Information determination method, device and electronic equipment

Abstract

The present disclosure provides an information determination method, device and electronic device, which relate to the field of computer technology, and specifically to the field of intelligent manufacturing technology. The specific implementation scheme is: obtaining the first specification parameter information of M products, where M is an integer greater than 1; based on the first specification parameter information, using a preset planning model to determine the first cutting scheme of the M products, the first cutting scheme is used to cut N objects to be cut into the M products, where N is a positive integer; using a preset heuristic arrangement rule to optimize the first cutting scheme, and obtaining a second cutting scheme, the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

Description

Technical Field

[0001] The present disclosure relates to the field of computer technology, in particular to the field of intelligent manufacturing technology, and specifically to an information determination method, device and electronic device. Background Art

[0002] The cutting problem is a combinatorial optimization problem with high computational complexity. It refers to determining the cutting plan of the product based on the product specification parameter information to be produced, so that the required product can be cut out with the least number of objects to be cut. The cutting problem has a deep engineering application background, such as metal cutting in mechanical manufacturing, wood cutting in the furniture industry, glass cutting in the construction industry, typesetting in the printing industry, plastic processing in the chemical industry, and cloth cutting in the clothing industry.

[0003] At present, the cutting stock problem is usually solved by using mathematical programming models or heuristic algorithms. Summary of the invention

[0004] The present disclosure provides an information determination method, device and electronic device.

[0005] According to a first aspect of the present disclosure, there is provided an information determination method, comprising:

[0006] Obtain first specification parameter information of M products, where M is an integer greater than 1;

[0007] Based on the first specification parameter information, determine a first cutting scheme for the M products using a preset planning model, wherein the first cutting scheme is used to cut N objects to be cut into the M products, where N is a positive integer;

[0008] The first cutting scheme is optimized by using a preset heuristic arrangement rule to obtain a second cutting scheme, where the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

[0009] According to a second aspect of the present disclosure, there is provided an information determination device, comprising:

[0010] An acquisition module, used to acquire first specification parameter information of M products, where M is an integer greater than 1;

[0011] A first determining module, configured to determine a first cutting scheme for the M products based on the first specification parameter information and using a preset planning model, wherein the first cutting scheme is used to cut N objects to be cut into the M products, where N is a positive integer;

[0012] A scheme optimization module is used to optimize the first cutting scheme using a preset heuristic arrangement rule to obtain a second cutting scheme, wherein the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

[0013] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0014] at least one processor; and

[0015] a memory communicatively connected to at least one processor; wherein,

[0016] The memory stores instructions that can be executed by at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform any method in the first aspect.

[0017] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause a computer to execute any one of the methods in the first aspect.

[0018] According to a fifth aspect of the present disclosure, a computer program product is provided, comprising a computer program, which implements any one of the methods in the first aspect when executed by a processor.

[0019] The technology disclosed in the present invention solves the problem of low accuracy in solving the material cutting problem, improves the accuracy in solving the material cutting problem, and thus effectively improves the material utilization rate.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0022] Figure 1 is a flowchart of an information determination method according to a first embodiment of the present disclosure;

[0023] Figure 2 It is a schematic diagram of sample arrangement on the whole board;

[0024] Figure 3 It is a schematic diagram of the arrangement of products that can be rotatably arranged;

[0025] Figure 4 It is a schematic diagram of simulating and combining sub-objects to be cut into an object to be cut;

[0026] Figure 5It is a schematic diagram of the arrangement of the sub-object to be cut;

[0027] Figure 6 It is a schematic diagram of the rearrangement of the product set after rotation;

[0028] Figure 7 is a schematic diagram of the overall process of the information determination method provided in this embodiment;

[0029] Figure 8 is a schematic structural diagram of an information determination device according to a second embodiment of the present disclosure;

[0030] Fig. 9 is a schematic block diagram of an example electronic device for implementing an embodiment of the present disclosure. DETAILED DESCRIPTION

[0031] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0032] First embodiment

[0033] like Figure 1 As shown, the present disclosure provides an information determination method, comprising the following steps:

[0034] Step S101: Obtain first specification parameter information of M products.

[0035] Wherein, M is an integer greater than 1.

[0036] In this embodiment, the information determination method relates to the field of computer technology, and in particular, to the field of intelligent manufacturing technology, and can be widely used in scenarios such as furniture board cutting, glass cutting, steel plate cutting, typesetting in the printing industry, plastic processing in the chemical industry, and cloth cutting in the clothing industry. The information determination method of the disclosed embodiment can be executed by the information determination device of the disclosed embodiment. The information determination device of the disclosed embodiment can be configured in any electronic device to execute the information determination method of the disclosed embodiment. The electronic device can be a server or a terminal device, which is not specifically limited here.

[0037] In step S101, the product refers to the item that actually needs to be produced. The material of the product may be different depending on the actual production scenario, such as a plate, glass or cloth, etc. Taking wood cutting as an example, each small rectangular plate that needs to be produced can be called a product.

[0038] The product can be cut from an object to be cut, and the object to be cut can be a plate, glass or cloth, etc. Taking wood cutting as an example, the object to be cut can be a whole plate, and the whole plate to be cut can be called a whole plate, which can usually be a fixed size, such as 1220*2440.

[0039] The purpose of this embodiment is to solve a cutting problem so that M products can be cut using the least number of objects to be cut, so as to improve the material utilization rate. The cutting problem is actually to solve an optimal layout method on the objects to be cut. The layout method can refer to the cutting plan of the products on a whole board, such as Figure 2 As shown, a layout can be performed on the whole plate 201 to simulate the layout of at least one product, and each small rectangular plate 202 simulated and arranged on the whole plate 201 is a product to be produced. The optimal layout method means that the M products can be simulated and arranged using the least number of whole plates, so that the M products can be cut using the least number of whole plates, thereby improving material utilization, saving materials, and reducing costs.

[0040] The first specification parameter information may include the length, width, area, aspect ratio, etc. of the product. The first specification parameter information may also include specification parameters that characterize whether the product can be rotated. For example, when the product has requirements for texture, the product can only be arranged in a fixed manner on the whole board and cannot be rotated. When the product has no requirements for texture, the product can be arranged horizontally or vertically on the whole board and can be rotated during simulation arrangement. When the product can be rotated during arrangement, the product can be allowed to be arranged in a fixed manner such as Figure 3 The two methods A and B shown are used for simulation arrangement.

[0041] Step S102: Based on the first specification parameter information, a first cutting scheme for the M products is determined using a preset planning model, where the first cutting scheme is used to cut the N objects to be cut into the M products.

[0042] Wherein, N is a positive integer.

[0043] The first cutting plan may include the number of objects to be cut and the arrangement method on each object to be cut, so that N objects to be cut can be cut into M products based on the first cutting plan.

[0044] The preset planning model may refer to a mathematical programming model, that is, an objective function and constraints are established and solved using a solver.

[0045] The number of the preset planning models is at least one. In an optional implementation, based on the first specification parameter information, an overall mathematical planning model can be used to simulate the arrangement of M products to obtain a first cutting plan for the M products.

[0046] In another optional embodiment, two mathematical planning models can be used to perform simulated arrangement of M products, such as a first planning model and a second planning model. Based on the first specification parameter information, the first planning model can be used to perform simulated arrangement of the first stage of the M products, and the second planning model can be used to perform simulated arrangement of the second stage of the M products to obtain a first cutting plan.

[0047] In this embodiment, the simulated arrangement in the first stage may refer to the simulated arrangement within the sub-object to be cut, that is, the M products are simulated and arranged in the framework of the sub-object to be cut, and L cutting sub-schemes corresponding to the L sub-objects to be cut can be obtained, and each sub-object to be cut can include the arrangement mode on the sub-object to be cut. Taking wood cutting as an example, the sub-object to be cut can be a long strip cut on the whole board. In this embodiment, the cutting of the object to be cut can meet the "one-size-fits-all" constraint, that is, each cutting is cut from one side to the other side to obtain the sub-object to be cut.

[0048] The simulated arrangement in the second stage may refer to the simulated arrangement of L sub-schemes to be cut within the object to be cut, that is, the simulated arrangement of M products in the framework of the object to be cut. Specifically, the simulated combination of L sub-objects to be cut can be performed based on the L sub-schemes to be cut to obtain the first cutting plan for the M products.

[0049] In another optional embodiment, based on the above embodiment, the simulation arrangement of the first stage may include two sub-stages, the first planning model may include a first planning sub-model and a second planning sub-model, the first sub-stage may refer to the use of the first planning sub-model to simulate the arrangement of M products in the sub-object to be cut in a locally optimal arrangement manner, and the second sub-stage may refer to the use of the second planning sub-model to simulate the arrangement of M products in the sub-object to be cut in a globally optimal arrangement manner based on the locally optimal arrangement manner, to obtain L cutting sub-plans.

[0050] Step S103: Optimize the first cutting scheme using a preset heuristic arrangement rule to obtain a second cutting scheme, where the second cutting scheme is used to cut the K objects to be cut into the M products.

[0051] Wherein, K is a positive integer less than or equal to N.

[0052] In this step, the second cutting scheme may include the number of objects to be cut and the arrangement method on each object to be cut, so that K objects to be cut can be cut into M products based on the second cutting scheme.

[0053] Compared with the first cutting scheme, the second cutting scheme can reduce the number of objects to be cut, thereby saving materials and reducing production costs. Based on the first cutting scheme, the arrangement of the objects to be cut in the first cutting scheme can be fine-tuned based on the preset heuristic arrangement rules to further optimize the arrangement, thereby improving material utilization.

[0054] The preset heuristic arrangement rule refers to trying to adjust the arrangement mode of the objects to be cut by a certain arrangement rule to optimize the first cutting scheme so as to reduce the number of the objects to be cut in the cutting scheme.

[0055] The number of preset heuristic arrangement rules may be at least one. For example, when the products are arranged in the first direction in the object to be cut in the first cutting scheme, the preset heuristic arrangement rule may include at least one of the following:

[0056] The products can be arranged in a second direction within the object to be cut;

[0057] The products are rotated from a first direction to a second direction for arrangement.

[0058] When the number of preset heuristic arrangement rules is at least two, in an optional embodiment, the first cutting scheme can be optimized in a serial manner, that is, the first cutting scheme is optimized with the first heuristic arrangement rule to obtain a cutting scheme, and then the cutting scheme is optimized with the second heuristic arrangement rule to obtain a second cutting scheme.

[0059] In another optional embodiment, the first cutting scheme can be optimized in a parallel manner, that is, the first cutting scheme is optimized with the first heuristic arrangement rule to obtain a cutting scheme, and the first cutting scheme is optimized with the second heuristic arrangement rule to obtain another cutting scheme, and the cutting scheme with the smaller number of objects to be cut among the two cutting schemes is determined as the second cutting scheme.

[0060] In this embodiment, the material cutting problem is solved by combining a heuristic algorithm with a mathematical programming model, thereby improving the accuracy of the solution and further improving the material utilization rate.

[0061] Optionally, the preset planning model includes a first planning model and a second planning model, and the step S102 specifically includes:

[0062] Based on the first specification parameter information, the first planning model is used to simulate the arrangement of the M products, and L cutting sub-schemes corresponding one to one to the L sub-objects to be cut are obtained, and the L cutting sub-schemes are used to cut the L sub-objects to be cut into the M products, where L is a positive integer;

[0063] Based on the L cutting sub-plans, the second planning model is used to simulate and combine the L sub-objects to be cut to obtain a first cutting plan for the M products.

[0064] In this embodiment, two mathematical planning models can be used to simulate the arrangement of M products. The preset planning model may include a first planning model and a second planning model. Based on the first specification parameter information, the first planning model can be used to simulate the arrangement of the M products in the first stage, and the second planning model can be used to simulate the arrangement of the M products in the second stage to obtain a first cutting plan.

[0065] The simulated arrangement in the first stage may refer to the simulated arrangement within the sub-object to be cut, that is, arranging M products in the framework of the sub-object to be cut in a simulated manner, and obtaining L cutting sub-schemes corresponding one to one to the L sub-objects to be cut. Each sub-object to be cut may include a layout method on the sub-object to be cut.

[0066] The simulated arrangement in the second stage may refer to the simulated arrangement within the object to be cut based on the L sub-schemes to be cut, that is, the simulated arrangement of M products in the framework of the object to be cut. Specifically, the second planning model may be used to simulate the combination of L sub-objects to be cut based on the L sub-schemes to be cut, and the first cutting scheme for the M products may be obtained.

[0067] The second planning model may be a one-dimensional box packing model, that is, considering the dimension of the frame height of the sub-object to be cut, the frames of the sub-object to be cut are distributed to different objects to be cut, so that the total number of objects to be cut is as small as possible.

[0068] like Figure 4 As shown, the left figure shows four corresponding cutting sub-plans for the four sub-objects to be cut (respectively, sub-object 401 to be cut, sub-object 402 to be cut, sub-object 403 to be cut and sub-object 404 to be cut). Based on these four cutting sub-plans, the second planning model is used to simulate and combine the four sub-objects to be cut to obtain a first cutting plan. The first cutting plan includes three combined objects to be cut (respectively, object 405 to be cut, object 406 to be cut and object 407 to be cut) and the layout of each object to be cut. Object 406 to be cut is formed by simulating and combining sub-object 401 to be cut and sub-object 403 to be cut.

[0069] It should be noted that the product, the sub-object to be cut and the object to be cut are all displayed in the form of a frame in the information determination device, that is, the corresponding physical object is represented by a two-dimensional rectangular frame with matching specifications.

[0070] In this embodiment, the stock cutting problem is solved in two stages by using two mathematical programming models, so that the accuracy of solving the stock cutting problem can be further improved, and thus the material utilization rate can be further improved.

[0071] Optionally, the first planning model includes a first planning sub-model and a second planning sub-model, and based on the first specification parameter information, the first planning model is used to simulate the arrangement of the M products to obtain L cutting sub-schemes corresponding to the L sub-objects to be cut, including:

[0072] Based on the first specification parameter information, the first planning sub-model is used to simulate the arrangement of the M products, and L1 cutting sub-schemes corresponding to the L1 sub-objects to be cut are obtained, and the L1 cutting sub-schemes are used to cut the L1 sub-objects to be cut into the M products. Different cutting sub-schemes simulate different products arranged in the sub-objects to be cut. In each cutting sub-scheme, the products are arranged in the sub-objects to be cut in a target arrangement manner, and the total value under the target arrangement manner is greater than or equal to the total value of the products arranged in the sub-objects to be cut in other arrangement manners. The total value is determined based on the first specification parameter information, and L1 is a positive integer greater than or equal to L;

[0073] The L1 cutting sub-plans are optimized using the second planning sub-model to obtain the L cutting sub-plans.

[0074] In this embodiment, based on the above embodiment, the simulation arrangement of the first stage may include two sub-stages. The first planning model may include a first planning sub-model and a second planning sub-model. The first sub-stage may refer to the use of the first planning sub-model to simulate the arrangement of M products in a locally optimal arrangement manner within the sub-object to be cut based on the first specification parameter information, and obtain L1 cutting sub-plans corresponding one to one to L1 sub-objects to be cut.

[0075] Among them, the first planning sub-model can be a one-dimensional knapsack model, which can be used to simulate the arrangement of products in the sub-object to be cut in a target arrangement manner, that is, a locally optimal arrangement manner, so that when the products are simulated in the first direction in the sub-object to be cut (the first direction can be the length direction of the sub-object to be cut), the total value of the products arranged in the sub-object to be cut is the largest, and the total value can be the total area of ​​the products arranged in the sub-object to be cut.

[0076] In the first sub-stage, a framework of the sub-object to be cut can be created, and products from the M products can be randomly selected to be simulated and arranged in the sub-object to be cut, so as to obtain L1 sub-schemes corresponding to the L1 sub-objects to be cut. Alternatively, the M products can be simulated and arranged in descending order of the M weights of the M products under the preset first target specification parameters, so as to obtain L1 sub-schemes corresponding to the L1 sub-objects to be cut, which is not specifically limited here.

[0077] Each of the L1 cutting sub-schemes is the optimal arrangement scheme in the sub-object to be cut, that is, they are all simulated arrangements in the sub-object to be cut by local greed, and the global optimal arrangement of the M products in the L1 cutting sub-schemes cannot be guaranteed. The second sub-stage can refer to using the second planning sub-model to simulate the arrangement of M products in the sub-object to be cut in a global optimal arrangement manner based on the local optimal arrangement manner, and obtain L cutting sub-schemes.

[0078] Compared with L1 cutting sub-schemes, L cutting sub-schemes can reduce the number of sub-objects to be cut, thereby reducing the number of objects to be cut, thereby saving materials and reducing production costs.

[0079] In this embodiment, by using two mathematical programming models in the first stage to solve the material cutting problem in two sub-stages, the accuracy of solving the material cutting problem can be further improved, and thus the material utilization rate can be further improved.

[0080] Optionally, based on the first specification parameter information, using the first planning sub-model to simulate the arrangement of the M products to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, including:

[0081] Based on the first specification parameter information, using the first planning sub-model, in accordance with the M weight decreasing order of the M products under the preset first target specification parameter, the M products are simulated and arranged in sequence to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, wherein the first specification parameter information includes the first target specification parameter;

[0082] The step of optimizing the L1 cutting sub-schemes by using the second planning sub-model to obtain the L cutting sub-schemes comprises:

[0083] The second planning sub-model is used to perform a global optimization simulation arrangement of the M products arranged in the L1 sub-objects to be cut in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, so as to obtain the L cutting sub-schemes, and the target parameter value is determined based on the L1 parameter values ​​of the L1 sub-objects to be cut under the first target specification parameters.

[0084] In this implementation manner, in the first sub-stage, the M products may be simulated and arranged in sequence according to the descending order of the M weights of the M products under the preset first target specification parameters.

[0085] Specifically, the M products may be sorted in descending order according to the M weights under the first target specification parameter to obtain the sorted M products, such as product 1, product 2, ..., product M. For example, the products may be sorted in descending order of width, area, or length. Taking the sorting in descending order of width as an example, the larger the width, the greater the weight, and the higher the ranking. Alternatively, the M products may be sorted according to the length-to-width ratio, and the weights of the products whose length-to-width ratios meet certain conditions, such as a length-to-width ratio close to 1, may be adjusted, and the products may be sorted based on the adjusted weights.

[0086] Afterwards, the sorted M products can be selected in turn and simulated arranged in the framework of the sub-object to be cut. In an optional implementation, multiple frameworks of sub-objects to be cut can be created first, and the sorted M products can be selected in turn and simulated sorted in the created frameworks of sub-objects to be cut.

[0087] In another optional implementation, the frame of the sub-object to be cut can be created by taking the parameter value of the first-ranked product under the first target specification parameter, such as the width value, as the frame height of the sub-object to be cut according to the arrangement order of the M products. The frame length of the sub-object to be cut can be the frame length of the object to be cut. The one-dimensional knapsack model is used to select products from the remaining unarranged products of the M products and simulate the arrangement in the frame of the created sub-object to be cut, wherein the selected products may include products that can be arranged rotatably. After the arrangement is completed in the frame of the currently created sub-object to be cut, the parameter value of the first-ranked product under the first target specification parameter is selected to create a new frame, and the frames of all the sub-objects to be cut are generated in sequence until the simulated arrangement of the M products is completed, and L1 sub-schemes corresponding to L1 sub-objects to be cut are obtained.

[0088] Afterwards, the second planning sub-model can be used to perform a global optimization simulation arrangement on the M products arranged in the L1 to-be-cut sub-objects in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, so as to obtain the L cutting sub-schemes.

[0089] The target parameter value is determined based on the L1 parameter values ​​of the L1 sub-objects to be cut under the first target specification parameter. When the first target specification parameter is width, the target parameter value can be the total height value of the sub-objects to be cut, that is, by minimizing the total height value of the sub-objects to be cut, the arrangement of the products in the sub-objects to be cut is globally optimized to obtain L cutting sub-objects that correspond one to one to the L sub-objects to be cut, so as to improve material utilization.

[0090] Specifically, based on the frame heights of the L1 sub-objects to be cut, the second planning sub-model (the second planning sub-model is a global optimization model) can be used for global optimization. The second planning sub-model is as follows:

[0091] min∑ j w j y j (1)

[0092]

[0093]

[0094]

[0095] ∑ j h i x i,j ≤L (5)

[0096]

[0097] The above formula (1) is the objective function in the second planning sub-model. The objective function is to minimize the total height of the frame shelf of the sub-object to be cut so that all products are arranged. j It can indicate whether to select the frame of the jth sub-object to be cut. When the value is 1, it indicates selection, and when the value is 0, it indicates not selection. j It can be the frame height of the jth sub-object to be cut.

[0098] The above equations (2) to (6) are the constraints in the second planning sub-model. In the above equation (2), x i,j It can represent whether the i-th product is arranged in the frame of the j-th sub-object to be cut. When the value is 1, it represents that it is arranged in the frame of the j-th sub-object to be cut. When the value is 0, it represents that it is not arranged in the frame of the j-th sub-object to be cut. The set C represents the set of products that can be rotatably arranged. The above formula (2) indicates that for any product that cannot be rotatably arranged, there must be a sub-object to be cut to arrange the product.

[0099] In the above formula (3), x i1,jIt can indicate whether the i1th product exists in the framework of the jth sub-object to be cut, x i2,j It can represent whether the i2th product exists in the framework of the jth sub-object to be cut, where the i1th product and the i2th product are the same product in set C, but represent different arrangements. For example, the i1th product represents the horizontal arrangement of the i-th product, and the i2th product represents the vertical arrangement of the i-th product. The above formula (3) indicates that for any product in set C, there must be a sub-object to be cut to arrange the product, and it can only be arranged once.

[0100] The above formula (4) indicates that no matter whether the i-th product selects the frame of the j-th sub-object to be cut for arrangement, x i,j The values ​​of are less than or equal to y j The value of .

[0101] In the above formula (5), h i represents the length value of the i-th product, L represents the frame length of the j-th sub-object to be cut, and the above formula (5) indicates that the total length of all products arranged in the frame of the j-th sub-object to be cut cannot be greater than the frame length of the j-th sub-object to be cut.

[0102] In the above formula (6), the set S represents the products that cannot be arranged in the frame of the j-th sub-object to be cut. For example, when the width of the product is greater than the height of the frame of the sub-object to be cut, the product cannot be arranged in the frame of the sub-object to be cut. The above formula (6) indicates that any product in the set S corresponding to the j-th sub-object to be cut cannot be arranged in the frame of the j-th sub-object to be cut.

[0103] In this embodiment, based on the first specification parameter information, the first planning sub-model is used to perform a simulated arrangement of the M products in sequence according to the M weight decreasing order of the M products under the preset first target specification parameter, and L1 cutting sub-schemes corresponding to the L1 sub-objects to be cut are obtained. The second planning sub-model is used to perform a globally optimized simulated arrangement of the M products arranged in the L1 sub-objects to be cut in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, and the L cutting sub-schemes are obtained. In this way, the products can be sorted according to the preset sorting rules, and the simulated arrangement of the products can be performed in sequence within the framework of the sub-objects to be cut, and then the globally optimized simulated arrangement can be performed, so that the L cutting sub-schemes can be determined, and the accuracy of solving the cutting problem using the mathematical programming model in the first stage can be improved.

[0104] Optionally, based on the first specification parameter information, using the first planning sub-model, in accordance with the descending order of the M weights of the M products under the preset first target specification parameters, the M products are simulated and arranged in sequence to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, including:

[0105] Create a first framework of a first sub-object to be cut based on the parameter value of the first target product under the first target specification parameter, the first target product is the product ranked first in descending order of weight under the first target specification parameter among M1 products, the M1 products include products among the M products that are not arranged in the second sub-object to be cut, the second sub-object to be cut is a sub-object to be cut in which products are arranged in the target arrangement, the L1 sub-objects to be cut include the first sub-object to be cut and the second sub-object to be cut, and M1 is a positive integer less than or equal to M;

[0106] Based on the first specification parameter information, using the first planning sub-model, with the goal of maximizing the total value of the products in the first sub-object to be cut, products are selected from the M1 products and simulated and arranged in the first framework to obtain a cutting sub-plan corresponding to the first sub-object to be cut;

[0107] A second framework of sub-objects to be cut is created based on parameter values ​​of unarranged products among the M1 products under the first target specification parameters, and a simulated arrangement of products is performed within the second framework until the L1 sub-cutting schemes are obtained.

[0108] In this embodiment, according to the arrangement order of the M products, the parameter value of the product currently ranked first under the first target specification parameter, such as the width value, can be taken as the frame height of the sub-object to be cut, and the first frame of the first sub-object to be cut can be the frame length of the object to be cut. Using the one-dimensional knapsack model, with the goal of maximizing the total value of the products in the first sub-object to be cut, products are selected from the remaining unarranged products of the M products to be simulated and arranged in the first frame, wherein the selected products may include products that can be arranged rotatably. After the arrangement in the first frame is completed, the parameter value of the unarranged and first-ranked product under the first target specification parameter is selected to create a new frame, i.e., the second frame, and the frames of all the sub-objects to be cut are generated in sequence until the simulated arrangement of the M products is completed, and L1 sub-cutting schemes corresponding to L1 sub-objects to be cut are obtained.

[0109] like Figure 5As shown, the parameter value of the product that is currently ranked first, i.e., product 1, under the first target specification parameter, such as the width value, can be taken as the frame height of the sub-object to be cut, and a frame 501 of the sub-object to be cut can be created. The one-dimensional backpack model is used to simulate the arrangement of products in the frame 501 to obtain a cutting sub-scheme for the sub-object to be cut. In the cutting sub-scheme, products ranked 1, 3, 4, 5, and 6 are arranged in the sub-object to be cut, and the unranked products among the M products include products ranked 2, 7, 8, ..., M. Then, the parameter value of the product that is currently ranked first, i.e., product 2, under the first target specification parameter is taken as the frame height of the sub-object to be cut, and a new frame is created. The frames of all the sub-objects to be cut are generated in sequence until the simulated arrangement of the M products is completed.

[0110] In this embodiment, by sorting the first target product in descending order and the parameter values ​​under the first target specification parameters, the framework of the sub-objects to be cut is created in sequence to simulate the arrangement of the remaining unarranged products. In this way, the created framework of the sub-objects to be cut is more in line with the product specifications, thereby further improving material utilization.

[0111] Optionally, in the first cutting scheme, the products are arranged in a first direction in the object to be cut, and the preset heuristic arrangement rule includes that the products can be arranged in a second direction in the object to be cut, and the step S103 specifically includes:

[0112] Obtaining a first cutting sub-scheme in the first cutting scheme, wherein the first cutting sub-scheme is used to cut a target object to be cut among the N objects to be cut into at least one second target product, wherein a utilization rate of the target object to be cut is less than or equal to a utilization rate of other objects to be cut among the N objects to be cut;

[0113] Traversing each second target product in the first cutting sub-scheme in turn, selecting a target position in the second direction from the frames of other objects to be cut except the target object to be cut among the N objects to be cut to perform simulated arrangement of the second target product, so as to obtain a second cutting scheme;

[0114] The target position is a position where no product is arranged within the frame of the other object to be cut, and the area of ​​the target position matches the area of ​​the second target product.

[0115] In this embodiment, the first direction may be a transverse direction, and the second direction may be a longitudinal direction. Alternatively, the first direction may be a longitudinal direction, and the second direction may be a transverse direction, which is not specifically limited here.

[0116] Taking the first direction as the horizontal direction and the second direction as the vertical direction as an example, in the first cutting scheme, the product is arranged in the horizontal direction within the object to be cut, specifically, arranged in the horizontal direction within the frame shelf of the sub-object to be cut, and vertical arrangement within the frame shelf is not allowed.

[0117] In this embodiment, an attempt is made to stack the products vertically in the frame shelf. An attempt can be made to stack the products arranged in the object to be cut with the lowest area utilization vertically in other objects to be cut to reduce the number of whole boards used and improve material utilization.

[0118] Specifically, the second target products arranged in the object to be cut with the lowest utilization rate may be sorted from small to large according to the area, and the sorted product set is assumed to be I={I1, I2, ..., Ip}.

[0119] Traverse each second target product in the product set in turn, and for each second target product, select a target position that matches the area of ​​the second target product from the frame of other objects to be cut, that is, based on the principle of minimizing the remaining area after arranging the second target products, select the most suitable position for vertical stacking arrangement of the second target products, and the target position is the position in the vertical direction.

[0120] If there is no suitable target position in other objects to be cut to arrange the second target product, the second target product will not be simulated and rearranged. If a target position is selected, the remaining positions are updated synchronously so that other second target products can be simulated and arranged based on the remaining positions.

[0121] After traversing all the second target products, until all the second target products are arranged, or the second target products that can be rearranged are arranged, the number of objects to be cut and the arrangement method of each object to be cut are determined to obtain the second cutting plan.

[0122] In this embodiment, by trying to stack the products vertically in the frame shelf, that is, trying to stack the products arranged in the object to be cut with the lowest area utilization rate vertically in other objects to be cut, the number of whole boards used can be reduced and the material utilization rate can be improved.

[0123] Optionally, the object to be cut in the first cutting scheme includes a sub-object to be cut, the preset heuristic arrangement rule includes arranging the product by rotating it from a first direction to a second direction, and the step S103 specifically includes:

[0124] Obtaining a second cutting sub-scheme corresponding to the target sub-object to be cut in the first cutting scheme, wherein the product set in the target sub-object to be cut is rotatable, and the product set includes all products arranged in the sub-object to be cut;

[0125] When the length of the product set in the target sub-object to be cut in the first direction is less than or equal to the length of the object to be cut corresponding to the target sub-object to be cut in the second direction, the product set is rotated from the first direction to the second direction for simulated arrangement to obtain second specification parameter information of the first product set;

[0126] Based on the second specification parameter information and the third specification parameter information of the second product set, a simulated rearrangement of the M products is performed to optimize the first cutting plan to obtain a second cutting plan. The second product set is a set of products within the N objects to be cut, except for the target sub-object to be cut.

[0127] In this implementation, it is possible to try to regard all products in the frame shelf of the sub-object to be cut as a product set, wherein the length of the product set is the total length of all products, and the width is the frame height.

[0128] If the length of the product collection is smaller than the width of the object to be cut, and all products in the product collection can be rotated, the product collection can be rotated from the horizontal direction to the vertical direction for simulated arrangement to obtain the first product collection and the second specification parameter information of the first product collection. Otherwise, the product collection is not rotated, that is, the third product collection of the original arrangement is retained, and the third specification parameter information of the third product collection is calculated.

[0129] Among them, the second specification parameter information can be determined based on the first specification parameter information of all products in the second product set, and the third specification parameter information can be determined based on the first specification parameter information of all products in the third product set. For example, the length of the third product set can be the total length of all products in the third product set.

[0130] Based on the second specification parameter information of the second product set and the third specification parameter of the third product set, the second product set and the third product set are treated as a new product, and the product set is simulated and arranged using the simulation arrangement of the first stage and the simulation arrangement of the second stage to obtain a second cutting plan. In some cases, the number of whole boards used can be reduced.

[0131] like Figure 6 As shown, the left picture is the first cutting scheme, in which the number of whole boards is 3, and the right picture is the second cutting scheme obtained by trying to regard all products in the frame shelf of the sub-object to be cut as a product set, rotating and re-simulating the arrangement of the product set. The number of whole boards in the second cutting scheme is 2. It can be seen that the second cutting scheme reduces the number of whole boards used compared to the first cutting scheme.

[0132] In this embodiment, all products in the frame shelf of the sub-object to be cut are considered as a product set, and the product set is re-arranged in simulation after rotation to optimize the first cutting plan and obtain the second cutting plan. In this way, the number of whole boards used can be reduced in some cases, and the material utilization rate can be improved.

[0133] Optionally, the preset heuristic arrangement rule includes a first heuristic arrangement rule and a second heuristic arrangement rule, and the step S103 specifically includes:

[0134] Optimizing the first cutting scheme by using the first heuristic arrangement rule to obtain a first target cutting scheme;

[0135] Optimizing the second target cutting scheme by using the second heuristic arrangement rule to obtain a third target cutting scheme, wherein the second target cutting scheme includes the first cutting scheme or the first target cutting scheme;

[0136] The cutting scheme with the smaller number of objects to be cut between the first target cutting scheme and the third target cutting scheme is determined as the second cutting scheme.

[0137] In this embodiment, when the number of preset heuristic arrangement rules is at least two, in an optional embodiment, the first cutting scheme can be optimized in a serial manner, that is, the first cutting scheme is optimized with the first heuristic arrangement rule to obtain the first target cutting scheme, and then the first target cutting scheme is optimized with the second heuristic arrangement rule to obtain the third target cutting scheme, and the cutting scheme with the smaller number of objects to be cut between the first target cutting scheme and the third target cutting scheme is determined as the second cutting scheme.

[0138] In another optional embodiment, the first cutting plan can be optimized in a parallel manner, that is, the first cutting plan is optimized with the first heuristic arrangement rule to obtain the first target cutting plan, and the first cutting plan is optimized with the second heuristic arrangement rule to obtain the third target cutting plan, and the cutting plan with the smaller number of objects to be cut between the first target cutting plan and the third target cutting plan is determined as the second cutting plan.

[0139] In this embodiment, multiple heuristic algorithms are used to solve the material cutting problem, thereby improving the accuracy of the solution and further improving the material utilization rate.

[0140] Optionally, after step S103, the method further includes:

[0141] Based on the first specification parameter information, in accordance with the descending order of the M weights of the M products under the preset second target specification parameters, the M products are simulated and rearranged in sequence to determine a third cutting scheme for the M products, wherein the first specification parameter information includes the second target specification parameter;

[0142] The cutting scheme with the smaller number of objects to be cut among the second cutting scheme and the third cutting scheme is determined as the cutting scheme for the M products.

[0143] In this embodiment, after sorting the M products in descending order of their M weights under the preset first target specification parameters, and simulating the arrangement of the M products in sequence in the sub-objects to be cut based on the sorted M products, and obtaining the second cutting scheme, the M products can be re-sorted in descending order of their M weights under the preset first target specification parameters, and the simulated rearrangement of the M products in sequence in the sub-objects to be cut based on the re-sorted M products, so as to determine the third cutting scheme. The method for determining the third cutting scheme is similar to the method for determining the second cutting scheme, and will not be described in detail here.

[0144] Correspondingly, all possible sorting rules can be traversed, and the M products sorted by each sorting rule can be simulated and rearranged in turn in the sub-objects to be cut to obtain the cutting scheme corresponding to each sorting rule, and the cutting scheme with the least number of objects to be cut among all the cutting schemes corresponding to the sorting rules is determined as the solution to the cutting problem, that is, the cutting scheme with the least number of whole plates used is finally determined.

[0145] In this embodiment, M products are sorted by trying different sorting rules, and the M products are simulated and rearranged in turn based on the sorted M products, and finally the cutting scheme corresponding to each sorting rule is obtained, and the cutting scheme with the least number of uses for the whole plate is determined as the final cutting scheme, which can further improve the accuracy of solving the cutting problem and thus improve the material utilization rate.

[0146] In order to more clearly illustrate the information determination method in the embodiment of the present disclosure, the following Figure 7 Take the example to illustrate the overall process of the information determination method. Figure 7 is a schematic diagram of the overall flow of the information determination method provided in this embodiment. Figure 7As shown, the M products can be sorted according to the sorting rules, a frame shelf can be created based on the sorted M products, a cutting sub-scheme of the frame shelf can be generated using a backpack model, a global optimization model can be used to perform global optimization arrangement to reduce the frame shelves, a one-dimensional packing model can be used to distribute the frame shelves to the whole board so that the number of whole boards is as small as possible, the first heuristic arrangement rule can be used to optimize the stacking arrangement, the second heuristic arrangement rule can be used to rotate the frame shelf, and the rotated frame shelf can be rearranged.

[0147] Determine whether the current cutting plan is the optimal plan. If so, determine whether the sorting rules have been traversed. If so, determine the cutting plan with the least number of whole boards among all cutting plans as the final cutting plan. If not, set a new sorting rule, sort the M products according to the new sorting rule, and rearrange them to determine the new cutting plan.

[0148] Second embodiment

[0149] like Figure 8 As shown, the present disclosure provides an information determination device 800, comprising:

[0150] An acquisition module 801 is used to acquire first specification parameter information of M products, where M is an integer greater than 1;

[0151] A first determining module 802 is used to determine a first cutting scheme for the M products based on the first specification parameter information and using a preset planning model, wherein the first cutting scheme is used to cut N objects to be cut into the M products, where N is a positive integer;

[0152] The scheme optimization module 803 is used to optimize the first cutting scheme using a preset heuristic arrangement rule to obtain a second cutting scheme, wherein the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

[0153] Optionally, the preset planning model includes a first planning model and a second planning model, and the first determining module 802 includes:

[0154] A first simulation arrangement submodule is used to perform a simulation arrangement of the M products using the first planning model based on the first specification parameter information, and obtain L cutting sub-schemes corresponding to the L sub-objects to be cut, wherein the L cutting sub-schemes are used to cut the L sub-objects to be cut into the M products, where L is a positive integer;

[0155] The simulation combination submodule is used to perform simulation combination of the L sub-objects to be cut based on the L cutting sub-plans and using the second planning model to obtain a first cutting plan for the M products.

[0156] Optionally, the first planning model includes a first planning sub-model and a second planning sub-model, and the first simulation arrangement sub-module includes:

[0157] a simulation arrangement unit, configured to perform a simulation arrangement of the M products using the first planning sub-model based on the first specification parameter information, and obtain L1 cutting sub-schemes corresponding to the L1 sub-objects to be cut one by one, wherein the L1 cutting sub-schemes are used to cut the L1 sub-objects to be cut into the M products, wherein different cutting sub-schemes simulate different products to be arranged in the sub-objects to be cut, and wherein the products in each cutting sub-scheme are arranged in the sub-objects to be cut in a target arrangement manner, and the total value under the target arrangement manner is greater than or equal to the total value of the products arranged in the sub-objects to be cut in other arrangement manners, and the total value is determined based on the first specification parameter information, and L1 is a positive integer greater than or equal to L;

[0158] A sub-scheme optimization unit is used to optimize the L1 cutting sub-schemes by using the second planning sub-model to obtain the L cutting sub-schemes.

[0159] Optionally, the simulation arrangement unit is specifically used to:

[0160] Based on the first specification parameter information, using the first planning sub-model, in accordance with the M weight decreasing order of the M products under the preset first target specification parameter, the M products are simulated and arranged in sequence to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, wherein the first specification parameter information includes the first target specification parameter;

[0161] The sub-scheme optimization unit is specifically used for:

[0162] The second planning sub-model is used to perform a global optimization simulation arrangement of the M products arranged in the L1 sub-objects to be cut in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, so as to obtain the L cutting sub-schemes, and the target parameter value is determined based on the L1 parameter values ​​of the L1 sub-objects to be cut under the first target specification parameters.

[0163] Optionally, the simulation arrangement unit is specifically used to:

[0164] Create a first framework of a first sub-object to be cut based on the parameter value of the first target product under the first target specification parameter, the first target product is the product ranked first in descending order of weight under the first target specification parameter among M1 products, the M1 products include products among the M products that are not arranged in the second sub-object to be cut, the second sub-object to be cut is a sub-object to be cut in which products are arranged in the target arrangement, the L1 sub-objects to be cut include the first sub-object to be cut and the second sub-object to be cut, and M1 is a positive integer less than or equal to M;

[0165] Based on the first specification parameter information, using the first planning sub-model, with the goal of maximizing the total value of the products in the first sub-object to be cut, products are selected from the M1 products and simulated and arranged in the first framework to obtain a cutting sub-plan corresponding to the first sub-object to be cut;

[0166] A second framework of sub-objects to be cut is created based on parameter values ​​of unarranged products among the M1 products under the first target specification parameters, and a simulated arrangement of products is performed within the second framework until the L1 sub-cutting schemes are obtained.

[0167] Optionally, in the first cutting scheme, the products are arranged in a first direction in the object to be cut, and the preset heuristic arrangement rule includes that the products can be arranged in a second direction in the object to be cut, and the scheme optimization module 803 includes:

[0168] A first acquisition submodule is used to acquire a first cutting sub-scheme in the first cutting scheme, wherein the first cutting sub-scheme is used to cut a target object to be cut among the N objects to be cut into at least one second target product, and a utilization rate of the target object to be cut is less than or equal to utilization rates of other objects to be cut among the N objects to be cut;

[0169] A selection submodule is used to sequentially traverse each second target product in the first cutting sub-scheme, and select a target position in the second direction from the frames of other objects to be cut except the target object to be cut among the N objects to be cut to perform simulated arrangement of the second target product, so as to obtain a second cutting scheme;

[0170] The target position is a position where no product is arranged within the frame of the other object to be cut, and the area of ​​the target position matches the area of ​​the second target product.

[0171] Optionally, the object to be cut in the first cutting scheme includes a sub-object to be cut, the preset heuristic arrangement rule includes arranging the product by rotating it from a first direction to a second direction, and the scheme optimization module 803 includes:

[0172] A second acquisition submodule is used to acquire a second cutting sub-scheme corresponding to the target sub-object to be cut in the first cutting scheme, wherein the product set in the target sub-object to be cut is rotatable, and the product set includes all products arranged in the sub-object to be cut;

[0173] A rotation submodule, for rotating the product set from the first direction to the second direction for simulated arrangement to obtain second specification parameter information of the first product set when the length of the product set in the target sub-object to be cut in the first direction is less than or equal to the length of the object to be cut corresponding to the target sub-object to be cut in the second direction;

[0174] A simulation submodule is used to simulate the rearrangement of the M products based on the second specification parameter information and the third specification parameter information of the second product set to optimize the first cutting plan and obtain a second cutting plan. The second product set is a set of products within the N objects to be cut, except for the target sub-object to be cut.

[0175] Optionally, the preset heuristic arrangement rule includes a first heuristic arrangement rule and a second heuristic arrangement rule, and the solution optimization module 803 includes:

[0176] A first scheme optimization submodule, configured to optimize the first cutting scheme by using the first heuristic arrangement rule to obtain a first target cutting scheme;

[0177] A second scheme optimization submodule, used for optimizing a second target cutting scheme by using the second heuristic arrangement rule to obtain a third target cutting scheme, wherein the second target cutting scheme includes the first cutting scheme or the first target cutting scheme;

[0178] The determination submodule is used to determine the cutting scheme with the smaller number of objects to be cut among the first target cutting scheme and the third target cutting scheme as the second cutting scheme.

[0179] Optionally, the device further comprises:

[0180] a simulation rearrangement module, configured to perform a simulation rearrangement of the M products in sequence according to the descending order of the M weights of the M products under the preset second target specification parameters based on the first specification parameter information, so as to determine a third cutting scheme for the M products, wherein the first specification parameter information includes the second target specification parameter;

[0181] The second determining module is used to determine the cutting scheme with the smaller number of objects to be cut among the second cutting scheme and the third cutting scheme as the cutting scheme for the M products.

[0182] The information determination device 800 provided in the present disclosure can implement each process implemented by the information determination method embodiment and can achieve the same beneficial effects. To avoid repetition, it will not be described again here.

[0183] In the technical solution of the present disclosure, the collection, storage, use, processing, transmission, provision and disclosure of user personal information involved are in compliance with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0184] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium and a computer program product.

[0185] Fig. 9 A schematic block diagram of an example electronic device that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0186] like Fig. 9 As shown, the device 900 includes a computing unit 901, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 902 or a computer program loaded from a storage unit 908 into a random access memory (RAM) 903. In the RAM 903, various programs and data required for the operation of the device 900 can also be stored. The computing unit 901, the ROM 902, and the RAM 903 are connected to each other via a bus 904. An input / output (I / O) interface 905 is also connected to the bus 904.

[0187] A number of components in the device 900 are connected to the I / O interface 905, including: an input unit 906, such as a keyboard, a mouse, etc.; an output unit 907, such as various types of displays, speakers, etc.; a storage unit 908, such as a disk, an optical disk, etc.; and a communication unit 909, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 909 allows the device 900 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0188] The computing unit 901 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 901 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 901 performs the various methods and processes described above, such as information determination methods. For example, in some embodiments, the information determination method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 908. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 900 via ROM 902 and / or communication unit 909. When the computer program is loaded into RAM 903 and executed by the computing unit 901, one or more steps of the information determination method described above may be performed. Alternatively, in other embodiments, the computing unit 901 may be configured to perform the information determination method in any other appropriate manner (e.g., by means of firmware).

[0189] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0190] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0191] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0192] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0193] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0194] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0195] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0196] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for determining information, comprising: Obtain first specification parameter information of M products, where M is an integer greater than 1; Based on the first specification parameter information, a first planning model in a preset planning model is used to simulate the arrangement of the M products, and L cutting sub-schemes corresponding one to one to the L sub-objects to be cut are obtained, wherein the L cutting sub-schemes are used to cut the L sub-objects to be cut into the M products, where L is a positive integer; The first planning model includes a first planning sub-model, and the use of the first planning model in the preset planning model to simulate the arrangement of the M products includes: using the first planning sub-model to simulate the arrangement of the M products in a first direction within the sub-object to be cut, and when simulating the arrangement of the products in the first direction within the sub-object to be cut, the total area of ​​the products arranged in the sub-object to be cut is maximized; Based on the L cutting sub-schemes, a second planning model in the preset planning model is used to simulate and combine the L sub-objects to be cut, so as to obtain a first cutting scheme for the M products, wherein the first cutting scheme is used to cut the N objects to be cut into the M products, where N is a positive integer; The first cutting scheme is optimized by using a preset heuristic arrangement rule to obtain a second cutting scheme, where the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

2. The method according to claim 1, wherein: The first planning model includes a first planning sub-model and a second planning sub-model. Based on the first specification parameter information, the first planning model in the preset planning model is used to simulate the arrangement of the M products, and L cutting sub-schemes corresponding to the L sub-objects to be cut are obtained, including: Based on the first specification parameter information, the first planning sub-model is used to simulate the arrangement of the M products, and L1 cutting sub-schemes corresponding to the L1 sub-objects to be cut are obtained, and the L1 cutting sub-schemes are used to cut the L1 sub-objects to be cut into the M products. Different cutting sub-schemes simulate different products arranged in the sub-objects to be cut. In each cutting sub-scheme, the products are arranged in the sub-objects to be cut in a target arrangement manner, and the total value under the target arrangement manner is greater than or equal to the total value of the products arranged in the sub-objects to be cut in other arrangement manners. The total value is determined based on the first specification parameter information, and L1 is a positive integer greater than or equal to L; The L1 cutting sub-plans are optimized using the second planning sub-model to obtain the L cutting sub-plans.

3. The method according to claim 2, wherein: The method of using the first planning sub-model to simulate the arrangement of the M products based on the first specification parameter information to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut includes: Based on the first specification parameter information, using the first planning sub-model, in accordance with the M weight decreasing order of the M products under the preset first target specification parameter, the M products are simulated and arranged in sequence to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, wherein the first specification parameter information includes the first target specification parameter; The step of optimizing the L1 cutting sub-schemes by using the second planning sub-model to obtain the L cutting sub-schemes comprises: The second planning sub-model is used to perform a global optimization simulation arrangement of the M products arranged in the L1 sub-objects to be cut in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, so as to obtain the L cutting sub-schemes, and the target parameter value is determined based on the L1 parameter values ​​of the L1 sub-objects to be cut under the first target specification parameters.

4. The method according to claim 3, wherein: Based on the first specification parameter information, using the first planning sub-model, the M products are simulated and arranged in sequence according to the descending order of the M weights of the M products under the preset first target specification parameters, to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, including: Create a first framework of a first sub-object to be cut based on the parameter value of the first target product under the first target specification parameter, the first target product is the product ranked first in descending order of weight under the first target specification parameter among M1 products, the M1 products include products among the M products that are not arranged in the second sub-object to be cut, the second sub-object to be cut is a sub-object to be cut in which products are arranged in the target arrangement, the L1 sub-objects to be cut include the first sub-object to be cut and the second sub-object to be cut, and M1 is a positive integer less than or equal to M; Based on the first specification parameter information, using the first planning sub-model, with the goal of maximizing the total value of the products in the first sub-object to be cut, products are selected from the M1 products and simulated and arranged in the first framework to obtain a cutting sub-plan corresponding to the first sub-object to be cut; A second framework of sub-objects to be cut is created based on parameter values ​​of unarranged products among the M1 products under the first target specification parameters, and a simulated arrangement of products is performed within the second framework until the L1 sub-cutting schemes are obtained.

5. The method according to claim 1, wherein: In the first cutting scheme, the products are arranged in a first direction in the object to be cut, the preset heuristic arrangement rule includes that the products can be arranged in a second direction in the object to be cut, and the first cutting scheme is optimized by using the preset heuristic arrangement rule to obtain the second cutting scheme, including: Obtaining a first cutting sub-scheme in the first cutting scheme, wherein the first cutting sub-scheme is used to cut a target object to be cut among the N objects to be cut into at least one second target product, wherein a utilization rate of the target object to be cut is less than or equal to a utilization rate of other objects to be cut among the N objects to be cut; Traversing each second target product in the first cutting sub-scheme in turn, selecting a target position in the second direction from the frames of other objects to be cut except the target object to be cut among the N objects to be cut to perform simulated arrangement of the second target product, so as to obtain a second cutting scheme; The target position is a position where no product is arranged within the frame of the other object to be cut, and the area of ​​the target position matches the area of ​​the second target product.

6. The method according to claim 1 or 5, wherein: The object to be cut in the first cutting scheme includes a sub-object to be cut, the preset heuristic arrangement rule includes arranging the product by rotating it from a first direction to a second direction, and the first cutting scheme is optimized by using the preset heuristic arrangement rule to obtain a second cutting scheme, including: Obtaining a second cutting sub-scheme corresponding to the target sub-object to be cut in the first cutting scheme, wherein the product set in the target sub-object to be cut is rotatable, and the product set includes all products arranged in the sub-object to be cut; When the length of the product set in the target sub-object to be cut in the first direction is less than or equal to the length of the object to be cut corresponding to the target sub-object to be cut in the second direction, the product set is rotated from the first direction to the second direction for simulated arrangement to obtain second specification parameter information of the first product set; Based on the second specification parameter information and the third specification parameter information of the second product set, a simulated rearrangement of the M products is performed to optimize the first cutting plan to obtain a second cutting plan. The second product set is a set of products within the N objects to be cut, except for the target sub-object to be cut.

7. The method according to claim 1, wherein: The preset heuristic arrangement rule includes a first heuristic arrangement rule and a second heuristic arrangement rule, and the first cutting scheme is optimized by using the preset heuristic arrangement rule to obtain the second cutting scheme, including: Optimizing the first cutting scheme by using the first heuristic arrangement rule to obtain a first target cutting scheme; Optimizing the second target cutting scheme by using the second heuristic arrangement rule to obtain a third target cutting scheme, wherein the second target cutting scheme includes the first cutting scheme or the first target cutting scheme; The cutting scheme with the smaller number of objects to be cut between the first target cutting scheme and the third target cutting scheme is determined as the second cutting scheme.

8. The method according to claim 1, after optimizing the first cutting scheme by using a preset heuristic arrangement rule to obtain a second cutting scheme, further comprises: Based on the first specification parameter information, in accordance with the descending order of the M weights of the M products under the preset second target specification parameters, the M products are simulated and rearranged in sequence to determine a third cutting scheme for the M products, wherein the first specification parameter information includes the second target specification parameter; The cutting scheme with the smaller number of objects to be cut among the second cutting scheme and the third cutting scheme is determined as the cutting scheme for the M products.

9. An information determination device, comprising: An acquisition module, used to acquire first specification parameter information of M products, where M is an integer greater than 1; A first simulation arrangement submodule is used to perform a simulation arrangement of the M products using a first planning model in a preset planning model based on the first specification parameter information, and obtain L cutting sub-schemes corresponding one to one to the L sub-objects to be cut, wherein the L cutting sub-schemes are used to cut the L sub-objects to be cut into the M products, where L is a positive integer; The first planning model includes a first planning sub-model, and the use of the first planning model in the preset planning model to simulate the arrangement of the M products includes: using the first planning sub-model to simulate the arrangement of the M products in a first direction within the sub-object to be cut, and when simulating the arrangement of the products in the first direction within the sub-object to be cut, the total area of ​​the products arranged in the sub-object to be cut is maximized; A simulation combination submodule, configured to perform simulation combination of the L sub-objects to be cut based on the L cutting sub-schemes and using a second planning model in a preset planning model to obtain a first cutting scheme for the M products, wherein the first cutting scheme is used to cut the N objects to be cut into the M products, where N is a positive integer; A scheme optimization module is used to optimize the first cutting scheme using a preset heuristic arrangement rule to obtain a second cutting scheme, wherein the second cutting scheme is used to cut K objects to be cut into the M products, where K is a positive integer less than or equal to N.

10. The device according to claim 9, wherein: The first planning model includes a first planning sub-model and a second planning sub-model, and the first simulation arrangement sub-module includes: a simulation arrangement unit, configured to perform a simulation arrangement of the M products using the first planning sub-model based on the first specification parameter information, and obtain L1 cutting sub-schemes corresponding to the L1 sub-objects to be cut one by one, wherein the L1 cutting sub-schemes are used to cut the L1 sub-objects to be cut into the M products, wherein different cutting sub-schemes simulate different products to be arranged in the sub-objects to be cut, and wherein the products in each cutting sub-scheme are arranged in the sub-objects to be cut in a target arrangement manner, and the total value under the target arrangement manner is greater than or equal to the total value of the products arranged in the sub-objects to be cut in other arrangement manners, and the total value is determined based on the first specification parameter information, and L1 is a positive integer greater than or equal to L; A sub-scheme optimization unit is used to optimize the L1 cutting sub-schemes by using the second planning sub-model to obtain the L cutting sub-schemes.

11. The device according to claim 10, wherein: The simulation arrangement unit is specifically used for: Based on the first specification parameter information, using the first planning sub-model, in accordance with the M weight decreasing order of the M products under the preset first target specification parameter, the M products are simulated and arranged in sequence to obtain L1 cutting sub-schemes corresponding to L1 sub-objects to be cut, wherein the first specification parameter information includes the first target specification parameter; The sub-scheme optimization unit is specifically used for: The second planning sub-model is used to perform a global optimization simulation arrangement of the M products arranged in the L1 sub-objects to be cut in the L1 cutting sub-schemes with the goal of minimizing the target parameter value, so as to obtain the L cutting sub-schemes, and the target parameter value is determined based on the L1 parameter values ​​of the L1 sub-objects to be cut under the first target specification parameters.

12. The device according to claim 11, wherein The simulation arrangement unit is specifically used for: Create a first framework of a first sub-object to be cut based on the parameter value of the first target product under the first target specification parameter, the first target product is the product ranked first in descending order of weight under the first target specification parameter among M1 products, the M1 products include products among the M products that are not arranged in the second sub-object to be cut, the second sub-object to be cut is a sub-object to be cut in which products are arranged in the target arrangement, the L1 sub-objects to be cut include the first sub-object to be cut and the second sub-object to be cut, and M1 is a positive integer less than or equal to M; Based on the first specification parameter information, using the first planning sub-model, with the goal of maximizing the total value of the products in the first sub-object to be cut, products are selected from the M1 products and simulated and arranged in the first framework to obtain a cutting sub-plan corresponding to the first sub-object to be cut; A second framework of sub-objects to be cut is created based on parameter values ​​of unarranged products among the M1 products under the first target specification parameters, and a simulated arrangement of products is performed within the second framework until the L1 sub-cutting schemes are obtained.

13. The device according to claim 9, wherein: In the first cutting scheme, the products are arranged in a first direction in the object to be cut, the preset heuristic arrangement rule includes that the products can be arranged in a second direction in the object to be cut, and the scheme optimization module includes: A first acquisition submodule is used to acquire a first cutting sub-scheme in the first cutting scheme, wherein the first cutting sub-scheme is used to cut a target object to be cut among the N objects to be cut into at least one second target product, and a utilization rate of the target object to be cut is less than or equal to utilization rates of other objects to be cut among the N objects to be cut; A selection submodule is used to sequentially traverse each second target product in the first cutting sub-scheme, and select a target position in the second direction from the frames of other objects to be cut except the target object to be cut among the N objects to be cut to perform simulated arrangement of the second target product, so as to obtain a second cutting scheme; The target position is a position where no product is arranged within the frame of the other object to be cut, and the area of ​​the target position matches the area of ​​the second target product.

14. The device according to claim 9 or 13, wherein: The object to be cut in the first cutting scheme includes a sub-object to be cut, the preset heuristic arrangement rule includes arranging the product by rotating it from a first direction to a second direction, and the scheme optimization module includes: A second acquisition submodule is used to acquire a second cutting sub-scheme corresponding to the target sub-object to be cut in the first cutting scheme, wherein the product set in the target sub-object to be cut is rotatable, and the product set includes all products arranged in the sub-object to be cut; A rotation submodule, for rotating the product set from the first direction to the second direction for simulated arrangement to obtain second specification parameter information of the first product set when the length of the product set in the target sub-object to be cut in the first direction is less than or equal to the length of the object to be cut corresponding to the target sub-object to be cut in the second direction; A simulation submodule is used to simulate the rearrangement of the M products based on the second specification parameter information and the third specification parameter information of the second product set to optimize the first cutting plan and obtain a second cutting plan. The second product set is a set of products within the N objects to be cut, except for the target sub-object to be cut.

15. The device according to claim 9, wherein: The preset heuristic arrangement rule includes a first heuristic arrangement rule and a second heuristic arrangement rule, and the solution optimization module includes: A first scheme optimization submodule, configured to optimize the first cutting scheme by using the first heuristic arrangement rule to obtain a first target cutting scheme; A second scheme optimization submodule, used for optimizing a second target cutting scheme by using the second heuristic arrangement rule to obtain a third target cutting scheme, wherein the second target cutting scheme includes the first cutting scheme or the first target cutting scheme; The determination submodule is used to determine the cutting scheme with the smaller number of objects to be cut among the first target cutting scheme and the third target cutting scheme as the second cutting scheme.

16. The apparatus according to claim 9, further comprising: a simulation rearrangement module, configured to perform a simulation rearrangement of the M products in sequence according to the descending order of the M weights of the M products under the preset second target specification parameters based on the first specification parameter information, so as to determine a third cutting scheme for the M products, wherein the first specification parameter information includes the second target specification parameter; The second determining module is used to determine the cutting scheme with the smaller number of objects to be cut among the second cutting scheme and the third cutting scheme as the cutting scheme for the M products.

17. An electronic device comprising: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 8.

18. A non-transitory computer-readable storage medium storing computer instructions, wherein: The computer instructions are used to cause the computer to execute the method according to any one of claims 1-8.

19. A computer program product, comprising a computer program, which, when executed by a processor, implements the method according to any one of claims 1 to 8.

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