Display substrate and preparation method thereof, and display module

Abstract

The embodiments of the present disclosure provide a display substrate and a preparation method thereof, and a display module. The display substrate includes a binding area and a metal trace, the metal trace includes a first connection trace located in the binding area, and the display substrate also includes: a first connection trace and a first insulating layer sequentially arranged on one side of the base substrate; a plurality of binding pads and at least one auxiliary pad located on the side of the first insulating layer away from the base substrate, the plurality of binding pads are located in the binding area and are sequentially spaced along the first direction; the auxiliary pad is located in the binding area, each auxiliary pad is located between two adjacent binding pads, and the orthographic projection of the first connection trace on the base substrate is located within the range of the orthographic projection of the auxiliary pad on the base substrate in the first direction. According to the technical solution of the present disclosure, during the lamination process of the display substrate and the flexible circuit board, the auxiliary pad can buffer stress, protect the first connection trace, avoid micro-short circuits in the metal trace, and improve the tearing phenomenon in the binding area.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, and a display module. Background Art

[0002] Organic Light-Emitting Diode (OLED) is a display lighting technology that has gradually developed in recent years. Especially in the display industry, OLED display is considered to have broad application prospects due to its advantages such as high response, high contrast, and flexibility. For flexible OLED display devices, in order to reduce the thickness of the display device, the setting of touch wiring can adopt FMLOC (Flexible Multi-Layer On Cell) technology, that is, a touch structure layer is set on the OLED substrate to realize the touch function of the display panel. This can make the flexible display substrate thinner, more precise, and better in bending performance.

[0003] The OLED display substrate includes a display area and a binding area located on one side of the display area. The binding area is provided with a plurality of binding pads, which are bound and connected to the binding pins on the flexible circuit board to achieve the connection between the display substrate and the flexible circuit board.

[0004] In the prior art, the display substrate has problems such as poor touch function and easy tearing of the binding area. Summary of the invention

[0005] The embodiments of the present disclosure provide a display substrate and a method for preparing the same, and a display module to solve or alleviate one or more technical problems in the prior art.

[0006] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display substrate, including a display area and a frame area located on one side of the display area, the frame area including a wiring area and a binding area, the binding area is located on a side of the wiring area away from the display area, the display substrate further includes at least one metal wiring, the at least one metal wiring is located in the display area, the wiring area and the binding area, the metal wiring includes a first connecting wiring located in the binding area, and the display substrate further includes:

[0007] substrate substrate;

[0008] A first connecting trace is located on one side of the substrate base;

[0009] A first insulating layer is located on a side of the first connecting trace facing away from the substrate;

[0010] A plurality of binding pads are located on a side of the first insulating layer away from the substrate and in the binding area, and the plurality of binding pads are sequentially spaced and arranged along a first direction;

[0011] At least one auxiliary pad is located on a side of the first insulating layer away from the base substrate and in the binding area, the orthographic projection of each auxiliary pad on the base substrate is located between the orthographic projections of two adjacent binding pads on the base substrate, and the orthographic projection of the first connecting trace on the base substrate is located in the first direction within the range of the orthographic projection of the auxiliary pad on the base substrate.

[0012] In some possible implementations, the auxiliary pad and the binding pad are disposed in the same layer.

[0013] In some possible implementations, an orthographic projection of the auxiliary pad on the base substrate overlaps with an orthographic projection of at least two first connecting traces on the base substrate.

[0014] In some possible implementations, a size of the auxiliary pad in the second direction is equal to or greater than a size of the binding pad in the second direction, and the second direction is perpendicular to the first direction.

[0015] In some possible implementations, the metal routing also includes a second connecting routing, a third connecting routing, and a fourth connecting routing, the third connecting routing, the fourth connecting routing, and the first connecting routing are connected in sequence, the second connecting routing is located in the display area and the routing area, the third connecting routing and the fourth connecting routing are both located in the routing area, the second connecting routing and the third connecting routing are located in the same layer, and the second connecting routing and the third connecting routing are not connected in the film layer where they are located.

[0016] In some possible implementations, the second connection trace and the third connection trace are disposed on the same layer as the first connection trace, and the fourth connection trace and the binding pad are disposed on the same layer.

[0017] In some possible implementations, the display substrate further includes at least one touch electrode located in the display area, and the metal wiring is connected to the touch electrode.

[0018] In some possible implementations, the display substrate also includes a planar layer and a plurality of first electrodes, the planar layer being located on a side of the binding pad and the auxiliary pad that is away from the base substrate, and being located in the display area and the binding area, the plurality of first electrodes being located on a side of the planar layer that is away from the base substrate, and being located in the display area, the display substrate also includes an organic light-emitting layer located in the display area, the organic light-emitting layer being located on a side of the first electrode that is away from the base substrate, the display substrate also includes a second electrode layer and an encapsulation layer that are sequentially arranged on a side of the organic light-emitting layer that is away from the base substrate, and at least one touch electrode is located on a side of the encapsulation layer that is away from the base substrate.

[0019] In some possible implementations, the display substrate also includes a flat layer located in the binding area, the flat layer is located on the side of the binding pad and the auxiliary pad facing away from the base substrate, the flat layer is provided with a plurality of openings, each opening corresponds to each binding pad one by one, and the binding pad is exposed through the corresponding opening.

[0020] In some possible implementations, the display substrate further includes a thin film transistor located in the display area, the first connecting wire is disposed in the same layer as the gate electrode of the thin film transistor, and the auxiliary pad is disposed in the same layer as the source electrode and the drain electrode of the thin film transistor.

[0021] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display module, including the display substrate in any embodiment of the present disclosure.

[0022] In some possible implementations, the display module also includes a flexible circuit board, which includes multiple binding pins, and the multiple binding pins are bound and connected to multiple binding pads on the display substrate in a one-to-one correspondence, and the orthographic projection of the binding pins on the base substrate does not overlap with the orthographic projection of the auxiliary pads on the base substrate.

[0023] As a third aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a method for preparing a display substrate, wherein the display substrate includes a display area and a frame area located on one side of the display area, the frame area includes a routing area and a binding area, the binding area is located on a side of the routing area away from the display area, the display substrate further includes at least one metal routing line, the at least one metal routing line is located in the display area, the routing area and the binding area, the metal routing line includes a first connecting routing line located in the binding area, and the method for preparing the display substrate includes:

[0024] forming a first connecting trace on one side of the substrate;

[0025] forming a first insulating layer on a side of the first connecting wire facing away from the substrate;

[0026] A plurality of binding pads are formed on a side of the first insulating layer away from the base substrate, the plurality of binding pads are located in the binding area, and the plurality of binding pads are sequentially arranged at intervals along a first direction;

[0027] At least one auxiliary pad is formed on the side of the first insulating layer facing away from the base substrate, the auxiliary pad is located in the binding area, the orthographic projection of each auxiliary pad on the base substrate is located between the orthographic projections of two adjacent binding pads on the base substrate, and the orthographic projection of the first connecting trace on the base substrate is located in the first direction within the range of the orthographic projection of the auxiliary pad on the base substrate.

[0028] According to the technical solution of the disclosed embodiment, during the process of pressing the display substrate and the flexible circuit board by the pressure head of the crimping device, the auxiliary pad can play the role of buffering stress, reduce the pressure of the pressure head of the crimping device, reduce the damage of the conductive particles to the space between two adjacent binding pads, protect the first connecting line, avoid micro short circuits in the metal line, improve the tearing phenomenon in the binding area, and improve the performance of the display substrate.

[0029] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0031] Figure 1 A schematic plan view showing a large substrate before it is cut;

[0032] Figure 2 for Figure 1 A schematic plan view of a display substrate obtained after a large display substrate plate is cut;

[0033] Figure 3 for Figure 2 AA section diagram in;

[0034] Figure 4 A schematic diagram showing the bonding of the substrate and the flexible circuit board;

[0035] Figure 5 A schematic cross-sectional view showing the binding area during the binding process between the substrate and the flexible circuit board;

[0036] Figure 6 It is a schematic plan view showing a substrate in one embodiment of the present disclosure;

[0037] Figure 7 for Figure 6 AA section diagram in;

[0038] Figure 8 A schematic diagram showing the binding connection between a substrate and a flexible circuit board in one embodiment of the present disclosure;

[0039] Fig. 9 A schematic cross-sectional view showing a binding area during the binding process between a substrate and a flexible circuit board in one embodiment of the present disclosure;

[0040] Fig.10a It is a schematic diagram showing a first connection line formed in a substrate according to an embodiment of the present disclosure;

[0041] Fig.10b This is a schematic diagram showing a first insulating layer formed in a substrate according to an embodiment of the present disclosure.

[0042] Description of reference numerals:

[0043] 11. Display area; 12. Frame area; 121. Routing area; 122. Binding area; 13. Lighting test area; 20. Metal routing; 21. First connection routing; 22. Second connection routing; 23. Third connection routing; 24. Fourth connection routing; 25. Test routing; 31. Base substrate; 32. First insulating layer; 331. Binding pad; 332. Auxiliary pad; 34. Flat layer; 341. Opening; 35. Second insulating layer; 36. Third insulating layer; 40. Flexible circuit board; 41. Binding pin; 51. Conductive particles; 52. Indenter. DETAILED DESCRIPTION

[0044] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined arbitrarily without conflict. Therefore, the drawings and descriptions are considered to be illustrative in nature and not restrictive.

[0045] Figure 1 This is a schematic diagram showing a plan view of a large substrate before it is cut. Figure 2 for Figure 1 A schematic plan view of a display substrate obtained after a large display substrate plate is cut; Figure 3 for Figure 2 AA cross-section diagram in Figure 2, Figure 4 This is a schematic diagram showing the bonding of the substrate and the flexible circuit board. Figure 5 It is a schematic cross-sectional view showing the binding area during the binding process between the substrate and the flexible circuit board.

[0046] For flexible OLED display devices, in order to reduce the thickness of the display device, the touch wiring can be set using FMLOC (Flexible Multi-Layer On Cell) technology, that is, a touch structure layer is set on the OLED substrate to realize the touch function of the display panel. This can make the flexible display substrate thinner, more precise, and better in bending performance.

[0047] In order to reduce losses and save costs, it is necessary to pre-process the detection of touch wiring. Figure 1 The shown display substrate is cut into Figure 2 The touch line detection is performed before the display substrate is shown. Figure 1 , Figure 2 and Figure 3 As shown, the display substrate may include a display area 11 (AA area) and a frame area 12 located on one side of the display area 11, and the frame area 12 may include a wiring area 121 and a binding area 122. Figure 1As shown, the display substrate may further include a lighting test area 13. The metal trace 20 extends from the display area 11 through the trace area 121 and the binding area 122 to the lighting test area 13. The metal trace 20 is connected to the touch electrode of the display area 11, so the metal trace 20 can be called a touch trace. The display substrate further includes a plurality of binding pads 331, and the plurality of binding pads 331 are located in the binding area 122, and the plurality of binding pads 331 are arranged in sequence in the binding area 122.

[0048] like Figure 1 and Figure 2 As shown, the metal trace 20 includes a first connection trace 21, which is located in the binding area 122 and connected to the test trace 25 of the lighting test area 13. Figure 3 As shown, the display substrate includes a base substrate 31, a first connecting trace 21 located on one side of the base substrate 31, a first insulating layer 32 located on the side of the first connecting trace 21 away from the base substrate 31, and a binding pad 331 located on the side of the first insulating layer 32 away from the base substrate 31. The display substrate also includes a flat layer 34 located on the side of the binding pad 331 away from the base substrate 31, and the flat layer 34 is provided with a plurality of openings 341, each opening 341 corresponds to each binding pad 331 one by one, and each binding pad 331 is exposed through the corresponding opening 341. The orthographic projection of the first connecting trace 21 on the base substrate 31 is located between the orthographic projections of adjacent binding pads 331 on the base substrate 31. A test pin is provided at the end of the test trace 25. Figure 1 In the process, the metal trace 20 is tested by lighting the test pin. Figure 1 The middle cutting line cuts the large display substrate to obtain Figure 2 The display substrate is shown.

[0049] During the assembly of the display substrate, the display substrate and the flexible circuit board 40 need to be bound and connected, such as Figure 4 As shown, the binding pad 331 of the display substrate is bound and connected to the binding pin 41 on the flexible circuit board 40. Figure 5 As shown, a conductive film (ACF) is provided between the flexible circuit board 40 and the display substrate, and the binding pad 331 and the binding pin 41 are connected through the conductive particles 51 in the ACF. When the pressure head 52 of the crimping device is pressed, the force applied to each part of the pressure head 52 is consistent. During the pressing process of the crimping device, the conductive particles 51 are likely to damage the space between two adjacent binding pads 331, resulting in damage to the first connecting wire 21, causing a micro short circuit in the metal wire 20, affecting the touch function, and even causing the binding area 122 to tear (peeling), resulting in reliability corrosion.

[0050] Figure 6is a schematic plan view of a display substrate in one embodiment of the present disclosure, Figure 7 for Figure 6 AA cross-sectional diagram in FIG. In one embodiment, as Figure 6 As shown, the display substrate includes a display area 11 and a frame area 12 located on one side of the display area 11. The frame area 12 includes a routing area 121 and a binding area 122, the routing area 121 is close to the display area 11, and the binding area 122 is located on a side of the routing area 121 away from the display area 11. The display substrate includes at least one metal routing line 20, and at least one metal routing line 20 is located in the display area 11, the routing area 121, and the binding area 122. The metal routing line 20 includes a first connecting routing line 21, and the first connecting routing line 21 is located in the binding area 122.

[0051] like Figure 7 As shown, the display substrate further includes a base substrate 31, a first insulating layer 32, a plurality of binding pads 331 and at least one auxiliary pad 332. The first connecting trace 21 is located on one side of the base substrate 31. The first insulating layer 32 is located on the side of the first connecting trace 21 away from the base substrate 31. The plurality of binding pads 331 are located on the side of the first insulating layer 32 away from the base substrate 31 and located in the binding area 122, and the plurality of binding pads 331 are sequentially arranged at intervals along the first direction X. The auxiliary pad 332 is located on the side of the first insulating layer 32 away from the base substrate 31 and located in the binding area 122, and the orthographic projection of each auxiliary pad 332 on the base substrate 31 is located between the orthographic projections of two adjacent binding pads 331 on the base substrate 31. The orthographic projection of the first connecting trace 21 on the base substrate 31 is located within the range of the orthographic projection of the auxiliary pad 332 on the base substrate 31 in the first direction. The first direction X is the arrangement direction of the plurality of binding pads 331.

[0052] Understandably, Figure 6 The display area 11 shown in the figure only conveniently shows the shape of the display area 11, and does not limit the horizontal dimension of the display area 11 to be larger than the vertical dimension. In one embodiment, the display substrate may be rectangular, and the display substrate may include a long side and a short side, the long side dimension is larger than the short side dimension, and the first direction may be parallel to the direction where the short side of the display substrate is located.

[0053] It should be noted that the orthographic projection of the first connecting line 21 on the base substrate 31 may include a first direction range and a second direction range, and the orthographic projection of the auxiliary pad 332 on the base substrate 31 may include a first direction range and a second direction range. In the first direction, the orthographic projection of the first connecting line 21 on the base substrate 31 is located within the range of the orthographic projection of the auxiliary pad 332 on the base substrate 31. Here, the orthographic projection relationship between the first connecting line 21 and the auxiliary pad 332 in the second direction is not limited.

[0054] It should be understood that, in the first direction, the orthographic projection of the first connecting trace 21 on the base substrate 31 is located within the range of the orthographic projection of the auxiliary pad 332 on the base substrate 31. It can be understood that, in the first direction, the orthographic projection of the first connecting trace 21 on the base substrate 31 is located on the inner side of the boundary of the orthographic projection of the auxiliary pad 332 on the base substrate 31, or, the orthographic projection of the first connecting trace 21 on the base substrate 31 coincides with the orthographic projection of the auxiliary pad 332 on the base substrate 31.

[0055] Figure 8 This is a schematic diagram showing the binding connection between the substrate and the flexible circuit board in one embodiment of the present disclosure. Fig. 9 FIG. 1 is a cross-sectional schematic diagram showing a binding region during the binding process between a substrate and a flexible circuit board in an embodiment of the present disclosure. Figure 8 and Fig. 9 As shown, the display module may include a flexible circuit board 40, and the flexible circuit board 40 includes a plurality of binding pins 41. The plurality of binding pads 331 of the display substrate are used to correspond one-to-one with the plurality of binding pins 41 of the flexible circuit board 40. In the process of binding the display substrate and the flexible circuit board 40, as shown in FIG. Fig. 9 As shown, a pressing head 52 of a pressing device is required to press the display substrate and the flexible circuit board 40 so that the binding pad 331 and the binding pin 41 are bound and connected through the conductive particles 51 in the ACF.

[0056] In the disclosed embodiment, the auxiliary pad 332 is located on the side of the first insulating layer 32 away from the base substrate 31. Therefore, during the process of the pressure head 52 of the crimping device pressing the display substrate and the flexible circuit board 40, the auxiliary pad 332 is located between the conductive particles 51 of the ACF and the first connecting line. Therefore, during the pressing process, the auxiliary pad 332 can play a role in buffering stress, reduce the pressure of the pressure head 52 of the crimping device, reduce the damage of the conductive particles 51 to the space between two adjacent binding pads 331, protect the first connecting line 21, avoid micro short circuit of the metal line 20, improve the tearing phenomenon of the binding area 122, and improve the performance of the display substrate.

[0057] In one embodiment, the auxiliary pad 332 may be made of metal, which can enhance the stress buffering effect of the auxiliary pad 332 and improve the protection of the first connection line 21 .

[0058] Exemplarily, the thickness of the auxiliary pad 332 can be set as needed. For example, the thickness of the auxiliary pad 332 can be the same as the thickness of the binding pad 331. It should be noted that the thickness of B can be the dimension of B in a direction perpendicular to the substrate.

[0059] For example, Figure 6As shown, the substrate 31 may include a substrate and a buffer layer located on the side of the substrate facing the first connection trace 21. The substrate may be made of a flexible material, such as polyimide. Thus, the display substrate may be a flexible display substrate.

[0060] In one embodiment, the auxiliary pad 332 and the binding pad 331 can be disposed in the same layer. Thus, the auxiliary pad 332 and the binding pad 331 can be formed simultaneously through a single patterning process, without adding a new process, and without increasing the cost of the display substrate.

[0061] In one embodiment, Figure 7 As shown, the display substrate may further include a second insulating layer 35 and a third insulating layer 36. The second insulating layer 35 is located between the base substrate 31 and the first connecting trace 21. The third insulating layer 36 may be located between the first connecting trace 21 and the first insulating layer 32. Exemplarily, the second insulating layer 35 may be called a first gate insulating layer (GI1), the third insulating layer 36 may be called a second gate insulating layer (GI2), and the first insulating layer 32 may be called an interlayer insulating layer (ILD). Exemplarily, an auxiliary pad 332 may be disposed between the third insulating layer 36 and the first insulating layer 32. It should be noted that as long as the auxiliary pad 332 is disposed between the first connecting trace 21 and the flexible circuit board, the auxiliary pad 332 may play a role in buffering stress and protecting the first connecting trace 21 during the process of crimping the pressure head to the binding area.

[0062] In one embodiment, Figure 7 As shown, the display substrate may further include a flat layer 34, which may be located on the side of the binding pad 331 and the auxiliary pad 332 away from the base substrate 31. The flat layer 34 may be located in the binding area 122, and the flat layer 34 is provided with a plurality of openings 341, each opening 341 corresponds to each binding pad 331, and the binding pad 331 is exposed through the corresponding opening 341. The flat layer 34 may further play a role in buffering stress, reducing the pressure of the device pressure head 52, and reducing the damage of the ACF particles to the binding area 122. The flat layer 34 may also play a protective role for the binding pad 331 and the auxiliary pad 332.

[0063] In one embodiment, Figure 6 As shown, the orthographic projection of the auxiliary pad 332 on the base substrate 31 overlaps with the orthographic projection of at least two first connection traces 21 on the base substrate 31. In such a structure, one auxiliary pad 332 can protect at least two first connection traces 21, which can reduce the number of auxiliary pads 332 and facilitate the arrangement of metal wires in the binding area 122.

[0064] from Figure 6It can be seen that the number of metal traces 20 can be multiple, and correspondingly, the number of first connection traces 21 can also be multiple. Multiple first connection traces 21 can be set within the range of the orthographic projection of an auxiliary pad 332 on the base substrate 31, and the number of first connection traces 21 set within the range of the orthographic projection of an auxiliary pad 332 on the base substrate 31 can be set as needed.

[0065] Exemplarily, the number of auxiliary pads 332 may be at least two, and the orthographic projection of each auxiliary pad 332 on the base substrate 31 may be located between the orthographic projections of two adjacent binding pads 331 on the base substrate 31. At least one first connecting trace 21 may be set within the range of the orthographic projection of each auxiliary pad 332 on the base substrate 31.

[0066] In one embodiment, the size of the auxiliary pad 332 in the second direction is equal to or greater than the size of the binding pad 331 in the second direction, and the second direction is perpendicular to the first direction. Thus, during the lamination process, the auxiliary pad 332 can protect the entire area between two adjacent binding pads 331 to prevent the binding area 122 from tearing.

[0067] In one embodiment, Figure 6 As shown, the metal wiring 20 may also include a second connection wiring 22, a third connection wiring 23 and a fourth connection wiring 24, and the third connection wiring 23, the fourth connection wiring 24 and the first connection wiring 21 are connected in sequence. The second connection wiring 22 is located in the display area 11 and the wiring area 121, the third connection wiring 23 and the fourth connection wiring 24 are both located in the wiring area 121, the second connection wiring 22 and the third connection wiring 23 are located in the same layer, and the second connection wiring 22 and the third connection wiring 23 are not connected in the film layer where they are located. The second connection wiring 22 and the third connection wiring 23 are arranged in the same layer, and the second connection wiring 22 and the third connection wiring 23 are not connected in the film layer where they are located, so that it is convenient to arrange a driver integrated circuit chip (DIC) between the second connection wiring 22 and the third connection wiring 23, so that the second connection wiring 22 and the third connection wiring 23 can be electrically connected through the DIC.

[0068] Exemplarily, the second connection trace 22 and the third connection trace 23 can be arranged in the same layer as the first connection trace 21, and the fourth connection trace 24 can be arranged in the same layer as the binding pad 331. The third connection trace 23 and the fourth connection trace 24 can be connected through a via penetrating the first insulating layer 32, and the fourth connection trace 24 and the first connection trace 21 can be connected through another via penetrating the first insulating layer 32. Dividing the metal trace 20 into multiple sections of connection traces, and each section of the connection trace is arranged in a different layer, can facilitate wiring at different layers. Reduce the difficulty of wiring design.

[0069] In one embodiment, the display substrate may further include at least one touch electrode, and the at least one touch electrode may be located in the display area 11, and the metal wiring 20 is connected to the touch electrode. Exemplarily, the second connecting wiring 22 may be connected to the touch electrode. With such a structure, the metal wiring 20 may be used as a touch wiring of the touch electrode, and the technical solution of the embodiment of the present disclosure may avoid micro short circuits in the metal wiring 20, thereby avoiding micro short circuits in the touch wiring and improving touch performance.

[0070] In one embodiment, the flat layer 34 may also be located in the display area 11, and the display substrate may further include a thin film transistor located between the base substrate 31 and the flat layer 34. The thin film transistor may be located in the display area 11. The display substrate may further include a plurality of first electrodes, which are located on the side of the flat layer 34 away from the base substrate 31 and located in the display area 11. Each first electrode may be connected to a corresponding thin film transistor. The display substrate also includes an organic light-emitting layer located in the display area 11, and the organic light-emitting layer is located on the side of the first electrode away from the base substrate 31. The display substrate also includes a second electrode layer and an encapsulation layer which are sequentially arranged on the side of the organic light-emitting layer away from the base substrate 31, and at least one touch electrode is located on the side of the encapsulation layer away from the base substrate 31. Such a display substrate adopts FMLOC technology, and the touch electrode is arranged on the substrate, which can make the display substrate thinner, more precise, and have better bending performance.

[0071] Exemplarily, the first connection trace 21 is disposed on the same layer as the gate electrode of the thin film transistor, and the binding pad 331 and the auxiliary pad 332 are disposed on the same layer as the source electrode and the drain electrode of the thin film transistor.

[0072] The embodiments of the present disclosure further provide a display module, which may include the display substrate in any embodiment of the present disclosure.

[0073] In one embodiment, Figure 8 and Fig. 9 As shown, the display module may further include a flexible circuit board 40, and the flexible circuit board 40 may include a plurality of binding pins 41. The plurality of binding pins 41 are bound and connected to the plurality of binding pads 331 on the display substrate in a one-to-one correspondence, and the orthographic projection of the binding pins 41 on the base substrate 31 does not overlap with the orthographic projection of the auxiliary pad 332 on the base substrate 31. In such a structure, the flexible circuit board 40 is not provided with binding pins 41 in the area where the auxiliary pad 332 is located, and the flexible circuit board 40 forms a hollow area at the position corresponding to the auxiliary pad 332, which can provide more space for the conductive particles 51 of the ACF, further avoiding the conductive particles 51 from damaging the binding area 122 during the binding process, and improving the poor tearing of the binding area 122.

[0074] In an exemplary embodiment, the first insulating layer, the second insulating layer, the third insulating layer, and the buffer layer may be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multilayer, or a composite layer. The buffer layer is used to improve the water and oxygen resistance of the substrate. The gate electrode, the source electrode, the drain electrode, and the metal wiring may be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single layer structure, or a multilayer composite structure, such as Ti / Al / Ti, etc.

[0075] The embodiment of the present disclosure also provides a method for preparing a display substrate. The display substrate includes a display area and a frame area located on one side of the display area, the frame area includes a routing area and a binding area, and the binding area is located on a side of the routing area away from the display area. The display substrate also includes at least one metal routing line, the at least one metal routing line is located in the display area, the routing area, and the binding area, and the metal routing line includes a first connecting routing line located in the binding area.

[0076] The method for preparing a display substrate comprises:

[0077] S11, forming a first connecting line on one side of the substrate;

[0078] S12, forming a first insulating layer on a side of the first connecting line away from the substrate;

[0079] S13, forming a plurality of binding pads on a side of the first insulating layer away from the substrate, the plurality of binding pads being located in the binding area, and the plurality of binding pads being sequentially spaced apart and arranged along the first direction;

[0080] S14. At least one auxiliary pad is formed on the side of the first insulating layer away from the base substrate, the auxiliary pad is located in the binding area, the orthographic projection of each auxiliary pad on the base substrate is located between the orthographic projections of two adjacent binding pads on the base substrate, and the orthographic projection of the first connecting trace on the base substrate is located in the range of the orthographic projection of the auxiliary pad on the base substrate in the first direction.

[0081] The technical solution of the embodiment of the present disclosure is further explained below through the preparation process of the display substrate in one embodiment of the present disclosure. It can be understood that the "patterning" mentioned in this article, when the patterned material is an inorganic material or metal, "patterning" includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist, and when the patterned material is an organic material, "patterning" includes processes such as mask exposure and development, and the evaporation, deposition, coating, and coating mentioned in this article are all mature preparation processes in the relevant technology.

[0082] The preparation process of the display substrate may include:

[0083] S11, forming a first connecting line on one side of the substrate. This step may include: forming a second insulating layer 35 on one side of the substrate; depositing a first metal film on the side of the second insulating layer 35 away from the substrate 31, and patterning the first metal film to form a first connecting line 21, such as Fig.10a As shown, Fig.10a This is a schematic diagram showing a first connection line formed in a substrate according to an embodiment of the present disclosure. The first connection line 21 is located in the binding area.

[0084] S12, forming a first insulating layer on the side of the first connecting line away from the substrate. This step may include: forming a second insulating layer 35 on the side of the first connecting line 21 away from the substrate, and forming a first insulating layer 32 on the side of the second insulating layer 35 away from the substrate. Fig.10b As shown, Fig.10b This is a schematic diagram showing a first insulating layer formed in a substrate according to an embodiment of the present disclosure.

[0085] S13 and S14, forming a plurality of bonding pads and at least one auxiliary pad on the side of the first insulating layer away from the base substrate. This step may include: forming a second metal film on the side of the first insulating layer 32 away from the base substrate 31, patterning the second metal film to form a plurality of bonding pads 331 and at least one auxiliary pad 332, such as Figure 7 As shown. A plurality of binding pads 331 are located in the binding area 122, and the plurality of binding pads 331 are arranged in sequence along the first direction. The auxiliary pads 332 are located in the binding area 122, and the orthographic projection of each auxiliary pad 332 on the base substrate 31 is located between the orthographic projections of two adjacent binding pads 331 on the base substrate 31, and the orthographic projection of the first connecting trace 21 on the base substrate 31 is located in the first direction within the range of the orthographic projection of the auxiliary pad 332 on the base substrate 31.

[0086] A flat layer 34 is formed on the side of the plurality of binding pads 331 and the at least one auxiliary pad 332 away from the base substrate 31. The flat layer 34 is provided with a plurality of openings 341. The plurality of openings 341 correspond to the plurality of binding pads 331 one by one. Each binding pad 331 is exposed through the corresponding opening 341. Figure 7 The planar layer 34 may be made of an organic material, such as a resin material.

[0087] Based on the inventive concept of the above embodiments, the embodiments of the present disclosure further provide a display device, which includes a display substrate using the above embodiments. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0088] In one embodiment, Figure 8 As shown, the display substrate also includes a flexible circuit board 40, which includes a plurality of binding pins 41. The plurality of binding pins 41 are bound and connected to a plurality of binding pads 331 on the display substrate in a one-to-one correspondence, and the orthographic projection of the binding pins 41 on the base substrate does not overlap with the orthographic projection of the auxiliary pads 332 on the base substrate.

[0089] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0090] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0091] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0092] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0093] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0094] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that: The display substrate includes a display area and a frame area located on one side of the display area, the frame area includes a wiring area and a binding area, the binding area is located on a side of the wiring area away from the display area, the display substrate also includes at least one metal wiring, the at least one metal wiring is located in the display area, the wiring area and the binding area, the metal wiring includes a first connecting wiring located in the binding area, and the display substrate also includes: substrate substrate; The first connecting trace is located on one side of the substrate; A first insulating layer, located on a side of the first connecting wire away from the substrate; A plurality of binding pads are located on a side of the first insulating layer away from the base substrate and located in the binding area, and the plurality of binding pads are sequentially arranged at intervals along a first direction; At least one auxiliary pad is located on a side of the first insulating layer away from the base substrate and in the binding area, the orthographic projection of each of the auxiliary pads on the base substrate is located between the orthographic projections of two adjacent binding pads on the base substrate, and the orthographic projection of the first connecting trace on the base substrate is located within the range of the orthographic projection of the auxiliary pad on the base substrate in the first direction.

2. The display substrate according to claim 1, characterized in that: The auxiliary pad is arranged in the same layer as the binding pad.

3. The display substrate according to claim 1, characterized in that: The orthographic projection of the auxiliary pad on the base substrate overlaps with the orthographic projections of at least two of the first connecting traces on the base substrate.

4. The display substrate according to claim 1, characterized in that: The size of the auxiliary pad in the second direction is equal to or greater than the size of the binding pad in the second direction, and the second direction is perpendicular to the first direction.

5. The display substrate according to claim 1, characterized in that: The metal routing also includes a second connecting routing, a third connecting routing and a fourth connecting routing, the third connecting routing, the fourth connecting routing and the first connecting routing are connected in sequence, the second connecting routing is located in the display area and the routing area, the third connecting routing and the fourth connecting routing are both located in the routing area, the second connecting routing and the third connecting routing are located in the same layer, and the second connecting routing and the third connecting routing are not connected in the film layer where they are located.

6. The display substrate according to claim 5, characterized in that: The second connection line and the third connection line are arranged on the same layer as the first connection line, and the fourth connection line is arranged on the same layer as the binding pad.

7. The display substrate according to claim 1, characterized in that: The display substrate further includes at least one touch electrode located in the display area, and the metal wiring is connected to the touch electrode.

8. The display substrate according to claim 7, characterized in that: The display substrate also includes a planar layer and a plurality of first electrodes, wherein the planar layer is located on a side of the binding pad and the auxiliary pad facing away from the base substrate, and is located in the display area and the binding area, the plurality of first electrodes are located on a side of the planar layer facing away from the base substrate, and are located in the display area, the display substrate also includes an organic light-emitting layer located in the display area, the organic light-emitting layer is located on a side of the first electrode facing away from the base substrate, the display substrate also includes a second electrode layer and an encapsulation layer sequentially arranged on a side of the organic light-emitting layer facing away from the base substrate, and the at least one touch electrode is located on a side of the encapsulation layer facing away from the base substrate.

9. The display substrate according to any one of claims 1 to 8, characterized in that: The display substrate also includes a flat layer located in the binding area, the flat layer is located on the side of the binding pad and the auxiliary pad away from the base substrate, the flat layer is provided with a plurality of openings, each of the openings corresponds to each of the binding pads, and the binding pads are exposed through the corresponding openings.

10. The display substrate according to claim 1, characterized in that: The display substrate further comprises a thin film transistor located in the display area, the first connecting wire is arranged in the same layer as the gate electrode of the thin film transistor, and the auxiliary pad is arranged in the same layer as the source electrode and the drain electrode of the thin film transistor.

11. A display module, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 10.

12. The display module according to claim 11, characterized in that: It also includes a flexible circuit board, which includes a plurality of binding pins, which are bound and connected to a plurality of binding pads on the display substrate in a one-to-one correspondence, and the orthographic projection of the binding pins on the base substrate does not overlap with the orthographic projection of the auxiliary pad on the base substrate.

13. A method for preparing a display substrate, characterized in that: The display substrate includes a display area and a frame area located on one side of the display area, the frame area includes a routing area and a binding area, the binding area is located on a side of the routing area away from the display area, the display substrate also includes at least one metal routing line, the at least one metal routing line is located in the display area, the routing area and the binding area, the metal routing line includes a first connecting routing line located in the binding area, and the manufacturing method of the display substrate includes: forming the first connecting trace on one side of the substrate; forming a first insulating layer on a side of the first connecting wire away from the substrate; A plurality of binding pads are formed on a side of the first insulating layer away from the base substrate, the plurality of binding pads are located in the binding area, and the plurality of binding pads are sequentially spaced apart and arranged along a first direction; At least one auxiliary pad is formed on the side of the first insulating layer facing away from the base substrate, the auxiliary pad is located in the binding area, the orthographic projection of each auxiliary pad on the base substrate is located between the orthographic projections of two adjacent binding pads on the base substrate, and the orthographic projection of the first connecting trace on the base substrate is located within the range of the orthographic projection of the auxiliary pad on the base substrate in the first direction.

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