Radiator and air conditioner

Abstract

The present invention provides a radiator and an air conditioner, wherein the radiator comprises a water inlet plate and a water outlet plate; the water inlet plate has a mounting surface, a water inlet channel is formed inside the water inlet plate, and the water inlet channel is used to connect to an external water source; a water outlet channel is formed inside the water outlet plate, the water outlet plate is arranged on one side of the water inlet plate adjacent to the mounting surface, and is arranged in a stepped manner along a direction perpendicular to the mounting surface with the water inlet plate, and a heat dissipation space is formed between the water outlet plate and the mounting surface; wherein the water outlet channel is connected to the water inlet channel, and the water outlet channel is used to connect to the outside world.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioners, and in particular to a radiator and an air conditioner. Background Art

[0002] For high-energy air conditioners under special working conditions, it is more difficult to effectively dissipate heat from the outdoor unit. Especially when the ambient temperature is high or the equipment is running at full load for a long time, the heat dissipation requirements of the computer board are higher. In order to enable the computer board to operate efficiently for a long time, the design of the heat sink is crucial. In the existing technology, most of them use aluminum or copper heat sinks, which are directly attached to the computer board to achieve the heat dissipation of the computer board. However, the heat dissipation effect of this heat sink is not good. If you want to achieve the best heat dissipation effect, the heat sink needs to be made larger, thereby occupying a large amount of internal space; and in the box environment of the air conditioner outdoor unit, the heat dissipation of the heat sink is slow, resulting in low heat dissipation efficiency. Summary of the invention

[0003] The present invention provides a radiator and an air conditioner, which are used to solve the defect of poor heat dissipation effect of the heat sink in the prior art and realize efficient heat dissipation of a computer board of the air conditioner.

[0004] The present invention provides a radiator, comprising:

[0005] A water inlet plate having a mounting surface, wherein a water inlet channel is formed in the water inlet plate, and the water inlet channel is used to connect to an external water source; and

[0006] A water outlet plate, with a water outlet channel formed therein, the water outlet plate is arranged on one side of the water inlet plate adjacent to the mounting surface, and is arranged in a stepped manner with the water inlet plate in a direction perpendicular to the mounting surface, so that a heat dissipation space is formed between the water outlet plate and the mounting surface;

[0007] Wherein, the water outlet channel is connected to the water inlet channel, and the water outlet channel is used to connect to the outside.

[0008] According to a radiator provided by the present invention, the water inlet channel comprises a plurality of water inlet channels arranged at intervals from each other, and the plurality of adjacent water inlet channels are interconnected; or,

[0009] The water inlet channel includes a plurality of water inlet grids spaced apart from each other, and the plurality of water inlet grids adjacent to each other are interconnected.

[0010] According to a radiator provided by the present invention, the water outlet channel comprises a plurality of water outlet waterways arranged at intervals from each other, and the plurality of water outlet waterways arranged adjacent to each other are interconnected; or,

[0011] The water outlet channel includes a plurality of water outlet grids that are spaced apart from each other, and the plurality of water outlet grids that are adjacent to each other are interconnected.

[0012] According to a radiator provided by the present invention, the water outlet plate is arranged on the mounting surface, and an overlapping area is formed between the water outlet plate and the water inlet plate;

[0013] The water inlet channel and the water outlet channel both extend into the overlapping area. Corresponding to the overlapping area, a water outlet connected to the water outlet channel is provided on the inner side wall of the water inlet channel so that the water outlet channel is connected to the water inlet channel.

[0014] According to a radiator provided by the present invention, a water inlet connected to the water inlet channel is formed on the side wall of the water inlet plate, and the water inlet is used to connect to an external water source;

[0015] A water outlet connected to the water outlet channel is formed on the side wall surface of the water outlet plate facing away from the water inlet, and the water outlet is used to connect to the outside.

[0016] According to a radiator provided by the present invention, a water inlet connected to the water inlet channel is provided on the water inlet plate, and a plurality of water inlets are provided; and / or,

[0017] The water outlet plate is provided with a water outlet connected to the water outlet channel, and a plurality of water outlets are provided.

[0018] According to a radiator provided by the present invention, a plurality of first radiating fins are arranged on the end surface of the water inlet plate facing away from the mounting surface; and / or,

[0019] One end of the water outlet plate is arranged on the installation surface, and the other end is extended in a direction away from the heat dissipation space to form a step surface facing the water inlet plate, and a plurality of second heat dissipation fins are arranged on the step surface.

[0020] According to a radiator provided by the present invention, the material of the water inlet plate and the water outlet plate includes any one of pure copper material, copper alloy material or aluminum alloy material.

[0021] The present invention also provides an air conditioner, comprising:

[0022] A radiator, wherein the radiator is a radiator according to any one of the above items; and

[0023] The computer control board is installed in the heat dissipation space.

[0024] According to an air conditioner provided by the present invention, the air conditioner further comprises a condensate water pipe, wherein the condensate water pipe is connected to the water inlet channel.

[0025] In the radiator provided by the present invention, the heat dissipation space is formed between the water inlet plate and the water outlet plate, the computer control board is placed in the heat dissipation space, water is provided to the water inlet channel, and poured into the water outlet channel, and discharged from the water outlet plate, and the heat on the water inlet plate is taken away with the water flow, so that the heat dissipation efficiency of the radiator can be improved without additionally increasing the area of ​​the radiator; in addition, the water inlet plate and the water outlet plate are arranged in layers, which effectively absorbs the temperature in the heat dissipation space and reduces the ambient temperature of the computer control board, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 is a schematic diagram of the three-dimensional structure of an embodiment of a radiator provided by the present invention;

[0028] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of the middle radiator from another angle;

[0029] Figure 3 yes Figure 1 A schematic diagram of a cross-sectional structure of a middle radiator viewed from above;

[0030] Figure 4 yes Figure 1 A schematic diagram of a top view and a cross-sectional three-dimensional structure of a middle radiator;

[0031] Figure 5 yes Figure 1 Schematic diagram of the front cross-sectional structure of the radiator.

[0032] Reference numerals:

[0033] 100. radiator; 1. water inlet plate; 11. mounting surface; 12. water inlet channel; 13. water inlet; 14. first heat sink; 2. water outlet plate; 21. water outlet; 22. second heat sink; 3. water outlet. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] For high-energy air conditioners under special working conditions, it is more difficult to effectively dissipate heat from the outdoor unit. Especially when the ambient temperature is high or the equipment is running at full load for a long time, the heat dissipation requirements of the computer board are higher. In order to enable the computer board to operate efficiently for a long time, the design of the heat sink is crucial. In the existing technology, most of them use aluminum or copper heat sinks, which are directly attached to the computer board to achieve the heat dissipation of the computer board. However, the heat dissipation effect of this heat sink is not good. If you want to achieve the best heat dissipation effect, the heat sink needs to be made larger, thereby occupying a large amount of internal space; and in the box environment of the air conditioner outdoor unit, the heat dissipation of the heat sink is slow, resulting in low heat dissipation efficiency.

[0036] The present invention provides a radiator and an air conditioner, which are used to solve the defect of poor heat dissipation effect of the heat sink in the prior art and realize efficient heat dissipation of a computer board of the air conditioner.

[0037] Combine the following Figures 1 to 5 The heat sink provided by the present invention is described.

[0038] See also Figure 1 to Figure 2 The present invention provides a radiator 100, comprising a water inlet plate 1 and a water outlet plate 2; the water inlet plate 1 has a mounting surface 11, a water inlet channel is formed in the water inlet plate 1, and the water inlet channel is used to connect to an external water source; the water outlet plate 2 has a water outlet channel formed in it, the water outlet plate 2 is arranged on one side of the water inlet plate 1 adjacent to the mounting surface 11, and is arranged in a stepped manner along a direction perpendicular to the mounting surface with the water inlet plate 1, and a heat dissipation space is formed between the water outlet plate 2 and the mounting surface 11; wherein the water outlet channel is connected to the water inlet channel, and the water outlet channel is used to connect to the outside.

[0039] In the radiator 100 provided by the present invention, the heat dissipation space is formed between the water inlet plate 1 and the water outlet plate 2, and the computer control board is placed in the heat dissipation space, and water is provided to the water inlet channel, and poured into the water outlet channel, and discharged from the water outlet plate 2, so that the heat on the water inlet plate 1 is taken away with the water flow, and the heat dissipation efficiency of the radiator can be improved without additionally increasing the area of ​​the radiator; in addition, the water inlet plate 1 and the water outlet plate 2 are arranged in layers, which effectively absorbs the temperature in the heat dissipation space and reduces the ambient temperature of the computer control board, thereby improving the heat dissipation efficiency.

[0040] It should be noted that the water outlet plate 2 is located on the side of the water inlet plate 1 adjacent to the mounting surface, and there are various positional connection relationships between the water outlet plate 2 and the water inlet plate 1, for example, the water outlet plate 2 and the mounting surface 11 are spaced apart; in the present embodiment, the water outlet plate 2 is installed on the mounting surface 11 to form a whole with the water inlet plate 1 to facilitate subsequent installation and setting.

[0041] Furthermore, the water inlet channel can be arranged in a variety of ways, as long as it can accommodate water flow, please refer to Figure 3 to Figure 4 In one embodiment of the present invention, the water inlet channel includes a plurality of water inlet channels 12 arranged at intervals from each other, and the plurality of adjacent water inlet channels 12 are interconnected. By providing the plurality of water inlet channels 12, the flow time and flow distance of the fluid passing through the water inlet channel are increased, and the heat exchange between the water inlet plate 1 and the heat in the heat dissipation space is fully performed, thereby improving the heat exchange efficiency.

[0042] It should be noted that there are various ways to set the water inlet waterway 12, for example, multiple water inlet waterways 12 are set in parallel, and two adjacent water inlet waterways are connected; or multiple water inlet waterways 12 are staggered to form a network waterway structure.

[0043] Furthermore, the plurality of water inlet channels 12 form a first heat absorption layer, and the first heat absorption layer is provided in plurality, the plurality of the first heat absorption layers are arranged at intervals, and the plurality of the first heat absorption layers are arranged to be interconnected.

[0044] In addition, in another embodiment provided by the present invention, the water inlet channel includes a plurality of water inlet grids arranged at intervals from each other, and the plurality of adjacent water inlet grids are interconnected. By arranging the water inlet grids, the water inlet channel forms a honeycomb structure to improve the heat exchange efficiency; it should be noted that each of the water inlet grids has a containing cavity formed therein to contain water flow.

[0045] Similarly, the arrangement of the water outlet channel also has multiple implementations. In one embodiment provided by the present invention, the water outlet channel includes a plurality of water outlet waterways arranged at intervals from each other, and the plurality of adjacent water outlet waterways are interconnected. The water outlet channel is formed by the water outlet waterways, and the flow time and flow distance of the fluid passing through the water outlet channel are increased to improve the heat exchange efficiency.

[0046] It should be noted that there are also various ways to set the water outlet waterway, for example, multiple water outlet waterways are set in parallel, and two adjacent water outlet waterways are connected; or multiple water outlet waterways are staggered to form a network waterway structure.

[0047] Furthermore, the plurality of water outlet channels form a second heat absorption layer, and the second heat absorption layer is provided in plurality, the plurality of the second heat absorption layers are arranged at intervals, and the plurality of the second heat absorption layers are arranged to be interconnected.

[0048] In another embodiment provided by the present invention, the water outlet channel includes a plurality of water outlet grids arranged at intervals from each other, and the plurality of adjacent water outlet grids are interconnected. By arranging the water outlet grids, the water outlet channel forms a honeycomb structure to improve heat exchange efficiency.

[0049] On the other hand, there are many implementations for connecting the water outlet channel to the water inlet channel. For example, a connecting pipe is provided between the water inlet plate 1 and the water outlet plate 2, and the two ends of the connecting pipe are connected to the water inlet channel and the water outlet channel respectively; for details, please refer to Figure 5 In this embodiment, the water outlet plate 2 is arranged on the mounting surface 11, and an overlap area is formed between the water outlet plate 2 and the water inlet plate 1; the water inlet channel and the water outlet channel both extend into the overlap area, and corresponding to the overlap area, a water port 3 connected to the water outlet channel is provided on the inner side wall of the water inlet channel, so that the water outlet channel is connected to the water inlet channel. No additional connecting parts are required, and after the water passes through the water inlet channel, it naturally flows into the water outlet channel, which facilitates the liquid flow between the water inlet plate 1 and the water outlet plate 2, saving space.

[0050] In order to further improve the heat exchange efficiency, a water inlet 13 connected to the water inlet channel is formed on the side wall of the water inlet plate 1, and the water inlet 13 is used to connect to an external water source; a water outlet 21 connected to the water outlet channel is formed on the side wall of the water outlet plate 2 facing away from the water inlet, and the water outlet 21 is used to connect to the outside world. The water inlet 13 and the water outlet 21 are arranged at both ends of the liquid passage, so that the liquid can fully absorb heat between the water inlet plate 1 and the water outlet plate 2, thereby improving the heat absorption efficiency.

[0051] In addition, the water inlet plate 1 is provided with a water inlet 13 connected to the water inlet channel, and a plurality of the water inlets 13 are provided. The plurality of water inlets 13 enable the water inlet plate 1 to form multiple inlets for simultaneous water inlet, thereby increasing the internal liquid flow rate and facilitating heat exchange.

[0052] Similarly, the water outlet plate 2 is provided with a water outlet 21 connected to the water outlet channel, and a plurality of water outlets 21 are provided.

[0053] It should be noted that, in the technical features of the quantity setting of the water inlet 13 and the water outlet 21, one of them may exist or both of them may exist. The present invention does not limit the specific quantity of the water inlet 13 and the water outlet 21. In the embodiment provided by the invention, a plurality of the water inlet 13 and the water outlet 21 are provided.

[0054] In order to further improve the heat dissipation efficiency of the radiator 100, in this embodiment, a plurality of first heat dissipation fins 14 are arranged on the end surface of the water inlet plate 1 facing away from the mounting surface. The heat on the water inlet plate 1 that is not carried away by the liquid is dissipated into the air through the first heat dissipation fins 14.

[0055] Similarly, one end of the water outlet plate 2 is arranged on the mounting surface 11, and the other end is extended in the direction away from the heat dissipation space to form a step surface facing the water inlet plate 1, and a plurality of second heat dissipation fins 22 are arranged on the step surface. The water outlet plate 2 extends away from the heat dissipation space to increase the heat dissipation area, and at the same time, the second heat dissipation fins 22 are arranged to dissipate the heat on the water outlet plate 2 that is not brought by the liquid into the air through the second heat dissipation plate 22.

[0056] It should be noted that the first heat sink 14 and the second heat sink 22 can be provided either alone or simultaneously. The present invention does not impose any specific limitation thereto. In this embodiment, the technical effect brought about by the simultaneous presence of the two is better.

[0057] In addition, it should be noted that a plurality of third heat sinks may be provided on the side wall surface of the water inlet plate 1; or a plurality of third heat sinks may be provided on the end surface of the water outlet plate 2 facing away from the mounting surface; or a plurality of third heat sinks may be provided on the side wall surface of the water outlet plate 2 facing away from the heat dissipation space. No specific limitation is made here.

[0058] In the embodiment provided by the present invention, the material of the water inlet plate 1 and the water outlet plate 2 includes any one of pure copper, copper alloy or aluminum alloy. Pure copper has a relatively better heat dissipation effect, but the cost is relatively high; aluminum alloy can be extruded and industrialized for mass production; copper alloy has a better comprehensive heat dissipation effect. The present invention does not impose specific restrictions on the material of the water inlet plate 1 and the water outlet plate 2, and the material is selected according to the actual production requirements.

[0059] Based on the above, the present invention provides a specific embodiment.

[0060] In this embodiment, the radiator 100 includes a water inlet plate 1 and a water outlet plate 2 .

[0061] The water inlet plate 1 has a mounting surface 11, and a plurality of water inlet channels 12 arranged at intervals are formed in the water inlet plate 1. The plurality of water inlet channels 12 are interconnected to form the water inlet channel. A plurality of water inlets 13 are penetrated on the side wall surface of the water inlet plate 1, and a plurality of the first heat sinks 14 are arranged on the end surface of the water inlet plate 1 facing away from the mounting surface 11.

[0062] One end of the water outlet plate 2 is installed on the water inlet plate 1 and is located on one side of the installation surface 11 of the water inlet plate 1. An overlapping area is formed between the water inlet plate 1 and the water inlet plate 1 is stepped. A heat dissipation space is formed between the side wall surface of the water outlet plate 2 and the installation surface 11; the other end of the water outlet plate 2 is extended in a direction away from the heat dissipation space to form a step surface facing the water inlet plate 1, and a plurality of second heat sinks 22 are arranged on the step surface; a plurality of water outlet waterways are formed in the water outlet plate 2 at intervals, and the plurality of water outlet waterways are interconnected; a plurality of water outlets are penetrated on the side wall surface of the water outlet plate 2 away from the water inlet 13.

[0063] The outlet waterway extends into the overlapping area, and the inlet waterway 12 also extends into the overlapping area. A water outlet 3 connected to the inlet waterway 12 is provided on the inner wall of the outlet waterway.

[0064] The water inlet plate 1 , the water outlet plate 2 , the first heat sink 14 , and the second heat sink 22 are all made of aluminum alloy.

[0065] The present invention further provides an air conditioner, which includes the above-mentioned radiator 100 and has all the technical features of the above-mentioned radiator 100. Therefore, it also has all the technical effects brought by all the above-mentioned technical features, which will not be described one by one here.

[0066] The present invention provides an air conditioner, comprising a radiator 100 and a computer control board; the computer control board is installed in the heat dissipation space so as to dissipate heat from the computer control board through the radiator 100.

[0067] Furthermore, the air conditioner further comprises a condensed water pipe, wherein the condensed water pipe is connected to the water inlet channel. While the condensed water discharges heat to the radiator, the heat of the radiator also promotes the evaporation of the condensed water, reduces the discharge of the condensed water, and forms an energy cycle in a large environment.

[0068] It should be noted that the condensate water pipe can be directly connected to the water inlet channel to allow water to flow naturally into the water inlet channel. However, when the height difference between the position of the radiator 100 and the condensate water pipe is not large, in order to facilitate the condensate water to enter the water inlet channel, the air conditioner may further include a water drive pump body to drive the condensate water to flow into the water inlet channel.

[0069] In a specific embodiment provided by the present invention, the air conditioner includes an air conditioner outdoor unit, an installation space is formed in the air conditioner outdoor unit, the radiator 100 is installed in the installation space, and the computer control board is installed in the heat dissipation space; the air conditioner also includes a condensate water pipe, and the condensate water pipe is directly connected to the water inlet 13 of the radiator 100, and the water outlet 21 of the radiator 100 is directly connected to an external water collection device, or directly discharged, and no specific limitation is made here.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A radiator, characterized in that: include: A water inlet plate having a mounting surface, wherein a water inlet channel is formed in the water inlet plate, and the water inlet channel is used to connect to an external water source; as well as, A water outlet plate, with a water outlet channel formed therein, the water outlet plate is arranged on one side of the water inlet plate adjacent to the mounting surface, and is arranged in a stepped manner with the water inlet plate in a direction perpendicular to the mounting surface, so that a heat dissipation space is formed between the water outlet plate and the mounting surface; Wherein, the water outlet channel is connected to the water inlet channel, and the water outlet channel is used to connect to the outside; The water outlet plate is arranged on the mounting surface, and an overlapping area is formed between the water outlet plate and the water inlet plate; The water inlet channel and the water outlet channel both extend into the overlapping area. Corresponding to the overlapping area, a water outlet connected to the water outlet channel is provided on the inner side wall of the water inlet channel so that the water outlet channel is connected to the water inlet channel.

2. The heat sink according to claim 1, characterized in that: The water inlet channel comprises a plurality of water inlet channels which are arranged at intervals from each other, and the plurality of adjacent water inlet channels are connected to each other; or The water inlet channel includes a plurality of water inlet grids spaced apart from each other, and the plurality of water inlet grids adjacent to each other are interconnected.

3. The heat sink according to claim 1, characterized in that: The water outlet channel includes a plurality of water outlet waterways arranged at intervals from each other, and the plurality of water outlet waterways arranged adjacent to each other are interconnected; or The water outlet channel includes a plurality of water outlet grids that are spaced apart from each other, and the plurality of water outlet grids that are adjacent to each other are interconnected.

4. The heat sink according to claim 1, characterized in that: A water inlet connected to the water inlet channel is formed on the side wall of the water inlet plate, and the water inlet is used to connect to an external water source; A water outlet connected to the water outlet channel is formed on the side wall surface of the water outlet plate facing away from the water inlet, and the water outlet is used to connect to the outside.

5. The heat sink according to claim 1, characterized in that The water inlet plate is provided with a water inlet connected to the water inlet channel, and a plurality of water inlets are provided; and / or, The water outlet plate is provided with a water outlet connected to the water outlet channel, and a plurality of water outlets are provided.

6. The heat sink according to claim 1, characterized in that A plurality of first heat sinks are arranged on the end surface of the water inlet plate facing away from the mounting surface; and / or, One end of the water outlet plate is arranged on the installation surface, and the other end is extended in a direction away from the heat dissipation space to form a step surface facing the water inlet plate, and a plurality of second heat dissipation fins are arranged on the step surface.

7. The heat sink according to claim 1, characterized in that: The material of the water inlet plate and the water outlet plate includes any one of pure copper material, copper alloy material or aluminum alloy material.

8. An air conditioner, characterized in that: include: A radiator, wherein the radiator is a radiator according to any one of claims 1 to 7; as well as, The computer control board is installed in the heat dissipation space.

9. The air conditioner according to claim 8, characterized in that: The air conditioner further comprises a condensed water pipe, wherein the condensed water pipe is connected to the water inlet channel.

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