Electrostatic microporous ceramic vacuum chuck

Abstract

The utility model relates to the field of electrostatic chucks, in particular to an electrostatic microporous ceramic vacuum chuck. The technical problems that in the manufacturing process of a semiconductor chip, production equipment needs to frequently control an electrostatic microporous ceramic vacuum chuck to adsorb the semiconductor chip, but a ceramic material is fragile, cracks are likely to occur when the ceramic material is impacted or pressed, and the chuck is damaged are solved. According to the technical scheme, the electrostatic microporous ceramic vacuum chuck comprises an adsorption assembly, a supporting assembly and a uniform load distribution assembly. According to the utility model, through the arrangement of the double uniformly distributed load mechanisms and the damping and buffering mechanism, in the operation process of equipment, the stress at the upper end of the suction cup can be more uniform, meanwhile, the lower end of the suction cup is lifted by the stress more uniformly, and the suction cup is buffered and damped when the suction cup displaces, so that the probability of cracks of the suction cup is reduced.

Description

Technical Field

[0001] The utility model relates to the field of electrostatic chucks, in particular to an electrostatic microporous ceramic vacuum chuck. Background Art

[0002] In the manufacturing process of semiconductor chips, accurate handling and positioning are crucial. Traditional mechanical clamping methods may damage the chips, and the electrostatic adsorption microporous ceramic vacuum chuck is designed to solve this problem. It uses the combination of electrostatic adsorption and vacuum adsorption to achieve accurate and stable adsorption of semiconductor chips. This chuck has the advantages of simple structure, easy operation, strong adsorption force, etc., which can meet the high requirements of handling accuracy and stability in the manufacturing process of semiconductor chips. However, the ceramic material itself is relatively fragile and is prone to cracks when subjected to impact or pressure. Utility Model Content

[0003] In order to overcome the problem that during the manufacturing process of semiconductor chips, production equipment needs to frequently operate the electrostatic microporous ceramic vacuum chuck to adsorb semiconductor chips, but the ceramic material itself is relatively fragile and easily cracks when subjected to impact or pressure, causing damage to the chuck.

[0004] The technical solution of the utility model is: an electrostatic microporous ceramic vacuum suction cup, comprising an adsorption component, a support component, and a uniform load component; a support component for protecting the suction cup is arranged at the lower end of the adsorption component; a uniform load component for increasing the force-bearing area so that the suction cup is evenly stressed is fitted in the gap at the upper end of the support component.

[0005] Preferably, the adsorption component is used to adsorb the semiconductor chip, the support component is used to protect the suction cup to reduce the probability of cracks, and the uniform load distribution component is used to increase the force-bearing area so that the suction cup is evenly stressed.

[0006] Preferably, the adsorption assembly includes a suction cup body, a receiving cavity, a bevel chamfer, a first curved surface chamfer, an electrode sheet, a microporous structure, and a vacuum pump connection port; the suction cup body is provided with a receiving cavity; and the inner wall of the suction cup body is provided with a bevel chamfer. The bevel chamfer is used to make the force distribution inside the suction cup more uniform after the suction cup is subjected to pressure.

[0007] Preferably, the outer wall of the suction cup body is provided with a first curved chamfer; an electrode sheet is fixedly connected in the accommodating cavity; a microporous structure is provided at the lower end of the suction cup body; and a vacuum pump connection port is provided at the upper end of the suction cup body. The vacuum pump is connected to the accommodating cavity through a connecting pipe that penetrates the mounting plate and the connecting cover and is connected to the vacuum pump connection port, so as to form a negative pressure in the accommodating cavity, so that the lower end of the microporous structure forms a suction force, and the electrode sheet forms static electricity in the microporous structure to form an additional suction force, so as to adsorb the semiconductor chip.

[0008] Preferably, the support assembly includes a support ring, a second curved chamfer, and a curved cushion; the support ring is provided at the lower end of the suction cup body; the second curved chamfer is provided inside the support ring; the curved cushion is attached to the second curved chamfer; the lower end surface of the support ring is higher than the bottom surface of the suction cup body. The support ring is used to support the suction cup body, and the first curved chamfer and the second curved chamfer are used to increase the support area of ​​the support ring on the suction cup body, and the curved cushion protects the contact part between the support ring and the suction cup body, so that the force on the lower end of the suction cup body is evenly applied.

[0009] Preferably, the uniformly distributed load assembly includes a mounting plate, a receiving groove, a second soft pad, a uniform distribution ring, a shock absorber, a limit ring, a docking block, a connecting cover, and a slide groove; the mounting plate is fitted in the gap at the upper end of the support ring; a receiving groove is provided at the lower end of the mounting plate; and a second soft pad is fixedly connected in the receiving groove.

[0010] Preferably, a uniform distribution ring is fixedly connected to the upper end of the mounting plate; a shock absorber is fixedly connected to the upper end of the uniform distribution ring; and a limit ring is fixedly connected to the shock absorber.

[0011] Preferably, a docking block is fixedly connected to the upper end of the shock absorber; a connecting cover is fixedly connected to the mounting plate; and a slide groove is provided on the connecting cover. The suction cup is mounted on the production equipment through the docking block. When the suction cup moves, the shock absorber can absorb part of the impact force, reduce the force directly acting on the suction cup body, and evenly distribute the force on the mounting plate by the uniform distribution ring, and then cooperate with the second soft pad to make the force on the upper end of the suction cup body uniform.

[0012] Beneficial effects of the utility model:

[0013] 1. By setting up a double uniform load distribution mechanism and a shock-absorbing buffer mechanism, the upper end of the suction cup can be more evenly stressed during operation, while the lower end of the suction cup can also be lifted more evenly. The suction cup can also be buffered and damped when it moves, so as to reduce the probability of cracks in the suction cup.

[0014] 2. The suction cup body is supported by the support ring, and the first curved surface chamfer and the second curved surface chamfer are used to increase the support area of ​​the support ring on the suction cup body, and the contact part between the support ring and the suction cup body is protected by the curved soft pad, so that the force on the lower end of the suction cup body is more uniform, and the bevel chamfer can make the force distribution inside the suction cup more uniform after the suction cup is under pressure;

[0015] 3. Install the suction cup on the production equipment through the docking block. When the suction cup moves, the shock absorber can absorb part of the impact force, reduce the force directly acting on the suction cup body, and evenly distribute the force on the mounting plate by the uniform distribution ring. The second soft pad is then used to make the force on the upper end of the suction cup body uniform, so as to reduce the probability of cracks in the suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 What is shown is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 What is shown is a schematic diagram of the electrode sheet structure of the utility model;

[0018] Figure 3 Shown is a schematic diagram of the suction cup body structure of the utility model;

[0019] Figure 4 Shown is a schematic diagram of the installation disk structure of the utility model;

[0020] Figure 5 What is shown is a schematic diagram of the structure of the shock absorber of the utility model;

[0021] Figure 6 What is shown is a schematic diagram of the uniformly distributed ring structure of the utility model;

[0022] Figure 7 Shown is a schematic diagram of the connection cover structure of the utility model;

[0023] Figure 8 What is shown is a schematic diagram of the docking block structure of the present utility model.

[0024] Explanation of the reference numerals: 1. adsorption assembly; 2. support assembly; 3. uniform load distribution assembly; 101. suction cup body; 102. accommodating chamber; 103. bevel chamfer; 104. first curved surface chamfer; 105. electrode sheet; 106. microporous structure; 107. vacuum pump connection port; 201. support ring; 202. second curved surface chamfer; 203. curved cushion; 301. mounting plate; 302. accommodating groove; 303. second cushion; 304. uniform distribution ring; 305. shock absorber; 306. limiting ring; 307. docking block; 308. connecting cover; 309. slide groove. DETAILED DESCRIPTION

[0025] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0026] See also Figure 1-3The utility model provides an embodiment: an electrostatic microporous ceramic vacuum suction cup, comprising an adsorption component 1, a support component 2, and a uniform load component 3; the lower end of the adsorption component 1 is provided with a support component 2 for protecting the suction cup; the upper end of the support component 2 is gap-matched with a uniform load component 3 for increasing the force-bearing area to make the suction cup evenly stressed. The adsorption component 1 is used to adsorb semiconductor chips, the support component 2 is used to protect the suction cup to reduce the probability of cracks, and the uniform load component 3 is used to increase the force-bearing area to make the suction cup evenly stressed. The adsorption component 1 includes a suction cup body 101, a receiving cavity 102, a bevel chamfer 103, a first curved surface chamfer 104, an electrode sheet 105, a microporous structure 106, and a vacuum pump connection port 107; the suction cup body 101 is provided with a receiving cavity 102; the inner wall of the suction cup body 101 is provided with a bevel chamfer 103. The bevel chamfer 103 is used to make the force distribution inside the suction cup more uniform after the suction cup is subjected to pressure. The outer wall of the suction cup body 101 is provided with a first curved chamfer 104; an electrode sheet 105 is fixedly connected to the accommodating cavity 102; a microporous structure 106 is provided at the lower end of the suction cup body 101; and a vacuum pump connection port 107 is provided at the upper end of the suction cup body 101. The vacuum pump is connected to the accommodating cavity 102 through a connecting pipe that penetrates the mounting plate 301 and the connecting cover 308 and is connected to the vacuum pump connection port 107, so as to form a negative pressure in the accommodating cavity 102, so that the lower end of the microporous structure 106 forms a suction force, and the electrode sheet 105 forms static electricity in the microporous structure 106 to form an additional suction force to adsorb the semiconductor chip. The support assembly 2 includes a support ring 201, a second curved chamfer 202, and a curved cushion 203; the support ring 201 is provided at the lower end of the suction cup body 101; the second curved chamfer 202 is provided inside the support ring 201; the curved cushion 203 is pasted on the second curved chamfer 202; the lower end surface of the support ring 201 is higher than the bottom surface of the suction cup body 101. The support ring 201 is used to support the suction cup body 101, and the first curved chamfer 104 and the second curved chamfer 202 are used to increase the support area of ​​the support ring 201 on the suction cup body 101, and the curved cushion 203 protects the contact part between the support ring 201 and the suction cup body 101, so that the force on the lower end of the suction cup body 101 is evenly applied.

[0027] See also Figure 4-8In this embodiment, the uniform load distribution assembly 3 includes a mounting plate 301, a receiving groove 302, a second cushion 303, a uniform distribution ring 304, a shock absorber 305, a limiting ring 306, a docking block 307, a connecting cover 308, and a sliding groove 309; the upper end of the supporting ring 201 is fitted with the mounting plate 301; the lower end of the mounting plate 301 is provided with a receiving groove 302; the second cushion 303 is fixedly connected in the receiving groove 302. The upper end of the mounting plate 301 is fixedly connected with the uniform distribution ring 304; the upper end of the uniform distribution ring 304 is fixedly connected with the shock absorber 305; the limiting ring 306 is fixedly connected to the shock absorber 305. The upper end of the shock absorber 305 is fixedly connected with the docking block 307; the mounting plate 301 is fixedly connected with the connecting cover 308; the connecting cover 308 is provided with a sliding groove 309. The suction cup is installed on the production equipment through the docking block 307. When the suction cup is displaced, the shock absorber 305 can absorb part of the impact force, reduce the force directly acting on the suction cup body 101, and the uniform distribution ring 304 evenly distributes the force on the installation plate 301, and then cooperates with the second soft pad 303 to make the force on the upper end of the suction cup body 101 uniform.

[0028] During operation, the suction cup is mounted on the production equipment through the docking block 307. When the suction cup moves, the shock absorber 305 can absorb part of the impact force, reduce the force directly acting on the suction cup body 101, and the uniform distribution ring 304 evenly distributes the force on the mounting plate 301. The second soft pad 303 is then used to make the force on the upper end of the suction cup body 101 uniform, so as to reduce the probability of cracks in the suction cup.

[0029] At the same time, the support ring 201 supports the suction cup body 101, and increases the support area of ​​the support ring 201 on the suction cup body 101 through the first curved chamfer 104 and the second curved chamfer 202, and the curved soft pad 203 protects the contact part between the support ring 201 and the suction cup body 101, so that the force on the lower end of the suction cup body 101 is more uniform, and the bevel chamfer 103 can make the force distribution inside the suction cup more uniform after the suction cup is subjected to pressure;

[0030] When adsorbing the semiconductor chip, the vacuum pump is connected to the accommodating chamber 102 through a connecting tube that passes through the mounting plate 301 and the connecting cover 308 and is connected to the vacuum pump connecting port 107, so as to form a negative pressure in the accommodating chamber 102, so that suction is formed at the lower end of the microporous structure 106, and static electricity is formed by the electrode sheet 105 in the microporous structure 106 to form additional suction to adsorb the semiconductor chip.

[0031] Through the above steps, a double uniform load distribution mechanism and a shock-absorbing and buffering mechanism are set up, so that during the operation of the equipment, the force on the upper end of the suction cup can be more evenly applied, and at the same time, the lower end of the suction cup can also be supported with a more even force, and the suction cup can be buffered and shock-absorbed when it moves, so as to reduce the probability of cracks in the suction cup.

[0032] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. An electrostatic microporous ceramic vacuum chuck, comprising an adsorption component (1); characterized in that: The invention also comprises a support component (2) and a uniform load component (3); the lower end of the adsorption component (1) is provided with a support component (2) for protecting the suction cup; the upper end of the support component (2) is gap-matched with a uniform load component (3) for increasing the force-bearing area so that the object is subjected to uniform force; the adsorption component (1) comprises a suction cup body (101), a receiving cavity (102), a bevel chamfer (103), a first curved surface chamfer (104), an electrode sheet (105), a microporous structure (106), and a vacuum pump connection port (107); the suction cup body (101) is provided with a receiving cavity (102); the inner wall of the suction cup body (101) is provided with a bevel chamfer (103); the outer wall of the suction cup body (101) is provided with a first curved surface chamfer (104); the electrode sheet (105) is fixedly connected to the receiving cavity (102); the lower end of the suction cup body (101) is provided with a microporous structure (106); the upper end of the suction cup body (101) is provided with a vacuum pump connection port (107); The support assembly (2) comprises a support ring (201), a second curved chamfer (202), and a curved cushion (203); the support ring (201) is disposed at the lower end of the suction cup body (101); the second curved chamfer (202) is provided on the inner side of the support ring (201); the curved cushion (203) is adhered to the second curved chamfer (202); the lower end surface of the support ring (201) is higher than the bottom surface of the suction cup body (101); the load distribution assembly (3) The invention comprises a mounting plate (301), a receiving groove (302), a second soft pad (303), a uniform distribution ring (304), a shock absorber (305), a limit ring (306), a docking block (307), a connecting cover (308), and a sliding groove (309); the mounting plate (301) is fitted in a clearance at the upper end of the supporting ring (201); a receiving groove (302) is provided at the lower end of the mounting plate (301); and the second soft pad (303) is fixedly connected in the receiving groove (302).

2. The electrostatic microporous ceramic vacuum chuck according to claim 1, characterized in that: A uniform distribution ring (304) is fixedly connected to the upper end of the mounting plate (301); a shock absorber (305) is fixedly connected to the upper end of the uniform distribution ring (304); and a limiting ring (306) is fixedly connected to the shock absorber (305).

3. The electrostatic microporous ceramic vacuum chuck according to claim 2, characterized in that: A docking block (307) is fixedly connected to the upper end of the shock absorber (305); a connecting cover (308) is fixedly connected to the mounting plate (301); and a sliding groove (309) is provided on the connecting cover (308).

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