Flexible circuit board and electronic product

Abstract

The present invention discloses a flexible circuit board and an electronic product. The flexible circuit board comprises: a substrate, at least one circuit layer arranged on the substrate, and a protective film arranged on the side of the at least one circuit layer away from the substrate; it also comprises at least one adhesive layer, the adhesive layer is arranged between the circuit layers, or between the circuit layer and the substrate, or between the protective film and the circuit layer; the flexible circuit board comprises a repair area; at least one first repair layer is arranged in the repair area, the first repair layer comprises a repair material, or the adhesive layer and / or the protective film in the repair area are doped with a repair material; wherein the glass transition temperature of the repair material is lower than the set temperature, and the repair material is used to repair the cracks when cracks appear in the adhesive layer or the protective film. The embodiments of the present invention improve the service life of the flexible circuit board.

Description

Technical Field

[0001] The present invention relates to the field of circuit technology, and in particular to a flexible circuit board and an electronic product. Background Art

[0002] With the development of electronic technology, flexible circuit boards are increasingly used in electronic products. Flexible circuit boards need to be bonded to electronic products through a bonding process. During the later use of flexible circuit boards, some film layers will crack due to repeated bending, which will affect the service life of the flexible circuit boards. Summary of the invention

[0003] The present invention provides a flexible circuit board and an electronic product, so as to repair cracks in an adhesive layer and a protective film of the flexible circuit board and improve the service life of the flexible circuit board.

[0004] According to one aspect of the present invention, there is provided a flexible circuit board, comprising:

[0005] A substrate, at least one circuit layer disposed on the substrate, and a protective film disposed on the side of the at least one circuit layer away from the substrate; and at least one adhesive layer disposed between the circuit layers, or between the circuit layer and the substrate, or between the protective film and the circuit layer;

[0006] The flexible circuit board includes a repair area; at least one first repair layer is arranged in the repair area, and the first repair layer includes a repair material, or the adhesive layer and / or the protective film in the repair area is doped with a repair material; wherein the glass transition temperature of the repair material is lower than a set temperature, and the repair material is used to repair cracks when cracks appear in the adhesive layer or the protective film.

[0007] Optionally, the first repair layer is in a grid shape;

[0008] The adhesive layer adjacent to the first repair layer is filled in the mesh holes of the first repair layer, and / or the protective film adjacent to the first repair layer is filled in the mesh holes of the first repair layer.

[0009] Optionally, when the first repair layer is disposed between the adhesive layer and the circuit layer, the first repair layer is in direct contact with the circuit layer.

[0010] Optionally, the glass transition temperature of the repair material is set to be less than or equal to 80 degrees.

[0011] Optionally, the repair material includes polyurethane resin, polyrotaxane, silicone resin, cyclodextrin or polyphenylene ether.

[0012] Optionally, the thickness of the first repair layer is between 10 microns and 100 microns.

[0013] Optionally, the flexible circuit board includes a reinforcement area, and the reinforcement area is provided with a reinforcement layer;

[0014] The repair area partially overlaps with the reinforcement area, or the repair area is the entire area of ​​the flexible circuit board.

[0015] Optionally, the flexible circuit board includes at least two circuit layers, the at least two circuit layers are arranged on both sides of the substrate, and the flexible circuit board includes a first protective film and a second protective film;

[0016] The substrate and the at least two circuit layers are arranged between the first protective film and the second protective film;

[0017] The first repair layer is disposed between the first protective film and the at least two circuit layers, the first repair layer is disposed between the second protective film and the at least two circuit layers, or both the first protective film and the second protective film are doped with repair materials.

[0018] Optionally, at least one second repair layer is provided in the repair area, the second repair layer includes a repair capsule, the repair capsule includes an insulating shell and conductive particles encapsulated in the insulating shell; the second repair layer is provided on the surface of the circuit layer, the circuit layer includes a plurality of wires, the second repair layer includes a plurality of repair lines, each repair line corresponds to a wire, and the repair line is used to repair the wire when cracks appear in the corresponding wire.

[0019] According to another aspect of the present invention, there is provided an electronic product comprising the flexible circuit board described in any embodiment of the present invention.

[0020] In the embodiment of the present invention, at least one first repair layer is arranged in the repair area of ​​the flexible circuit board. The first repair layer includes a repair material, or the adhesive layer and / or the protective film in the repair area are doped with the repair material. Since the glass transition temperature of the repair material is relatively low, the glass transition temperature of the repair material can be easily reached during use. After the repair material reaches the glass transition temperature, it can be filled into the cracks when cracks appear in the adhesive layer or the protective film, thereby repairing the adhesive layer and the protective film and avoiding cracks in the protective film and the adhesive layer that affect the service life of the flexible circuit board.

[0021] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 is a schematic diagram of a flexible circuit board provided by an embodiment of the present invention;

[0024] Figure 2 is a schematic diagram of a film layer in a repair area of ​​a flexible circuit board provided by an embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention;

[0026] Figure 4 yes Figure 3 A schematic plan view of the bonding layer of the flexible circuit board;

[0027] Figure 5 is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention;

[0028] Figure 6 It is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention;

[0029] Figure 7 is a schematic diagram of another flexible circuit board provided by an embodiment of the present invention;

[0030] Figure 8 It is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by the present invention;

[0031] Fig. 9 It is a plan view schematic diagram of a second repair layer provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0034] An embodiment of the present invention provides a flexible circuit board. Figure 1 is a schematic diagram of a flexible circuit board provided by an embodiment of the present invention, Figure 2 is a schematic diagram of a film layer in a repair area of ​​a flexible circuit board provided by an embodiment of the present invention, with reference to Figure 1 and Figure 2 , flexible circuit boards include:

[0035] A substrate 10, at least one circuit layer 20 disposed on the substrate 10, and a protective film 30 disposed on the side of the at least one circuit layer 20 away from the substrate 10; and at least one adhesive layer 40, the adhesive layer 40 is disposed between the circuit layers 20, or between the circuit layer 20 and the substrate 10, or between the protective film 30 and the circuit layer 20;

[0036] The flexible circuit board includes a repair area 100; at least one first repair layer 50 is arranged in the repair area 100, and the first repair layer 50 includes a repair material, or the adhesive layer 40 and / or the protective film 30 in the repair area 100 are doped with the repair material; wherein the glass transition temperature of the repair material is lower than the set temperature, and the repair material is used to repair cracks when cracks appear in the adhesive layer or the protective film.

[0037] Among them, the repair area 100 can be an area in the flexible circuit board that is easily subjected to external forces to produce defects such as cracks. The repair area 100 can be the entire area of ​​the flexible circuit board, or it can be a partial area of ​​the flexible circuit board. The substrate 10 can be made of PI and other materials. The flexible circuit board can include one, two or more circuit layers 20, and the circuit layer 20 can be formed of copper or other metals. An adhesive layer 40 can be included between the substrate 10 and the circuit layer 20, and an adhesive layer 40 can also be included between the protective film 30 and the circuit layer 20, and an adhesive layer 40 can also be included between the circuit layer 20 and the circuit layer 20. The adhesive layer 40 plays a bonding role, and is used to bond the circuit layer 20 to the substrate 10, the circuit layer 20 to the circuit layer 20, and the protective film 30 to the circuit layer 20. The protective film 30 plays a protective role and is arranged on the outermost layer of the entire flexible circuit board.

[0038] The first repair layer 50 includes a repair material, and the glass transition temperature of the repair material is lower than the set temperature, that is, the glass transition temperature of the repair material is low, and the glass transition temperature of the repair material is easily reached during use. After reaching the glass transition temperature, the repair material has a certain fluidity and can be filled into the cracks of the adjacent adhesive layer 40 or protective film 30 to repair the adhesive layer 40 and the protective film 30. Alternatively, by doping the repair material into the adhesive layer 40 and the protective film 30, after reaching the glass transition temperature, the repair material can flow into the cracks of the adhesive layer 40 and the protective film 30 to repair the cracks in the adhesive layer 40 and the protective film 30.

[0039] In the embodiment of the present invention, at least one first repair layer 50 is arranged in the repair area 100 of the flexible circuit board. The first repair layer 50 includes a repair material, or the adhesive layer 40 and / or the protective film 30 in the repair area 100 are doped with the repair material. Since the glass transition temperature of the repair material is relatively low, it is easy to reach the glass transition temperature of the repair material during use. After the repair material reaches the glass transition temperature, it can be filled into the cracks when cracks appear in the adhesive layer 40 or the protective film 30, thereby repairing the adhesive layer 40 and the protective film 30, and avoiding cracks in the protective film 30 and the adhesive layer 40 that affect the service life of the flexible circuit board.

[0040] It should be noted that Figure 2 The position of the circuit layer 20 is only shown for example, and the wires of the circuit layer 20 are not shown. In fact, the gaps between the wires of the circuit layer 20 will expose the adhesive layer 40 on the side of the circuit layer 20 adjacent to the substrate 10 .

[0041] Figure 3 is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention, Figure 4 yes Figure 3 Schematic diagram of the bonding layer of the flexible circuit board. Figure 5 is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention. Figure 3-Figure 5 The first repair layer 50 is in a grid shape; the adhesive layer 40 adjacent to the first repair layer 50 is filled in the grid holes of the first repair layer 50, and / or the protective film 30 adjacent to the first repair layer 50 is filled in the grid holes of the first repair layer 50.

[0042] Specifically, refer to Figure 3 and Figure 4 , the adhesive layer 40 adjacent to the first repair layer 50 is filled in the grid holes of the first repair layer 50. On the one hand, the first repair layer 50 has a larger contact area with the adhesive layer 40 and is in contact with the inside of the adhesive layer 40, which can better repair the cracks in the adhesive layer 40 or the protective film 30. On the other hand, the first repair layer 50 and the adhesive layer 40 are located in the same film layer, and the sum of the thicknesses of the two is smaller, so that after adding the first repair layer 50, the thickness of the flexible circuit board is smaller. In addition, the adhesive layer 40 and the first repair layer 50 are interlocked with each other, and the adhesive layer 40 also plays a bonding role on the first repair layer 50, so that the first repair layer 50 can be directly bonded to the surface of the protective film 30 or the surface of the circuit layer 20.

[0043] In addition, reference Figure 5 , the protective film 30 adjacent to the first repair layer 50 is filled in the mesh holes of the first repair layer 50. On the one hand, the repair layer 50 has a larger contact area with the protective film 30 and is in contact with the inside of the protective film 30, which can better repair the cracks in the protective film 30. On the other hand, the first repair layer 50 and the protective film 30 are located in the same film layer, and the sum of the thicknesses of the two is smaller, so that after adding the first repair layer 50, the thickness of the flexible circuit board is smaller. The first repair layer 50 and the protective film 30 are embedded together, and there is no need to set an adhesive layer 50 between the first repair layer 50 and the protective film 30 to attach the first repair layer 50 to the surface of the protective film 30.

[0044] In addition, the film thickness of the protective film 30 can be greater than the film thickness of the first repair layer 50. When the protective film 30 adjacent to the first repair layer 50 is filled in the grid holes of the first repair layer 50, only a partial area of ​​the protective film 30 is filled in the grid holes of the first repair layer 50. The side of the protective film 30 away from the circuit layer 20 does not expose the first repair layer 50, that is, the outermost side of the flexible circuit board is a complete protective film 30, which can ensure that the protective film 30 better protects the flexible circuit board.

[0045] It should be noted that Figure 4 The shape of the mesh holes of the first repair layer 50 is shown as a rectangle for exemplary purposes only, and is not a limitation of the present invention. In other embodiments, the shape of the mesh holes of the first repair layer 50 may also be a circle, an ellipse, a parallelogram, a rhombus, or other polygons. Figure 2 and Figure 3 The position of the circuit layer 20 is only shown for example, and the wires of the circuit layer 20 are not shown.

[0046] In addition, the first repair layer 50 may not be set in a grid shape. When the first repair layer 50 is set between the adhesive layer 40 and the circuit layer 20, the first repair layer 50 can be adhered to the surface of the circuit layer 20 through the adhesive layer 40, or it can be adhered to the surface of the circuit layer 20 in other forms.

[0047] Optional, continue to refer to Figure 1 When the first repair layer 50 is disposed between the adhesive layer 40 and the circuit layer 20 , the first repair layer 50 is in direct contact with the circuit layer 20 .

[0048] Specifically, the first repair layer 50 can be directly pressed onto the surface of the circuit layer 20 by a high temperature pressing process, without providing an adhesive layer 40 between the first repair layer 50 and the circuit layer 20, thereby ensuring that the flexible circuit board has a smaller thickness.

[0049] Optionally, the set temperature is less than or equal to 80 degrees. This setting allows the flexible circuit board to easily reach the glass transition temperature of the repair material during use, and the crack repair of the bonding layer 40 or the protective film 30 can be achieved without special processes. Exemplarily, the set temperature can be 60 degrees, 50 degrees, 45 degrees or 40 degrees, etc.

[0050] Optionally, the repair material includes polyurethane resin, polyrotaxane, silicone resin, cyclodextrin or polyphenylene ether.

[0051] Specifically, the above materials all have a low glass transition temperature, a simple preparation process, and high flexibility. The above materials are used to ensure that the flexible circuit board has good flexibility, and under the premise of a simple preparation process, the flexible circuit board can be repaired.

[0052] Optionally, the first repair layer 50 has a thickness ranging from 10 micrometers to 100 micrometers.

[0053] Specifically, when the thickness of the first repair layer 50 is small, the difficulty of the preparation process is high, and it is not conducive to the repair of the adhesive layer 40 and the protective film 30. When the thickness of the first repair layer 50 is large, the thickness of the flexible circuit board is greatly increased, which may affect the flexibility and use of the flexible circuit board. By setting the thickness of the first repair layer 50 to include 10 microns-100 microns, it is ensured that the first repair layer 50 can better repair the adhesive layer 40 and the protective film 30, while reducing the difficulty of the manufacturing process, ensuring that the flexible circuit board has a small thickness.

[0054] Figure 6is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by an embodiment of the present invention. Figure 6 The flexible circuit board includes at least two circuit layers 20, and the at least two circuit layers 20 are arranged on both sides of the substrate 10. The flexible circuit board includes a first protective film 31 and a second protective film 32;

[0055] The substrate 10 and at least two circuit layers 20 are disposed between the first protective film 31 and the second protective film 32;

[0056] A first repair layer 50 is disposed between the first protective film 31 and at least two circuit layers 20 , and a first repair layer 50 is disposed between the second protective film 32 and at least two circuit layers 20 , or both the first protective film 31 and the second protective film 32 are doped with repair materials.

[0057] Specifically, the first protective film 31 and the second protective film 32 are the outermost film layers of the flexible circuit board. When the flexible circuit board is bent, the strain of the first protective film 31 and the second protective film 32 is large and cracks are more likely to occur. By setting a first repair layer 50 between the first protective film 31 and at least two circuit layers 20, and setting a first repair layer 50 between the second protective film 32 and at least two circuit layers 20, or doping the first protective film 31 and the second protective film 32 with repair materials, it can be ensured that the first protective film 31 and the second protective film 32 can be repaired in time when cracks occur, thereby improving the service life of the flexible circuit board.

[0058] In addition, reference Figure 6 Each adhesive layer 40 may also be provided with a first repair layer 50 to ensure that each adhesive layer 40 can be repaired in time when cracks occur, thereby further improving the service life of the flexible circuit board.

[0059] Figure 7 is a schematic diagram of another flexible circuit board provided by an embodiment of the present invention, optionally, refer to Figure 7 , the flexible circuit board includes a reinforcement area, and the reinforcement area is provided with a reinforcement layer 60;

[0060] The repair area 100 partially overlaps with the reinforcement area, or the repair area 100 is the entire area of ​​the flexible circuit board.

[0061] Specifically, the reinforcement layer 60 is used to improve the structural strength of the bonding area of ​​the flexible circuit board. The reinforcement layer 60 generally covers the bonding area of ​​the flexible circuit board, and the area of ​​the reinforcement layer 60 is larger than the area of ​​the bonding area. The flexible circuit board in the area near the edge of the reinforcement layer 60 away from the bonding area is subjected to the greatest bending stress and is most prone to cracks. The repair area 100 is set to overlap partially with the reinforcement area, that is, the repair area 100 overlaps with part of the reinforcement layer 60, and the repair area 100 also includes a part of the area near the edge of the reinforcement area away from the bonding area. In this way, the repair material can repair the flexible circuit board in time when cracks appear.

[0062] In addition, the repair area 100 is the entire area of ​​the flexible circuit board, that is, the first repair layer 50 is set throughout the entire flexible circuit board, or the entire film layer range of the adhesive layer 40 and the protective film 30 is doped with repair materials. In this way, cracks at any position within the entire flexible circuit board can be repaired in time.

[0063] Figure 8 is a schematic diagram of a film layer in a repair area of ​​another flexible circuit board provided by the present invention, Fig. 9 is a schematic plan view of a second repair layer provided by an embodiment of the present invention, with reference to Figure 8 and Fig. 9 At least one second repair layer 70 is also provided in the repair area 100. The second repair layer 70 includes a repair capsule. The repair capsule includes an insulating shell and conductive particles encapsulated in the insulating shell. The second repair layer 70 is provided on the surface of the circuit layer 20. The circuit layer 20 includes a plurality of conductive wires 21. The second repair layer 70 includes a plurality of repair lines 71. Each repair line 71 corresponds to a conductive wire. The repair line 71 is used to repair the conductive wire 21 when a crack appears in the corresponding conductive wire 21.

[0064] Specifically, each repair line 71 corresponds to a conductor 21, that is, the vertical projection of each repair line 71 on the substrate 10 overlaps with the vertical projection of only one conductor 21 on the substrate 10. Specifically, the vertical projection of the repair line 71 on the substrate 10 may overlap with the vertical projection of the conductor 21 on the substrate 10, for example, the vertical projection of the repair line 71 on the substrate 10 overlaps with the vertical projection of the conductor 21 on the substrate 10, or the vertical projection of the repair line 71 on the substrate 10 partially overlaps with the vertical projection of the conductor 21 on the substrate 10. When the flexible circuit board is bent by external force, and a conductor 21 of the circuit layer 20 and the repair line 71 corresponding to the conductor 21 are cracked, the insulating shell of the repair capsule in the repair line 71 is cracked, and the conductive particles in the insulating shell flow out and cover the crack of the conductor 21, thereby repairing the crack of the conductor 21 and restoring the electrical connection at the crack of the conductor 21.

[0065] Optionally, the conductive particles are made of liquid metal or nano-conductive material. Exemplarily, the conductive particles are made of gallium, gallium-indium alloy, nanotube or graphene; the insulating shell includes at least one of polyurethane, melamine formaldehyde resin, urea formaldehyde resin, gelatin, polyurea, polystyrene, polydivinylbenzene and polyamide.

[0066] An embodiment of the present invention further provides an electronic product, which includes the flexible circuit board described in any embodiment of the present invention.

[0067] Specifically, the flexible circuit board is used to provide electrical signals to other components in the electronic product, such as providing driving signals to other components in the electronic product. Exemplarily, the electronic product may include a flexible light-emitting screen, the flexible circuit board is bonded to the flexible light-emitting screen, and the flexible circuit board is used to drive the flexible light-emitting screen to emit light.

[0068] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0069] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A flexible circuit board, characterized in that: include: A substrate, at least one circuit layer disposed on the substrate, and a protective film disposed on a side of the at least one circuit layer away from the substrate; It also includes at least one adhesive layer, which is arranged between the circuit layers, or between the circuit layer and the substrate, or between the protective film and the circuit layer; The flexible circuit board includes a repair area; at least one first repair layer is arranged in the repair area, the first repair layer includes a repair material, the first repair layer is arranged adjacent to the adhesive layer and / or the first repair layer is arranged adjacent to the protective film, or the adhesive layer and / or the protective film in the repair area are doped with a repair material; Among them, the glass transition temperature of the repair material is lower than the set temperature, and the set temperature is less than or equal to 80 degrees and greater than or equal to 40 degrees; after the repair material reaches the glass transition temperature, the repair material has a certain fluidity and can be filled into the cracks of the adhesive layer or the protective film adjacent to the repair material to achieve repair of the adhesive layer and the protective film.

2. The flexible circuit board according to claim 1, characterized in that: The first repair layer is in a grid shape; The adhesive layer adjacent to the first repair layer is filled in the mesh holes of the first repair layer, and / or the protective film adjacent to the first repair layer is filled in the mesh holes of the first repair layer.

3. The flexible circuit board according to claim 1, characterized in that: When the first repair layer is disposed between the adhesive layer and the circuit layer, the first repair layer is in direct contact with the circuit layer.

4. The flexible circuit board according to claim 1, characterized in that: The repair material includes polyurethane resin, polyrotaxane, silicone resin, cyclodextrin or polyphenylene ether.

5. The flexible circuit board according to claim 1, characterized in that: The thickness of the first repair layer is in the range of 10 micrometers to 100 micrometers.

6. The flexible circuit board according to claim 1, characterized in that: The flexible circuit board comprises a reinforcement area, and the reinforcement area is provided with a reinforcement layer; The repair area partially overlaps with the reinforcement area, or the repair area is the entire area of ​​the flexible circuit board.

7. The flexible circuit board according to claim 1, characterized in that: The flexible circuit board comprises at least two circuit layers, the at least two circuit layers are arranged on both sides of the substrate, and the flexible circuit board comprises a first protective film and a second protective film; The substrate and the at least two circuit layers are arranged between the first protective film and the second protective film; The first repair layer is disposed between the first protective film and the at least two circuit layers, the first repair layer is disposed between the second protective film and the at least two circuit layers, or both the first protective film and the second protective film are doped with repair materials.

8. The flexible circuit board according to claim 1, characterized in that: At least one second repair layer is also provided in the repair area, the second repair layer includes a repair capsule, and the repair capsule includes an insulating shell and conductive particles encapsulated in the insulating shell; The second repair layer is arranged on the surface of the circuit layer, the circuit layer includes a plurality of conductive wires, the second repair layer includes a plurality of repair lines, each repair line corresponds to a conductive wire, and the repair line is used to repair the conductive wire when cracks appear in the corresponding conductive wire.

9. An electronic product, characterized in that: The flexible circuit board comprises the flexible circuit board as described in any one of claims 1 to 8.

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