Optical chip subassembly, optical chip, and method for assembling optical chip

Abstract

An optical chip subassembly, an optical chip, and a method for assembling an optical chip. The optical chip subassembly includes: an input / output interface, including a plurality of first-type physical interfaces and a plurality of second-type physical interfaces; and an optical functional device optically coupled to at least some of the plurality of first-type physical interfaces and the plurality of second-type physical interfaces. The plurality of first-type physical interfaces are configured to be detachably connectable to the second-type physical interfaces of a first another optical chip subassembly, and the plurality of second-type physical interfaces are configured to be detachably connectable to the first-type physical interfaces of a second another optical chip subassembly, so that the optical functional device can optically communicate with the optical functional devices in the first another optical chip subassembly and the optical functional devices in the second another optical chip subassembly via at least some of the physical interfaces.

Description

Technical Field

[0001] The present disclosure generally relates to optical chip technology, and more particularly to an optical chip subassembly, an optical chip, and a method of assembling an optical chip. Background Art

[0002] The interior of an optical chip (e.g., a field programmable optical chip) usually contains some basic unit combination arrays, which can be connected in a specific way according to functional requirements. With the rapid growth of application requirements, large-scale programmable optical chips need to retain scalability while realizing complex functions.

[0003] However, the larger scale of optical chips brings many technical problems, such as reduced chip yield, increased calibration difficulty, etc. In addition, optical chips are usually not scalable after tape-out. Summary of the invention

[0004] It would be advantageous to provide a mechanism that alleviates, mitigates, or even eliminates one or more of the above-mentioned problems.

[0005] According to one aspect of the present disclosure, an optical chip sub-assembly is provided, comprising: an input / output interface, including a plurality of first-type physical interfaces and a plurality of second-type physical interfaces; and an optical functional device optically coupled to at least some of the plurality of first-type physical interfaces and the plurality of second-type physical interfaces, wherein the plurality of first-type physical interfaces are configured to be detachably connectable with the second-type physical interfaces of a first another optical chip sub-assembly, and the plurality of second-type physical interfaces are configured to be detachably connectable with the first-type physical interfaces of a second another optical chip sub-assembly, so that the optical functional device can optically communicate with the optical functional devices in the first another optical chip sub-assembly and the optical functional devices in the second another optical chip sub-assembly via the at least some of the physical interfaces.

[0006] According to another aspect of the present disclosure, an optical chip is provided, comprising: a plurality of optical chip subassemblies. Each of the optical chip subassemblies comprises the optical chip subassembly described above. The plurality of optical chip subassemblies are detachably connected to each other via the first type physical interface and the second type physical interface, thereby being spliced ​​into the optical chip.

[0007] According to yet another aspect of the present disclosure, a method for assembling an optical chip is provided, comprising: selecting at least two optical chip sub-assemblies from a plurality of optical chip sub-assemblies, wherein each of the optical chip sub-assemblies comprises the optical chip sub-assembly as described above; and detachably connecting the at least two optical chip sub-assemblies to each other via the first type physical interface and the second type physical interface, thereby splicing them into the optical chip.

[0008] These and other aspects of the disclosure will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Further details, features and advantages of the present disclosure are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0010] Figure 1 is a schematic diagram of a single programmable optical switch in the related art;

[0011] Figure 2A and 2B is a schematic diagram of an optical chip subassembly according to an exemplary embodiment of the present disclosure;

[0012] Figure 3A and 3B is a schematic diagram of an optical chip subassembly according to an exemplary embodiment of the present disclosure;

[0013] Figure 4A and 4B is a schematic diagram of an optical chip subassembly according to an exemplary embodiment of the present disclosure;

[0014] Figure 5A and 5B is a schematic diagram of an optical chip according to an exemplary embodiment of the present disclosure; and

[0015] Figure 6 is a flow chart of a method of assembling an optical chip according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0016] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which are depicted by way of illustration specific examples in which the disclosure may be practiced. It is to be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure.

[0017] It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first element, component, region, layer or part discussed below may be referred to as the second element, component, region, layer or part without departing from the teaching of the present disclosure.

[0018] The terms used herein are only for the purpose of describing a specific embodiment and are not intended to limit the present disclosure. As used herein, the singular forms "one", "one" and "the" are intended to also include plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "include" and / or "comprise" specify the existence of the features, integral bodies, steps, operations, elements and / or parts when used in this specification, but do not exclude the existence of one or more other features, integral bodies, steps, operations, elements, parts and / or their groups or add one or more other features, integral bodies, steps, operations, elements, parts and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items, and the phrase "at least one of A and B" refers to only A, only B, or both A and B.

[0019] Embodiments of the present disclosure are described herein with reference to schematic illustrations (and intermediate structures) of idealized embodiments of the present disclosure. As such, variations in the illustrated shapes, for example as a result of manufacturing techniques and / or tolerances, should be expected. Therefore, embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the zones illustrated herein, but should include shape deviations, for example, due to manufacturing. Therefore, the zones illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the zones of the device and are not intended to limit the scope of the present disclosure.

[0020] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0021] As used herein, the terms "coupling" and "coupling" refer to a plurality of corresponding ports between a plurality of objects forming a systematic organic connection, and the connection is not limited to a physical or mechanical connection. For example, in this context, an optical functional device can be optically coupled to an input / output interface.

[0022] Figure 1The schematic diagram of a programmable optical switch 100 in the related art is illustrated. The programmable optical switch 100 is a Mach-Zehnder interferometer (MZI) type optical switch in this example, which includes four ports 120, 130, 140 and 150 for inputting or outputting optical signals, two directional couplers (or multimode interferometers) 160A and 160B, and a pair of waveguide modulation arms 170A and 170B. For the optical signal input to port 120 or 130, it can be selectively delivered to one or both of port 140 and port 150 through directional coupler (or multimode interferometer) 160A, waveguide modulation arms 170A and 170B, and directional coupler (or multimode interferometer) 160B. The programmable optical switch 100 is a basic unit constituting a programmable optical chip. For complex functional requirements, various functional devices including programmable optical switches need to be integrated into the programmable optical chip on a large scale. Large-scale optical chips have problems such as large optical loss, high device tuning power consumption, high network calibration difficulty, and low chip yield due to their large scale. In addition, due to the limited number of devices that can be accommodated on a single chip and the single material platform, the functions of optical chips are limited, and the scalability of optical chips is limited.

[0023] Embodiments of the present disclosure provide an optical chip sub-assembly, an optical chip, and a method for assembling an optical chip. According to the embodiments of the present disclosure, the functional expansion and scale expansion of the optical chip are achieved through the detachable connection of the optical chip sub-assembly, without integrating complex functions into a single large-scale optical chip. Since a single optical chip sub-assembly contains fewer devices and has a small overall size, the optical chip sub-assembly has a higher yield rate and is convenient for calibration before use. In some embodiments, by flexibly connecting dedicated optical devices (for example, semiconductor optical amplifiers (SOAs)) between optical chip sub-assemblies as needed, dedicated optical devices can be used to compensate for optical losses. In addition, by selecting an appropriate number and type of optical chip sub-assemblies to splice into the required optical chip, the problem of too many devices in the optical chip can be avoided, so that the overall power consumption of the optical chip can be reduced. In this regard, the following will be combined with FIG. 2A to FIG. 5B Specific description.

[0024] Figure 2A An optical chip subassembly 200A according to an exemplary embodiment of the present disclosure is illustrated.

[0025] like Figure 2A As shown, the optical chip subassembly 200A includes an input / output interface IO and an optical functional device 210A. The input / output interface IO includes a plurality of first type physical interfaces IO1 and a plurality of second type physical interfaces IO2. The optical functional device 210A is optically coupled to at least some of the plurality of first type physical interfaces IO1 and the plurality of second type physical interfaces IO2. For the convenience of illustration, Figure 2AThe optical coupling structure between the optical functional device 210A and the first and second type physical interfaces IO1 and IO2 is not shown.

[0026] The plurality of first type physical interfaces IO1 are configured to communicate with a first another optical chip subassembly ( Figure 2A The second type physical interface IO2 (not shown) is detachably connectable, and the plurality of second type physical interfaces IO2 are configured to be connected to the second another optical chip subassembly ( Figure 2A The optical function device 210A is optically communicable with the optical function device in the first another optical chip subassembly and the optical function device in the second another optical chip subassembly via at least some physical interfaces optically coupled to the optical function device 210A. As used herein, the term "detachably connected" should be interpreted as "detachably directly connected" without the need for an intermediate transmission medium (e.g., a waveguide).

[0027] In some embodiments, the first type physical interface IO1 is one of a male interface and a female interface, and the second type physical interface IO2 is the other of a male interface and a female interface. Figure 2A In the example of , the first type physical interface IO1 is a female interface, and the second type physical interface IO2 is a male interface. It will be understood that the male interface and the female interface are not limited to the configurations illustrated in the figure. For example, in alternative embodiments, the male interface and the female interface can be based on a mortise and tenon structure, a snap-fit ​​structure, or any other suitable detachable connection.

[0028] In various embodiments, the optical functional device in the optical chip subassembly can be any of a variety of optical functional devices, for example, a basic programmable optical network structure without a dedicated optical device, a basic programmable optical network structure with a dedicated optical device, or a dedicated optical device. Figure 2A In the example, the optical functional device 210A is a basic programmable optical network structure without dedicated optical devices. As used herein, the term "optical functional device" refers to an optical device having various optical functions, including, for example, optical transmission, optical modulation, optical detection, optical amplification, optical filtering, amplitude control and / or phase control. The term "basic programmable optical network structure" refers to a network-like optical structure composed of optical waveguides and programmable optical switches, and the term "dedicated optical device" refers to other optical devices other than the basic programmable optical network structure, including but not limited to semiconductor optical amplifiers, optical modulators, optical detectors, optical filters, delay lines, power dividers, lasers, attenuators, and light intensity monitors.

[0029] like Figure 2AAs shown, the basic programmable optical network structure in the optical functional device 210A is a hexagonal cyclic grid structure, which includes a network-like optical waveguide 211A and a plurality of programmable optical switches 212A arranged in the network-like optical waveguide 211A, which are optically communicable internally. In some embodiments, any one of the plurality of programmable optical switches 212A may be an MZI type optical switch (e.g., Figure 1 The optical switch 100 shown in FIG. 100A or a MEMS optical switch. This is just an exemplary embodiment, and the basic programmable optical network structure of the optical chip subassembly 200A may also be a circular grid structure of a square, triangle or other optional geometric shapes.

[0030] Figure 2B Another optical chip subassembly 200B according to an exemplary embodiment of the present disclosure is shown. Compared with the optical chip subassembly 200A, the optical function device 210B in the optical chip subassembly 200B is also a basic programmable optical network structure without dedicated optical devices, except that the optical function device 210B has a network topology different from that of the optical function device 210A.

[0031] like Figure 2B As shown, the optical function device 210B in the optical chip subassembly 200B is a forward mesh structure, in which light flows in one direction, as indicated by the arrows in the figure. The optical function device 210B includes a network-like optical waveguide 211B and a plurality of programmable optical switches 212B arranged in the network-like optical waveguide 211B. This is only an exemplary embodiment, and the basic programmable optical network structure of the optical chip subassembly 200B may also be a forward mesh structure of other optional topologies.

[0032] exist Figure 2B In the example, the optical functional device 210B is a basic programmable optical network structure without dedicated optical devices.

[0033] It should be understood that the number of components, interfaces, and basic programmable optical network structures of the optical chip subassembly 200A and the optical chip subassembly 200B are not limited to Figure 2A and Figure 2B Instructions in .

[0034] Figure 3A An optical chip subassembly 300A according to an exemplary embodiment of the present disclosure is illustrated.

[0035] like Figure 3AAs shown, the optical chip subassembly 300A includes an input / output interface IO and an optical functional device 310A. The input / output interface IO includes a plurality of first type physical interfaces IO1 and a plurality of second type physical interfaces IO2. The optical functional device 310A is optically coupled to at least some of the plurality of first type physical interfaces IO1 and the plurality of second type physical interfaces IO2. For the convenience of illustration, Figure 3A The optical coupling structure between the optical functional device 310A and the first and second type physical interfaces IO1 and IO2 is not shown.

[0036] The plurality of first type physical interfaces IO1 are configured to communicate with a first another optical chip subassembly ( Figure 3A The second type physical interface IO2 (not shown) is detachably connectable, and the plurality of second type physical interfaces IO2 are configured to be connected to the second another optical chip subassembly ( Figure 3A The first type physical interface IO1 (not shown) is detachably connectable so that the optical functional device 310A can optically communicate with the optical functional device in the first another optical chip sub-assembly and the optical functional device in the second another optical chip sub-assembly via at least some physical interfaces optically coupled to the optical functional device 310A.

[0037] like Figure 3A As shown, the basic programmable optical network structure in the optical functional device 310A is a hexagonal cyclic grid structure, including a network-like optical waveguide 311A ​​and a plurality of programmable optical switches 312A arranged in the network-like optical waveguide 311A, which are optically communicable internally. The optical functional device 310A also includes a dedicated optical device 313A, such as an optical filter. In this example, the dedicated optical device 313A is coupled to the middle of the hexagonal network.

[0038] exist Figure 3A In the example, the optical functional device 310A is a basic programmable optical network structure with dedicated optical devices.

[0039] Figure 3B The figure shows a schematic diagram of another optical chip subassembly 300B according to an exemplary embodiment of the present disclosure. Compared with the optical chip subassembly 300A, the optical function device 310B in the optical chip subassembly 300B is also a basic programmable optical network structure with a dedicated optical device, but the dedicated optical device 313B of the optical function device 310B is coupled to the dedicated optical device 313A at different positions of the respective basic programmable optical network structures. The dedicated optical device 313B can be the same as or different from the dedicated optical device 313A.

[0040] like Figure 3BAs shown, the basic programmable optical network structure in the optical functional device 310B is a hexagonal cyclic grid structure, including a network-like optical waveguide 311B and a plurality of programmable optical switches 312B arranged in the network-like optical waveguide 311B. The optical functional device 310B also includes a dedicated optical device 313B. In this example, the dedicated optical device 313B is coupled to the edge of the hexagonal network structure.

[0041] exist Figure 3B In the example, the optical functional device 310B is a basic programmable optical network structure with dedicated optical devices.

[0042] It should be understood that the number of components, interfaces, and basic programmable optical network structures of the optical chip subassembly 300A and the optical chip subassembly 300B are not limited to Figure 3A and Figure 3B In other embodiments, the basic programmable optical network structure of the optical chip subassemblies 300A and 300B may also be a grid structure of other optional topologies, and the coupling mode of the dedicated optical devices in the optical functional devices 310A and 310B may also be other optional coupling modes.

[0043] Figure 4A A schematic diagram of an optical chip subassembly 400A according to an exemplary embodiment of the present disclosure is illustrated.

[0044] like Figure 4A As shown, the optical chip subassembly 400A includes an input / output interface IO and an optical functional device 410A. The input / output interface IO includes a plurality of first type physical interfaces IO1 and a plurality of second type physical interfaces IO2. The optical functional device 410A is optically coupled to at least some of the plurality of first type physical interfaces IO1 and the plurality of second type physical interfaces IO2. For the convenience of illustration, Figure 4A The optical coupling structure between the optical functional device 410A and the first and second type physical interfaces IO1 and IO2 is not shown.

[0045] The plurality of first type physical interfaces IO1 are configured to communicate with a first another optical chip subassembly ( Figure 4A The second type physical interface IO2 (not shown) is detachably connectable, and the plurality of second type physical interfaces IO2 are configured to be connected to the second another optical chip subassembly ( Figure 4A The first type physical interface IO1 (not shown) is detachably connectable so that the optical functional device 410A can optically communicate with the optical functional device in the first another optical chip sub-assembly and the optical functional device in the second another optical chip sub-assembly via at least some physical interfaces optically coupled to the optical functional device 410A.

[0046] exist Figure 4AIn the example, the optical functional device 410A is a dedicated optical device, which may be, for example, a high-performance adjustable delay line structure.

[0047] Figure 4B FIG. 4 is a schematic diagram of another optical chip subassembly 400B according to an exemplary embodiment of the present disclosure. Compared with the optical chip subassembly 400A, the optical function device 410B in the optical chip subassembly 400B is also a dedicated optical device, but the dedicated optical device 410B has different functions from the optical function device 410A.

[0048] exist Figure 4B In the example, the optical functional device 410B is a dedicated optical device, and its function may be, for example, a semiconductor optical amplifier (SOA) for compensating for optical loss in an optical transmission path.

[0049] In some embodiments, each of the dedicated optical devices 410A and 410B in the optical chip subassemblies 400A and 400B can be selected from the group consisting of: semiconductor optical amplifiers, optical modulators, optical detectors, optical filters, delay lines, power dividers, lasers, attenuators, and light intensity monitors. In some other embodiments, the dedicated optical devices in the optical chip subassemblies 400A and 400B may also be other optional optical device combinations. It should be understood that the number of dedicated optical devices, the number of interfaces, and the number of basic programmable optical network structures of the optical chip subassemblies 400A and 400B are not limited to Figure 4A and Figure 4B Instructions in .

[0050] FIG. 2A to FIG. 4B Each of the illustrated optical chip subassemblies 200A, 200B, 300A, 300B, 400A, and 400B has at least one pair of sides opposite to each other, a plurality of first type physical interfaces IO1 are arranged at at least one first side of the at least one pair of sides, and a plurality of second type physical interfaces IO2 are arranged at at least one second side of the at least one pair of sides, and at least one second side is opposite to at least one first side. For example, the optical chip subassembly 200A includes an upper side and a lower side opposite to each other, and a left side and a right side opposite to each other, wherein a plurality of first type physical interfaces IO1 are arranged at the upper side and the right side, and a plurality of second type physical interfaces IO2 are arranged at the lower side and the left side. It should be understood that this is merely exemplary, and in other embodiments, the optical chip subassembly may have other planar shapes, and the first and second type physical interfaces IO1 and IO2 may be arranged at the sides of the optical chip subassembly in a manner different from that illustrated.

[0051] Figure 5A FIG. 5 shows a schematic diagram of an optical chip 500A according to an exemplary embodiment of the present disclosure. Figure 5A As shown, the optical chip 500A includes an optical chip subassembly 200A-1, an optical chip subassembly 200A-2, an optical chip subassembly 200A-3, an optical chip subassembly 200A-4, an optical chip subassembly 300A, an optical chip subassembly 300B, an optical chip subassembly 400A, an optical chip subassembly 400B-1, and an optical chip subassembly 400B-2. These optical chip subassemblies are detachably connected (e.g., engaged) to each other via a first type physical interface and a second type physical interface, thereby being spliced ​​into an optical chip 500A. Since the functional components of the optical chip 500A are distributed in a plurality of optical chip subassemblies, a single optical chip subassembly is small in size and has fewer components, resulting in a higher yield rate of the chip and convenient calibration work before use.

[0052] like Figure 5A As shown in the figure, the optical chip subassembly 400A in the optical chip 500A has an optical functional device that is a dedicated optical device (for example, a high-performance adjustable delay line structure). In the case where it is desired to add a dedicated optical device function to the optical chip, the optical chip subassembly 400A can be flexibly arranged at a non-edge position of the optical chip 500A. In contrast, for traditional large-scale optical chips, after the optical chip is taped out, it is impossible to place a dedicated optical device in the middle of the optical chip to increase the function.

[0053] In addition, the optical chip subassembly 400A ("first optical chip subassembly") can be based on a substrate material (e.g., silicon dioxide) that is different from the substrate material (e.g., silicon) of the optical chip subassemblies 400B-1 and 400B-2 ("second optical chip subassemblies"). Alternatively or additionally, the optical functional devices of the optical chip subassembly 400A ("first optical chip subassembly") can be based on an optical material (e.g., silicon nitride) that is different from the optical material (e.g., silicon) of the optical functional devices of the optical chip subassemblies 400B-1 and 400B-2 ("second optical chip subassemblies"). This allows the selection of appropriate substrate materials and / or optical device materials for the optical functional devices in the optical chip subassembly, avoiding material limitations on device performance. More generally, in Figure 5AIn the example, the optical chip subassemblies 200A-1, 200A-2, 200A-3 and 200A-4, the optical chip subassemblies 300A and 300B, and the optical chip subassemblies 400A, 400B-1 and 400B-2 can be based on different substrate materials from each other, and / or, the optical functional devices of the optical chip subassemblies 200A-1, 200A-2, 200A-3 or 200A-4, the optical chip subassembly 300A, the optical chip subassembly 300B, the optical chip subassembly 400A, and the optical chip subassembly 400B-1 or 400B-2 can be based on different optical materials from each other. It should be understood that the optical chip subassembly type, the number of optical chip subassemblies and the connection method between the optical chip subassemblies of the optical chip 500A are not limited to Figure 5A Instructions in .

[0054] Figure 5B FIG. 5 is a schematic diagram of another optical chip 500B according to an exemplary embodiment of the present disclosure. Compared with the optical chip 500A, the optical chip subassemblies included in the optical chip 500B are the same, and the optical chip subassemblies are also detachably connected, but their splicing methods are different. More specifically, the optical chip subassembly at a non-edge position in the optical chip 500B is the optical chip subassembly 300A. Figure 5B As shown in the figure, the optical chip subassembly 300A in the optical chip 500B has an optical functional device that is a basic programmable optical network structure with dedicated optical devices. In the case where it is desired to add the function of dedicated optical devices in the optical chip, the optical chip subassembly 300A can be flexibly arranged at a non-edge position of the optical chip 500B without affecting the subsequent scalability of the programmable optical network in the optical chip. In contrast, in traditional large-scale optical chips, it is impossible to place dedicated optical devices in the middle of an already taped-out optical chip to increase functionality. It should be understood that the type of optical chip subassemblies, the number of optical chip subassemblies, and the method of connection between optical chip subassemblies of the optical chip 500B are not limited to Figure 5B Instructions in .

[0055] Various optical chip subassemblies and optical chips formed by splicing different optical chip subassemblies have been described above, but this is only for illustration. In other embodiments, different optical chip subassemblies may have different physical sizes and different numbers of physical interfaces.

[0056] The exemplary embodiment of the present disclosure also provides a method for assembling an optical chip accordingly. Figure 6 , and refer to Figure 2A-Figure 5B Specific description.

[0057] Figure 6 A flow chart of a method 600 of assembling an optical chip according to an exemplary embodiment of the present disclosure is illustrated.

[0058] like Figure 6 As shown, in step 610, at least two optical chip sub-assemblies are selected from a plurality of optical chip sub-assemblies. Figure 5A and 5B In the illustrated example, a total of nine optical chip subassemblies are selected from the various optical chip subassemblies described above, namely, optical chip subassemblies 200A-1, 200A-2, 200A-3, 200A-4, 300A, 300B, 400A, 400B-1 and 400B-2. It should be understood that in some other embodiments, the type and quantity of the optical chip subassembly selection can be any other optional solution.

[0059] In step 620, the selected at least two optical chip subassemblies are detachably connected to each other via the first type physical interface and the second type physical interface, thereby splicing into an optical chip. Figure 5A and 5B In the illustrated example, the selected optical chip subassemblies 200A-1, 200A-2, 200A-3, 200A-4, 300A, 300B, 400A, 400B-1 and 400B-2 are spliced ​​into an optical chip 500A or 500B via a detachable connection (e.g., engagement) between the first type of physical interface and the second type of physical interface. It should be understood that in some other embodiments, the connection mode between the optical chip subassemblies and the functional composition of the optical chip can be any other optional scheme.

[0060] although Figure 6 The flowchart of the embodiment of the present invention shows a specific execution order, and the execution order may be different from the order depicted. For example, the execution order of two or more blocks or arrows may be scrambled relative to the order shown. Moreover, two or more blocks shown in succession may be executed simultaneously or partially simultaneously. All such variations are within the scope of the present disclosure.

[0061] The present disclosure has been described using the non-limiting detailed description of its examples and is not intended to limit the scope of the present disclosure. It should be understood that the features and / or operations described with respect to one example can be used with other examples, and not all examples of the present disclosure have all the features and / or operations illustrated in a particular figure or described with respect to one of the examples. Those skilled in the art will readily appreciate variations of the described examples. In addition, the terms "include", "comprise", "have" and their cognates should mean "including but not necessarily limited to" when used in the present disclosure and / or claims.

[0062] It is noted that some of the examples described above may include details of structures, actions, or structures and actions that may not be necessary for the present disclosure and are intended as examples. The structures and actions described herein may be replaced by equivalents that perform the same functions, even if the structures or actions are different, as known in the art. Therefore, the scope of the present disclosure is limited only by the elements and limitations as used in the claims.

[0063] Aspect 1: An optical chip subassembly, comprising:

[0064] an input / output interface, comprising a plurality of first type physical interfaces and a plurality of second type physical interfaces; and

[0065] an optical functional device optically coupled to at least some of the plurality of first type physical interfaces and the plurality of second type physical interfaces,

[0066] Wherein, the multiple first-type physical interfaces are configured to be detachably connectable to the second-type physical interfaces of a first another optical chip sub-assembly, and the multiple second-type physical interfaces are configured to be detachably connectable to the first-type physical interfaces of a second another optical chip sub-assembly, so that the optical functional device can optically communicate with the optical functional device in the first another optical chip sub-assembly and the optical functional device in the second another optical chip sub-assembly via at least some of the physical interfaces.

[0067] Aspect 2. The optical chip subassembly according to Aspect 1, wherein the optical functional device is selected from the group consisting of: a basic programmable optical network structure without dedicated optical devices, a basic programmable optical network structure with dedicated optical devices, and dedicated optical devices.

[0068] Aspect 3. An optical chip subassembly according to Aspect 2, wherein the dedicated optical device includes one selected from the group consisting of: a semiconductor optical amplifier, an optical modulator, an optical detector, an optical filter, a delay line, a power divider, a laser, an attenuator, and a light intensity monitor.

[0069] Aspect 4. The optical chip subassembly according to aspect 2, wherein the basic programmable optical network structure comprises:

[0070] A mesh optical waveguide; and

[0071] A plurality of programmable optical switches are arranged in the grid-like optical waveguide.

[0072] Aspect 5. The optical chip subassembly of aspect 4, wherein any one of the plurality of programmable optical switches comprises one selected from the group consisting of: an MZI type optical switch and a MEMS type optical switch.

[0073] Aspect 6. An optical chip subassembly according to any one of Aspects 1 to 5, wherein the first type of physical interface is one of a male interface and a female interface, and the second type of physical interface is the other of a male interface and a female interface.

[0074] Aspect 7: The optical chip subassembly according to any one of aspects 1 to 5,

[0075] Wherein, the optical chip subassembly has at least one pair of sides opposite to each other, and

[0076] Wherein, the multiple first type physical interfaces are arranged at at least one first side of the at least one pair of sides, and the multiple second type physical interfaces are arranged at at least one second side of the at least one pair of sides, and the at least one second side is opposite to the at least one first side.

[0077] Aspect 8: An optical chip, comprising:

[0078] A plurality of optical chip subassemblies, each of the optical chip subassemblies comprising an optical chip subassembly as described in any one of aspects 1-7,

[0079] The plurality of optical chip sub-assemblies are detachably connected to each other via the first type physical interface and the second type physical interface, thereby being spliced ​​into the optical chip.

[0080] Aspect 9: The optical chip according to aspect 8,

[0081] The plurality of optical chip subassemblies include a first optical chip subassembly, the optical functional device of the first optical chip subassembly is a dedicated optical device or a basic programmable optical network structure with a dedicated optical device, and

[0082] The first optical chip subassembly is arranged at a non-edge position of the optical chip formed by splicing the plurality of optical chip subassemblies.

[0083] Aspect 10. The optical chip according to aspect 8, wherein a first optical chip subassembly of the plurality of optical chip subassemblies is based on a substrate material different from a substrate material of a second optical chip subassembly of the plurality of optical chip subassemblies.

[0084] Aspect 11. An optical chip according to Aspect 8, wherein the optical functional device of a first optical chip subassembly among the plurality of optical chip subassemblies is based on an optical material different from the optical material of the optical functional device of a second optical chip subassembly among the plurality of optical chip subassemblies.

[0085] Aspect 12: A method for assembling an optical chip, comprising:

[0086] selecting at least two optical chip sub-assemblies from a plurality of optical chip sub-assemblies, wherein each of the optical chip sub-assemblies comprises an optical chip sub-assembly as described in any one of aspects 1-7; and

[0087] The at least two optical chip sub-assemblies are detachably connected to each other via the first type physical interface and the second type physical interface, so as to be spliced ​​into the optical chip.

Claims

1. An optical chip, comprising: A plurality of optical chip subassemblies, each optical chip subassembly being optically communicable with at least two other optical chip subassemblies, the optical chip subassemblies comprising: substrate; The input / output interface in the substrate includes a plurality of first type physical interfaces and a plurality of second type physical interfaces; and an optical functional device on the substrate, the optical functional device being manufactured based on an optical material and optically coupled to at least some of the plurality of first type physical interfaces and the plurality of second type physical interfaces, wherein the plurality of first-type physical interfaces are configured to be detachably connectable to second-type physical interfaces of a first further optical chip subassembly, and the plurality of second-type physical interfaces are configured to be detachably connectable to first-type physical interfaces of a second further optical chip subassembly, so that the optical functional device is optically communicable with the optical functional device in the first further optical chip subassembly and the optical functional device in the second further optical chip subassembly via at least some of the physical interfaces, The plurality of optical chip subassemblies are detachably connected to each other via the first type physical interface and the second type physical interface, thereby being assembled into the optical chip, and The optical chip comprises a first optical chip subassembly arranged in the middle of the optical chip, and the optical functional device of the first optical chip subassembly is a dedicated optical device or a basic programmable optical network structure with a dedicated optical device.

2. The optical chip according to claim 1, wherein: The optical functional devices of other optical chip sub-assemblies among the multiple optical chip sub-assemblies except the first optical chip sub-assembly are selected from the group consisting of: a basic programmable optical network structure without dedicated optical devices, a basic programmable optical network structure with dedicated optical devices, and dedicated optical devices.

3. The optical chip according to claim 2, wherein: The dedicated optical device includes one selected from the group consisting of: a semiconductor optical amplifier, an optical modulator, an optical detector, an optical filter, a delay line, a power divider, a laser, an attenuator, and a light intensity monitor.

4. The optical chip according to claim 2, wherein: The basic programmable optical network structure includes: A mesh optical waveguide; and A plurality of programmable optical switches are arranged in the grid-like optical waveguide.

5. The optical chip according to claim 4, wherein: Any one of the plurality of programmable optical switches includes one selected from the group consisting of: an MZI type optical switch and a MEMS type optical switch.

6. The optical chip according to any one of claims 1 to 5, wherein: The first type of physical interface is one of a male interface and a female interface, and the second type of physical interface is the other of a male interface and a female interface.

7. The optical chip according to any one of claims 1 to 5, in, Each optical chip subassembly has at least one pair of sides opposite to each other, and Wherein, the multiple first type physical interfaces are arranged at at least one first side of the at least one pair of sides, and the multiple second type physical interfaces are arranged at at least one second side of the at least one pair of sides, and the at least one second side is opposite to the at least one first side.

8. The optical chip according to claim 2, wherein: The first of the plurality of optical chip subassemblies is based on a substrate material that is different than a substrate material of the other of the plurality of optical chip subassemblies.

9. The optical chip according to claim 2, wherein: The optically functional device of the first of the plurality of optical chip subassemblies is based on an optical material that is different from the optically functional devices of the other of the plurality of optical chip subassemblies.

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