Substrate processing equipment

Abstract

The present invention provides a substrate processing device, which comprises: a liquid supply unit for supplying a light source and / or a processing liquid to a substrate; and a voltage applying unit for applying a voltage to the substrate supplied with the light source.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0182612 filed in the Korean Patent Office on December 23, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus for processing a substrate. Background Art

[0004] Recently, the display market has expanded and grown from CRT to various technologies such as LCD and OLED. The small and medium-sized display market is dominated by OLED. Compared with LCD, OLED has a simple structure, low cost, and flexibility, and has developed into the main display of smartphones. In contrast, the large display market is still dominated by LCD. This is because unlike small and medium-sized ones, large OLEDs have high manufacturing costs and a large CAPEX burden.

[0005] Recently, in the large display market, next-generation technologies that aim to replace OLED have emerged. Examples of next-generation technologies that replace OLED include QD-OLED and QNED. In particular, QNED has a structure that uses nanorods (nanorods), which are micro-sized LEDs, as light sources. OLED has problems with short life and aging because it is a structure that emits light from organic matter, but QNED has advantages such as long life and low power consumption because it is a structure that emits light from inorganic LEDs.

[0006] In the process of manufacturing QNED, nanorods used as light sources are supplied (deposited) on thin film transistors (TFT). The supply of nanorods is achieved by supplying a treatment solution containing nanorods to the thin film transistor. The nanorods supplied to the thin film transistor are in a non-aligned state with different length directions. When the nanorods are in such a non-aligned state, the luminous efficiency and clarity of the manufactured QNED will be reduced. In other words, in order to improve the luminous efficiency and clarity of QNED, it is necessary to align the nanorods supplied to the thin film transistor. Summary of the invention

[0007] [Technical issues to be solved]

[0008] An object of the present invention is to provide a substrate processing apparatus capable of efficiently processing a substrate.

[0009] Another object of the present invention is to provide a substrate processing device capable of manufacturing a display with high luminous efficiency and high definition.

[0010] Another object of the present invention is to provide a substrate processing apparatus capable of aligning a light source provided to a substrate.

[0011] Another object of the present invention is to provide a substrate processing apparatus capable of aligning a light source provided to a substrate by applying a voltage to the substrate.

[0012] Another object of the present invention is to provide a substrate processing device that buffers the pressure transmitted to the substrate when a voltage is applied to the substrate to reduce damage to the substrate.

[0013] Another object of the present invention is to provide a substrate processing apparatus that can reduce the risk of a substrate being damaged by collision with the substrate processing apparatus when loading or unloading the substrate into the substrate processing apparatus.

[0014] The purpose of the present invention is not limited to this, and for those skilled in the art, other purposes not mentioned will become more clear through the following description.

[0015] [Technical means to solve technical problems]

[0016] The present invention provides a substrate processing device. A substrate processing device comprises: a liquid supply unit, which is used to supply a processing liquid containing a light source onto a substrate; and a voltage applying unit, which is used to apply a voltage to the substrate supplied with the light source; wherein the voltage applying unit comprises: a voltage applying component, which can be electrically contacted with an electrode of the substrate supplied with the light source, and is connected to a power source to apply a voltage to the electrode supplied with the light source; and a voltage releasing component, which can be electrically contacted with an electrode of the substrate supplied with the light source, and releases the voltage supplied to the electrode of the substrate supplied with the light source.

[0017] According to an embodiment, the voltage applying member and the voltage releasing member include at least one conductive pin contacting the substrate to apply the voltage to the substrate.

[0018] According to an embodiment, the voltage applying component and the voltage releasing component further include a buffer component for buffering pressure applied to the substrate when the conductive pin contacts the substrate.

[0019] According to an embodiment, the voltage applying component further includes a conductive plate connected to a power source; the conductive plate, the buffer component and the conductive pin are electrically connected to each other.

[0020] According to an embodiment, the voltage applying member and the voltage releasing member further include: a housing formed with a slot into which the conductive pin is inserted; and a moving member for moving the conductive pin inserted into the housing.

[0021] According to an embodiment, the moving member moves the housing in an up-down direction.

[0022] According to an embodiment, the moving member moves the housing in a lateral direction.

[0023] According to one embodiment, the moving member rotates the housing around a rotation axis parallel to a moving direction of the substrate.

[0024] According to one embodiment, the device also includes: a workbench unit, which is used to spray gas under the substrate to float the substrate; and a clamping unit, which is used to clamp the floated substrate to move the substrate on the workbench unit; the voltage applying unit is installed on the clamping unit and moves with the clamping unit.

[0025] According to an embodiment, the clamping unit further comprises a clamp for clamping the floated substrate by vacuum adsorption.

[0026] According to one embodiment, the device further includes a workbench unit having a mounting plate on which the substrate is mounted and which can move together with the mounted substrate; the voltage applying unit is mounted on the workbench unit and moves together with the mounting plate.

[0027] In addition, the present invention provides a substrate processing device. A substrate processing device includes: a liquid supply unit, which is used to supply a processing liquid containing a rod-shaped light source with a nanometer unit size to a substrate; and a voltage applying unit, which is used to generate an electric field on the substrate to align the light source supplied to the substrate containing an electrode; wherein the voltage applying unit includes: a voltage applying component, which can be electrically contacted with the electrode of the substrate supplied with the light source, and connected to a power source to apply a voltage to the electrode supplied with the light source; and a voltage releasing component, which can be electrically contacted with the electrode of the substrate supplied with the light source, and release the voltage supplied to the electrode of the substrate supplied with the light source.

[0028] According to one embodiment, the device also includes: a workbench unit, which is used to spray gas under the substrate to float the substrate; and a clamping unit, which is used to clamp one side of the floated substrate and move the clamped substrate to the area below the liquid supply unit; the voltage applying unit is installed on the clamping unit and moves with the clamping unit.

[0029] According to an embodiment, the clamping unit further comprises a clamp for clamping the bottom surface of the floated substrate by vacuum adsorption.

[0030] According to an embodiment, the voltage applying member and the voltage releasing member include at least one conductive pin that is in electrical contact with the electrode formed on the substrate.

[0031] According to an embodiment, the voltage applying component and the voltage releasing component further include a buffer component for buffering pressure applied to the substrate when the conductive pin contacts the substrate.

[0032] According to one embodiment, the apparatus further includes a controller; the controller controls the liquid supply unit and the voltage applying unit to enable the voltage applying unit to apply a voltage to the substrate during the period when the liquid supply unit supplies the processing liquid to the substrate.

[0033] According to one embodiment, the device further includes a controller; the controller controls the liquid supply unit and the voltage applying unit so that the voltage applying unit applies a voltage to the substrate after the liquid supply unit supplies the processing liquid onto the substrate.

[0034] In addition, the present invention provides a substrate processing device. A substrate processing device includes: a workbench unit, which is used to spray gas to the bottom of a glass substrate to float the substrate; a clamping unit, which is used to clamp the floated glass substrate by vacuum adsorption to move the substrate on the workbench unit; a liquid supply unit, which is used to supply a processing liquid containing nanorods as a light source and acetone to the glass substrate by inkjet; a voltage applying unit, which is used to be installed on the clamping unit and apply voltage to the glass substrate supplied with the processing liquid to align the length direction of the nanorods in one direction; wherein the voltage applying unit includes: a voltage applying component, which can be electrically contacted with the electrode of the glass substrate supplied with the nanorods, and connected to a power supply to apply voltage to the electrode of the glass substrate supplied with the nanorods; a voltage releasing component, which can be electrically contacted with the electrode of the glass substrate supplied with the nanorods, and release the voltage supplied to the electrode of the glass substrate supplied with the nanorods.

[0035] According to one embodiment, the voltage applying component and the voltage releasing component include: a conductive pin, which contacts an electrode formed on the glass substrate to apply a voltage to the glass substrate; a buffer component, which is electrically connected to the conductive pin to buffer the pressure transmitted to the glass substrate when the conductive pin contacts the electrode; and a moving component, which is used to change the position of the conductive pin so that the conductive pin can selectively contact the electrode.

[0036] [Technical Effects of the Invention]

[0037] According to an embodiment of the present invention, a substrate can be processed efficiently.

[0038] In addition, according to an embodiment of the present invention, a display with high luminous efficiency and high definition can be manufactured.

[0039] In addition, according to an embodiment of the present invention, the light sources supplied to the substrate can be aligned.

[0040] In addition, according to an embodiment of the present invention, a voltage may be applied to the substrate to align the light source supplied to the substrate.

[0041] In addition, according to an embodiment of the present invention, when a voltage is applied to a substrate, the pressure transmitted to the substrate is buffered to reduce damage on the substrate.

[0042] In addition, according to an embodiment of the present invention, when loading or unloading a substrate into or from a substrate processing apparatus, the risk of the substrate and the substrate processing apparatus being damaged by collision can be reduced.

[0043] The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned can be clearly understood by those skilled in the art through this specification and the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention;

[0045] Figure 2 To express Figure 1 A schematic diagram of a clamping unit and a voltage applying unit;

[0046] Figure 3 To express Figure 2 A cross-sectional view of a clamping unit and a voltage applying unit;

[0047] Figure 4 For a rough representation Figure 2 A schematic diagram of a voltage applying component of a voltage applying unit;

[0048] Figure 5 For a rough representation Figure 2 A schematic diagram of a voltage release component of a voltage applying unit;

[0049] Figure 6 A schematic diagram schematically showing a state of a voltage applying unit according to an embodiment of the present invention viewed from above;

[0050] Figure 7 To express Figure 1 A cross-sectional view of an example of a substrate processed by a substrate processing apparatus;

[0051] Figure 8 To indicate the view from above Figure 1 A schematic diagram of an example of a substrate processed by a substrate processing apparatus;

[0052] Fig. 9 To express Figure 8 A schematic diagram of a state where a substrate supplies a light source;

[0053] Fig.10 To express Fig. 9 A schematic diagram of a state in which a voltage is applied to a substrate to align the light source;

[0054] Fig.11 A cross-sectional view schematically showing a voltage applying unit according to another embodiment of the present invention;

[0055] Fig.12 A cross-sectional view schematically showing a voltage applying unit according to another embodiment of the present invention;

[0056] Fig.13 A schematic diagram showing a substrate processing device according to another embodiment of the present invention;

[0057] Fig.14 To express Fig.13 Schematic diagram of a voltage applying unit.

[0058] * Reference Numbers *

[0059] 1000: Substrate processing equipment

[0060] G: Substrate

[0061] 10: Thin Film Transistor Layer

[0062] 20: Luminous layer

[0063] 21: First electrode

[0064] 22: Second electrode

[0065] 23: Nanorods

[0066] 24: Insulation layer

[0067] 30: Polarizing layer

[0068] 40: Color filter layer

[0069] 100: Workbench unit

[0070] 110: Workbench

[0071] 112: Gas injection hole

[0072] 120: Support structure

[0073] 200: Liquid supply unit

[0074] 300: Clamping unit

[0075] 310: Transfer framework

[0076] 321: First transport track

[0077] 322: Second transport track

[0078] 331: First moving part

[0079] 332: Second mobile unit

[0080] 333: Connecting plate

[0081] 340: Combined Framework

[0082] 350: Clamp

[0083] 352: Adsorption Department

[0084] 400, 500, 600: Voltage application unit

[0085] 410, 510, 610: Electrical contact parts

[0086] 420, 620: Conductive pins

[0087] 430: Buffer components

[0088] 440: Conductive plate

[0089] 450: Power application line

[0090] 460: Power

[0091] 470, 570, 670: Moving parts

[0092] 471: Vertical Frame

[0093] 472: Vertical Track

[0094] 474: Vertical drive unit

[0095] 672: Horizontal Track

[0096] 674: Horizontal drive unit

[0097] 2000: Substrate processing equipment

[0098] 1100: Workbench unit

[0099] 1110: Installation board

[0100] 1120: Transport track

[0101] 1200: Liquid supply unit

[0102] 1400: Voltage application unit

[0103] 1410: Main body

[0104] 1420: Combined plate

[0105] 1430: Lifting track

[0106] 1440: Lifting plate

[0107] 1450: Fixed plate

[0108] 1460: Lifting drive unit DETAILED DESCRIPTION

[0109] Below, various embodiments of the present invention are described in detail in conjunction with the accompanying drawings to help those skilled in the art better understand the present invention. However, the present invention can be implemented in various forms without being limited by the embodiments described herein. In addition, in the process of describing the present invention in detail, if it is considered that the specific description of the relevant disclosed functions or structures hinders the understanding of the present invention, its detailed description will be omitted. In addition, for parts that play similar functions and effects, the same marks are used in all the drawings.

[0110] When a certain component is said to be "included", other components are not excluded, but may be included, unless there is an expected record to the contrary. Specifically, the terms "include" or "have" indicate the existence of features, numbers, steps, operations, structures, components or combinations thereof recorded in the specification, but do not exclude the existence or additional possibility of one or more other features, numbers, steps, operations, structures, components or combinations thereof in advance.

[0111] If there is no obvious distinction in the context, the singular description includes the plural meaning. In addition, the shapes and sizes of the elements in the drawings may be exaggerated for a clearer description.

[0112] The input "and / or" includes all combinations of one or more of the listed items. In addition, in this specification, the terms "connect" and "combine" not only refer to the case where component A and component B are directly connected, but also refer to the case where component A and component B are indirectly connected by adding component C between component A and component B.

[0113] Next, combine Figures 1 to 14 , embodiments of the present invention are described.

[0114] Figure 1 FIG. 1 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention. Figure 2 To express Figure 1 Schematic diagram of the clamping unit and voltage applying unit. Figure 1 and Figure 2As shown, a substrate processing apparatus 1000 according to an embodiment of the present invention processes a substrate G by supplying a light source and / or a processing liquid to the substrate G. The substrate processing apparatus 1000 can process the substrate G by supplying a processing liquid containing nanorods as a light source to the substrate G. In addition, the substrate G can be a glass substrate. Specifically, the substrate G can be a mother glass.

[0115] The substrate processing apparatus 1000 may include a stage unit 100 , a liquid supply unit 200 , a clamping unit 300 , a voltage applying unit 400 , and a controller (not shown).

[0116] The workbench unit 100 can float the substrate G. The workbench unit 100 may include a workbench 110 and a support structure 120. The workbench 110 may be supported by the support structure 120. On the workbench 110, at least one gas injection hole 112 for injecting gas may be formed. For example, on the workbench 110, a plurality of gas injection holes 112 for injecting gas may be formed. The gas injection holes 112 formed on the workbench 110 may be formed spaced apart from each other. The gas injection holes 112 formed on the workbench 110 may be formed at the same intervals from each other. When viewed from above, the gas injection holes 112 formed on the workbench 110 may be spaced apart from each other in a grid shape. The gas injection holes 112 inject gas to the bottom of the substrate G loaded on the substrate processing apparatus 1000 to float the substrate G.

[0117] The liquid supply unit 200 can supply the processing liquid to the substrate G loaded on the substrate processing device 1000. The liquid supply unit 200 can supply the processing liquid in an inkjet manner. For example, the liquid supply unit 200 can be an inkjet head module that supplies the processing liquid in an inkjet manner. The liquid supply unit 200 can be moved by a driving component not shown. For example, the liquid supply unit 200 can move in a direction perpendicular to the moving direction of the substrate G observed from the top. For example, the liquid supply unit 200 can move in the left-right direction. The liquid supply unit 200 can discharge the processing liquid in an inkjet manner while moving in the left-right direction.

[0118] The treatment liquid supplied by the liquid supply unit 200 may include a light source. For example, the treatment liquid supplied by the liquid supply unit 200 may be a treatment liquid in which acetone is mixed with the light source. The light source contained in the treatment liquid may be a nanorod (Nanorods) as a fine LED. The nanorod may be an inorganic substance. The nanorod may be a blue LED (blue LED) of a nanometer unit size. The nanorod may have a pillar shape. The nanorod may be a core / shell (Core / Shell) shaped structure LED.

[0119] The clamping unit 300 can clamp the substrate G. The clamping unit 300 can clamp the substrate G floated by the workbench unit 100. The clamping unit 300 can clamp one side of the substrate G floated by the workbench unit 100. The clamping unit 300 can clamp one side of the bottom surface of the substrate G by vacuum adsorption. In addition, the clamping unit 300 can move the substrate G on the workbench unit 100. The clamping unit 300 can move the clamped substrate G linearly. The clamping unit 300 can move the clamped substrate G to the lower area of ​​the liquid supply unit 200. The clamping unit 300 can move the clamped substrate G linearly in the lower area of ​​the liquid supply unit 200 while the liquid supply unit 200 supplies the processing liquid.

[0120] The voltage applying unit 400 may apply a voltage to the substrate G to which the nanorods as the light emitting sources are supplied. The voltage applying unit 400 generates an electric field on the substrate G by applying a voltage to the substrate G to which the nanorods are supplied. If the voltage applying unit 400 generates an electric field on the substrate G, the nanorods supplied to the substrate G may be aligned in one direction. The voltage applying unit 400 may be provided in two directions in a direction parallel to the moving direction of the substrate. In one embodiment, the voltage applying unit 400 may include a first voltage applying unit 400-1 on a first side and a second voltage applying unit 400-2 on a second side opposite to the first side.

[0121] In addition, the voltage applying unit 400 may be installed on the clamping unit 300. In addition, the voltage applying unit 400 may provide at least one. For example, the voltage applying unit 400 may provide a plurality of voltage applying units. For example, the voltage applying unit 400 may provide three first voltage applying units 400-1 located on the first side and three second voltage applying units 400-2 located on the second side. However, it is not limited, and the number of the voltage applying units 400 may be changed in various forms.

[0122] Next, combine Figure 3 , Figure 4 and Figure 5 The clamping unit 300 and the voltage applying unit 400 of the substrate processing apparatus 1000 according to an embodiment of the present invention are described in detail. In addition, when a plurality of voltage applying units 400 are installed in the clamping unit 300, the structures of the voltage applying units 400 may be the same or similar. Figure 3 To express Figure 2 A cross-sectional view of a clamping unit and a voltage applying unit, and Figure 4 For a rough representation Figure 2 Schematic diagram of a voltage applying component of a voltage applying unit. Figure 5 For a rough representation Figure 2 Schematic diagram of a voltage releasing component of a voltage applying unit.

[0123] like Figure 3 , Figure 4 and Figure 5 As shown, the clamping unit 300 may include a transfer frame 310 , transfer rails 321 and 322 , a first moving portion 331 , a second moving portion 332 , a connecting plate 333 , a combining frame 340 , and a clamp 350 .

[0124] The transfer frame 310 may support transport rails 321 and 322. The transport rails 321 and 322 may provide a moving path for the clamp 350 to move. The transport rails 321 and 322 may include a first transport rail 321 and a second transport rail 322. The length direction of the first transport rail 321 may be parallel to the moving direction of the substrate G. When viewed from above, the length direction of the second transport rail 322 may be perpendicular to the moving direction of the substrate G.

[0125] The first moving part 331 can move the clamp 350 in the front-back direction. The first moving part 331 can be a main body that moves along the first transport rail 321. The first moving part 331 can include a groove having a shape corresponding to the first transport rail 321. At least one first moving part 331 can be provided. For example, the first moving part 331 can be provided in a number corresponding to the first transport rail 321. For example, when a pair of transport rails 320 are provided, a pair of first moving parts 331 can also be provided.

[0126] The second moving part 332 may move the clamp 350 in the left-right direction. The second moving part 332 may be a main body that moves along the second transport rail 322. The second moving part 332 may include a groove having a shape corresponding to the second transport rail 322.

[0127] Since the clamping unit 300 includes the first moving part 331, the second moving part 332, the first transport rail 321, and the second transport rail 322, the clamp 350 can move in the front-back and left-right directions. For example, if the first moving part 331 moves in the front-back direction, the position of the clamp 350 also changes in the front-back direction. In addition, if the second moving part 332 moves in the left-right direction, the position of the clamp 350 also changes in the left-right direction.

[0128] The coupling frame 340 can be coupled to the clamp 350. In addition, the voltage applying unit 400 can be coupled to the coupling frame 340. That is, the coupling frame 340 can be a main body for coupling the clamp 350 and the voltage applying unit 400. In addition, the coupling frame 340 can be coupled to the first moving part 331 through the connecting plate 333.

[0129] The clamp 350 can grip the substrate G. The clamp 350 can grip one side of the substrate G. The clamp 350 can grip the bottom surface of one side of the substrate G. In addition, the clamp 350 can grip the substrate G by vacuum adsorption. For example, the clamp 350 may include an adsorption portion 352 forming at least one vacuum adsorption hole (not shown). The vacuum adsorption hole formed with the adsorption portion 352 adsorbs the bottom surface of one side of the substrate G. Therefore, even if the substrate G floats on the workbench unit 100, its height can be maintained at a specified height. In addition, the clamp 350 can move linearly while adsorbing the bottom surface of the substrate G, so the substrate G can be moved in the front-rear direction.

[0130] The voltage applying unit 400 may apply voltage to the substrate G. The voltage applying unit 400 includes an electrical contact member 410. The electrical contact member 410 includes a voltage applying member 411 and a voltage releasing member 412. The electrical contact member 410 includes a housing, a conductive pin 420, a buffer member 430, and a conductive plate 440.

[0131] When viewed in cross section, the shell is roughly The housing may have a substantially curved plate shape. A conductive pin 420 is exposed at one end of the housing. For example, a slot for inserting the conductive pin 420 may be formed on the housing.

[0132] The conductive pin 420 may contact the substrate G to apply a voltage to the substrate G. The conductive pin 420 may contact an electrode formed on the substrate G, and a voltage may be applied to the substrate G by applying a voltage to the electrode. The conductive pin 420 may contact an electrode formed on the substrate G, and an electric field may be generated on the substrate G by applying a voltage to the electrode. The conductive pin 420 may include a head portion that allows the conductive pin 420 to be hooked to a groove formed in the housing to prevent the conductive pin 420 from being detached, and a contact portion extending downward from the head portion.

[0133] In addition, the voltage applying unit 400 may further include a buffer member 430. The buffer member 430 may be provided between the head of the conductive pin 420 and the conductive plate 440. The conductive plate 440 may be a plate connected to the power applying wire 451 or the power releasing wire 452 connected to the power source 460. The buffer member 430 may be a member that buffers the pressure transmitted to the substrate G when the conductive pin 420 contacts the upper surface of the substrate G. For example, the buffer member 430 may have a spring shape.

[0134] In addition, the conductive pin 420, the buffer component 430 and the conductive plate 440 may be made of conductive materials. The conductive pin 420, the buffer component 430 and the conductive plate 440 may be electrically connected to each other.

[0135] The voltage applying member 411 is a member for applying voltage to the substrate G. The voltage applying member 411 is connected to the power applying wire 451. The power applying wire 451 and the conductive plate 440 may be electrically connected to each other. Therefore, if the power source 460 applies a voltage to the conductive plate 440, the applied voltage may be transmitted to the conductive pin 420 through the buffer member 430. In addition, the conductive pin 420 may be located at a position opposite to the adsorption portion 352 of the clamp 350.

[0136] The voltage release part 412 is a part that releases the voltage applied from the voltage applying part 411. The voltage release part 412 is connected to the power release line 452. The power release line 452 and the conductive plate 440 may be electrically connected to each other.

[0137] The moving part 470 can move the conductive pin 420. For example, the moving part 470 can move the housing in which the conductive pin 420 is inserted. The moving part 470 can move the housing in the up-down direction. As an example, the moving part 470 may include a vertical frame 471, a vertical track 472, and a vertical driving part 474. The vertical frame 471 may be a structure fixedly mounted on the aforementioned coupling frame 340. On the vertical frame 471, a vertical track 472 extending in the vertical direction may be mounted. The vertical track 472 may be provided with a vertical driving part 474. The vertical driving part 474 may be coupled to the housing. The vertical driving part 474 may be movable in the up-down direction along the vertical track 472. Therefore, the housing coupled to the vertical driving part 474 also moves in the up-down direction. Since the housing can be movable in the up-down direction, the conductive pin 420 inserted into the housing can selectively contact the upper surface of the substrate G.

[0138] Figure 6 Schematic diagram schematically showing the state of a voltage applying unit according to an embodiment of the present invention as viewed from above. Figure 6 As shown, a plurality of panels P are provided on a substrate G made of mother glass. As an example shown in the figure, two panels P are provided on a substrate G made of mother glass. The first panel P1 obtains a positive voltage through a first voltage applying component provided with a first voltage applying unit 400-1 on the first side, and releases the voltage applied by the first voltage releasing component 400-2. The second panel P2 obtains a positive voltage through a first voltage applying component provided with a second voltage applying unit 400-2 on the second side, and releases the voltage applied by the second voltage releasing component 400-2. As will be described later, the voltage applied to the panel P aligns the nanorods 23 on the first electrode 21. Figure 7 To express Figure 1 A cross-sectional view of an example of a substrate processed by a substrate processing device. Figure 7 As shown, the substrate G processed and manufactured by the substrate processing apparatus 1000 according to an embodiment of the present invention may include a thin film transistor layer 10 , a light emitting layer 20 , a polarizing layer 30 and a color filter layer 40 .

[0139] The thin film transistor layer 10 can be made of materials such as In, Ga, Zn, oxide, etc. Figure 7 The structure of the thin film transistor layer 10 shown is only an example, and the structure of the thin film transistor layer 10 can be modified into various known thin film transistor layers 10 .

[0140] The light emitting layer 20 may be a layer where the nanorods 23 as the light source emit light. The light emitting layer 20 may include a first electrode 21, a second electrode 22, and an insulating layer 24. The nanorods 23 may be provided between the first electrode 21 and the second electrode 22.

[0141] The first electrode 21 may be formed on the thin film transistor layer 10. The first electrode 21 may be formed by depositing ITO or Al, Ti, Au or other materials by physical vapor deposition (PVD) and etching by wet etching. In addition, the first electrode 21 may be an electrode in contact with the conductive pin 420.

[0142] The insulating layer 24 may be SiN or SiO 2 The materials are deposited by chemical vapor deposition (CVD).

[0143] The second electrode 22 is provided on the upper part of the nanorod 23. The second electrode 22 can be formed by depositing materials such as Ti / Au or ITO by physical vapor deposition (PVD) and then by exposure / etching. In addition, the second electrode 22 can be an electrode for driving the nanorod 23.

[0144] The polarizing layer 30 may be a layer that polarizes light generated by the nanorods 23 .

[0145] The color filter layer 40 may be a layer that adds R, G, and B colors to the light generated by the nanorods 23. For example, when the nanorods 23 are fine-sized Blue LEDs, the color filter layer 40 plays a role in adding R, G, and B colors to the blue light generated by the nanorods 23 as Blue LEDs.

[0146] The substrate processing apparatus 1000 according to an embodiment of the present invention can supply a processing liquid including the nano-rods 23 onto the first electrode 21 of the substrate G, and align the direction of the nano-rods 23 supplied onto the first electrode 21 .

[0147] Next, a method for supplying nanorods 23 to a substrate G and aligning the supplied nanorods 23 using a substrate processing apparatus 1000 according to an embodiment of the present invention is described. The controller may control the substrate processing apparatus 1000 to perform the substrate processing method described below. For example, the controller controls the liquid supply unit 200 and the voltage applying unit 400 so that the voltage applying unit 400 applies a voltage to the substrate G during the period when the liquid supply unit 200 supplies the processing liquid to the substrate G. Conversely, the controller controls the liquid supply unit 200 and the voltage applying unit 400 so that the voltage applying unit 400 applies a voltage to the substrate G after the liquid supply unit 200 supplies the processing liquid to the substrate G.

[0148] For example, Figure 8 As shown, the thin film transistor layer 10 is provided with a first electrode 21. The substrate G provided with the first electrode 21 may be loaded into the substrate processing apparatus 1000. The substrate G loaded into the substrate processing apparatus 1000 is floated by the gas ejected by the workbench unit 100, and the floated substrate G may be clamped by the clamping unit 300. In addition, the floated substrate G may be moved by the clamping unit 300 to the lower area of ​​the liquid supply unit 200.

[0149] The substrate G moves to the area below the liquid supply unit 200, and the liquid supply unit 200 can supply the processing liquid to the substrate G. The processing liquid supplied by the liquid supply unit 200 can be a liquid for mixing the nanorods 23 with acetone. Fig. 9 As shown, the nanorods 23 are in a non-aligned state. When the nanorods 23 are in a non-aligned state, the luminous efficiency and clarity of the manufactured display (e.g., QNED) will be reduced. This is because when the nanorods 23 are in a non-aligned state, the light generated by each nanorod 23 interferes with each other. Therefore, it is very important to align the nanorods 23 in one direction.

[0150] In the substrate processing apparatus 1000 according to an embodiment of the present invention, the conductive pin 420 contacts the first electrode 21 of the substrate G, and the conductive pin 420 applies a voltage to the first electrode 21. The conductive pin 420 applies a voltage to the first electrode 21, and an electric field is generated on the substrate G. Fig.10 As shown, the generated electric field aligns the nanorods 23 in one direction. When the nanorods 23 are aligned, the light generated by the nanorods 23 do not interfere with each other, thereby improving the luminous efficiency and clarity of the manufactured display.

[0151] In addition, as described above, the voltage applying unit 400 includes the buffer member 430. Therefore, when the conductive pin 420 contacts the first electrode 21, the pressure applied to the first electrode 21 can be relieved, thereby reducing damage to the substrate G, specifically the first electrode 21.

[0152] Fig.11 FIG. 2 is a cross-sectional view schematically showing a voltage applying unit according to another embodiment of the present invention. Fig.11 The structure of the voltage applying unit 500 shown is the same as or similar to the structure of the voltage applying unit 400 described above, except for the structure described below.

[0153] The voltage applying unit 500 may include a moving part 570 that can selectively make the conductive pin 520 contact the substrate G. The moving part 570 can rotate the electrical contact part 510 around a rotation axis that is parallel to the moving direction of the substrate G. That is, since the electrical contact part 510 can rotate around the rotation axis, when the substrate G is loaded or unloaded on the workbench unit 100, the risk of collision between the substrate G and the electrical contact part 510 can be further reduced.

[0154] Fig.12 FIG. 2 is a cross-sectional view schematically showing a voltage applying unit according to another embodiment of the present invention. Fig.12 The structure of the voltage applying unit 600 shown is the same as or similar to the structure of the voltage applying units 400 and 500 described above, except for the structure described below. The voltage applying unit 600 may include a moving part 670 that can selectively contact the conductive pin 520 with the substrate G. The moving part 670 may include a horizontal rail 672 installed on the clamp 350 and a horizontal driving part 674 that moves along the horizontal rail 672. The electric contact part 610 may be combined with the horizontal driving part 674. That is, the moving part 670 can move the electric contact part 610 in the lateral direction, more specifically, in the left-right direction which is a direction perpendicular to the moving direction of the substrate G viewed from the top. That is, since the electric contact part 610 can move in the left-right direction, when the substrate G is loaded or unloaded on the workbench unit 100, the risk of collision between the substrate G and the electric contact part 610 can be further reduced.

[0155] In the above example, the workbench unit 100 sprays gas to the bottom of the substrate G to make the substrate G float. The workbench unit 100 floats the substrate G in a non-contact manner, which has the advantage of reducing the generation of dust and static electricity. However, the embodiments of the present invention are not limited thereto. For example, Fig.13 As shown, a substrate processing apparatus 2000 according to another embodiment of the present invention may include a workbench unit 1100, a liquid supply unit 1200, and a voltage applying unit 1400. Since the structure and function of the liquid supply unit 1200 are the same or similar to those of the aforementioned liquid supply unit 200, they will not be described in detail herein.

[0156] The workbench unit 1100 may include a mounting plate 1110 and a transport track 1120. The mounting plate 1110 provides a mounting surface for mounting the substrate G. Vacuum adsorption holes are formed on the mounting plate 1110 to hold the substrate G by vacuum adsorption. In addition, the mounting plate 1110 may move linearly in the front-rear direction along the transport track 1120. As the mounting plate 1110 moves along the transport track 1120, the substrate G may move to the lower area of ​​the liquid supply unit 1200.

[0157] In addition, the voltage applying unit 1400 may be mounted on the table unit 1100. For example, the voltage applying unit 1400 may be mounted on the table unit 1100 and moved together with the mounting plate 1110. The structure of the voltage applying unit 1400 is the same as or similar to the structure of the voltage applying units 400, 500, and 600 described above except for the following contents.

[0158] Fig.14 To express Fig.13 Schematic diagram of the voltage applying unit. Fig.14 As shown, the voltage applying unit 1400 may include an electrical contact component 1410, a coupling plate 1420, a lifting rail 1430, a lifting plate 1440, a fixing plate 1450, and a lifting driving unit 1460. The structure of the electrical contact component 1410 is different from the structure of the aforementioned electrical contact components 410, 510, and 610 in terms of only a part of the shape, and therefore, it is not described here in detail. The coupling plate 1420 is a plate coupled to the workbench unit 1100. A lifting rail 1430 for providing a path for the electrical contact component 1410 to be lifted and lowered may be installed on the coupling plate 1420. At least one lifting rail 1430 may be provided. For example, a pair of lifting rails 1430 may be provided. The lifting plate 1440 is a structure that can move in the up-down direction along the lifting rail 1430. The lifting plate 1440 can move in the up-down direction using the driving force generated by the lifting driving unit 1460. In addition, the aforementioned electrical contact component 1410 may be coupled to the lifting plate 1440. For example, the lifting plate 1440 may be fixedly coupled to the electrical contact component 1410 by means of the fixing plate 1450.

[0159] In the aforementioned embodiment of the electrical contact component and the aspect of the substrate G electrically contacting and aligning the nanorods 23, the voltage application can be performed while supplying the treatment liquid containing the nanorods 23. In addition, in the aforementioned embodiment of the electrical contact component and the aspect of the substrate G electrically contacting and aligning the nanorods 23, the voltage application can be performed after supplying the treatment liquid containing the nanorods 23.

[0160] The above detailed description is an example of the present invention. In addition, the above content only describes the preferred embodiment of the present invention, and the present invention can be used in various other combinations and modified environments. That is, changes or modifications can be made within the conceptual scope of the invention provided by the present invention, the content of the description and the scope of equality and / or the scope of the technology or knowledge in the field. The embodiments illustrate the best state of the user to implement the technical idea of ​​the present invention, but various changes required for the specific application field and use of the present invention can also be made. Therefore, the above detailed description of the present invention does not limit the present invention. In addition, the attached claims should be understood to also include other embodiments.

Claims

1. A substrate processing device, the substrate processing device include: A liquid supply unit, the liquid supply unit being used to supply a processing liquid containing a light emitting source onto the substrate; a voltage applying unit for applying a voltage to the substrate supplied with the light source; A workbench unit, the workbench unit is used to spray gas to the bottom of the substrate to make the substrate float; a clamping unit, the clamping unit being used to clamp the floating substrate so that the substrate moves on the workbench unit, and having a clamp for clamping the floating substrate at the bottom edge of the substrate by vacuum adsorption, wherein the clamp includes an adsorption portion for adsorbing the bottom edge of the substrate; wherein the voltage applying unit is mounted on the clamping unit and moves together with the clamping unit; Wherein, the voltage applying unit comprises: a voltage applying member disposed in electrical contact with an electrode of the substrate supplied with the light source, and connected to a power source to apply a voltage to the electrode supplied with the light source; a voltage release component, the voltage release component being arranged to be in electrical contact with an electrode of the substrate supplied with the light source, and releasing a voltage supplied to the electrode of the substrate supplied with the light source; The voltage applying component and the voltage releasing component include at least one conductive pin that contacts the substrate to apply voltage to the substrate, and the conductive pin is located at a position opposite to the adsorption portion of the clamp of the clamping unit.

2. The substrate processing device according to claim 1, Features: The voltage applying part and the voltage releasing part further include a buffer part for buffering a pressure applied to the substrate when the conductive pin contacts the substrate.

3. The substrate processing device according to claim 2, Features: The voltage applying component also includes a conductive plate connected to a power source; The conductive plate, the buffer member, and the conductive pin are electrically connected to each other.

4. The substrate processing apparatus according to claim 1, Features: The voltage applying component and the voltage releasing component further include: a housing formed with a slot into which the conductive pin is inserted; and A moving part is used to move the conductive pin inserted into the housing.

5. The substrate processing device according to claim 4, Features: The moving member moves the housing in an up-down direction.

6. The substrate processing apparatus according to claim 4, Features: The moving member moves the housing in a lateral direction.

7. The substrate processing apparatus according to claim 4, Features: The moving member rotates the housing around a rotation axis parallel to a moving direction of the substrate.

8. A substrate processing device, the substrate processing device include: A liquid supply unit, the liquid supply unit is used to supply a processing liquid containing a rod-shaped light source having a nanometer unit size onto the substrate; and a voltage applying unit for generating an electric field on the substrate to align the light emitting source supplied to the substrate including the electrode; A workbench unit, the workbench unit is used to spray gas to the bottom of the substrate to make the substrate float; a clamping unit, the clamping unit being used to clamp the floating substrate so that the substrate moves on the workbench unit, and having a clamp for clamping the floating substrate at the bottom edge of the substrate by vacuum adsorption, wherein the clamp includes an adsorption portion for adsorbing the bottom edge of the substrate; The voltage applying unit is mounted on the clamping unit and moves together with the clamping unit; Wherein, the voltage applying unit comprises: a voltage applying member, the voltage applying member being arranged to be in electrical contact with an electrode of the substrate supplied with the light source, and being connected to a power source to apply a voltage to the electrode supplied with the light source; a voltage release component, the voltage release component being arranged to be in electrical contact with an electrode of the substrate supplied with the light source, and releasing a voltage supplied to the electrode of the substrate supplied with the light source; The voltage applying part and the voltage releasing part include at least one conductive pin that contacts the substrate to apply a voltage to the substrate, the conductive pin being located at a position opposite to the adsorption portion of the clamp of the clamping unit.

9. The substrate processing apparatus according to claim 8, Features: The voltage applying part and the voltage releasing part further include a buffer part for buffering a pressure applied to the substrate when the conductive pin contacts the substrate.

10. The substrate processing apparatus according to claim 8 or 9, Features: The device also includes a controller; The controller is configured to control the liquid supply unit and the voltage applying unit so that the voltage applying unit applies a voltage to the substrate while the liquid supply unit supplies the processing liquid onto the substrate.

11. The substrate processing apparatus according to claim 8 or 9, Features: The device also includes a controller; The controller is configured to control the liquid supply unit and the voltage applying unit so that the voltage applying unit applies a voltage to the substrate after the liquid supply unit supplies the processing liquid onto the substrate.

12. A substrate processing device, the substrate processing device include: A workbench unit, the workbench unit is used to spray gas to the bottom of the glass substrate to make the substrate float; a clamping unit, the clamping unit being used to clamp the floating glass substrate so that the substrate moves on the workbench unit, the clamping unit having a clamp for clamping the floating substrate at the bottom edge of the substrate by vacuum adsorption, wherein the clamp includes an adsorption portion for adsorbing the bottom edge of the substrate; A liquid supply unit, the liquid supply unit is used to supply a processing liquid containing nanorods as light sources and acetone to the glass substrate by inkjet method; a voltage applying unit, the voltage applying unit being installed at the clamping unit and applying a voltage to the glass substrate supplied with the processing liquid so as to align the length direction of the nanorods in one direction; wherein the voltage applying unit is mounted on the clamping unit and moves together with the clamping unit; Wherein, the voltage applying unit comprises: a voltage applying member disposed in electrical contact with the electrode of the glass substrate to which the nanorods are supplied, and connected to a power source to apply a voltage to the electrode of the glass substrate to which the nanorods are supplied; a voltage releasing component, the voltage releasing component being arranged to be in electrical contact with the electrode of the glass substrate supplied with the nanorods, and releasing the voltage supplied to the electrode of the glass substrate supplied with the nanorods; The voltage applying part and the voltage releasing part include at least one conductive pin that contacts the substrate to apply a voltage to the substrate, the conductive pin being located at a position opposite to the adsorption portion of the clamp of the clamping unit.

13. The substrate processing apparatus according to claim 12, Features: The voltage applying component and the voltage releasing component include: a buffer component electrically connected to the conductive pin to buffer pressure transmitted to the glass substrate when the conductive pin contacts the electrode; and A moving component is used to change the position of the conductive pin so that the conductive pin can selectively contact the electrode.

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