Antenna Package and Image Display Device

Abstract

An antenna package and an image display device are provided. The antenna package includes an antenna device having an antenna unit and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bent region. The flexible circuit board includes a core layer having a first surface and a second surface opposite to each other, signal wirings provided on the first surface of the core layer and electrically connected to the antenna unit, a ground line provided on the first surface of the core layer spaced apart from the signal wirings, a ground layer provided on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region outside the bent region and connecting the ground line and the ground layer to each other.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2020 - 0154537, filed with the Korean Intellectual Property Office (KIPO) on November 18, 2020, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board, and an image display device including the antenna package. Background art

[0004] With the development of information technology, wireless communication technologies such as Wi - Fi and Bluetooth are combined with image display devices in the form of smart phones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] According to the development of mobile communication technology, an antenna capable of implementing communication in, for example, a high frequency band or an ultra - high frequency band is required in a display device.

[0006] A circuit board for power feeding and control signal transmission can be connected to the antenna to control the radiation drive of the antenna. However, if the drive frequency of the antenna increases, signal loss increases, and as the length of the transmission path through the circuit board increases, the degree of signal loss may further increase.

[0007] The circuit board can be bent, for example, to be connected to a driving integrated circuit chip. In this case, the circuit wiring may be damaged, and the bonding with the antenna may fail due to bending stress.

[0008] In addition, as the thickness of recently adopted image display devices with antennas decreases, the degree of the bending curvature of the circuit board may also increase. In this case, the above - mentioned defects due to bending may be further deteriorated. Therefore, a configuration of an antenna package for obtaining a reliable electrical connection while maintaining or improving the radiation characteristics of the antenna may be required.

[0009] For example, Korean Patent Publication No. 2013 - 0095451 discloses an antenna integrated into a display panel, but does not propose an effective circuit connection as described above. Summary of the invention

[0010] According to one aspect of the present invention, there is provided an antenna package having improved mechanical reliability and signal efficiency.

[0011] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved electrical reliability and radiation efficiency.

[0012] (1) An antenna package, comprising: an antenna device including an antenna unit; and a flexible circuit board electrically connected to the antenna unit, the flexible circuit board having a bent region, wherein the flexible circuit board includes: a core layer having a first surface and a second surface opposite to each other; signal wirings disposed on the first surface of the core layer and electrically connected to the antenna unit; ground wirings disposed on the first surface of the core layer spaced apart from the signal wirings; a ground layer disposed on the second surface of the core layer; and a via structure penetrating a portion of the core layer in a region outside the bent region and connecting the ground wirings and the ground layer to each other.

[0013] (2) The antenna package according to the above (1), wherein the flexible circuit board further includes a first region located at one end of the bent region and electrically connected to the antenna unit and a second region located at the other end of the bent region, and the via structure includes a first via structure penetrating a portion of the core layer in the first region and a second via structure penetrating a portion of the core layer in the second region.

[0014] (3) The antenna package according to the above (2), wherein the ground wiring includes a first ground pattern formed on a portion of the core layer in the first region and a second ground pattern formed on a portion of the core layer in the second region, and the first ground pattern and the second ground pattern are spaced apart from each other with the bent region interposed therebetween.

[0015] (4) The antenna package according to the above (3), wherein the first via structure connects the first ground pattern and the ground layer to each other, and the second via structure connects the second ground pattern and the ground layer to each other.

[0016] (5) The antenna package according to the above (2), characterized in that the ground wiring continuously extends through the first region, the bent region, and the second region.

[0017] (6) The antenna package according to the above (2), further including an antenna driving integrated circuit chip connected to the flexible circuit board through a portion of the signal wiring in the second region.

[0018] (7) The antenna package according to the above (2), wherein a thickness of a portion of the signal wiring in the bent region is smaller than a thickness of a portion of the signal wiring in the first region or the second region.

[0019] (8) The antenna package according to the above (1), wherein the signal wirings and the ground wirings are alternately and repeatedly disposed in parallel with each other on the first surface of the core layer.

[0020] (9) According to the antenna package of (8) above, wherein the via structure is repeatedly provided along the extending direction of the ground wire to form a plurality of via columns.

[0021] (10) According to the antenna package of (9) above, wherein a pair of via columns among the plurality of via columns are spaced apart from each other when a signal line is inserted therebetween.

[0022] (11) According to the antenna package of (8) above, wherein the antenna unit includes a radiator, a transmission line extending from the radiator, and a signal pad formed at an end of the transmission line, and a plurality of antenna units are provided in the width direction.

[0023] (12) According to the antenna package of (11) above, wherein the signal wiring is electrically connected to the signal pad included in each of the plurality of antenna units.

[0024] (13) According to the antenna package of (12) above, wherein the antenna unit further includes a ground pad provided around the signal pad and separated from the signal pad and the transmission line, and the ground wire is electrically connected to the ground pad.

[0025] (14) According to the antenna package of (1) above, wherein there is no conductive layer other than the signal wiring on a portion of the first surface of the core layer located in the bent region.

[0026] (15) An image display device, comprising: a display panel; and an antenna package according to the above-described embodiment provided on the display panel.

[0027] (16) According to the image display device of (15) above, it further includes an antenna driving integrated circuit chip provided under the display panel, wherein a bent region of the flexible circuit board of the antenna package is bent so as to be electrically connected to the antenna driving integrated circuit chip.

[0028] An antenna package according to an exemplary embodiment may include circuit wiring formed on a bottom surface of a core layer of a flexible circuit board connected to an antenna device, a ground wire adjacent to and spaced apart from the circuit wiring, a ground layer formed on a top surface of the core layer, and a via structure (via) connecting the ground wire and the ground layer. The ground wire may be connected to the ground layer through the via structure to improve the signal transmission / reception efficiency of the signal wiring and prevent signal loss and interference.

[0029] In an exemplary embodiment, a via structure may not be formed in a bent region of a flexible printed circuit board. Accordingly, signal loss and deterioration of driving stability due to cracks in the via structure while bending the flexible printed circuit board can be prevented. In addition, exposure of a core layer of the flexible printed circuit board due to cracks can be prevented to improve lifetime stability of the antenna package. Further, a thickness of a signal line located in the bent region may be formed to be relatively thin to improve bending performance of the flexible printed circuit board.

[0030] In some embodiments, a ground line may not be formed in a bent region of a flexible printed circuit board. Accordingly, signal interference and signal loss due to damage of the ground line in the bent region while bending the flexible printed circuit board can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 and Figure 2 are a schematic cross-sectional view and a top plan view showing an antenna package according to an exemplary embodiment, respectively.

[0032] Figure 3 is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to an exemplary embodiment.

[0033] Figure 4 is a schematic cross-sectional view showing an antenna package according to some exemplary embodiments.

[0034] Figure 5 is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to an exemplary embodiment.

[0035] Figure 6 is a schematic cross-sectional view showing an image display device including an antenna package according to an exemplary embodiment. DETAILED DESCRIPTION

[0036] According to an exemplary embodiment of the present invention, there is provided an antenna package in which an antenna device and a flexible printed circuit board including a ground line are combined. According to an exemplary embodiment of the present invention, there is also provided an image display device including the antenna package.

[0037] Hereinafter, the present invention will be described in detail with reference to the drawings. However, those skilled in the art will understand that these embodiments provided with reference to the drawings are for further understanding of the spirit of the present invention and are not intended to limit the subject matter to be protected disclosed in the detailed description and the appended claims.

[0038] Figure 1 and Figure 2 are a schematic cross-sectional view and a top plan view showing an antenna package according to an exemplary embodiment, respectively. Specifically,Figure 1 is a schematic cross-sectional view showing an antenna package. Figure 2 is a schematic top plan view showing an antenna device included in the antenna package.

[0039] Referring Figure 1 , the antenna package may include an antenna device 100 and a flexible circuit board 200 (e.g., a flexible printed circuit board (FPCB)). The flexible circuit board 200 may include a core layer 210, signal wirings 220 formed on the surface of the core layer 210, ground lines 230 adjacent to and spaced apart from the signal wirings 220, and a ground layer 250. The signal wirings 220, the ground lines 230, and / or the ground layer 250 may be formed of a metal plating such as a copper plating, for example.

[0040] In an exemplary embodiment, the core layer 210 may include a first surface 210a (e.g., a bottom surface) and a second surface 210b (e.g., a top surface) opposite to each other. The signal wirings 220 and the ground lines 230 may be formed on the first surface 210a of the core layer 210, and the ground layer 250 may be formed on the second surface 210b of the core layer 210.

[0041] The core layer 210 may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. The core layer 210 may include an inner insulating layer included in the circuit board 200.

[0042] Referring Figure 2 , the antenna device 100 may include an antenna dielectric layer 110 and an antenna unit 120 disposed on the antenna dielectric layer 110.

[0043] The antenna dielectric layer 110 may include polyester resins such as polyethylene terephthalate, poly(ethylene isophthalate), polyethylene naphthalate, and poly(butylene terephthalate); cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as poly(methyl)methacrylate and poly(ethyl)methacrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, cycloolefin, or polyolefin having a norbornene structure and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allylated resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. They may be used alone or in combination of two or more.

[0044] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the antenna dielectric layer 110. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0045] In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a desired high frequency band or ultra-high frequency band may not be achieved.

[0046] The antenna unit 120 may be formed on the top surface of the antenna dielectric layer 110. For example, a plurality of antenna units 120 may be arranged in an array along the width direction of the antenna dielectric layer 110 or the antenna package to form a horizontal row of antenna units.

[0047] The antenna unit 120 may include a radiator 122 and a transmission line 124. The radiator 122 may have, for example, a polygonal flat plate shape, and the transmission line 124 may extend from one side of the radiator 122. The transmission line 124 may be formed as a single member substantially integral with the radiator 122 and may have a smaller width than the radiator 122.

[0048] The antenna unit 120 may further include a signal pad 126. The signal pad 126 may be connected to one end of the transmission line 124. In one embodiment, the signal pad 126 may be formed as a member substantially integral with the transmission line 124, and the end portion of the transmission line 124 may serve as the signal pad 126.

[0049] In some embodiments, a ground pad 128 may be provided around the signal pad 126. For example, a pair of ground pads 128 may be provided to face each other with the signal pad 126 interposed therebetween.

[0050] For example, the ground pad 128 may be electrically and physically separated from the transmission line 124 around the signal pad 126. The ground pad 128 may be used as a bonding pad that can improve the bonding stability with the conductive bonding structure 150.

[0051] In an exemplary embodiment, the antenna unit 120 or the radiator 122 may provide signal transmission / reception in a high frequency band or an ultra-high frequency band (e.g., 3G, 4G, 5G or higher). In a non-limiting example, the resonant frequency of the antenna unit may be about 24 GHz to about 45 GHz.

[0052] The antenna unit 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination.

[0053] In one embodiment, the antenna unit 120 may include silver (Ag) or a silver alloy (e.g., silver - palladium - copper (APC)) or copper (Cu) or a copper alloy (e.g., copper - calcium (CuCa)) to achieve a low resistance and a fine linewidth pattern.

[0054] In one embodiment, the antenna unit 120 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0055] In some embodiments, the antenna unit 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a bilayer structure of a transparent conductive oxide layer - metal layer, or a trilayer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, flexibility can be improved by the metal layer, and the signal transmission speed can also be increased by the low resistance of the metal layer. Corrosion resistance and transparency can be improved by the transparent conductive oxide layer.

[0056] The antenna unit 120 may include a blackened portion, so that the reflectivity at the surface of the antenna unit 120 can be reduced to suppress the visual recognition of the antenna unit due to light reflection.

[0057] In one embodiment, the surface of the metal layer included in the antenna unit 120 may be converted into a metal oxide or a metal sulfide to form a blackened layer. In one embodiment, a blackened layer, such as a black material coating or plating, may be formed on the antenna unit 120 or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one of them.

[0058] Considering the reduction of the reflection effect and the antenna radiation characteristics, the composition and thickness of the blackened layer can be adjusted.

[0059] In some embodiments, the radiator 122 and the transmission line 124 may include a mesh pattern structure to improve the light transmittance. In this case, a dummy mesh electrode (not shown) may be formed around the radiator 122 and the transmission line 124.

[0060] Considering reducing the feed resistance and noise absorption efficiency, the signal pad 126 and the ground pad 128 may have a solid pattern structure formed of the above-described metal or alloy.

[0061] In some embodiments, the antenna ground layer 130 may be formed on the bottom surface of the antenna dielectric layer 110. The antenna ground layer 130 may overlap with the radiator 122 of the antenna unit 120 in the thickness direction. A substantially vertically radiating antenna can be realized by generating an electric field or inductance between the radiator 122 and the antenna ground layer 130.

[0062] In one embodiment, the antenna ground layer 130 may completely cover the radiator 122 in a plan view and may not overlap with the pads 126 and 128.

[0063] The antenna ground layer 130 may include the above-described metal and / or alloy. In some embodiments, the antenna ground layer 130 may be included therein as an independent component of the antenna element device. In some embodiments, the conductive member of the image display device employing the antenna device 100 may be used as the antenna ground layer 130.

[0064] The conductive member may include, for example, the gate electrode of a thin film transistor (TFT) included in the display panel, various wirings such as scan lines or data lines, and various electrodes such as pixel electrodes or common electrodes.

[0065] In one embodiment, various structures containing a conductive material provided under the display panel may be used as the antenna ground layer 130. For example, a metal plate (e.g., a stainless steel plate such as a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digital converter, etc. may be used as the antenna ground layer 130.

[0066] Figure 3 is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to an exemplary embodiment.

[0067] Referring to Figure 3 , the flexible printed circuit board 200 may include a bending area BA, a first area I positioned at one end of the bending area BA and electrically connected to the above-described antenna unit 120, and a second area II positioned at the other end of the bending area BA. For example, the bending area BA may be a portion where the flexible printed circuit board 200 can be bent.

[0068] For example, the first area I may include an area where the signal pad 126 of the antenna device 100 and the signal wiring 220 of the flexible printed circuit board 200 can be electrically connected or joined to each other.

[0069] For example, the flexible printed circuit board 200 and the antenna driving integrated circuit (IC) chip 280 (seeFigure 6 ) can be electrically connected to each other through the portion of the signal wiring 220 located in the second region II.

[0070] As described above, the signal wiring 220 may be disposed on the first surface 210a of the core layer 210. For example, one end of the signal wiring 220 may be joined to the signal pad 126 of the antenna unit 120 in the first region I, and the other end of the signal wiring 220 may be electrically connected to the antenna driving IC chip 280.

[0071] For example, a conductive bonding structure 150 (e.g., an anisotropic conductive film (ACF)) may be disposed on the pads 126 and 128 of the antenna unit 120, and the portion of the flexible circuit board 200 located in the first region I may be attached to the conductive bonding structure 150. Thereafter, the electrical connection between the signal wiring 220 and the signal pad 126 may be achieved through a bonding process including a heating / pressurizing process.

[0072] In an exemplary embodiment, bonding pads 223 may be formed at each end portion of the signal wiring 220. In this case, the bonding pads 223 and the signal pad 126 may be electrically connected to each other. In one embodiment, one end of the signal wiring 220 may be directly provided as the bonding pad 223.

[0073] In some embodiments, a ground bonding pattern 225 may also be disposed on the core layer 210. For example, the ground bonding pattern 225 may be disposed at the end portion of the signal wiring 220 or around the bonding pad 223.

[0074] The ground bonding pattern 225 may be aligned above the ground pad 128 of the antenna device 100. The ground bonding pattern 225 may also be electrically connected to the ground pad 128 of the antenna device 100 through the conductive bonding structure 150.

[0075] In some embodiments, the signal wiring 220 may continuously extend in the length direction of the flexible circuit board 200 on the first surface 210a of the core layer 210 through the first region I, the bending region BA, and the second region II.

[0076] In an exemplary embodiment, a ground wire 230 adjacent to the signal wiring 220 may be disposed on the first surface 210a of the core layer 210. For example, the ground wire 230 may be used as a ground portion of the signal wiring 220.

[0077] In some embodiments, the ground wire 230 continuously extends on the first surface 210a of the core layer 210 through the first region I, the bending region BA, and the second region II.

[0078] In an exemplary embodiment, the ground layer 250 may be formed on the second surface 210b of the core layer 210. For example, an electric field may be generated between the signal wiring 220 and the ground layer 250, thereby improving the feeding efficiency for the antenna unit 120. In addition, the ground layer 250 may be connected to the ground wire 230 through the via structure 240, thereby improving the signal transmission / reception efficiency of the signal wiring 220 while shielding the noise around the signal wiring 220.

[0079] For example, the ground layer 250 may have a solid structure.

[0080] In an exemplary embodiment, the flexible circuit board 200 may include a via structure 240 that connects the ground wire 230 and the ground layer 250.

[0081] For example, the via structure 240 may include columnar or cylindrical patterns that are independent of each other and may penetrate the core layer 210. For example, the via structure 240 may be formed of substantially the same material through the same process as that for forming the above-mentioned ground wire 230.

[0082] The via structure 240 may penetrate a portion of the core layer 210 located in a region that does not include the bending region BA of the core layer 210. In this case, cracks in the via structure that may be generated in the bending region BA when the flexible circuit board 200 is bent can be prevented. Therefore, signal loss from the signal wiring can be suppressed and the ratio of the core layer 210 exposed to the outside can be reduced, thereby improving the driving stability and reliability of the antenna package.

[0083] In some embodiments, the via structure 240 may include a first via structure 242 that penetrates a portion of the core layer 210 located in the first region I and a second via structure 244 that penetrates a portion of the core layer 210 located in the second region II.

[0084] In this case, the ground layer 250 and the ground wire 230 may be connected through the via structure 240 in the first region I and the second region II, while preventing signal loss due to damage to the via structure 240 in the bending region BA. Therefore, signal transmission / reception efficiency and noise shielding can be effectively achieved.

[0085] In some embodiments, a plurality of signal wirings 220 and a plurality of ground wires 230 may be alternately and repeatedly arranged in parallel with each other on the first surface 210a of the core layer 210. Therefore, the ground wire 230 may be used as a ground shield for the signal wiring 220.

[0086] In one embodiment, a plurality of via structures 240 may be disposed along the extending direction of each ground line 230 to form a plurality of via columns. For example, a pair of via columns may be spaced apart from each other with a signal wiring 220 interposed therebetween. Accordingly, the ground line 230 may stably and uniformly serve as a ground pattern for the signal wiring 220.

[0087] In some embodiments, a plurality of antenna units 120 may be disposed in the width direction of the antenna device 100. In this case, each signal wiring 220 may be electrically connected to a signal pad 126 of the antenna unit 120. In addition, each ground line 230 may be electrically connected to a ground pad 128. For example, each ground line 230 may be connected to a ground bonding pattern 225, and the ground bonding pattern 225 may be electrically connected to the ground pad 128 of the antenna unit 120 as described above.

[0088] In some embodiments, the spacing distance (e.g., the shortest distance between the center line of the signal wiring 220 and the center of the ground line 230) between the signal wiring 220 and the ground line 230 on the first surface 210a of the core layer 210 may be 50 μm to 500 μm. Within the above range, signal interference and signal loss caused when the ground line 230 and the signal wiring 220 are too close to each other can be prevented while improving the space efficiency of the flexible circuit board 200 and the antenna package.

[0089] In some embodiments, the diameter of the via structure 240 may be 120 μm to 200 μm. Within the above range, the connection between the ground layer 250 and the ground line 230 can be appropriately achieved while improving the space efficiency of the flexible circuit board 200 and the antenna package to sufficiently provide the grounding function of the ground line 230.

[0090] In an exemplary embodiment, the signal wiring 220, the ground line 230, and the ground layer 250 may include the above-described metal and / or alloy. For example, the signal wiring 220 and the ground line 230 may be formed of substantially the same material.

[0091] Figure 4 is a schematic cross-sectional view showing an antenna package according to some exemplary embodiments.

[0092] Referring to Figure 4 , in some embodiments, the thickness of the portion of the signal wiring 220 disposed in the bending area BA of the flexible circuit board 200 may be less than the thickness of the portion of the signal wiring located in the first area I and / or the second area II.

[0093] For example, the via structure 240 is not provided in the bending region BA, so an additional electroplating process for forming the via structure 240 may not be required. Therefore, the thickness of the portion of the signal wiring 220 provided in the bending region BA can be reduced. Accordingly, the overall thickness of the bending region BA can also be reduced, and the bending characteristics of the flexible printed circuit board 200 can be improved.

[0094] Figure 5 is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to an exemplary embodiment.

[0095] Referring to Figure 5 , in some embodiments, the ground line 230 may include a first ground pattern 232 formed on a portion of the core layer 210 located in the first region I and a second ground pattern 234 formed on a portion of the core layer 210 located in the second region II. The first ground pattern 232 and the second ground pattern 234 may be spaced apart from each other with the bending region BA interposed therebetween.

[0096] In this case, signal interference and signal loss caused by damage to the ground line 230 in the bending region BA when the flexible printed circuit board is bent can be prevented. Accordingly, improved driving stability and signal transmission / reception efficiency of the antenna package can be achieved.

[0097] In some embodiments, the first via structure 242 may connect the first ground pattern 232 and the ground layer 250 to each other, and the second via structure 244 may connect the second ground pattern 234 and the ground layer 250. Accordingly, signal interference and signal loss of the signal wiring 220 can be prevented while preventing damage to the ground line 230 and the via structure 240 in the bending region BA.

[0098] In some embodiments, there may be no conductive layer other than the signal wiring on a portion of the first surface 210a of the core layer 210 located in the bending region BA. In this case, there may be no conductive layer that may require an additional electroplating process other than the signal wiring 220, so that the thickness of the signal wiring 220 can be reduced within a range that does not reduce the signal transmission efficiency. Accordingly, the bending characteristics of the flexible printed circuit board 200 can be improved.

[0099] Figure 6 is a schematic cross-sectional view showing an image display device including an antenna package according to an exemplary embodiment.

[0100] Referring to Figure 6 , the image display device may include a display panel 260 and the antenna package according to the above exemplary embodiment provided on the display panel 260.

[0101] The display panel 260 may include, for example, an OLED panel or an LCD panel, preferably an OLED panel. The antenna device 100 may be disposed on the display panel 260. The radiator 122 of the antenna unit 120 may be disposed on the display area of the image display device or the display panel 260. In this case, the radiator 122 may include a mesh structure to increase the light transmittance and suppress the visual recognition of the antenna unit 120.

[0102] The signal pad 126 of the antenna unit 120 may be disposed on the border area or the outer peripheral area of the image display device or the display panel 260. The flexible circuit board 200 may be joined to the signal pad 126 using the first region I, and may be bent downward using the bending region BA to reach the display panel 260.

[0103] For example, the boundary between the bending region BA and the first region I may be defined as the bending start line of the flexible circuit board 200, and the boundary between the bending region BA and the second region II may be defined as the bending end line where the flexible circuit board 200 ends.

[0104] As Figure 6 shown, the via hole structure 240 may be formed only in the first region I and the second region II that do not include the bending region BA, so that it is possible to prevent the via hole structure 240 and / or the ground wire 230 from breaking in the bending region BA when the flexible circuit board 200 is bent.

[0105] As described above, the signal wiring 220 having a relatively thin thickness may be included in the bending region BA, and the flexible circuit board 200 may provide improved bending stability. In addition, the via hole structure 240 may not be provided in the bending region BA, so that signal loss and deterioration of driving stability due to cracks in the via hole structure 240 can be prevented. The second region II may be inserted under the display panel 260 through the bending region BA.

[0106] The signal wiring 220 included in the second region II may be electrically connected to the antenna driving IC chip 280 using the intermediate circuit board 270. The intermediate circuit board 270 may include, for example, a main board, a package board, or a rigid printed circuit board.

[0107] The antenna driving IC chip 280 may be mounted on the intermediate circuit board 270 to supply power to the antenna unit pattern 120 and control antenna radiation through the flexible circuit board 200.

Claims

1. An antenna package, characterized in that, It includes: An antenna device, which includes an antenna unit; And A flexible printed circuit board electrically connected to the antenna unit, the flexible printed circuit board having a bent region, wherein the flexible printed circuit board includes: a core layer having a first surface and a second surface opposite to each other; signal wirings provided on the first surface of the core layer and electrically connected to the antenna unit; a ground wire provided on the first surface of the core layer spaced apart from the signal wirings; a ground layer provided on the second surface of the core layer; and a via structure that penetrates a portion of the core layer in a region outside the bent region and connects the ground wire and the ground layer to each other, Wherein the flexible printed circuit board further includes a first region located at one end of the bent region and electrically connected to the antenna unit and a second region located at the other end of the bent region, Wherein the ground wire continuously extends through the first region, the bent region, and the second region.

2. The antenna package according to claim 1, wherein It further includes an antenna driving integrated circuit chip connected to the flexible printed circuit board through a portion of the signal wirings located in the second region.

3. The antenna package according to claim 1, wherein The thickness of the portion of the signal wirings located in the bent region is smaller than the thickness of the portion of the signal wirings located in the first region or the second region.

4. The antenna package according to claim 1, characterized in that, The signal wirings and the ground wire are alternately and repeatedly provided parallel to each other on the first surface of the core layer.

5. The antenna package according to claim 4, characterized in that The via structure is repeatedly provided along the extending direction of the ground wire to form a plurality of via columns.

6. The antenna package according to claim 5, characterized in that, A pair of the via columns among the plurality of via columns are spaced apart from each other with the signal wirings interposed therebetween.

7. The antenna package according to claim 4, characterized in that, The antenna unit includes a radiator, a transmission line extending from the radiator, and a signal pad formed at an end of the transmission line, and a plurality of the antenna units are provided in the width direction.

8. The antenna package according to claim 7, wherein The signal wirings are electrically connected to the signal pads included in each of the plurality of antenna units.

9. The antenna package according to claim 8, characterized in that, The antenna unit further includes a ground pad provided around the signal pad and separated from the signal pad and the transmission line, and The ground wire is electrically connected to the ground pad.

10. An image display device, characterized in that, It includes: A display panel; And The antenna package according to claim 1 provided on the display panel.

11. The image display device according to claim 10, characterized in that, It further includes an antenna driving integrated circuit chip provided below the display panel, Wherein the bent region of the flexible printed circuit board of the antenna package is bent so as to be electrically connected to the antenna driving integrated circuit chip.

Images