Semiconductor strip cutting and sorting apparatus, conveying device and method

Abstract

Embodiments of the present invention provide a semiconductor strip cutting and sorting apparatus, a conveying device, and a method. The device for conveying semiconductor packages in the semiconductor strip cutting and sorting apparatus includes: an adsorption plate having a vacuum hole for adsorbing the semiconductor package; a main body having a first flow path internally formed in connection with the adsorption plate and communicating with the vacuum hole; a suction pipe connected to the first flow path for supplying airflow to apply vacuum pressure; a vacuum pressure forming section for applying vacuum pressure through the suction pipe and the first flow path; a first valve disposed between the vacuum pressure forming section and the suction pipe for opening or closing the suction pipe; a second flow path connected to the first flow path to form a path for external gas flow; and a second valve connected to the second flow path for opening or closing the second flow path.

Description

Technical Field

[0001] The present invention relates to an apparatus and method for conveying semiconductor packages in a semiconductor strip cutting and sorting apparatus, and more specifically to an apparatus and method for conveying semiconductor packages cleaned with a cleaning solution. Background Art

[0002] Semiconductor manufacturing processes are used to fabricate semiconductor devices on wafers, including processes such as exposure, evaporation, etching, ion implantation, and cleaning. Semiconductor strip cutting and sorting equipment cuts strips containing multiple packages into individual packages. Through cleaning, drying, and inspection of each package, they are classified as normal or defective and then loaded into the final storage container, i.e., the tray.

[0003] Inspection of each package is performed using visual inspection devices such as cameras. For precise inspection, each package needs to be free of foreign objects that may obstruct the inspection. The cleaning fluid used to clean the cut packages may also become an obstacle during the inspection process, so it needs to be managed to ensure that no cleaning fluid residue remains on the packages. Summary of the Invention

[0004] Therefore, embodiments of the present invention provide apparatus and method for conveying semiconductor packages in a semiconductor strip cutting and sorting apparatus while preventing cleaning fluid residue.

[0005] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

[0006] An apparatus for conveying semiconductor packages in a semiconductor strip cutting and sorting machine includes: an adsorption plate having a vacuum hole for adsorbing the semiconductor package; a main body having a first flow path internally formed in connection with the adsorption plate and communicating with the vacuum hole; a suction pipe connected to the first flow path for supplying airflow for applying vacuum pressure; a vacuum pressure forming section for applying vacuum pressure through the suction pipe and the first flow path; a first valve disposed between the vacuum pressure forming section and the suction pipe for opening or closing the suction pipe; a second flow path connected to the first flow path to form a path for external gas flow; and a second valve connected to the second flow path for opening or closing the second flow path.

[0007] In this embodiment, the device may further include: a filter section disposed on a portion of the suction pipe to filter liquid flowing through the suction pipe; and a drain container to store the liquid filtered by the filter section.

[0008] In this embodiment, the second flow path may be formed in the main body portion.

[0009] In this embodiment, if the main body is located at the target conveying position, the second valve may be opened for a certain period of time.

[0010] In this embodiment, the second valve may close after a certain period of time; if the second valve closes, the first valve may close to release the vacuum pressure; if the vacuum pressure is released, the semiconductor package may be placed at the target delivery position.

[0011] In this embodiment, the second flow path may be formed as a side portion connecting the first flow path and the main body portion.

[0012] In this embodiment, the second flow path may be formed as the upper surface connecting the first flow path and the main body.

[0013] In this embodiment, the second flow path may be formed on the adsorption plate.

[0014] A method for conveying a semiconductor package in a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention includes: a step of picking up the semiconductor package in a package picker by applying vacuum pressure through a first flow path of a main body portion connected to an adsorption hole for adsorbing the semiconductor package; a step of positioning the package picker with the adsorbed semiconductor package at a target conveying position; a step of opening a second flow path connected to the first flow path to form a path for external gas flow to draw out moisture present in the first flow path; and a step of cutting off the second flow path and releasing the vacuum pressure to place the semiconductor package at the target conveying position.

[0015] In this embodiment, the second flow path may be formed in the main body portion.

[0016] In this embodiment, the opening or closing of the second flow path may be performed by a second valve connected to the second flow path.

[0017] In this embodiment, the step of drawing water vapor present in the first flow path may include the step of opening the second valve for a certain period of time.

[0018] In this embodiment, the second flow path may be formed as a side portion connecting the first flow path and the main body portion.

[0019] In this embodiment, the second flow path may be formed as the upper surface connecting the first flow path and the main body.

[0020] In this embodiment, the second flow path may be formed on the adsorption plate having adsorption holes for adsorbing the semiconductor package.

[0021] A semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention includes: a loading section for loading semiconductor strips configured with multiple packages; a cutting section including a package picker for cutting the semiconductor strips and conveying individual semiconductor packages; and a sorting section for drying and inspecting the semiconductor packages and storing them in a tray. The package picker may include: an adsorption plate having a vacuum hole for adsorbing the semiconductor package; a main body having a first flow path formed internally in conjunction with the adsorption plate and communicating with the vacuum hole; a suction pipe connected to the first flow path for supplying airflow for applying vacuum pressure; a vacuum pressure forming section for applying vacuum pressure through the suction pipe and the first flow path; a first valve disposed between the vacuum pressure forming section and the suction pipe for opening or closing the suction pipe; a second flow path formed internally in the main body, between a side portion of the main body and the first flow path, allowing external gas to flow; and a second valve disposed in conjunction with the second flow path for opening or closing the second flow path.

[0022] In one embodiment, the semiconductor strip cutting and sorting apparatus may further include: a filter section disposed in a portion of the first flow path to filter liquid flowing through the first flow path; and a drain container to hold the liquid filtered by the filter section.

[0023] In one embodiment, if the main body is located on the tilting table, the second valve may be opened for a certain period of time.

[0024] In one embodiment, the second valve may close after a certain period of time; if the second valve closes, the first valve closes to release the vacuum pressure; and if the vacuum pressure is released, the semiconductor package is placed on the flipping table.

[0025] In one embodiment, the second flow path may be formed as a side portion connecting the first flow path and the main body portion.

[0026] According to an embodiment of the present invention, a second flow path is formed in which external gas can flow, thereby drawing out moisture remaining in the first flow path which is subjected to vacuum pressure for adsorbing the semiconductor package, thus preventing moisture from being discharged into the semiconductor package.

[0027] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. Attached Figure Description

[0028] Figure 1 The schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention is shown.

[0029] Figure 2 This illustrates the situation where water vapor is expelled during the transport process of a semiconductor package.

[0030] Figure 3 An example of an apparatus for conveying a semiconductor package according to an embodiment of the present invention is shown.

[0031] Figure 4 This illustrates a process for removing residual moisture in a first flow path during the transport of a semiconductor package according to an embodiment of the present invention.

[0032] Figure 5 An example of guiding gas in an apparatus for conveying a semiconductor package is shown according to an embodiment of the present invention.

[0033] Figure 6 This is a flowchart of a method for delivering a semiconductor package according to an embodiment of the present invention.

[0034] (Explanation of reference numerals in the attached diagram)

[0035] 100: Loading section; 200: Cutting section

[0036] 205: Temporary Storage Department; 210: Strip Pickup Device

[0037] 220: Pick up 230: First guide frame

[0038] 240: Chuck 250: Cutting section

[0039] 260: Cleaning Department; 300: Sorting Department

[0040] 310: Tilting table; 315: Second guide frame

[0041] 320: Drying section; 330: Inspection section

[0042] 341: First accompanying clamping platform; 346: Second accompanying clamping platform

[0043] 350: First pallet ejection drive unit; 351: First pallet ejection unit

[0044] 352: Second pallet ejector; 355: Pallet ejector drive unit

[0045] 356: Second pallet removal 360: Inspection Department

[0046] 370: Sorting Pickup Unit; 380: Sorting Pickup Unit Drive Component

[0047] 800: Classification C: Semiconductor Package

[0048] P: Semiconductor package; S: Semiconductor strip Detailed Implementation

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0050] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0051] Furthermore, in multiple embodiments, the same reference numerals are used to describe only representative embodiments of the constituent elements having the same structure, while in other embodiments only structures different from the representative embodiments are described.

[0052] In the specification as a whole, when a part is described as being "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also includes cases where other components are placed in between for "indirect connection (or combination)". Furthermore, when a part is described as "including" a constituent element, unless otherwise stated otherwise, it means that other constituent elements may be included, rather than excluding them.

[0053] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless explicitly defined in this application.

[0054] Figure 1 A schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention is shown. (Refer to...) Figure 1 The semiconductor package cutting and sorting apparatus according to an embodiment of the present invention includes a loading section 100, a cutting section 200, and a sorting section 300.

[0055] According to an embodiment of the present invention, a semiconductor strip cutting and sorting apparatus includes a loading section 100 for loading semiconductor strips S on which multiple packages are disposed, a cutting section 200 having a package picker 220 for cutting semiconductor strips S and conveying individual semiconductor packages P, and a sorting section 300 for drying and inspecting semiconductor packages P and storing them in a tray.

[0056] The loading unit 100 transfers the semiconductor strip S, which is conveyed from the outside, to the temporary storage unit 205 of the cutting unit 200. Although not in Figure 1 As shown in detail, the loading unit 100 may include a cassette for loading semiconductor strips S and a pusher for pushing and delivering semiconductor strips S. The semiconductor strips S supplied to the loading unit 100 may be located in the temporary storage unit 205.

[0057] The strip pickup 210 picks up the semiconductor strip S located in the temporary storage section 205 and conveys it to the chuck 240. The package pickup 220 holds the semiconductor package P, which has been cut by the dicing section 250 and conveyed through the chuck 240, by vacuum adsorption and conveys it to the cleaning section 260 and the turnover table 310. The first guide 230 provides a path for the strip pickup 210 and the package pickup 220 to move in the X-axis direction. The first guide 230 can be combined with a drive unit for moving the strip pickup 210 and the package pickup 220.

[0058] The chuck 240 allows semiconductor strips S and semiconductor packages P to be transported between the strip pickup 210 and the dicing section 250, and between the dicing section 250 and the package pickup 220, respectively. The chuck 240 can move in the Y-axis direction and rotate around the Z-axis, and can hold the semiconductor strip S. The chuck 240 picks up the semiconductor strip S transported by the strip pickup 210 and transports it to the dicing section 250. Additionally, the chuck 240 transfers multiple semiconductor packages P that have been diced by the dicing section 250 to the package pickup 220. That is, the chuck 240 can reciprocate between the dicing section 250 and the first guide 230. Alternatively, the package pickup 220 may pick up semiconductor packages P cleaned in the cleaning section 260 and transport them to the turnover table 310, where the semiconductor packages P transported to the turnover table 310 are dried by the drying section 320. The turnover table 310 can move along the second guide 315.

[0059] The sorting unit 300 sorts the semiconductor packages P according to the inspection results of each semiconductor package P. More specifically, the sorting unit 300 independently picks up the semiconductor packages P that have been inspected by the vision inspection units 330 and 360 and are loaded on the first accompanying fixture table 341 and the second accompanying fixture table 346, sorts them sequentially according to the inspection results, and transfers them to other locations.

[0060] The sorting unit 300 for this purpose may include a sorting picker 370, a sorting picker drive unit 380, a first transport pallet 351, a second transport pallet 356, a first transport pallet drive unit 350, and a second transport pallet drive unit 355.

[0061] The sorting picker 370 picks up the semiconductor package P that has been inspected by the vision inspection units 330 and 360 and is loaded onto the first accompanying fixture table 341 and the second accompanying fixture table 346 respectively, and transfers it to the first transfer tray 351 and the second transfer tray 356, which will be described later.

[0062] The sorting picker drive unit 380 can be formed in the shape of a guide rail and arranged along the X-axis direction, with a portion positioned adjacent to the visual inspection unit 360. The sorting picker drive unit 380 moves the sorting picker 370 in the X-axis direction. For this purpose, the sorting picker drive unit 380 can have a built-in drive tool for moving the sorting picker 370.

[0063] The first mover tray 351 and the second mover tray 356 can be loaded with qualified semiconductor packages P and unqualified semiconductor packages P respectively, and moved to other locations. Alternatively, the first mover tray 351 and the second mover tray 356 can also be loaded according to the evaluation grade of the semiconductor packages P based on their manufacturing condition. For example, the first mover tray 351 can be loaded with grade A semiconductor packages P, and the second mover tray 356 can be loaded with grade B semiconductor packages P, whose manufacturing condition is lower than grade A.

[0064] If the sorting picker 370 picks up the semiconductor package P from the first accompanying fixture 341 and the second accompanying fixture 346 and loads them all onto the first transfer tray 351 or the second transfer tray 356 respectively, the first transfer tray 351 or the second transfer tray 356 moves in the Y-axis direction to transfer the semiconductor package P to other locations.

[0065] The first pallet-moving drive unit 350 moves the first pallet-moving tray 351. The first pallet-moving drive unit 350 may have a built-in drive tool for moving the first pallet-moving tray 351.

[0066] The second pallet drive unit 355 moves the second pallet 356. The second pallet drive unit 355 may have a built-in drive tool for moving the second pallet 356.

[0067] Semiconductor strip cutting and sorting equipment can cut, clean, dry, and inspect semiconductor strips S as described above, then sort them and discharge them to other locations. On the other hand, the package pickup 220 according to embodiments of the present invention is not limited to inclusion in semiconductor strip cutting and sorting equipment, but can be applied to ordinary semiconductor package manufacturing systems. Hereinafter, an apparatus and method according to embodiments of the present invention for preventing moisture from escaping into the semiconductor package P in the package pickup 220 are described.

[0068] Figure 2This illustrates the removal of moisture during the transport of the semiconductor package P. The package pickup 220 for transporting the semiconductor package P includes: an adsorption plate 2210 with a vacuum hole 2211 for adsorbing the semiconductor package P; a main body 2220 having a first flow path 2221 formed internally in conjunction with the adsorption plate 2210 and communicating with the vacuum hole 2211; a suction pipe 2290 connected to the first flow path 2221 for supplying airflow for applying vacuum pressure; a vacuum pressure forming section 2230 for applying vacuum pressure through the suction pipe 2290 and the first flow path 2221; and a first valve 2240 disposed between the vacuum pressure forming section 2230 and the first flow path 2221 to open or close the first flow path 2221. Additionally, the package pickup 220 may also include: a filter section 2270, disposed in a portion of the suction pipe 2290 to filter the liquid flowing through the first flow path 2221; and a drain container 2280 to hold the liquid filtered by the filter section 2270. Furthermore, a fastening portion 2295, fastened between the main body 2220 and the suction pipe 2290 and connecting the first flow path 2221 and the suction pipe 2290, may be provided in the package pickup 220.

[0069] After the adsorption plate 2210 comes into direct contact with the semiconductor package P, the semiconductor package P is adsorbed by vacuum pressure. The adsorption plate 2210 can be configured differently according to the type of semiconductor package P to pick up various types, and can be replaced as needed. The main body 2220 clamps the adsorption plate 2210 and is connected to the suction pipe 2290 by the fastening part 2295. The main body 2220 can transport the semiconductor package P by moving in the horizontal and vertical directions, and can be equipped with a drive unit and a controller for driving the main body 2220. The suction pipe 2290, as a pipe for gas flow to apply vacuum pressure, can be implemented as a pipe with a certain length. A filter part 2270 is formed in a part of the suction pipe 2290, and gas flow based on the vacuum pressure of the vacuum pressure forming part 2230 is used by opening and closing the first valve 2240.

[0070] Reference Figure 2 In (a), due to the vacuum pressure applied to adsorb the semiconductor package P, the cleaning fluid remaining in the semiconductor package P may rise and remain in the first flow path 2221 and the suction pipe 2290. If, with the cleaning fluid remaining in the first flow path 2221 and the suction pipe 2290, the vacuum pressure is released in order to place the semiconductor package P at the target transfer position (e.g., the turntable 310), then... Figure 2 As in (b), the cleaning fluid remaining in the first flow path 2221 and the suction pipe 2290 may be discharged together. If the cleaning fluid is discharged, moisture may be dispersed into the inspection section 330 located around the tilting table 310, which may have a negative impact on the inspection performance.

[0071] Although the cleaning fluid that reaches the filter section 2270 during the application of vacuum pressure is collected by the drain container 2280 and not discharged, if the semiconductor package P is completely adsorbed on the adsorption plate 2210 and the gas no longer flows to the filter section 2270, the cleaning fluid remaining in the first flow path 2221 and the suction pipe 2290 cannot move together and remains.

[0072] Therefore, embodiments of the present invention, by continuously guiding the airflow to the filter section 2270 after the semiconductor package P is adsorbed onto the adsorption plate 2210, ensure that the cleaning liquid does not remain in the first flow path 2221 and the suction pipe 2290, thereby providing an apparatus and method to prevent the cleaning liquid from being discharged during the adsorption release process of the semiconductor package P. An apparatus (package pickup 220) for conveying the semiconductor package P according to embodiments of the present invention can be as follows: Figure 3 That's how it's structured.

[0073] An apparatus (package picker 220) for conveying semiconductor packages P in a semiconductor strip cutting and sorting equipment includes: an adsorption plate 2210 having a vacuum hole 2211 for adsorbing the semiconductor package P; a main body 2220 having a first flow path 2221 formed internally in connection with the adsorption plate 2210 and communicating with the vacuum hole 2211; a suction pipe 2290 connected to the first flow path 2221 for supplying airflow for applying vacuum pressure; and a vacuum pressure forming section 2230. Vacuum pressure is applied through suction pipe 2290 and first flow path 2221; first valve 2240 is disposed between vacuum pressure forming part 2230 and suction pipe 2290 to open or close suction pipe 2290; second flow path 2250 is formed inside main body 2220, between side part of main body and first flow path, allowing external gas to flow; and second valve 2260 is combined with second flow path 2250 to open or close second flow path 2250.

[0074] According to an embodiment of the present invention, when the semiconductor package P is adsorbed onto the adsorption plate 2210, gas is also allowed to flow through the second flow path by vacuum pressure. Therefore, the cleaning fluid remaining in the first flow path 2221 and the suction pipe 2290 can flow inward with the gas and move to the drain container 2280. Thus, the cleaning fluid does not remain in the first flow path 2221 and the suction pipe 2290, preventing the cleaning fluid from being discharged when the vacuum adsorption is released and the semiconductor package P is placed on the flipping table 310.

[0075] In one embodiment, the package pickup 220 may further include: a filter section 2270 disposed in part of the suction pipe 2290 to filter liquid flowing through the suction pipe 2290; and a drain container 2280 for holding the liquid filtered by the filter section 2270.

[0076] Reference Figure 4 (a) If the package pickup 220 reaches the flipping stage 310 while adsorbing the semiconductor package P under applied vacuum pressure, the second valve 2260 is opened, allowing external gas to flow into the interior through the second flow path 2250. That is, if the main body 2220 is located at the target transfer position (flipping stage 310), the second valve 2260 can be open for a certain period of time. (See reference...) Figure 4 (b) Due to the pressure of the gas flowing in through the second flow path 2250, the cleaning liquid remaining in the first flow path 2221 and the suction pipe 2290 is collected in the drain container 2280 through the filter section 2270.

[0077] Reference Figure 4 (c) If a certain period of time passes, the second valve 2260 closes. If the second valve 2260 closes, the first valve 2240 closes, releasing the vacuum pressure. If the vacuum pressure is released, the semiconductor package P is placed in the target transfer position (turntable 310). According to an embodiment of the present invention, the cleaning fluid does not remain in the first flow path 2221 and the suction pipe 2290, thus preventing the cleaning fluid from being discharged when the semiconductor package P is placed in the turntable 310.

[0078] Figure 5 An example of a second flow path 2250 for the flow of external gas in an apparatus for conveying a semiconductor package P, according to an embodiment of the present invention, is shown. Figure 5 As shown in (a) and (c), the second flow path 2250 can be formed in the main body 2220. Additionally, as... Figure 5 As shown in (a), the second flow path 2250 can be formed as a side portion connecting the first flow path 2221 and the main body portion.

[0079] In addition, if Figure 5 As in (c), the second flow path 2250 can be formed as the upper part connecting the first flow path 2221 and the main body 2220. Additionally, as... Figure 5 As in (b), the second flow path 2250 can be formed on the adsorption plate 2210.

[0080] Figure 6 This is a flowchart of a method for conveying a semiconductor package P according to an embodiment of the present invention. Figure 6 The various operations can be performed by the modules of the semiconductor strip cutting and sorting equipment through the controller that controls the operation of the semiconductor package P.

[0081] A method for conveying a semiconductor package P in a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention includes: a step of picking up the semiconductor package P in a package picker 220 by applying vacuum pressure through a first flow path 2221 connected to an adsorption hole 2211 for adsorbing the semiconductor package P (S605); a step of positioning the package picker 220 with the adsorbed semiconductor package P at a target conveying position (S610); a step of opening a second flow path 2250 connected to the first flow path 2221 to form a path for external gas flow to draw out water vapor present in the first flow path 2221 (S615); and a step of cutting off the second flow path 2250 and releasing the air pressure to place the semiconductor package P at the target conveying position (S620).

[0082] In one embodiment, the second flow path 2250 can be as follows: Figure 5 Formed in the main body 2220 as in (a) and (c).

[0083] In one embodiment, if Figure 4 In this way, the opening or closing of the second flow path 2250 can be performed by the second valve 2260 combined with the second flow path 2250.

[0084] In one embodiment, if Figure 4 As in (a), the step of drawing water vapor present in the first flow path 2221 (S615) may include the step of opening the second valve 2260 for a certain period of time.

[0085] In one embodiment, if Figure 5 As in (a), the second flow path 2250 can be formed as a side part connecting the first flow path 2221 and the main body 2220.

[0086] In one embodiment, if Figure 5 As in (c), the second flow path 2250 can be formed as the upper part connecting the first flow path 2221 and the main body 2220.

[0087] In one embodiment, if Figure 5 As in (b), the second flow path 2250 can be formed on the adsorption plate 2210.

[0088] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0089] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. An apparatus for conveying semiconductor packages in a semiconductor strip cutting and sorting equipment, characterized in that, The device includes: An adsorption plate is formed with vacuum holes for adsorbing the semiconductor package; The main body has a first flow path formed inside, which is connected to the adsorption plate and communicates with the vacuum hole; A suction pipe is connected to the first flow path to supply airflow for applying vacuum pressure; The vacuum pressure forming section applies vacuum pressure through the suction pipe and the first flow path; A first valve is disposed between the vacuum pressure forming section and the suction pipe to open or close the suction pipe; The second flow path connects to the path between the vacuum hole and the suction pipe to form a path through which external gas can flow; and The second valve, in conjunction with the second flow path, opens or closes the second flow path. The second flow path is opened during the period when vacuum pressure is applied to the first flow path through the vacuum pressure forming section, thereby drawing out moisture remaining in the first flow path and the suction pipe while maintaining the state of the adsorption plate adsorbing the semiconductor package.

2. The apparatus according to claim 1, characterized in that, The device further includes: a filter section disposed in part of the suction pipe to filter liquid flowing through the suction pipe; and a drain container to store the liquid filtered by the filter section.

3. The apparatus according to claim 1, characterized in that, The second flow path is formed in the main body portion.

4. The apparatus according to claim 3, characterized in that, If the main body is located at the target conveying position, the second valve will open for a certain period of time.

5. The apparatus according to claim 4, characterized in that, If the specified time elapses, the second valve will close. If the second valve is closed, the first valve will close, thus relieving the vacuum pressure. If the vacuum pressure is released, the semiconductor package is placed at the target delivery location.

6. The apparatus according to claim 1, characterized in that, The second flow path is formed as a side portion connecting the first flow path and the main body portion.

7. The apparatus according to claim 1, characterized in that, The second flow path is formed as the upper part connecting the first flow path and the main body.

8. The apparatus according to claim 1, characterized in that, The second flow path is formed on the adsorption plate.

9. A method for conveying semiconductor packages in a semiconductor strip cutting and sorting apparatus, characterized in that, The method includes: The step of picking up a semiconductor package by applying vacuum pressure to a first flow path of a main body portion connected to the adsorption holes for adsorbing the semiconductor package in a package pickup including an adsorption plate having a vacuum hole for adsorbing the semiconductor package; The step of positioning the package pickup, which has adsorbed the semiconductor package, at the target delivery position; The step of drawing water vapor present in the first flow path by opening a second flow path that connects the vacuum hole and the suction pipe connected to the first flow path for air flow to apply vacuum pressure, thereby forming a path for external gas flow; and The step of cutting off the second flow path and releasing the vacuum pressure to place the semiconductor package at the target delivery position. The second flow path is opened while vacuum pressure is applied to the first flow path via the vacuum pressure forming part that applies vacuum pressure through the suction pipe and the first flow path, thereby suctioning out moisture remaining in the first flow path and the suction pipe while maintaining the state of the adsorption plate adsorbing the semiconductor package.

10. The method according to claim 9, characterized in that, The second flow path is formed in the main body portion.

11. The method according to claim 9, characterized in that, The opening or closing of the second flow path is performed by a second valve connected to the second flow path.

12. The method according to claim 11, characterized in that, The step of drawing out water vapor present in the first flow path includes the step of opening the second valve for a certain period of time.

13. The method according to claim 9, characterized in that, The second flow path is formed as a side portion connecting the first flow path and the main body portion.

14. The method according to claim 9, characterized in that, The second flow path is formed as the upper part connecting the first flow path and the main body.

15. The method according to claim 9, characterized in that, The second flow path is formed on the adsorption plate having adsorption holes for adsorbing the semiconductor package.

16. A semiconductor strip cutting and sorting device, characterized in that, include: The loading section loads semiconductor strips configured with multiple packages; The dicing section includes a package picker that dices the semiconductor strip and delivers individualized semiconductor packages. as well as The sorting department dries and inspects the semiconductor packages and stores them on trays. The package pickup includes: An adsorption plate is formed with vacuum holes for adsorbing the semiconductor package; The main body has a first flow path formed inside, which is connected to the adsorption plate and communicates with the vacuum hole; A suction pipe is connected to the first flow path to supply airflow for applying vacuum pressure; The vacuum pressure forming section applies vacuum pressure through the suction pipe and the first flow path; A first valve is disposed between the vacuum pressure forming section and the suction pipe to open or close the suction pipe; The second flow path, located inside the main body, connects with the side portion of the main body and the path between the vacuum hole and the suction pipe to form a path through which external gas can flow; and The second valve, in conjunction with the second flow path, opens or closes the second flow path. The second flow path is opened during the period when vacuum pressure is applied to the first flow path through the vacuum pressure forming section, thereby drawing out moisture remaining in the first flow path and the suction pipe while maintaining the state of the adsorption plate adsorbing the semiconductor package.

17. The semiconductor strip cutting and sorting equipment according to claim 16, characterized in that, The semiconductor strip cutting and sorting equipment also includes: A filter section, disposed in a portion of the first flow path, filters the liquid flowing through the first flow path; and A drain container for storing the liquid filtered through the filter section.

18. The semiconductor strip cutting and sorting equipment according to claim 16, characterized in that, If the main body is located on the tilting table, the second valve will open for a certain period of time.

19. The semiconductor strip cutting and sorting equipment according to claim 18, characterized in that, If the specified time elapses, the second valve will close. If the second valve is closed, the first valve will close, thus relieving the vacuum pressure. If the vacuum pressure is released, the semiconductor package is placed on the flipping table.

20. The semiconductor strip cutting and sorting equipment according to claim 16, characterized in that, The second flow path is formed as a side portion connecting the first flow path and the main body portion.

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