Design aid, method, system, program

Abstract

The present application provides a kind of design auxiliary device, method, system, program, design auxiliary device has: input unit, for inputting the analysis condition including the substrate information and current detection element information of thermal analysis object;Setting unit, for setting the output form of the thermal analysis result obtained by thermal analysis unit for thermal analysis;And display control unit, control display part, to display the thermal analysis result based on analysis condition in display part with the output form set by setting unit, wherein, display control unit controls display part, to display the first thermal analysis result based on the first analysis condition input by input unit and the second thermal analysis result based on the second analysis condition obtained from the first analysis condition changes at least one of substrate information and current detection element information in display part in a manner that can be mutually identified.

Description

TECHNICAL FIELD

[0001] The present application relates to a design assistance device, a design assistance method, a design assistance system, and a design assistance program. BACKGROUND

[0002] In Patent Literature 1, it is described that "on a layout screen, a heat generating element is laid out on a substrate, a temperature distribution on the substrate is calculated based on the laid-out position, and the temperature distribution on the substrate is displayed, so that heat research can be performed simply."

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2005-84895 SUMMARY

[0006] In the first aspect of the present application, a design assistance device is provided. The design assistance device includes an input unit configured to input analysis conditions including substrate information and current detecting element information of a heat analysis object; a setting unit configured to set an output form of a heat analysis result obtained by a heat analysis unit; and a display control unit configured to control a display section so that the heat analysis result based on the analysis conditions is displayed on the display section in the output form set by the setting unit. The display control unit controls the display section so that a first heat analysis result based on first analysis conditions input by the input unit and a second heat analysis result based on second analysis conditions obtained by changing at least one of the substrate information and the current detecting element information from the first analysis conditions are displayed on the display section in a manner that they can be identified from each other.

[0007] It can be that, in a case where the same substrate information as the first analysis conditions and different current detecting element information from the first analysis conditions are input as the second analysis conditions in a case where the first analysis conditions are input by the input unit, the display control unit controls the display section so that the first heat analysis result and the second heat analysis result are displayed on the display section in a manner that they can be identified from each other.

[0008] It can be that, in a case where different substrate information from the first analysis conditions and the same current detecting element information as the first analysis conditions are input as the second analysis conditions in a case where the first analysis conditions are input by the input unit, the display control unit controls the display section so that the first heat analysis result and the second heat analysis result are displayed on the display section in a manner that they can be identified from each other.

[0009] It can be that the current detecting element information includes a temperature coefficient of resistance of the current detecting element. It can be that the display control unit controls the display section so that the current detecting element information is displayed on the display section.

[0010] The current detection element information can include at least one of a size of the current detection element and a resistance value of the current detection element. The display control unit can control the display unit to display the current detection element information on the display unit.

[0011] The analysis condition can further include environmental information of the thermal analysis target. The environmental information can include at least one of a temperature of an environment of the thermal analysis target, a convective heat transfer rate of the environment, and a radiative heat transfer rate of the environment.

[0012] The substrate related to the thermal analysis target can have one conductor layer or a plurality of conductor layers arranged in a thickness direction of the substrate. The substrate information can include at least one of a number of the conductor layers, a thickness of the conductor layers, and an area of the conductor layers. The display control unit can control the display unit to display the substrate information on the display unit.

[0013] The plurality of conductor layers can have the same shape when viewed from above the substrate.

[0014] In a case where a shape of a first conductor layer of the plurality of conductor layers is different from a shape of a second conductor layer when viewed from above the substrate, the substrate information can include information of the first conductor layer and information of the second conductor layer.

[0015] The environmental information can include at least one of a surface state of the substrate and a configuration direction of the substrate.

[0016] The environmental information can further include a value of an effective current flowing in the conductor layer.

[0017] The input unit can input first information selected from the substrate information, the current detection element information, and the environmental information, and second information different from the first information. The setting unit can set an output form to a form showing a relationship between the first information and the second information. The display control unit can control the display unit to display the first thermal analysis result and the second thermal analysis result in the form set by the setting unit.

[0018] In a case where the thermal analysis unit has performed thermal analysis on the thermal analysis target, the setting unit can set the form showing the relationship between the first information and the second information to be unchangeable.

[0019] In a case where the setting unit sets the form showing the relationship between the first information and the second information to be unchangeable, in a case where the input unit inputs third information selected from the substrate information, the current detection element information, and the environmental information, and different from the first information and different from the second information, the display control unit can control the display unit to display a warning on the display unit.

[0020] The setting unit can set the form showing the relationship between the first information and the second information to be changeable in a case where the input unit inputs the form of the initialization.

[0021] The setting unit can set the output form from the form showing the relationship between the first information and the second information to a form showing a relationship between third information and the second information in a case where the input unit inputs the third information selected from the substrate information, the current detecting element information, and the environmental information, the third information being different from the first information and different from the second information. The display control unit can control the display section to display the first thermal analysis result and the second thermal analysis result in the form showing the relationship between the third information and the second information.

[0022] The thermal analysis unit can perform thermal analysis on the thermal analysis target each time the second analysis condition is input by the input unit. The display control unit can control the display section to display the second thermal analysis result on the display section each time the thermal analysis unit performs thermal analysis on the thermal analysis target.

[0023] The display control unit can control the display section to display the second thermal analysis result while the display section displays the first thermal analysis result.

[0024] The display control unit can control the display section to display the first analysis condition and the second analysis condition, and the display control unit can control the display section to display the difference between the first analysis condition and the second analysis condition in a manner that is mutually recognizable.

[0025] The input unit can input at least one of first current detecting element information and second current detecting element information, the first current detecting element information being current detecting element information related to a first current detecting element, and the second current detecting element information being current detecting element information related to a second current detecting element different from the first current detecting element. The thermal analysis unit can perform thermal analysis on the thermal analysis target based on the first analysis condition including the first current detecting element information in a case where the input unit inputs a start of the thermal analysis on the thermal analysis target including the first current detecting element. The thermal analysis unit can perform thermal analysis on the thermal analysis target based on the second analysis condition including the second current detecting element information in a case where the input unit inputs a start of the thermal analysis on the thermal analysis target including the second current detecting element.

[0026] In the second aspect of the present application, a design assistance method is provided. The design assistance method can include: an analysis condition input step in which an input unit inputs analysis conditions including substrate information and current detecting element information of a heat analysis target; an output form setting step in which a setting unit sets an output form of a heat analysis result obtained by a heat analysis unit; and a display step in which a display control unit displays the heat analysis result based on the analysis conditions in the output form set in the output form setting step on a display section. The display step can be a step in which a first heat analysis result based on first analysis conditions input in the analysis condition input step and a second heat analysis result based on second analysis conditions obtained by changing at least one of the substrate information and the current detecting element information from the first analysis conditions are displayed on the display section in a manner in which they can be identified from each other.

[0027] The current detecting element information can include a temperature coefficient of resistance of the current detecting element.

[0028] The analysis conditions can further include environmental information of the heat analysis target. The environmental information can include at least one of a temperature of an environment of the heat analysis target, a convective heat transfer rate of the environment, and a radiative heat transfer rate of the environment.

[0029] The design assistance method can further include an output form input step in which the input unit inputs first information selected from among the substrate information, the current detecting element information, and the environmental information and second information different from the first information. The output form setting step can be a step in which the output form is set to a form showing a relationship between the first information and the second information.

[0030] The analysis condition input step can be a step in which the input unit inputs at least one of first current detection element information and second current detection element information, the first current detection element information being current detection element information about a first current detection element, and the second current detection element information being current detection element information about a second current detection element different from the first current detection element. The design assistance method can further include a start input step in which the input unit inputs a start of thermal analysis on a thermal analysis object including the first current detection element or a thermal analysis object including the second current detection element, and a thermal analysis step in which the thermal analysis unit performs thermal analysis on the thermal analysis object. In a case where the input unit inputs the start of thermal analysis on the thermal analysis object including the first current detection element in the start input step, the thermal analysis unit can perform thermal analysis on the thermal analysis object based on first analysis conditions including the first current detection element information. In a case where the input unit inputs the start of thermal analysis on the thermal analysis object including the second current detection element in the start input step, the thermal analysis unit can perform thermal analysis on the thermal analysis object based on second analysis conditions including the second current detection element information.

[0031] The thermal analysis step can include a first thermal analysis step in which the thermal analysis unit performs thermal analysis on the thermal analysis object based on the first analysis conditions, and a second thermal analysis step in which the thermal analysis unit performs thermal analysis on the thermal analysis object based on the second analysis conditions. The design assistance method can further include a judgment step in which the control unit judges whether to return to the analysis condition input step after the first thermal analysis step. In a case where the control unit judges to return to the analysis condition input step in the judgment step, the thermal analysis unit can perform the second thermal analysis step.

[0032] In a third aspect of the present application, a design assistance program is provided. The design assistance program is for causing a computer to function as a design assistance device.

[0033] In a fourth aspect of the present application, a design assistance system is provided. The design assistance system includes a design assistance device, a thermal analysis unit, a display unit, and a storage unit. The storage unit stores at least one of substrate information, current detection element information, and a thermal analysis result.

[0034] Furthermore, the above-described summary of the application is not intended to list all essential features of the application. In addition, sub-combinations of these feature groups can also constitute the application. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 FIG. 1 is a diagram illustrating an example of a thermal analysis object 41 according to an embodiment of the present application.

[0036] Figure 2 is a view showing a cross section of the substrate 42 passing through the a-a' line in Figure 1 .

[0037] Figure 3 is a view showing the thermal analysis object 141 according to an embodiment of the present application.

[0038] Figure 4 is a view showing an example of the design support system 200 according to an embodiment of the present application.

[0039] Figure 5 is a view showing an example of a display mode in which the display section 50 displays.

[0040] Figure 6 is an enlarged view of the output form input section 51 and the analysis condition input section 59 in Figure 5 .

[0041] Figure 7 is an enlarged view of the thermal analysis execution section 56, the save execution section 57, and the thermal analysis result display section 58 in Figure 5 .

[0042] Figure 8 is an enlarged view of the thermal analysis result display section 58 shown in Figure 5 .

[0043] Figure 9 is another enlarged view of the thermal analysis result display section 58 shown in Figure 5 .

[0044] Figure 10 is another enlarged view of the thermal analysis result display section 58 shown in Figure 5 .

[0045] Figure 11 is another enlarged view of the thermal analysis result display section 58 shown in Figure 5 .

[0046] Figure 12 is another enlarged view of the thermal analysis result display section 58 shown in Figure 5 .

[0047] Figure 13 is a view showing an example of the analysis condition display section 66 shown in Figure 12 .

[0048] Figure 14 is a view showing another example of the design support system 200 according to an embodiment of the present application.

[0049] Figure 15is a flowchart showing an example of a design assistance method according to an embodiment of the present application.

[0050] Figure 16 is a diagram showing an example of a computer 2200 that can embody the design assistance apparatus 100 according to an embodiment of the present application as a whole or in part. DETAILED DESCRIPTION

[0051] Hereinafter, the present application will be described by embodiments of the application, but the following embodiments are not intended to limit the application covered by the claims. In addition, not all combinations of features described in the embodiments are necessarily essential to the solution of the application.

[0052] Figure 1 is a diagram showing an example of a thermal analysis object 41 according to an embodiment of the present application. The thermal analysis object 41 is, for example, a printed circuit board used in electronic equipment or the like. The thermal analysis object 41 includes a substrate 42 and a current detection element 43. The substrate 42 has a conductor layer 44. The substrate 42 can have a conductor layer 47. The conductor layer 44 and the conductor layer 47 are, for example, copper foils.

[0053] In the present specification, orthogonal coordinate axes of an X-axis, a Y-axis, and a Z-axis are sometimes used to describe technical matters. In the present specification, a plane parallel to the plane of the substrate 42 is set as an XY plane. In the present specification, a direction orthogonal to the plane of the substrate 42 (a thickness direction of the substrate 42) is set as a Z-axis direction. In the present specification, a prescribed direction in the XY plane is set as an X-axis direction, and a direction orthogonal to the X-axis in the XY plane is set as a Y-axis direction.

[0054] In the present specification, the X-axis direction refers to a direction parallel to the X-axis from one direction to the other direction and from the other direction to the one direction. That is, in the present specification, the X-axis direction does not refer to one of two directions parallel to the X-axis, but refers to a direction parallel to the X-axis. The same applies to the Y-axis direction and the Z-axis direction in the present specification.

[0055] In the present specification, plan view refers to a case where the substrate 42 is observed from the Z-axis direction. In the present specification, side view refers to a case where the substrate 42 is observed from a direction orthogonal to the Z-axis (a prescribed direction in the XY plane).

[0056] The current detection element 43 is an element that detects a current I flowing in the conductor layer 44 when the current I is measured. The current detection element 43 can be a magnetic field detection type current sensor. The magnetic field detection type current sensor refers to a magnetic sensor that detects a magnetic field generated by the current I. The current detection element 43 is, for example, a Hall element. In Figure 1 In the present specification, the orientation of the current I is shown by a thick arrow.

[0057] In a case where the current detecting element 43 is a magnetic sensor, the current detecting element 43 can be provided with an IC (integrated circuit) that amplifies a signal from the magnetic sensor. The substrate 42 can have 2 conductor layers 47 (conductor layer 47-1 and conductor layer 47-2). The current flowing in the IC can flow in the conductor layers 47.

[0058] The current detecting element 43 can have connection terminals 46. In the present example, the current detecting element 43 has 2 connection terminals 46 (connection terminal 46-1 and connection terminal 46-2). The substrate 42 of the present example has 2 conductor layers 44 (conductor layer 44-1 and conductor layer 44-2) in plan view. The connection terminal 46-1 can be connected to the conductor layer 44-1. The connection terminal 46-2 can be connected to the conductor layer 44-2.

[0059] The substrate 42 generates heat due to the current I flowing in the conductor layer 44. The current detecting element 43 generates heat due to the current I flowing in the conductor layer 44. The heat analysis unit 40 (described later) thermally analyzes the heat generation of the substrate 42 and the current detecting element 43.

[0060] An opening 48 can be provided in the substrate 42 and the conductor layer 44-1. An opening 49 can be provided in the substrate 42 and the conductor layer 44-2. A via hole 91 can be provided in the opening 48. A via hole 92 can be provided in the opening 49.

[0061] The substrate 42 can have 1 or more conductor layers 44. The plurality of conductor layers 44 can be provided in the thickness direction of the substrate 42. The via hole 91 can be used to electrically connect one conductor layer 44-1 to another conductor layer 44-1. The via hole 92 can be used to electrically connect one conductor layer 44-2 to another conductor layer 44-2.

[0062] The end portion position of the current detecting element 43 side in the X-axis direction of the conductor layer 44-1 is set as a position Px1. The center position of the via hole 91 in plan view in the X-axis direction of the conductor layer 44-1 is set as a position Px2. The center position of the via hole 91 in plan view is the position of the center in the path of the current I flowing in the via hole 91 in the Z-axis direction. The length in the X-axis direction from the position Px1 to the position Px2 is set as a length L.

[0063] The end portion position of the current detecting element 43 side in the X-axis direction of the conductor layer 44-2 is set as a position Px1'. The center position of the via hole 92 in plan view in the X-axis direction of the conductor layer 44-2 is set as a position Px2'. The center position of the via hole 92 in plan view is the position of the center in the path of the current I flowing in the via hole 92 in the Z-axis direction. The length in the X-axis direction from the position Px1' to the position Px2' is set as a length L'.

[0064] A position of one end portion of the conductor layer 44-1 on the side of the current detection element 43 in the Y-axis direction is set as a position Py1. A position of the other end portion of the conductor layer 44-1 in the Y-axis direction is set as a position Py2. A width in the Y-axis direction from the position Py1 to the position Py2 is set as a width W.

[0065] A position of one end portion of the conductor layer 44-2 on the side of the current detection element 43 in the Y-axis direction is set as a position Py1'. A position of the other end portion of the conductor layer 44-2 in the Y-axis direction is set as a position Py2'. A width in the Y-axis direction from the position Py1' to the position Py2' is set as a width W'.

[0066] Further, in the Y-axis direction, the position Py1 and the position Py1' can be the same position, or can be different positions. In the Y-axis direction, the position Py2 and the position Py2' can be the same position, or can be different positions. The width W and the width W' can be equal, or can be different. In the present example, in the Y-axis direction, the position Py1 and the position Py1' are the same position, and the position Py2 and the position Py2' are the same position. In the present example, the width W is equal to the width W'.

[0067] In a case where the length L varies in a range from the position Py1 to the position Py2 along the Y-axis direction, the length L can be an average value, or can be a maximum value, or can be a minimum value, or can be a central value of the length from the position Px1 to the position Px2 between the position Py1 and the position Py2. The same applies to the length L'.

[0068] In a case where the width W varies in a range from the position Px1 to the position Px2 along the X-axis direction, the width W can be an average value, or can be a maximum value, or can be a minimum value, or can be a central value of the width from the position Py1 to the position Py2 between the position Px1 and the position Px2. The same applies to the width W'.

[0069] An area of the conductor layer 44-1 in plan view is set as an area S1. An area of the conductor layer 44-2 in plan view is set as an area S1'. In the present example, the area S1 and the area S1' are equal. Figure 1 In the present example, the area S1 and the area S1' are equal.

[0070] The current detection element 43 easily generates heat with detection of the current I. The heat of the current detection element 43 easily spreads in the planar direction (in-plane direction) of the substrate 42 by propagating in the conductor layer 44. The larger the area S1 and the area S1', the more easily the heat of the current detection element 43 spreads in the planar direction of the substrate 42. The area S1 and the area S1' are heat dissipation areas of the heat generated by the current detection element 43.

[0071] The area S1 and the area S1' can be equal or different. In this example, the area S1 and the area S1' are equal.

[0072] Figure 2 is a view illustrating an example of a cross section of the a-a' line in the substrate 42. The a-a' line is a YZ cross section passing through the substrate 42, the conductor layer 44-2, the opening 49, and the via hole 92. The substrate 42 can have n layers of the conductor layer 44-2 (the conductor layer 44-2-1 to the conductor layer 44-2-n). Here, n is an integer of 2 or more. n is the number of the conductor layer 44-2. Figure 1 In this specification, the conductor layer 44-2-1 side in the Z-axis direction is referred to as the upper side, and the conductor layer 44-2-n side in the Z-axis direction is referred to as the lower side. The conductor layer 44-2-1 can be provided on the upper surface 93 of the substrate 42. The conductor layer 44-2-n can be provided on the lower surface 94 of the substrate 42. The opening 49 can pass through the substrate 42 from the upper surface 93 to the lower surface 94. The via hole 92 can electrically connect the conductor layer 44-2-1 to the conductor layer 44-2-n.

[0073] The thicknesses of the conductor layer 44-2-1 to the conductor layer 44-2-n are respectively set to the thickness d1 to the thickness dn. The thicknesses d1 to dn can all be equal or all be different. In this example, the thicknesses d1 to dn are all equal. In this example, the thickness of each of the conductor layer 44-2-1 to the conductor layer 44-2-n is set to the thickness d.

[0074] The substrate 42 has n layers of the conductor layer 44-1 which are the same as the conductor layer 44-2. The conductor layer 44-1-1 can be provided on the upper surface 93 of the substrate 42. The conductor layer 44-1-n can be provided on the lower surface 94 of the substrate 42. The opening 48 can pass through the substrate 42 from the upper surface 93 to the lower surface 94. The via hole 91 can electrically connect the conductor layer 44-1-1 to the conductor layer 44-1-n.

[0075] The thicknesses of the conductor layer 44-1-1 to the conductor layer 44-1-n can be the thickness d1 to the thickness dn respectively, similarly to the thicknesses of the conductor layer 44-2-1 to the conductor layer 44-2-n. In this example, the thickness of each of the conductor layer 44-1-1 to the conductor layer 44-1-n is the thickness d, similarly to the conductor layer 44-2-1 to the conductor layer 44-2-n.

[0076] When the substrate 42 is viewed from above, the shapes of the plurality of conductor layers 44-2 can be the same. In the example illustrated in FIG. 1A, the shapes of the conductor layer 44-2-2 to the conductor layer 44-2-n when viewed from above can be the same as the shape of the conductor layer 44-2-1 when viewed from above. When the substrate 42 is viewed from above, the shapes of the plurality of conductor layers 44-2 can also be different.

[0077] Figure 2 In the example illustrated in FIG. 1A, the shapes of the conductor layer 44-2-2 to the conductor layer 44-2-n when viewed from above can be the same as the shape of the conductor layer 44-2-1 when viewed from above. When the substrate 42 is viewed from above, the shapes of the plurality of conductor layers 44-2 can also be different.​

[0078] Figure 3 is a view showing a thermal analysis target 141 related to one embodiment of the present application. The thermal analysis target 141 includes a current detecting element 143. The current detecting element 143 can be a current sensor of a current-voltage conversion type. The current sensor of the current-voltage conversion type is a current sensor that detects a current by converting the current flowing in a resistor into a voltage. The current detecting element 143 is, for example, a shunt resistor. The thermal analysis target 141 is different from the thermal analysis target 41 (refer to Figure 1 ) in this point. The current detecting element 143 is electrically connected to the conductor layer 44-1 and is electrically connected to the conductor layer 44-2.

[0079] The current sensor of the current-voltage conversion type detects a current by converting the current flowing in a resistor into a voltage, and thus, it is preferable that the resistance value of the resistor is such that the size of the converted voltage can be detected. Therefore, the amount of heat generation per unit time in the current sensor of the current-voltage conversion type is likely to be larger than the amount of heat generation per unit time in the current sensor of the magnetic detection type. The thermal analysis target 141 can be a thermal analysis target that is an object of comparison with the thermal analysis target 41.

[0080] Figure 4 is a view showing an example of a design support system 200 related to one embodiment of the present application. The design support system 200 includes the design support apparatus 100, a thermal analysis unit 40, a display section 50, and a storage unit 60. The thermal analysis unit 40 is a unit that performs thermal analysis on a thermal analysis target 41 (refer to Figure 1 ). The display section 50 is, for example, a display, a monitor, or the like. The storage unit 60 is, for example, a storage device such as a hard disk drive. The storage unit 60 stores at least one of substrate information (described later) that is information of the substrate 42, current detecting element information that is information of the current detecting element 43, and a result of thermal analysis on the thermal analysis target 41 obtained by the thermal analysis unit 40. The storage unit 60 can also store product information of the current detecting element 43.

[0081] In addition, the design support system 200 can not include the storage unit 60. In the case where the design support system 200 does not include the storage unit 60, a storage unit 60 separate from the design support system 200 can be connected to the design support system 200.

[0082] The design support apparatus 100 includes the input unit 10, the setting unit 20, the control unit 30, and a display control unit 32. The input unit 10 is, for example, a mouse, a keyboard, or the like. The control unit 30 is, for example, a CPU (Central Processing Unit). The design support apparatus 100 is, for example, a computer including the CPU, a memory, an interface, and the like.

[0083] The input unit 10 is used to input an analysis condition of the thermal analysis object 41 (refer to Figure 1 ). The analysis condition is set as an analysis condition Ia. The analysis condition Ia includes substrate information (described later) as information related to the substrate 42 and current detecting element information (described later) as information of the current detecting element 43. The thermal analysis of the thermal analysis object 41 is performed by the thermal analysis unit 40 based on the analysis condition Ia. The output form of the thermal analysis result of the thermal analysis object 41 is set by the setting unit 20. The output form is described later.

[0084] The display control unit 32 controls the display section 50. The display control unit 32 is, for example, a GPU (Graphics Processing Unit). The display control unit 32 controls the display section 50 so that the thermal analysis result of the thermal analysis object 41 (refer to Figure 1 ) is displayed in the display section 50 in the output form set by the setting unit 20.

[0085] Further, the display control unit 32 can be included in the control unit 30. The control unit 30 and the display control unit 32 can be, for example, one CPU.

[0086] Figure 5 is a view showing an example of a display mode displayed in the display section 50. The display control unit 32 (refer to Figure 4 ) controls the display section 50 so that the display section 50 displays an output form input region 51, an analysis condition input region 59, current detecting element information input region 52, substrate information input region 54, environment information input region 55, thermal analysis execution region 56, result saving execution region 57, and thermal analysis result display region 58.

[0087] The thermal analysis result display region 58 is a region for displaying a result obtained by the thermal analysis unit 40 (refer to Figure 4 ) performing thermal analysis of at least one of the thermal analysis object 41 and the thermal analysis object 141 based on the analysis condition Ia (described later). The result is set as a thermal analysis result Ir. In the thermal analysis result display region 58, the thermal analysis result Ir can be displayed in a graph form or in a table form.

[0088] The output form input region 51 is a region for inputting an output form of the thermal analysis result Ir. The output form can be input by the input unit 10 (refer to Figure 4) input. The output form refers to a display form of the thermal analysis result Ir displayed in the thermal analysis result display area 58 (described later). As described later, the display form can be either a graph form or a table form. In the case where the display form is the graph form, the output form input area 51 can be an area for inputting two parameters in the graph form.

[0089] The analysis condition input area 59 is an area for inputting the analysis condition Ia. In the present example, the analysis condition input area 59 includes the current detecting element information input area 52, the substrate information input area 54, and the environment information input area 55.

[0090] The current detecting element information input area 52 is an area for inputting current detecting element information. The current detecting element information refers to at least one of information about the current detecting element 43 and information about the current detecting element 143. The current detecting element information is denoted by current detecting element information Id. Details of the current detecting element information Id are described later. The current detecting element information Id can be input by the input unit 10 (refer to Figure 4 ) input.

[0091] In the present example, the current detecting element information input area 52 includes two input areas 53. The two input areas 53 are denoted by a first input area 53-1 and a second input area 53-2. In the present example, the first input area 53-1 is an area for inputting information about the current detecting element 43. In the present example, the second input area 53-2 is an area for inputting information about the current detecting element 143.

[0092] The substrate information input area 54 is an area for inputting substrate information. The substrate information refers to information about the substrate 42 (refer to Figure 1 and Figure 3 ). The substrate information is denoted by substrate information Is. Details of the substrate information Is are described later. The substrate information Is can be input by the input unit 10 (refer to Figure 4 ) input.

[0093] The environment information input area 55 is an area for inputting environment information. The environment information refers to at least one of information about an environment in which the thermal analysis object 41 is disposed and information about an environment in which the thermal analysis object 141 is disposed. The environment information is denoted by environment information Ie. The analysis condition Ia can include the environment information Ie. Details of the environment information Ie are described later. The environment information Ie can be input by the input unit 10 (refer to Figure 4 ) input.

[0094] The thermal analysis execution area 56 is an area for inputting the start of thermal analysis. The save execution area 57 is an area for inputting the start of thermal analysis result saving. The thermal analysis execution area 56 and the save execution area 57 are described later.

[0095] Figure 6 is Figure 5 An enlarged view of the output form input area 51 and the analysis condition input area 59 in the thermal analysis result display area 58 (refer to Figure 5 ) is shown in a graph form. The output form input area 51 of the present example is an area for inputting the vertical axis and the horizontal axis in the graph form. The parameters of the vertical axis and the horizontal axis can be displayed in a pull-down form. The parameters of the vertical axis and the horizontal axis can be each one selected from the substrate information Is and the environment information Ie.

[0096] The first input area 53-1 is an area for inputting information on the current detecting element 43. The information on the current detecting element 43 is set as first current detecting element information Idl. The first current detecting element information Idl can be at least one of the name of the current detecting element 43 and the conductor resistance value. The name of the current detecting element and the product information on the name can be stored in the storage unit 60 Figure 4 ). The name of the current detecting element 43 is, for example, the product name of the current detecting element 43. In the case where the current detecting element 43 is a magnetic sensor, a magnetic field generated by a current is applied to the magnetic sensor. The conductor resistance value of the current detecting element 43 can be the resistance value of a conductor for flowing the current. Further, in the case where the name of the current detecting element 43 is input in the first input area 53-1, the conductor resistance value of the current detecting element 43 can be set to be non-inputtable.

[0097] The second input area 53-2 is an area for inputting information on the current detecting element 143. The information on the current detecting element 143 is set as second current detecting element information Id2. The current detecting element information Id2 can include the resistance temperature coefficient of the current detecting element 143. The current detecting element information Id2 can further include at least one of the size and the resistance value of the current detecting element 143. In the present example, the current detecting element information Id2 includes the size, the resistance value, and the resistance temperature coefficient of the current detecting element 143. In the case where the current detecting element 143 is a shunt resistor, the current detecting element information Id2 is the size [mm], the resistance value [mΩ], and the resistance temperature coefficient [ppm / °C] of the shunt resistor.

[0098] The substrate information input area 54 is an area for inputting the substrate information Is. The substrate information Is can include the number of the conductor layers 44 (refer to Figure 2), the thickness d of the conductor layer 44 (refer to Figure 2 )[μm] and the area [mm 2 ] of the conductor layer 44. The area of the conductor layer 44 is set as a conductor layer area S. The conductor layer area S is a heat dissipation area of the conductor layer 44. In the present example, the conductor layer area S is the sum of the area S1 and the area S1' (refer to Figure 1 and Figure 3 ).

[0099] The substrate information Is can also include a conductor width. The conductor width is the width W and the width W' (refer to Figure 1 and Figure 3 ) of the conductor layer 44. The substrate information Is can also include a conductor length. The conductor length can be the length L and the length L' (refer to Figure 1 and Figure 3 ) of the conductor layer 44. Further, it can be that, in a case where the conductor layer area S is input in the substrate information input area 54, the conductor width and the conductor length are set to be non-inputtable.

[0100] The environment information input area 55 is an area for inputting environment information Ie. The environment information Ie can include at least one of the temperature of the environment in which at least one of the thermal analysis object 41 and the thermal analysis object 141 is disposed, the convective heat transfer rate of the environment, and the radiative heat transfer rate of the environment.

[0101] The temperature of the environment in which the thermal analysis object 41 is disposed can be the temperature of a portion in which the current detection element 43 is disposed on the upper side of the substrate 42 in the thermal analysis object 41. The temperature of the environment in which the thermal analysis object 141 is disposed can be the temperature of a portion in which the current detection element 143 is disposed on the upper side of the substrate 42 in the thermal analysis object 141. The temperature of the portion in which the current detection element 43 is disposed and the temperature of the portion in which the current detection element 143 is disposed sometimes reach 100°C.

[0102] The convective heat transfer rate of the environment in which the thermal analysis object 41 is disposed is a coefficient indicating the degree of propagation of energy due to the flow of air, water, or the like in the environment. The convective heat transfer rate in a case where the thermal analysis object 41 is blown by a wind generated by a cooling fan, for example, is higher than the convective heat transfer rate in a case where the thermal analysis object 41 is not blown by the wind.

[0103] The radiation heat transfer rate of the environment in which the heat analysis object 41 is disposed is a coefficient indicating the degree of radiation of the energy of the electromagnetic wave released from the object. In this example, the object is the substrate 42, the current detection element 43, or the like. In a case where the temperature is lower than a predetermined temperature, the radiation heat transfer rate can be ignored. The predetermined temperature is, for example, 90°C. However, the temperature of the substrate 42, the current detection element 43, or the like is sometimes 100°C or higher. Therefore, by taking into account the radiation heat transfer rate of the electromagnetic wave released from the substrate 42, the current detection element 43, or the like, the heat analysis unit 40 can more accurately calculate the rise temperature ΔT (described later) in the environment in which the heat analysis object 41 is disposed than in a case where the radiation heat transfer rate is not taken into account.

[0104] The environment information Ie can further include at least one of the surface state of the substrate 42 and the disposition direction of the substrate 42. The surface state of the substrate 42 is, for example, information on heat dissipation of the substrate 42, such as whether the conductor layer 44 disposed on the upper surface 93 of the substrate 42 is exposed or coated with solder resist. The disposition direction of the substrate 42 is information on the disposition of the substrate 42, such as whether the upper surface 93 of the substrate 42 (see FIG. 1) is parallel to the horizontal direction or the vertical direction. By heat dissipation from the substrate 42, convection is easily generated in the air around the substrate 42. In a case where the upper surface 93 is parallel to the vertical direction, the air of the convection is more likely to cross the upper surface 93 than in a case where the upper surface 93 is parallel to the horizontal direction. Therefore, the substrate 42 is more likely to be cooled in a case where the upper surface 93 is parallel to the vertical direction than in a case where the upper surface 93 is parallel to the horizontal direction. Figure 2 ) is parallel to the horizontal direction or the vertical direction. By heat dissipation from the substrate 42, convection is easily generated in the air around the substrate 42. In a case where the upper surface 93 is parallel to the vertical direction, the air of the convection is more likely to cross the upper surface 93 than in a case where the upper surface 93 is parallel to the horizontal direction. Therefore, the substrate 42 is more likely to be cooled in a case where the upper surface 93 is parallel to the vertical direction than in a case where the upper surface 93 is parallel to the horizontal direction.

[0105] The environment information Ie can further include at least one of the effective current and the rise temperature. The effective current is the effective value of the current I flowing in the conductor layer 44. The effective value of the current I flowing in the conductor layer 44 can be the maximum value of the current I that can flow in the conductor layer 44. The rise temperature is the difference between the maximum value of the temperature allowed in the environment in which the heat analysis object 41 and the heat analysis object 141 are disposed and the current temperature. The rise temperature is set as the rise temperature ΔT.

[0106] Figure 7 is Figure 5A magnified view of the thermal analysis execution area 56, the save execution area 57, and the thermal analysis result display area 58 in the thermal analysis execution screen 55 is shown in FIG. 6. In this example, the current detection element 43 is set as a first current detection element 243, and the current detection element 143 is set as a second current detection element 343. The second current detection element 343 can be a current detection element of a different kind from the first current detection element 243. The current detection elements being of different kinds can mean that the methods of detecting current are different. In this example, the first current detection element 243 is a magnetic sensor, and the second current detection element 343 is a shunt resistor. The magnetic sensor detects current by detecting a magnetic field generated by the current. The shunt resistor detects current by detecting a voltage generated due to the current flowing in a conductor. In this example, the first current detection element 243 and the second current detection element 343 differ in the method of detecting current at this point.

[0107] The display control unit 32 (refer to Figure 4 ) can control the display section 50 to cause the first start section 61 for starting thermal analysis on the thermal analysis target 41 including the first current detection element 243 and the second start section 62 for starting thermal analysis on the thermal analysis target 141 including the second current detection element 343 to be displayed on the display section 50. In this example, the display control unit 32 controls the display section 50 to cause the first start section 61 and the second start section 62 to be displayed on the thermal analysis execution area 56. The first start section 61 and the second start section 62 can be buttons displayed on the display section 50.

[0108] The current detection element information Id related to the first current detection element 243 is set as first current detection element information Idl. The current detection element information Id related to the second current detection element 343 is set as second current detection element information Id2. In a case where the input unit 10 (refer to Figure 4 ) has inputted a start of thermal analysis on the thermal analysis target 41 including the first current detection element 243, the thermal analysis unit 40 (refer to Figure 4The thermal analysis on the thermal analysis target 41 can be performed based on the first analysis condition Ia1 including the first current detecting element information Id1. In a case where the input unit 10 inputs a start of the thermal analysis on the thermal analysis target 41 including the second current detecting element 343, the thermal analysis unit 40 performs the thermal analysis on the thermal analysis target 41 based on the second analysis condition Ia2 including the second current detecting element information Id2. In the present example, in a case where the input unit 10 presses the first start section 61, the thermal analysis unit 40 performs the thermal analysis on the thermal analysis target 41 based on the analysis condition Ia including the first current detecting element information Id1. In the present example, in a case where the input unit 10 presses the second start section 62, the thermal analysis unit 40 performs the thermal analysis on the thermal analysis target 41 based on the analysis condition Ia including the second current detecting element information Id2.

[0109] The display control unit 32 (see Figure 4 ) can control the display section so that the initialization section 63 is displayed on the display section 50. In the present example, the display control unit 32 controls the display section 50 so that the initialization section 63 is displayed on the thermal analysis execution region 56. The initialization section 63 can be a button displayed on the display section 50. In a case where the input unit 10 presses the initialization section 63, the display control unit 32 can control the display section 50 so that the thermal analysis result Ir displayed on the display section 50 is deleted from the display section 50.

[0110] The save execution region 57 can include the save section 64 displayed on the display section. The save section 64 can be a button displayed on the display section 50. In a case where the input unit 10 presses the save section 64, the thermal analysis result Ir can be stored in the storage unit 60 (see Figure 4 ).

[0111] The thermal analysis result display region 58 is a region in which the thermal analysis result Ir of at least one of the thermal analysis target 41 and the thermal analysis target 141 is displayed. The input unit 10 (see Figure 4 ) can input first information If1 and second information If2 selected from the substrate information Is, the current detecting element information Id, and the environment information Ie. The first information If1 and the second information If2 are different. The first information If1 and the second information If2 can be selected from items displayed on the current detecting element information input region 52, the substrate information input region 54, and the environment information input region 55 shown in FIG. 6. The first information If1 and the second information If2 can be input in the output form input region 51. The first information If1 can be a parameter of one of the vertical axis and the horizontal axis input in the output form input region 51. The second information If2 can be a parameter of the other of the vertical axis and the horizontal axis input in the output form input region 51. Figure 6 ​

[0112] The setting unit 20 can set the output form of the thermal analysis result Ir to a form showing the relationship between the first information Ifl and the second information If2. In the present example, the setting unit 20 sets the output form of the thermal analysis result Ir to a graph form. In the present example, the first information Ifl is the conductor layer area S, and the second information If2 is the temperature rise AT.

[0113] The analysis condition Ia of the thermal analysis object 41 is set to the first analysis condition Ial. The analysis condition Ia obtained by changing at least one of the substrate information Is and the current detecting element information Id from the first analysis condition Ial is set to the second analysis condition Ia2. In the present example, the analysis condition Ia obtained by changing the current detecting element information Id from the first analysis condition Ial is set to the second analysis condition Ia2. In the present example, the second analysis condition Ia2 is the analysis condition Ia of the thermal analysis object 141.

[0114] The first thermal analysis result based on the first analysis condition Ial is set to the first thermal analysis result Ir 1. The second thermal analysis result based on the second analysis condition Ia2 is set to the second thermal analysis result Ir2. The display control unit 32 controls the display section 50 so that the first thermal analysis result Ir 1 and the second thermal analysis result Ir2 are displayed in the display section 50 in the output form set by the setting unit 20. The display control unit 32 (refer to Figure 4 ) controls the display section 50 so that the first thermal analysis result Ir 1 and the second thermal analysis result Ir2 are displayed in the display section 50 in a manner that can be mutually recognized. In the present example, the first thermal analysis result Ir 1 of the thermal analysis object 41 is shown in a solid line, and the second thermal analysis result Ir2 of the thermal analysis object 141 is shown in a dot-dash line, whereby the first thermal analysis result Ir 1 and the second thermal analysis result Ir2 are displayed in the display section 50 in a manner that can be mutually recognized.

[0115] The substrate information Is in the first analysis condition Ial is set to the substrate information Is 1. The substrate information Is in the second analysis condition Ia2 is set to the substrate information Is2. The substrate information Is 1 and the substrate information Is2 can be the same. The environmental information Ie in the first analysis condition Ial is set to the environmental information Iel. The environmental information Ie in the second analysis condition Ia2 is set to the environmental information Ie2. The environmental information Iel and the environmental information Ie2 can be the same.

[0116] In a case where the current detecting element 43 is a magnetic sensor and the magnetic sensor detects a change in a magnetic field, the magnetic sensor generates a current generated due to the change in the magnetic field. The primary conductor of the current detecting element 43 refers to a conductor in which the current generated due to the change in the magnetic field flows.

[0117] In this example, the resistance value of the primary conductor of the current detection element 43 is smaller than the resistance value of the current detection element 143, and thus the heat generation amount per unit time of the heat analysis object 41 including the current detection element 43 is more easily suppressed than the heat generation amount per unit time of the heat analysis object 141 including the current detection element 143. In a case where the substrate information Is1 and the substrate information Is2 are the same and the environmental information Ie1 and the environmental information Ie2 are the same, the user of the design assistance device 100 can easily know the difference in the heat dissipation characteristics of the substrate 42 in a case where the current detection element 143 is replaced with the current detection element 43. In Figure 7 In the example illustrated, the user of the design assistance device 100 can easily know the reduction effect of the conductor layer area S in a case where the temperature rise ΔT is all set to T1 in a case where the current detection element 143 is replaced with the current detection element 43.

[0118] In the heat analysis object 41, the heat generated due to the current flowing in the conductor layer 44 and the current detection element 43 is set as heat Qt1. In the heat analysis object 41, the heat convected above the conductor layer 44 and above the current detection element 43 is set as heat Qc1. In the heat analysis object 41, the heat obtained by thermal radiation generated by the conductor layer 44 and thermal radiation generated by the current detection element 43 is set as heat Qr1. The following relationship holds between the heat Qt1, the heat Qc1, and the heat Qr1.

[0119] [Equation 1]

[0120] Qt1-Qc1-Qr1=0 (1)

[0121] In the heat analysis object 141, the heat generated due to the current flowing in the conductor layer 44 and the current detection element 143 is set as heat Qt2. In the heat analysis object 141, the heat convected above the conductor layer 44 and above the current detection element 143 is set as heat Qc2. In the heat analysis object 141, the heat obtained by thermal radiation generated by the conductor layer 44 and thermal radiation generated by the current detection element 143 is set as heat Qr2. The same relationship as the above (1) holds between the heat Qt2, the heat Qc2, and the heat Qr2.

[0122] The current flowing in the conductor layer 44 and the current detection element 43 is set as I1, and the resistance value of the current detection element 43 is set as R1 p . The resistance value of the conductor layer 44 is set as R sub , and the resistance temperature coefficient of the conductor layer 44 is set as a. The temperature of the substrate 42 is set as t. The number of the conductor layers 44 (refer to Figure 2Let n be the conductor layer 44, and let d be the average thickness of the n conductor layers 44. Let ρ0 be the resistivity of the conductor layer 44 at a temperature of 0℃, and ρ be the resistivity of the conductor layer 44 at a temperature of t. The heat Qt1 is expressed by the following formula.

[0123] [Formula 2]

[0124] Qt1=I1 2 (R sub +R1 p (2-1)

[0125]

[0126] ρ=ρ0(1+αt) (2-3)

[0127] Among them, Figure 1 As described above, L represents the distance from position Px1 to position Px2 (refer to...). Figure 1 and Figure 3 The length along the X-axis of the distance from position Px1′ to position Px2′ (refer to...). Figure 1 and Figure 3 The length of W along the X-axis from position Py1 to position Py2 (refer to...). Figure 1 and Figure 3 The width of the object along the Y-axis. W′ is the distance from position Py1′ to position Py2′ (refer to...). Figure 1 and Figure 3 The width of ) in the Y-axis direction.

[0128] Let the current flowing in the conductor layer 44 and the current sensing element 143 be I2, and let the resistance value of the current sensing element 143 be R2. p Heat Qt2, current I2, and resistance R2 p The same relationship exists between them as in equations (2-1) to (2-3) above.

[0129] Let the area of ​​the region on the substrate 42 through which current flows in the conductor layer 44 be defined as area S. sub In the thermal analysis object 41, the area of ​​the current sensing element 43 when viewed from above is set as area S1. d Area S1 d It means Figure 1The area of ​​the shaded region in the diagram. The convective heat transfer rate hc1 is defined as the heat transfer rate obtained by convection between the heat above the conductor layer 44 and above the current sensing element 43 and on the upper surface 93 side of the substrate 42, and the heat below the conductor layer 44 and below the current sensing element 43 and on the lower surface 94 side of the substrate 42. The temperature rise caused by the heating of the conductor layer 44 and the current sensing element 43 is defined as temperature ΔT1. The heat Qc1 is expressed by the following formula.

[0130] [Formula 3]

[0131] Qc1=(S sub +S1 d )×hc1×ΔT1 (3-1)

[0132] S sub = (W×L+W'×L') (3-2)

[0133] The heat Qr1 is expressed by the following formula.

[0134] [Formula 4]

[0135] Qr1=(S sub +S1 d )×hr1×ΔT1 (4-1)

[0136]

[0137] Where σ is the Stefan Boltzmann constant. σ = 5.67 × 10 -8 [W / (m 2 ·K 4 ε represents the thermal emissivity from the upper and lower surfaces of the conductor layer 44 and the upper and lower surfaces of the current sensing element 43. ε can vary depending on the material of the substrate 42, the surface condition of the substrate 42, etc. ε is a value greater than 0 and less than 1. sub The temperature of conductor layer 44 and current sensing element 43 is T. air The temperature of the environment in which the thermal analysis object 41 is configured.

[0138] In the thermal analysis object 141, the area of ​​the current sensing element 143 when viewed from above is set as area S2. d Area S2 d It means Figure 2 The area of ​​the shaded region in the diagram. The convective heat transfer rate obtained by convection through the heat from the upper surface 93 side and the lower surface 94 side of the substrate 42 is defined as the convective heat transfer rate hc2. The temperature rise caused by the heating of the conductor layer 44 and the current sensing element 143 is defined as temperature ΔT2. Heat Qc2, area S2 dThe convective heat transfer rate hc2 and temperature ΔT2 have the same relationship as in equations (3-1) and (3-2). Heat Qc2 is related to area S2. d The same relationship as in equation (4) applies between them.

[0139] Resistance value R sub It is easy to cause the pads to be placed in the via (in Figure 1 and Figure 2 In the example, the resistance drops from directly above the opening (49) (i.e., from the pad on via). The resistance value R... sub It is also easy to cause problems due to through-holes (in) Figure 1 and Figure 2 In the example, opening 49) connects multiple wiring layers (in Figure 2 and Figure 4 In the example, the resistance decreases from conductor layer 44-2-1 to conductor layer 44-2-n. p and resistance value R2 p The temperature of current sensing element 43 and current sensing element 143 changes as the temperature rises, respectively.

[0140] When the pad is positioned directly above a via (e.g., opening 49), or when multiple wiring layers (e.g., conductor layers 44-2-1 to conductor layers 44-2-n) are connected vias (e.g., opening 49), in area S sub The substrate 42 may also include the lower surface 94 of the conductor layer 44 (see reference). Figure 4 The area of ​​the region in conductor layer 44 on the side through which current flows.

[0141] When performing thermal analysis on the object 41, the temperature coefficient of resistance α can be stored in the storage unit 60 (refer to...). Figure 4 Thermal analysis unit 40 (refer to) Figure 6 Thermal analysis of the object 41 can be performed using the temperature coefficient of resistance α stored in the storage unit 60. When performing thermal analysis on the object 141, the temperature coefficient of resistance α can be obtained from the input unit 10 (refer to...). Figure 4 ) In the second input area 53-2 (refer to Figure 6 The values ​​entered in ) are used for thermal analysis.

[0142] The convective heat transfer rates hc1 and hc2 can be based on the input unit 10 (refer to...) Figure 8 In the environmental information input area 55 (refer to...) Figure 5The surface state of the substrate 42 and the arrangement direction of the substrate 42 are at least one of them inputted in the input unit 10. The heat analysis unit 40 can perform heat analysis on the heat analysis target 41 by using the derived heat transfer rate hcl, and can perform heat analysis on the heat analysis target 141 by using the derived heat transfer rate hc2.

[0143] Generally, the amount of heat generation per unit time in an IC (Integrated Circuit) tends to depend on the electric power consumed as a transistor is driven. In contrast, in the case where the current detection element 43 is a magnetic sensor and the current detection element 143 is a shunt resistor, the amount of heat generation per unit time in the heat analysis target 41 and the heat analysis target 141 tends to depend on the area S sub , the width W, the width W', the length L, and the length L'. Therefore, in this example, the user of the design assistance device 100 can easily compare the behavior of the temperature AT1 in the heat analysis target 41 with the behavior of the temperature AT2 in the heat analysis target 141 by changing the area S sub , the width W, the width W', the length L, and the length L' in the heat analysis target 41 and the heat analysis target 141.

[0144] Figure 7 is an enlarged view of the heat analysis result display region 58 shown in Figure 4 In this example, as in the example shown in Figure 4 , the first information Ifl is the conductor layer area S, and the second information If2 is the temperature rise AT.

[0145] In the case where the first analysis condition Ial is inputted through the input unit 10 (refer to Figure 8 ), the display control unit 32 (refer to Figure 9 ) can control the display section 50 so that the first heat analysis result Ir1 based on the first analysis condition Ial is displayed on the display section 50. In Figure 5 , the first heat analysis result Ir1 is displayed in the heat analysis result display region 58 with a dotted line.

[0146] Figure 4 is another enlarged view of the heat analysis result display region 58 shown in Figure 8 In this example, it is assumed that the substrate information Is in the second analysis condition Ia2 is the same as the substrate information Is of the first analysis condition Ial, and the current detection element information Id in the second analysis condition Ia2 is different from the current detection element information Id of the first analysis condition Ial. In the case where the first analysis condition Ial is inputted through the input unit 10 (refer to Figure 4 ) (i.e. Figure 4the second analysis condition Ia2 is inputted via the input unit 10 (refer to Figure 4 ) can control the display section 50 so that the first thermal analysis result Ir1 and the second thermal analysis result Ir2 are displayed on the display section 50 in a manner that they can be mutually recognized.

[0147] The display control unit 32 can control the display section 50 so that the display section 50 displays the second thermal analysis result Ir2 in a state where the display section 50 displays the first thermal analysis result Ir1. In this case, the display control unit 32 can control the display section 50 so that the display section 50 displays the second thermal analysis result Ir2 in a state where the first analysis condition Ia1 is inputted via the input unit 10 (refer to Figure 10 ) and the second analysis condition Ia2 is inputted via the input unit 10 (refer to ) in this case, the first current detection element information Id1 in the first analysis condition Ia1 is information about the current detection element 43, and the second current detection element information Id2 in the second analysis condition Ia2 is information about the current detection element 143.

[0148] Figure 5 It can also be that the thermal analysis unit 40 (refer to ) performs thermal analysis on the thermal analysis object 41 every time the second analysis condition Ia2 is inputted via the input unit 10. It can be that the display control unit 32 controls the display section 50 so that the second thermal analysis result Ir2 is displayed on the display section 50 every time the thermal analysis unit 40 performs thermal analysis on the thermal analysis object 41.

[0149] Figure 4 Figure 4 is a further enlarged view of the thermal analysis result display region 58 shown in

[0150] In a case where the first analysis condition Ia1 is inputted via the input unit 10 (refer to Figure 10 ), the display control unit 32 (refer to Figure 11 ) can control the display section 50 so that the first thermal analysis result Ir1 based on the first analysis condition Ia1 is displayed on the display section 50. In Figure 5 , the first thermal analysis result Ir1 is displayed in the thermal analysis result display region 58 with a thick broken line.

[0151] Figure 4 is a further enlarged view of the thermal analysis result display region 58 shown in Figure 8The thermal analysis result shown shows a further enlarged view of the region 58. In this example, the substrate information Is in the second analysis condition Ia2 is set to be different from the substrate information Is in the first analysis condition Ia1, and the current detecting element information Id in the second analysis condition Ia2 is set to be the same as the current detecting element information Id in the first analysis condition Ia1. In this example, the first current detecting element information Id1 and the second current detecting element information Id2 are both information related to the current detecting element 43 (e.g., a magnetic sensor).

[0152] The display control unit 32 (refer to Figure 4 ) can control the display section 50 so that the first thermal analysis result Ir1 and the second thermal analysis result Ir2 are displayed on the display section 50 in a manner that allows them to be distinguished from each other, with the condition that the second analysis condition Ia2 is inputted in the case where the first analysis condition Ia1 is inputted through the input unit 10 (refer to Figure 2 ). Figure 1 The display control unit 32 (refer to ) can control the display section 50 so that the display section 50 also displays the second thermal analysis result Ir2, in the state where the display section 50 displays the first thermal analysis result Ir1, with the condition that the second analysis condition Ia2 is inputted in the case where the first analysis condition Ia1 is inputted. In this example, the conductor layer area S of the substrate information Is1 in the first analysis condition Ia1 is area SO, and the conductor layer area S of the substrate information Is2 in the second analysis condition Ia2 is area SO' (> SO).

[0153] In this example, the user of the design assistance device 100 can easily know the suppression effect of suppressing the rising temperature ΔT from the temperature TO to the temperature TO' in the case where the area S of the conductor layer 44 provided on the substrate 42 on which the current detecting element 43 (e.g., a magnetic sensor) is provided is reduced, with the effective current Im maintained at the current I1.

[0154] Figure 4 In the side view of the substrate 42 shown in Figure 4 , the conductor layer 44-2-1 of the plurality of conductor layers 44-2 is set to be the first conductor layer D1, and the conductor layer 44-2-2 is set to be the second conductor layer D2. In the case where the shape of the first conductor layer D1 is different from the shape of the second conductor layer D2 in the plan view of the substrate 42 shown in

[0155] In the case where the thermal analysis unit 40 (refer to Figure 7 ) has performed thermal analysis on the thermal analysis target 41, the setting unit 20 (refer to Figure 4The output format of the thermal analysis result Ir can be set to be unchangeable. Figure 4 In the example shown, the setting unit 20 sets the output format of the thermal analysis result Ir as follows: the first information If1 is the conductor layer area S, and the second information If2 is the rising temperature ΔT. When the thermal analysis unit 40 performs thermal analysis on the thermal analysis object 41, the setting unit 20 can set the first information If1 and the second information If2 to be unchangeable. By setting the first information If1 and the second information If2 to be unchangeable, even if the user of the design assistance device 100 mistakenly changes at least one of the first information If1 and the second information If2, it is possible to prevent at least one of the first information If1 and the second information If2 from being changed, whenever thermal analysis is performed by the thermal analysis unit 40, the display control unit 32 can easily control the display unit 50 to display the thermal analysis result Ir on the display unit 50.

[0156] In setting unit 20 (refer to) Figure 9 When the form of the thermal analysis result Ir is set to be unchangeable, in input unit 10 (refer to...) Figure 9 When the third information If3, selected from the substrate information Is, the current detection element information Id, and the environmental information Ie, is input, the display control unit 32 can control the display unit 50 to display a warning. The third information If3 is different from the first information If1 and different from the second information If2.

[0157] The display control unit 32 controls the display unit 50 to display a warning, thereby informing the user of the design assistance device 100 that at least one of the first information If1 and the second information If2 has been incorrectly changed. Furthermore, the design assistance device 100 can also emit a warning sound instead of the warning displayed on the display unit 50 by the display control unit 32.

[0158] exist Figure 9 In the example shown, the first piece of information, If1, is the area S of the conductor layer, and the second piece of information, If2, is the temperature rise ΔT. Figure 9 In this process, the output format of the thermal analysis result Ir1 is set to show the relationship between the first information If1 and the second information If2.

[0159] When the third information If3 is input into the input unit 10, the setting unit 20 can change the output form of the thermal analysis result Ir from a form that shows the relationship between the first information If1 and the second information If2 ( Figure 11the form shown) is set to a form showing the relationship between the third information If3 and the second information If2. In a case where the third information If3 is, for example, the effective current Im, the setting unit 20 can set the output form of the thermal analysis result Ir from the form shown Figure 4 to the form shown Figure 4 . The display control unit 32 can control the display section 50 so that the first thermal analysis result Ir1 and the second thermal analysis result Ir2 are displayed in the display section 50 in a form showing the relationship between the third information If3 and the second information If2.

[0160] In a case where the input unit 10 (refer to Figure 7 ) inputs initialization of the output form of the thermal analysis result Ir, the setting unit 20 (refer to Figure 12 ) can set the output form to be changeable. In the present example, in a case where the input unit 10 presses the initialization section 63 (refer to Figure 5 ), the setting unit 20 sets the output form of the thermal analysis result Ir to be changeable. In a case where the input unit 10 inputs initialization of the output form of the thermal analysis result Ir, the setting unit 20 can set the first information If1 and the second information If2 to be changeable. In a case where the input unit 10 inputs initialization of the output form of the thermal analysis result Ir, the display control unit 32 can control the display section 50 so that the thermal analysis result Ir displayed in the display section 50 is deleted from the display section 50.

[0161] Figure 4 is Figure 4 another enlarged view of the thermal analysis result display region 58 shown. The thermal analysis result display region 58 can include a calculation region 65 and an analysis condition display region 66. The analysis condition display region 66 is a region in which the thermal analysis result Ir for each analysis condition Ia is displayed in a table form.

[0162] The display control unit 32 (refer to Figure 13 ) can control the display section 50 so that a result calculated for a specific numerical value of the first information If1 or the second information If2 is displayed in the calculation region 65 as the thermal analysis result Ir for each analysis condition Ia. In the present example, the first information If1 is the conductor layer area S, and the second information If2 is the temperature rise AT. In the present example, a result obtained by calculating the temperature rise AT in a case where the conductor layer area S is 5 [mm 2 ] is displayed in the calculation region 65 as each thermal analysis result Ir. The specific numerical value of the first information If1 or the second information If2 can be input by the input unit 10 (refer to Figure 12 ).

[0163] Figure 4 is a view showing Figure 13The analysis conditions shown are illustrated in a diagram of an example of region 66. Control unit 32 is shown (see reference). Figure 13 The display control unit 32 can control the display unit 50 so that the first analysis condition Ia1 and the second analysis condition Ia2 are displayed on the display unit 50 (in this example, they are displayed in the analysis condition display area 66). In this example, the display control unit 32 controls the display unit 50 so that the analysis conditions Ia numbered 1 to 6 are displayed in the analysis condition display area 66.

[0164] The display control unit 32 can control the display unit 50 to display the second thermal analysis condition Ia2 when the display unit 50 is displaying the first thermal analysis condition Ia1. The display control unit 32 can also control the display unit 50 to additionally display each analysis condition Ia based on a different analysis condition Ia in the display unit 50.

[0165] The display control unit 32 can control the display unit 50 so that the differences between the first analysis condition Ia1 and the second analysis condition Ia2 are displayed on the display unit 50 in a mutually recognizable manner. Figure 13 In the example shown, the case where analysis condition Ia is numbered 1 is designated as the first analysis condition Ia1, and the case where analysis condition Ia is numbered 2 is designated as the second analysis condition Ia2. In this example, the difference between the first analysis condition Ia1 and the second analysis condition Ia2 is the resistance value of the current sensing element 43. In this example, the resistance value in the second analysis condition Ia2 is surrounded by a thick frame to identify the difference between the second analysis condition Ia2 and the first analysis condition Ia1. Furthermore, the difference between the second analysis condition Ia2 and the first analysis condition Ia1 can also be displayed in a recognizable manner by coloring it in the analysis condition display area 66.

[0166] exist Figure 14 In the example shown, the case where analysis condition Ia is numbered 5 is designated as the first analysis condition Ia1, and the case where analysis condition Ia is numbered 6 is designated as the second analysis condition Ia2. In this example, the difference between the first analysis condition Ia1 and the second analysis condition Ia2 is the arrangement direction of the substrate 42. In this example, the arrangement direction of the substrate 42 in the second analysis condition Ia2 is enclosed in a thick frame.

[0167] exist Figure 4 In the example shown, the items in the Z-axis direction that are analyzed in cases Ia numbered 1 and 2 are enclosed by thick dashed lines. The region enclosed by these thick dashed lines is designated as region D. Region D will be described later.

[0168] Figure 13is a diagram illustrating another example of the design assistance system 200 according to an embodiment of the present application. In the design assistance system 200 of this example, the design assistance device 100 further includes the detection unit 70. The design assistance system 200 of this example differs from the design assistance system illustrated in Figure 13 .

[0169] The detection unit 70 can detect the height of the current detecting element 43 based on the first current detecting element information Idl. The display control unit 32 can control the display section 50 so that the height of the current detecting element 43 detected by the detection unit 70 is displayed on the display section 50. The height of the current detecting element 43 detected by the detection unit 70 can be displayed on the region D illustrated in Figure 15 .

[0170] In a case where the current detecting element 43 is a magnetic sensor and the current detecting element 143 is a shunt resistor, the structure of the current detecting section using the current detecting element 43 is easier to make smaller than the structure of the current detecting section using the current detecting element 143. The structure of the current detecting section can refer to the height of the current detecting section. Therefore, the size of the device using the current detecting element 43 is easier to make smaller than the size of the device using the current detecting element 143. In this example, the user of the design assistance device 100 can easily compare the height of the current detecting element 43 and the conductor layer area illustrated in the region D in Figure 4 with the height of the current detecting element 143 and the conductor layer area, respectively.

[0171] Figure 4 is a flowchart illustrating an example of the design assistance method according to an embodiment of the present application. The design assistance method according to an embodiment of the present application is an example of the design assistance method in a case where the design assistance system 200 (refer to Figure 4 ) is used.

[0172] The design assistance method includes the output form setting step S102, the analysis condition input step S104, and the display step S110. The design assistance method can include the output form input step S100, the start input step S106, the thermal analysis step S108, and the determination step S112.

[0173] The output form input step S100 is a step in which the input unit 10 (refer to Figure 4 ) sets the output form of the thermal analysis result Ir. The output form input step S100 can be a step in which the input unit 10 inputs the first information Ifl and the second information If2 selected from the substrate information Is, the current detecting element information Id, and the environment information Ie.

[0174] The output form setting step S102 is a step in which the setting unit 20 (refer toFigure 4 ) a step of setting an output form of the thermal analysis result Ir. In the output form setting step S102, the setting unit 20 can set the output form of the thermal analysis result Ir to the output form input in the output form input step S100. The output form setting step S102 can be a step of setting the output form of the thermal analysis result Ir to a form that shows a relationship between the first information Ifl and the second information If2.

[0175] The analysis condition input step S104 is a step in which the input unit 10 (refer to Figure 4 ) inputs the analysis condition Ia including the substrate information Is and the current detecting element information Id. The substrate information Is is information of at least one of the substrate 42 in the thermal analysis object 41 and the substrate 42 in the thermal analysis object 141. The current detecting element information Id is at least one of information of the current detecting element 43 and information of the current detecting element 143.

[0176] The analysis condition input step S104 can be a step in which the input unit 10 inputs at least one of the first current detecting element information Idl and the second current detecting element information Id2. The first current detecting element information Idl is the current detecting element information Id related to the first current detecting element 243 (the current detecting element 43). The second current detecting element information Id2 is the current detecting element information Id related to the second current detecting element 343 (the current detecting element 143).

[0177] In the analysis condition input step S104, the input unit 10 can input the first analysis condition Ial and the second analysis condition Ia2. As described above, the second analysis condition Ia2 is the analysis condition Ia obtained by changing at least one of the substrate information Is and the current detecting element information Id from the first analysis condition Ial.

[0178] The analysis condition Ia can further include environmental information Ie of at least one of the thermal analysis object 41 and the thermal analysis object 141. The environmental information Ie can include at least one of a temperature of an environment of at least one of the thermal analysis object 41 and the thermal analysis object 141, a convective heat transfer rate of the environment, and a radiative heat transfer rate of the environment.

[0179] The start input step S106 is a step in which the input unit 10 (refer to Figure 4 ) inputs a start of the thermal analysis of the thermal analysis object 41 or the thermal analysis object 141. The thermal analysis step S108 is a step in which the thermal analysis unit 40 (refer to Figure 15 ) performs the thermal analysis of the thermal analysis object 41 or the thermal analysis object 141.

[0180] In a case where the input unit 10 has inputted, in the start input step S106, a start of the thermal analysis on the thermal analysis object 41, in the thermal analysis step S108, the thermal analysis unit 40 performs the thermal analysis on the thermal analysis object 41 based on the first analysis condition Ia1 including the current detection element information Idl of the first current detection element 243 (the current detection element 43). In a case where the input unit 10 has inputted, in the start input step S106, a start of the thermal analysis on the thermal analysis object 141, in the thermal analysis step S108, the thermal analysis unit 40 performs the thermal analysis on the thermal analysis object 141 based on the second analysis condition Ia2 including the current detection element information Id2 of the second current detection element 343 (the current detection element 143).

[0181] The display step S110 is a step in which the display control unit 32 displays the thermal analysis result Ir based on the analysis condition Ia in the output form set in the output form setting step S102 on the display section 50. The display step S110 is a step of displaying the first thermal analysis result Ir1 based on the first analysis condition Ia1 inputted in the analysis condition input step S104 and the second thermal analysis result Ir2 based on the second analysis condition Ia2 in a manner that they can be recognized from each other on the display section 50.

[0182] The thermal analysis step S108 can include a first thermal analysis step S108-1 in which the thermal analysis unit 40 performs the thermal analysis on one of the thermal analysis object 41 and the thermal analysis object 141 based on the first analysis condition Ia1 and a second thermal analysis step S108-2 in which the thermal analysis unit 40 performs the thermal analysis on the other of the thermal analysis object 41 and the thermal analysis object 141 based on the second analysis condition Ia2.

[0183] The judgment step S112 is a step in which the control unit 30 (refer to Figure 4 ) judges whether to return to the analysis condition input step S104 after the first thermal analysis step S108-1. In a case where the control unit 30 judges to return to the analysis condition input step S104 in the judgment step S112, the thermal analysis unit 40 can perform the second thermal analysis step S108-2.

[0184] Various embodiments of the present application can be described with reference to flowcharts and block diagrams. In various embodiments of the present application, a block can represent a stage of processing for performing an operation or a part of an apparatus having a role of performing an operation.

[0185] A specific stage can be implemented by a dedicated circuit, a programmable circuit, or a processor. A specific part can be implemented by a dedicated circuit, a programmable circuit, or a processor. The programmable circuit and the processor are provided with computer readable instructions. The computer readable instructions can be saved on a computer readable medium.

[0186] A dedicated circuit can include at least one of a digital hardware circuit and an analog hardware circuit. A dedicated circuit can also include at least one of an integrated circuit (IC) and a discrete circuit. A programmable circuit can include a hardware circuit of a logical AND, a logical OR, a logical XOR, a logical NAND, a logical NOR, and other logical operations. A programmable circuit can also include a reconfigurable hardware circuit including a flip-flop, a register, a field programmable logic gate array (FPGA), a programmable logic array (PLA), and the like memory elements.

[0187] A computer readable medium can include any tangible device that is capable of storing instructions for execution by an appropriate device. Since a computer readable medium includes the tangible device, a computer readable medium having instructions stored therein has a product including the instructions capable of being executed to make a unit for performing operations specified in a flowchart or a block diagram.

[0188] A computer readable medium can be, for example, an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, or the like. More specifically, a computer readable medium can be, for example, a floppy (registered trademark) disk, a magnetic disk, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM or flash memory), an electrically erasable programmable read only memory (EEPROM), a static random access memory (SRAM), a compact disk read only memory (CD-ROM), a digital versatile disk (DVD), a Blu-ray (RTM) disk, a memory stick, an integrated circuit card, or the like.

[0189] Computer readable instructions can include any one of an assembly instruction, an instruction set architecture (ISA) instruction, a machine instruction, a machine dependent instruction, microcode, firmware instruction, state setting data, source code, and object code. The source code and the object code can be described by any combination of one or more programming languages including an object-oriented programming language and an existing procedural programming language. An object-oriented programming language can be, for example, Smalltalk, JAVA (registered trademark), C++, or the like. A procedural programming language can be, for example, a "C" programming language.

[0190] Computer-readable instructions can be provided to the processor or programmable circuitry of a general-purpose computer, special-purpose computer, or other programmable data processing device, either locally or via a wide area network (LAN), the Internet, or similar means. The processor or programmable circuitry of a general-purpose computer, special-purpose computer, or other programmable data processing device can be configured to execute... Figure 14 The flowchart shown or Figure 16 and Figure 15 The unit specified in the block diagram executes computer-readable instructions. The processor can be a computer processor, processing unit, microprocessor, digital signal processor, controller, microcontroller, etc.

[0191] Figure 15 This diagram illustrates an example of a computer 2200 that can be embodied, in whole or in part, in an embodiment of the design assistance device 100 according to an embodiment of the present invention. A program installed in the computer 2200 enables the computer 2200 to function as an operation associated with or one or more parts of the design assistance device 100 according to an embodiment of the present invention, or enables the computer 2200 to execute that operation or those one or more parts, or enables the computer 2200 to execute various stages related to the design assistance method of the present invention (see...). Figure 4 This program can be executed by CPU 2212 to cause computer 2200 to execute the flowchart described in this specification. Figure 14 ) and block diagram ( ​ and ​ () a specific operation associated with several or all of the boxes.

[0192] The computer 2200 of this embodiment includes a CPU 2212, RAM 2214, a graphics controller 2216, and a display device 2218. The CPU 2212, RAM 2214, graphics controller 2216, and display device 2218 are interconnected via a main controller 2210. The computer 2200 also includes input / output units such as a communication interface 2222, a hard disk drive 2224, a DVD-ROM drive 2226, and an IC card driver. The communication interface 2222, hard disk drive 2224, DVD-ROM drive 2226, and IC card driver are connected to the main controller 2210 via an input / output controller 2220. The computer also includes conventional input / output units such as a ROM 2230 and a keyboard 2242. The ROM 2230 and keyboard 2242 are connected to the input / output controller 2220 via an input / output chip 2240.

[0193] The CPU 2212 acts in accordance with a program held in the ROM 2230 and the RAM 2214, thereby controlling the units. The graphics controller 2216 displays image data on the display device 2218 by taking a frame buffer or the like provided in the RAM 2214 or image data generated by the CPU 2212 in the RAM 2214.

[0194] The communication interface 2222 is provided to communicate with other electronic devices via a network. The hard disk drive 2224 holds programs and data used by the CPU 2212 in the computer 2200. The DVD-ROM drive 2226 reads a program or data from the DVD-ROM 2201, and provides the read-out program or data to the hard disk drive 2224 via the RAM 2214. The IC card drive reads a program and data from an IC card, or writes a program and data to the IC card.

[0195] The ROM 2230 holds a boot program or the like executed by the computer 2200 at the time of activation, or a program depending on the hardware of the computer 2200. The input / output chip 2240 can connect various input / output units to the input / output controller 2220 via a parallel port, a serial port, a keyboard port, a mouse port, or the like.

[0196] The programs are provided via the computer-readable medium such as the DVD-ROM 2201 or the IC card. The programs are read from the computer-readable medium, installed in the hard disk drive 2224, the RAM 2214, or the ROM 2230 which are examples of the computer-readable medium, and executed by the CPU 2212. The information processing described in these programs is read by the computer 2200, and the cooperation between the programs and the various types of hardware resources described above is realized. An apparatus or a method can be constituted by the operation or processing of information as the computer 2200 is used.

[0197] For example, in the case where communication is performed between the computer 2200 and an external device, the CPU 2212 can execute a communication program loaded into the RAM 2214, and instruct the communication processing to the communication interface 2222 based on the processing described in the communication program. The communication interface 2222 reads transmission data held in a transmission buffer processing area provided in a recording medium such as the RAM 2214, the hard disk drive 2224, the DVD-ROM 2201, or the IC card under the control of the CPU 2212, transmits the read-out transmission data to a network, or writes reception data received from the network to a reception buffer processing area or the like provided on the recording medium.

[0198] The CPU 2212 can read all or a desired part of a file or a database saved in the external recording medium such as the hard disk drive 2224, the DVD-ROM drive 2226 (DVD-ROM 2201), or an IC card, to the RAM 2214. The CPU 2212 can perform various types of processing on the data on the RAM 2214. Then, the CPU 2212 can write the processed data back to the external recording medium.

[0199] Various types of information such as programs, data, tables, and databases can be saved in the recording medium and subjected to information processing. The CPU 2212 can perform various types of processing on the data read out from the RAM 2214, including various types of operations, information processing, conditional judgment, conditional branching, unconditional branching, search or replacement of information, and the like, specified by the instruction sequence of the program according to the present disclosure. The CPU 2212 can write the results back to the RAM 2214.

[0200] The CPU 2212 can search for information in a file, a database, or the like within the recording medium. For example, in a case where a plurality of entries each having an attribute value of a first attribute associated with an attribute value of a second attribute are saved within the recording medium, the CPU 2212 can search for an entry that matches a condition of specifying an attribute value of the first attribute from among the plurality of entries, read the attribute value of the second attribute saved within the entry, and read the second attribute value, thereby acquiring the attribute value of the second attribute associated with the first attribute that satisfies a condition decided in advance.

[0201] The programs or software modules explained above can be saved on the computer 2200 or a computer-readable medium of the computer 2200. A recording medium such as a hard disk or a RAM provided in a server system connected to a dedicated communication network or the Internet can be used as the computer-readable medium. The programs are provided to the computer 2200 through the recording medium.

[0202] The above has explained the present application using embodiments, but the technical scope of the present application is not limited to the range recited in the above embodiments. It should be clear to those skilled in the art that various changes or modifications can be made to the above embodiments. It should be clear from the recitations of the claims that the modes obtained by making such changes or modifications can also be included in the technical scope of the present application.

[0203] It should be noted that the order of execution of various processes illustrated in the claims, specification, and drawings, such as the order of actions, processes, steps, and stages in devices, systems, programs, and methods, etc., can be changed as long as such changes do not result in misinterpretation of the sequence, unless specifically stated otherwise and are not intended to imply that preceded actions are a prerequisite for any succeeded actions. With respect to the flow of actions in the claims, specification, and drawings, the use of "first," "next," etc. is used for convenience and does not require that the steps be implemented in the order shown.

[0204] BRIEF DESCRIPTION OF DRAWINGS

[0205] 10: input unit; 20: setting unit; 30: control unit; 32: display control unit; 40: thermal analysis unit; 41: thermal analysis object; 42: substrate; 43: current detecting element; 44: conductor layer; 46: connection terminal; 47: conductor layer; 48: opening; 49: opening; 50: display section; 51: output form input area; 52: current detecting element information input area; 53: input area; 54: substrate information input area; 55: environmental information input area; 56: thermal analysis execution area; 57: saving execution area; 58: thermal analysis result display area; 59: analysis condition input area; 60: storage unit; 61: first start section; 62: second start section; 63: initialization section; 64: saving section; 65: calculation area; 66: analysis condition display area; 70: detecting unit; 91: through-hole; 92: through-hole; 93: upper surface; 94: lower surface; 100: design assistance device; 141: thermal analysis object; 143: current detecting element; 200: design assistance system; 243: first current detecting element; 343: second current detecting element; 2200: computer; 2201: DVD-ROM; 2210: main controller; 2212: CPU; 2214: RAM; 2216: graphics controller; 2218: display device; 2220: input / output controller; 2222: communication interface; 2224: hard disk drive; 2226: DVD-ROM drive; 2230: ROM; 2240: input / output chip.

Claims

1. A design aid device, characterized in that, have: The input unit is used to input analysis conditions that include information about the substrate and the current sensing element of the object being thermally analyzed. The display control unit controls the display unit to display the thermal analysis results based on the analysis conditions. The display control unit controls the display unit to display a first thermal analysis result based on a first analysis condition input through the input unit and a second thermal analysis result based on a second analysis condition obtained by changing at least one of the substrate information and the current detection element information from the first analysis condition, in a mutually recognizable manner on the display unit. The analysis conditions also include environmental information of the object being thermally analyzed. The environmental information includes at least one of the temperature of the environment of the object being analyzed, the convective heat transfer rate of the environment, and the radiative heat transfer rate of the environment. The design assistance device also includes a setting unit, which is used to set the output format of the thermal analysis results obtained by the thermal analysis unit. The input unit inputs first information selected from the substrate information, the current sensing element information, and the environmental information, as well as second information different from the first information. The setting unit sets the output format to show the relationship between the first information and the second information. The display control unit controls the display unit to display the first thermal analysis result and the second thermal analysis result in the form set by the setting unit.

2. The design auxiliary device according to claim 1, characterized in that, If, under the condition that the first analysis condition is input through the input unit, the same substrate information as the first analysis condition is input as well as the current detection element information different from the first analysis condition is input as the second analysis condition, the display control unit controls the display unit to display the first thermal analysis result and the second thermal analysis result in a mutually recognizable manner on the display unit.

3. The design assistance device according to claim 1 or 2, characterized in that, If, under the condition that the first analysis condition is input through the input unit, the substrate information is different from the first analysis condition and the current detection element information is the same as the first analysis condition, the display control unit controls the display unit to display the first thermal analysis result and the second thermal analysis result in a mutually recognizable manner on the display unit.

4. The design assistance device according to claim 1 or 2, characterized in that, The current sensing element information includes the temperature coefficient of resistance of the current sensing element. The display control unit controls the display unit to display the information of the current detection element on the display unit.

5. The design assistance device according to claim 1 or 2, characterized in that, The current sensing element information includes at least one of the size of the current sensing element and the resistance value of the current sensing element. The display control unit controls the display unit to display the information of the current detection element on the display unit.

6. The design assistance device according to claim 1 or 2, characterized in that, The substrate associated with the object of thermal analysis has one conductor layer or multiple conductor layers disposed along the thickness direction of the substrate. The substrate information includes at least one of the number of conductor layers, the thickness of the conductor layers, and the area of ​​the conductor layers. The display control unit controls the display unit to display the substrate information on the display unit.

7. The design aid device according to claim 6, characterized in that, When viewed from above, the plurality of conductor layers have the same shape.

8. The design assistance device according to claim 6, characterized in that, When the shape of the first conductor layer among the plurality of conductor layers differs from the shape of the second conductor layer when the substrate is viewed from above, the substrate information includes information about the first conductor layer and information about the second conductor layer.

9. The design aid device according to claim 6, characterized in that, The environmental information also includes at least one of the surface condition of the substrate and the configuration orientation of the substrate.

10. The design assistance device according to claim 6, characterized in that, The environmental information also includes the value of the effective current flowing in the conductor layer.

11. The design assistance device according to claim 1 or 2, characterized in that, When the thermal analysis unit performs thermal analysis on the thermal analysis object, the setting unit sets the form to be unchangeable.

12. The design assistance device according to claim 11, characterized in that, When the setting unit sets the form to be unchangeable, and the input unit inputs third information that is different from the first information and different from the second information, selected from the substrate information, the current detection element information and the environmental information, the display control unit controls the display unit to display a warning.

13. The design assistance device according to claim 11, characterized in that, When the input unit inputs an initialization of the form described above, the setting unit sets the form to be changeable.

14. The design assistance device according to claim 1 or 2, characterized in that, When the output format is set to the specified format, if the input unit inputs third information selected from the substrate information, the current sensing element information, and the environmental information, which is different from both the first and second information, the setting unit changes the output format from the format showing the relationship between the first and second information to a format showing the relationship between the third information and the second information. The display control unit controls the display unit to display the first thermal analysis result and the second thermal analysis result in a form that shows the relationship between the third information and the second information on the display unit.

15. The design assistance device according to claim 1 or 2, characterized in that, Whenever the second analysis condition is input through the input unit, the thermal analysis unit performs thermal analysis on the object to be analyzed. Whenever the thermal analysis unit performs thermal analysis on the thermal analysis object, the display control unit controls the display unit to display the second thermal analysis result on the display unit.

16. The design assistance device according to claim 15, characterized in that, The display control unit controls the display unit while the display unit is displaying the first thermal analysis result, so that the display unit displays the second thermal analysis result.

17. The design assistance device according to claim 1 or 2, characterized in that, The display control unit controls the display unit to display the first analysis condition and the second analysis condition, and the display control unit controls the display unit to display the differences between the first analysis condition and the second analysis condition in a mutually recognizable manner.

18. The design assistance device according to claim 17, characterized in that, The display control unit controls the display unit to display the second analysis condition when the display unit displays the first analysis condition.

19. The design aid device according to claim 1 or 2, characterized in that, It also includes a detection unit that detects the height of the current sensing element based on the information from the current sensing element. The display control unit controls the display unit to display the height of the current detection element detected by the detection unit on the display unit.

20. A design aid device, characterized in that, have: The input unit is used to input analysis conditions that include information about the substrate and the current sensing element of the object being thermally analyzed. The display control unit controls the display unit to display the thermal analysis results based on the analysis conditions. The display control unit controls the display unit to display a first thermal analysis result based on a first analysis condition input through the input unit and a second thermal analysis result based on a second analysis condition obtained by changing at least one of the substrate information and the current detection element information from the first analysis condition, in a mutually recognizable manner on the display unit. The input unit inputs at least one of first current detection element information and second current detection element information, wherein the first current detection element information is current detection element information related to a first current detection element, and the second current detection information is current detection element information related to a second current detection element different from the first current detection element. When the input unit inputs "start thermal analysis of the thermal analysis object including the first current detection element", the thermal analysis unit performs thermal analysis on the thermal analysis object based on the first analysis conditions including the information of the first current detection element. When the input unit inputs "start thermal analysis of the thermal analysis object including the second current detection element", the thermal analysis unit performs thermal analysis on the thermal analysis object based on the second analysis conditions including the information of the second current detection element.

21. The design assistance device according to claim 20, characterized in that, The first current sensing element is one of a magnetic field detection type current sensor and a current-voltage conversion type current sensor, and the second current sensing element is the other of the magnetic field detection type current sensor and the current-voltage conversion type current sensor.

22. The design assistance device according to claim 20 or 21, characterized in that, It also includes a detection unit that detects the height of the current sensing element based on the information from the current sensing element. The display control unit controls the display unit to display the height of the current detection element detected by the detection unit on the display unit.

23. A design-aided method, characterized in that, Includes the following steps: The analysis condition input step involves inputting analysis conditions, including substrate information and current detection element information, into the input unit. as well as In the display step, the display control unit displays the thermal analysis results based on the analysis conditions on the display unit. The display step involves displaying a first thermal analysis result based on a first analysis condition input in the analysis condition input step and a second thermal analysis result based on a second analysis condition obtained by changing at least one of the substrate information and the current detection element information from the first analysis condition on the display unit in a mutually recognizable manner. The analysis conditions also include environmental information of the object being thermally analyzed. The environmental information includes at least one of the temperature of the environment of the object being analyzed, the convective heat transfer rate of the environment, and the radiative heat transfer rate of the environment. The design assistance method further includes the following steps: The output form input step, in which the input unit inputs first information selected from the substrate information, the current sensing element information, and the environmental information, and second information different from the first information; and The output format setting step involves a setting unit setting the output format of the thermal analysis results obtained by the thermal analysis unit. The output format setting step is a step of setting the output format to show the relationship between the first information and the second information.

24. The design assistance method according to claim 23, characterized in that, The current sensing element information includes the temperature coefficient of resistance of the current sensing element.

25. A design-aided method, characterized in that, Includes the following steps: The analysis condition input step involves inputting analysis conditions, including substrate information and current detection element information, into the input unit. as well as In the display step, the display control unit displays the thermal analysis results based on the analysis conditions on the display unit. The display step involves displaying a first thermal analysis result based on a first analysis condition input in the analysis condition input step and a second thermal analysis result based on a second analysis condition obtained by changing at least one of the substrate information and the current detection element information from the first analysis condition on the display unit in a mutually recognizable manner. The analysis condition input step is a step in which the input unit inputs at least one of first current detection element information and second current detection element information, wherein the first current detection element information is current detection element information related to a first current detection element, and the second current detection information is current detection element information related to a second current detection element different from the first current detection element. The design assistance method further includes the following steps: The input unit initiates a step to input the start of thermal analysis of the object being analyzed, either including the first current sensing element or the object including the second current sensing element; and... In the thermal analysis step, the thermal analysis unit performs thermal analysis on the object to be analyzed. When the input unit inputs "start thermal analysis of the thermal analysis object including the first current detection element" in the start input step, the thermal analysis unit performs thermal analysis on the thermal analysis object based on the first analysis conditions including the information of the first current detection element. When the input unit inputs "start thermal analysis of the thermal analysis object including the second current detection element" in the start input step, the thermal analysis unit performs thermal analysis on the thermal analysis object based on the second analysis conditions including the information of the second current detection element.

26. The design assistance method according to claim 25, characterized in that, The thermal analysis step includes a first thermal analysis step and a second thermal analysis step. In the first thermal analysis step, the thermal analysis unit performs thermal analysis on the object to be analyzed based on the first analysis conditions. In the second thermal analysis step, the thermal analysis unit performs thermal analysis on the object to be analyzed based on the second analysis conditions. The design assistance method further includes a decision step, in which the control unit, after the first thermal analysis step, determines whether to return to the analysis condition input step. If the control unit determines in the judgment step that it should return to the analysis condition input step, the thermal analysis unit performs the second thermal analysis step.

27. A computer program product comprising design-aiding program, characterized in that, When the design assistance program is executed by a computer, it implements the steps of the design assistance method according to any one of claims 23 to 26.

28. A computer-readable storage medium storing a design-aiding program, characterized in that, When the design assistance program is executed by a computer, it implements the steps of the design assistance method according to any one of claims 23 to 26.

29. A design assistance system, characterized in that, have: The design aid device according to any one of claims 1 to 22; Thermal analysis unit; The display unit; as well as Storage unit, The storage unit stores at least one of the substrate information, the current detection element information, and the thermal analysis results.

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