Fixing device for packaging microelectronic device and microelectronic device packaging method

Abstract

The present invention relates to the technical field of microelectronic devices, and discloses a fixing device for packaging microelectronic devices and a method for packaging microelectronic devices. The fixing device for packaging microelectronic devices comprises: a base plate; two columns, which are relatively arranged on the base plate; and a fixing component, each column is provided with a fixing component, and the fixing component comprises: a limit plate, which is slidably connected with the column, and an adjustable fixed gap for fixing the microelectronic device is formed between the two limit plates; and a clamping member, which is arranged on the limit plate, and the clamping member is used to clamp the microelectronic device. The fixing device for packaging microelectronic devices can adjust the size of the fixed gap according to the different types or sizes of the microelectronic devices, so as to realize the packaging of various microelectronic devices, thereby improving the adaptability to the microelectronic devices and effectively reducing the packaging and transportation costs.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronic devices, and in particular to a fixing device for packaging a microelectronic device and a microelectronic device packaging method. Background Art

[0002] Microelectronics technology mainly studies semiconductor materials, devices, processes, integrated circuit design, etc. Its related devices have the advantages of small size, light weight, high reliability and fast working speed, so they are widely used in many fields. The packaging of microelectronic devices is very important as an indispensable part of the preservation and operation of microelectronic devices.

[0003] In the prior art, when packaging microelectronic devices, a fixture is often prefabricated according to the size of the microelectronic devices. During packaging, the microelectronic devices to be transported are directly placed in the fixture, and the packaging of the microelectronic devices is completed using the space reserved in the fixture.

[0004] However, the above-mentioned fixing device does not have an adjustable function, which means that the device can only fix and package one type of microelectronic device, and its scope of use is relatively small. When the microelectronic device is of different types or sizes, other fixing devices are required, which will increase the packaging and transportation costs. Summary of the invention

[0005] The object of the present invention is to provide a fixing device for packaging a microelectronic device and a microelectronic device packaging method, so as to solve the problem that the device used for packaging a microelectronic device has a small application range and a high packaging and transportation cost.

[0006] To achieve this object, the present invention adopts the following technical solution: the fixing device for packaging a microelectronic device comprises: a base plate; two columns, which are relatively arranged on the above-mentioned base plate; and a fixing component, one of which is arranged on each of the above-mentioned columns, and the above-mentioned fixing component comprises: a limiting plate, which is slidably connected to the above-mentioned columns, and a fixed gap of adjustable size is formed between the two above-mentioned limiting plates for fixing the microelectronic device; and a clamping member, which is arranged on the above-mentioned limiting plate, and the above-mentioned clamping member is used to clamp the above-mentioned microelectronic device.

[0007] Optionally, the fixing assembly further includes: a transverse plate, which is arranged on the vertical column, the limiting plate is slidably connected to the transverse plate, and the limiting plate partially extends out of the transverse plate to form the fixed gap; and a locking member, which is arranged on the transverse plate, and the locking member can selectively lock the position of the limiting plate on the transverse plate.

[0008] Through the above technical solution, when fixing the microelectronic device, the locking member on the horizontal plate is first released, and the limit plate can slide on the horizontal plate, while driving the clamping member to move. When the microelectronic device is placed in the fixed gap, the limit plate can be fixed to the horizontal plate by the locking member, so as to fix the microelectronic device.

[0009] Optionally, the clamping member includes: an elastic member, which is arranged on the top wall of the above-mentioned limiting plate; and a clamping plate, which is arranged on the elastic member, and the clamping plate is arranged opposite to the limiting plate, and the bottom wall of the clamping plate and the top wall of the limiting plate form a clamping gap for clamping the microelectronic device.

[0010] Through the above technical solution, when clamping the microelectronic device, the clamping plate is pulled away from the limiting plate, and the elastic member is stretched and deformed. At this time, the clamping gap distance increases, and the microelectronic device can be placed in the clamping gap. Then the clamping plate is released, and the elastic member automatically restores the deformation, thereby pulling the clamping plate to reset, and the bottom wall of the clamping plate abuts against the microelectronic device, thereby fixing the microelectronic device.

[0011] Optionally, the clamping member further includes: a limiting rod, which is arranged on the limiting plate and is slidably connected to the clamping plate; and a limiting plate, which is arranged at one end of the limiting rod away from the limiting plate, and the cross-sectional area of ​​the limiting plate is larger than the cross-sectional area of ​​the limiting rod.

[0012] Through the above technical solution, the limit rod can limit the moving direction of the clamping plate to reduce the possibility of the clamping plate being offset during movement. By setting the limit plate, the lifting distance of the clamping plate can be limited to reduce the possibility of the clamping plate being separated from the limit rod.

[0013] Optionally, the locking member includes: a locking rod, which is arranged on the transverse plate, the locking rod partially extends into the transverse plate, and one end of the locking rod extending into the transverse plate can selectively abut against the top wall of the limiting plate.

[0014] Through the above technical solution, after adjusting the position of the limit plate according to the microelectronic device, the locking rod can be inserted, and the locking rod can be abutted against the limit plate to press the limit plate against the cross plate, so that the limit plate can be fixed, thereby realizing the adjustment of the fixed gap.

[0015] Optionally, the fixing assembly further comprises: a sliding block disposed on the limiting plate; wherein a sliding groove for the sliding block to slide is provided on the inner side wall of the transverse plate.

[0016] Through the above technical solution, when the limit plate slides, it also drives the slider to slide in the slide groove. The slider cooperates with the slide groove to limit the moving direction of the limit plate, reducing the possibility of the limit plate offset.

[0017] Optionally, the column has a through hole, and the cross plate passes through the through hole; wherein the fixing assembly further comprises: a pressure plate, slidably connected in the through hole, and the pressure plate can selectively abut against the cross plate; and a rotating rod, arranged on the column, and one end of the rotating rod can selectively extend into the through hole and be rotatably connected to the pressure plate.

[0018] Through the above technical solution, after the microelectronic device is fixed, the rotating rod can be operated to leave the through hole, thereby pulling the pressure plate and the cross plate apart. At this time, the cross plate can be pushed to rotate in the rotating gap, so that the microelectronic device can be driven to shift to adjust the fixed angle of the microelectronic device. Then the rotating rod is extended into the through hole, and the rotating rod will push the pressure plate to squeeze the cross plate, thereby fixing the cross plate in the through hole, so that the fixed angle of the microelectronic device can be adjusted.

[0019] Optionally, the pressure plate has a curved surface on one side close to the horizontal plate; and the top wall of the horizontal plate has an arc-shaped groove that fits the curved surface.

[0020] Through the above technical solution, the arc surface cooperates with the arc groove to further increase the contact area between the pressure plate and the cross plate, thereby increasing the friction between the pressure plate and the cross plate to improve the stability of the cross plate after fixation.

[0021] Optionally, the fixing assembly further comprises: a lever, which is arranged on a side of the rotating rod away from the pressure plate; and / or a pull rod, which is arranged on a side of the locking member away from the limiting plate.

[0022] With the above technical solution, when the rotating rod is operated to extend into or leave the through hole, it can be done by grabbing the lever, so as to facilitate the corresponding operation of the rotating rod. And by providing a pull rod, when inserting or withdrawing the locking member, the pull rod can be directly grasped, and the locking member can lock or loosen the limit plate by applying a pulling force to the pull rod.

[0023] The present invention also provides a method for packaging a microelectronic device, which includes the following steps: using the above-mentioned fixing device for packaging a microelectronic device to fix the microelectronic device to be packaged: according to the size of the microelectronic device, pushing the above-mentioned limiting plate to slide relative to the above-mentioned column so that the two above-mentioned limiting plates are separated from each other, thereby increasing the size of the above-mentioned fixed gap; placing the microelectronic device into the above-mentioned fixed gap, pushing the above-mentioned limiting plate to slide relative to the above-mentioned column so that the two above-mentioned limiting plates are close to each other, thereby reducing the above-mentioned fixed gap; after the above-mentioned fixed gap is reduced, clamping and fixing the microelectronic device in the above-mentioned fixed gap by the above-mentioned clamping member; and packaging the fixed microelectronic device.

[0024] Beneficial effects of the present invention:

[0025] 1. When packaging microelectronic devices, first place the bottom plate, and push the limit plate to slide relative to the column according to the size of the microelectronic device, so that the two limit plates are separated from each other, and the size of the fixed gap will increase, so that the microelectronic device can be placed in the fixed gap. Then push the limit plates closer to each other to reduce the fixed gap, and use the clamp to clamp the microelectronic device to fix the microelectronic device in the fixed gap, so that the entire device can be packaged. In this way, the size of the fixed gap can be adjusted according to the type or size of the microelectronic device to achieve the packaging of various microelectronic devices, thereby improving the adaptability of microelectronic devices and effectively reducing the packaging and transportation costs.

[0026] 2. By adopting the microelectronic device packaging method, not only can various microelectronic devices be packaged, the adaptability of microelectronic devices can be improved, and the packaging and transportation costs can be reduced, but also the microelectronic devices can be quickly fixed by adjusting the fixed gap size, thereby realizing rapid packaging to improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a front view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention.

[0028] Figure 2 FIG. 1 is a top view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention.

[0029] Figure 3 A partial cross-sectional view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention is shown.

[0030] Figure 4 Shown Figure 3 An enlarged view of section A in the implementation shown.

[0031] Figure 5 FIG. 1 is a schematic flow chart of a microelectronic device packaging method according to an embodiment of the present invention.

[0032] In the figure:

[0033] 100, bottom plate; 200, column; 210, through hole; 300, fixed component; 310, cross plate; 311, sliding cavity; 312, slide groove; 320, limit plate; 321, slider; 330, locking member; 331, locking rod; 332, pull rod; 340, clamping member; 341, elastic member; 342, clamping plate; 343, clamping gap; 344, limit rod; 345, limit sheet; 350, pressure plate; 360, rotating rod; 361, lever; 400, fixed gap. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0038] The present invention provides a fixing device for packaging microelectronic devices, which is mainly used for packaging microelectronic devices. Microelectronic devices are widely used in various fields due to their own advantages such as small size, light weight, high reliability and fast working speed, so the demand for microelectronic devices is very large. The storage and transportation of microelectronic devices require packaging, so how to quickly and easily dig grooves for large-scale packaging of microelectronic devices is very important for the storage and transportation of microelectronic devices.

[0039] In the existing packaging devices for microelectronic devices, the fixation is often achieved through prefabricated parts, which are not adjustable and have low reusability. Although there are some devices with adjustment functions, these devices often use relatively complex structures to fix the microelectronic devices, so they are very time-consuming in the operation process. Especially in the packaging process of large quantities of microelectronic devices, the efficiency of using such devices for packaging is very low.

[0040] The present invention provides a fixing device for packaging microelectronic devices and a method for packaging microelectronic devices. The microelectronic device is fixed by setting a fixed gap of adjustable size. That is, when fixing the microelectronic device, the fixed gap is increased to quickly adapt to the size of the microelectronic device. After the microelectronic device is placed, the fixed gap is reduced to quickly fix the microelectronic device. After the microelectronic device is fixed, the microelectronic device can be packaged. In this way, microelectronic devices of different sizes and types can be fixed, and the packaging of various microelectronic devices can be quickly completed, thereby not only improving the adaptability of the device, but also effectively improving the packaging efficiency of microelectronic devices.

[0041] Figure 1 Shown is a front view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention. Figure 2 FIG. 2 is a top view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the device includes: a base plate 100, two columns 200 and two fixing components 300. The columns 200 are arranged on the top wall of the base plate 100, and the two columns 200 are arranged opposite to each other. The connection method between the columns 200 and the base plate 100 can be bonding, welding or clamping, as long as the fixed connection between the columns 200 and the base plate 100 can be achieved. The two fixing components 300 are respectively arranged on the two columns 200, and the two fixing components 300 are arranged opposite to each other.

[0042] The fixing assembly 300 includes a limit plate 320 and a clamp 340. The limit plate 320 is slidably connected to the column 200, and the axis direction of the limit plate 320 can be set perpendicular to the axis direction of the column 200, which is equivalent to the limit plate 320 sliding along the radial direction of the column 200. A fixed gap of adjustable size is formed between the two limit plates 320, and the fixed gap 400 is used to fix the microelectronic device. The clamp 340 is set on the side of the limit plate 320 away from the column, and the clamp 340 is used to clamp the microelectronic device.

[0043] Specifically, the bottom plate 100 may be a rectangular parallelepiped, and the two columns 200 are spaced apart along the length direction of the bottom plate 100. The bottom plate 100 may also be circular or other polygonal, and the specific shape of the bottom plate 100 may be designed according to the actual packaging situation. The thickness of the bottom plate 100 should not be too large to reduce the overall weight of the bottom plate 100, and the specific thickness of the bottom plate 100 may be designed according to the size of the actual microelectronic device.

[0044] The pillar 200 extends along the thickness direction of the base plate 100, and the cross section of the pillar 200 can be circular or square. The fixing assembly 300 is arranged at one end of the pillar 200 away from the base plate 100. The cross section of the limiting plate 320 can be rectangular, and the whole is in a long strip shape, so that when supporting the microelectronic device, the microelectronic device can be stably supported by surface contact.

[0045] The clamping member 340 can be arranged on the top wall of the limiting plate 320, and the clamping member 340 can clamp the microelectronic device in the thickness direction of the microelectronic device, that is, the clamping member 340 can selectively approach or move away from the limiting plate 320. The sliding direction of the limiting plate 320 can be the length direction of the microelectronic device. The fixed gap 400 formed by the two limiting plates 320 and the two clamping members 340 can be changed in size according to the size of the microelectronic device to achieve adaptation to microelectronic devices of different sizes.

[0046] When packaging the microelectronic device, first place the base plate 100, and then according to the length of the microelectronic device, push the limit plate 320 to slide relative to the column 200, the two limit plates 320 move away from each other, and the limit plate 320 will synchronously drive the clamp 340 to move, thereby adjusting the size of the fixed gap 400. After the microelectronic device is placed in the fixed gap 400, the limit plate 320 is pushed to move, and the two limit plates 320 are close to each other, so that the fixed gap 400 can be reduced, and then the microelectronic device is clamped and fixed in the fixed gap 400 by the clamp 340, so as to facilitate the packaging of the microelectronic device. In this way, it is possible to package and transport various microelectronic devices, reducing the cost of packaging and transportation. Moreover, by adjusting the size of the fixed gap 400, the fixation of the microelectronic device can be quickly completed, thereby improving the packaging efficiency of the microelectronic device.

[0047] Figure 3 FIG. 2 is a partial cross-sectional view of a fixing device for packaging a microelectronic device according to an embodiment of the present invention. Figure 3As shown, the fixing assembly 300 further includes: a transverse plate 310 and a locking member 330. The transverse plate 310 is disposed on the column 200, and the transverse plate 310 extends along the length direction of the bottom plate 100. The limiting plate 320 is slidably connected to the transverse plate 310, and the limiting plate 320 partially extends out of the transverse plate 310 to form the above-mentioned fixed gap 400, and the clamping member 340 is located on the side of the limiting plate 320 extending out of the transverse plate.

[0048] The locking member 330 is disposed on the transverse plate 310 . The locking member 330 partially extends into the transverse plate 310 . The portion of the locking member 330 extending into the transverse plate 310 can selectively lock the limiting plate 320 .

[0049] Specifically, the cross section of the horizontal plate 310 can be rectangular or circular. The horizontal plate 310 has a sliding cavity 311 inside, one end of the sliding cavity 311 is open, and one end of the limiting plate 320 extends into the sliding cavity 311 through the opening.

[0050] The locking member 330 can be arranged on the top wall of the horizontal plate 310, or on the side wall of the horizontal plate 310, or on the bottom wall of the horizontal plate 310. The specific arrangement position of the locking member 330 can be designed according to the actual packaging space, and the present invention does not limit it. When the locking member 330 is arranged on the top wall of the horizontal plate 310, the bottom end of the locking member 330 can extend into the sliding cavity 311, and the end of the locking member 330 extending into the sliding cavity 331 can abut or plug against the top wall of the limiting plate 320 to achieve locking of the limiting plate 320.

[0051] Through the sliding connection of the limit plate 320, when sliding the limit plate 320, first release the lock of the limit plate 320 by the locking member 330, and then push the limit plate 320 to slide on the cross plate 310. When the microelectronic device has been clamped and fixed in the fixed gap 400, the limit plate 320 can be locked by the locking member 330 to fix the limit plate 320 on the cross plate, thereby limiting the movement of the limit plate 320, so as to facilitate the packaging of the microelectronic device.

[0052] Reference Figure 3 As shown, in the embodiment of the present invention, the fixing assembly 300 further includes a slider 321. The slider 321 is arranged on the side of the limiting plate 320, and a slide groove 312 for the slider 321 to slide is provided on the inner side wall of the cross plate 310, and the slide groove 312 extends along the sliding direction of the limiting plate 320.

[0053] Specifically, the slider 321 can be located on the side of the limiting plate 320 and close to the side of the column 200. The slider 321 can be manufactured integrally with the limiting plate 320, or can be fixed to the limiting plate 320 by welding or bonding. Two sliders 321 can be provided, and the two sliders 321 are respectively located on both sides of the limiting plate 320. The two ends of the slide groove 312 are closed to limit the movement range of the slider 321, thereby limiting the sliding range of the limiting plate 320.

[0054] By providing the slider 321 and the slide groove 312 , when the limiting plate 320 slides, the slider 321 will slide in the slide groove 312 synchronously. The cooperation between the slider 321 and the slide groove 312 can limit the sliding direction of the limiting plate 320 .

[0055] Figure 4 Shown Figure 3 The enlarged view of part A in the implementation shown. Figure 4 As shown, in the embodiment of the present invention, the clamping member 340 includes an elastic member 341 and a clamping plate 342. The elastic member 341 is arranged along the thickness direction of the bottom plate 100, one end of the elastic member 341 is fixedly connected to the outer top wall of the limiting plate 320, and the other end of the elastic member 341 is fixedly connected to the bottom wall of the clamping plate 342. The clamping plate 342 is arranged opposite to the limiting plate 320, and a clamping gap 343 is formed between the bottom wall of the clamping plate 342 and the top wall of the limiting plate 320, and the clamping gap 343 is used to fix the microelectronic device.

[0056] Specifically, the elastic member 341 may be a spring, and the spring may be located on the side of the limit plate 320 away from the pillar 200. The clamping plate 342 may be in the shape of a thin plate, so as to form surface contact when clamping the microelectronic device, and better clamp the microelectronic device. It should be understood that the clamping plate 342 may also be in other shapes, as long as it meets the clamping requirements for the microelectronic device.

[0057] By setting the elastic member 341 and the clamping plate 342, when clamping the microelectronic device, the clamping plate 342 is pulled away from the limiting plate 320 to pull the elastic member 341 to produce tensile deformation, so as to facilitate placing one side of the microelectronic device into the clamping gap 343, and then the clamping plate 342 is released. The clamping plate 342 is reset under the action of the elastic member 341, so that the bottom wall of the clamping plate 342 is squeezed against the top wall of the microelectronic device, and the microelectronic device can be successfully fixed.

[0058] Reference Figure 4As shown, in the embodiment of the present invention, the clamping member 340 further includes: a limiting rod 344 and a limiting sheet 345. The limiting rod 344 is arranged on the top wall of the limiting plate 320, the limiting rod 344 extends along the thickness direction of the limiting plate 320, the limiting rod 344 penetrates the clamping plate 342, and the limiting rod 344 is slidably connected to the clamping plate 342. The limiting sheet 345 is fixed on the top wall of the limiting rod 344, and the cross-sectional area of ​​the limiting sheet 345 is larger than the cross-sectional area of ​​the limiting rod 344.

[0059] Specifically, the limiting rod 344 can be fixed to the limiting plate 320 by bonding or welding. The cross section of the limiting rod 344 can be square, and a sliding hole for the limiting rod 344 to pass through is provided on the clamping plate 342, and the sliding hole is also correspondingly square. The sliding hole is located on the side of the clamping plate 342 close to the elastic member 341. The limiting rod 344 can be set in the middle of the elastic member 341, that is, the spring can be sleeved on the limiting rod 344, or it can be set at other positions.

[0060] By providing the limiting rod 344 and the limiting sheet 345, a limiting effect can be generated when the clamping plate 342 slides, so as to limit the moving direction of the clamping plate 342 and prevent the clamping plate 342 from deflecting. The square limiting rod 344 cooperates with the square sliding hole to limit the rotation of the clamping plate 342. The limiting sheet 345 can limit the lifting height of the clamping plate 342 and reduce the possibility of the clamping plate 342 and the limiting rod 344 being separated.

[0061] Reference Figure 3 As shown, in the embodiment of the present invention, the locking member 330 includes: a locking rod 331. The locking rod 331 can be arranged on the top wall of the horizontal plate 310, the bottom end of the locking rod 331 extends into the horizontal plate 310, and one end of the locking rod 331 extending into the horizontal plate 310 abuts against the top wall of the limiting plate 320.

[0062] Specifically, the locking rod 331 can be a screw rod, and in this case, a threaded hole is provided on the top wall of the horizontal plate 310, and the threaded hole is connected to the sliding cavity 311 in the horizontal plate 310, and the screw rod can extend into the sliding cavity 311. When it is necessary to fix the limit plate 320, the screw rod is screwed into the sliding cavity 311, and the bottom end of the screw rod can be pressed against the top wall of the limit plate 320, and the bottom wall of the limit plate 320 can be pressed against the cavity wall of the sliding cavity 311, so that the limit rod 344 can be fixed in the sliding cavity 311. The locking rod 331 can also be other types of rods, which can be fixed and kept in contact with the limit plate 320 when inserted into the sliding cavity 311 by means of a snap connection. The specific fixing method of the locking rod 331 can be designed according to actual conditions, and the present invention does not limit it.

[0063] Reference Figure 3As shown, in an embodiment of the present invention, the locking member 330 also includes a pull rod 332. The pull rod 332 is fixed to the top end of the locking rod 331. Specifically, the axis of the pull rod 332 is not colinear with the axis of the locking rod 331. For example, the axis of the pull rod 332 can be perpendicular to the axis of the locking rod 331. Because the locking rod 331 is arranged in the vertical direction, it is inconvenient to directly grasp the locking rod 331 and apply force when inserting or screwing. Therefore, by providing the pull rod 332, when installing the locking rod 331, you can directly grasp the pull rod 332 to complete it, which is more convenient to operate the locking rod 331.

[0064] In the embodiment of the present invention, the portion of the locking rod 331 away from the limiting plate 320 can be folded, and a corresponding storage hole can be provided on the top wall of the horizontal plate 310. Specifically, a hinge point is provided at the middle of the locking rod 331, so that the portion of the locking rod 331 outside the horizontal plate 310 can be rotated, so that the top of the locking rod 331 and the pull rod 332 can be stored in the storage hole to reduce space occupation.

[0065] In the embodiment of the present invention, the column 200 has a through hole 210. The cross plate 310 passes through the through hole 210, and the cross-sectional area of ​​the cross plate 310 is smaller than the cross-sectional area of ​​the through hole 210 to form a rotation gap. The fixing assembly 300 also includes a pressing plate 350 and a rotating rod 360. The pressing plate 350 is slidably connected in the through hole 210, and the bottom wall of the pressing plate 350 abuts against the top wall of the cross plate 310. The rotating rod 360 is arranged at the top end of the column 200, and the bottom end of the rotating rod 360 can selectively extend into the through hole 210, and the bottom end of the rotating rod 360 is rotatably connected to the top wall of the pressing plate 350.

[0066] Specifically, the through hole 210 is opened through the column 200 along the sliding direction of the limit plate 320, and one side of the through hole 210 can be opened, that is, the entire through hole 210 can be in a U-shape, so that the horizontal plate 310 can rotate in the horizontal plane. It should be understood that the through hole 210 can also be closed, and it is only necessary to reserve sufficient rotation clearance.

[0067] A connecting hole is provided on the top wall of the column 200 in the vertical direction, and the connecting hole is connected to the through hole 210. The rotating rod 360 is arranged in the connecting hole. The rotating rod 360 can be threadedly connected to the connecting hole, or can be snapped into the connecting hole, that is, the rotating rod 360 is fixed when inserted into the connecting hole, and the rotating rod 360 can also be pulled out of the connecting hole. The height of the rotating rod 360 is greater than the height of the connecting hole, so that the bottom end of the rotating rod 360 can extend into the through hole 210.

[0068] The pressing plate 350 is rotatably connected to the bottom end of the rotating rod 360. The cross-sectional area of ​​the pressing plate 350 is larger than that of the rotating rod 360, so as to increase the contact area with the horizontal plate 310. The pressing plate 350 is in a cubic shape as a whole. A pressing groove adapted to the pressing plate 350 can be provided on the top wall of the horizontal plate 310. By placing the pressing plate 350 in the pressing groove, the contact area between the horizontal plate 310 and the pressing plate 350 can be further increased. Moreover, since the pressing plate 350 and the rotating rod 360 are rotatably connected, when the horizontal plate 310 rotates, the pressing plate 350 can also rotate accordingly.

[0069] By reserving the rotation gap, when the microelectronic device is fixed, the pressure plate 350 can be pulled to move by operating the rotating rod 360 to separate the pressure plate 350 and the horizontal plate 310, and then the horizontal plate 310 can be pushed to rotate in the rotation gap. When the horizontal plate 310 rotates in the horizontal plane, the microelectronic device is already fixed in the fixed gap 400, so the fixing direction of the microelectronic device will also change with the rotation of the horizontal plate 310, and then the bottom end of the rotating rod 360 is extended into the through hole 210, and the rotating rod 360 will push the pressure plate 350 to squeeze the horizontal plate 310, so that the horizontal plate 310 is fixed in the through hole 210, so as to adjust the fixing angle of the microelectronic device.

[0070] In an embodiment of the present invention, the bottom wall of the pressure plate 350 has an arc surface, and the top wall of the cross plate 310 has an arc groove that fits the arc surface. Specifically, the cross section of the pressure plate 350 is arc-shaped, that is, the side of the pressure plate 350 away from the rotating rod 360 is convex to form an arc surface. An arc groove that fits the arc surface is provided on the top wall of the cross plate 310. Through the cooperation of the arc surface and the arc groove, the contact area between the pressure plate 350 and the cross plate 310 can be further increased, thereby increasing the friction between the pressure plate 350 and the cross plate 310 to improve the stability of the cross plate 310.

[0071] Reference Figure 3 As shown, in the embodiment of the present invention, the fixing assembly 300 further includes a lever 361. The lever 361 is disposed at the top of the rotating rod 360. Specifically, the axis of the lever 361 may not be colinear with the axis of the rotating rod 360. For example, the axis of the lever 361 may be at an angle of ninety degrees to the axis of the rotating rod 360. In this way, when the lever 361 is operated to extend into the through hole 210, the lever 361 may be grasped, and the rotating rod 360 may move along with the movement of the lever 361 by pulling the lever 361 or rotating the lever 361, thereby facilitating the operation of the rotating rod 360.

[0072] The present invention also provides a method for packaging a microelectronic device. The fixing device for packaging a microelectronic device can achieve fixed packaging of the microelectronic device through this method.

[0073] Figure 5FIG. 1 is a schematic diagram of a process for packaging a microelectronic device according to an embodiment of the present invention. Figure 5 As shown, the method comprises the following steps:

[0074] S100: According to the size of the microelectronic device, the limiting plate is pushed to slide relative to the pillar, so that the two limiting plates are separated from each other and the size of the fixed gap is increased.

[0075] The fixed gap is formed by two limit plates and two clamping members, and the clamping members are arranged on the limit plates. When the limit plates are pushed to move, the clamping members can be driven to move. When the two limit plates are separated from each other, the fixed gap will increase. At the same time, the clamping members include clamping plates and elastic members. According to the size of the microelectronic device in the thickness direction, the clamping plates can be pulled away from the limit plates, and the elastic members are elastically deformed to facilitate clamping the microelectronic device.

[0076] S200: placing the microelectronic device into the fixed gap, and pushing the limiting plate to slide relative to the pillar, so that the two limiting plates are close to each other, thereby reducing the fixed gap.

[0077] After the size of the fixed gap increases, the microelectronic device can be placed in the fixed gap, and then the limiting plates are pushed closer to each other, thereby reducing the fixed gap in the length direction of the microelectronic device, and the clamping plate and the limiting plate form the clamping gap. When the fixed gap is reduced in the length direction, the microelectronic device will enter the clamping gap.

[0078] S300: After the fixed gap is reduced, the microelectronic device is clamped and fixed in the fixed gap by a clamping member;

[0079] When the microelectronic device enters the clamping gap, the clamping plate can be released, and the elastic member will pull the clamping plate downward under the action of elastic force, thereby clamping the microelectronic device in the fixed gap to complete the fixation of the microelectronic device. In addition, the locking member can be used to lock the limit plate and fix the limit plate on the horizontal plate, thereby improving the stability of the microelectronic device after fixation, so as to facilitate the packaging of the microelectronic device.

[0080] S400: Packaging the fixed microelectronic device.

[0081] Since the bottom plate of the fixed microelectronic device is arranged in advance, the microelectronic device fixed on the device can be directly packaged to facilitate the storage and transportation of the microelectronic device.

[0082] Through the above steps S1, S2, S3 and S4, microelectronic devices of various types or sizes can be fixed, thereby improving the adaptability to microelectronic devices. At the same time, the packaging of microelectronic devices can be completed quickly, thereby improving the packaging efficiency.

[0083] In an embodiment of the present invention, the above step S3 further includes: after the microelectronic device is fixed, adjusting the angle of the microelectronic device.

[0084] The horizontal plate is inserted into the through hole on the column, and a rotation gap is reserved. At this time, the direction of the limit plate can be adjusted by pushing the horizontal plate to rotate in the horizontal plane. The microelectronic device is fixed in the fixed gap at this time. When the angle of the fixed gap changes, the microelectronic device will also change accordingly, so as to adjust the fixed angle of the microelectronic device. After the angle adjustment is completed, the horizontal plate can be pressed against the through hole by the cooperation of the rotating rod and the pressure plate to fix the horizontal plate, so as to facilitate the packaging of the microelectronic device.

[0085] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A fixing device for packaging a microelectronic device, characterized in that: The microelectronic device packaging fixture comprises: Bottom plate (100); Two upright posts (200) are arranged opposite to each other on the base plate (100); and A fixing assembly (300), wherein each of the columns (200) is provided with a fixing assembly (300), and the fixing assembly (300) comprises: A limiting plate (320) is slidably connected to the pillar (200), and a fixed gap (400) of adjustable size for fixing the microelectronic device is formed between the two limiting plates (320); and A clamping member (340) is arranged on the limiting plate (320), and the clamping member (340) is used to clamp the microelectronic device; The fixing assembly (300) further comprises: A transverse plate (310) is arranged on the upright column (200), the limiting plate (320) is slidably connected to the transverse plate (310), and the limiting plate (320) partially extends out of the transverse plate (310) to form the fixed gap (400); and A locking member (330) is arranged on the transverse plate (310), and the locking member (330) can selectively lock the position of the limiting plate (320) on the transverse plate (310); The clamping member (340) comprises: An elastic member (341) is arranged on the top wall of the limiting plate (320); and A clamping plate (342) is arranged on the elastic member (341), the clamping plate (342) and the limiting plate (320) are arranged opposite to each other, and a bottom wall of the clamping plate (342) and a top wall of the limiting plate (320) form a clamping gap (343) for clamping the microelectronic device; The upright column (200) has a through hole (210), the transverse plate (310) passes through the through hole (210), and there is a rotation gap between the transverse plate (310) and the through hole (210); wherein the fixing assembly (300) further comprises: A pressing plate (350) is slidably connected in the through hole (210), and the pressing plate (350) can selectively abut against the transverse plate (310); and A rotating rod (360) is arranged on the column (200), and one end of the rotating rod (360) can be selectively extended into the through hole (210) and is rotatably connected to the pressing plate (350).

2. The fixing device for packaging a microelectronic device according to claim 1, characterized in that: The clamping member (340) further comprises: A limiting rod (344) is disposed on the limiting plate (320), and the limiting rod (344) is slidably connected to the clamping plate (342); and A limiting piece (345) is arranged at one end of the limiting rod (344) away from the limiting plate (320), and a cross-sectional area of ​​the limiting piece (345) is greater than a cross-sectional area of ​​the limiting rod (344).

3. The fixing device for packaging a microelectronic device according to claim 1, characterized in that: The locking member (330) comprises: A locking rod (331) is arranged on the transverse plate (310), and the locking rod (331) partially extends into the transverse plate (310). One end of the locking rod (331) extending into the transverse plate (310) can selectively abut against the top wall of the limiting plate (320).

4. The fixing device for packaging a microelectronic device according to claim 1, characterized in that: The fixing assembly (300) further comprises: A slider (321) is arranged on the limiting plate (320); Wherein, a sliding groove (312) for the sliding block (321) to slide is provided on the inner side wall of the transverse plate (310).

5. The fixing device for packaging a microelectronic device according to claim 1, characterized in that: The pressure plate (350) has a curved surface on one side close to the transverse plate (310); and the top wall of the transverse plate (310) has an arc-shaped groove that fits the curved surface.

6. The fixing device for packaging a microelectronic device according to claim 1, characterized in that: The fixing assembly (300) further comprises: a lever (361) disposed on a side of the rotating rod (360) away from the pressing plate (350); and / or The pull rod (332) is arranged on a side of the locking member (330) away from the limiting plate (320).

7. A microelectronic device packaging method, characterized in that: The microelectronic device packaging method comprises the following steps: fixing the microelectronic device to be packaged using the microelectronic device packaging fixing device according to any one of claims 1 to 6: According to the size of the microelectronic device, the limiting plate is pushed to slide relative to the pillar so that the two limiting plates are separated from each other and the size of the fixed gap is increased; Put the microelectronic device into the fixed gap, and push the limiting plate to slide relative to the column so that the two limiting plates are close to each other to reduce the fixed gap; After the fixed gap is reduced, the microelectronic device is clamped and fixed in the fixed gap by the clamping member; The fixed microelectronic devices are packaged.

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