top view of a layered device 200 having a release coating 206, Figure 2b is a schematic top view of a layered device 200 having a rigid fixing structure 206. Thus, Figure 2a-2b The device 200 shown in FIG. 1 may be Figure 1a-1d An example of a device 100 is shown in FIG. Figure 2b In the figure, the rigid fixing structure is shown schematically only and can be located anywhere within the cross-dashed area 206.

[0085] exist Figure 2a-2b In the embodiment, the conductive pattern 204 is shown extending into the device, for example in a touch sensor embodiment. The conductive pattern 204 includes an exposed portion having an exposed end 207. The end 207 or the entire exposed portion of the conductive pattern 204 can be loosened and separated from the first base film ( Figure 2a-2b ). The second base film 202 is illustrated as a top film in the device 200. The first and / or second base films 202 may be transparent.

[0086] In addition to the first conductive pattern 204 attached to the first base film, as shown in FIG. Figure 2a-2b As shown, as the external part of the circuit and two pins located on the outside, the device 200 may also include a second conductive pattern 214 (or any number thereof). The second conductive pattern 214 is attached to the second base film 202 at the surface facing the first base film. Figure 2a-2b 2, according to the present embodiment, the second conductive pattern 214 is attached to the inward surface of the second upper base film 202. The first and second conductive patterns 204, 214 in the present embodiment are aligned to be separated in the planes parallel to the first and second base films 202. In this way, the conductive patterns 204, 214 are arranged to avoid contact with each other during the pressure treatment.

[0087] Figure 3 is a schematic side view of an example layered device including two conductive patterns 304, 314 respectively attached to a first base film 301 and a second base film 302. The device includes a non-conductive adhesive layer 303 insulating the conductive patterns 304, 314 and filling the space between the first and second base films 301, 302.

[0088] The device also includes an opening in the adhesive layer 303, which is formed by Figure 3 The device also includes a spacer 305 positioned between the conductive layers 304 and 314 to replace the adhesive in the opening. The exposed portion of the conductive pattern 314 is loosened and separated from the first base film for easier external access ( Figure 3 on the right side of the Figure 3In the embodiment, at least the material of the second base film 302 allows it to have flexibility.

[0089] Figure 4 4 is a flow chart of a method for producing a layered electronic device according to one aspect. The method includes providing a first base film and a second base film 401 positioned parallel to each other. The base films may be provided in a chamber or reactor for further assembly. The method also includes applying a conductive pattern 402 to the upper surface of the first base film and printing a spacer 403 on the first base film and a portion of the conductive pattern. Then, the method includes forming a bonding layer 404 that fills the space between the first and second base films. The method also includes creating an opening 405 in the bonding layer that is aligned with the spacer, for example by cutting it into a predetermined shape so that the opening is aligned with the position of the spacer printed on the first base film and a portion of the conductive pattern.

[0090] The method is completed by pressure treating the resulting layered structure 406 at a predetermined temperature. The pressure treatment can be performed in any suitable manner, including applying pressure to one or both of the base films. In one embodiment, the pressure treatment also includes treating the resulting layered structure with UV cross-linking. In some examples, the pressure treatment 406 of the resulting layered structure may include thermoforming at a temperature of 130-200° C., or any other suitable technique, such as lamination and vacuum forming.

[0091] The operations before processing the resulting layered structure can provide layered devices, such as Figure 1a-3 The invention relates to any layered device shown in . Processing the resulting layered structure finally completes the production of the layered device. According to some embodiments, the processing may include molding, thermoforming, lamination or other pressure treatment techniques. The benefits of the method include production efficiency and improved resulting layered structure, which is protected especially during the final pressure treatment step.

[0092] The conductive pattern may be applied to the surface of the first base film facing the second base film by depositing a conductive material and etching the conductive material to produce a pattern. A second conductive pattern may also be applied to the surface of the second base film.

[0093] Before forming 404 the bonding layer between the first base film and the second base film, the operations of applying the conductive pattern 402 and printing the spacer 403 can be performed on the second base film. The conductive pattern on the second base film can face the first base film, or be applied on the opposite surface of the second base film. The operations of the method can also be performed multiple times to produce a laminated or multilayer device, the device including a spacer between the base films to strengthen the exposed portion of the conductive pattern during the pressure treatment.

[0094] The method also includes creating at least one loose end of the conductive pattern by die cutting or laser cutting a portion of the conductive pattern corresponding to the portion of the conductive pattern where the spacers are printed.

[0095] Producing a loose or detachable end of the conductive pattern prior to processing 406 may provide easier access to the exposed portion of the conductive pattern, for example, for providing a connection point to the electrode if the conductive pattern includes an electrode.

[0096] After the pressure treatment 406, the method may further include cooling the device ( Figure 4 (not shown above). A cooling operation may be required to fix the shape, for example after thermoforming or any other process.

[0097] As is clear to a person skilled in the art, the invention is not limited to the examples and embodiments described above, but these embodiments may now vary freely within the scope of the claims.

Claims

1. A layered device comprising: The first basement membrane, a second base film positioned parallel to the first base film at a predetermined distance, a conductive pattern attached to a surface of the first base film facing the second base film, an adhesive layer that at least partially fills a space between the first base film and the second base film, surrounds a portion of the conductive pattern, and bonds the first base film and the second base film together, in: The bonding layer comprises an opening, The conductive pattern includes at least one exposed portion aligned with the opening in the bonding layer, and at least one end portion of the exposed portion of the conductive pattern is loose and detached from the first base film, and The device also includes a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least a portion of a space created by the opening in the adhesive layer. 2 . The device of claim 1 , wherein the spacer comprises two or more structures rigidly fixed to the first base film and the exposed portion of the conductive pattern, and wherein the structures are positioned adjacent to each other at a predetermined distance.

3. The device of claim 2, wherein the structure comprises a material selected from the group consisting of: UV cross-linkable polymer ink, thermal cross-linkable polymer ink, and thermosetting ink. 4 . The device of claim 1 , wherein the spacer comprises a release coating that uniformly fills at least a portion of a space created by the opening in the bonding layer.

5. The device of claim 4, wherein the release coating comprises a polymer matrix, a UV or thermally cross-linkable polymer, or a solvent-based or water-based solution.

6. The device of any one of claims 1 to 5, wherein the first base film and the second base film are non-conductive.

7. The device of claim 6, wherein the first base film and the second base film comprise a material selected from the group consisting of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, polyvinyl chloride, polyethylene 2,6-naphthoate, polyimide, polypropylene, polyethylene, and any combination thereof.

8. The device according to any one of claims 1 to 5, wherein the first base film and / or the second base film is transparent.

9. The device of any one of claims 1-5, wherein the conductive pattern comprises a network of conductive high aspect ratio molecular structures.

10. The device of any one of claims 1-5, wherein the conductive pattern comprises at least one set of conductive traces.

11. The device of any one of claims 1 to 5, comprising a second conductive pattern attached to a surface of the second base film facing the first base film, wherein the conductive pattern attached to a surface of the first base film facing the second base film body is a first conductive pattern. 12 . The device of claim 11 , wherein the first conductive pattern and the second conductive pattern are aligned to be separated in a plane where the first base film and the second base film are parallel. 13 . The device of claim 1 , wherein the bonding layer at least partially filling a space between the first base film and the second base film and surrounding a portion of the conductive pattern comprises an optically transparent adhesive.

14. The device of any one of claims 1 to 5, wherein the adhesive layer is further configured to insulate a portion of the conductive pattern that it surrounds.

15. The device of any one of claims 1 to 5, wherein the spacer fills at least a portion of a space between the exposed portion of the conductive pattern and the second base film.

16. The device of any one of claims 1-5, wherein the spacer comprises a mechanically rigid material capable of withstanding a pressure of at least 5200 bar at a temperature up to 250°C.

17. A touch sensor comprising the device of any one of claims 1 to 16, wherein the exposed portion of the conductive pattern comprises at least one electrode of the touch sensor.

18. A method for producing a layered electronic device comprising: Providing a first base film and a second base film positioned parallel to the first base film at a predetermined distance; applying a conductive pattern to a surface of the first base film facing the second base film; printing a spacer on the first base film and a portion of the conductive pattern; preparing the bonding layer by cutting the bonding layer into a predetermined shape including an opening; placing the bonding layer between the first base film and the second base film to at least partially fill the space between the first base film and the second base film and surround a portion of the conductive pattern so that an opening in the bonding layer is aligned with a spacer printed on the first base film and a portion of the conductive pattern, and wherein the conductive pattern includes at least one exposed portion aligned with the opening in the bonding layer, and at least one end portion of the exposed portion of the conductive pattern is loose and detached from the first base film; and The resulting layered structure is pressure treated at a predetermined temperature.

19. The method of claim 18, wherein the conductive pattern is applied to the surface of the first base film facing the second base film by depositing a conductive material and etching the conductive material to produce a pattern.

20. The method of any one of claims 18-19, wherein the operations of applying the conductive pattern and printing the spacer are performed on the second base film before adding the adhesive between the first base film and the second base film.

21. The method of any one of claims 18-19, wherein the pressure treatment of the resulting layered structure comprises thermoforming at a temperature of 130-200°C.

22. The method of any one of claims 18 to 19, wherein the pressure treatment of the resulting layered structure comprises: o The lamination was carried out at a temperature of C.

23. The method of claim 22, wherein the pressure treatment of the resulting layered structure comprises: o The lamination was carried out at a temperature of C.

24. The method of any one of claims 18-19, further comprising creating at least one loose end of the conductive pattern by die cutting or laser cutting a portion of the conductive pattern corresponding to the portion of the conductive pattern on which the spacers are printed.

25. The method of any one of claims 18-19, further comprising cooling the device after pressure treating.

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