Electronic component module and method for manufacturing the same

Abstract

An electronic component module (10) includes a substrate (20), an electronic component (41), an insulating resin (51), and a shielding film (70). The insulating resin (51) covers the first main surface (201) side of the substrate (20). The insulating resin (51) exposes the opposite surface (412) of the electronic component (41). The shielding film (70) covers the insulating resin (51) and the opposite surface (412) of the electronic component (41). The opposite surface (412) has uneven portions. The concave portions (4121) of the uneven portions have a smoother shape than the convex portions (4122) of the uneven portions.

Description

Technical Field

[0001] The present invention relates to an electronic component module in which electronic components are mounted on a substrate. Background Art

[0002] A high-frequency module in which electronic components are mounted on a main surface of a wiring substrate is described in Patent Document 1. The electronic components are semiconductor elements and chip components.

[0003] The main surface of the wiring substrate and the electronic components are covered with a sealing resin layer. The outer surface of the sealing resin layer is covered with a shielding layer.

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2018-88460

[0005] There is a structure in which, for the structure shown in Patent Document 1, the sealing resin layer is ground until a semiconductor element (semiconductor IC) as an electronic component is exposed, and a shielding layer is directly formed on the surface of the semiconductor element.

[0006] In this case, there are cases where the surfaces of many semiconductor elements are ground together with the sealing resin layer, and sharp grinding marks are formed accordingly. Moreover, there are cases where cracks and peeling occur in the shielding layer along the grinding marks. If cracks and peeling occur in the shielding layer in this way, the electromagnetic shielding property of the high-frequency module is reduced. Summary of the Invention

[0007] Therefore, an object of the present invention is to provide an electronic component module in which cracks and peeling of a shielding film are suppressed.

[0008] The electronic component module of the invention includes: a substrate having a first main surface and a second main surface, with the second main surface side being the mounting side; a first electronic component mounted on the first main surface, having an opposing surface opposing the substrate and an opposite surface on the side opposite to the opposing surface; an insulating resin covering the first main surface side; and a shielding film covering the insulating resin. The opposite surface is exposed from the insulating resin. The shielding film covers the opposite surface. The opposite surface has uneven portions. The concave portions of the uneven portions are smoother than the convex portions of the uneven portions.

[0009] In this structure, the grinding marks are eliminated by the uneven portions. Moreover, since the concave portions are smooth, steep gaps that may cause cracks and the like can be suppressed.

[0010] According to the invention, cracks and peeling of the shielding film can be suppressed. Brief Description of the Drawings

[0011] Figure 1 (A) is a side cross-sectional view showing the structure of the electronic component module of the first embodiment, Figure 1 (B) is a side cross-sectional view showing the shape of the opposite surface of the electronic component after magnification.

[0012] Figure 2 is a flowchart showing a manufacturing method of an electronic component module according to the first embodiment.

[0013] Figure 3 (A) of Figure 3 (B) of Figure 3 (C) of Figure 3 (D) of is a side cross-sectional view showing the structure in each process of the manufacturing process.

[0014] Figure 4 is a side cross-sectional view showing the structure of an electronic component module according to the second embodiment.

[0015] Figure 5 is a side cross-sectional view showing the structure of an electronic component module according to the third embodiment.

[0016] Figure 6 is a side cross-sectional view showing the structure of an electronic component module according to the fourth embodiment. Detailed Embodiments

[0017] (First Embodiment)

[0018] The electronic component module according to the first embodiment of the present invention will be described with reference to the drawings. Figure 1 (A) of is a side cross-sectional view showing the structure of an electronic component module according to the first embodiment, Figure 1 (B) of is a side cross-sectional view after magnifying the shape of the opposite surface of the electronic component.

[0019] As Figure 1 (A) of shows, the electronic component module 10 includes a substrate 20, an electronic component 41, an insulating resin 51, a plurality of terminal conductors 61, and a shielding film 70.

[0020] The substrate 20 has an insulating main body and includes a conductor pattern for realizing the electronic component module 10. The substrate 20 is formed, for example, by laminating a plurality of insulator layers having a predetermined conductor pattern. In addition, illustration of the conductor pattern formed inside the substrate 20 is omitted. The substrate 20 is, for example, a rectangular flat plate and has a first main surface 201 and a second main surface 202 that face each other. The substrate 20 is a ceramic multilayer substrate. Alternatively, the substrate 20 may be a resin multilayer substrate.

[0021] A plurality of pad conductors 211 are formed on the first main surface 201 of the substrate 20. The number and arrangement of the pad conductors 211 correspond to the number of terminals and the terminal arrangement of the electronic component 41.

[0022] A plurality of terminal conductors 61 are formed on the second main surface 202 of the substrate 20. The plurality of terminal conductors 61 are external connection terminals of the electronic component module 10.

[0023] The electronic component 41 uses a semiconductor. For example, the electronic component 41 is a semiconductor IC which is a so-called bare chip not separately molded by an insulating resin or the like. The electronic component 41 corresponds to the "first electronic component" of the present invention. In addition, the electronic component 41 may also be a piezoelectric element.

[0024] The electronic component 41 has an opposed surface 411 opposed to the substrate and an opposite surface 412 on the side opposite to the opposed surface. On the opposed surface 411, for example, solder bumps or the like are formed. The functional circuit of the electronic component 41 is formed, for example, on the surface of the opposed surface 411 and in the vicinity of the surface. No solder bumps or the like are formed on the opposite surface 412.

[0025] The electronic component 41 is a component that can be thinned by grinding the semiconductor. At this time, the opposite surface 412 side is ground.

[0026] The electronic component 41 is disposed on the first main surface 201 side of the substrate 20. At this time, the electronic component 41 is disposed such that the opposed surface 411 is opposed to the first main surface 201 of the substrate 20. The electronic component 41 is joined (mounted) to the pad conductor 211 using solder or the like.

[0027] The insulating resin 51 covers the first main surface 201 side of the substrate 20. More specifically, the insulating resin 51 covers the opposed surface 411 and the side surface of the electronic component 41. In other words, the opposite surface 412 of the electronic component 41 is exposed to the outside from the insulating resin 51.

[0028] By providing the insulating resin 51, the electronic component 41 and the conductor pattern formed on the first main surface 201 of the substrate 20 can be protected from the external environment.

[0029] The shielding film 70 is a conductive film. The shielding film 70 covers the entire surface of the outer surface of the insulating resin 51, the opposite surface 412 of the electronic component 41, and the entire surface of the side surface of the substrate 20. In this way, by disposing the shielding film 70, unnecessary coupling and interference between the electronic component 41 and the electrical structure formed on the substrate 20 and the external environment can be suppressed. In addition, it is preferable that the shielding film 70 is connected to the ground potential. This case can be realized, for example, by exposing a ground electrode (not shown) from the side surface of the substrate 20 in the inner layer of the substrate 20 and connecting the shielding film 70 to the exposed ground electrode. The thickness (average thickness) of the shielding film 70 is, for example, 1.0 μm or more and 10.0 μm or less.

[0030] In such a structure, the electronic component module 10 has Figure 1 the structure shown in (B).

[0031] As Figure 1As shown in (B), in the electronic component module 10, the opposite surface 412 of the electronic component 41 has uneven portions where concave portions 4121 and convex portions 4122 appear alternately. The uneven portions are formed on the entire surface of the opposite surface 412. In addition, although the uneven portions may be formed on at least a part of the opposite surface 412, it is preferably formed on the entire surface.

[0032] And, the concave portion 4121 has a smoother shape than the convex portion 4122. In other words, the concave portion 4121 does not have a sharp change in the shape of the outer surface, and the rate of change of the shape is also smaller than that of the convex portion 4122.

[0033] With such a structure, it is possible to suppress the steeply shaped gaps that develop from the opposite surface 412 of the electronic component 41 including a semiconductor into the interior of the electronic component 41. Therefore, the electronic component module 10 can suppress cracks and peeling of the shielding film 70 caused by such gaps. Thereby, the electronic component module 10 can achieve a highly reliable shielding performance.

[0034] In addition, it is preferable that the surface roughness (for example, arithmetic mean roughness Ra) of the uneven portions is less than 1.0 μm. This threshold value of 1.0 μm is a value derived by the inventor through experiments. Specifically, with the minimum thickness of the shielding film in the actual specifications being 2.0 μm, an experiment on the generation of cracks and peeling was conducted, and it was found through the experiment that if the surface roughness is less than 1.0 μm, almost no cracks and peeling occur, and if the surface roughness is 1.0 μm or more, cracks and peeling are likely to occur. Therefore, if the surface roughness is within this range, cracks and peeling can be more reliably suppressed.

[0035] In addition, in this structure, by grinding the electronic component 41, the electronic component module 10 is made to have a lower height. Therefore, the electronic component module 10 can achieve a lower height while having a highly reliable shielding performance.

[0036] The electronic component module 10 including such a structure can be realized by the manufacturing method shown below. Figure 2 It is a flowchart showing the manufacturing method of the electronic component module of the first embodiment. Figure 3 In (A), Figure 3 In (B), Figure 3 In (C), Figure 3 In (D) are side cross-sectional views showing the structure in each process of the manufacturing process.

[0037] First, as Figure 3 shown in (A), an electronic component 41 (S11) including a semiconductor IC or the like is mounted on the first main surface 201 of the substrate 20.

[0038] Next, as Figure 3As shown in (B), the first main surface 201 side of the substrate 20 is sealed with the insulating resin 51. At this time, the insulating resin 51 is formed to cover the entire electronic component 41.

[0039] Next, as Figure 3 shown in (C), on the first main surface 201 side of the substrate 20, the insulating resin 51 is ground from the surface of the insulating resin 51 opposite to the abutting surface against the first main surface 201 until the opposite surface 412 of the electronic component 41 is exposed. At this time, it is more preferable to grind the electronic component 41 until the reliability and electrical characteristics of the electronic component 41 do not cause problems. Thereby, the electronic component module 10 can be further miniaturized.

[0040] Next, as Figure 3 shown in (D), the opposite surface 412 of the electronic component 41 is irradiated with a laser to form uneven portions (concave portion 4121 and convex portion 4122) (S14). The laser is a laser having a wavelength that does not penetrate the electronic component body. For example, when the electronic component 41 includes a Si semiconductor, it is preferable to use a UV laser. When the electronic component 41 includes a piezoelectric body, not only a UV laser but also a green laser (wavelength 532 μm) can be used. More specifically, on the opposite surface 412, the laser is condensed into a circle formed by a specified diameter (forming a laser spot with a specified area). By scanning the laser in a direction parallel to the opposite surface 412 in this state, a laser mark is formed on the entire surface of the opposite surface 412. At this time, the portion irradiated with the central part of the laser spot becomes the concave portion 4121, and the portion irradiated with the outer peripheral part becomes the convex portion 4122. Thus, by using the laser mark, as Figure 1 shown in (B), the surface of the concave portion 4121 becomes smooth. Thereby, cracks and breakages of the shielding film 70 are not likely to occur. In addition, although the convex portion 4122 is not as smooth as the concave portion 4121, the shielding film 70 easily adheres to the convex portion 4122, so cracks and breakages of the shielding film 70 are not likely to occur.

[0041] Next, for example, a shielding film 70 is formed by sputtering or the like. Thereby, an electronic component module 10 having the structure shown in (A) and Figure 1 shown in (B) is formed. Moreover, by using this manufacturing method, an electronic component module 10 that can suppress cracks and breakages of the shielding film 70 can be manufactured more reliably and easily. Figure 1

[0042] (Second Embodiment)

[0043] The electronic component module according to the second embodiment of the present invention will be described with reference to the drawings. Figure 4 is a side cross-sectional view showing the structure of the electronic component module according to the second embodiment.

[0044] As​Figure 4 As shown in Figure 4 , the electronic component module 10A of the second embodiment is different from the electronic component module 10 of the first embodiment in that it has a printing portion 80. The other structures of the electronic component module 10A are the same as those of the electronic component module 10, and the description of the same parts is omitted.

[0045] The electronic component module 10A has a printing portion 80. The printing portion 80 is formed on the opposite surface 412 of the electronic component 41. The printing portion 80 is realized by a groove (printing groove) formed on the opposite surface 412. The depth of the printing portion 80 is greater than the surface roughness of the uneven portion. Thus, even if there is an uneven portion, the characters of the printing portion 80 can be easily recognized.

[0046] For example, the printing portion 80 is formed by irradiation with a laser in the same manner as the uneven portion. For example, after irradiation with a laser for the uneven portion, irradiation with a laser for the printing portion 80 is performed. At this time, the irradiation conditions of the laser used for forming the printing portion 80 are different from the irradiation conditions of the laser used for forming the uneven portion. For example, regarding the irradiation conditions of the laser used for forming the printing portion 80, the pulse energy is increased, or a high pulse frequency is formed at a low scanning speed to increase the pulse irradiation density. Thus, the depth of the printing portion 80 is greater than the surface roughness of the uneven portion.

[0047] In addition, since such a printing portion 80 is also formed by irradiation with a laser, the bottom surface of the groove is smooth. Therefore, cracks and breakages of the shielding film 70 can also be suppressed at the bottom of the printing portion 80.

[0048] In this way, even if it has the printing portion 80, the electronic component module 10A can achieve a relatively high reliability shielding performance. In addition, by having the printing portion 80, even if the electronic component 41 is ground and the original printing of the electronic component 41 is removed, it can be reproduced by this printing portion 80.

[0049] (Third Embodiment)

[0050] The electronic component module of the third embodiment of the present invention will be described with reference to the drawings. Figure 5 It is a side cross-sectional view showing the structure of the electronic component module of the third embodiment.

[0051] As Figure 5 shown in Figure 5 , the electronic component module 10B of the third embodiment is different from the electronic component module 10A of the second embodiment in that a surface-mounted electronic component is also mounted on the second main surface 202 side of the substrate 20. That is, the electronic component module 10B is a so-called double-sided surface-mounted type. The other structures of the electronic component module 10B are the same as those of the electronic component module 10A, and the description of the same parts is omitted.

[0052] The electronic component module 10B includes an electronic component 42, an electronic component 43, an insulating resin 52, and a columnar conductor 610 on the second main surface 202 side of the substrate 20.

[0053] On the second main surface 202 of the substrate 20, a plurality of pad conductors 221, a plurality of pad conductors 222, and a plurality of external connection terminal conductors 290 are formed. The number and arrangement of the plurality of pad conductors 221 correspond to the number and terminal arrangement of the electronic component 42. The number and arrangement of the plurality of pad conductors 222 correspond to the number and terminal arrangement of the electronic component 43. The plurality of external connection terminal conductors 290 are arranged along the outer peripheral end near the outer peripheral end on the second main surface 202 of the substrate 20. In addition, the plurality of external connection terminal conductors 290 do not necessarily need to be arranged along the outer peripheral end of the substrate, and for example, they can also be arranged between the electronic component 42 and the electronic component 43.

[0054] The electronic component 42 and the electronic component 43 are, for example, semiconductor ICs, active components (such as transistors) after resin molding, chip capacitor components, chip inductor components, chip resistor components, etc. The electronic component 42 and the electronic component 43 correspond to the "second electronic component" of the present invention.

[0055] The electronic component 42 is joined (mounted) to the pad conductor 221 using solder or the like. The electronic component 43 is joined (mounted) to the pad conductor 222 using solder or the like.

[0056] The columnar conductor 610 is made of a metal such as copper, for example. The plurality of columnar conductors 610 are joined (mounted) to the plurality of external connection terminal conductors 290 using solder or the like. The columnar conductor 610 is a protruding electrode, a metal pin, a via conductor, etc. formed by electroplating or the like. In addition, solder bumps can be used instead of the columnar conductor.

[0057] The insulating resin 52 covers the second main surface 202 side of the substrate 20. The insulating resin 52 covers the electronic component 42, the electronic component 43, and the columnar conductor 610. By providing the insulating resin 52, the electronic component 42, the electronic component 43, and the conductor pattern formed on the second main surface 202 of the substrate 20 can be protected from the external environment.

[0058] The terminal conductor 61 is formed on the surface of the columnar conductor 610 opposite to the joint surface with the external connection terminal conductor 290. This terminal conductor 61 serves as a terminal for mounting the electronic component module 10B on another circuit board. That is, in the electronic component module 10B, the second main surface 202 side of the substrate 20 becomes the mounting side to another circuit board.

[0059] The shielding film 70 covers the entire outer surface of the insulating resin 51, the opposite surface 412 of the electronic component 41, the entire side surface of the substrate 20, and the entire side surface of the insulating resin 52. In this way, by disposing the shielding film 70, it is possible to suppress unnecessary coupling and interference between the electronic components 41, 42, 43 and the electrical structure formed on the substrate 20 and the external environment.

[0060] Even in such a dual-sided mounting type, the electronic component module 10B can suppress cracks and breakage of the shielding film by having the above-mentioned uneven portions on the opposite surface 412 of the electronic component 41, and can achieve a highly reliable shielding performance.

[0061] (Fourth Embodiment)

[0062] The electronic component module according to the fourth embodiment of the present invention will be described with reference to the drawings. Figure 6 It is a side cross-sectional view showing the structure of the electronic component module according to the fourth embodiment.

[0063] As Figure 6 shown, the electronic component module 10C according to the fourth embodiment is different from the electronic component module 10B according to the third embodiment in the structure of the mounting of the electronic components. Other structures of the electronic component module 10C are the same as those of the electronic component module 10B, and the description of the same parts is omitted.

[0064] Instead of the electronic components 42 and 43 of the electronic component module 10B, the electronic component module 10C includes electronic components 44 and 45. The electronic component 44 is, for example, an electronic component that cannot be ground, and the electronic component 44 is, for example, an active element (such as a transistor) after resin molding, a chip capacitor element, a chip inductor element, a chip resistor element, etc. The height of the electronic component 44 is lower than the height of the ground electronic component 41. The electronic component 45 is, for example, an electronic component that can be thinned by grinding. For example, the electronic component 45 is formed of a semiconductor or a piezoelectric body.

[0065] A plurality of pad conductors 214 are formed on the first main surface 201 of the substrate 20. The number and arrangement of the plurality of pad conductors 214 correspond to the number of terminals and the terminal arrangement of the electronic component 44. The electronic component 44 is joined (mounted) to the pad conductors 214 using solder or the like.

[0066] A plurality of pad conductors 225 are formed on the second main surface 202 of the substrate 20. The number and arrangement of the plurality of pad conductors 225 correspond to the number of terminals and the terminal arrangement of the electronic component 45. The electronic component 45 is joined (mounted) to the pad conductors 225 using solder or the like.

[0067] The opposite surface of the electronic component 45 and the sum of the insulating resin 52 are flush with the surface of the substrate 20 on the side opposite to the contact surface and are exposed from the insulating resin 52. In addition, components with a height lower than that of the ground electronic component 45 can also be mounted on the second main surface 202 of the substrate 20.

[0068] Even with such a structure, the electronic component module 10C can suppress cracks and breakage of the shielding film and achieve a highly reliable shielding performance by having the above-described uneven portions on the opposite surface 412 of the electronic component 41. Also, the electronic component module 10C can grind the electronic component thinner on both the first main surface 201 side and the second main surface 202 side of the substrate 20. Thus, the electronic component module 10C can achieve thinning in a structure where electronic components are mounted on both sides of the substrate 20.

[0069] In addition, although in each of the above-described embodiments, a method of mounting one grindable electronic component on the main surface is shown, multiple grindable electronic components can also be mounted. Also, the number of non-grindable electronic components is not limited to the above-described embodiments.

[0070] Reference Numeral Explanation: 10, 10A, 10B, 10C... electronic component module; 20... substrate; 41, 42, 43, 44, 45... electronic component; 51, 52... insulating resin; 61... terminal conductor; 70... shielding film; 80... printing portion; 201... first main surface; 202... second main surface; 211, 214, 221, 222, 225... pad conductor; 290... external connection terminal conductor; 411... opposing surface; 412... opposite surface; 610... columnar conductor; 4121... concave portion; 4122... convex portion.

Claims

1. An electronic component module, wherein, Comprising: A substrate having a first main surface and a second main surface, with the second main surface side being the mounting side; A first electronic component mounted on the first main surface, having a facing surface facing the substrate and an opposite surface on the side opposite to the facing surface; An insulating resin covering the first main surface side; And A shielding film covering the insulating resin, The opposite surface is exposed from the insulating resin, The shielding film covers the opposite surface, The opposite surface has uneven portions, The concave portions of the uneven portions are smoother in shape than the convex portions of the uneven portions, The concave portions do not have a sharp change in the outer surface shape, and the change rate of the shape of the concave portions is also smaller than that of the convex portions.

2. The electronic component module according to claim 1, wherein, The uneven portions are formed on the entire surface of the opposite surface.

3. The electronic component module according to claim 1 or 2, wherein, The opposite surface has printing grooves, The depth of the printing grooves is larger than the surface roughness of the uneven portions.

4. The electronic component module according to claim 1 or 2, wherein, The electronic component module includes a second electronic component mounted on the second main surface.

5. A method for manufacturing an electronic component module, wherein, Having: A process of mounting an electronic component including a semiconductor on the first main surface of the substrate; A process of covering the first main surface and the electronic component with an insulating resin; A process of grinding the insulating resin to expose the opposite surface of the electronic component on the side opposite to the side mounted on the substrate; A process of forming uneven portions on the opposite surface where the concave portions are smoother in shape than the convex portions; and A process of covering the outer surface of the insulating resin and the opposite surface with a shielding film, The concave portions do not have a sharp change in the outer surface shape, and the change rate of the shape of the concave portions is also smaller than that of the convex portions.

6. The method for manufacturing an electronic component module according to claim 5, wherein, The process of forming the uneven portions is performed by irradiating a laser that does not penetrate the semiconductor.

7. The method for manufacturing an electronic component module according to claim 6, wherein, The laser is a UV laser or a green laser.

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