A method for gluing annular structure product and a gluing jig thereof

Abstract

The invention relates to a method for gluing an annular structure product and a gluing jig thereof. The gluing jig is used to perform a first gluing process on the annular structure product so that the glue can fill a gluing cavity of the annular structure product. After the glue is solidified, the inner ring and the outer ring of the annular structure product are connected, thereby reducing the difficulty of assembling the annular structure product and achieving waterproof and dustproof effects to protect internal electronic components. The second gluing process is performed on the annular structure product so that gate residues, bubbles and other defects on the surface of the first gluing process can be completely solved, so that the final glue surface is flat and smooth with a relatively good appearance.

Description

Technical Field

[0001] The invention relates to the technical field of glue pouring, and in particular to a glue pouring method for an annular structure product and a glue pouring jig thereof. Background Art

[0002] Since electronic products with ring structures are difficult to assemble and have electronic components inside, it is necessary to fill such electronic products with ring structures with glue to reduce the difficulty of assembly, solve the waterproof and dustproof problems, and protect the internal electronic components.

[0003] However, the existing glue pouring process for electronic products with annular structures is prone to produce bubbles during the glue pouring process and has the defect of gate residue after glue pouring. On the one hand, the bubbles and gate residue generated by glue pouring will affect the waterproof and dustproof performance of the electronic products with annular structures, and easily affect the normal operation of the electronic components inside the electronic products and reduce the service life of the electronic products; on the other hand, for some electronic products with indicator lights inside, the bubbles and gate residue generated by glue pouring will also affect the lighting effect of the indicator lights inside. Summary of the invention

[0004] Based on this, the present invention provides a method for gluing a ring-shaped structure product and a gluing jig thereof. The gluing method is simple, and no bubbles are generated and no gate residues are left. A flat and smooth glue surface can be obtained, which meets the gluing requirements of ring-shaped electronic products.

[0005] On the one hand, the present invention provides a glue pouring jig for an annular structure product, comprising a jig lower mold, a lower gasket and an upper gasket suitable for being assembled in an assembly groove of the jig lower mold, and a jig upper mold adapted to the jig lower mold, the assembly groove being used to assemble the annular structure product, the jig lower mold extending from the assembly groove to form a positioning column, the positioning column being used to fix the position of the annular structure product, the upper gasket and the lower gasket being used to seal the front and back sides of the annular structure product, the glue pouring jig is also provided with a glue injection channel and an exhaust channel passing through the glue pouring cavity of the annular structure product, the glue injection channel and the exhaust channel being symmetrically arranged.

[0006] Optionally, the glue injection channel vertically penetrates the jig upper mold and the upper gasket, the exhaust channel vertically penetrates the upper gasket, and the jig upper mold is provided with an exhaust port vertically penetrating the exhaust channel.

[0007] Optionally, the glue pouring jig also includes a fixing part for fixing the jig lower mold and the jig upper mold, the jig lower mold and the jig upper mold are provided with a groove for assembling the fixing part, the fixing part is hinged to the jig lower mold, and can flip and move in the groove.

[0008] The present invention further provides a method for glue pouring a ring-shaped structure product, wherein the glue pouring jig is used to pour glue on the ring-shaped structure product, wherein the ring-shaped structure product has an inner ring and an outer ring, and a glue pouring cavity is formed between the inner ring and the outer ring, and the method comprises the following steps:

[0009] S1. Loading the annular structure product into the glue-filling jig;

[0010] S2, injecting glue into the glue filling cavity to complete the first glue filling process; and

[0011] S3, dispensing glue on the front and back sides of the annular structure product that has completed the first glue pouring process, to complete the second glue pouring process.

[0012] Optionally, the step S1 comprises the steps of:

[0013] S11, sequentially installing the lower washer, the annular structure product and the upper washer into the assembly groove of the lower mold of the jig, and forming a state in which the annular structure product is positioned by the positioning column; and

[0014] S12, covering the jig upper mold on the jig lower mold, and fixing the positions of the jig upper mold and the jig lower mold by the fixing parts of the jig lower mold, so that the annular structure product is pressed and fixed between the jig upper mold and the jig lower mold.

[0015] Optionally, in the step S2, a glue gun is used to inject glue into the glue pouring cavity through the glue injection channel of the glue pouring fixture, and the gas in the glue pouring cavity is discharged through the exhaust channel.

[0016] Optionally, in step S2, after injecting glue into the glue pouring cavity, a UV lamp is used to dry it to form a first glue layer in the glue pouring cavity; in step S3, after dispensing glue, a UV lamp is used to dry it to form a second glue layer on the front and back sides of the annular structure product.

[0017] Optionally, in step S3, the thickness of the formed second adhesive layer is 1-2 mm.

[0018] Optionally, before step S1, the method further includes the step of degassing and vacuuming the glue.

[0019] Optionally, the glue used in the first glue pouring process and the second glue pouring process is transparent UV glue.

[0020] The present invention first performs a first glue pouring process on the annular structure product, so that the glue can fill the glue pouring cavity of the annular structure product. After the glue is cured, the inner ring and the outer ring of the annular structure product are connected, which reduces the difficulty of assembling the annular structure product, and at the same time can play a waterproof and dustproof role to protect the internal electronic components; secondly, the annular structure product is subjected to a second glue pouring process, which can completely solve the gate residues, bubbles and other defects on the surface of the first glue pouring process, so that the final glue surface is flat and smooth, and has a better appearance. In other words, the present invention can reduce the difficulty of glue pouring on the annular structure product by performing a second glue pouring on the annular structure product, and can avoid the generation of bubbles and gate residues during the glue pouring process, and can obtain a good glue pouring effect.

[0021] The present invention can reduce the generation of bubbles during glue pouring and ensure a good glue pouring effect by degassing and vacuuming the glue before glue pouring and arranging symmetrical glue injection channels and exhaust channels on the glue pouring jig. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a flowchart of the method for glue filling of the annular structure product of the present invention;

[0023] Figure 2 It is a schematic diagram of the first glue pouring process of the annular structure product of the present invention using a glue pouring jig;

[0024] Figure 3 for Figure 2 A cross-sectional schematic diagram of a glue-filling fixture for the annular structure product shown;

[0025] Figure 4 for Figure 2 An enlarged schematic diagram of the structure of part B of the glue-filling fixture for the annular structure product shown;

[0026] Figure 5 for Figure 2 A partial exploded view of the glue-filling fixture for the annular structure product shown;

[0027] Figure 6 It is a schematic diagram of the second glue pouring process of the annular structure product of the present invention using a glue pouring jig;

[0028] Figure 7 Based on Figure 1 A top view of a finished product obtained by the method for gluing the annular structure product shown;

[0029] Figure 8 for Figure 6 The shown schematic cross-sectional view of the finished product after being cut along the AA axis.

[0030] The meanings of the symbols in the accompanying drawings are:

[0031] 10-glue pouring jig; 11-jig lower mold; 110-assembly groove; 111-positioning column; 12-lower gasket; 121-lower convex ring; 13-upper gasket; 131-upper convex ring; 14-jig upper mold; 141-exhaust port; 15-glue injection channel; 16-exhaust channel; 17-gate residual position; 18-fixing part; 101-groove; 19-bottom plate; 20-ring-shaped structure product; 21-inner ring; 22-outer ring; 201-glue pouring cavity; 30-glue pouring gun; 31-first glue layer; 32-second glue layer. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0035] like Figures 1 to 8 As shown, the specific steps of a method for glue pouring a ring-shaped structure product according to a preferred embodiment of the present invention and the specific structure of the glue pouring fixture 10 used are explained.

[0036] Specifically, Figure 1 , Figure 2 as well as Figure 6 As shown, the method for gluing the annular structure product comprises the following steps:

[0037] S1, loading the annular structure product 20 into the glue-filling fixture 10;

[0038] S2, injecting glue into the glue filling cavity 201 of the annular structure product 20 to complete the first glue filling process; and

[0039] S3, dispensing glue on the front and back sides of the annular structure product 20 that has completed the first glue pouring process, to complete the second glue pouring process.

[0040] Specifically, Figures 3 to 5 As shown, the glue-pouring jig 10 includes a jig lower die 11, a lower gasket 12 and an upper gasket 13 suitable for being assembled in an assembly groove 110 of the jig lower die 11, and a jig upper die 14 adapted to the jig lower die 11, and the jig lower die 11 extends to form a positioning column 111 in the assembly groove 110, and the step S1 specifically includes the steps of:

[0041] S11, sequentially installing the lower gasket 12, the annular structure product 20 and the upper gasket 13 into the assembly groove 110 of the jig lower die 11, and forming a state in which the annular structure product 20 is positioned by the positioning column 111; and

[0042] S12, cover the jig upper mold 14 on the jig lower mold 11, and fix the positions of the jig upper mold 14 and the jig lower mold 11 by the fixing part 18 of the jig lower mold 11, so that the annular structure product 20 is pressed and fixed between the jig upper mold 14 and the jig lower mold 11.

[0043] In particular, the glue pouring jig 10 is provided with a glue injection channel 15 and an exhaust channel 16 which pass through the glue pouring cavity 201, and the glue injection channel 15 and the exhaust channel 16 are symmetrically arranged. In the step S2, a glue gun 30 is used to inject glue into the glue pouring cavity 201 through the glue injection channel 15 of the glue pouring jig 10, and the gas in the glue pouring cavity 201 is discharged through the exhaust channel 16.

[0044] It is understandable that by providing the symmetrical injection channel 15 and the exhaust channel 16 on the glue pouring jig 10 , the generation of bubbles can be reduced during glue pouring, thereby ensuring a good glue pouring effect.

[0045] It is worth mentioning that, in order to further ensure that no bubbles are generated during the glue pouring process, the present invention further includes the steps of degassing and vacuuming the glue before performing the step S1.

[0046] It is also worth mentioning that the glue injection channel 15 is composed of corresponding perforations of the jig upper mold 14 and the upper gasket 13, that is, the glue injection channel 15 vertically penetrates the jig upper mold 14 and the upper gasket 13, the exhaust channel 16 vertically penetrates the upper gasket 13, and the jig upper mold 14 is provided with an exhaust port 141 which is vertical and penetrates the exhaust channel 16.

[0047] It is understandable that the difficulty of the glue filling process is that there are bubbles during the glue filling, so it is necessary to select a suitable needle, air pressure and the position of the exhaust port 141 to reduce the generation of bubbles. The present invention can minimize the generation of bubbles by setting the injection channel 15 and the exhaust channel 16, as well as the position of the exhaust port 141, so that the glue layer obtained after the first glue filling process is uniform and dense, ensuring the waterproof and dustproof performance of the inside of the annular structure product 20, and playing a good protective role for the electronic components inside the annular structure product 20. It should also be pointed out here that the position of the exhaust port 141 can be connected to a vacuum device, through which the gas in the glue filling chamber 201 is extracted outwardly, so that the colloid in the glue filling gun 30 can flow better toward the exhaust channel 16, which is conducive to the flow of the colloid and filling the glue filling chamber 201.

[0048] That is to say, the present invention can reduce the generation of bubbles during glue pouring and ensure a good glue pouring effect by degassing and vacuuming the glue before glue pouring and providing symmetrical glue injection channels 15 and exhaust channels 16 on the glue pouring jig 10.

[0049] Furthermore, the first glue pouring process and the second glue pouring process also include the step of drying the glue with a UV lamp. Specifically, in step S2, after injecting glue into the glue pouring cavity 201, a UV lamp is used to dry the glue, and a first glue layer 31 is formed in the glue pouring cavity 201. In step S3, after dispensing glue, a UV lamp is used to dry the glue, and a second glue layer 32 is formed on the front and back of the annular structure product 20. In some embodiments of the present invention, a corresponding type of lamp can also be used for drying according to the type of glue used, and the present invention does not limit the type of drying lamp used.

[0050] It is worth mentioning that in this preferred embodiment of the present invention, when the annular structure product 20 is an electronic product and an indicator light is provided inside the electronic product, in order to ensure that the indicator light is visible, the glue used in the first glue pouring process and the second glue pouring process of the present invention is transparent UV glue. For some other electronic products, the present invention does not limit the type of glue used for glue pouring.

[0051] It is also worth mentioning that during the first glue pouring process, the glue pouring cavity 201 is filled with UV glue with good fluidity, which can ensure that the first glue layer 31 is overall uniform and dense; during the second glue pouring process, the first glue layer 31 is covered with UV glue with good fluidity, which can ensure that the glue surface of the second glue layer 32 is flat and smooth.

[0052] Furthermore, if Figures 5 to 8As shown, the annular structure product 20 has an inner ring 21 and an outer ring 22, and the glue pouring cavity 201 is formed between the inner ring 21 and the outer ring 22. The first glue layer 31 is formed in the glue pouring cavity 201, and the second glue layer 32 is formed on the front and back sides of the first glue layer 31, that is, the second glue layer 32 is formed on the front and back sides of the annular structure product 20.

[0053] It can be understood that the purpose of the first glue pouring process in the present invention is to form a first glue layer 31 in the glue pouring cavity 201 of the annular structure product 20, and to fix the inner ring 21 and the outer ring 22 through the first glue layer 31 to reduce the difficulty of assembling the annular structure product 20, and to seal the interior of the annular structure product 20 through the first glue layer 31 to prevent water and dust from entering the electronic components of the annular structure product 20, thereby protecting the internal electronic components.

[0054] It can also be understood that after the first glue pouring process, the upper surface of the first glue layer 31 is Figure 3 There will be gate residues at the gate residue position 17 shown. In order to eliminate the gate residues, bubbles and other defects, the present invention needs to perform the second glue pouring process. That is to say, the present invention performs the second glue pouring process for the purpose of eliminating the gate residues, bubbles and other defects generated by the first glue pouring process, so that the glue surface of the annular structure product 20 can be flat and smooth and have a good appearance.

[0055] Moreover, since after the first glue pouring process, the surface of the first glue layer 31 will have a gate residue of about 1 to 2 mm, in order to make the overall glue surface of the annular structure product 20 smooth, the thickness of the second glue layer 32 formed in the second glue pouring process is preferably 1 to 2 mm, so as to ensure that the gate residue, bubbles or other defects generated by the first glue pouring process can be completely eliminated. That is, in the step S3, the thickness of the second glue layer 32 formed is preferably 1 to 2 mm.

[0056] like Figure 8 As shown, the finished product obtained by the method for gluing annular structure products according to the present invention has a flat and smooth glue surface and a good appearance.

[0057] like Figures 2 to 5As shown, the present invention further provides a glue pouring jig 10 for an annular structure product, the glue pouring jig 10 includes a jig lower mold 11, a lower gasket 12 and an upper gasket 13 suitable for being assembled in the assembly groove 110 of the jig lower mold 11, and a jig upper mold 14 adapted to the jig lower mold 11, the assembly groove 110 is used to assemble the annular structure product 20, the jig lower mold 11 is extended to form a positioning column 111 in the assembly groove 110, the positioning column 111 is used to fix the position of the annular structure product 20, the upper gasket 13 and the lower gasket 12 are used to seal the front and back sides of the annular structure product 20, the glue pouring jig 10 is also provided with a glue injection channel 15 and an exhaust channel 16 that pass through the glue pouring cavity 201 of the annular structure product 20, and the glue injection channel 15 and the exhaust channel 16 are symmetrically arranged.

[0058] Specifically, the injection channel 15 vertically penetrates the jig upper mold 14 and the upper gasket 13 , the exhaust channel 16 vertically penetrates the upper gasket 13 , and the jig upper mold 14 is provided with an exhaust port 141 vertically penetrating the exhaust channel 16 .

[0059] It is worth mentioning that the upper gasket 13 and the lower gasket 12 are both silicone pads, the lower gasket 12 is an annular silicone pad adapted to the assembly groove 110, and the upper gasket 13 is a plate-shaped silicone pad. The upper gasket 13 and the lower gasket 12 made of silicone material can be well fitted between the upper mold 14, the lower mold 11 and the surface of the annular structure product 20 during the first glue pouring process, providing a better sealing space for the glue pouring cavity 201 in the annular structure product 20 for forming the first glue layer 31, except for the glue injection channel 15 and the exhaust channel 16, which is conducive to the flow of the colloid and the action of vacuum extraction.

[0060] like Figure 4 As shown, the upper gasket 13 includes an upper convex ring 131 extending from top to bottom between the inner ring 21 and the outer ring 22, and the lower gasket 12 also includes a lower convex ring 121 extending from bottom to top between the inner ring 21 and the outer ring 22. No colloid will remain in the upper convex ring 131 and the lower convex ring 121 during the first glue pouring process, so that a space for the second glue pouring is formed between the upper and lower surfaces of the first glue layer 31 formed after the upper gasket 13 and the lower gasket 12 are removed after the first glue pouring process and the inner ring 21 and the outer ring 22. It is further necessary to point out that the depth of the outer surface between the inner ring 21 and the outer ring 22 in the longitudinal direction involved in the space corresponds to the thickness of the second glue layer 32.

[0061] Furthermore, the glue pouring jig 10 also includes a fixing part 18 for fixing the jig lower mold 11 and the jig upper mold 14. The jig lower mold 11 and the jig upper mold 14 are provided with a groove 101 for assembling the fixing part 18. The fixing part 18 is hinged to the jig lower mold 11 and can be flipped and moved in the groove 101 to switch the state of locking and releasing the jig upper mold 14 and the jig lower mold 11.

[0062] Furthermore, the glue pouring jig 10 also includes a bottom plate 19 for supporting the jig lower mold 11, wherein when the fixing member 18 is flipped in a direction close to the bottom plate 19 on the jig lower mold 11, the jig upper mold 14 and the jig lower mold 11 are released and can be disassembled to facilitate the loading of the annular structure product 20 into the glue pouring jig 10. After the annular structure product 20 is loaded, the fixing member 18 can be flipped in a direction away from the bottom plate 19 into the groove 101 to press and lock the jig upper mold 14 and the jig lower mold 11.

[0063] The present invention seals the front and back sides of the annular structure product 20 respectively through the upper gasket 13 and the lower gasket 12, and fixes the annular structure product 20 by pressing the lower mold 11 and the upper mold 14 of the jig, which can ensure the stable glue pouring and ensure a good glue pouring effect. The glue pouring jig 10 has a simple structure and is easy to disassemble and assemble, and the glue injection channel 15, the exhaust channel 16 and the exhaust port 141 are specially arranged to ensure that no bubbles are generated when the annular structure product 20 is poured with glue.

[0064] In general, the present invention provides a method for gluing an annular structure product and a gluing jig thereof. The gluing method is simple, and no bubbles are generated and no gate residues are left. A flat and smooth glue surface can be obtained, which meets the gluing requirements of annular electronic products.

[0065] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for glue pouring of annular structure products, characterized in that: The invention comprises a glue pouring jig for an annular structure product for executing the glue pouring method, wherein the glue pouring jig for the annular structure product comprises a jig lower mold, a lower gasket and an upper gasket suitable for being assembled in an assembly groove of the jig lower mold, and a jig upper mold adapted to the jig lower mold, wherein the assembly groove is used to assemble the annular structure product, the jig lower mold is extended to form a positioning column in the assembly groove, the positioning column is used to fix the position of the annular structure product, the upper gasket and the lower gasket are used to seal the front and back sides of the annular structure product, and the glue pouring jig is also provided with a glue injection channel and an exhaust channel which pass through the glue pouring cavity of the annular structure product, and the glue injection channel and the exhaust channel are symmetrically arranged; The glue injection channel vertically penetrates the jig upper mold and the upper gasket, the exhaust channel vertically penetrates the upper gasket, and the jig upper mold is provided with an exhaust port vertically penetrating the exhaust channel; The annular structure product comprises an inner ring and an outer ring, a glue pouring cavity is formed between the inner ring and the outer ring, and the glue pouring step comprises: S1. Loading the annular structure product into the glue-filling jig; S2, injecting glue into the glue filling cavity to complete the first glue filling process; and S3, dispensing glue on the front and back sides of the annular structure product that has completed the first glue pouring process, to complete the second glue pouring process.

2. The method for glue pouring of annular structure products according to claim 1, characterized in that: The glue pouring jig also includes a fixing part for fixing the jig lower mold and the jig upper mold. The jig lower mold and the jig upper mold are provided with a groove for assembling the fixing part. The fixing part is hinged to the jig lower mold and can flip and move in the groove.

3. The method for glue pouring of annular structure products according to claim 2, characterized in that: The step S1 comprises the steps of: S11, sequentially installing the lower washer, the annular structure product and the upper washer into the assembly groove of the lower mold of the jig, and forming a state in which the annular structure product is positioned by the positioning column; and S12, covering the jig upper mold on the jig lower mold, and fixing the positions of the jig upper mold and the jig lower mold by the fixing parts of the jig lower mold, so that the annular structure product is pressed and fixed between the jig upper mold and the jig lower mold.

4. The method for glue pouring of annular structure products according to claim 3, characterized in that: In the step S2, glue is injected into the glue pouring cavity through the glue injection channel of the glue pouring fixture using a glue pouring gun, and the gas in the glue pouring cavity is discharged through the exhaust channel.

5. The method for glue pouring of annular structure products according to claim 4, characterized in that: In the step S2, after injecting glue into the glue-filling cavity, a UV lamp is used to dry it, so as to form a first glue layer in the glue-filling cavity; in the step S3, after dispensing glue, a UV lamp is used to dry it, so as to form a second glue layer on the front and back sides of the annular structure product.

6. The method for glue pouring of annular structure products according to claim 5, characterized in that: In the step S3, the thickness of the formed second adhesive layer is 1-2 mm.

7. The method for glue pouring of annular structure products according to claim 6, characterized in that: Before step S1, the method further includes the steps of degassing and vacuuming the glue.

8. The method for glue pouring of annular structure products according to claim 7, characterized in that: The glue used in the first glue pouring process and the second glue pouring process is transparent UV glue.

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