Short wave infrared detector

Abstract

The utility model relates to the field of chip packaging, in particular to a short-wave infrared detector, which comprises a ceramic tube shell, an optical window, a tube shell metal ring, a short-wave infrared chip and a refrigerator, the tube shell metal ring is arranged at the opening of the cavity of the ceramic tube shell to increase the height of the cavity; the optical window covers the opening of the cavity, and forms a closed working cavity with the ceramic tube shell and the tube shell metal ring; the refrigerator is arranged at the bottom of the closed working cavity, and the short wave infrared chip is arranged in the closed working cavity and located at the top of the refrigerator. According to the utility model, the ceramic tube shell with smaller insulator spacing is used, and a section of tube shell metal ring is additionally arranged at the opening of the cavity of the ceramic tube shell, so that the height of the cavity is increased, the packaging of a stacked structure formed by the short-wave infrared chip and the refrigerator is realized, the problem of low yield is avoided, and the production efficiency is improved. And the universality of the short-wave infrared detector is improved.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging, in particular to a short-wave infrared detector. Background Art

[0002] With the development of technology, infrared sensors are used in various occasions. Among them, short-wave infrared detectors are increasingly valued by practitioners in various fields due to their strong penetration, strong anti-interference ability, excellent thermal imaging ability and high resolution. The scope of application is becoming wider and wider, and accordingly, the working environment is becoming more and more complex.

[0003] In order to ensure the working stability of short-wave infrared detectors, it is usually necessary to integrate a heat sink in the packaging component to prevent the infrared chip's own working heat from affecting the detection effect. However, the current heat sink is large in size, and the stacked structure of the infrared chip plus the heat sink requires a high height in the cavity of the packaging component. Therefore, short-wave infrared detectors usually use metal shells, which results in a larger space occupied by the packaging component, which is not conducive to the miniaturization of the component and limits the application scenarios of short-wave infrared detectors.

[0004] Therefore, how to further reduce the size of the short-wave infrared detector and reduce the space occupied by the components is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0005] The utility model aims to provide a short-wave infrared detector to solve the problem that the short-wave infrared detector in the prior art is too large in size, which is not conducive to the miniaturization of components and reduces the versatility of the components.

[0006] In order to solve the above technical problems, the utility model provides a short-wave infrared detector, including a ceramic tube shell, an optical window, a tube shell metal ring, a short-wave infrared chip and a refrigerator;

[0007] The tube shell metal ring is arranged at the cavity opening of the ceramic tube shell to increase the height of the cavity;

[0008] The optical window covers the opening of the chamber, and forms a closed working chamber with the ceramic tube shell and the metal ring of the tube shell;

[0009] The refrigerator is arranged at the bottom of the sealed working chamber, and the short-wave infrared chip is arranged in the sealed working chamber and located at the top of the refrigerator.

[0010] Optionally, in the short-wave infrared detector, the short-wave infrared chip is at least one of a linear chip and an array chip.

[0011] Optionally, in the short-wave infrared detector, the cooler is a semiconductor cooler.

[0012] Optionally, in the short-wave infrared detector, the semiconductor cooler is a multi-stage cooler.

[0013] Optionally, in the short-wave infrared detector, the outer surface of the tube shell metal ring includes fixed fins;

[0014] The fixing wing includes a positioning hole and a fixing hole;

[0015] The positioning hole is used to cooperate with the positioning piece on the mounting surface to position the short-wave infrared detector on the mounting surface;

[0016] The fixing hole is used to cooperate with a fixing piece to fix the short-wave infrared detector on the installation surface.

[0017] Optionally, in the short-wave infrared detector, the ceramic tube shell includes a step disposed at an inner edge of the chamber;

[0018] The refrigerator is electrically connected to an external circuit via a connecting piece arranged on the step;

[0019] and / or

[0020] The short-wave infrared chip is electrically connected to an external circuit via bonding fingers arranged on the step.

[0021] Optionally, in the short-wave infrared detector, an incident surface and / or an exit surface of the optical window is provided with an anti-reflection film.

[0022] Optionally, in the short-wave infrared detector, a metal carrying ring is also included;

[0023] The metal bearing ring comprises a bearing base and a bearing surrounding ring;

[0024] The carrying ring is disposed on the carrying base, and the carrying base extends beyond the inner diameter of the carrying ring and continues to extend inward to form a connecting table;

[0025] The supporting substrate is fixedly connected to the top surface of the tube shell metal ring;

[0026] The optical window is arranged on the connecting table and is fixedly connected to the supporting substrate.

[0027] Optionally, in the short-wave infrared detector, the optical window is fixedly connected to the supporting substrate by eutectic bonding.

[0028] Optionally, in the short-wave infrared detector, the metal supporting ring is fixedly connected to the top surface of the metal ring of the tube shell by parallel sealing welding.

[0029] The short-wave infrared detector provided by the utility model includes a ceramic tube shell, an optical window, a tube shell metal ring, a short-wave infrared chip and a refrigerator; the tube shell metal ring is arranged at the chamber opening of the ceramic tube shell to increase the height of the chamber; the optical window covers the opening of the chamber and forms a closed working chamber with the ceramic tube shell and the tube shell metal ring; the refrigerator is arranged at the bottom of the closed working chamber, and the short-wave infrared chip is arranged in the closed working chamber and located at the top of the refrigerator. The utility model uses a ceramic tube shell with a smaller insulator spacing, which reduces the plane size required for the short-wave infrared detector, and adopts the method of adding a tube shell metal ring at the chamber opening of the ceramic tube shell to increase the height of the chamber, realize the packaging of the stacked structure composed of the short-wave infrared chip and the refrigerator, avoids the problem of complex preparation process and low yield of ceramic tube shells with a large height, takes into account the high yield and low space occupation of the finished component, and greatly improves the versatility of the short-wave infrared detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] FIG1 is a schematic structural cross-sectional view of a specific embodiment of a short-wave infrared detector provided by the utility model;

[0032] FIG2 is a schematic structural cross-sectional view of another specific implementation of the short-wave infrared detector provided by the present utility model;

[0033] FIG3 is a schematic top view of the structure of a specific embodiment of the short-wave infrared detector provided by the utility model;

[0034] FIG4 is a schematic top view of the structure of another specific implementation manner of the short-wave infrared detector provided by the utility model.

[0035] In the figure, 100-optical window, 101-first solder layer, 102-carrying ring, 103-carrying substrate, 104-welding joint area, 105-photosensitive structure, 106-circuit chip, 107-tube shell metal ring, 108-second solder area, 109-connecting piece, 110-ceramic substrate, 111-connecting wire, 112-PN junction, 113-tube shell pin, 114-fixing wing, 115-positioning hole, 116-fixing hole, 117-bonding finger, 118-bonding wire, DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0037] The core of the utility model is to provide a short-wave infrared detector, a structural schematic diagram of a specific implementation is shown in FIG1 , which is referred to as the first specific implementation, and includes a ceramic tube shell, an optical window 100, a tube shell metal ring 107, a short-wave infrared chip and a refrigerator;

[0038] The tube shell metal ring 107 is arranged at the cavity opening of the ceramic tube shell to increase the height of the cavity;

[0039] The optical window 100 covers the opening of the chamber, and forms a closed working chamber with the ceramic tube shell and the tube shell metal ring 107;

[0040] The refrigerator is arranged at the bottom of the sealed working chamber, and the short-wave infrared chip is arranged in the sealed working chamber and located at the top of the refrigerator.

[0041] In the present invention, it is assumed that the short-wave infrared detector is placed on a horizontal plane, and the opening of the chamber of the ceramic tube shell is vertically upward. The remaining descriptions of the position of the structure are also based on this. In actual production and use, if the setting direction changes, it can be changed according to the orientation recorded in the present invention, and the present invention is not limited here.

[0042] The short-wave infrared chip is usually composed of two parts, one part is the photosensitive structure 105 of the chip, and the other part is the circuit chip 106 of the chip. The two parts are connected by an indium column interconnection structure to achieve circuit connection.

[0043] In addition, the optical window 100 in the present invention does not refer to an opening formed by a sealed gap, but a transparent packaging structure that allows infrared rays to enter. Preferably, the optional material of the optical window 100 includes at least one of fused quartz and sapphire.

[0044] The short-wave infrared chip is at least one of a linear chip and an array chip. The linear chip and the array chip can be selected according to actual needs, further improving the versatility of the utility model.

[0045] Preferably, the refrigerator is a semiconductor refrigerator. It refers to a device that uses the thermoelectric effect of semiconductors to produce cooling, also known as a thermoelectric refrigerator. When two different metals are connected by a conductor and a direct current is connected, the temperature at one connection point decreases and the temperature at the other connection point increases. The semiconductor refrigerator does not require moving parts and can achieve cooling in the fully enclosed environment of the enclosed working chamber, greatly improving the stability of the component operation.

[0046] The thermoelectric cooler mainly consists of two parts, one is a ceramic substrate 110, the materials include but are not limited to aluminum nitride ceramics, aluminum oxide ceramics; the other is a PN junction 112 structure, the materials of which include but are not limited to bismuth telluride and other materials. The PN junction 112 and the ceramic substrate 110 are fixed by welding, and the optional materials of the solder include but are not limited to SnSb (tin-antimony alloy), SnAgCu (tin-copper-silver), BiSn (bismuth-tin alloy) and other materials.

[0047] The thermoelectric cooler and the ceramic tube shell can be fixed by welding or gluing. The optional solder materials include but are not limited to SnAgCu, InAg (indium silver alloy) and other solders. The optional adhesives include but are not limited to epoxy glue, nano silver glue and the like.

[0048] The electrical signal of the entire detector is led out through the shell pin 113, and the shell pin 113 is fixed to the outer surface of the ceramic shell by welding. The optional solder materials include but are not limited to AgCu (silver-copper alloy), AuGe (gold-germanium alloy), AuSn (gold-tin alloy) and other solders.

[0049] Furthermore, the semiconductor refrigerator is a multi-stage refrigerator. The multi-stage refrigerator has a stronger cooling performance, which can better help the short-wave infrared chip to work stably in a low-temperature constant temperature environment, and improve the working stability of the short-wave infrared detector. Of course, a single-stage refrigerator can also be selected according to actual needs. The thickness of the single-stage refrigerator is lower, which can meet the requirements of stricter and thinner thickness of the short-wave infrared detector. Please refer to Figure 2, which is a cross-sectional schematic diagram of a packaging component including a multi-stage refrigerator. It is not difficult to see that the multi-stage refrigerator includes more ceramic substrates 110.

[0050] As a preferred embodiment, the ceramic tube shell includes a step arranged at the inner edge of the chamber;

[0051] The refrigerator is electrically connected to an external circuit via a connecting piece 109 disposed on the step;

[0052] and / or

[0053] The short-wave infrared chip is electrically connected to an external circuit via the bonding fingers 117 disposed on the step.

[0054] Because the refrigerator is usually thick, and the short-wave infrared chip is arranged on the top of the refrigerator, the connection point between the short-wave infrared chip and the refrigerator is at a higher position. If the relevant technology is adopted, the bonding finger 117 corresponding to the short-wave infrared chip and the connecting piece 109 corresponding to the refrigerator are arranged at the bottom of the chamber, then the bonding wire 118 needs to extend all the way from the short-wave infrared chip arranged at a high place to the bottom of the chamber. Similarly, the connecting wire 111 of the refrigerator also needs to extend from the higher position of the refrigerator to the bottom of the chamber. Excessively long conductive wires will increase the difficulty of installation and increase the possibility of falling off, short circuit and other faults during operation. In the preferred embodiment, a step is provided at the edge of the chamber, so that the conductive wires of the short-wave infrared chip and / or the refrigerator no longer need to reach the bottom of the chamber, but can be connected to the step, which greatly shortens the length of the conductive wires of the short-wave infrared chip and / or the refrigerator, thereby improving the working stability of the components and reducing the difficulty of conductive installation.

[0055] It should be noted that the connecting piece 109 and the bonding finger 117 can be respectively arranged on two steps in the chamber, or can be arranged on different position areas of the same step. It can be selected according to actual conditions, and the utility model does not limit this.

[0056] Preferably, an anti-reflection film is provided on the incident surface and / or the exit surface of the optical window 100. After the anti-reflection film is provided, the infrared rays irradiated onto the short-wave infrared chip are further increased, thereby improving the accuracy of the short-wave infrared detector.

[0057] As a preferred embodiment, it also includes a metal carrying ring;

[0058] The metal carrier ring includes a carrier base 103 and a carrier surrounding ring 102;

[0059] The carrying ring 102 is disposed on the carrying base 103, and the carrying base 103 extends beyond the inner diameter of the carrying ring 102 and continues to extend inward to form a connecting table;

[0060] The carrier substrate 103 is fixedly connected to the top surface of the tube shell metal ring 107;

[0061] The optical window 100 is disposed on the connecting table and is fixedly connected to the supporting substrate 103 .

[0062] In this preferred embodiment, the optical window 100 is connected to the tube shell metal ring 107 through the metal supporting ring, and the metal supporting ring is specifically described to include the supporting base 103 and the supporting ring. Please refer to Figure 1. The supporting base 103 and the supporting ring form a step-like structure on the inner circle of the supporting ring, that is, the connecting table. The optical window 100 can be set on the connecting table. The supporting ring 102 acts as a limiter to prevent the optical window 100 from being offset and causing sealing failure. The metal supporting ring is more tightly and firmly connected to the tube shell metal ring 107 below, thereby improving the overall sealing and working stability of the component.

[0063] The carrier substrate 103 and the carrier ring 102 are fixed together by soldering, and the solder layer between the two is called the first solder layer 101. Specifically, the soldering is parallel sealing, and the two metal structures that are attached to each other during the parallel sealing process melt to form a welding joint area 104. The material of the carrier ring 102 includes but is not limited to iron-nickel alloy, aluminum alloy, titanium alloy and other materials, and the solder material between the carrier ring 102 and the carrier substrate 103 includes but is not limited to AgCu (silver-copper alloy), AuGe (gold-germanium alloy), AuSn (gold-tin alloy), SnAg (tin-silver alloy), InAg and other solders.

[0064] Furthermore, the optical window 100 is fixedly connected to the carrier substrate 103 by eutectic bonding. Eutectic bonding greatly improves the connection firmness and sealing of the carrier substrate 103 and the optical window 100. Of course, since the eutectic bonding is adopted for fixing, the edge of the optical window 100 should include a metal layer, and further, a vapor-deposited metal layer. The solder material of the eutectic bonding includes but is not limited to AuSn (gold-tin eutectic), SnAg (silver-tin eutectic), InAg (silver-indium eutectic) and other solders. The material of the carrier substrate 103 includes but is not limited to iron-nickel alloy, aluminum alloy, titanium alloy and other materials.

[0065] Furthermore, the metal carrier ring is fixedly connected to the top surface of the tube shell metal ring 107 by parallel sealing, and the corresponding solder area is called the second solder area 108. Parallel sealing occupies less space, has good sealing performance, and the obtained short-wave infrared detector has a high finished product yield.

[0066] The optical window 100, the metal supporting ring, the tube shell metal ring 107 and the ceramic tube shell form a sealed environment. The materials of each part are dense and there are no gaps at the joints, so no gas is released, which prevents external gas from entering the chamber, thereby improving the stability of the working environment of the short-wave infrared chip.

[0067] The utility model further extends the chamber of the ceramic shell by adding a section of the shell metal ring 107 at the opening of the ceramic shell, which is equivalent to increasing the height of the chamber by adding a section of metal, thereby meeting the height requirement of stacking the refrigerator and the short-wave infrared chip, and solving the problem of complex process and low yield of finished products for preparing a larger chamber height for a pure ceramic shell. The technical solution provided by the utility model can even accommodate multi-stage semiconductor refrigerators with thicker thickness, which is unimaginable in a pure ceramic shell.

[0068] The short-wave infrared detector provided by the utility model comprises a ceramic tube shell, an optical window 100, a tube shell metal ring 107, a short-wave infrared chip and a refrigerator; the tube shell metal ring 107 is arranged at the chamber opening of the ceramic tube shell to increase the height of the chamber; the optical window 100 covers the opening of the chamber and forms a closed working chamber with the ceramic tube shell and the tube shell metal ring 107; the refrigerator is arranged at the bottom of the closed working chamber, and the short-wave infrared chip is arranged in the closed working chamber and located at the top of the refrigerator. The utility model uses a ceramic tube shell with a smaller insulator spacing, reduces the plane size required for the short-wave infrared detector, and adopts the method of adding a tube shell metal ring 107 at the chamber opening of the ceramic tube shell to increase the height of the chamber, realizes the packaging of the stacked structure composed of the short-wave infrared chip and the refrigerator, avoids the problem of complex preparation process and low yield of ceramic tube shells with a large height, takes into account the high yield and low space occupation of the finished component, and greatly improves the versatility of the short-wave infrared detector.

[0069] On the basis of the first specific implementation, the positioning and installation of the short-wave infrared detector are further improved to obtain a second specific implementation, the corresponding structural diagram of which is shown in FIG3 , including a ceramic tube shell, an optical window 100, a tube shell metal ring 107, a short-wave infrared chip and a refrigerator;

[0070] The tube shell metal ring 107 is arranged at the cavity opening of the ceramic tube shell to increase the height of the cavity;

[0071] The optical window 100 covers the opening of the chamber, and forms a closed working chamber with the ceramic tube shell and the tube shell metal ring 107;

[0072] The refrigerator is arranged at the bottom of the sealed working chamber, and the short-wave infrared chip is arranged in the sealed working chamber and located at the top of the refrigerator;

[0073] The outer surface of the tube shell metal ring 107 includes a fixing fin 114;

[0074] The fixing wing 114 includes a positioning hole 115 and a fixing hole 116;

[0075] The positioning hole 115 is used to cooperate with the positioning piece on the mounting surface to position the short-wave infrared detector on the mounting surface;

[0076] The fixing hole 116 is used to cooperate with a fixing member to fix the short-wave infrared detector on the installation surface.

[0077] The difference between this embodiment and the above embodiment is that in this embodiment, a fixing structure is added to the tube shell metal ring 107, and the remaining structures are the same as those in the above embodiment, which will not be described in detail here.

[0078] In this specific embodiment, an outer edge structure, namely, the fixing fin 114, is provided on the outer surface of the tube shell metal ring 107. Please refer to FIG3, which is a top view of the short-wave infrared detector. The fixing fin 114 is extended from the metal structure to help positioning and installation, and can withstand more demanding use environments, greatly improving the reliability of the short-wave infrared detector of the utility model. In other words, it also broadens the use scenarios of the short-wave infrared detector and improves its versatility. The corresponding FIG4 is a top view of the internal structure of the packaging component.

[0079] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0080] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0081] The above is a detailed introduction to the short-wave infrared detector provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A short-wave infrared detector, characterized in that: It comprises a ceramic tube shell, an optical window (100), a tube shell metal ring (107), a short-wave infrared chip and a refrigerator; The tube shell metal ring (107) is arranged at the cavity opening of the ceramic tube shell to increase the height of the cavity; The optical window (100) covers the opening of the chamber, and forms a closed working chamber with the ceramic tube shell and the tube shell metal ring (107); The refrigerator is arranged at the bottom of the sealed working chamber, and the short-wave infrared chip is arranged in the sealed working chamber and located at the top of the refrigerator.

2. The short-wave infrared detector according to claim 1, characterized in that: The short-wave infrared chip is at least one of a linear chip and an array chip.

3. The short-wave infrared detector according to claim 1, characterized in that: The refrigerator is a semiconductor refrigerator.

4. The short-wave infrared detector according to claim 3, characterized in that: The semiconductor refrigerator is a multi-stage refrigerator.

5. The short-wave infrared detector according to claim 1, characterized in that: The outer surface of the tube shell metal ring (107) comprises fixing fins (114); The fixing wing (114) comprises a positioning hole (115) and a fixing hole (116); The positioning hole (115) is used to cooperate with a positioning piece on the mounting surface to position the short-wave infrared detector on the mounting surface; The fixing hole (116) is used to cooperate with a fixing piece to fix the short-wave infrared detector on the installation surface.

6. The short-wave infrared detector according to claim 1, characterized in that: The ceramic tube shell includes a step disposed at an inner edge of the chamber; The refrigerator is electrically connected to an external circuit via a connecting piece (109) arranged on the step; and / or The short-wave infrared chip is electrically connected to an external circuit via a bonding finger (117) arranged on the step.

7. The short-wave infrared detector according to claim 1, characterized in that: The incident surface and / or the exit surface of the optical window (100) is provided with an anti-reflection film.

8. The short-wave infrared detector according to claim 1, characterized in that: Also included is a metal carrier ring; The metal bearing ring comprises a bearing base (103) and a bearing surrounding ring (102); The carrying ring (102) is arranged on the carrying base (103), and the carrying base (103) extends beyond the inner diameter of the carrying ring (102) and continues to extend inwards to form a connecting table; The supporting substrate (103) is fixedly connected to the top surface of the tube shell metal ring (107); The optical window (100) is arranged on the connection table and is fixedly connected to the supporting substrate (103).

9. The short-wave infrared detector according to claim 8, characterized in that: The optical window (100) is fixedly connected to the supporting substrate (103) by eutectic bonding.

10. The short-wave infrared detector according to claim 8, characterized in that: The metal supporting ring is fixedly connected to the top surface of the tube shell metal ring (107) by parallel sealing welding.

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