A wafer-level optical composite filter imprinting process

Abstract

The invention discloses a wafer-level optical composite filter imprinting process. The wafer-level optical composite filter imprinting process of the invention adopts a process of coating the upper and lower surfaces of a glass substrate and cutting them into monomers combined with a glue injection mold for glue injection molding. The process steps are simple, the process cost is low, and the overall thickness of the manufactured composite filter is thin and the size is small, which provides more installation space for the assembly of downstream devices and improves the reliability of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of optical composite filter manufacturing, and in particular to a wafer-level optical composite filter imprinting process, which can be widely used in photoelectric sensor devices of smart phones, wearable devices or equipment. Background Art

[0002] In recent years, with the advancement of thin film coating technology and the reduction of costs, the application of optical coated composite filters has become more and more extensive. The traditional packaging method of thin film coated glass substrates is the WLO packaging process, which is to layer the glass substrate with thin film layer (Optical Coating Substrate), the baffle wafer (Baffle Wafer), and the spacer wafer (Spacer Wafer) and then use wafer bonding (Wafer Bonding) to stack the three layers. The products made by this process are larger in size and thicker in thickness; the minimum thickness is 400 microns. The production process is longer and the productivity is lower.

[0003] Therefore, the present invention designs a wafer-level optical composite filter imprinting process, which can overcome the size limitations and process complexity problems of the prior art and improve product reliability. Summary of the invention

[0004] In order to solve the above technical problems, the present invention designs a wafer-level optical composite filter imprinting process.

[0005] The present invention adopts the following technical solution:

[0006] A wafer-level optical composite filter imprinting process, the process steps of which are:

[0007] S1, polishing the upper and lower surfaces of the optical flat glass and cutting it into single pieces according to the required size to form a glass substrate;

[0008] S2. A thin film coating is coated on one side of the glass substrate at intervals according to the size, and a coating layer with a pattern is produced on the surface of the glass substrate by combining a photolithography or silk screen printing process;

[0009] S3. According to the requirements of the optical performance of the product, a thin film coating or a screen-printed epoxy resin adhesive layer with light diffusion properties can be coated on the other side of the glass substrate;

[0010] S4, using a fully automatic wafer cutting machine to cut the glass substrate with thin film coatings on both sides into monomers;

[0011] S5. Prepare a mold and use a fully automatic transplanting machine to transplant the monomer with film coating on both sides into the mold. The outer edge of the monomer in the mold is provided with interconnected glue injection areas. After transplanting, the mold is assembled together;

[0012] S6. Use an automatic embossing glue injection machine to inject black glue liquid into the assembled mold through the glue injection hole, and use ultraviolet light combined with high-temperature baking to cure the black glue liquid to form a shielding layer and a separation layer of the wafer after packaging;

[0013] S7. Demolding the packaged wafer from the mold to form an optical imprinted composite filter.

[0014] Preferably, in steps S2 and S3, the method of coating a thin film coating is evaporation coating or sputtering coating.

[0015] Preferably, the mold includes an upper mold and a lower mold, and the upper mold and the lower mold are respectively provided with a glue injection area, the glue injection area is connected to a glue injection hole, and the glue injection area is respectively provided with multiple rows of upper bosses and lower bosses, and a monomer with a double-sided thin film coating is placed between the upper bosses and the lower bosses.

[0016] Preferably, the upper mold consists of an upper film bottom plate and an upper film plate, which are fixedly mounted therebetween, and the lower mold consists of a lower film bottom plate and a lower film plate, which are fixedly mounted therebetween.

[0017] Preferably, in step S1, the optical flat glass can be cut into square pieces or round pieces.

[0018] The beneficial effects of the present invention are as follows: the wafer-level optical composite filter imprinting process of the present invention adopts a process of coating the upper and lower surfaces of a glass substrate and cutting it into monomers combined with a glue injection mold for injection molding. The process steps are simple and the process cost is low. The overall thickness of the manufactured composite filter is relatively thin and the size is precise and small. The thickness can be less than 150 microns and the size can be as small as 1mm x 1mm or less, which provides more installation space for the assembly of downstream devices and improves the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a structural schematic diagram of a glass substrate in the present invention;

[0020] Figure 2 It is a structural schematic diagram of a coating layer with a pattern produced on a glass substrate in the present invention;

[0021] Figure 3 It is a structural schematic diagram of a glass substrate in the present invention having a thin film coating or a screen-printed epoxy resin adhesive layer with light diffusion properties on the other side thereof;

[0022] Figure 4It is a schematic diagram of a structure in which a glass substrate with thin film coatings on both sides of the present invention is cut into monomers;

[0023] Figure 5 It is a structural schematic diagram of a monomer with thin film coatings on both sides of the present invention after being transplanted into a glue injection mold;

[0024] Figure 6 It is a structural schematic diagram of the glue injection mold after glue injection of the present invention;

[0025] Figure 7 It is a structural schematic diagram of an optical embossed composite filter which is demoulded from a glue injection mold according to the present invention;

[0026] In the figure: 1. glass substrate, 2. coating layer with pattern, 3. epoxy resin glue layer, 4. upper film base plate, 5. upper film plate, 6. lower film base plate, 7. lower film plate, 8. upper boss, 9. lower boss, 10. glue injection area, 11. glue injection hole, 12. black glue, 13. shielding layer, 14. partition layer. DETAILED DESCRIPTION

[0027] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0028] Embodiment: A wafer-level optical composite filter imprinting process, the process steps are:

[0029] S1, polishing the upper and lower surfaces of the optical flat glass and cutting it into single pieces according to the required size to form a glass substrate 1, such as Figure 1 As shown;

[0030] S2, a thin film coating is coated on one side of the glass substrate at intervals of size, and a coating layer 2 with a pattern is produced on the surface of the glass substrate by combining photolithography or silk screen printing process, such as Figure 2 As shown;

[0031] S3. According to the requirements of the optical performance of the product, a thin film coating or a screen-printed epoxy resin adhesive layer with light diffusion properties may be formed on the other side of the glass substrate. Figure 3 As shown;

[0032] S4, using a fully automatic wafer cutting machine to cut the glass substrate with thin film coating on both sides into monomers, such as Figure 4 As shown;

[0033] S5, prepare a mold, use a fully automatic transplanting machine to transplant the monomer with two-sided film coating into the mold, the outer edge of the monomer in the mold is provided with interconnected injection areas 10, and the mold is assembled after transplantation. Figure 5 As shown;

[0034] S6, use an automatic embossing glue injection machine to inject black glue 12 into the assembled mold through the glue injection hole 11, and use ultraviolet light combined with high temperature baking to solidify the black glue. The black glue uses black cyclopentane resin to form a shielding layer 13 and a separation layer 14 of the wafer after packaging. Figure 6 As shown;

[0035] S7, demolding the packaged wafer from the mold to form an optical imprinted composite filter, such as Figure 7 shown.

[0036] Preferably, in steps S2 and S3, the method of coating a thin film coating is evaporation coating or sputtering coating.

[0037] Preferably, the mold includes an upper mold and a lower mold, and the upper mold and the lower mold are respectively provided with a glue injection area, the glue injection area is connected to a glue injection hole, and the glue injection area is respectively provided with multiple rows of upper bosses 8 and lower bosses 9, and a monomer with a double-sided thin film coating is placed between the upper bosses and the lower bosses.

[0038] Preferably, the upper mold consists of an upper film bottom plate 4 and an upper film plate 5, which are fixedly mounted therebetween, and the lower mold consists of a lower film bottom plate 6 and a lower film plate 7, which are fixedly mounted therebetween.

[0039] Preferably, in step S1, the optical flat glass can be cut into square pieces or round pieces.

[0040] The wafer-level optical composite filter imprinting process of the present invention adopts a process of coating the upper and lower surfaces of a glass substrate and cutting it into monomers combined with a glue injection mold for injection molding. The process steps are simple and the process cost is low. The overall thickness of the manufactured composite filter is relatively thin and the size is small. The thickness can be less than 150 microns and the size can be as small as 1mm x 1mm or less, which provides more installation space for the assembly of downstream devices and improves the reliability of the product.

[0041] The above-described embodiment is only a preferred solution of the present invention and does not limit the present invention in any form. There are other variations and modifications without exceeding the technical solution described in the claims.

Claims

1. A wafer-level optical composite filter imprinting process, characterized in that: The process steps are: S1, polishing the upper and lower surfaces of the optical flat glass and cutting it into single pieces according to the required size to form a glass substrate; S2. A thin film coating is coated on one side of the glass substrate at intervals according to the size, and a coating layer with a pattern is produced on the surface of the glass substrate by combining a photolithography or silk screen printing process; S3. According to the requirements of the optical performance of the product, a thin film coating or a screen-printed epoxy resin adhesive layer with light diffusion properties is coated on the other side of the glass substrate; S4, using a fully automatic wafer cutting machine to cut the glass substrate with thin film coatings on both sides into monomers; S5. Prepare a mold and use a fully automatic transplanting machine to transplant the monomer with film coating on both sides into the mold. The outer edge of the monomer in the mold is provided with interconnected glue injection areas. After transplanting, the mold is assembled together; S6. Use an automatic embossing glue injection machine to inject black glue liquid into the assembled mold through the glue injection hole, and use ultraviolet light combined with high-temperature baking to cure the black glue liquid to form a shielding layer and a separation layer of the wafer after packaging; S7. Demolding the packaged wafer from the mold to form an optical imprinted composite filter.

2. The wafer-level optical composite filter imprinting process according to claim 1, characterized in that: In steps S2 and S3, a thin film coating is deposited by evaporation coating or sputtering coating.

3. The wafer-level optical composite filter imprinting process according to claim 1, characterized in that: The mold comprises an upper mold and a lower mold, wherein the upper mold and the lower mold are respectively provided with a glue injection area, the glue injection area is connected with a glue injection hole, and the glue injection area is respectively provided with multiple rows of upper bosses and lower bosses, and a monomer with a double-sided thin film coating is placed between the upper bosses and the lower bosses.

4. The wafer-level optical composite filter imprinting process according to claim 3 is characterized in that: The upper mold is composed of an upper film bottom plate and an upper film plate, which are fixedly installed between the upper film bottom plate and the upper film plate, and the lower mold is composed of a lower film bottom plate and a lower film plate, which are fixedly installed between the lower film bottom plate and the lower film plate.

5. The wafer-level optical composite filter imprinting process according to claim 1, characterized in that: In step S1, the optical flat glass is cut into square pieces or round pieces.

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