Chip automatic suction placement detection equipment and detection method

Abstract

The present invention relates to the field of chip manufacturing technology, and in particular to a chip automatic suction placement detection device and detection method, including a base, a mobile device, a gripping device, a detection device, and a control module. The control module adjusts the action of the mobile device according to the chip position detected by the detection device. The mobile device moves to a first preset position, and the control module controls the gripping module to grip the chip and move it to a second preset position. The control module controls the gripping module to place the chip at the preset position. The detection module detects whether the chip placement position meets the preset requirements. If the preset requirements are met, the current gripping work ends. If the preset requirements are not met, the control module controls the gripping module to grip and place the chip again until the preset requirements are met. The present invention adds a detection device and intelligent control to the chip gripping device, so that the gripping and calibration of the chip can be intelligently detected and corrected.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to automatic chip suction and placement detection equipment and a detection method. Background Art

[0002] Since the 21st century, China's electronic information product manufacturing industry has developed rapidly and gradually become one of the pillar industries of the national economy, with huge demand for automation. As the core device of semiconductors, the advanced manufacturing process and advanced manufacturing method of chips have become an urgent problem to be solved in my country. In the chip manufacturing process, more stringent requirements are put forward for the automatic absorption, placement and detection equipment and detection methods of smaller chips. The requirements for position accuracy are extremely high, and other sensors are needed for effective assistance. However, due to the limitations of existing technologies, the actions of chip automatic absorption, placement and detection equipment and detection methods cannot meet the preset standards.

[0003] Chinese Patent Publication No.: CN112743564A. A chip grabbing robot and grabbing method are disclosed, which include: L arm, sliding plug A, spring A, sliding plug B, arm tube, sliding sleeve, spring B, suction cup, sliding plug C, air supply pipe, suction hose, wherein the hollow L arm is installed on the robot arm; sliding plug A and sliding plug B are respectively sealed and slidable in the two branches of the L arm, and the cross-sectional areas of sliding plug A and sliding plug B are equal; the present invention uses the linkage of sliding plug A, sliding plug B and sliding plug C, so that when the chip is grabbed by the suction cup, the greater the external force acting on the chip to make it separate from the suction cup, the greater the movement amplitude of sliding plug B in the L arm, the more air the suction system continues to extract from the suction cup, the greater the suction force of the suction cup on the chip, and the less likely the chip is to separate from the suction cup, thereby protecting the chip from falling and being damaged due to separation from the suction cup;

[0004] It can be seen that the chip suction tool has no position detection mechanism during the chip grabbing process, which easily leads to the problem of deviation in the placement position after grabbing the chip. Summary of the invention

[0005] To this end, the present invention provides a chip automatic suction placement detection device and detection method to overcome the problem in the prior art that no detection mechanism is set during the chip grabbing process, resulting in the inability to detect and correct the chip grabbing and calibration.

[0006] To achieve the above-mentioned purpose, the present invention provides a chip automatic suction placement detection device, including a base, a moving device, a grasping device, a detection device, and a control module, wherein:

[0007] A control module is arranged in the base, and the base is connected to the mobile device and the detection device to support the mobile device and the detection device;

[0008] The mobile device is arranged on the base, and is provided with a first mobile unit, a second mobile unit and a third mobile unit, wherein the first mobile unit is arranged on the base, and is used to connect the second mobile unit and move to a coordinate point on a preset coordinate X axis, the second mobile unit is arranged on the first mobile unit, and is used to link the third mobile unit and move to a coordinate point on a preset coordinate Y axis, and the third mobile unit is arranged below the end of the second mobile unit and is connected to the grasping device, and is used to link the second mobile unit and drive the grasping device to move to a coordinate point on a preset coordinate Z axis;

[0009] The grasping device is arranged on one side of the moving device, and is provided with an electric suction unit and a deformation detection unit, wherein the electric suction unit is arranged at the end of the grasping device to absorb the chip, and the deformation detection unit is arranged on one side of the electric suction unit to detect the degree of deformation of the absorbed chip;

[0010] The detection device is arranged on the mobile device and the base, and is provided with a laser positioning unit and a plurality of binocular camera units, wherein the laser positioning unit is arranged on one side of the grasping device to detect the current position of the electric suction unit and the position from the chip, and the plurality of binocular camera units are arranged on the base respectively to detect the relative error between the electric suction unit and the current position of the chip and the position where the chip is placed;

[0011] The control module is arranged in the base, and is used to control the linkage work of the grabbing device, the moving device and the detection device, and to adjust the grabbing device and the moving device according to the comparison value between the real-time data detected by the detection device and the preset data;

[0012] A detection method for a chip automatic suction and placement detection device, comprising:

[0013] Step S1, the control module adjusts the movement of the mobile device according to the chip position detected by the detection device, and the mobile device moves to a first preset position;

[0014] Step S2, the control module controls the grabbing device to grab the chip and move it to a second preset position;

[0015] Step S3, the control module controls the grasping device to place the chip at a preset position, and detects whether the chip placement position meets the preset requirements;

[0016] Step S4: if the preset requirements are met, the current grabbing work is completed; if the preset requirements are not met, the control module controls the grabbing device to grab and place the chip again according to the data detected by the detection device until the preset requirements are met;

[0017] In step S1, the control module presets the three-dimensional coordinates of the movable range of the mobile device, presets the volume coordinate points of the grasping device and the mobile device, and presets the maximum grasping range of the electric suction unit. When the electric suction unit grasps the chip, the center point of the electric suction unit corresponds to the detected center point of the chip, and the chip is grasped within the maximum grasping range of the electric suction unit as a condition for controlling the movement of the mobile unit.

[0018] Step S11, the control module controls the first mobile unit to drive the second mobile unit to move to the position of the first preset position coordinate x of the chip through X-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the second mobile unit and the center of the chip through the binocular camera units, wherein the theoretical angle value is set as A0 and the actual angle value is set as A1.

[0019] If 99%A0≤A1≤101%A0, the control module determines that the actual angle value does not need to be corrected;

[0020] If 98%A0≥A1 or 102%A0≤A1, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit to adjust the horizontal position until 99%A0≤A1≤101%A0;

[0021] Step S12, the control module controls the second mobile unit to drive the third mobile unit to move to the position of the first preset position coordinate point y of the chip through Y-axis movement according to the current position of the chip detected by the multiple binocular camera units, and detects and corrects the angle between the third mobile unit and the center of the chip through the multiple binocular camera units, wherein the theoretical angle value is set as B0 and the actual angle value is set as B1.

[0022] If 99%B0≤B1≤101%B0, the control module determines that the actual angle value does not need to be corrected;

[0023] If 98%B0≥B1 or 102%B0≤B1, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit to adjust the longitudinal horizontal position until 99%B0≤B1≤101%B0;

[0024] Step S13, the control module controls the third moving unit to drive the electric suction unit to move to the first preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit, wherein the theoretical graspable distance value is set as D0, and the actual distance value is set as D1.

[0025] If 10% D0<D1<D0, the control module determines that the actual distance value does not need to be corrected;

[0026] If D1≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit to adjust the vertical position until 10%D0<D1<D0;

[0027] If 10%D0≥D1, the control module determines that the electric suction unit is too close to the chip, controls the third mobile unit to stop urgently, and outputs an alarm prompt;

[0028] In step S2, after the control module determines that the electric suction unit has moved to the first preset position coordinates (x, y, z), the control module controls the electric suction unit to grab the chip, and the deformation detection unit compares the flatness of the chip before grabbing with the flatness after grabbing to detect whether the chip deformation is within the preset reasonable range, and adjusts the suction force of the electric suction unit according to the comparison result.

[0029] Set the chip flatness detected before grabbing to P0, set the chip flatness detected after grabbing to P1, and set the chip flatness preset reasonable deformation to P0±P2.

[0030] If P0-P2<P1<P0+P2, the control module determines that the current chip deformation is within the preset reasonable range, and the suction force of the electric suction unit does not need to be adjusted;

[0031] If P1≥P0+P2 or P1≤P0-P2, the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit needs to be adjusted;

[0032] Set the minimum suction force of the electric suction unit to grab the chip and fix it as PGP1, set the maximum suction force that the electric suction unit can generate as PGP3, set the current suction force generated by the electric suction unit as PGP2, and set the preset suction force generated by the electric suction unit as PGP0. ,

[0033] When P1≥P0+P2 or P1≤P0-P2, the control module determines that the preset suction force PGP0 of the current electric suction unit is too large. At this time, PGP0=PGP2, and the current suction force PGP2 needs to be reduced until P0-P2<P1<P0+P2, at which time PGP2′ is obtained, and PGP1<PGP2′<PGP0;

[0034] In step S3, the control module controls the third mobile unit to drive the electric suction unit that grabs the chip to lift the height to a preset safety height position, and controls the first mobile unit to drive the second mobile unit to move to the position of the second preset position coordinate x of the chip through X-axis movement, and detects and corrects the center angle of the first mobile unit from the chip through a plurality of binocular camera units;

[0035] Step S31, the control module controls the second mobile unit to drive the third mobile unit to move to the position of the second preset position coordinate point y of the chip through Y-axis movement, and detects and corrects the angle between the third mobile unit and the center of the chip through a plurality of binocular camera units;

[0036] Step S32, the control module controls the third moving unit to drive the electric suction unit to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit;

[0037] Step S33, after the control module determines that the electric suction unit has moved to the second preset position coordinates (x′, y′, z′), it controls the electric suction unit to place the chip, and detects and corrects the position of the chip through a plurality of binocular camera units.

[0038] In step S4, the coordinates of the center point of the preset position are set to (x1, y1), and the coordinates of the center point of the current position are set to (x2, y2).

[0039] If 99%x1≤x2≤101%x1, the control module determines that the coordinate point on the X-axis of the current position meets the preset requirements and no adjustment is required;

[0040] If 98%<x2 or 102%x1>x2, the control module determines that the coordinate point on the X-axis of the current position deviates from the preset coordinate point on the X-axis and needs to be adjusted;

[0041] If 99%y1≤y2≤101%y1, the control module determines that the coordinate point on the Y axis of the current position meets the preset requirements and no adjustment is required;

[0042] If 98%<y2 or 102%y1>y2, the control module determines that the coordinate point on the Y axis of the current position deviates from the preset coordinate point on the Y axis and needs to be adjusted;

[0043] When 99%x1≤x2≤101%x1, and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and this grasping work is completed;

[0044] In step S4, when 98%<x2 or 102%x1>x2 or 98%<y2 or 102%y1>y2, the control module controls the mobile device to re-grab and place the chip until 99%x1≤x2≤101%x1 and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and this grabbing work is completed.

[0045] Step S41, wherein the process of re-capturing and correcting is as follows:

[0046] The control module controls the first mobile unit to drive the second mobile unit to move to the position of the current third preset position coordinate x of the chip through the X-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the second mobile unit and the center of the chip through the binocular camera units, and sets the actual angle value as A1′.

[0047] If 99.5%A0≤A1′≤100.5%A0, the control module determines that the actual angle value does not need to be corrected;

[0048] If 99%A0≥A1′ or 101%A0≤A1′, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit to adjust the horizontal position until 99.5%A0≤A1′≤100.5%A0;

[0049] Step S42: the control module controls the second mobile unit to drive the third mobile unit to move to the position of the third preset position coordinate point y of the chip through Y-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the third mobile unit and the center of the chip through the binocular camera units, and sets the actual angle value to B1′.

[0050] If 99.5%B0≤B1′≤100.5%B0, the control module determines that the actual angle value does not need to be corrected;

[0051] If 99%B0≥B1′ or 100%B0≤B1′, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit to adjust the longitudinal horizontal position until 99.5%B0≤B1′≤100.5%B0;

[0052] Step S43, the control module controls the third moving unit to drive the electric suction unit to move to the position of the current third preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit, and sets the actual distance value as D1′.

[0053] If 5%D0<D1′<D0, the control module determines that the actual distance value does not need to be corrected;

[0054] If D1′≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit to adjust the vertical position until 5%D0<D1′<D0;

[0055] If 5%D0≥D1′, ​​the control module determines that the electric suction unit is too close to the chip, controls the third mobile unit to stop urgently, and outputs an alarm prompt;

[0056] Step S44, after the control module determines that the electric suction unit has moved to the current third preset position coordinate (x″, y″, z″), the control module controls the electric suction unit to grab the chip, and the deformation detection unit compares the flatness of the chip before grabbing with the flatness after grabbing, detects whether the chip deformation is within a preset reasonable range, and adjusts the suction force of the electric suction unit according to the comparison result, wherein the flatness of the chip detected before grabbing is set to P0, the flatness of the chip detected after grabbing is set to P1, and the preset reasonable deformation degree of chip flatness is set to P0± ,

[0057] If P0- <P1<P0+ , the control module determines that the current chip deformation is within the preset reasonable range, and the suction force of the electric suction unit does not need to be adjusted;

[0058] If P1≥P0+ or P1≤P0- , the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit needs to be adjusted;

[0059] When P1≥P0+ or P1≤P0- When P0- <P1<P0+ , at this time, PGP2″ is obtained, and PGP1<PGP2″<PGP2′;

[0060] Step S45, the control module controls the first mobile unit to drive the second mobile unit to move to the position of the second preset position coordinate x of the chip through X-axis movement, and detects and corrects the angle between the first mobile unit and the center of the chip through a plurality of binocular camera units;

[0061] The control module controls the second mobile unit to drive the third mobile unit to move to the position of the second preset position coordinate point y of the chip through Y-axis movement, and detects and corrects the angle between the third mobile unit and the center of the chip through a plurality of binocular camera units;

[0062] The control module controls the third moving unit to drive the electric suction unit to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit;

[0063] Step S46, after the control module determines that the electric suction unit has moved to the second preset position coordinates (x′, y′, z′), the control module controls the electric suction unit to place the chip, and detects and corrects the position of the chip through a number of binocular camera units. If the control module determines that the current position coordinate point meets the preset requirements, the current grabbing work is completed. If the control module determines that the current position coordinate point does not meet the preset requirements, the control module repeats the process of grabbing, placing and correcting again until the control module determines that the current position coordinate point meets the preset requirements.

[0064] Compared with the prior art, the beneficial effect of the present invention is that by adding a detection device and an intelligent control system to the chip grabbing device, the chip grabbing device can be made more intelligent and efficient.

[0065] Furthermore, through in-depth utilization of the detection device, the chip grabbing work can be secondary adjusted and calibrated according to the real-time data detected by the detection device during the chip grabbing process, thereby improving the grabbing accuracy and efficiency, while avoiding damage to the chip caused by manual operation.

[0066] Furthermore, by adding a detection device to the chip grabbing device, both the grabbing and placement of the chip can be effectively detected and corrected, thereby improving the accuracy of chip placement.

[0067] Furthermore, by presetting the three-dimensional coordinate data of the mobile device within the movable range in the control module, the mobile device can obtain more accurate reference values, error values ​​and correction values ​​based on the comparison between real-time data and preset data when moving, thereby avoiding more serious subsequent problems in the chip capture work caused by problems with either the detection device or the three-dimensional coordinate data.

[0068] Furthermore, by adopting an electric suction grasping component and a deformation detection unit, the chip can be protected to the greatest extent possible from being damaged by the grasping action itself during the grasping and moving process. At the same time, the suction force of the electric suction component can be adjusted in real time, and the suction force that is most conducive to protecting the chip can be obtained through detection by the deformation detection unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Figure 1 It is a schematic side view of the structure of the automatic chip suction and placement detection device according to an embodiment of the present invention;

[0070] Figure 2 It is a schematic top view of the structure of the automatic chip suction and placement detection device according to an embodiment of the present invention;

[0071] Figure 3 It is a schematic diagram of the structure side movement of the automatic chip suction and placement detection device according to an embodiment of the present invention;

[0072] Figure 4It is a schematic diagram of the structure and movement of the automatic chip suction and placement detection device according to an embodiment of the present invention from a top view;

[0073] Figure 5 It is a schematic front view of the structure of the automatic chip suction and placement detection device according to an embodiment of the present invention;

[0074] Figure 6 It is a structural schematic diagram of a detection method of a chip automatic suction and placement detection device according to an embodiment of the present invention;

[0075] In the figure: a base 1, a first mobile unit 2, a second mobile unit 3, a third mobile unit 4, an electric suction unit 5, a deformation detection unit 6, a laser positioning unit 7, and a binocular camera unit 8. DETAILED DESCRIPTION

[0076] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0077] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0078] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0079] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] See also Figure 1 As shown, it is a schematic diagram of the structure of the automatic chip suction placement detection device according to an embodiment of the present invention. This embodiment includes a base 1, a moving device, a gripping device, a detection device, and a control module, wherein:

[0081] A control module is provided in the base 1, and the base 1 is connected to the mobile device and the detection device to support the mobile device and the detection device;

[0082] The mobile device is arranged on the base 1, and is provided with a first mobile unit 2, a second mobile unit 3 and a third mobile unit 4, wherein the first mobile unit 2 is arranged on the base 1, and is used to connect the second mobile unit 3 and move to a coordinate point on a preset coordinate X axis, the second mobile unit 3 is arranged on the first mobile unit 2, and is used to link the third mobile unit 4 and move to a coordinate point on a preset coordinate Y axis, and the third mobile unit 4 is arranged below the end of the second mobile unit 3 and is connected to the grasping device, and is used to link the second mobile unit and drive the grasping device to move to a coordinate point on a preset coordinate Z axis;

[0083] The grabbing device is arranged at one side of the moving device, and is provided with an electric suction unit 5 and a deformation detection unit 6, wherein the electric suction unit 5 is arranged at the end of the third moving unit 4 to suck the chip, and the deformation detection unit 6 is arranged at one side of the electric suction unit 5 to detect the degree of deformation of the sucked chip;

[0084] The detection device is arranged on the mobile device and the base 1, and is provided with a laser positioning unit 7 and a plurality of binocular camera units 8, wherein the laser positioning unit 7 is arranged on one side of the grasping device to detect the current position of the electric suction unit 5 and the position from the chip, and the plurality of binocular camera units 8 are respectively arranged on the base 1 to detect the relative error between the electric suction unit 5 and the current position of the chip and the position where the chip is placed;

[0085] The control module is arranged in the base 1, and is used to control the linkage work of the grabbing device, the moving device and the detection device, and to adjust the grabbing device and the moving device according to the comparison value between the real-time data detected by the detection device and the preset data;

[0086] In this embodiment, the mobile device is provided with a first mobile unit 2, a second mobile unit 3 and a third mobile unit 4, and the transmission components of all units can be screw transmission or gear transmission, as long as they can meet the transmission requirements in this embodiment, which will not be repeated here.

[0087] Please continue reading Figure 6 As shown, it is a schematic diagram of the structure of the detection method of the chip automatic suction placement detection device according to an embodiment of the present invention, which includes:

[0088] Step S1, the control module adjusts the movement of the mobile device according to the chip position detected by the detection device, and the mobile device moves to a first preset position;

[0089] Step S2, the control module controls the grabbing device to grab the chip and move it to a second preset position;

[0090] Step S3, the control module controls the grasping device to place the chip at a preset position, and detects whether the chip placement position meets the preset requirements;

[0091] Step S4: if the preset requirements are met, the current grabbing work is completed; if the preset requirements are not met, the control module controls the grabbing device to grab and place the chip again according to the data detected by the detection device until the preset requirements are met;

[0092] In step S1, the control module presets the three-dimensional coordinates of the movable range of the mobile device, presets the volume coordinate points of the grasping device and the mobile device, and presets the maximum grasping range of the electric suction unit 5. When the electric suction unit 5 grasps the chip, the center point of the electric suction unit 5 corresponds to the detected center point of the chip, and the chip is grasped within the maximum grasping range of the electric suction unit 5 as a graspable condition, and the movement of the mobile unit is controlled.

[0093] Step S11, the control module controls the first mobile unit 2 to drive the second mobile unit 3 to move to the position of the first preset position coordinate x of the chip through the X-axis movement according to the current position of the chip detected by the binocular camera units 8, and detects and corrects the angle between the second mobile unit 3 and the center of the chip through the binocular camera units 8, wherein the theoretical angle value is set as A0 and the actual angle value is set as A1.

[0094] If 99%A0≤A1≤101%A0, the control module determines that the actual angle value does not need to be corrected;

[0095] If 98%A0≥A1 or 102%A0≤A1, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit 2 to adjust the horizontal position until 99%A0≤A1≤101%A0;

[0096] Step S12, the control module controls the second mobile unit 3 to drive the third mobile unit 4 to move to the position of the first preset position coordinate point y of the chip through Y-axis movement according to the current position of the chip detected by the binocular camera units 8, and detects and corrects the angle between the third mobile unit 4 and the center of the chip through the binocular camera units 8, wherein the theoretical angle value is set as B0 and the actual angle value is set as B1.

[0097] If 99%B0≤B1≤101%B0, the control module determines that the actual angle value does not need to be corrected;

[0098] If 98%B0≥B1 or 102%B0≤B1, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit 3 to adjust the longitudinal horizontal position until 99%B0≤B1≤101%B0;

[0099] Step S13, the control module controls the third moving unit 4 to drive the electric suction unit 5 to move to the first preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the distance between the electric suction unit 5 and the center of the chip through the laser positioning unit 7, wherein the theoretical graspable distance value is set as D0, and the actual distance value is set as D1.

[0100] If 10% D0<D1<D0, the control module determines that the actual distance value does not need to be corrected;

[0101] If D1≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit 4 to adjust the vertical position until 10%D0<D1<D0;

[0102] If 10%D0≥D1, the control module determines that the electric suction unit is too close to the chip, controls the third mobile unit 4 to stop urgently, and outputs an alarm prompt;

[0103] In step S2, after the control module determines that the electric suction unit 5 has moved to the first preset position coordinates (x, y, z), the control module controls the electric suction unit 5 to grab the chip, and the deformation detection unit 6 compares the flatness of the chip before grabbing with the flatness after grabbing to detect whether the chip deformation is within the preset reasonable range, and adjusts the suction force of the electric suction unit 5 according to the comparison result.

[0104] Set the chip flatness detected before grabbing to P0, set the chip flatness detected after grabbing to P1, and set the chip flatness preset reasonable deformation to P0±P2.

[0105] If P0-P2<P1<P0+P2, the control module determines that the current chip deformation is within the preset reasonable range, and the suction force of the electric suction unit 5 does not need to be adjusted;

[0106] If P1≥P0+P2 or P1≤P0-P2, the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit 5 needs to be adjusted;

[0107] The minimum suction force of the electric suction unit 5 to grab the chip and fix it is set to PGP1, the maximum suction force that the electric suction unit 5 can generate is set to PGP3, the current suction force generated by the electric suction unit 5 is set to PGP2, and the preset suction force generated by the electric suction unit 5 is set to PGP0. ,

[0108] When P1≥P0+P2 or P1≤P0-P2, the control module determines that the preset suction force PGP0 of the current electric suction unit 5 is too large. At this time, PGP0=PGP2, and the current suction force PGP2 needs to be reduced until P0-P2<P1<P0+P2, at which time PGP2′ is obtained, and PGP1<PGP2′<PGP0;

[0109] In step S3, the control module controls the third mobile unit 4 to drive the electric suction unit 5 that has grabbed the chip to lift the height to a preset safety height position, and controls the first mobile unit 2 to drive the second mobile unit 3 to move to the position of the second preset position coordinate x of the chip through X-axis movement, and detects and corrects the center angle of the first mobile unit 2 from the chip through a plurality of binocular camera units 8;

[0110] Step S31, the control module controls the second mobile unit 3 to drive the third mobile unit 4 to move to the position of the second preset position coordinate point y of the chip through Y-axis movement, and detects and corrects the angle between the third mobile unit 4 and the center of the chip through a plurality of binocular camera units 8;

[0111] Step S32, the control module controls the third moving unit 4 to drive the electric suction unit 5 to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit 5 and the center of the chip through the laser positioning unit 7;

[0112] Step S33, after the control module determines that the electric suction unit 5 has moved to the second preset position coordinates (x′, y′, z′), it controls the electric suction unit 5 to place the chip, and detects and corrects the position of the chip through a plurality of binocular camera units 8.

[0113] In step S4, the coordinates of the center point of the preset position are set to (x1, y1), and the coordinates of the center point of the current position are set to (x2, y2).

[0114] If 99%x1≤x2≤101%x1, the control module determines that the coordinate point on the X-axis of the current position meets the preset requirements and no adjustment is required;

[0115] If 98%<x2 or 102%x1>x2, the control module determines that the coordinate point on the X-axis of the current position deviates from the preset coordinate point on the X-axis and needs to be adjusted;

[0116] If 99%y1≤y2≤101%y1, the control module determines that the coordinate point on the Y axis of the current position meets the preset requirements and no adjustment is required;

[0117] If 98%<y2 or 102%y1>y2, the control module determines that the coordinate point on the Y axis of the current position deviates from the preset coordinate point on the Y axis and needs to be adjusted;

[0118] When 99%x1≤x2≤101%x1, and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and this grasping work is completed;

[0119] In step S4, when 98%<x2 or 102%x1>x2 or 98%<y2 or 102%y1>y2, the control module controls the mobile device to re-grab and place the chip until 99%x1≤x2≤101%x1 and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and this grabbing work is completed.

[0120] Step S41, wherein the process of re-capturing and correcting is as follows:

[0121] The control module controls the first mobile unit 2 to drive the second mobile unit 3 to move to the position of the current third preset position coordinate x of the chip through the X-axis movement according to the current position of the chip detected by the binocular camera units 8, and detects and corrects the angle between the second mobile unit 3 and the center of the chip through the binocular camera units 8, and sets the actual angle value to A1′.

[0122] If 99.5%A0≤A1′≤100.5%A0, the control module determines that the actual angle value does not need to be corrected;

[0123] If 99%A0≥A1′ or 101%A0≤A1′, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit 2 to adjust the horizontal position until 99.5%A0≤A1′≤100.5%A0;

[0124] Step S42: the control module controls the second mobile unit 3 to drive the third mobile unit 4 to move to the position of the current third preset position coordinate point y of the chip through the Y-axis movement according to the current position of the chip detected by the binocular camera units 8, and detects and corrects the angle between the third mobile unit 4 and the center of the chip through the binocular camera units 8, and sets the actual angle value to B1′.

[0125] If 99.5%B0≤B1′≤100.5%B0, the control module determines that the actual angle value does not need to be corrected;

[0126] If 99%B0≥B1′ or 100%B0≤B1′, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit 3 to adjust the longitudinal horizontal position until 99.5%B0≤B1′≤100.5%B0;

[0127] Step S43, the control module controls the third moving unit 4 to drive the electric suction unit 5 to move to the position of the current third preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units 8, and detects and corrects the distance between the electric suction unit 5 and the center of the chip through the laser positioning unit 7, and sets the actual distance value as D1′.

[0128] If 5%D0<D1′<D0, the control module determines that the actual distance value does not need to be corrected;

[0129] If D1′≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit 4 to adjust the vertical position until 5%D0<D1′<D0;

[0130] If 5%D0≥D1′, ​​the control module determines that the electric suction unit 5 is too close to the chip, controls the third mobile unit 4 to stop urgently, and outputs an alarm prompt;

[0131] Step S44, after the control module determines that the electric suction unit 5 has moved to the current third preset position coordinates (x″, y″, z″), the control module controls the electric suction unit 5 to grab the chip, and the deformation detection unit 6 compares the flatness of the chip before grabbing with the flatness after grabbing, detects whether the chip deformation is within the preset reasonable range, and adjusts the suction force of the electric suction unit 5 according to the comparison result, wherein the flatness of the chip detected before grabbing is set to P0, the flatness of the chip detected after grabbing is set to P1, and the preset reasonable deformation degree of chip flatness is set to P0± ,

[0132] If P0- <P1<P0+ , the control module determines that the current chip deformation is within a preset reasonable range, and the suction force of the electric suction unit 5 does not need to be adjusted;

[0133] If P1≥P0+ or P1≤P0- , the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit 5 needs to be adjusted;

[0134] When P1≥P0+ or P1≤P0- When P0- <P1<P0+ , at this time, PGP2″ is obtained, and PGP1<PGP2″<PGP2′;

[0135] Step S45, the control module controls the first mobile unit 2 to drive the second mobile unit 3 to move to the position of the second preset position coordinate x of the chip through the X-axis movement, and detects and corrects the angle between the first mobile unit 2 and the center of the chip through a plurality of binocular camera units 8;

[0136] The control module controls the second mobile unit 3 to drive the third mobile unit 4 to move to the position of the second preset position coordinate point y of the chip through the Y-axis movement, and detects and corrects the angle between the third mobile unit 4 and the center of the chip through a plurality of binocular camera units 8;

[0137] The control module controls the third moving unit 4 to drive the electric suction unit 5 to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit 5 and the center of the chip through the laser positioning unit 7;

[0138] Step S46, after the control module determines that the electric suction unit 5 has moved to the second preset position coordinates (x′, y′, z′), the control module controls the electric suction unit 5 to place the chip, and detects and corrects the position of the chip through a plurality of binocular camera units 8. If the control module determines that the current position coordinate point meets the preset requirements, the current grabbing work is completed. If the control module determines that the current position coordinate point does not meet the preset requirements, the control module repeats the process of grabbing, placing and correcting again until the control module determines that the current position coordinate point meets the preset requirements.

[0139] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0140] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip automatic suction placement detection device, characterized in that: include: Base, moving device, grasping device, detection device, control module, wherein, The control module is arranged in the base, and the base is connected to the detection device to support the detection device; The mobile device is arranged on the base, and is provided with a first mobile unit, a second mobile unit and a third mobile unit, wherein the first mobile unit is arranged on the base, and is used to connect the second mobile unit and move to a coordinate point on a preset coordinate X axis, the second mobile unit is arranged on the first mobile unit, and is used to connect the third mobile unit and move to a coordinate point on a preset coordinate Y axis, and the third mobile unit is arranged below the end of the second mobile unit and is connected to the grasping device, and is used to connect the second mobile unit and drive the grasping device to move to a coordinate point on a preset coordinate Z axis; The grabbing device is arranged at one side of the moving device, and the grabbing device is provided with an electric suction unit and a deformation detection unit, wherein the electric suction unit is arranged at the end of the third moving unit to suck the chip, and the deformation detection unit is arranged at one side of the electric suction unit to detect the degree of deformation of the sucked chip; The detection device is provided with a laser positioning unit and a plurality of binocular camera units, wherein the laser positioning unit is provided on one side of the grasping device to detect the current position of the electric suction unit and the position from the chip, and the plurality of binocular camera units are respectively provided on the base to detect the relative error between the electric suction unit and the current position of the chip and the position where the chip is placed; The control module controls the linkage operation of the grabbing device, the moving device and the detecting device, and adjusts the grabbing device and the moving device according to the comparison value between the real-time data detected by the detecting device and the preset data.

2. A detection method for the chip automatic suction and placement detection device according to claim 1, characterized in that: include: Step S1, the control module adjusts the action of the mobile device according to the chip position detected by the detection device, and controls the mobile device to move to a first preset position; Step S2, the control module controls the grabbing device to grab the chip and move it to a second preset position; Step S3, the control module controls the grasping device to place the chip at a preset position, and detects whether the chip placement position meets the preset requirements; Step S4, if the preset requirements are met, the current grabbing work is completed; if the preset requirements are not met, the control module controls the grabbing device to grab and place the chip again according to the data detected by the detection device until the preset requirements are met.

3. The detection method according to claim 2, characterized in that: In step S1, the control module is preset with the three-dimensional coordinates of the movable range of the mobile device, the three-dimensional coordinate points of the grasping device and the mobile device, and the maximum grasping range of the electric suction unit. When the electric suction unit grasps the chip, the center point of the electric suction unit corresponds to the detected center point of the chip, and the chip is graspable within the maximum grasping range of the electric suction unit, and the movement of the mobile device is controlled.

4. The detection method according to claim 3, characterized in that: In the step S1, it includes: Step S11, the control module controls the first mobile unit to drive the second mobile unit to move to the position of the first preset position coordinate x of the chip through X-axis movement according to the current position of the chip detected by the plurality of binocular camera units, and detects and corrects the angle between the second mobile unit and the center of the chip through the plurality of binocular camera units, wherein the theoretical angle value is set as A0, and the actual angle value is set as A1, If 99%A0≤A1≤101%A0, the control module determines that the actual angle value does not need to be corrected; If 98%A0≥A1 or 102%A0≤A1, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit to adjust the horizontal position until 99%A0≤A1≤101%A0; Step S12, the control module controls the second mobile unit to drive the third mobile unit to move to the position of the first preset position coordinate point y of the chip through Y-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the third mobile unit and the center of the chip through the binocular camera units, wherein the theoretical angle value is set as B0 and the actual angle value is set as B1. If 99%B0≤B1≤101%B0, the control module determines that the actual angle value does not need to be corrected; If 98%B0≥B1 or 102%B0≤B1, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit to adjust the longitudinal horizontal position until 99%B0≤B1≤101%B0; Step S13, the control module controls the third moving unit to drive the electric suction unit to move to the position of the first preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit, wherein the theoretical graspable distance value is set as D0, and the actual distance value is set as D1. If 10% D0<D1<D0, the control module determines that the actual distance value does not need to be corrected; If D1≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit to adjust the vertical position until 10%D0<D1<D0; If 10%D0≥D1, the control module determines that the electric suction unit is too close to the chip, controls the third moving unit to stop urgently, and outputs an alarm prompt.

5. The detection method according to claim 4, characterized in that: In step S2, after the control module determines that the electric suction unit has moved to the first preset position coordinates (x, y, z), the control module controls the electric suction unit to grab the chip, and the deformation detection unit compares the flatness of the chip before grabbing with the flatness after grabbing to detect whether the chip deformation is within a preset reasonable range, and adjusts the suction force of the electric suction unit according to the comparison result. Set the chip flatness detected before grabbing to P0, set the chip flatness detected after grabbing to P1, and set the chip flatness preset reasonable deformation to P0±P2. If P0-P2<P1<P0+P2, the control module determines that the current chip deformation is within a preset reasonable range, and the suction force of the electric suction unit does not need to be adjusted; If P1≥P0+P2 or P1≤P0-P2, the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit needs to be adjusted; The minimum suction force of the electric suction unit to grab the chip and fix it is set to PGP1, the maximum suction force that the electric suction unit can generate is set to PGP3, the suction force currently generated by the electric suction unit is set to PGP2, and the preset suction force generated by the electric suction unit is set to PGP0. , When P1≥P0+P2 or P1≤P0-P2, the control module determines that the preset suction force PGP0 of the current electric suction unit is too large. At this time, PGP0=PGP2, and the current suction force PGP2 needs to be reduced until P0-P2<P1<P0+P2, at which time PGP2′ is obtained, and PGP1<PGP2′<PGP0.

6. The detection method according to claim 5, characterized in that: In step S3, the control module controls the third mobile unit to drive the electric suction unit that has grasped the chip to lift to a preset safety height position, and controls the first mobile unit to drive the second mobile unit to move to the position of the second preset position coordinate x of the chip through X-axis movement, and detects and corrects the center angle of the first mobile unit from the chip through the binocular camera units; Step S31, the control module controls the second mobile unit to drive the third mobile unit to move to the position of the second preset position coordinate point y of the chip through Y-axis movement, and detects and corrects the angle between the third mobile unit and the center of the chip through the binocular camera units; Step S32, the control module controls the third moving unit to drive the electric suction unit to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit; Step S33, after the control module determines that the electric suction unit has moved to the second preset position coordinates (x′, y′, z′), it controls the electric suction unit to place the chip, and detects and corrects the position of the chip through the binocular camera units.

7. The detection method according to claim 6, characterized in that: In step S4, the coordinates of the center point of the preset position are set to (x1, y1), and the coordinates of the center point of the current position are set to (x2, y2). If 99%x1≤x2≤101%x1, the control module determines that the coordinate point on the X-axis of the current position meets the preset requirements and no adjustment is required; If 98% < x2 or 102% x1 > x2, the control module determines that the coordinate point on the X-axis of the current position deviates from the preset coordinate point on the X-axis and needs to be adjusted; If 99%y1≤y2≤101%y1, the control module determines that the coordinate point on the Y axis of the current position meets the preset requirements and no adjustment is required; If 98%<y2 or 102%y1>y2, the control module determines that the coordinate point on the Y axis of the current position deviates from the preset coordinate point on the Y axis and needs to be adjusted; When 99%x1≤x2≤101%x1 and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and the current grasping work is completed.

8. The detection method according to claim 7, characterized in that: In step S4, when 98%<x2 or 102%x1>x2 or 98%<y2 or 102%y1>y2, the control module controls the mobile device to re-grasp and place the chip until 99%x1≤x2≤101%x1 and 99%y1≤y2≤101%y1, the control module determines that the current position coordinate point meets the preset requirements, and this grabbing work is completed.

9. The detection method according to claim 8, characterized in that: In step S4, the process of re-grasping and correcting is as follows: Step S41, the control module controls the first mobile unit to drive the second mobile unit to move to the position of the current third preset position coordinate x of the chip through X-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the second mobile unit and the center of the chip through the binocular camera units, and sets the actual angle value to A1′. If 99.5%A0≤A1′≤100.5%A0, the control module determines that the actual angle value does not need to be corrected; If 99%A0≥A1′ or 101%A0≤A1′, the control module determines that the actual angle value needs to be corrected, and controls the first mobile unit to adjust the horizontal position until 99.5%A0≤A1′≤100.5%A0; Step S42, the control module controls the second mobile unit to drive the third mobile unit to move to the position of the current third preset position coordinate point y of the chip through Y-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the angle between the third mobile unit and the center of the chip through the binocular camera units, and sets the actual angle value to B1′. If 99.5%B0≤B1′≤100.5%B0, the control module determines that the actual angle value does not need to be corrected; If 99%B0≥B1′ or 100%B0≤B1′, the control module determines that the actual angle value needs to be corrected, and controls the second mobile unit to adjust the longitudinal horizontal position until 99.5%B0≤B1′≤100.5%B0; Step S43, the control module controls the third moving unit to drive the electric suction unit to move to the position of the current third preset position coordinate point z of the chip through Z-axis movement according to the current position of the chip detected by the binocular camera units, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit, and sets the actual distance value as D1′. If 5% D0<D1′<D0, the control module determines that the actual distance value does not need to be corrected; If D1′≥D0, the control module determines that the actual distance value needs to be corrected, and controls the third mobile unit to adjust the vertical position until 5%D0<D1′<D0; If 5%D0≥D1′, ​​the control module determines that the electric suction unit is too close to the chip, controls the third mobile unit to stop urgently, and outputs an alarm prompt; Step S44, after the control module determines that the electric suction unit has moved to the current third preset position coordinate (x", y", z"), the control module controls the electric suction unit to grab the chip, and the deformation detection unit compares the flatness of the chip before grabbing with the flatness after grabbing, detects whether the chip deformation is within a preset reasonable range, and adjusts the suction force of the electric suction unit according to the comparison result, wherein the flatness of the chip detected before grabbing is set to P0, the flatness of the chip detected after grabbing is set to P1, and the preset reasonable deformation degree of chip flatness is set to P0± , If P0- <P1<P0+ , the control module determines that the current chip deformation is within a preset reasonable range, and the suction force of the electric suction unit does not need to be adjusted; If P1≥P0+ or P1≤P0- , the control module determines that the current chip deformation exceeds the preset reasonable range, and the suction force of the electric suction unit needs to be adjusted; When P1≥P0+ or P1≤P0- When P0- <P1<P0+ , at this time we get PGP2″, and PGP1<PGP2″<PGP2′.

10. The detection method according to claim 9, characterized in that: In step S4, the process of adjusting and moving the control module after grabbing the chip is as follows: Step S45, the control module controls the first mobile unit to drive the second mobile unit to move to the position of the second preset position coordinate x of the chip through X-axis movement, and detects and corrects the angle between the first mobile unit and the center of the chip through the binocular camera units; The control module controls the second mobile unit to drive the third mobile unit to move to the position of the second preset position coordinate point y of the chip through Y-axis movement, and detects and corrects the angle between the third mobile unit and the center of the chip through the binocular camera units; The control module controls the third moving unit to drive the electric suction unit to move to the position of the second preset position coordinate point z of the chip through Z-axis movement, and detects and corrects the distance between the electric suction unit and the center of the chip through the laser positioning unit; Step S46, after the control module determines that the electric suction unit has moved to the second preset position coordinates (x′, y′, z′), the control module controls the electric suction unit to place the chip, and detects and corrects the position of the chip through the binocular camera units. If the control module determines that the current position coordinate point meets the preset requirements, the current grabbing work is completed. If the control module determines that the current position coordinate point does not meet the preset coordinate placement requirements, the control module repeats step S4 until the control module determines that the current position coordinate point meets the preset coordinate placement requirements.

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