Carrier device and semiconductor process equipment

Abstract

The application discloses a bearing device and a semiconductor process equipment, and relates to the field of semiconductor equipment. The bearing device comprises a base, a supporting shaft, a driving mechanism and a temperature measuring mechanism. The base is provided with a temperature measuring surface. One end of the supporting shaft is connected with the base. The supporting shaft is provided with a first channel. One end of the first channel is arranged correspondingly to the temperature measuring surface. The driving mechanism comprises a driving assembly and a shell. The driving assembly comprises a driving structure outside the shell and a driven driving structure inside the shell. The two structures are magnetically coupled. The supporting shaft is arranged at least partially in the inner cavity of the shell. The other end of the supporting shaft is connected with the driven driving structure. The shell is provided with a light transmission part. The light transmission part is arranged correspondingly to the other end of the first channel. The temperature measuring mechanism is arranged outside the shell and correspondingly to the light transmission part. The semiconductor process equipment comprises the bearing device. The application can solve the problems of low temperature measuring precision and pressure change in the chamber caused by the movement of the supporting shaft.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, specifically relating to a carrier device and semiconductor process equipment. Background Technology

[0002] Currently, infrared thermometry is widely used in temperature measurement and monitoring of epitaxial equipment. During wafer fabrication, the surface of the wafer undergoing epitaxial processing becomes a non-uniform surface with characteristic patterns, making accurate temperature measurement impossible. Therefore, the industry generally uses the back of a substrate supporting the wafer, which has a more uniform testing surface, for temperature monitoring. During the epitaxial process, to ensure uniform growth, the substrate is designed to rotate. However, as the substrate rotates, the bottom support structure interferes with the infrared pyrometer's temperature measurement, thus affecting the accuracy.

[0003] Currently, some base support components include a base shaft and a substrate lifting component. The base shaft includes a support column and multiple extension arms extending outward from the support column. Thus, during the rotation of the base support component, the extension arms periodically pass through the space between the back of the base and the infrared pyrometer, interfering with the infrared emission from the back of the base and affecting temperature measurement accuracy. Furthermore, during the lifting and lowering of the support shaft, the volume within the chamber changes, affecting the internal air pressure and thus placing an additional load on the substrate lifting component. Summary of the Invention

[0004] The purpose of this application is to provide a support device and semiconductor process equipment that can at least solve the problems of the extension arm periodically blocking infrared emission and affecting the temperature measurement accuracy, as well as the additional load brought about by the lifting process of the support shaft.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides a support device for use in the process chamber of semiconductor process equipment. The support device includes: a base, a support shaft, a drive mechanism, and a temperature measuring mechanism.

[0007] The base has a bearing surface and a temperature measuring surface arranged opposite to each other, and the bearing surface is used to support the wafer;

[0008] One end of the support shaft is connected to the base, and the support shaft is provided with a first channel extending along its own axis, with one end of the first channel corresponding to the temperature measuring surface;

[0009] The drive mechanism includes a drive assembly and a housing for sealing connection with the process chamber. The drive assembly includes an active drive structure disposed outside the housing and a driven drive structure disposed inside the housing. The support shaft is at least partially disposed inside the housing, and the other end of the support shaft is connected to the driven drive structure. The active drive structure drives the driven drive structure through magnetic coupling to drive the support shaft to move along its own axis and rotate around its own axis.

[0010] The housing is provided with a light-transmitting part along the direction of the first channel, and the other end of the first channel is provided corresponding to the light-transmitting part;

[0011] The temperature measuring mechanism is located outside the housing and is positioned corresponding to the light-transmitting part.

[0012] This application also provides a semiconductor process apparatus, which includes the aforementioned carrier device.

[0013] In this embodiment, the support shaft has a first channel extending along its own axis, and one end of the first channel is corresponding to the temperature measuring surface on the back of the base. To ensure the airtightness of the process chamber, a housing is connected to the bottom of the process chamber. The support shaft is at least partially disposed in the inner cavity of the housing. A light-transmitting part is disposed in the housing along the direction of the first channel. The other end of the first channel is corresponding to the light-transmitting part. The temperature measuring mechanism is disposed outside the housing and is corresponding to the light-transmitting part. Since the light-transmitting part has good light transmittance in the infrared band, the infrared rays on the back of the base are transmitted through the first channel and emitted by the light-transmitting part. At this time, the infrared rays transmitted through the light-transmitting part can be received by the temperature measuring mechanism, thereby realizing the temperature measurement of the temperature measuring surface of the base.

[0014] Furthermore, the drive assembly includes a magnetically coupled active drive structure and a driven drive structure. The active drive structure is disposed outside the housing, and the driven drive structure is disposed inside the housing cavity. The other end of the support shaft is connected to the driven drive structure. Thus, the active drive structure can drive the support shaft to move along its own axis and rotate around its own axis through the driven drive structure.

[0015] Based on the above configuration, this embodiment uses the first channel of the support shaft as the infrared propagation channel, thereby forming an infrared temperature measurement optical path along the axial direction of the support shaft. This allows the infrared rays emitted from the temperature measuring surface to propagate along the first channel to the temperature measuring mechanism. Even if the support shaft rotates, it will not interfere with the propagation of the infrared rays. Therefore, the temperature measuring mechanism can effectively measure the temperature of the temperature measuring surface on the back of the base through the first channel, thus ensuring the accuracy of the temperature measurement. At the same time, since the active drive structure and the driven drive structure are magnetically coupled and located outside and inside the housing respectively, when the active drive structure drives the support shaft to move along its own axis through the driven drive structure, it will not change the air pressure inside the housing or even inside the process chamber, thus not adding extra resistance to the movement of the support shaft. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the base support component and the pyrometer in the related technology;

[0017] Figure 2 This is a cross-sectional view of the support device disclosed in the embodiments of this application;

[0018] Figure 3 This is a cross-sectional view of the drive mechanism disclosed in the embodiments of this application.

[0019] Explanation of reference numerals in the attached figures:

[0020] a-Base shaft; b-Base plate lifting component; c-Base; d-Bellwall; e-First arm; f-Infrared pyrometer;

[0021] 10-Base; 11-Bearing surface; 12-Temperature measuring surface;

[0022] 20-Support shaft; 21-First shaft body; 211-First channel; 22-First support arm; 23-Support column;

[0023] 30 - Lifting axis; 31 - Second axis; 311 - Second channel; 32 - Second support arm; 33 - Lifting bar;

[0024] 40-Drive mechanism; 41-Housing; 411-Sealing cylinder; 412-Annular seal; 413-Sealing plate; 414-First sealing element; 415-Second sealing element; 42-Drive assembly; 421-First lifting drive component; 4211-First linear module; 4212-First frame; 4213-Second frame; 4214-Third frame; 422-Rotary drive component; 4221-Rotary drive element; 4222-First magnetic rotating element; 4223-Second magnetic rotating element; 4231-First bearing; 4232-Second bearing; 424-Second lifting drive component; 4241-Second linear module; 4242-First magnetic element; 4243-Second magnetic element; 425-First annular support; 426-Second annular support; 43-Fixed bracket; 441-First guide rail; 442-Second guide rail;

[0025] 50 - Temperature measuring mechanism; 51 - Temperature measuring element; 52 - Shielding cover. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0029] refer to Figure 1 A base support component in related technology includes a base shaft a and a substrate lifting component b. The base shaft a includes a solid first support column and a plurality of first arms e extending radially from the first support column. The substrate lifting component b includes a second support column and a plurality of second arms extending radially from the second support column. Its temperature measurement path is as follows... Figure 1The dotted line in the diagram represents the temperature of the back of the base c measured via a side optical path. During the lifting and lowering process, the two shafts are raised and lowered by the extension and retraction of the two bellows d at the bottom, while the base shaft a can also be rotated by the bottom rotating mechanism.

[0030] However, when the base support component is in normal use, the multiple first arms e of the base shaft a will interfere with the infrared emission on the back of the base c, affecting the temperature measurement accuracy of the infrared pyrometer f located on the lower side of the base support component; in addition, the overall volume of the chamber will change during the lifting process of the bellows d type lifting mechanism, which will also affect the temperature measurement accuracy of the infrared pyrometer f, and the air pressure inside the chamber will bring additional load to the lifting motor, and the moving bellows d is also prone to accumulating dirt and stirring up dust particles.

[0031] Based on this, this application provides a support device to overcome the above problems, as detailed below.

[0032] refer to Figure 2 and Figure 3 This application discloses a carrier device applied to the process chamber of a semiconductor process equipment. The carrier device can carry a wafer so that the wafer can undergo the corresponding process flow in the inner cavity of the process chamber to realize the processing of the wafer.

[0033] The disclosed support device includes a base 10, a support shaft 20, a drive mechanism 40, and a temperature measuring mechanism 50. The base 10 supports the wafer, and the support shaft 20 connects to the base 10, providing support and also rotating the base 10 to improve wafer uniformity and thus processing accuracy. The drive mechanism 40 provides at least the driving force for the rotation of the base 10.

[0034] The base 10 has a bearing surface 11 and a temperature measuring surface 12, with the bearing surface 11 and the temperature measuring surface 12 arranged opposite to each other. The bearing surface 11 is used to support the wafer, and the temperature measuring surface 12 is used for temperature measurement. When the support device is in use, the bearing surface 11 is located at the top of the base 10, and the temperature measuring surface 12 is located at the bottom of the base 10.

[0035] One end of the support shaft 20 is connected to the base 10. Optionally, the support shaft 20 may include a first shaft body 21, a first support arm 22, and a support column 23. Multiple first support arms 22 are provided on the outer wall of the first shaft body 21, extending radially outward along the first shaft body 21, thereby increasing the contact area between the support shaft 20 and the base 10 to ensure the stability and firmness of the connection between them. Each support arm has a support column 23 at its end facing away from the first shaft body 21. The support column 23 is parallel to the first shaft body 21, thus connecting the first support arm 22 to the base 10 via the support column 23.

[0036] Optionally, multiple mounting holes can be opened circumferentially at the bottom of the base 10, and multiple support columns 23 can be assembled into the multiple mounting holes one by one, thereby realizing the connection between the support columns 23 and the base 10.

[0037] To form an infrared temperature measurement optical path, the support shaft 20 is provided with a first channel 211 extending along its own axis, one end of which is correspondingly positioned with respect to the temperature measuring surface 12. Specifically, the first shaft 21 is hollowed out along its axis, forming a hollow shaft structure. The hollow cavity of the first shaft 21 is positioned opposite to the back of the base 10, i.e., the temperature measuring surface 12. This ensures that the infrared rays emitted by the temperature measuring surface 12 can propagate along the first channel 211 in a direction away from the temperature measuring surface 12, so that the temperature measuring mechanism 50 can receive them.

[0038] To ensure the process chamber remains sealed during the process and to allow the base 10 to rotate, the drive mechanism 40 in this embodiment includes a drive assembly 42 and a housing 41, wherein the housing 41 is sealed to the process chamber. Optionally, one end of the housing 41 is open and connected to the bottom of the process chamber, communicating with the process chamber through the opening so that the support shaft 20 can pass into the process chamber. To ensure sealing, a sealing structure can also be provided between the housing 41 and the process chamber to ensure the sealing at the connection point.

[0039] When setting the support shaft 20, one end of the support shaft 20 can be inserted into the inner cavity of the process chamber to support the base 10 located in the inner cavity of the process chamber, while at least a portion of the other end of the support shaft 20 is located in the inner cavity of the housing 41. In this way, the support shaft 20 can be located in the inner cavity of the interconnected process chamber and the inner cavity of the housing 41, thereby ensuring that the inner cavity of the process chamber is not connected to the external environment and ensuring the airtightness of the process chamber.

[0040] In order for the infrared rays transmitted through the first channel 211 to be received by the temperature measuring mechanism 50, in this embodiment of the application, a light-transmitting portion is provided on the housing 41 along the direction extending from the first channel 211, and the other end of the first channel 211 is correspondingly disposed with respect to the light-transmitting portion. The temperature measuring mechanism 50 is disposed outside the housing 41 and is correspondingly disposed with respect to the light-transmitting portion. In this way, the infrared rays emitted by the temperature measuring surface 12 of the base 10 can be transmitted along the first channel 211 to the light-transmitting portion. At this time, the infrared rays can be received simply by aligning the temperature measuring mechanism 50 with the light-transmitting portion, thereby realizing the temperature measurement of the temperature measuring surface 12 of the base 10.

[0041] In this embodiment, the infrared rays emitted by the temperature measuring surface 12 of the base 10 can be transmitted to the light-transmitting part through the first channel 211, so that the temperature measuring mechanism 50 can receive the infrared rays at the light-transmitting part, thereby realizing the temperature measurement of the temperature measuring surface 12 of the base 10.

[0042] To enable the base 10 to rotate and lift, the drive assembly 42 is at least partially disposed in the inner cavity of the housing 41 and connected to the support shaft 20. The drive assembly 42 can drive the support shaft 20 to move along its own axis and rotate around its own axis to meet process requirements.

[0043] In some embodiments, the drive assembly 42 includes an active drive structure disposed outside the housing 41 and a driven drive structure disposed inside the housing 41. The other end of the support shaft 20 is connected to the driven drive structure, and the active drive structure is magnetically coupled to the driven drive structure, thereby driving the driven drive structure to move and, through the driven drive structure, driving the support shaft to move along its own axis and rotate around its own axis.

[0044] The specific structures and connection methods of the active and passive drive structures will be described in detail below.

[0045] Based on the above configuration, in this embodiment, the first channel 211 of the support shaft 20 is used as the infrared transmission channel, thereby forming an infrared temperature measurement optical path along the axial direction of the support shaft 20. The infrared rays emitted from the temperature measuring surface 12 are transmitted to the temperature measuring mechanism 50 along the first channel 211. Since the first channel 211 extends along the axial direction of the support shaft 20, it will not be blocked by the arm connected to the support shaft 20. Therefore, even if the support shaft 20 rotates, it will not interfere with the transmission of infrared rays. Thus, the temperature measuring mechanism 50 can effectively measure the temperature of the temperature measuring surface 12 on the back of the base 10 through the first channel 211, thereby ensuring the accuracy of the temperature measurement.

[0046] Meanwhile, since the active drive structure and the driven drive structure are magnetically coupled and located outside and inside the housing 41 respectively, when the active drive structure drives the support shaft 20 to move along its own axis through the driven drive structure, the air pressure inside the housing 41 or even inside the process chamber will not be changed, thereby further ensuring the accuracy of temperature measurement and not adding extra resistance to the movement of the support shaft 20.

[0047] To achieve the lifting and rotation of the base 10, the active drive structure may include a first lifting drive component 421 and a rotation drive component 422, while the driven structure may include a first driven structure. The output end of the rotation drive component 422 is magnetically coupled to the first driven structure, which is connected to the support shaft 20 to drive the support shaft 20 to rotate around its own axis. The support shaft 20 then drives the base 10 to rotate synchronously, allowing the wafers supported on the bearing surface 11 of the base 10 to rotate with the base 10, thus ensuring the uniformity of wafer processing.

[0048] The first lifting drive component 421 is connected to the rotation drive component 422 to drive the rotation drive component 422 and the support shaft 20 to move along the axial direction of the support shaft 20.

[0049] To drive the support shaft 20 to rotate, in some embodiments, the rotation drive component 422 may include a rotation drive element 4221 and a first magnetic rotating element 4222, while the first driven structure includes a second magnetic rotating element 4223. The rotation drive element 4221 is driveably connected to the first magnetic rotating element 4222, and the first magnetic rotating element 4222 is magnetically coupled to the second magnetic rotating element 4223. The first magnetic rotating element 4222 is rotatably disposed outside the housing 41, and the second magnetic rotating element 4223 is rotatably disposed inside the housing 41 and connected to the support shaft 20.

[0050] It should be noted that the first magnetic rotating component 4222 and the second magnetic rotating component 4223 can have opposite polarities, allowing them to couple together through magnetic attraction, thereby transmitting motion and power. Alternatively, the first magnetic rotating component 4222 and the second magnetic rotating component 4223 can have the same polarity, allowing them to couple through magnetic repulsion, thus transmitting motion and power.

[0051] Optionally, the rotary drive 4221 can be a rotary motor, which can drive the first magnetic rotary element 4222 to rotate. Both the first magnetic rotary element 4222 and the second magnetic rotary element 4223 can be magnetic transmission wheels. Due to the magnetic coupling between the two, when the first magnetic rotary element 4222 is driven by the rotary drive 4221, it can drive the second magnetic rotary element 4223 to rotate, thereby driving the support shaft 20 to rotate through the second magnetic rotary element 4223, and finally driving the base 10 to rotate through the support shaft 20.

[0052] Based on the above configuration, through the magnetic coupling between the first magnetic rotating component 4222 and the second magnetic rotating component 4223, the first magnetic rotating component 4222 located outside the housing 41 can transmit power and motion to the second magnetic rotating component 4223 located inside the housing 41. Thus, the transmission of power and motion between the first magnetic rotating component 4222 and the second magnetic rotating component 4223 can be achieved without opening a clearance space on the housing 41, thereby ensuring the sealing of the housing 41 and even the process chamber. At the same time, the base 10 can also be rotated.

[0053] To achieve the lifting and lowering of the support shaft 20, in some embodiments, the first lifting drive component 421 includes a first linear module 4211 and a first frame 4212, while the first driven structure includes a second frame 4213. The first linear module 4211 is connected to the first frame 4212. The first frame 4212 is disposed outside the housing 41 and is movable relative to the housing 41 along the axial direction of the support shaft 20. A first magnetic rotating component 4222 is rotatably connected to the first frame 4212. The second frame 4213 is disposed inside the housing 41 and is movable relative to the housing 41 along the axial direction of the support shaft 20. A second magnetic rotating component 4223 is rotatably connected to the second frame 4213.

[0054] To prevent magnetic interference, both the first frame 4212 and the second frame 4213 can be made of non-magnetic metallic materials.

[0055] In some embodiments, the first linear module 4211 may include a drive motor, a lead screw, and a slider. The drive motor's shaft is connected to the lead screw, the slider is threadedly connected to the lead screw, and the slider is fixedly connected to the first frame 4212. Thus, the drive motor can drive the slider and the first frame 4212 connected to the slider to move via the lead screw, thereby causing the first frame 4212 to reciprocate along the axial direction of the support shaft 20. Furthermore, through the magnetic coupling of the first magnetic rotating member 4222 and the second magnetic rotating member 4223, the support shaft 20 is driven to reciprocate along its own axial direction, ultimately achieving the lifting and lowering of the base 10.

[0056] In other embodiments, the first linear module 4211 may also be in other forms, such as a cylinder, a hydraulic cylinder, an electric cylinder, etc. The specific form of the first linear module 4211 is not limited in the embodiments of this application.

[0057] The first frame 4212 can be a ring structure, which is sleeved on the outside of the housing 41 and can move relative to the housing 41. In order to install the first magnetic rotating member 4222, a first annular groove can be opened on the first frame 4212, the first magnetic rotating member 4222 is placed in the first annular groove, and the first magnetic rotating member 4222 can rotate in the first annular groove.

[0058] To install the first magnetic rotating component 4222 into the first annular groove, the first frame 4212 can be designed as a split structure, specifically including an L-shaped annular frame structure and an annular plate. When installing the first magnetic rotating component 4222, the annular plate is separated from the annular frame structure, and then the first magnetic rotating component 4222 is placed inside the annular frame structure. The annular plate is then placed over one end face of the annular frame structure, thus forming the first annular groove together with the annular plate, thereby achieving the installation of the first magnetic rotating component 4222.

[0059] To ensure smooth movement of the first frame 4212, a first guide rail 441 can be provided on the outer wall of the housing 41 along the axis of the support shaft 20, and the inner side of the first frame 4212 can be slidably connected to the first guide rail 441. This ensures smooth movement of the first frame 4212 outside the housing 41. Optionally, the inner end face of the annular frame structure can be slidably connected to the first guide rail 441, and the annular plate can be spaced apart from the first guide rail 441.

[0060] In some embodiments, the second frame 4213 may also be an annular structure, disposed inside the housing 41, and movable relative to the housing 41 within the inner cavity of the housing 41. To mount the second magnetic rotating member 4223, a second annular groove may be formed on the second frame 4213, the second magnetic rotating member 4223 may be disposed in the second annular groove, and the second magnetic rotating member 4223 may rotate within the second annular groove.

[0061] Optionally, the second frame 4213 can be a single piece. In this case, to install the second magnetic rotating member 4223 into the second annular groove, the diameter of the opening at one end of the second frame 4213 can be increased to ensure that the second magnetic rotating member 4223 can be placed in the second annular groove. At the same time, it can also ensure that the support shaft 20 can pass through the second frame 4213 and connect with the second magnetic rotating member 4223.

[0062] Based on this, the cross-section of the second frame 4213 can be designed as a C-shaped structure, with one end of the C-shaped structure being shorter than the other end, thus forming a ring structure with a large opening at one end and a small opening at the other end, which facilitates the installation of the second magnetic rotating component 4223.

[0063] In order to enable the second frame 4213 to move smoothly, a second guide rail 442 can be provided on the inner wall of the housing 41 along the axis of the support shaft 20, and the outer side of the second frame 4213 can be slidably connected to the second guide rail 442. In this way, the second frame 4213 can be guaranteed to move smoothly inside the housing 41.

[0064] In some embodiments, the first magnetic rotating member 4222 is a magnetic gear sleeve, and correspondingly, the rotating driving member 4221 has an output gear, which meshes with the magnetic gear sleeve, thereby enabling the transmission of power and motion.

[0065] In order to connect the second magnetic rotating component 4223 with the support shaft 20, in some embodiments, the second magnetic rotating component 4223 is a magnetic ring. The end of the support shaft 20 away from the base 10 is inserted into the magnetic ring and connected accordingly, so that the second magnetic rotating component 4223 can drive the support shaft 20 to rotate.

[0066] To enable relative rotation between the magnetic gear sleeve and the first frame 4212, bearings can be used to connect the magnetic gear sleeve to the first frame 4212 at its two axially opposite end faces. Optionally, the first frame 4212 has a first annular groove with an upper and lower wall surface opposite to each other. When the magnetic gear sleeve is placed in the first annular groove, a first bearing 4231 is provided between one end face of the magnetic gear sleeve and the upper wall surface, and between the other end face of the magnetic gear sleeve and the lower wall surface. In this way, the magnetic gear sleeve can be fitted into the first annular groove through the first bearing 4231, and the first bearing 4231 can support the two end faces of the magnetic gear sleeve and ensure that the magnetic gear sleeve can rotate freely.

[0067] Similarly, to achieve relative rotation between the magnetic ring and the second frame 4213, bearings can be used to connect the magnetic ring to the second frame 4213 at its two axially opposite end faces. Optionally, the second frame 4213 can be provided with a second annular groove, which has an upper wall and a lower wall facing each other. When the magnetic ring is placed in the second annular groove, a second bearing 4232 is provided between one end face of the magnetic ring and the upper wall, and between the other end face of the magnetic ring and the lower wall. In this way, the magnetic ring can be fitted into the second annular groove through the second bearing 4232, and the second bearing 4232 can support the two end faces of the magnetic ring and ensure that the magnetic ring can rotate freely.

[0068] In order to connect the rotary drive component 422 with the first lifting drive component 421, in some embodiments, the first lifting drive component 421 may further include a third frame 4214, which is connected to the first frame 4212. The rotary drive component 4221 in the rotary drive component 422 is disposed on the third frame 4214. In this way, the rotary drive component 422 can be connected to the first frame 4212 through the third frame 4214. Thus, when the first frame 4212 moves along the axis of the support shaft 20, the rotary drive component 4221 can be driven to move synchronously through the third frame 4214, so as to ensure that the rotary drive component 4221 can be connected to the first magnetic rotary component 4222 disposed on the first frame 4212.

[0069] Since the output end of the rotary drive 4221 (i.e., the output gear) is located in the inner cavity of the third frame 4214, and the first magnetic rotating member 4222 is located in the inner cavity of the first frame 4212, in order to enable the rotary drive 4221 and the first magnetic rotating member 4222 to be connected in transmission, a clearance hole can be provided on the side wall of the first frame 4212. The inner cavity of the first frame 4212 and the inner cavity of the third frame 4214 can be connected through the clearance hole, so that the output gear and the first magnetic rotating member 4222 can be connected in transmission through the clearance hole, thereby ensuring the transmission of rotational power and ultimately realizing the rotation of the support shaft 20 and the base 10 connected to the support shaft 20.

[0070] Based on the above configuration, the first magnetic rotating component 4222, the second magnetic rotating component 4223, and the rotary drive component 4221 are respectively installed in the first frame 4212, the second frame 4213, and the third frame 4214. Under the driving action of the first linear module 4211, the first frame 4212 and the first magnetic rotating component 4222 can move along the axial direction of the support shaft 20. Under the action of magnetic force, the second magnetic rotating component 4223 and the second frame 4213 can move synchronously, and the third frame 4214 and the rotary drive component 4221 can also move synchronously. This can provide driving force for the support shaft 20, ensuring that the support shaft 20 can both lift and rotate without interference, and also ensuring the sealing of the process chamber.

[0071] In order to enable the wafer to be placed on or removed from the support surface 11, the support device may also include a lifting shaft 30 for lifting the wafer. By moving the lifting shaft 30, the wafer can be moved, thereby placing the wafer on or lifting it from the support surface 11.

[0072] In some embodiments, the lifting shaft 30 is at least partially disposed within the inner cavity of the housing 41. Simultaneously, a second channel 311 extending along its own axial direction is provided on the lifting shaft 30 and sleeved on the outside of the support shaft 20, allowing the support shaft 20 to pass through and at least partially exit the second channel 311. This achieves assembly between the support shaft 20 and the lifting shaft 30, ensuring that the support shaft 20 and the lifting shaft 30 are collinear. Therefore, the support shaft 20 can rotate and move up and down within the second channel 311 of the lifting shaft 30 without interference from the lifting shaft 30, while the lifting shaft 30 can also move freely up and down without interference from the support shaft 20.

[0073] It should be noted that one end of the support shaft 20 located inside the housing 41 is passed through the corresponding end of the lifting shaft 30, so that the support shaft 20 can be connected to the second magnetic rotating member 4223.

[0074] Optionally, the lifting shaft 30 may include a second shaft 31, a plurality of second arms 32 connected to the outer wall of the second shaft 31 and extending radially, and lifting rods 33 corresponding to each of the second arms 32. The second shaft 31 is a hollow shaft structure with a second channel 311 for the support shaft 20 to pass through. The multiple lifting rods 33 are movably mounted on the first arms 22 and correspond to each of the second arms 32. Simultaneously, the base 10 has through holes corresponding to each of the lifting rods 33, allowing the lifting rods 33 to pass through the through holes and contact the wafer. Thus, when the wafer needs to be lifted, the second shaft 31 can move along its own axis and abut against the corresponding lifting rods 33 via the multiple second arms 32, thereby lifting the wafer with the lifting rods 33 to place it on or lift it from the bearing surface 11.

[0075] To enable the lifting shaft 30 to move, the active drive structure may further include a second lifting drive component 424, and the driven structure includes a second driven structure. The output end of the second lifting drive component 424 is magnetically coupled to the second driven structure. The second driven structure is connected to the lifting shaft 30 to drive the lifting shaft 30 to reciprocate along its own axis, thereby lifting the wafer and placing it on or away from the support surface 11.

[0076] Based on this, the drive mechanism 40 can drive the support shaft 20 to rotate and lift, and also drive the lifting shaft 30 to lift, thus realizing multiple functions. Compared with using multiple drive parts, it can reduce the number of parts, reduce the structural complexity of the load-bearing device, and save costs.

[0077] In some embodiments, the second lifting drive component 424 may include a second linear module 4241 and a first magnetic element 4242, while the second driven structure includes a second magnetic element 4243. The second linear module 4241 is connected to the first magnetic element 4242, the first magnetic element 4242 is magnetically coupled to the second magnetic element 4243, and the lifting shaft 30 is connected to the second magnetic element 4243. Thus, under the driving action of the second linear module 4241, the first magnetic element 4242 can move with the second linear module 4241, and under the action of magnetic force, the second magnetic element 4243 can move with the first magnetic element 4242. Therefore, the second magnetic element 4243 can drive the lifting shaft 30 to move relative to the support shaft 20, thereby achieving the lifting effect on the wafer.

[0078] It should be noted that the first magnetic component 4242 and the second magnetic component 4243 have opposite polarities, allowing them to couple together through magnetic attraction, thereby transmitting motion and power to achieve a coordinated lifting and lowering effect. Alternatively, the first magnetic component 4242 and the second magnetic component 4243 can also have the same polarity, allowing them to couple through magnetic repulsion, thus transmitting motion and power.

[0079] In some embodiments, the second linear module 4241 may include a drive motor, a lead screw, and a slider. The drive motor shaft is connected to the lead screw, the slider is threadedly connected to the lead screw, and the slider is fixedly connected to the first magnetic element 4242. Thus, the drive motor can drive the slider and the first magnetic element 4242 connected to the slider to move via the lead screw, thereby causing the first magnetic element 4242 to reciprocate along the axial direction of the lifting shaft 30. Through the magnetic coupling of the first magnetic element 4242 and the second magnetic element 4243, the lifting shaft 30 is driven to reciprocate along its own axial direction, ultimately achieving the lifting and lowering of the lifting shaft 30.

[0080] In other embodiments, the second linear module 4241 may also be in other forms, such as a cylinder, a hydraulic cylinder, an electric cylinder, etc. The specific form of the second linear module 4241 is not limited in the embodiments of this application.

[0081] In some embodiments, the first magnetic element 4242 and the second magnetic element 4243 are both magnetic rings. The first magnetic element 4242 is sleeved on the outside of the housing 41, and the second magnetic element 4243 is disposed in the inner cavity of the housing 41 and sleeved on the outside of the lifting shaft 30.

[0082] To ensure smooth and stable movement of the first magnetic component 4242 and the second magnetic component 4243, the first magnetic component 4242 is slidably connected to the outer wall of the housing 41, and the second magnetic component 4243 is slidably connected to the inner wall of the housing 41. Optionally, a third guide rail can be provided on the outer wall of the housing 41 along the axis of the lifting shaft 30, and the inner side of the first magnetic component 4242 is slidably connected to the third guide rail, thereby ensuring smooth and stable movement of the first magnetic component 4242 outside the housing 41. Similarly, a fourth guide rail can be provided on the inner wall of the housing 41 in the opposite direction along the axis of the lifting shaft 30, and the outer side of the second magnetic component 4243 is slidably connected to the fourth guide rail, thereby ensuring smooth and stable movement of the second magnetic component 4243 inside the housing 41.

[0083] It should be noted that the third guide rail here and the first guide rail 441 mentioned above can be two independent guide rails, or they can be the same guide rail; similarly, the fourth guide rail here and the second guide rail 442 mentioned above can be two independent guide rails, or they can be the same guide rail.

[0084] In order to make the connection between the rotary drive component 422 and the support shaft 20 more stable and firm, the drive assembly 42 also includes a first annular support 425, the first annular support 425 and the second magnetic rotating component 4223, and the first annular support 425 is sleeved on the end of the support shaft 20 away from the base 10.

[0085] Optionally, the first annular support 425 is fixed on the second magnetic rotating member 4223, and the two are coaxially arranged. When the other end of the support shaft 20 is inserted into the second magnetic rotating member 4223, on the one hand, the outer wall of the support shaft 20 abuts against the inner side of the second magnetic rotating member 4223 to ensure the fit and connection between the support shaft 20 and the second magnetic rotating member 4223. On the other hand, the outer wall of the support shaft 20 also abuts against the inner side wall of the first annular support 425 to ensure the fit and connection between the support shaft 20 and the first annular support 425.

[0086] Furthermore, an anti-slip structure, such as a rough surface or an anti-slip pad, is provided on the inner side wall of the first annular support 425, thereby increasing the frictional resistance between the first annular support 425 and the support shaft 20, thus ensuring that the support shaft 20 will not detach from the second magnetic rotating member 4223 and will not rotate relative to the second magnetic rotating member 4223.

[0087] Based on the above configuration, the connection between the second magnetic rotating component 4223 and the support shaft 20 can be strengthened and stabilized by the first annular support 425.

[0088] In order to make the connection between the second lifting drive component 424 and the lifting shaft 30 more stable and secure, the drive assembly 42 also includes a second annular support 426. The second annular support 426 is connected to the second magnetic component 4243, and the second annular support 426 is sleeved on the end of the lifting shaft 30 away from the base 10.

[0089] Optionally, the second annular support 426 is fixed on the second magnetic component 4243, and the two are coaxially arranged. When the other end of the lifting shaft 30 is inserted into the second magnetic component 4243, on the one hand, the outer wall of the lifting shaft 30 abuts against the inner side of the second magnetic component 4243 to ensure the cooperative connection between the lifting shaft 30 and the second magnetic component 4243. On the other hand, the outer wall of the lifting shaft 30 abuts against the inner side wall of the second annular support 426 to ensure the cooperative connection between the lifting shaft 30 and the second annular support 426.

[0090] Furthermore, an anti-slip structure, such as a rough surface or an anti-slip pad, is provided on the inner side wall of the second annular support 426, thereby increasing the frictional resistance between the second annular support 426 and the lifting shaft 30, thus ensuring that the lifting shaft 30 will not detach from the second magnetic component 4243 and will not rotate relative to the second magnetic component 4243.

[0091] Based on the above configuration, the second annular support 426 can increase the firmness and stability of the connection between the second magnetic component 4243 and the lifting shaft 30.

[0092] To ensure the airtightness and light transmittance of the housing 41, the housing 41 includes a sealing cylinder 411, a sealing plate 413 and an annular seal 412. The light-transmitting part is formed on the sealing plate 413, and the annular seal 412 is used to seal the sealing plate 413 to the end of the sealing cylinder 411 away from the base 10.

[0093] Optionally, the sealing cylinder 411 is a cylindrical structure open at both ends. One end is connected to the bottom of the process chamber, and the other end is provided with an annular seal 412. The sealing plate 413 can be installed at the other end of the sealing cylinder 411 through the annular seal 412. In this way, the sealing performance at the other end of the housing 41 can be guaranteed, and the light-transmitting performance can be achieved through the light-transmitting part, so that the infrared rays transmitted along the first channel 211 can be emitted through the light-transmitting part and received by the temperature measuring mechanism 50.

[0094] In some embodiments, the cross-section of the annular seal 412 is L-shaped, so that one end face of the annular seal 412 forms an annular groove. At this time, the sealing plate 413 can be disposed in the annular groove, and then the annular seal 412 is fixed to the sealing cylinder 411, thereby limiting the sealing plate 413 between the annular seal 412 and the sealing cylinder 411.

[0095] In addition, the light-transmitting part of the sealing plate 413 can be made of a material with better light transmittance, so that infrared rays have excellent transmittance, thereby allowing the infrared rays to be received by the temperature measuring mechanism 50, and thus ensuring the accuracy of temperature measurement.

[0096] To ensure the sealing of the connection area between the housing 41 and the process chamber, the housing 41 also includes a first sealing element 414 and a second sealing element 415. The first sealing element 414 is located in the inner cavity of the process chamber, while the second sealing element 415 is connected to one end of the sealing cylinder 411. Thus, when the housing 41 is connected to the process chamber, the first sealing element 414 and the second sealing element 415 can cooperate to achieve the sealing between the housing 41 and the process chamber, thereby ensuring the smooth operation of the process in the process chamber.

[0097] During temperature measurement, to prevent external light from affecting the temperature measuring mechanism 50 and the light-transmitting part, the temperature measuring mechanism 50 may also include a shielding cover 52. In addition, the temperature measuring mechanism 50 also includes a temperature measuring element 51. One end of the shielding cover 52 is connected to the annular seal 412, and the other end of the shielding cover 52 is connected to the temperature measuring element 51, thereby forming a shielding channel for shielding external light between the housing 41 and the temperature measuring element 51.

[0098] Based on the above configuration, the infrared rays transmitted along the first channel 211 to the light-transmitting part continue to be transmitted along the shielding channel to the temperature measuring element 51, where they are received by the temperature measuring element 51. During this process, the area between the light-transmitting part and the temperature measuring element 51 is surrounded by a shielding cover 52, which can block external light from entering between the light-transmitting part and the temperature measuring element 51, thereby effectively preventing external light from affecting the accuracy of temperature measurement.

[0099] Optionally, the shielding cover 52 can be made of a material that can shield infrared rays in external light to prevent infrared rays from entering between the light-transmitting part and the temperature measuring element 51, thereby ensuring the accuracy of temperature measurement.

[0100] To secure the drive assembly 42, the supporting device may further include a fixing bracket 43, which is fixedly connected to the housing 41. The fixing bracket 43 may be provided with a fixing mounting groove, in which the first lifting drive component 421 and the second lifting drive component 424 are both disposed, to avoid exposure that would affect the appearance and performance, and at the same time, to prevent external factors from interfering with the normal operation of the drive assembly 42.

[0101] Based on the aforementioned carrier device, this application also discloses a semiconductor process apparatus, which includes the aforementioned carrier device.

[0102] In summary, the carrier device in this embodiment can perform more accurate infrared high-temperature measurement on the temperature measuring surface 12 on the back of the base 10. Specifically, the infrared radiation emitted by the temperature measuring surface 12 on the back of the base 10 passes through the first channel 211 and the light-transmitting part with good infrared transmittance and is received by the temperature measuring mechanism 50. After processing by the temperature measuring mechanism 50, an electrical signal corresponding to the temperature can be obtained. The temperature measuring mechanism 50 has a good distance coefficient, that is, the area tested at a greater distance is smaller and its temperature measuring range will not be interfered with.

[0103] In this embodiment, the lifting and rotation of the support shaft 20 and the lifting shaft 30 can be realized through the drive component 42. Compared with the bellows form, the housing 41 can be sealed to the process chamber, and a fully magnetically coupled rotation lifting drive method is adopted. Thus, during the lifting and lowering of the support shaft 20 and the lifting shaft 30, the light-transmitting part is relatively fixed and will not move, ensuring the stability of the temperature measurement optical path, thereby further improving the temperature measurement accuracy. At the same time, compared with the bellows form, it can also avoid changes in atmospheric pressure in the process chamber, thereby avoiding the additional load caused by atmospheric pressure during the lifting and lowering process, and significantly reducing the load on each lifting drive component. Furthermore, the fixed external structure also helps to prevent particles that have been adsorbed and stabilized on the internal surface of the drive component 42 from re-entering the working area of ​​the process chamber, thereby effectively avoiding particle contamination.

[0104] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A support device, applied to a process chamber of semiconductor process equipment, characterized in that, The bearing device includes: a base (10), a support shaft (20), a drive mechanism (40), and a temperature measuring mechanism (50). The base (10) has a bearing surface (11) and a temperature measuring surface (12) arranged opposite to each other, the bearing surface (11) being used to support the wafer; One end of the support shaft (20) is connected to the base (10), and the support shaft (20) is provided with a first channel (211) extending along its own axis, and one end of the first channel (211) is correspondingly provided with the temperature measuring surface (12); The drive mechanism (40) includes a drive assembly (42) and a housing (41) for sealing connection with the process chamber. The drive assembly (42) includes an active drive structure disposed outside the housing (41) and a driven drive structure disposed inside the housing (41). The support shaft (20) is at least partially disposed inside the housing (41). The other end of the support shaft (20) is connected to the driven drive structure. The active drive structure drives the driven drive structure through magnetic coupling to drive the support shaft (20) to move along its own axis and rotate around its own axis. The housing (41) is provided with a light-transmitting part in the direction extending along the first channel (211), and the other end of the first channel (211) is provided corresponding to the light-transmitting part; The temperature measuring mechanism (50) is disposed outside the housing (41) and is disposed corresponding to the light-transmitting part; The active drive structure includes a rotary drive component (422), and the driven drive structure includes a first driven drive structure. The output end of the rotary drive component (422) is magnetically coupled to the first driven drive structure. The first driven drive structure is connected to the support shaft (20) to drive the support shaft (20) to rotate around its own axis. The rotary drive component (422) includes a rotary drive member (4221) and a first magnetic rotary member (4222), and the first driven structure includes a second magnetic rotary member (4223). The rotary drive (4221) is connected to the first magnetic rotary component (4222) in a transmission manner. The first magnetic rotary component (4222) is magnetically coupled to the second magnetic rotary component (4223). The first magnetic rotary component (4222) is rotatably disposed outside the housing (41), and the second magnetic rotary component (4223) is rotatably disposed inside the housing (41) and connected to the support shaft (20).

2. The bearing device according to claim 1, characterized in that, The active drive structure also includes a first lifting drive component (421). The first lifting drive component (421) is connected to the rotary drive component (422) to drive the rotary drive component (422) and the support shaft (20) to move along the axial direction of the support shaft (20).

3. The bearing device according to claim 2, characterized in that, The first lifting drive component (421) includes a first linear module (4211) and a first frame (4212), and the first driven structure further includes a second frame (4213). The first linear module (4211) is connected to the first frame (4212), the first frame (4212) is disposed outside the housing (41) and is movable relative to the housing (41) along the axial direction of the support shaft (20), and the first magnetic rotating component (4222) is rotatably connected to the first frame (4212). The second frame (4213) is disposed in the inner cavity of the housing (41) and is movable relative to the housing (41) along the axial direction of the support shaft (20). The second magnetic rotating member (4223) is rotatably connected to the second frame (4213).

4. The bearing device according to claim 3, characterized in that, The first magnetic rotating component (4222) is a magnetic gear sleeve, and the rotating driving component (4221) has an output gear. The output gear meshes with the magnetic gear sleeve, and the two axially opposite end faces of the magnetic gear sleeve are respectively connected to the first frame (4212) through bearings. And / or, the second magnetic rotating component (4223) is a magnetic ring sleeve, and the two opposite end faces of the magnetic ring sleeve are respectively connected to the second frame (4213) by bearings.

5. The bearing device according to claim 3, characterized in that, The first lifting drive component (421) further includes a third frame (4214), which is connected to the first frame (4212). The side wall of the first frame (4212) is provided with a clearance hole, which connects the inner cavity of the first frame (4212) and the inner cavity of the third frame (4214); The rotary drive (4221) is disposed on the third frame (4214), and the output end of the rotary drive (4221) is located in the inner cavity of the third frame (4214) and is connected to the first magnetic rotary component (4222) through the clearance hole.

6. The bearing device according to claim 2, characterized in that, The support device further includes a lifting shaft (30) for lifting the wafer, the lifting shaft (30) being at least partially disposed in the inner cavity of the housing (41); The lifting shaft (30) is provided with a second channel (311) extending along its own axis and is sleeved on the outside of the support shaft (20); The active drive structure further includes a second lifting drive component (424), and the driven drive structure further includes a second driven drive structure. The output end of the second lifting drive component (424) is magnetically coupled to the second driven drive structure. The second driven drive structure is connected to the lifting shaft (30) to drive the lifting shaft (30) to move along its own axis.

7. The bearing device according to claim 6, characterized in that, The second lifting drive component (424) includes a second linear module (4241) and a first magnetic component (4242). The second linear module (4241) is connected to the first magnetic component (4242). The second driven structure includes a second magnetic component (4243) that is magnetically coupled to the first magnetic component (4242). The first magnetic component (4242) is slidably connected to the outer wall of the housing (41), the second magnetic component (4243) is slidably connected to the inner wall of the housing (41), and the lifting shaft (30) is connected to the second magnetic component (4243).

8. The bearing device according to claim 7, characterized in that, The drive assembly (42) further includes a first annular support (425), which is connected to the second magnetic rotating member (4223), and the first annular support (425) is sleeved on one end of the support shaft (20) away from the base (10); And / or, the drive assembly (42) further includes a second annular support (426), which is connected to the second magnetic element (4243), and the second annular support (426) is sleeved on one end of the lifting shaft (30) away from the base (10).

9. The bearing device according to claim 1, characterized in that, The housing (41) includes a sealing cylinder (411), a sealing plate (413), and an annular seal (412). The light-transmitting portion is formed on the sealing plate (413), and the annular seal (412) is used to seal the sealing plate (413) to one end of the sealing cylinder (411) away from the base (10).

10. The bearing device according to claim 9, characterized in that, The temperature measuring mechanism (50) includes a temperature measuring element (51) and a shield (52). One end of the shield (52) is connected to the annular seal (412), and the other end of the shield (52) is connected to the temperature measuring element (51) to form a shielding channel for shielding external light between the housing (41) and the temperature measuring element (51).

11. A semiconductor process apparatus, characterized in that, Includes the support device according to any one of claims 1 to 10.

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