Partition alignment method based on multi-layer PCB and partition alignment device for multi-layer PCB

Abstract

The present invention provides a partition alignment method based on a multi-layer PCB and a partition alignment device for a multi-layer PCB, the method comprising: S101: dividing the panel into partitions according to preset partition information, and obtaining information of the target of each partition, the target comprising a first target corresponding to the four corners of the partition and a second target corresponding to the partition line of the partition; S102: selecting a target according to the acquired processing information, and processing the partition by the target and the expansion and contraction coefficient corresponding to the target, wherein the processing method comprises at least one of laser drilling, graphic exposure, and mechanical drilling. The present invention greatly reduces the influence of the expansion and contraction of the plate by partitioning the panel and performing corresponding processing using the expansion and contraction coefficients of different partitions, thereby avoiding the deviation of the alignment, reducing the probability of the occurrence of the collapse hole, improving the yield of the product, and promoting the reduction of the production cost.

Description

Technical Field

[0001] The present invention relates to the field of PCB manufacturing, and in particular to a partition alignment method based on a multi-layer PCB and a partition alignment device for a multi-layer PCB. Background Art

[0002] Printed Circuit Board (PCB) is an important electronic component, generally used to carry electronic components and realize electrical connections between electronic components. With the development of electronic technology, the wiring density of printed circuit boards is getting higher and higher, and the complexity of printed circuit boards is also getting higher and higher.

[0003] In order to meet the needs of high-density wiring, the solder ring design of blind vias and mechanical through holes is getting smaller and smaller. For example, in some PCBs, the single-sided solder ring design of blind vias and mechanical through holes is only 0.030mm. This situation is very easy to cause the nonlinear distortion caused by the expansion and contraction of the board to cause the blind vias and mechanical through holes to collapse during the processing, which greatly reduces the product yield and increases the production cost. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the present invention proposes a partition alignment method based on a multi-layer PCB and a partition alignment device for a multi-layer PCB. In PCB processing, the panel is divided into multiple partitions, and a corresponding target is set for each partition. When the panel is processed, each partition is processed according to the expansion and contraction coefficient of the target in each partition. By partitioning the panel and performing corresponding processing using the expansion and contraction coefficients of different partitions, the influence of the expansion and contraction of the plate is greatly reduced, thereby avoiding alignment deviation, reducing the probability of hole collapse, improving the yield of the product, and promoting the reduction of production costs.

[0005] To solve the above problems, a technical solution adopted by the present invention is: a partition alignment method based on a multi-layer PCB, the partition alignment method based on a multi-layer PCB comprising: S101: dividing the panel into partitions according to preset partition information, and obtaining target information of each partition, the target comprising a first target corresponding to the four corners of the partition and a second target corresponding to the partition line of the partition; S102: selecting the target according to the acquired processing information, and processing the partition by the target and the expansion and contraction coefficient corresponding to the target, wherein the processing method comprises at least one of laser drilling, graphic exposure, and mechanical drilling.

[0006] Furthermore, the step of dividing the panel into partitions according to preset partition information specifically includes: determining partition lines of the panel according to the partition information, and dividing the panel into a plurality of partitions through the partition lines.

[0007] Furthermore, the first targets include original targets and newly added targets, the original targets are targets corresponding to the four corners of the panel, and the number of newly added targets is not less than the number of the original targets.

[0008] Furthermore, the newly added target and the second target do not overlap with the partition line, and the distance between the newly added target and the adjacent partition line is within a preset range.

[0009] Furthermore, one partition is processed at a time.

[0010] Furthermore, the step of selecting the target according to the acquired processing information specifically includes: determining the partition of the panel to be processed and the processing method of the partition according to the processing information, and selecting the target in the partition and the adjacent partitions of the partition according to the processing method.

[0011] Furthermore, the step of processing the partition through the target and the expansion and shrinkage coefficient corresponding to the target includes: determining that the processing method is laser drilling, aligning through the first target corresponding to the partition, calculating the expansion and shrinkage coefficient according to the actual distance and design distance of the first target, laser drilling the partition based on the expansion and shrinkage coefficient, and processing the alignment target used for graphic exposure through the expansion and shrinkage coefficient.

[0012] Furthermore, the step of processing the partition by means of the target and the expansion / shrinkage coefficient corresponding to the target includes: determining that the processing method is graphic exposure, obtaining the alignment target corresponding to the graphic exposure for alignment, calculating the expansion / shrinkage coefficient according to the actual distance and the design distance of the alignment target, performing graphic exposure based on the expansion / shrinkage coefficient, and exposing the alignment target for laser drilling according to the expansion / shrinkage coefficient.

[0013] Furthermore, the step of processing the partition by the target and the expansion / shrinkage coefficient corresponding to the target includes: determining the processing method as mechanical drilling, determining the expansion / shrinkage coefficient of different areas of the partition according to the expansion / shrinkage coefficient of the first target corresponding to the partition, and performing mechanical drilling processing on the partition by the expansion / shrinkage coefficient and the second target corresponding to mechanical drilling.

[0014] Based on the same inventive concept, the present invention also proposes a partition alignment device for a multi-layer PCB, the partition alignment device comprising a processor and a memory, the processor being communicatively connected to the memory, the memory storing a computer program, and the processor executing the partition alignment method based on the multi-layer PCB as described in the above embodiment through the computer program.

[0015] Compared with the prior art, the beneficial effect of the present invention is that in PCB processing, the panel is divided into multiple partitions, and a corresponding target is set for each partition. When the panel is processed, each partition is processed according to the expansion and contraction coefficient of the target in each partition. The panel is partitioned and the expansion and contraction coefficients of different partitions are used for corresponding processing, which greatly reduces the influence of the expansion and contraction of the plate, thereby avoiding alignment deviation, reducing the probability of hole collapse, improving the yield of the product, and promoting the reduction of production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a flow chart of an embodiment of a partition alignment method based on a multi-layer PCB of the present invention;

[0017] Figure 2 It is a schematic diagram of an embodiment of a panel partition in a partition alignment method based on a multi-layer PCB of the present invention;

[0018] Figure 3 A schematic diagram of an embodiment of the alignment target design in the partition alignment method based on a multi-layer PCB of the present invention;

[0019] Figure 4 A schematic diagram of another embodiment of the alignment target design in the partition alignment method based on a multi-layer PCB of the present invention;

[0020] Figure 5 It is a schematic diagram of an embodiment of a laser drilling alignment target in a partition alignment method based on a multi-layer PCB of the present invention;

[0021] Figure 6 It is a schematic diagram of an embodiment of the comparison between four-partition and non-partition deformation in the partition alignment method based on a multi-layer PCB of the present invention;

[0022] Figure 7 It is a schematic diagram of an embodiment of the L5 / 6 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention;

[0023] Figure 8 It is a schematic diagram of an embodiment of the L4 / 7 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention;

[0024] Fig. 9 It is a schematic diagram of an embodiment of the L3 / 8 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention;

[0025] Fig.10 It is a schematic diagram of an embodiment of the L2 / 9 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention;

[0026] Fig.11It is a schematic diagram of an embodiment of the L1 / 10 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention;

[0027] Fig.12 It is a structural diagram of an embodiment of a partition alignment device for a multi-layer PCB according to the present invention. DETAILED DESCRIPTION

[0028] The following describes the implementation methods of the present application through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the various embodiments of the present disclosure generally described and shown in the accompanying drawings here can be combined with each other without conflict, and the structural components or functional modules therein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the present disclosure claimed for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0029] The terms used in the disclosure of this application are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms of "a", "said" and "the" used in the present disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0030] See also Figures 1 to 11 ,in, Figure 1 It is a flow chart of an embodiment of a partition alignment method based on a multi-layer PCB of the present invention; Figure 2 It is a schematic diagram of an embodiment of a panel partition in a partition alignment method based on a multi-layer PCB of the present invention; Figure 3 A schematic diagram of an embodiment of the alignment target design in the partition alignment method based on a multi-layer PCB of the present invention; Figure 4 A schematic diagram of another embodiment of the alignment target design in the partition alignment method based on a multi-layer PCB of the present invention; Figure 5 It is a schematic diagram of an embodiment of a laser drilling alignment target in a partition alignment method based on a multi-layer PCB of the present invention; Figure 6 It is a schematic diagram of an embodiment of the comparison between four-partition and non-partition deformation in the partition alignment method based on a multi-layer PCB of the present invention; Figure 7It is a schematic diagram of an embodiment of the L5 / 6 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention; Figure 8 It is a schematic diagram of an embodiment of the L4 / 7 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention; Fig. 9 It is a schematic diagram of an embodiment of the L3 / 8 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention; Fig.10 It is a schematic diagram of an embodiment of the L2 / 9 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention; Fig.11 It is a schematic diagram of an embodiment of the L1 / 10 deformation comparison trend in the partition alignment method based on a multi-layer PCB of the present invention, wherein: Figure 6 The dotted frame composed of the middle dotted lines is the deformed state of the panel, and the solid frame inside the panel that intersects with the dotted lines is the non-deformed state of the panel. Figures 1 to 11 The partition alignment method based on a multi-layer PCB of the present invention is described in detail.

[0031] The partition alignment methods based on multi-layer PCB include:

[0032] S101: Divide the panel into partitions according to preset partition information, and obtain target information of each partition, where the targets include first targets corresponding to the four corners of the partition and second targets corresponding to the partition lines of the partition.

[0033] In the prior art, after the PCB has gone through processes such as electroplating and lamination, it is impacted by temperature, humidity, and pressure, and the PCB sheet will expand and shrink. This change is accompanied by nonlinear distortion, which causes the alignment of the laser to the substrate, the pattern to the blind hole, and the pattern to the mechanical hole to shift during the processing, and eventually leads to hole collapse. Among them, the greater the target deformation value on the four corners of the panel, the greater the risk of hole collapse. The deformation value of the unpartitioned area is about 0.1mm, and the hole collapse ratio is about 20%. The hole collapse ratio needs to be reduced.

[0034] The step of dividing the panel into partitions according to the preset partition information specifically includes: determining the partition lines of the panel according to the partition information, and dividing the panel into a plurality of partitions through the partition lines.

[0035] In this embodiment, the number of partitions is four, and the areas of the partitions are equal. In other embodiments, the number of partitions can also be set to three, five, or other numbers according to user needs, and the areas of the partitions can also be unequal, which is not limited here.

[0036] The panel can be divided into left and right, up and down, up and down, left and right. The specific division method can be set by yourself.

[0037] In a specific embodiment, the panel is divided into four partitions, namely, zone A, zone B, zone C, and zone D, and each partition has an equal area and is divided by partition lines.

[0038] In this embodiment, the first target includes an original target and an additional target, the original target is a target corresponding to the four corners of the panel, the additional target and the second target do not overlap with the partition line, and the distance from the adjacent partition line is within a preset range.

[0039] In this embodiment, the preset range is ±50 mm from the nearest partition line. In other embodiments, it can also be ±40 mm, ±45 mm, ±48 mm or other values, and the user can set it according to the needs.

[0040] In this embodiment, the second target may be disposed at a position close to the partition lines on the upper and lower sides of the partition, or may be disposed at a position close to the partition lines on the left and right sides of the partition.

[0041] In a specific embodiment, the original target numbers of the four corners of the panel are ①②③④. After partitioning, the newly added target numbers are ⑤⑥⑦⑧⑨. Among them, the newly added targets ⑤⑥⑦⑧⑨ cannot be designed on the partition line, and they are set above and below the partition line and on the left and right sides of the partition line + / - 50mm away from the partition line. The second target of the partition is generated, and the second target numbers in each partition are divided into EF, GH, IJ, and KL.

[0042] S102: Select a target according to the acquired processing information, and process the partition using the target and the expansion / contraction coefficient corresponding to the target, wherein the processing method includes at least one of laser drilling, pattern exposure, and mechanical drilling.

[0043] In this embodiment, the step of selecting targets according to the acquired processing information specifically includes: determining the partition of the panel to be processed and the processing method of the partition according to the processing information, and selecting targets in the partition and adjacent partitions of the partition according to the processing method.

[0044] When the processing method is laser drilling, the steps of processing the partitions through the targets and the expansion and shrinkage coefficients corresponding to the targets include: determining that the processing method is laser drilling, aligning through the first target corresponding to the partition, calculating the expansion and shrinkage coefficient according to the actual distance and design distance of the first target, performing laser drilling processing on the partitions based on the expansion and shrinkage coefficients, and processing the alignment targets used for graphic exposure through the expansion and shrinkage coefficients.

[0045] In this embodiment, the actual distance and the design distance of the target are obtained by measuring the distance of the distance measurement target relative to the preset position, and the expansion and contraction coefficient is calculated according to the ratio of the actual distance to the design distance (actual distance / design distance).

[0046] In this embodiment, the distance between the alignment target and the adjacent partition line is also within the preset range.

[0047] In a specific embodiment, the panel is divided into four partitions, ABCD. When the processing method is determined to be laser drilling, the targets numbered ①⑤⑥⑦ are used for alignment in area A, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the targets, and the entire area A is laser drilled according to this coefficient (that is, the graphics in area A are processed and drilled). Among them, when using targets ①⑤⑥⑦ for alignment, only area A is processed, and other partitions are not processed. According to the expansion and contraction coefficients of targets ①⑤⑥⑦, alignment targets for pattern exposure alignment are processed (graphic exposure requires alignment targets as a reference. Using laser-processed targets for alignment will have better alignment. Alignment can be performed using the original targets, but the alignment effect is poor). For area B, targets ⑤②⑦⑧ are used for alignment, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the targets, and the entire area B is laser drilled according to this coefficient. Among them, when using targets ⑤②⑦⑧ for alignment, only area B is processed, and other areas cannot be processed. According to the expansion and contraction coefficients of targets ⑤②⑦⑧, alignment targets are processed for pattern exposure alignment. For area C, targets ⑥⑦④⑨ are used for alignment, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the target, and the entire area C is laser drilled according to this coefficient. When using targets ⑥⑦④⑨ for alignment, only area C is processed, and other areas cannot be processed. According to the expansion and contraction coefficients of targets ⑥⑦④⑨, alignment targets are processed for pattern exposure alignment. For area D, targets ⑦⑧⑨③ are used for alignment, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the target, and the entire area D is laser drilled according to this coefficient. Among them, when using targets ⑦⑧⑨③ for alignment, only area D is processed, and other areas cannot be processed. According to the expansion and contraction coefficients of targets ⑦⑧⑨③, alignment targets are processed for graphic exposure alignment. Specifically, the alignment targets used for graphic exposure alignment by laser drilling are numbered M, N, O, P, Q, R, S, T, and U, for a total of 9. Among them, the alignment targets M, O, U, and S are designed in areas A, B, C, and D, respectively, and the expansion and contraction coefficients of the alignment targets are consistent with the partitions in which they are located. Among them, the common targets N, P, Q, R, and T in the alignment targets can be designed within the range of + / -50mm on both sides of the partition line, and the expansion and contraction coefficients of the common targets are consistent with the partitions in which they are located.

[0048] Furthermore, when the processing method is image exposure, the steps of processing partitions through targets and expansion and shrinkage coefficients corresponding to the targets include: determining that the processing method is graphic exposure, obtaining the alignment target corresponding to the graphic exposure for alignment, calculating the expansion and shrinkage coefficient according to the actual distance and design distance of the alignment target, performing graphic exposure based on the expansion and shrinkage coefficient, and exposing the alignment target for laser drilling of the next layer of panel according to the expansion and shrinkage coefficient.

[0049] In the typical stacking structure of the HDI (High Density Interconnector) circuit board of the PCB, 10 layers of HDI need to be laminated 4 times. Among them, L5 / 6 is laminated to L4 / 7, L4 / 7 is laminated to L3 / 8, L3 / 8 is laminated to L2 / 9, and L2 / 9 is laminated to L1 / 10. Each layer needs to be laser drilled and pattern exposed once. The laser alignment target is designed in the adjacent layer of the previous layer (for example, the alignment target of the L4 / 5 laser hole is designed in the L5 layer pattern, and the copper and resin around the target are exposed by laser burning to capture the target; the alignment target of the L4 layer pattern is drilled by the L4 / 5 layer laser drilling to drill a 5*5 matrix hole). When the pattern exposure is aligned with the matrix hole drilled by the laser, the alignment will be better. Each layer has alignment requirements for the pattern to the laser hole and the laser hole to the pattern (no collapse is allowed).

[0050] In a specific embodiment, the partitions are divided into four partitions, ABCD. For the A area, alignment targets M, N, P, and Q are used for alignment. The expansion and contraction coefficient is calculated according to the actual distance and design distance of the alignment targets (actual distance / design distance, and the expansion and contraction coefficient is calculated by the actual distance / design distance), and the entire A area is exposed according to the expansion and contraction coefficient. When the alignment targets M, N, P, and Q are used for alignment, only the A area is exposed, and other areas cannot be exposed. According to the expansion and contraction coefficients of the alignment targets M, N, P, and Q, the alignment targets are exposed for laser drilling alignment. For the B area, alignment targets N, O, Q, and R are used for alignment. The expansion and contraction coefficient is calculated according to the actual distance and design distance of the alignment targets, and the entire B area is exposed according to this coefficient. When the alignment targets N, O, Q, and R are used for alignment, only the B area is exposed, and other areas cannot be exposed. And according to the expansion and contraction coefficients of the alignment targets N, O, Q, and R, the alignment targets used for laser drilling alignment are exposed. For area C, alignment targets P, Q, S, and T are used for alignment, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the alignment targets, and the entire area C is exposed according to this coefficient. Among them, when alignment targets P, Q, S, and T are used for alignment, only area C is exposed, and other areas cannot be exposed. According to the expansion and contraction coefficients of the alignment targets P, Q, S, and T, the alignment targets used for laser drilling alignment are exposed. For area D, alignment targets Q, R, T, and U are used for alignment, and the expansion and contraction coefficient (actual distance / design distance) is calculated according to the actual distance and design distance of the alignment targets, and the entire area D is exposed according to this expansion and contraction coefficient. Among them, when alignment targets Q, R, T, and U are used for alignment, only area D is exposed, and other areas cannot be exposed. According to the expansion and contraction coefficients of the alignment targets Q, R, T, and U, the alignment targets used for laser drilling alignment are exposed. The alignment targets used for laser drilling alignment are numbered ①②③④⑤⑥⑦⑧⑨, a total of 9. Alignment targets ①②③④ are designed in areas A, B, C, and D respectively, and the expansion and contraction coefficients of the alignment targets are consistent with the partitions they are in. The shared targets ⑤⑥⑦⑧⑨ in the alignment targets can be designed within the range of + / -50mm on both sides of the partition line, and the expansion and contraction coefficients of the shared targets are consistent with the partitions they are in.

[0051] When the processing method is mechanical drilling, the steps of processing the partitions through the targets and the expansion and contraction coefficients corresponding to the targets include: determining that the processing method is mechanical drilling, determining the expansion and contraction coefficients of different areas of the partitions according to the expansion and contraction coefficients of the first targets corresponding to the partitions, and performing mechanical drilling processing on the partitions through the expansion and contraction coefficients and the second targets corresponding to the mechanical drilling.

[0052] In a specific embodiment, the panel is divided into four zones, ABCD. For zone A, targets ①⑤⑥⑦ are used to classify and process different areas of the zone, and different types of expansion and contraction use corresponding expansion and contraction coefficients. Among them, zone A uses targets E and F for alignment, and only zone A is processed, and other zones cannot be processed. For zone B, targets ⑤②⑦⑧ are used to classify and process different areas of the zone, and different types of expansion and contraction use corresponding expansion and contraction coefficients. Zone B uses targets G and H for alignment, and only zone B is processed, and other zones cannot be processed. For zone C, targets ⑥⑦④⑨ are used to classify different areas of the zone, and different types of expansion and contraction use corresponding expansion and contraction coefficients. Zone C uses targets I and J for alignment, and only zone C is processed, and other zones cannot be processed. For zone D, targets ⑦⑧⑨③ are used to classify different areas of zone D, and different types of expansion and contraction use corresponding expansion and contraction coefficients. Zone D uses targets K and L for alignment, and only zone D is processed, and other zones cannot be processed. When classifying expansion and contraction, an X-RAY measuring device is used to measure the expansion and contraction coefficient of each area of ​​each panel, and the area is divided into multiple areas in a grid manner. For targets with measurement numbers ①⑤⑥⑦ in area A, the expansion and contraction coefficient is calculated based on the actual distance and design distance of the target (the expansion and contraction coefficient is calculated based on the actual distance / design distance. The area in area A where the expansion and contraction coefficient falls will use the coefficient. Each grid has mechanical drill holes corresponding to different expansion and contraction coefficients.

[0053] In this embodiment, after the panel is divided into four partitions, the deformation value is theoretically reduced by 50% compared with the case without partitions. Figure 6 As shown, the deformation values ​​of a, b, c, d without four-partitioning are significantly greater than those of a', b', c', d' in four-partitioning (taking area A as an example), and the deformation value is theoretically reduced by 50%.

[0054] pass Figure 7-Figure 11It can be seen that in the deformation comparison of the L5 / 6 layer (referring to the typical stacking structure, L5 / 6 is the core layer, the L4 / 7 layer after the first lamination, the L3 / 8 layer after the second lamination, the L2 / 9 layer after the third lamination, and the L1 / 10 layer after the fourth lamination; each layer needs to be laser drilled and pattern exposed), the deformation value of the non-partitioned layer is about 2.0 mil, and the deformation value of the four-partitioned layer is about 0.5 mil, and the deformation is significantly reduced. In the deformation comparison of the L4 / 7 layer (the layer after the first lamination), the deformation value of the non-partitioned layer is about 4.0 mil, and the deformation value of the four-partitioned layer is about 1.5 mil, which is significantly reduced. In the deformation comparison of the L3 / 8 layer, the deformation value of the non-partitioned layer is about 4.0 mil, and the deformation value of the four-partitioned layer is about 1.5 mil, which is significantly reduced. In the deformation comparison of the L2 / 9 layer, the deformation value of the non-partitioned layer is about 4.0 mil, and the deformation value of the four-partitioned layer is about 1.5 mil, which is significantly reduced. In the L1 / 10 layer deformation comparison, the deformation value of the non-partitioned layer is about 4.5 mil, and the deformation value of the four-partitioned layer is about 1.5 mil, and the deformation is significantly reduced. The deformation of the four-partitioned layer is significantly reduced compared to the traditional non-partitioned layer, and the deformation value is reduced from about 4.5 mil to about 1.5 mil.

[0055] Among them, the analysis and comparison of each layer collapse are as follows:

[0056]

[0057] Table 1. Comparison of collapse analysis of each layer

[0058] According to Table 1, the cumulative hole collapse of each layer in the non-partitioned area is 20.7% (the sum of laser bottom pad collapse, graphic blind hole collapse, and graphic mechanical hole collapse), and the cumulative hole collapse ratio of the four-partitioned area is 0%. The hole collapse defects have been significantly reduced, and the product yield has been significantly improved.

[0059] In the partition alignment based on the multi-layer PCB of the present invention, the panel is divided into multiple partitions during PCB processing, and a corresponding target is set for each partition. When the panel is processed, each partition is processed according to the expansion and contraction coefficient of the target in each partition. The panel is partitioned and the expansion and contraction coefficients of different partitions are used for corresponding processing, which greatly reduces the influence of the expansion and contraction of the plate, thereby avoiding the deviation of the alignment, reducing the probability of the occurrence of the hole collapse, improving the yield of the product, and promoting the reduction of the production cost.

[0060] Based on the same inventive concept, the present invention also proposes a partition alignment device for a multi-layer PCB, see Fig.12 ,in, Fig.12 FIG. 1 is a structural diagram of an embodiment of a partition alignment device for a multi-layer PCB according to the present invention. Fig.12 The partition alignment device for a multi-layer PCB of the present invention is described in detail.

[0061] In this embodiment, the partition alignment device includes a processor and a memory. The processor is communicatively connected to the memory. The memory stores a computer program. The processor executes the partition alignment method based on the multi-layer PCB as described in the above embodiment through the computer program.

[0062] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0063] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A partition alignment method based on a multi-layer PCB, characterized in that: The partition alignment method based on a multi-layer PCB includes: S101: Divide the panel into partitions according to preset partition information, and obtain information of targets of each partition, wherein the targets include first targets corresponding to the four corners of the partition and second targets corresponding to the partition lines of the partition; the step of dividing the panel into partitions according to the preset partition information specifically includes: determining the partition lines of the panel according to the partition information, and dividing the panel into multiple partitions through the partition lines; the first targets include original targets and newly added targets, wherein the original targets are targets corresponding to the four corners of the panel, and the number of newly added targets is not less than the number of original targets; the newly added targets and the second targets do not overlap with the partition lines, and the distances to the adjacent partition lines are within a preset range; S102: Selecting the target according to the acquired processing information, and processing the partition by using the target and the expansion / contraction coefficient corresponding to the target, wherein the processing methods include laser drilling, pattern exposure and mechanical drilling; the step of selecting the target according to the acquired processing information specifically includes: determining the partition of the panel to be processed and the processing method of the partition according to the processing information, and selecting targets in the partition and adjacent partitions of the partition according to the processing method.

2. The partition alignment method based on a multi-layer PCB as claimed in claim 1, characterized in that: One partition is processed at a time.

3. The partition alignment method based on a multi-layer PCB as claimed in claim 1, characterized in that: The step of processing the partition by using the target and the expansion / contraction coefficient corresponding to the target comprises: Determine that the processing method is laser drilling, perform alignment through the first target corresponding to the partition, calculate the expansion and shrinkage coefficient according to the actual distance and the design distance of the first target, perform laser drilling on the partition based on the expansion and shrinkage coefficient, and use the expansion and shrinkage coefficient to process the alignment target used for graphic exposure.

4. The partition alignment method based on a multi-layer PCB as claimed in claim 1, characterized in that: The step of processing the partition by using the target and the expansion / contraction coefficient corresponding to the target comprises: Determine that the processing method is graphic exposure, obtain the alignment target corresponding to the graphic exposure for alignment, calculate the expansion and shrinkage coefficient according to the actual distance and the design distance of the alignment target, perform graphic exposure based on the expansion and shrinkage coefficient, and expose the alignment target for laser drilling according to the expansion and shrinkage coefficient.

5. The partition alignment method based on a multi-layer PCB as claimed in claim 1, characterized in that: The step of processing the partition by using the target and the expansion / contraction coefficient corresponding to the target comprises: The processing method is determined to be mechanical drilling, the expansion and contraction coefficients of different areas of the partition are determined according to the expansion and contraction coefficients of the first target corresponding to the partition, and the partition is mechanically drilled using the expansion and contraction coefficients and the second target corresponding to the mechanical drilling.

6. A partition alignment device for a multi-layer PCB, characterized in that: The partition alignment device includes a processor and a memory, the processor is communicatively connected to the memory, the memory stores a computer program, and the processor executes the partition alignment method based on a multi-layer PCB as described in any one of claims 1-5 through the computer program.

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