A localized environmental cooling device

Abstract

This invention relates to a localized cooling device, comprising a semiconductor refrigeration system, an atomizing device, a water replenishment system, a dehumidification system, and a sensing and control system. In operation, the device employs a combination of semiconductor refrigeration and water mist evaporation heat absorption, with these two methods alternating to achieve localized cooling. Atomization and float-ball water replenishment complete a dynamic water circulation process. The dehumidification system, water replenishment system, and atomizing plates work together to consume and replenish water in the cooling tank. The device features a special structural design for the cold and hot end heat sinks, and multiple sensors coordinate with the control system. This device can achieve localized cooling within a small area.

Description

Technical Field

[0001] This invention relates to the field of refrigeration and cooling, and more specifically, to an indoor local environment cooling device. Background Technology

[0002] In the sweltering summer, maintaining a comfortable working and living environment requires cooling devices. There are many cooling methods, such as compression refrigeration, liquid vaporization heat absorption, semiconductor refrigeration, phase change heat absorption, and magnetic refrigeration. Among these, compression refrigeration is the most common; air conditioners utilize this principle. An air conditioner generally consists of four main parts: a compressor, condenser, evaporator, and expansion valve (also known as a throttling element). While highly efficient, it has a relatively complex structure, is not easily moved, and the refrigerant can cause pollution. Prolonged exposure to air-conditioned environments can also lead to "air conditioning sickness."

[0003] Semiconductor refrigeration, also known as thermoelectric refrigeration or electronic refrigeration, primarily utilizes the Peltier effect. This effect occurs when two different metals or semiconductors form a circuit, and when electricity is applied, one end absorbs heat while the other releases heat at their contact points. Semiconductor refrigeration directly converts electrical energy into heat energy without a compressor or refrigerant. Compared to commonly used compression refrigeration devices, it lacks mechanical parts like compressors, resulting in no vibration, low noise, and more stable operation. The absence of refrigerant makes it environmentally friendly. The main working component is the cooling element, which has a simple structure, can be made very small, and can be processed into any shape. It is wear-free, easy to maintain, has a long service life, high reliability, and can be moved freely. By changing the direction and magnitude of the current, the cooling or heating state can be changed, adjusting the cooling capacity. It is easy to adjust and control, has a fast response speed, and good safety. However, semiconductor refrigeration also has drawbacks such as a relatively low coefficient of performance (COP), relatively high power consumption, and limitation to localized, enclosed environments. Semiconductor refrigeration is particularly suitable for localized and small-space cooling.

[0004] Currently, it has applications in the military field, such as submarines and electronic communication vehicles; in the medical field, such as refrigerated boxes and incubators; and in everyday applications such as water dispensers and small refrigerators. Furthermore, it has important applications in the heat dissipation of precision electronic instruments and power electronic components, as well as in low-power localized cooling devices.

[0005] The evaporation of water absorbs heat and carries it away, which is a common principle of refrigeration. Sprinkling water on the ground or after rain in summer makes us feel cool. Applying a hot towel to the body when we have a fever can lower our body surface temperature. The heat absorption principle of water evaporation is also used in the manufacture of some refrigeration devices. Summary of the Invention

[0006] This invention proposes an indoor local environment cooling device that can reduce the indoor local temperature by alternating between two methods: cooling by a semiconductor refrigeration chip and heat absorption by water evaporation.

[0007] According to one aspect of the present invention, an indoor local environment cooling device is provided, the device comprising a semiconductor refrigeration system, an atomizing device, a water replenishment system, a dehumidification system, and a sensing and control system, wherein:

[0008] The semiconductor cooling system includes multiple semiconductor cooling chips, heat sinks at the top and bottom, a cooling water tank, and a fan.

[0009] The atomizing device is composed of an ultrasonic atomizing plate;

[0010] The water replenishment system comprises a float valve, connectors, pipes, and a water replenishment tank in the cooling water tank.

[0011] The dehumidification system includes a dehumidifier and piping connected to a water supply tank;

[0012] The sensing and control system consists of a temperature sensor in the cooling water tank, a liquid flow sensor in the water supply pipeline, a humidity sensor, a control terminal of PLC or microcontroller, a power supply, a display panel, and switch buttons.

[0013] Preferably, the cooling device uses a semiconductor cooling chip for cooling, a fan to blow out cold air, and an atomizing plate to atomize water, with the water mist evaporating and absorbing heat. The two cooling methods work alternately to complete the cooling process and achieve the effect of lowering the ambient temperature.

[0014] Preferably, the fan can oscillate or move along a certain trajectory, which can not only disperse the cold energy generated by the cold end heat sink, but also disperse the water mist generated by the atomizing plate, accelerate the evaporation of water mist and absorb heat, and ensure the cooling range.

[0015] Preferably, the circulation of cooling water in the cooling water tank is accomplished by atomization consumption of the atomizing plate and water replenishment by the float ball, so that the cooling water temperature is not too high and the heat dissipation of the hot end of the cooling plate is good.

[0016] Preferably, the dehumidification system is used in conjunction with an atomizing plate and a water replenishment device.

[0017] Preferably, the sensing and control system includes a humidity sensor to monitor ambient humidity; if the ambient humidity exceeds a threshold, the dehumidification device is activated; a temperature sensor to monitor the temperature of the cooling water in the cooling water tank; if the temperature exceeds a threshold, the power supply to the semiconductor cooling chip is disconnected, and the atomizing chip is turned on to atomize the warm water; and a liquid flow sensor to turn off the atomizing chip, stop water replenishment, and turn on the cooling chip when liquid flows through it.

[0018] Preferably, the dehumidification device and the water supply tank of the water supply system are connected by a pipeline. When the ambient humidity is too high, the dehumidification device is activated and the collected water is returned to the water supply container.

[0019] Preferably, the float valve of the water replenishment system is placed at the edge of the cooling water tank and connected to the water replenishment tank through a connector and pipeline. When atomization is consumed, causing the liquid level to drop to a certain height, the float valve automatically replenishes water from the water replenishment tank to the cooling water tank.

[0020] Preferably, the heat sinks at both ends of the cooling system have the following characteristics: the heat sink at the cold end of the cooling chip has a small base area and a high fin height, and the area of ​​the heat sink can be covered by an axial fan; the heat sink at the hot end of the semiconductor has a base area that is as large as possible and a low fin height; the cooling water tank has a large area and a low relative height of the liquid level.

[0021] Preferably, the semiconductor refrigeration system has multiple refrigeration chips connected in parallel (or series) to increase the cooling capacity.

[0022] The localized cooling device of the present invention can be used in localized indoor environments or inside mobile vehicles. The device is small in size and easy to move. It employs both semiconductor refrigeration and water mist evaporation for cooling, with the two methods working alternately. This results in low cost, ease of maintenance, and the ability to regulate localized temperature and humidity.

[0023] The present invention has other features and advantages, which will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of the invention. Attached Figure Description

[0024] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same parts.

[0025] Figure 1 This is an overall schematic diagram of a localized environmental cooling device according to an exemplary embodiment of the present invention.

[0026] Figure 2 This is a top view of the main body of the cooling device according to the present invention.

[0027] Figure 3 The image shows a top view of the main body of the cooling device according to the present invention, illustrating the trajectory of the fan.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1-Semiconductor cooling chip, 2-Cold end pin radiator, 3-Hot end radiator, 4-Copper pad, 5-Sealing insulation material around the cooling chip, 6-Insulation board, 7-Plastic screw, 8-Cooling water tank, 9-Fan, 10-Atomizing plate, 11-Temperature sensor, 12-Float valve, 13-Conduit connector, 14-Outlet, 15-Flow sensor, 16-Cooling water conduit, 17-Make-up water tank, 18-Dehumidifier, 19-Humidity sensor, 20-Conduit, 21-Power supply and control system, 22-Circular opening. Detailed Implementation

[0030] The invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0031] Traditional semiconductor cooling devices mainly consist of a power supply, a cooling chip, and a heat dissipation system. Each cooling chip is composed of multiple PN junctions connected in series. By connecting multiple cooling chips in series and parallel to form a thermopile, the cooling capacity can be further increased. When energized, one side of the cooling chip cools while the other side generates heat. The heat dissipation system uses various methods such as water cooling or air cooling to remove the heat generated at the hot end.

[0032] Since the heat dissipation of the hot end of a semiconductor refrigeration unit equals the sum of its cooling capacity and input power, the heat dissipation effect of the hot end is a crucial factor affecting the performance of semiconductor refrigeration. According to the law of conservation of energy, continuous cooling of the cold end can only be achieved by continuously dissipating the heat from the hot end and maintaining it at a certain temperature. The heat flux density at both the hot and cold ends of the refrigeration unit is very high. If this heat is not transferred out in time, it will not only greatly affect the cooling efficiency but may even burn out the refrigeration unit in a short period of time.

[0033] In semiconductor refrigeration, effective heat dissipation at the hot end is crucial. Heat dissipation methods include heat conduction, convection, and radiation (non-contact). Among these, natural air convection is the simplest and most direct method. Due to the temperature difference between the heat sink and the surrounding air, the heat sink can directly exchange heat with the environment. However, this method has a low heat dissipation coefficient and limited heat exchange capacity. Forced convection involves forcing airflow between the heat sink and the surrounding environment under external force. Fans are typically installed around the heat sink in natural convection heat exchange to remove the heat generated by the heat sink. Its heat dissipation capacity is an order of magnitude higher than natural convection, making it the most widely used heat exchange method. Water cooling removes heat through water circulation, typically by installing a water tank around the heat sink at the hot end. Water cooling removes heat through water circulation, typically with inlet and outlet, and a water pump controls the water flow. Its heat dissipation capacity is an order of magnitude higher than forced convection cooling. However, water cooling requires repeated water circulation, which has the disadvantages of requiring a complex piping system and additional components, making the system structure complex, inconvenient to move, and costly. Heat pipe heat exchange utilizes the principle of phase change and capillary action to rapidly conduct heat away, with a thermal conductivity exceeding that of any known metal. However, it is relatively expensive and sensitive to gravity. Heat dissipation utilizes the latent heat of fusion of a substance, based on the characteristic that a substance absorbs a large amount of heat during melting, but it is only suitable for intermittent operation.

[0034] Combining the advantages and disadvantages of various heat dissipation methods, forced convection cooling is used at the cold end, while water cooling is used at the hot end during operation. Traditional water cooling systems involve internal water circulation, and external cooling towers, water drains, and piping to cool the circulating water, resulting in an overly complex structure. Our focus is on improving the water cooling method. The surface area of ​​the heatsink base at the hot end needs to be large because the heat dissipation at the hot end is greater than at the cold end. The lower the temperature at the hot end, the lower the temperature at the cold end, resulting in better cooling performance. Air cooling is not used at the hot end because, besides its low efficiency, air cooling also generates hot air, which is detrimental to environmental cooling. Furthermore, adding color to the outer surface of the heatsink can increase heat radiation, which is beneficial for better heat dissipation. The water tank volume should be sealed, the fan should be rotatable, and it should provide multi-angle airflow, or the cold end heatsink should have a rotating function.

[0035] The evaporation of water can also absorb and carry away heat, thus achieving a cooling effect. Each gram of water evaporated can remove 2.4 kJ of heat. In the dry northern regions, the evaporation process also humidifies the air. Our refrigeration device combines semiconductor refrigeration with the heat absorption principle of water evaporation, working synergistically to achieve the purpose of cooling.

[0036] like Figure 1As shown, the device includes multiple thermoelectric coolers 1, forming a thermoelectric cooler group to improve cooling capacity. Each cooler has an external heat sink connected to both its hot and cold ends, with the cold end facing upwards and the hot end facing downwards. The cold end of the cooler is connected to a pin-type heat sink 2 via a copper pad 4. The pin-type heat sink increases the specific surface area and improves heat dissipation. Furthermore, it ensures airflow and, in conjunction with a fan 9, maximizes the conduction of cool air, ensuring air circulation and a higher heat transfer coefficient. The hot end of the cooler uses thermally conductive silicone and is directly connected to the heat sink 3. The hot end heat sink is finned, with dense, flat, and short fins. The hot end heat sink 3 is directly inserted into the cooling water tank 8. The heat dissipation capacity of the hot end has a significant impact on the cooling device; if the hot end cannot dissipate heat in time, the cold end temperature will also rise, failing to achieve the desired cooling effect. The structure and heat dissipation method of the heat sink have a crucial influence on the cooling capacity. Here, we use a pin-type heat sink for the cold end and a large-base heat sink for the hot end. This special structure features a large projected area but a low fin height to facilitate subsequent operations. The hot end of the cooling chip is in direct contact with the heat sink using thermally conductive silicone to reduce thermal resistance and allow for more efficient heat transfer from the cooling chip to the heat sink, improving heat dissipation. The cold end is raised by a copper plate before contacting the heat sink, increasing the distance between the hot and cold ends. Thermal insulation material 5, typically polyurethane foam, is sealed around the cooling chip to reduce heat exchange between the hot and cold ends, i.e., heat conduction from the hot end to the cold end. Plastic screws 7 are used to secure the upper and lower heat sinks to the cooling chip, avoiding the thermal conductivity issues associated with metal screws. A heat insulation plate 6 covers the hot end heat sink 3 to prevent heat transfer to the surrounding air.

[0037] On the edge of the heat insulation plate 6 on the cooling water tank 8, we leave a circular opening 22, and install an atomizing plate 10 at the opening. Next to the atomizing plate, below the water level, there is a temperature sensor 11. On the side wall of the other end of the cooling water tank, we make an opening and install a float valve 12. The float valve 12 is connected to the cooling water conduit 16 via a connector 13, and the cooling water conduit 16 is connected to the makeup water storage tank 17. Next to the connector, there is a flow sensor 15 on the conduit.

[0038] The external dehumidifier 18 is connected to the water supply tank 17 via a conduit 20, and the water collected by the dehumidifier can be directly returned to the water supply tank 17. A humidity sensor 19 is located next to the dehumidifier.

[0039] The power supply and control system 21 provides power to the entire device and controls the coordination between sensors and working components. The entire control system is mainly controlled by a microcontroller or PLC, with a display screen and built-in or external power supply on the system panel. It coordinates parameters from feedback from sensors including the temperature sensor in the cooling water tank, the humidity sensor working with the dehumidifier, and the liquid flow sensor, controlling the operation of each working component of the entire refrigeration system, including the start and stop of the cooling coil 1, the atomizing coil 10, and the dehumidifier 18. Alternatively, the system can use time parameters for control without sensor feedback signals. For example, after setting the time parameters, the cooling coil automatically starts after a certain period, stops after another period, the atomizing coil starts, the atomizing coil stops after another period, and then the cooling coil restarts, alternating between these cycles. The time parameters can be set on the operation panel or pre-programmed and executed directly according to the time parameters after startup.

[0040] Humidity sensor 19 works in conjunction with dehumidifier 18. The humidity sensor detects changes in ambient humidity and determines whether to turn on the dehumidifier. Temperature sensor 11 in the cooling water tank works in conjunction with cooling chip 1 and atomizing chip 10. It detects changes in cooling water temperature and determines whether to stop the cooling chip and whether to turn on the atomizer.

[0041] Considering factors such as economy and portability, a high thermal conductivity aluminum or copper heatsink is chosen, featuring thin and numerous cooling fins and a smooth bottom. A fan with a large number of blades at a wide angle is selected, directing airflow towards the coolant end of the heatsink. The thermoelectric cooler is model TEC1-12706, with a maximum cooling capacity of 54W. Semiconductor cooling utilizes multiple thermoelectric coolers connected in series and parallel to increase cooling capacity. Taking the commonly used TEC1-12706 thermoelectric cooler as an example, each cooler has a cooling capacity of 54W, and approximately 10 coolers are sufficient for localized personal cooling needs. Lay them out flat, each cooler will occupy several square centimeters. Using higher-power thermoelectric coolers can further reduce the device size; for example, common high-power thermoelectric coolers can reach a cooling capacity of 130W, requiring only about four coolers. The illustrated thermoelectric cooler 1 is a design with 3 x 3 coolers, totaling nine coolers. The hot ends of the coolers all face downwards and are connected to the hot-end heatsink 3 via thermally conductive silicone. The hot-end radiator has a large heatsink area to enhance heat dissipation. The heatsink is relatively short and is placed in a shallow cooling water tank 8, with the cooling water submerging the heatsink fins. The cold end of the cooling chip is raised by a copper pad 4 with good thermal conductivity. The copper pad connects the cold-end pin-type radiator 2 and the semiconductor cooling chip 1 on both sides with thermally conductive silicone. The surface area of ​​the cold-end radiator is smaller than that of the hot-end radiator. The cold-end radiator is pin-shaped, allowing for better airflow. Its height is relatively long, comparable to the fan size. Thermal insulation materials, such as polyurethane foam, are used to seal the parts including the cooling chip and the hot-end radiator to prevent heat conduction between the hot and cold ends and heat transfer from the hot-end radiator to the surrounding environment. The cooling water tank 8 is thin, with an outlet at one end for an atomizing plate 10 and a float valve 12 internally connected to the other end. The float valve is connected to the water supply tank 17 via a connector 13 and a cooling water pipe 16. A fan 9 is positioned facing the cold-end radiator. Choose a fan with high power, high speed, many blades, and wide directional movement. The fan can oscillate or move along a certain arc around the heatsink to ensure the cooling range.

[0042] After the instrument starts working, the thermoelectric cooler 1 is powered on and begins to operate, with the cold end cooling and the hot end heating respectively. The heat sink 3 at the hot end is inserted into the cooling water tank 8, where heat is conducted away through the water. The needle-type heat sink 2 at the cold end transfers coolness to the surroundings through its needle-shaped fins. The fan is turned on to blow cool air to the surroundings, accelerating heat transfer from the heat sink through forced convection. The fan can oscillate or adjust according to... Figure 3As shown in the top view, the air moves along an arc-shaped trajectory, blowing towards the heat sink and carrying away the cooling energy. A temperature sensor 11 is placed in the cooling water tank 8. When the cooling water temperature exceeds a certain threshold, the power to the cooling chip is disconnected, and the cooling chip stops working. Subsequently, the atomizing plate 10 in the water tank starts working. The atomizing plate uses ultrasonic atomization or other methods to ultrasonically vibrate and atomize the water in the tank. The water in the tank will be dispersed into the surrounding air in the form of water mist. At the same time, the continuous operation of the fan blows the water mist to the surrounding area and further away. The water mist also carries away a large amount of heat through evaporation, thus achieving a cooling effect. This process can also be performed without using a temperature sensor. By setting the working time of the cooling chip, the cooling chip will automatically stop working when the set time is reached, and the atomizer will start directly. After working for a period of time, the atomization process will consume the water in the tank. When the water level in the tank drops to a certain height, as the float of the float valve 12 moves, the water supply valve opens, and water is automatically replenished from the water supply tank 17 into the cooling water tank, flowing into the cooling water tank from the outlet 14. The cooling water conduit 16 used for water replenishment has a liquid flow sensor 15. When water flows through it for a period of time, the water replenishment is completed, the atomizing plate 10 stops working, and the semiconductor refrigeration plate 1 restarts, beginning another cooling cycle. The two cooling processes alternate repeatedly, which helps to reduce the local temperature.

[0043] Ambient humidity also significantly affects perceived temperature. While water vapor evaporation can remove a large amount of heat, excessive humidity makes it difficult for the body to sweat, leading to stuffy and uncomfortable conditions. Therefore, a dehumidifier 18 is included, working in conjunction with a humidity sensor 19. When the humidity sensor 19 detects excessively high humidity, it activates the dehumidifier 18 to remove water vapor from the air. This dehumidifier is primarily suitable for enclosed environments; it is not necessary to activate it when there is air circulation, such as with open windows. The water collected by the dehumidifier flows back to the water tank 17 via the conduit 20.

[0044] The power supply and control system 21 is powered by a battery or AC power and has a display panel and buttons that can display the real-time measured values ​​of the sensors. The control system is mainly controlled by a microcontroller or programmable controller, which controls the operation of devices such as the cooling coil, atomizing coil, fan, and dehumidifier based on the values ​​fed back by the sensors. Alternatively, sensors can be omitted, and the overall operation of the device can be controlled by time parameters and programs.

[0045] Figure 2This is a top view of the main body of the refrigeration unit. The cooling water tank 8 is entirely covered by a heat insulation plate 6, with a circular opening 22 at the edge of the heat insulation plate for placing atomizing plates 10. Heat insulation is also applied to the contact points between the cooling plates and the heat sinks at both ends, sealed by heat-insulating material 5 around the cooling plates. A fan faces the cold-end pin-type heat sink 2 and the circular opening 22 of the atomizing plate, dispersing the cooling energy generated by the heat sink and the water mist produced by the atomizing plate, thus creating a cooling effect. The cooling water conduit 16 extends into the water tank at its edge.

[0046] Figure 3 To show a top-down view of the fan's movement trajectory, the fan can oscillate, or follow... Figure 3 The trajectory shown makes the cooling space larger and the cooling more uniform.

Claims

1. A localized environmental cooling device, characterized in that, This includes a semiconductor cooling system, an atomizing device, a water replenishment system, a dehumidification system, and a sensing and control system, among which: The semiconductor cooling system includes multiple semiconductor cooling chips, heat sinks at the top and bottom, a cooling water tank, and a fan. The atomizing device is composed of an ultrasonic atomizing plate; The water replenishment system comprises a float valve, connectors, pipes, and a water replenishment tank in the cooling water tank. The dehumidification system includes a dehumidifier and piping connected to a water supply tank; The sensing and control system consists of a temperature sensor in the cooling water tank, a liquid flow sensor in the water supply pipeline, a humidity sensor, a control terminal of PLC or microcontroller, a display panel, a power supply and switch buttons. The cold end heat sink of the cooling chip is a pin-type heat sink, and the height of the heat sink is higher than that of the hot end heat sink, and is comparable to the size of the fan. When the cooling device is working, the cooling chip starts, and the fan blows the cold air around the cold end of the cooling chip's pin-type heat sink to the surrounding area. The hot end of the cooling chip is cooled by the cooling water tank. When the cooling water temperature rises, the cooling chip stops working, the atomizer is turned on, and the fan blows water mist to the surrounding area, cooling by water vapor evaporation. When the water level in the cooling water tank drops, the float valve automatically replenishes water to the cooling water tank. After the water is replenished, the cooling chip continues to start. In this way, the cooling chip and the atomizer work alternately to cool, and the cooling water tank is constantly consumed and automatically replenished to ensure that the device can work continuously for a long time.

2. The local environmental cooling device according to claim 1, characterized in that, The fan can oscillate or move along a certain trajectory, which can not only disperse the cold air generated by the cold end heat sink of the cooling chip, but also disperse the water mist generated by the atomizing plate, thus accelerating the evaporation and heat absorption of the water mist.

3. The local environmental cooling device according to claim 1, characterized in that, The circulation of cooling water in the cooling water tank is accomplished by water mist atomization consumption and float ball water replenishment.

4. The local environmental cooling device according to claim 1, characterized in that, The consumption and replenishment of cooling water in the cooling water tank are accomplished by the combined operation of the dehumidification system, atomizing plate, and water replenishment system.

5. The local environmental cooling device according to claim 1, characterized in that, The sensing and control system includes a humidity sensor that monitors ambient humidity; if the ambient humidity exceeds a threshold, the dehumidifier is activated; a temperature sensor that monitors the temperature of the cooling water in the cooling water tank; if the temperature exceeds a threshold, the power supply to the semiconductor cooling chip is disconnected, and the atomizing chip is activated to atomize the cooling water; and a liquid flow sensor that, if liquid flows through, deactivates the atomizing chip, stops water replenishment, and activates the cooling chip.

6. The local environmental cooling device according to claim 1, characterized in that, The dehumidifier and the water supply tank of the water supply system are connected by a pipeline. When the ambient humidity is too high, the dehumidifier starts and returns the collected water to the water supply tank.

7. The local environmental cooling device according to claim 1, characterized in that, The float valve of the water replenishment system is located at the edge of the cooling water tank and is connected to the water replenishment tank through a connector and pipeline. When the atomization is consumed, causing the liquid level in the cooling water tank to drop to a certain height, the float valve automatically replenishes water from the water replenishment tank to the cooling water tank.

8. The local environmental cooling device according to claim 1, characterized in that, The heat sinks at both ends of the cooling chip have a larger base area than the heat sink at the cold end.

9. The local environmental cooling device according to claim 1, characterized in that, The semiconductor cooling system uses multiple cooling chips in parallel or series to increase the cooling capacity.

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