A Gordon type heat flow meter and its self-correction method

Abstract

The present invention discloses a Gordon type heat flux meter and a self-correction method thereof, wherein the heat flux meter comprises a heat sink, a sensitive element and a thermal energy detection assembly; one side of the heat sink is a groove structure, the interior of the heat sink is a water cooling structure, the sensitive element is arranged on the opening side of the groove structure so that a heat insulating cavity is formed inside the groove structure, the sensitive element is used to absorb the radiation heat flow in the space and transfer the heat energy to the heat sink, the water cooling structure provides a channel for the coolant, and is used to cool the heat sink; the thermal energy detection assembly is connected with the heat sink and the sensitive element, and is used to detect the temperature of the heat sink and the sensitive element, so as to realize the measurement of the radiation heat flow parameters of a small range in a low-pressure space, and improve the accuracy of the detection.

Description

Technical Field

[0001] The present invention relates to the field of heat flow measurement technology, and in particular to a Gordon type heat flow meter and a self-correction method thereof. Background Art

[0002] Gordon heat flux meter, also known as circular foil heat flux sensor, has simple structure, fast response time, high measurement accuracy and good environmental adaptability. It is widely used in the measurement of radiation and radiation convection heat flux parameters in aviation, aerospace, construction, petrochemical and other industries.

[0003] Gordon heat flow sensors are based on the principle of temperature gradient measurement. Depending on whether liquid cooling is used, they can be divided into heat sink heat flow sensors and liquid cooled heat flow sensors. Liquid cooled heat flow sensors rely on liquid cooling to take away the heat absorbed by the sensor and are used for long-term megawatt-level heat flux density measurements; while heat sink heat flow sensors rely on the heat capacity of the heat sink to absorb heat and are generally used in low heat flux environments with shorter measurement times.

[0004] When the two types of heat flow meters measure a small heat flux density environment in space, they not only absorb the radiation heat flux in space, but also radiate heat flux into space due to the sensor's own temperature, and are affected by the different temperatures of the sensor's heat sink. When the temperature difference between the space radiation temperature and the sensor surface temperature is very small, the energy absorbed by the sensor is very close to the energy emitted to space, resulting in the sensor's net absorption of very little space radiation energy, no temperature difference on the sensor's sensitive element circular foil, and the sensor output is basically zero. Therefore, the existing design of the Gordon heat flux sensor is difficult to measure the small-range heat flux density of environmental radiation.

[0005] Therefore, how to realize the measurement of small-range radiation heat flux parameters in low-pressure space using Gordon heat flux meter has become a technical problem that needs to be solved urgently. Summary of the invention

[0006] The purpose of the embodiments of this specification is to provide a Gordon-type heat flow meter and a self-correction method thereof, which can realize a small-range radiation heat flow parameter in a low-pressure space.

[0007] In one aspect, the present invention provides a Gordon type heat flow meter, the Gordon type heat flow meter comprising: a heat sink, a sensitive element and a thermal energy detection component;

[0008] One side of the heat sink is a groove structure, the interior of the heat sink is a water cooling structure, the open side of the groove structure is provided with the sensitive element, so that a heat insulating cavity is formed inside the groove structure, the sensitive element is used to absorb the radiation heat flow in the space and transfer the heat energy to the heat sink, and the water cooling structure provides a channel for the coolant to cool the heat sink;

[0009] The thermal energy detection components are connected to the heat sink and the sensitive element, and are used to detect the temperatures of the heat sink and the sensitive element.

[0010] On the other hand, the present invention also provides a self-correction method for a Gordon-type heat flow meter, the method comprising the following steps:

[0011] Place the Gordon heat flow meter in a stable space heat flow environment, and control the temperature of the sensitive element and the heat sink to be the same;

[0012] According to the detection data of the second detection component and the parameters of the heat sink, a standard value of the spatial heat flux density absorbed by the sensitive element is calculated;

[0013] Adjusting the inlet temperature and inlet speed of the coolant at the inlet end of the water cooling structure so that the temperature of the heat sink is maintained at the first temperature;

[0014] Calculate a reference value of the spatial heat flux density absorbed by the sensitive element according to the parameter information of the sensitive element and the heat sink, and the detection data of the first detection component and the second detection component;

[0015] A correction value of the Gordon-type heat flux meter is obtained according to the standard value of the spatial heat flux density and the reference value of the spatial heat flux density.

[0016] By adopting the above technical scheme, a Gordon-type heat flux meter and a self-correction method thereof described in the present invention can realize sufficient dissipation of heat energy inside the insulating cavity by forming an insulating cavity between the sensitive element and the heat sink, thereby effectively realizing the measurement of radiation heat flux parameters of a small range in a low-pressure space, thereby improving the accuracy of detection. In addition, by providing a self-correction method for the heat flux meter, the accuracy of the Gordon-type heat flux meter detection can be further guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art description. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of a Gordon type heat flow meter in the embodiment of this specification;

[0019] Figure 2 This is a schematic diagram of the structure of the water cooling structure in the embodiment of this specification;

[0020] Figure 3 This is a schematic diagram of the heat dissipation structure in the embodiment of this specification;

[0021] Figure 4 This is a schematic diagram of the working principle of the Gordon type heat flow meter in the embodiment of this specification;

[0022] Figure 5 A schematic diagram of the steps of the self-correction method of the Gordon type heat flow meter provided in the embodiments of this specification;

[0023] Figure 6 for Figure 5 Detailed step diagram of step S101 in FIG.

[0024] Reference numerals in the figures:

[0025] 1: Heat sink;

[0026] 2: Sensitive components;

[0027] 3: Thermal energy detection component;

[0028] 4: High emissivity coating;

[0029] 11: Groove structure;

[0030] 12: Water cooling structure;

[0031] 31: first detection component;

[0032] 32: second detection component;

[0033] 111: through hole;

[0034] 121: cooling unit;

[0035] 122: connection part;

[0036] 123: liquid inlet end;

[0037] 124: liquid outlet;

[0038] 311: first positive temperature measuring wire;

[0039] 312: first negative electrode temperature measuring wire;

[0040] 321: second positive temperature measuring wire;

[0041] 322: Second negative electrode temperature measuring wire. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, device, product or equipment that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0045] When the existing Gordon type heat flux meter absorbs the radiation heat flux in space, when the temperature difference between the space radiation temperature and the surface temperature of the heat flux meter is very small, the energy absorbed by the heat flux meter is very close to the energy emitted into space, resulting in the heat flux meter's net absorption of very little space radiation energy. There is no temperature difference on the circular foil of the heat flux meter's sensitive element, and the sensor output is basically zero. Therefore, the existing design of the Gordon type heat flux sensor is difficult to measure the small-range heat flux density of ambient radiation.

[0046] The embodiment of the present specification provides a Gordon type heat flow meter, which can realize small-range heat flow measurement in low-pressure space.

[0047] The structural composition of the Gordon type heat flux meter provided in the embodiments of this specification is a manifestation of the inventive concept of this specification. Too many or too few structural compositions that can realize the corresponding functions of the Gordon type heat flux meter are all within the scope of the protection technical solution required by this specification.

[0048] Specifically, Figure 1As shown, the heat flow meter includes a heat sink 1, a sensitive element 2 and a thermal energy detection component 3; one side of the heat sink 1 is a groove structure 11, and the sensitive element 2 is arranged on the open side of the groove structure 11, so that a heat-insulating cavity is formed inside the groove structure 11, and the sensitive element 2 is used to absorb the radiant heat flow in the space and transfer the heat energy to the heat sink 1. The bottom of the heat-insulating cavity can emit the heat energy of the heat sink 1 itself, which is then received by the sensitive element 2. In this way, in a low-pressure and small-range heat flow environment, the amount of heat energy absorbed by the sensitive element 2 is increased, thereby achieving the accuracy of the heat flow meter detection.

[0049] The interior of the heat sink 1 is a water cooling structure 12, and the water cooling structure 12 provides a channel for the coolant to cool the heat sink 1. When the heat flow meter is measuring heat, a temperature difference can be formed between the sensitive element 2 and the heat sink 1, thereby realizing the transfer of thermal energy of the sensitive element 1 and improving the response speed of the heat flow measurement.

[0050] The thermal energy detection component 3 is connected to the heat sink 1 and the sensitive element 2, and is used to detect the temperature of the heat sink 1 and the sensitive element 2. The spatial radiation heat flux density can be obtained by detecting the temperature of the heat sink 1 and the sensitive element 2 and combining the parameters of the heat sink and the sensitive element. The specific calculation process is described in detail below.

[0051] In actual work, the sensitive element 2 is a circular foil, which can sense the absolute radiation heat flow in space. One end of the heat sink 1 is provided with a groove, and the circular foil is arranged on the groove. The edge of the circular foil is connected to the edge of the opening end of the groove. Optionally, the circular foil can be a constantan sheet, and the heat sink can be a material with fast thermal conductivity such as pure copper or stainless steel. Therefore, the circular foil can be connected to the heat sink by brazing welding / laser welding. Preferably, the connection points between the circular foil and the heat sink are evenly distributed, so that the radiation energy received by the circular foil in space can be evenly and quickly transferred to the inside of the heat sink 1, and the above-mentioned connection points can be used as temperature measuring thermocouple junctions at the edge of the circular foil.

[0052] The material used for the constantan sheet is a copper-nickel alloy (Cu: 55%, Ni: 45%), often called constantan; the material used for the heat sink is pure copper (Cu: 100%); the two are respectively the negative electrode and positive electrode materials of the T-type thermocouple.

[0053] In a further embodiment, the heat sink body 1 can be a cylindrical structure, one end of the columnar structure can be provided with a groove structure, the open end of the groove structure is provided with a circular foil, the circular foil absorbs the spatial radiation heat flow and transfers heat energy to the entire heat sink body, and a water cooling structure is provided at the other end of the columnar structure, and a cooling heat flow channel is provided inside the water cooling structure, so that the heat sink body can be cooled.

[0054] The central axis of the cylindrical structure can be hollow and pass through the center of the circular foil. When the circular foil receives the spatial radiation heat flow, the heat flow diffuses from the center to the surrounding inside the circular foil, thereby evenly transferring the heat energy to the heat sink. Therefore, through the design of the through hole in the center of the circular foil, the heat energy can be evenly transferred to the heat sink laterally inside the circular foil, so that the temperature change of the circular foil can be accurately obtained, thereby improving the accuracy of detection.

[0055] In order to further improve the intensity of thermal energy inside the thermal insulation cavity, so that the sensitive element 2 obtains more thermal energy, the thermal energy emitted by the heat sink 1 to the inside of the thermal insulation cavity can be increased. Optionally, the bottom of the groove structure 11 can be set as a heat dissipation structure, and the heat dissipation structure can be used to increase the surface emissivity of the bottom of the groove structure 11 to the sensitive element 2.

[0056] It can be understood that the heat dissipation structure can increase the surface area of ​​the bottom surface of the groove, so that the heat energy emitted from the bottom of the groove structure 11 to the sensitive element 2 can be increased. As an option, Figure 3 As shown, the heat dissipation structure may be a conical structure. Preferably, when the heat sink 1 is a cylindrical structure, the heat dissipation structure may be an annular micro-conical structure, which can greatly increase the surface emissivity of the bottom of the groove structure 11.

[0057] In the embodiments of the present specification, the heat dissipation structure and the heat sink 1 may be an integrally formed structure, which can improve the continuity of heat energy transfer inside the heat sink and avoid excessive consumption of heat energy.

[0058] The Gordon type heat flux meter provided in the embodiment of the present specification is suitable for measuring the radiation heat flux in low-pressure space. Since the sensitive element is fixed at the open end of the groove structure 11 in the form of a circular foil, in order to avoid the instability of the connection of the circular foil in a low-pressure environment, a through hole 111 is provided on the side wall of the groove structure 11. The through hole 111 is used to connect the thermal insulation cavity with the external environment. Optionally, the through hole can be a pressure-balancing micropore in the cavity to balance the internal and external pressures, so that the heat flux meter is suitable for low-pressure environments such as vacuum, so as to avoid the circular foil of the sensitive element 2 being deformed by pressure due to the inconsistency between the thermal insulation cavity and the external pressure. It should be noted that the pressure-balancing micropore in the cavity can balance the internal and external pressures. In order to avoid excessive loss of heat energy in the cavity from the through hole, the aperture of the through hole can be set to a smaller size. In some other embodiments, a plurality of pressure-balancing micropores in the cavity can be provided, which is not limited in the present specification.

[0059] The water cooling structure 12 is used as a cooling structure of the heat sink 1, and a cooling liquid channel is provided inside to achieve temperature regulation of the heat sink 1. Specifically, Figure 2 As shown, the water cooling structure 12 may include a cooling part 121, a connecting part 122, a liquid inlet end 123 and a liquid outlet end 124; one end of the cooling part 121 is provided with the groove structure 11, which can realize rapid temperature adjustment of the groove structure 11, and the other end of the cooling part 121 is connected with one end of the connecting part 122, and the other end of the connecting part 122 is connected with the liquid inlet end 123 and the liquid outlet end 124, so that the cooling liquid enters the cooling part 121 through the liquid inlet end 123 and the connecting part 122, and flows out of the liquid outlet end 124 through the cooling part 121 and the connecting part 122. The setting of the water cooling structure 12 can quickly adjust the temperature of the heat sink 1, and can ensure that the heat sink 1 is kept at a fixed temperature, especially to make the various components of the heat flow meter work at room temperature or low temperature, improve the measurement accuracy of the calorimeter, and realize the long-term measurement of the calorimeter.

[0060] In a further embodiment, when the heat sink 1 is a cylindrical structure, the cooling portion 121 in the water-cooling structure 12 can be a spoke-type structure, specifically a spoke-type liquid discharge design from the inside to the outside. This structural design has a good cooling effect on the heat sink 1 and uniform temperature field distribution, and can effectively reduce the error effect of uneven temperature distribution of the heat sink 1 and the circular foil of the sensitive element 2 on the heat flow measurement.

[0061] In a further embodiment, the thermal energy detection component 3 can detect the temperature information of the heat sink 1 and the sensitive element 2, wherein the thermal energy detection component 3 includes a first detection component 31 and a second detection component 32. Optionally, the first detection component 31 and the second detection component 32 can be arranged through the central axis of the heat sink 1, so that the entire heat flux meter structure is more compact.

[0062] The first detection component 31 includes a first positive temperature measuring wire 311 and a first negative temperature measuring wire 312 ; the first positive temperature measuring wire 311 is connected to the center of the sensitive element 2 , and the first negative temperature measuring wire 312 is connected to the sensitive element 2 .

[0063] Optionally, the first positive temperature measuring wire 311 is a pure copper wire, which can be connected to the circular foil by welding, and the connection point constitutes a temperature measuring thermocouple junction at the center of the circular foil of the sensitive element 2. The first negative temperature measuring wire 312 is also connected to the sensitive element 2. The first negative temperature measuring wire 312 can be selected from constantan wire. It should be noted that the first negative temperature measuring wire 312 needs to be away from the heat sink 1 and the first positive temperature measuring wire 311, so that the heat energy transferred by the first positive temperature measuring wire 311 through the connection point can be reduced, thereby ensuring the accuracy of the temperature detected by the first positive temperature measuring wire 311. Optionally, the first negative temperature measuring wire 312 can be set at the midpoint of the radius of the circular foil of the sensitive element 2.

[0064] The second detection assembly 32 includes a second positive temperature measuring wire 321 and a second negative temperature measuring wire 322 ; the second positive temperature measuring wire 321 is connected to the heat sink 1 , and the second negative temperature measuring wire 322 is connected to the bottom of the groove structure 11 .

[0065] Optionally, the second positive temperature measuring wire 321 can be made of the same material as the heat sink 1, and can be pure copper wire, and can be connected by welding. The second positive temperature measuring wire 321 and the first positive temperature measuring wire 311 can form a pair of temperature difference thermocouples for measuring the temperature difference between the center and the edge of the circular foil of the sensitive element 2. The temperature difference between the center and the edge of the circular foil of the sensitive element 2 can be obtained by measuring the thermoelectric potential between the two. In addition, the second positive temperature measuring wire 321 and the first negative temperature measuring wire 312 can form a thermocouple pair for measuring the temperature at the edge of the circular foil of the sensitive element.

[0066] The second negative temperature measuring wire 322 is connected to the surface of the heat dissipation structure, wherein the second negative temperature measuring wire 322 can be made of the same material as the sensitive element 2, and can optionally be a constantan wire; the second negative temperature measuring wire 322 and the second positive temperature measuring wire 321 constitute a thermocouple pair for measuring the surface temperature of the ring micro-cone structure.

[0067] In a further embodiment, a high emissivity coating 4 can be coated on the surface of the heat sink 1 and the sensitive element 2. The coating can be coated on the surface of the heat sink 1, the inner and outer surfaces of the sensitive element 2, and the surface of the heat dissipation structure, which can increase the emissivity of the heat flow meter surface, thereby improving the thermal energy intensity of the insulation space and the thermal energy efficiency of the sensitive element 2 itself, thereby improving the detection accuracy of thermal energy in a small range. Optionally, the high emissivity coating 4 can be made of a material that is resistant to low pressure and high and low temperatures.

[0068] In the embodiment of the present specification, the heat transfer component sensitive element 2 of the Gordon type heat flux meter is very thin, and the contact thermal resistance with the heat sink 1 is very small, so that the thermal response of the calorimeter is extremely fast. After the surface of the sensitive element 2 is heated, most of the heat is directly transferred to the heat sink 1 through the direct contact area between the sensitive element 2 and the heat sink 1; and since the bottom surface of the central circular area of ​​the sensitive element 2 is not in direct contact with the heat sink 1, it is necessary to establish lateral heat conduction inside the sensitive element 2, and transfer the heat to the direct contact area between the sensitive element 2 and the heat sink 1, and then transfer the heat to the heat sink 1. At this time, there will be a more obvious temperature difference between the center point of the sensitive element 2 and the edge of the central circular area.

[0069] like Figure 4 As shown in the figure, it is an example diagram of the working principle of the heat flow meter in the embodiment of this specification. The sensitive element 2 and the heat sink 1 absorb the space radiation heat flux Q 空间 , that is, the radiation heat flow parameter of the side space. Due to the temperature, the outer side of the circular foil of the sensitive element 2 and the heat sink 1 itself radiate energy Q to the outside space 圆箔外 , which is proportional to the product of the fourth power of the surface temperature and the surface emissivity and is always positive. 圆箔内 It is the energy radiated from the inner side of the circular foil of the sensitive element 2 to the heat-insulating cavity due to its own temperature; the energy radiated from the heat-insulating cavity is absorbed by the heat dissipation structure integrated with the heat sink 1. E is the absorbed energy, that is, the energy conducted from the center line inside the circular foil of the sensitive element 2 to the heat sink 1. Q 热沉 The heat dissipation structure radiates energy to the heat-insulating cavity due to its own temperature, and the radiated energy is absorbed by the circular foil of the sensitive element 2.

[0070] For the sensitive element 2, the circular foil is very thin. In steady state, the heat conduction in the thickness direction of the circular foil is ignored. According to the Fourier heat conduction formula and the energy conservation formula, the differential equation describing the heat conduction of the circular foil is:

[0071]

[0072]

[0073] The boundary conditions are:

[0074] When r=0, T(0)=T1

[0075] When r=0, T'(0)=0

[0076] When r=R, T(R)=T2

[0077] Where q is the measured environmental heat flux density, R is the radius of the circular foil of the sensitive element, h is the thickness of the circular foil of the sensitive element, λ is the thermal conductivity of the circular foil of the sensitive element, ε is the surface emissivity of the object, and δ is the Boltzmann constant.

[0078] Q 热沉 It is related to the surface temperature of the heat dissipation structure and can be obtained by measuring and calculating the signal between the second positive temperature measuring wire 321 of the heat sink 1 and the second negative temperature measuring wire 322 of the heat sink 1 .

[0079] Temperature T1 represents the temperature at the center of the circular foil of the sensitive element, which can be obtained through the measurement values ​​of the first positive temperature measuring wire 311 and the first negative temperature measuring wire 312 of the sensitive element 2. Temperature T2 represents the temperature at the edge of the circular foil of the sensitive element, which can be obtained through the measurement values ​​of the first negative temperature measuring wire 312 of the sensitive element and the second positive temperature measuring wire 321 of the heat sink 1.

[0080] Through the above formulas (1) and (2), the radiation heat flux density q of the measured ambient space can be calculated by the signal between the second positive temperature measuring wire 321 and the first negative temperature measuring wire 312, the signal between the first positive temperature measuring wire 311 and the first negative temperature measuring wire 312, and the signal between the second positive temperature measuring wire 321 and the second negative temperature measuring wire 322.

[0081] Through the working principle diagram of the Gordon type heat flow meter provided above, the embodiment of this specification also provides a self-correction method of the Gordon type heat flow meter, which is implemented based on the principle of conservation of energy. Specifically, the energy absorbed by the circular foil of the sensitive element is the same as the energy radiated and transmitted to the outside by the circular foil of the sensitive element. According to the energy conservation formula:

[0082] Q 空间 +Q 热沉 =Q 圆箔内 +Q 圆箔外 +E (3)

[0083] Move the item to get: Q 空间 =Q 圆箔内 +Q 圆箔外 +EQ 热沉 (4)

[0084] Since the circular foil of the sensitive element is very thin, basically less than 0.3 mm, it is approximately assumed that the temperature distribution of the outer surface and the inner surface of the circular foil is consistent. This is equivalent to, Q 圆箔内 =Q 圆箔外.

[0085] Therefore, the space radiation heat flux density is:

[0086]

[0087] The embodiment of this specification provides a self-correction method of a Gordon-type heat flow meter, which can realize the correction of the detection data of the heat flow meter. Figure 5 It is a schematic diagram of the steps of a self-correction method of a Gordon-type heat flux meter provided in an embodiment of the present invention. This specification provides the method operation steps described in the embodiment or flowchart, but may include more or fewer operation steps based on conventional or non-creative labor. The order of steps listed in the embodiment is only one way of executing the steps among many orders, and does not represent the only order of execution. When the actual system or device product is executed, it can be executed in the order of the method shown in the embodiment or the drawings or in parallel. Specifically, Figure 5 As shown, the method may include:

[0088] S101: Place the Gordon heat flow meter in a stable space heat flow environment and control the temperature of the sensitive element and the heat sink to be the same;

[0089] S103: Calculating a standard value of spatial heat flux density absorbed by the sensitive element according to the detection data of the thermal energy detection component and the parameters of the heat sink;

[0090] S105: adjusting the inlet temperature and inlet speed of the coolant at the inlet end of the water cooling structure so that the temperature of the heat sink is maintained at the first temperature;

[0091] S107: Calculating a reference value of the spatial heat flux density absorbed by the sensitive element according to the parameters of the sensitive element, the parameters of the heat sink and the detection data of the thermal energy detection component;

[0092] S109: Obtaining a correction value of the Gordon-type heat flux meter according to the standard value of the spatial heat flux density and the reference value of the spatial heat flux density.

[0093] The self-correction method provided in the embodiment of this specification first obtains the standard value of the spatial radiation heat flux density through an absolute measurement method, which is equivalent to the actual spatial radiation heat flux density, and then performs a secondary measurement by adjusting the fixed temperature point maintained by the heat sink 1. The spatial radiation heat flux density measured this time is the data obtained in the normal working mode. Due to the instability of the spatial radiation heat flux and the performance loss of the components of the heat flux meter itself under long-term operation, the value measured at the fixed temperature point will have a certain deviation. The data obtained by the secondary measurement can be compared with the standard value to obtain a correction value, and the correction value is used for correction in subsequent measurements.

[0094] It should be noted that although the absolute measurement method can be used to measure real and accurate spatial radiation heat flux density data, this method is only applicable to steady-state radiation heat flux measurements. At the same time, this method has a long measurement time and poor dynamic response time. Therefore, in order to ensure the efficiency of the measurement, a fixed temperature point measurement method will be selected for dynamic spatial radiation heat flux measurements.

[0095] In step S101, the Gordon heat flow meter is placed in a stable space radiation heat flow environment, such as Figure 6 As shown, the following steps may be included:

[0096] S1011: placing the Gordon type heat flow meter in a stable space heat flow environment, and obtaining the signal value output between the first positive electrode temperature measuring wire and the second positive electrode temperature measuring wire in the thermal energy detection component;

[0097] S1013: adjusting the inlet temperature and inlet speed of the coolant at the inlet end of the water cooling structure so that the signal output between the first positive temperature measuring wire and the second positive temperature measuring wire is zero.

[0098] When the signal output between the first positive temperature measuring wire 311 and the second positive temperature measuring wire 321 is zero, it means that there is no heat energy transfer between the sensitive element and the heat sink, that is, E=0. In this state, there is no heat conduction heat flow inside the sensitive element; there is no temperature gradient on the surface of the sensitive element, that is, the surface temperature is a constant value, which is the same as the temperature of the heat sink, that is, Q 圆箔外 =E.Q 空间 The spatial radiation heat flux is the same as the radiation heat flux of the heat sink of the heat flow meter.

[0099] Combining formula (2) and (5), we can get:

[0100]

[0101] q is obtained by measuring and calculating the signal between the second positive temperature measuring wire 321 of the heat sink and the second negative temperature measuring wire 322 of the heat sink.

[0102] The spatial radiation heat flux density obtained in step S103 is a real density value and can be used in a stable spatial radiation heat flux environment.

[0103] The following beneficial effects can be achieved by using the Gordon type heat flow meter and its correction method provided above:

[0104] 1. By setting up an insulating cavity to increase the emission of heat energy, the measurement of small-scale space radiation heat flux can be achieved. At the same time, the embodiments of the specification take into account the characteristics of vacuum environments such as low pressure and low temperature, and avoid the influence of the heat flow meter's own temperature and space radiation temperature on the measurement of radiation heat flux. Even if the heat flux radiated by the heat flow meter itself to the space is the same or similar to the space radiation heat flux to be measured, accurate measurement of heat flux can be achieved.

[0105] 2. By self-correcting the heat flow meter, high-precision data can be obtained in a stable spatial radiation heat flux, and the data of the heat flow meter working at a fixed temperature point can be corrected to improve the measurement accuracy of the heat flow meter. By adopting a fixed temperature point, the measurement response time is fast.

[0106] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0107] The above description is only an embodiment of the present specification and is not intended to limit the present specification. For those skilled in the art, the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification shall be included in the scope of the claims of the present specification.

Claims

1. A Gordon type heat flow meter, characterized in that: include: A heat sink (1), a sensitive element (2) and a thermal energy detection component (3); One side of the heat sink (1) is a groove structure (11), the interior of the heat sink (1) is a water cooling structure (12), the open side of the groove structure (11) is provided with the sensitive element (2) so that a heat-insulating cavity is formed inside the groove structure (11), the sensitive element (2) is used to absorb the radiation heat flow in the space and transfer the heat energy to the heat sink (1), and the water cooling structure (12) provides a channel for a cooling liquid, so as to cool the heat sink (1); The thermal energy detection component (3) is connected to the heat sink (1) and the sensitive element (2) and is used to detect the temperature of the heat sink (1) and the sensitive element (2); The bottom of the groove structure (11) is a heat dissipation structure, which is used to increase the surface emissivity of the bottom of the groove structure (11) to the sensitive element (2); The thermal energy detection component (3) comprises a first detection component (31) and a second detection component (32); The first detection component (31) comprises a first positive temperature measuring wire (311) and a first negative temperature measuring wire (312); the first positive temperature measuring wire (311) is connected to the center of the sensitive element (2), and the first negative temperature measuring wire (312) is connected to one end of the sensitive element (2); The second detection component (32) comprises a second positive temperature measuring wire (321) and a second negative temperature measuring wire (322); the second positive temperature measuring wire (321) is connected to the heat sink (1), and the second negative temperature measuring wire (322) is connected to the bottom of the groove structure (11); The second positive temperature measuring wire (321) and the first positive temperature measuring wire (311) form a pair of temperature difference thermocouples, which are used to measure the temperature difference between the center and the edge of the circular foil of the sensitive element (2), and the temperature difference between the center and the edge of the circular foil of the sensitive element (2) is obtained by measuring the thermoelectric potential between the two. In addition, the second positive temperature measuring wire (321) and the first negative temperature measuring wire (312) form a pair of thermocouples for measuring the temperature at the edge of the circular foil of the sensitive element; The second negative temperature measuring wire (322) and the second positive temperature measuring wire (321) form a thermocouple pair for measuring the surface temperature of the ring micro-cone structure.

2. The Gordon type heat flow meter according to claim 1, characterized in that: A through hole (111) is provided on the side wall of the groove structure (11), and the through hole (111) is used to connect the heat-insulating cavity with the external environment.

3. The Gordon type heat flow meter according to claim 1, characterized in that: The water cooling structure (12) comprises a cooling part (121), a connecting part (122), a liquid inlet end (123) and a liquid outlet end (124); one end of the cooling part (121) is provided with the groove structure (11), the other end of the cooling part (121) is connected to one end of the connecting part (122), and the other end of the connecting part (122) is connected to the liquid inlet end (123) and the liquid outlet end (124), so that the cooling liquid enters the cooling part (121) through the liquid inlet end (123) and the connecting part (122), and flows out of the liquid outlet end (124) through the cooling part (121) and the connecting part (122).

4. The Gordon type heat flow meter according to claim 3, characterized in that: The cooling portion (121) is in a spoke-like structure, and the connecting portion (122) is connected to the middle portion of the spoke-like structure.

5. The Gordon type heat flow meter according to claim 1, characterized in that: It also comprises a high emissivity coating (4), wherein the high emissivity coating (4) is arranged on the surfaces of the heat sink (1) and the sensitive element (2).

6. A self-correction method for a Gordon type heat flow meter, applicable to the Gordon type heat flow meter according to any one of claims 1 to 5, characterized in that: The method comprises: Placing the Gordon type heat flow meter in a stable space heat flow environment and controlling the temperature of the sensitive element and the heat sink to be the same, specifically comprising: placing the Gordon type heat flow meter in a stable space heat flow environment and obtaining a signal value output between a first positive temperature measuring wire and a second positive temperature measuring wire in a thermal energy detection component; adjusting the inlet temperature and inlet speed of the coolant at the inlet end of the water cooling structure so that the signal output between the first positive temperature measuring wire and the second positive temperature measuring wire is zero; According to the detection data of the thermal energy detection component and the parameters of the heat sink, the standard value of the spatial heat flux density absorbed by the sensitive element is calculated; Adjusting the inlet temperature and inlet speed of the coolant at the inlet end of the water cooling structure so that the temperature of the heat sink is maintained at the first temperature; According to the parameters of the sensitive element, the parameters of the heat sink and the detection data of the thermal energy detection component, a reference value of the spatial heat flux density absorbed by the sensitive element is calculated; A correction value of the Gordon-type heat flux meter is obtained according to the standard value of the spatial heat flux density and the reference value of the spatial heat flux density.

7. The self-correction method of Gordon type heat flow meter according to claim 6, characterized in that: The heat sink body parameters include the heat sink body surface emissivity; The parameters of the sensitive element include the radius of the sensitive element, the thickness of the sensitive element, the thermal conductivity of the sensitive element and the surface emissivity of the sensitive element.

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