Substrate processing apparatus

Abstract

A substrate processing apparatus of the present invention processes a substrate by supplying a fluid to the substrate, and includes the following elements: a first processing housing; a processing section provided inside the first processing housing for processing a substrate placed on a placement section with a fluid; a first supply section disposed on one side of the processing section when viewed from a front side surface of the first processing housing for maintenance, for supplying a first fluid to the processing section; and a second supply section disposed on the other side of the processing section when viewed from the front side surface, for supplying a second fluid to the processing section.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus that processes a substrate (hereinafter, simply referred to as a substrate) such as a semiconductor wafer, a liquid crystal display or an organic EL (Electroluminescence) display device substrate, a photomask glass substrate, an optical disc substrate, a magnetic disc substrate, a ceramic substrate, a solar cell substrate, or the like by supplying a processing liquid or a processing gas or the like to the substrate. BACKGROUND

[0002] Conventionally, such an apparatus has a housing, a processing section, and a supply section. For example, refer to Japanese Patent Laid-Open No. 2017-163103 ( Figure 1 ). The housing has the processing section and the supply section. The processing section processes the substrate with various processing liquids. The supply section supplies the processing section with various processing liquids. The supply section is disposed so as to be adjacent to only one side of the processing section in the left-right direction when viewed from the front side surface where a worker enters and exits when performing maintenance on the apparatus. The one side is, for example, the right side. The supply section supplies, for example, two kinds of processing liquids (for example, acid, alkali) to the processing section.

[0003] The housing is provided with a carrying-in / carrying-out port for transferring the substrate between the processing section at the back side surface opposite to the front side surface of the apparatus. The processing section has a substrate placement section for placing the substrate in the center when viewed from above. The supply section has a nozzle for supplying the processing liquid. The front end portion of the nozzle is turned between a supply position above the substrate placement section and a standby position away from the substrate placement section. The turning is performed with the base end portion of the nozzle as an axis. In this configuration, two nozzles are provided, and each nozzle is dispersedly disposed in the processing section so as not to interfere with each other.

[0004] The base end portion of each nozzle is dispersedly disposed around the substrate placement section in the processing section. Specifically, the base end portion of one nozzle is disposed on the right side when viewed from the front side surface of the processing section. One nozzle is disposed along one side of the processing section from the front side surface to the back side surface when viewed from above. One nozzle is disposed along the front side surface from the supply section, and is supplied with the processing liquid through a pipe. The base end portion of the other nozzle is disposed on the left side when viewed from the front side surface of the processing section. The other nozzle is disposed along one side of the processing section from the front side surface to the back side surface when viewed from above. That is, the other nozzle is disposed at a position farther from the supply section than one nozzle. In other words, the other nozzle is disposed on the opposite side of the supply section with the substrate placement section of the processing section interposed therebetween.

[0005] However, the conventional example having this configuration has the following problems.

[0006] That is, in the conventional apparatus, another nozzle needs to be connected to the piping from the supply portion along the back surface in order to avoid the piping of the one nozzle arranged along the front surface. Therefore, the other nozzle is arranged at a position farthest from the front surface where maintenance is performed, so it is difficult to access the piping. As a result, there is a problem that the maintenance is poor. In addition, if the piping is connected along the back surface, the length of the piping becomes long. When the length of the piping is thus long, there are problems that the amount of the treatment liquid that remains increases, or the amount of the treatment liquid that is not warmed up increases. SUMMARY

[0007] The present application has been achieved in view of such circumstances, and has an object to provide a substrate processing apparatus that can improve the maintenance and shorten the length of the piping by designing the arrangement.

[0008] The present application has the following configuration in order to achieve the object.

[0009] The present application is a substrate processing apparatus that processes a substrate by supplying a fluid to the substrate, the apparatus including the following elements: a first processing housing; a processing portion provided inside the first processing housing, for processing a substrate placed on a placement portion with a fluid; a first supply portion arranged on one side of the processing portion, when viewed from a front surface of the first processing housing where maintenance is performed, for supplying a first fluid to the processing portion; and a second supply portion arranged on the other side of the processing portion, when viewed from the front surface, for supplying a second fluid to the processing portion.

[0010] According to the present application, the substrate processing apparatus has the processing portion in the first processing housing, and has the first supply portion that supplies the first fluid to the processing portion, and the second supply portion that supplies the second fluid to the processing portion. The first supply portion is arranged on one side of the processing portion, when viewed from the front surface of the first processing housing, and the second supply portion is arranged on the other side of the processing portion, when viewed from the front surface of the first processing housing. Therefore, the first supply portion or the second supply portion is not arranged on the back surface that is on the opposite side of the front surface and is difficult to access. As a result, the first supply portion and the second supply portion can be easily accessed from the front surface, so the maintenance can be improved. In addition, the first supply portion and the second supply portion can shorten the length of the piping.

[0011] In addition, in the present application, it is preferable that the first supply portion has a first nozzle that supplies the first fluid to a substrate placed on the placement portion, and a first fluid supply portion that supplies the first fluid to the first nozzle, and the second supply portion has a second nozzle that supplies the second fluid to a substrate placed on the placement portion, and a second fluid supply portion that supplies the second fluid to the second nozzle.

[0012] The first nozzle and the first fluid supply portion are arranged on one side of the processing portion when viewed from the front side of the first processing housing. The second nozzle and the second fluid supply portion are arranged on the other side of the processing portion when viewed from the front side of the first processing housing. Therefore, the first nozzle and the first fluid supply portion, and the second nozzle and the second fluid supply portion can be easily accessed from the front side, so that the maintainability can be improved.

[0013] In the present application, it is preferable that the first nozzle includes a base end portion supplied with the first fluid from the first fluid supply portion, a nozzle portion in communication with the base end portion, and an arm connecting the base end portion and the nozzle portion, and the base end portion is arranged on the first fluid supply portion side more than the placement portion, and the nozzle portion swings between a supply position above the placement portion and a standby position away from the placement portion with the base end portion as a center, and the second nozzle includes a base end portion supplied with the second fluid from the second fluid supply portion, a nozzle portion in communication with the base end portion, and an arm connecting the base end portion and the nozzle portion, and the base end portion is arranged on the second fluid supply portion side more than the placement portion, and the nozzle portion swings between a supply position above the placement portion and a standby position away from the placement portion with the base end portion as a center.

[0014] The base end portion of the first nozzle is arranged on the first fluid supply portion side more than the placement portion. The base end portion of the second nozzle is arranged on the second fluid supply portion side more than the placement portion. Therefore, the first fluid supply portion and the base end portion of the first nozzle can be in communication with each other on the front side. In addition, the second fluid supply portion and the base end portion of the second nozzle can be in communication with each other on the front side. As a result, the distance of the communication can be shortened, so that the maintainability can be improved.

[0015] In the present application, it is preferable that the first fluid and the second fluid are different fluids.

[0016] The first fluid is, for example, any one of an organic solvent, an acidic solution, an alkaline solution, and an inert gas. The second fluid is a fluid different from the first fluid. Since different fluids can be supplied to the processing portion, various processing can be performed.

[0017] In the present application, it is preferable that the first fluid and the second fluid are liquids.

[0018] The first fluid and the second fluid are, for example, an organic solvent, an acidic solution, or an alkaline solution.

[0019] Further, in the present application, preferably, the first fluid supply section includes: a first fluid storage section that stores the first fluid, and includes a delivery section that delivers the first fluid and a return section that returns the first fluid; a supply pipe that is communicatively connected to the delivery section of the first fluid storage section; a return pipe that is communicatively connected to the return section of the first fluid storage section; a recovery section that is provided at the standby position and recovers the first fluid supplied from the first nozzle; a discharge pipe that is communicatively connected to the recovery section and discharges the first fluid recovered by the recovery section; a supply branch pipe that has one end portion communicatively connected to the supply pipe and the other end portion communicatively connected to the base end portion; a flow meter that measures the flow rate of the first fluid in the supply branch pipe; a flow rate adjustment valve that is provided at the base end portion side of the supply branch pipe than the flow meter and controls the flow rate of the first fluid in the supply branch pipe; and a supply control valve that controls the supply and stop of the first fluid adjusted by the flow rate adjustment valve from the nozzle.

[0020] The first fluid supply section includes the first fluid storage section, the supply pipe communicatively connected to the delivery section, the supply branch pipe branched from the supply pipe and communicatively connected to the base end portion, the flow meter, the flow rate adjustment valve provided at the base end portion side of the supply branch pipe than the flow meter and controlling the flow rate of the first fluid in the supply branch pipe, and the supply control valve. Therefore, the supply and stop of the first fluid from the nozzle can be controlled by the supply control valve while the flow rate is controlled by the flow rate adjustment valve and the flow rate is monitored by the flow meter.

[0021] Further, in the present application, preferably, the flow rate adjustment valve is disposed at a position close to the front side surface of the first processing housing.

[0022] The flow rate adjustment valve is disposed at a position close to the front side surface of the first processing housing. Therefore, maintenance of the flow rate adjustment valve can be easily performed.

[0023] Further, in the present application, preferably, the first fluid supply section further includes: a return pipe that is communicatively connected at one end side between the supply control valve and the flow rate adjustment valve in the supply branch pipe and communicatively connected at the other end side to the return pipe; and a return switch valve that is provided at the return pipe and allows and blocks the passage of the first fluid in the return pipe; and when the first nozzle is located at the standby position, the supply control valve is closed, the return switch valve is opened, the first fluid is returned to the first fluid storage section via the return pipe, and the first fluid is circulated.

[0024] If the first fluid remains in the piping path for a long time, there is a case where dirt accumulates in the first fluid or a component of the piping dissolves to degrade the quality. When the first nozzle is in the standby position, the supply control valve is closed, the return switch valve is opened, and the first fluid is circulated by returning to the first fluid storage portion via the return piping. Therefore, the first fluid does not remain in the piping path for a long time. As a result, the quality of the first fluid can be inhibited from degrading, so the substrate can be processed with high cleanliness.

[0025] In addition, in the present application, it is preferable to be provided with: a first manual switch valve provided in the supply branch pipe to manually allow and block the flow of the first fluid in the supply branch pipe; and a second manual switch valve provided in the return piping to manually allow and block the flow of the first fluid in the return piping.

[0026] By manually operating the first manual switch valve and the second manual switch valve to block, the first nozzle can be separated from the supply pipe. Therefore, maintenance of the first nozzle can be performed without stopping the supply from the first fluid storage portion.

[0027] In addition, in the present application, it is preferable that the first fluid is an organic solvent, the flowmeter and the flow adjustment valve are housed in a shielded container in which a gas atmosphere is shielded from the outside, and the inside of the shielded container is evacuated.

[0028] The flowmeter and the flow adjustment valve provided in the supply branch pipe can become an ignition source of gas generated by evaporation of the organic solvent. Therefore, the flowmeter and the flow adjustment valve are housed in a shielded container, and the inside is evacuated, so it is possible to prevent gas generated by evaporation of the organic solvent from remaining in the shielded container. Therefore, it is possible to configure an explosion-proof structure, so that processing can be safely performed.

[0029] In addition, in the present application, it is preferable that the first manual switch valve and the second manual switch valve are disposed at a position close to the front surface of the first processing housing.

[0030] The first manual switch valve and the second manual switch valve are operated to allow and block the flow of the supply branch pipe and the return piping for maintenance. Therefore, the first manual switch valve and the second manual switch valve are disposed at a position close to the front surface of the first processing housing, so they can be easily operated at the time of maintenance.

[0031] In addition, in the present application, it is preferable that the base end portions of the first nozzle and the second nozzle are disposed at a position close to the front surface of the first processing housing.

[0032] The base end portion is supplied with the first fluid or the second fluid. Therefore, since the base end portion is disposed at a position close to the front side surface of the first processing housing, maintenance related to the supply of the first fluid or the second fluid can be made easy.

[0033] In addition, in the present application, it is preferable that an exhaust tank that exhausts gas from the processing portion be disposed adjacent to the first supply portion.

[0034] The exhaust tank is provided adjacent to the first supply portion. Therefore, the use efficiency of the space on the first supply portion side in the first processing housing can be improved.

[0035] In addition, in the present application, it is preferable that a second processing housing that is disposed below the first processing housing, the second processing housing including a processing portion disposed inside the second processing housing for processing a substrate placed on a placement portion with a fluid, a first fluid supply portion disposed on one side of the processing portion to supply the processing portion with a first fluid, and a second fluid supply portion disposed on the other side of the processing portion to supply the processing portion with a second fluid, be further provided.

[0036] Even in a substrate processing apparatus of a multi-layered configuration in which a second processing housing is disposed below a first processing housing, the first supply portion or the second supply portion is not disposed on a back surface that is on the opposite side of the front surface and is difficult to access. As a result, both the first supply portion and the second supply portion can be easily accessed from the front surface, so the maintainability can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0037] To illustrate the application, several forms now preferred are shown in the accompanying drawings, in which:

[0038] Figure 1 is a cross-sectional view of a substrate processing apparatus of an embodiment.

[0039] Figure 2 is a longitudinal cross-sectional view of the substrate processing apparatus in the front-rear direction.

[0040] Figure 3 is a longitudinal cross-sectional view of the arrow E-E of Figure 1

[0041] Figure 4 is a right side view showing the configuration of the right portion of the substrate processing apparatus.

[0042] Figure 5 is a left side view showing the configuration of the left portion of the substrate processing apparatus.

[0043] ​Figure 6 is a cross-sectional view of a processing unit.

[0044] Figure 7 is a schematic view of a supply system of the 1st supply unit.

[0045] Figure 8 is a schematic view of a case where the 1st supply unit is in a standby state.

[0046] Figure 9 is a schematic view of a case where the 1st fluid is supplied from the 1st supply unit.

[0047] Figure 10 is a schematic view of a case where the supply system of the 1st supply unit is maintained. DETAILED DESCRIPTION

[0048] Hereinafter, an embodiment of the present application will be described with reference to the drawings. Figure 1 is a cross-sectional view of a substrate processing apparatus of the embodiment. Figure 2 is a longitudinal cross-sectional view of a front-rear direction X of the substrate processing apparatus.

[0049] <Configuration of Substrate Processing Apparatus>

[0050] The substrate processing apparatus 1 processes a substrate W. The substrate W is, for example, a semiconductor wafer. The substrate W is a substantially circular thin flat plate.

[0051] The substrate processing apparatus 1 has a transfer conveyance section 3 and a processing block 5. The processing block 5 is connected to the transfer conveyance section 3. The transfer conveyance section 3 and the processing block 5 are arranged in a horizontal direction. The transfer conveyance section 3 hands over the substrate W between the processing block 5. The processing block 5 processes the substrate W with a fluid. The fluid is, for example, a processing liquid or a processing gas.

[0052] In the present specification, for convenience, the horizontal direction in which the transfer conveyance section 3 and the processing block 5 are arranged is referred to as a "front-rear direction X". A direction on the front-rear direction X from the processing block 5 toward the transfer conveyance section 3 is referred to as a "front direction". A direction opposite to the front direction is referred to as a "rear direction". A horizontal direction orthogonal to the front-rear direction X is referred to as a "width direction Y". One direction of the "width direction Y" is appropriately referred to as a "right direction". A direction opposite to the right direction is referred to as a "left direction". A direction perpendicular to the horizontal direction is referred to as a "vertical direction Z". In each drawing, as a reference, the front, the rear, the right, the left, the upper, and the lower are appropriately shown. When it is not necessary to particularly distinguish the "front direction", the "rear direction", the "right direction", and the "left direction", they are referred to as "side directions".

[0053] <Configuration of Transfer Conveyance Section 3>

[0054] The transfer conveyance section 3 has a plurality of carrier placement sections 7. In the present embodiment, the transfer conveyance section 3 has four carrier placement sections 7. The carrier placement sections 7 are arranged in the width direction Y. Each of the carrier placement sections 7 places one carrier C. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

[0055] The transfer conveyance section 3 has a conveyance space 9. The conveyance space 9 is disposed behind the carrier placement sections 7. The conveyance space 9 is a space extending in the width direction Y along the four carrier placement sections 7.

[0056] The transfer conveyance section 3 has one conveyance mechanism 11. The conveyance mechanism 11 is provided in the conveyance space 9. The conveyance mechanism 11 is disposed behind the carrier placement sections 7. The conveyance mechanism 11 conveys the substrates W. The conveyance mechanism 11 can access the carriers C placed in the carrier placement sections 4.

[0057] The conveyance mechanism 11 has two hands 13a, 13b and a hand drive section 15. The hands 13a, 13b each support one substrate W in a horizontal posture. The hand drive section 15 has a multi-joint arm that moves the two hands 13a, 13b. The hand drive section 15 moves the two hands 13a, 13b in the front-rear direction X, the width direction Y, and the vertical direction Z. The hand drive section 15 rotates the two hands 13a, 13b about the axis of the vertical direction Z. The conveyance mechanism 11 can access each of the carriers C on the four carrier placement sections 4. The conveyance mechanism 11 itself is fixed and does not move in the width direction Y. Only the two hands 13a, 13b can move in the width direction Y.

[0058] <Configuration of the processing block 5>

[0059] Referring to Figure 1 and Figure 2 The processing block 5 has, for example, two conveyance mechanisms 17A, 17B and, for example, 24 (a plurality of) processing units 19. The 24 processing units 19 each perform a prescribed process on the substrate W conveyed by one of the two conveyance mechanisms 17A, 17B using a prescribed processing liquid or processing gas. The 24 processing units 19 are arranged and disposed along the conveyance paths of the two conveyance mechanisms 17A, 17B. The 24 processing units 19 are disposed facing each other in the width direction Y across the conveyance paths, and further are disposed in layers in the up-down direction. The detailed configuration of the processing block 5 will be described.

[0060] The processing block 5 has a conveyance space 21A. The conveyance space 21A is disposed at the central portion of the processing block 11 in the width direction Y. The conveyance space 21A extends in the front-rear direction X. The front portion of the conveyance space 21A is connected to the conveyance space 9 of the transfer conveyance section 3.

[0061] The processing block 5 has a substrate placement portion 23A. The substrate placement portion 23A is provided in the conveyance space 21A. The substrate placement portion 23A is arranged at a front portion of the conveyance space 21A. The conveyance mechanism 11 of the transfer conveyance portion 3 is also able to enter and exit the substrate placement portion 23A. The substrate placement portion 23A places one or a plurality of substrates W.

[0062] The processing block 5 has a conveyance mechanism 17A. The conveyance mechanism 17A is provided in the conveyance space 21A. The conveyance mechanism 17A conveys the substrate W. The conveyance mechanism 17A is able to enter and exit the substrate placement portion 23A.

[0063] As shown in Figure 1 , the processing block 5 has four processing units 19A, 19B, 19C, 19D. The processing units 19A, 19B are arranged at right sides of the conveyance space 21A. The processing units 19A, 19B are arranged in the front-rear direction X along the conveyance space 21A. The processing unit 19B is arranged at a rear side of the processing unit 19A. The processing units 19C, 19D are arranged at left sides of the conveyance space 21A. The processing units 19C, 19D are arranged in the front-rear direction X along the conveyance space 21A. The processing unit 19D is arranged at a rear side of the processing unit 19C. The two processing units 19A, 19B and the two processing units 19C, 19D are arranged facing each other with the conveyance space 21A therebetween.

[0064] Further, when the processing units 19A, 19B, 19C, 19D are not distinguished, the processing units 19 are simply referred to. The processing units 19 perform processing on the substrate W.

[0065] Referring to Figure 2 , the processing block 5 has a conveyance space 21B in addition to the conveyance space 21A. The conveyance space 21B is arranged below the conveyance space 21A. The conveyance space 21B overlaps the conveyance space 21A when viewed from above. The conveyance space 21B has substantially the same shape as the conveyance space 21A. The conveyance space 21B is also connected to the conveyance space 9 of the transfer conveyance portion 3. When the conveyance spaces 21A, 21B are not distinguished, the conveyance spaces 21 are simply referred to.

[0066] The processing block 5 has one partition wall 25. The partition wall 25 is arranged below the conveyance space 21A and above the conveyance space 21B. The partition wall 25 has a horizontal plate shape. The partition wall 25 separates the conveyance space 21A from the conveyance space 21B.

[0067] The processing block 5 has the substrate placing portion 23B in addition to the substrate placing portion 23A. The substrate placing portion 23B is provided in the conveyance space 21B. The substrate placing portion 23B is arranged below the substrate placing portion 23A. The substrate placing portion 23B overlaps the substrate placing portion 23A in plan view. The substrate placing portion 23B is arranged at the same position as the substrate placing portion 23A in plan view. The substrate placing portion 23B is arranged at the front portion of the conveyance space 21B. The conveyance mechanism 11 of the transfer conveyance portion 3 can also access the substrate placing portion 23B. The substrate placing portion 23B places one or a plurality of substrates W.

[0068] The processing block 5 has the conveyance mechanism 17B in addition to the conveyance mechanism 17A. The conveyance mechanism 17B is provided in the conveyance space 21B. The conveyance mechanism 17B conveys the substrate W. The conveyance mechanism 17B can access the substrate placing portion 23B.

[0069] The conveyance mechanism 17B has the same structure as the conveyance mechanism 17A. When the conveyance mechanisms 17A and 17B are not distinguished, the conveyance mechanism is simply referred to as the conveyance mechanism 17.

[0070] Referring to Figure 1 and Figure 2 . Each conveyance mechanism 17 has a hand 27 and a hand driving portion 29. The hand 27 supports one substrate W in a horizontal posture. The hand driving portion 29 is coupled to the hand 27. The hand driving portion 29 moves the hand 27 in the front-rear direction X, the width direction Y, and the vertical direction Z. The hand driving portion 29 rotates the hand 27 about the axis of the vertical direction Z.

[0071] Referring to Figures 1 to 5 . Figure 3 is a longitudinal sectional view taken along the arrow E-E of Figure 1 . Figure 4 is a right side view showing the configuration of the right portion of the substrate processing apparatus. Figure 5 is a left side view showing the configuration of the left portion of the substrate processing apparatus.

[0072] The processing block 5 has six processing units 19A. The six processing units 19A are arranged in layers in the up-down direction. That is, the six processing units 19A are arranged in a row in the vertical direction Z. Similarly, the processing block 5 has six processing units 19B, six processing units 19C, and six processing units 19D. The six processing units 19B, the six processing units 19C, and the six processing units 19D are arranged in layers in the up-down direction, respectively.

[0073] Figure 2The upper-layer conveyance mechanism 17A hands over the substrate W between the 12 (4 x 3 layers on the upper side) processing units 19 on the upper side. In addition, the lower-layer conveyance mechanism 17B hands over the substrate W between the 12 (4 x 3 layers on the lower side) processing units 19 on the lower side. Further, the conveyance mechanism 17 can access the placement portions 31 of the processing units 19.

[0074] <Configuration of processing unit 19>

[0075] Figure 6 is a cross-sectional view of the processing unit. The 24 processing units 19 each have a processing portion 33, a first space 35, and a second space 37. In the following description, the processing unit 19 (19C) disposed in front of and on the left of Figure 1 in each of the processing units 19 will be described taking the processing unit 19 (19C) disposed in front of and on the left of

[0076] The processing portion 33 has a placement portion 31 on which the substrate W is placed. The placement portion 31 rotates while holding the substrate W. The processing portion 33 processes the substrate W held and rotated by the placement portion 31. The first space 35 has a first supply portion 41 that supplies a first fluid to the processing portion 33. The first fluid is, for example, an organic solvent. In addition, the first space 35 has an exhaust tank 43 that switches a plurality of exhausts. The exhaust tank 43 communicates with the processing portion 33 via an exhaust port 45 in order to exhaust the inside of the processing portion 33. In addition, the exhaust tank 43 communicates with three exhaust pipes 44 that extend in the vertical direction. The exhaust tank 43 exhausts only any one of the three exhaust pipes 44 by switching operation. The exhaust tank 43 is disposed in the first space 35 so as to be adjacent to the first supply portion 41 in the width direction Y. The exhaust tank 43 is disposed on the right of the first supply portion 41 in the width direction Y.

[0077] The second space 37 has a second supply portion 45 that supplies a second fluid to the processing portion 33. The second fluid is, for example, an alkaline processing liquid. The alkaline processing liquid contains, for example, at least one of an ammonia hydrogen peroxide water mixed solution (SC1), ammonia water, an ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH). The second space 37 has a third supply portion 46 that supplies a third fluid to the processing portion 33. The third fluid is, for example, an acidic processing liquid. The acidic processing liquid contains, for example, at least one of hydrofluoric acid, a hydrofluoric acid hydrogen peroxide water mixed solution, hydrochloric acid, a sulfuric acid hydrogen peroxide water mixed solution, nitrofluoric acid (a mixed solution of hydrofluoric acid and nitric acid), and hydrochloric acid.

[0078] The processing unit 19 separately arranges the first space 35 and the second space 37 in front and back of the processing portion 33 in the front-back direction X. Therefore, the first space 35 and the second space 37 can be separately used according to the use or the kind. As a result, the arrangement efficiency of the piping of the processing liquid or the exhaust in the first space 35 and the second space 37 can be improved.

[0079] Further, the processing units 19 correspond to "first processing casings" in the present application, and the processing units 19 located below the processing units 19 correspond to "second processing casings" in the present application. The first supply portions 41 correspond to "first fluid supply portions" in the present application, and the second supply portions 45 correspond to "second fluid supply portions" in the present application. The first supply portions 41 and the nozzles 51 correspond to "first supply portions" in the present application, and the second supply portions 45 and the nozzles 53 correspond to "second supply portions" in the present application.

[0080] <Configuration of the processing units 19>

[0081] First, the configuration of the processing units 19 will be described. The processing units 19 have a substantially box shape. The processing units 19 have a substantially rectangular shape when viewed from above, from the front, and from the side.

[0082] <Configuration of the processing units 19> Figures 3 to 5 The six processing units 19A have six processing units 33 stacked with each other. Similarly, the six processing units 19B have six processing units 33 stacked with each other. The six processing units 19C have six processing units 33 stacked with each other. The six processing units 19D have six processing units 33 stacked with each other. Each processing unit 33 is adjacent to the conveyance space 21.

[0083] <Configuration of the processing units 19> Figure 6 . Figure 6 is a cross-sectional view of the processing unit.

[0084] Each processing unit 33 has four side walls 47a, 47b, 47c, 47d and a bottom plate 47f. The side walls 47a to 47d each have a substantially vertical plate shape. The bottom plate 47f has a substantially horizontal plate shape. The processing unit 33 is partitioned by the side walls 47a to 47d and the bottom plate 47f. The side wall 47a extends in the front-rear direction X. The side wall 47c is provided on the opposite side of the side wall 47a. The side walls 47b, 47d extend in the width direction Y. The side walls 47b, 47d each extend from the side wall 47a to the side wall 47c. The side wall 47d is provided on the opposite side of the side wall 47b.

[0085] The processing unit 19 having the above configuration is maintained from the side of the side wall 47c. That is, the surface of the side wall 47c corresponds to the "front side surface" in the present application. In the following description, the front side surface is denoted by the symbol MS.

[0086] The processing unit 33 has a substrate conveyance port 39. The substrate conveyance port 39 is formed in the side wall 47a. The substrate W can pass through the substrate conveyance port 39. The substrate W moves between the outside of the processing unit 33 and the inside of the processing unit 33 through the substrate conveyance port 37. Each processing unit 19 has a shutter, not shown. The shutter is attached to the side wall 47a. The shutter opens and closes the substrate conveyance port 39.

[0087] The processing unit 33 includes a mounting unit 31. The mounting unit 31 is disposed inside the processing unit 33. The mounting unit 31 holds a substrate W in a horizontal position. The mounting unit 31 uses its upper surface to mount the substrate W. The mounting unit 31 can hold the lower surface of the substrate W, for example, by vacuum adsorption. Alternatively, the mounting unit 31 may include a rotating base and three or more retaining pins erected on the rotating base. In this case, the three or more retaining pins create a gap between the rotating base and the substrate W, and clamp the side surface of the substrate W to hold it. Furthermore, Figure 1 In the diagram, the substrate W placed on the mounting section 31 is indicated by a dashed line. The mounting section 31 is rotated about a vertical axis Z by a rotation drive member such as an electric motor (not shown). The mounting section 31 is surrounded by a protective cover 49. The protective cover 49 prevents the processing liquid from splashing from the substrate W placed on the mounting section 31 to the surrounding area.

[0088] like Figure 6 As shown, the processing unit 33 includes, for example, three nozzles 51, 53, and 55. Each nozzle 51 has a base end 51a, an ejection portion 51b, and an arm 51c. The base end 51a is supplied with a first fluid from the first supply unit 41. The base end 51a is disposed adjacent to the side of the first supply unit 41. The ejection portion 51b is connected to the base end 51a. The arm 51c connects the base end 51a and the ejection portion 51b. The base end 51a holds the arm 51c, allowing it to swing. The base end 51a swings about an axis in the vertical direction Z via a drive member (not shown). In the standby state, the nozzle 51 is positioned such that the arm 51c is along the sidewall 47b. In the standby state, the nozzle 51 is in a standby position where the ejection portion 51b is laterally away from the mounting unit 31. In the supply state, the nozzle 51 is in a supply position where the ejection portion 51b is above the mounting unit 31.

[0089] The nozzle 53 includes a base end portion 53a, an ejection portion 53b, and an arm 53c. The base end portion 53a is supplied with a second fluid from a second supply portion 45. The base end portion 53a is disposed adjacent to the side of the second supply portion 45. The ejection portion 53b is connected to the base end portion 53a. The arm 53c connects the base end portion 53a and the ejection portion 53b. The base end portion 53a holds the arm 53c, allowing it to swing. The base end portion 53a rotates about an axis in the vertical direction Z via a drive member (not shown). In a standby state, the nozzle 53... Figure 6 The nozzle 53 is positioned such that arm 53c is positioned along sidewall 47c. In standby mode, the nozzle 53 is as follows: Figure 6 The nozzle 53 is shown in the standby position, with the ejector portion 53b located laterally away from the mounting portion 31. In the supply state, the nozzle 53 is located in the supply position, with the ejector portion 53b above the mounting portion 31.

[0090] The nozzle 55 has a base end portion 55a, an ejection portion 55b, and an arm 55c. The base end portion 55a is supplied with the third fluid from the third supply portion 46. The base end portion 55a is disposed so as to be adjacent to the side of the second supply portion 45 and the third supply portion 46. The ejection portion 55b is communicatively connected to the base end portion 55a. The arm 55c links the base end portion 55a and the ejection portion 55b. The base end portion 55a holds the arm 55c so as to be able to swing. The base end portion 55a is rotated about the axis of the vertical direction Z by a drive member not shown. The nozzle 55 is positioned so that the arm 55c is along the side wall 47d in the standby state. The nozzle 55 is positioned at a standby position where the ejection portion 55b is away from the placement portion 31 in the side direction in the standby state. The nozzle 55 is positioned at a supply position where the ejection portion 55b is above the placement portion 31 in the supply state.

[0091] The base end portions 51a, 53a, 55a are disposed at positions closer to the side wall 47c than the placement portion 31 in the width direction Y. That is, the base end portions 51a, 53a, 55a are disposed at positions closer to the front side surface MS than the placement portion 31. In addition, when viewed from the front side surface MS, each of the base end portions 51a, 53a, 55a is disposed at a position that partially overlaps but does not completely overlap. In other words, the center portions of the base end portions 51a, 53a, 55a through which the pipes and the like are inserted do not overlap when viewed from the front side surface MS. Therefore, the pipes and the like of each of the base end portions 51a, 53a, 55a described below are not disposed at positions that overlap in the front-back direction X when viewed from the front side surface MS. Therefore, the pipes and the like of each of the base end portions 51a, 53a, 55a do not become difficult to see at the time of maintenance.

[0092] In the processing portion 33, a standby box 57 is provided below each of the ejection portions 51b, 53b, 55b in a state where each of the nozzles 51, 53, 55 is at the standby position. The standby box 57 recovers the fluid and the like that is ejected empty from each of the ejection portions 51b, 53b, 55b of the nozzles 51, 53, 55.

[0093] In the present embodiment, the base end portions 51a, 53a, 55a are disposed as described above, so the pipes from the corresponding first supply portion 41, second supply portion 45, and third supply portion 46 can be shortened. As a result, the length of the circulation pipes (supply pipe 67, return pipe 79) described below can also be shortened. As a result, in a case where these pipes are set as temperature adjustment targets, the temperature adjustment can be stably performed. In addition, the amount of pre-dispensing to the standby box 57 performed before the product is supplied can be reduced, so the consumption of the processing liquid can be suppressed.

[0094] Furthermore, the nozzle 51 corresponds to the "first nozzle" in the present application, and the nozzle 53 corresponds to the "second nozzle" in the present application.

[0095] <First Supply Portion 41>

[0096] Referring to Figure 6 and Figure 7 . Figure 7 is a schematic view of a supply system of the 1st supply section. Further, Figure 7 In the present embodiment, for the sake of easy illustration, the configuration of the processing section 33 including 3 processing units 19 is shown. As shown in Figure 4 and the like, the configuration of the processing section 33 including 6 processing units 19 is also the same configuration.

[0097] The 1st supply section 41 is provided with a shield container 59. The shield container 59 shields the gas atmosphere inside from the outside. The gas inside the shield container 59 is purged with an inert gas. The inert gas is, for example, nitrogen. The 1st supply section 41 supplies the 1st fluid from a storage section 61. The storage section 61 is provided with a tank 63 and a pump 65. The tank 63 stores the 1st fluid. The pump 65 outputs the 1st fluid inside the tank 63. The supply pipe 67 is communicatively connected to one end side of the delivery section 63a of the tank 63. The pump 65 is disposed in the supply pipe 67. The pump 65 outputs the 1st fluid of the tank 63 to the supply pipe 67. The other end side of the supply pipe 67 is communicatively connected to the return section 63b of the tank 63.

[0098] The supply pipe 67 is communicatively connected to one end side of three supply branch pipes 69. The other end side of the supply branch pipes 69 is communicatively connected to the base end section 51a. The other end side of the supply branch pipes 69 is communicatively connected to the spout section 51b via the base end section 51a. The supply branch pipes 69 are provided with a manual on-off valve 71, a flow meter 73, a flow adjusting valve 75, and a supply control valve 77 from a position close to the supply pipe 67 toward the spout section 51b.

[0099] The manual on-off valve 71 allows and blocks the flow of the 1st fluid in the supply branch pipe 69 in a manual manner. The flow meter 73 detects the flow rate of the 1st fluid in the supply branch pipe 69. The flow adjusting valve 75 adjusts the flow rate of the 1st fluid in the supply branch pipe 69. The flow meter 73 and the flow adjusting valve 75 are housed in the shield container 59. The shield container 59 can prevent the gas generated by the volatilization of the 1st fluid from remaining in the shield container 59 because the gas inside is exhausted. Therefore, an explosion-proof structure can be configured, and thus the processing can be performed safely. The supply control valve 77 controls the supply of the 1st fluid with the flow rate set by the flow adjusting valve 75. The supply control valve 77 controls the supply and stop of the 1st fluid from the spout section 51b.

[0100] In the supply branch pipe 69, one end side of the return pipe 79 is communicatively connected between the supply control valve 77 and the flow rate adjustment valve 75. The other end side of the return pipe 79 is communicatively connected to the return portion 63b of the tank 63 via the downstream side of the supply pipe 67. The return pipe 79 has a return switch valve 81 and a manual switch valve 83. The return switch valve 81 is disposed in the return pipe 79 on the side close to the supply control valve 77. The manual switch valves 71, 83 and the flow rate adjustment valve 75 are disposed at positions where the operator can access when performing maintenance from the front side MS (the side wall 47c side) of the processing unit 19, i.e., positions close to the front side MS. The supply branch pipe 69 is preferably disposed so as to be close to the front side MS from the supply pipe 67 toward the base end portion 51a. The position close to the front side MS herein means a distance that the operator can reach with his hand from the side wall 47c side toward the substrate conveyance port 39 side.

[0101] The standby box 57 is communicatively connected to one end side of the discharge pipe 85. The other end side of the discharge pipe 85 is communicatively connected to a liquid discharge processing portion not shown. The standby box 57 recovers the first fluid discharged from the discharge portion 51b when the nozzle 51 is in the standby position. The first fluid recovered by the standby box 57 is discharged through the discharge pipe 85.

[0102] The flow rate adjustment valve 75, the supply control valve 77 and the return switch valve 81 are electrically controlled to be opened and closed by the control portion 87 using electric signals. The control portion 87 includes a CPU (Central Processing Unit), a memory or the like. The control portion 87 also controls the rotation of the placement portion 31, or the supply of the second fluid and the third fluid from the second supply portion 45 and the third supply portion 46. The control portion 87 also controls the conveyance mechanisms 11, 17 and the like.

[0103] Further, the tank 63 corresponds to the "first fluid storage portion" in the present application, and the return pipe 79 corresponds to the "recovery pipe" in the present application. In addition, the manual switch valve 71 corresponds to the "first manual switch valve" in the present application, and the manual switch valve 83 corresponds to the "second manual switch valve" in the present application. The standby box 57 corresponds to the "recovery portion" in the present application.

[0104] <Second supply portion 45 and third supply portion 46>

[0105] The second supply part 45 and the third supply part 46 are configured by omitting the return pipe 79 from the first supply part 41. Therefore, detailed description of the second supply part 45 and the third supply part 46 will be omitted. Further, the second supply part 45 and the third supply part 46 can also be configured in the same manner as the first supply part 41. The second supply part 45 and the third supply part 46 are individually partitioned by partition walls. However, the partition walls can be omitted, and the second supply part 45 and the third supply part 46 can be disposed in the same space.

[0106] <Example of operation of first supply part 41>

[0107] Referring to Figures 8 to 10 . Figure 8 is a schematic view showing a case where the first supply part is in a standby state. Figure 9 is a schematic view showing a case where the first fluid is supplied from the first supply part. Figure 10 is a schematic view showing a case where the supply system of the first supply part is maintained. Further, in these drawings, a closed valve is depicted in black, and an open valve is depicted in white.

[0108] <Standby state>

[0109] As shown in Figure 8 , in a case where the first supply part 41 is in a standby state, the supply control valve 77 is closed. The manual on-off valves 71, 83, the flow rate adjustment valve 75, and the return on-off valve 81 are open. Therefore, the first fluid supplied from the supply pipe 67 is returned to the tank 63 through the return pipe 79 from the supply branch pipe 69. Therefore, the first fluid does not remain in the supply pipe 67 and the supply branch pipe 69. In addition, in a case where the first fluid needs to be temperature-controlled, a temperature control mechanism can be disposed in the circulation path in advance, and the first fluid can be circulated while being temperature-controlled to a target temperature.

[0110] In a case where the first fluid is, for example, isopropyl alcohol (IPA), if it remains in the supply pipe 67 and the supply branch pipe 69 for a long time, there is a case where dirt accumulates in the isopropyl alcohol or the components of the pipe elute to degrade the quality of the isopropyl alcohol. Therefore, when the nozzle 51 is located at the standby position, it is preferable to circulate the isopropyl alcohol as described above. Thus, the isopropyl alcohol does not remain in the supply pipe 67 and the supply branch pipe 69 for a long time. As a result, the quality of the isopropyl alcohol can be inhibited from degrading, so the substrate W can be processed with high cleanliness.

[0111] <Supply state>

[0112] As shown in Figure 9As shown, when the first fluid is supplied from the first supply section 41, the backflow switch valve 81 is closed. The manual switch valves 71 and 83, the flow adjustment valve 75, and the supply control valve 77 are opened. Therefore, the first fluid supplied from the supply pipe 67 is ejected from the ejection section 51b to the substrate W through the supply branch pipe 69 at a flow rate adjusted by the flow adjustment valve 75.

[0113] <Maintenance Status>

[0114] like Figure 10 As shown, when performing maintenance on the supply system of the first supply unit 41, maintenance is instructed from a control panel (not shown) of the substrate processing apparatus 1. Specifically, it instructs which of the 24 processing units 19 to be maintained. In this case, the instruction can be one or more. In this way, the supply control valve 77 and the return control valve 81 in the processing unit 19 to be maintained are closed by the control unit 87. Then, the operator performs the operation from the front side MS of the substrate processing apparatus 1 and manually closes the manual switch valves 71 and 83. Maintenance of the supply system of the first supply unit 41 is performed in this state. In this state, the flow of the first fluid in the first supply unit 41, which is to be maintained, is blocked in the direction closer to the ejector 51b than the manual switch valve 71. Therefore, maintenance work can be performed on the supply branch pipe 69 on the side closer to the ejector 51b than the manual switch valve 71, the return pipe 79 up to the manual switch valve 83, and the flow meter 73, flow regulating valve 75, and nozzle 51.

[0115] Furthermore, under this maintenance condition, the flow of the first fluid in the processing unit 19 subject to maintenance is blocked. Therefore, other processing units 19 not subject to maintenance can continue processing the substrate W. As a result, although maintenance related to the first supply section 41 in the processing unit 19 is performed, the decrease in the productivity of the substrate processing apparatus 1 can be suppressed.

[0116] In the substrate processing apparatus 1, such as Figure 6As shown, the substrate W placed on the processing unit 19 is processed with, for example, the acid-based treatment liquid supplied from the third supply portion 46 as the third fluid. In this case, for example, the exhaust tank 43 is caused to perform a switching operation, and the exhaust gas is delivered to the exhaust pipe 44 of the three exhaust pipes 44 that is closest to the substrate conveyance port 39. Further, the substrate W placed on the processing unit 19 is processed with, for example, the alkali-based treatment liquid supplied from the second supply portion 45 as the second fluid. In this case, for example, the exhaust tank 43 is caused to perform a switching operation, and the exhaust gas is delivered to the exhaust pipe 44 of the three exhaust pipes 44 that is located at the center in the left-right direction. Further, the substrate W placed on the processing unit 19 is processed with, for example, the organic solvent supplied from the first supply portion 41 as the first fluid. In this case, for example, the exhaust tank 43 is caused to perform a switching operation, and the exhaust gas is delivered to the exhaust pipe 44 of the three exhaust pipes 44 that is closest to the front side surface MS. In this way, the three exhaust pipes 44 are switched according to the type of the treatment liquid. Therefore, it is possible to suppress the mixing of the exhaust gas containing different treatment liquids with each other.

[0117] According to the present embodiment, the substrate processing apparatus 1 is provided with the processing portion 33 in the processing unit 19, and is provided with the first supply portion 41 that supplies the first fluid to the processing portion 33, the second supply portion 45 that supplies the second fluid to the processing portion 33, and the third supply portion 46 that supplies the third fluid to the processing portion 33. The first supply portion 41 is disposed on one side of the processing portion 33 when viewed from the front side surface MS of the processing unit 19, and the second supply portion 45 and the third supply portion 46 are disposed on the other side of the processing portion 33 when viewed from the front side surface MS of the processing unit 19. Therefore, the first supply portion 41, the second supply portion 45, and the third supply portion 46 are not disposed on the back side surface that is located on the opposite side of the front side surface MS and is difficult for the worker to access at the time of maintenance. As a result, the first supply portion 41, the second supply portion 45, and the third supply portion 46 can be easily accessed from the front side surface MS, and thus it is possible to improve the maintainability. Further, the first supply portion 41, the second supply portion 45, and the third supply portion 46 can shorten the pipe length.

[0118] The present application is not limited to the above-described embodiment, and can be modified as described below.

[0119] (1) In the above-described embodiment, the substrate processing apparatus 1 provided with the three supply portions of the first supply portion 41, the second supply portion 45, and the third supply portion 46 is described as an example. However, the present application is not limited to this configuration. That is, the present application can be configured such that, for example, one of at least two supply portions, such as the first supply portion 41 and the second supply portion 45, or the first supply portion 41 and the third supply portion 46, is disposed on one side when viewed from the front side surface MS, and the other is disposed on the other side when viewed from the front side surface MS.

[0120] (2) In the embodiment, the first fluid is an organic treatment liquid, the second fluid is an alkali treatment liquid, and the third fluid is an acid treatment liquid. However, the present application is not limited to such treatment liquids. In addition, the fluids do not necessarily need to be different, and can be the same fluid. Furthermore, the fluids are not limited to liquids, and can be gases.

[0121] (3) In the embodiment, the flow rate adjustment valve 75 is disposed near the front side surface MS, but the present application is not necessarily configured as such.

[0122] (4) In the embodiment, the configuration is provided with the return pipe 79 to circulate the first fluid. However, the present application is not necessarily configured as such. Thus, the circulation path can be omitted, so that the cost can be suppressed.

[0123] (5) In the embodiment, the manual on-off valves 71 and 83 are provided, but the present application is not necessarily provided with these on-off valves 71 and 83.

[0124] (6) In the embodiment, the explosion-proof structure is adopted using the shield container 59. However, depending on the type of fluid, the explosion-proof structure can not need to be provided using the shield container 59.

[0125] (7) In the embodiment, the manual on-off valves 71 and 83 and the flow rate adjustment valve 75 are disposed near the front side surface MS. However, the present application is not necessarily configured as such.

[0126] (8) In the embodiment, the exhaust tank 43 is disposed adjacent to the first supply portion 41. However, the present application is not necessarily configured as such.

[0127] (9) In the embodiment, the processing units 19 are stacked in the vertical direction Z. However, the present application is not necessarily configured as such.

[0128] (10) In the embodiment, the position of the conveyance mechanism 11 in the width direction Y is fixed. However, the present application is not necessarily configured as such. That is, the configuration can be provided in which the conveyance mechanism 11 moves in the width direction Y.

[0129] (11) In the embodiment, with respect to the first supply portion 41, a configuration in which an organic solvent is supplied as the first fluid is exemplified. The present application can also be provided with a configuration in which, for example, the discharge portion 51b has a cylindrical outer peripheral surface, a first ejection port, a second ejection port, and a supply nozzle instead of the configuration. The first ejection port is a ring-shaped ejection port that is opened in the outer peripheral surface. The second ejection port is a ring-shaped ejection port that is opened in the outer peripheral surface at a position closer to the substrate surface than the first ejection port. The supply nozzle is opened in the lower surface of the cylindrical discharge portion 51b in a manner facing the substrate W. The supply nozzle discharges the organic solvent. The first ejection port and the second ejection port can also be provided with a configuration in which the gas is respectively ejected in a radial manner in a manner extending to the peripheral edge portion of the substrate. Thereby, the gas from the first ejection port and the second ejection port can protect the substrate from foreign matter such as a particle or the like that reaches the substrate when performing the cleaning process, or a splash or mist of the organic solvent, and can suppress contamination of the substrate. Therefore, the substrate W can be processed with high cleanliness.

[0130] The present application can be implemented in other specific forms without departing from the spirit or essential attributes thereof, and it is therefore to be understood that the present application is not to be limited to the specific embodiments described hereinabove but is to be accorded the full scope that can be implied from the following claims.

Claims

1. A substrate processing apparatus that processes a substrate supplied with a fluid, the apparatus comprising the following elements: a first processing housing; a processing section provided inside the first processing housing for processing a substrate placed on a placement section with a fluid; a first supply section provided on one side of the processing section when viewed from a front side of the first processing housing from which maintenance is performed, for supplying the processing section with a first fluid; and a second supply section provided on the other side of the processing section when viewed from the front side, for supplying the processing section with a second fluid; the first supply section having: a first nozzle for supplying the substrate placed on the placement section with the first fluid; and a first fluid supply section for supplying the first nozzle with the first fluid; the second supply section having: a second nozzle for supplying the substrate placed on the placement section with the second fluid; and a second fluid supply section for supplying the second nozzle with the second fluid; the first nozzle having: a base end section supplied with the first fluid from the first fluid supply section; an ejection section communicatively connected to the base end section; and an arm connecting the base end section and the ejection section; and the base end section being provided on the first fluid supply section side more than the placement section, and the ejection section oscillating between a supply position above the placement section and a standby position away from the placement section with the base end section as a center; the second nozzle having: a base end section supplied with the second fluid from the second fluid supply section; an ejection section communicatively connected to the base end section; and an arm connecting the base end section and the ejection section; and the base end section being provided on the second fluid supply section side more than the placement section, and the ejection section oscillating between a supply position above the placement section and a standby position away from the placement section with the base end section as a center; the base end sections of the first nozzle and the second nozzle being provided closer to the front side of the first processing housing than the placement section; and the first fluid supply section being provided adjacent to a side of the base end section of the first nozzle, and the second fluid supply section being provided adjacent to a side of the base end section of the second nozzle.

2. The substrate processing apparatus according to claim 1, wherein the first fluid and the second fluid are different fluids.

3. The substrate processing apparatus according to claim 1, wherein the first fluid and the second fluid are liquids.

4. The substrate processing apparatus according to claim 2, wherein the first fluid and the second fluid are liquids.

5. The substrate processing apparatus according to claim 1, wherein the first fluid supply section has: a first fluid storage section that stores the first fluid, and has a delivery section that delivers the first fluid and a return section that returns the first fluid; a supply tube communicatively connected to the delivery section of the first fluid storage section; a return tube communicatively connected to the return section of the first fluid storage section; and a recovery section provided at the standby position, that recovers the first fluid supplied from the first nozzle. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a discharge pipe connected to the recovery section to discharge the first fluid recovered by the recovery section; a supply branch pipe having one end connected to the supply pipe and the other end connected to the base end section; a flow meter measuring the flow rate of the first fluid in the supply branch pipe; a flow rate adjustment valve provided on the base end section side of the supply branch pipe further than the flow meter to adjust the flow rate of the first fluid in the supply branch pipe; and a supply control valve for supplying and stopping the supply of the first fluid adjusted by the flow rate adjustment valve from the nozzle.

6. The substrate processing apparatus according to claim 5, wherein the flow rate adjustment valve is disposed at a position close to the front surface of the first processing housing.

7. The substrate processing apparatus according to claim 5, wherein the first fluid supply section further includes: a return pipe connected at one end side to the supply control valve and at the other end side to the recovery pipe in the supply branch pipe; and a return switch valve provided in the return pipe to allow and block the flow of the first fluid in the return pipe; and when the first nozzle is in the standby position, the supply control valve is closed, the return switch valve is opened, and the first fluid is circulated by being returned to the first fluid storage section through the return pipe.

8. The substrate processing apparatus according to claim 6, wherein the first fluid supply section further includes: a return pipe connected at one end side to the supply control valve and at the other end side to the recovery pipe in the supply branch pipe; and a return switch valve provided in the return pipe to allow and block the flow of the first fluid in the return pipe; and when the first nozzle is in the standby position, the supply control valve is closed, the return switch valve is opened, and the first fluid is circulated by being returned to the first fluid storage section through the return pipe.

9. The substrate processing apparatus according to claim 7, further comprising: a first manual switch valve provided in the supply branch pipe to manually allow and block the flow of the first fluid in the supply branch pipe; and a second manual switch valve provided in the return pipe to manually allow and block the flow of the first fluid in the return pipe.

10. The substrate processing apparatus according to claim 5, wherein the first fluid is an organic solvent, the flow meter and the flow rate adjustment valve are housed in a shielded container in which a gas atmosphere is shielded from the outside, and the inside of the shielded container is evacuated.

11. The substrate processing apparatus according to claim 9, wherein the first manual switch valve and the second manual switch valve are disposed at positions close to the front surface of the first processing housing.

12. The substrate processing apparatus according to claim 1, wherein a gas exhaust box for exhausting gas from the processing section is disposed adjacent to the first supply section.

13. The substrate processing apparatus according to claim 1, ​ Further, a second processing housing is provided below the first processing housing, The second processing housing includes: a processing unit provided inside the second processing housing and configured to process a substrate placed on a placement unit using a fluid; a first fluid supply unit provided on one side of the processing unit and configured to supply a first fluid to the processing unit when viewed from a front side of the second processing housing where maintenance is performed; and a second fluid supply unit provided on the other side of the processing unit and configured to supply a second fluid to the processing unit when viewed from the front side.

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