An electrode path planning method for EDM machining of special-shaped air film holes

Abstract

The present invention discloses an electrode path planning method for special-shaped air film hole electrospark machining. The method comprises: processing a selected air film hole model to be machined in an area to obtain a mesh model M, offsetting the mesh model M to obtain a mesh model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Intersection processing is performed to obtain multiple intersection lines; the intersection lines are offset and the offset intersection lines are arranged. The present invention meshes the processing area and plans the path of the electrode for the EDM of the special-shaped air film hole in the mesh model, so that the processing efficiency of the air film hole is effectively improved and the processing cost is greatly reduced.

Description

Technical Field

[0001] The invention relates to the technical field of special machining, and in particular to an electrode path planning method for electrical discharge machining of special-shaped air film holes. Background Art

[0002] Film cooling technology is to spray gas along the wall to form an air film, which plays a role in heat insulation and heat dissipation. It has been widely used in the hot end working blades of aircraft engines and gas turbines to ensure that they can work reliably at an ambient temperature higher than the melting point of the blade material. The key to the realization of film cooling technology lies in the processing of film holes. Since the working blades work under high temperature, heavy load and variable stress conditions, the quality of the film holes directly affects the yield, cooling efficiency and service life of the blades. Its processing technology has become one of the key technologies in the manufacture of aircraft engines and gas turbines.

[0003] Film holes can be divided into cylindrical film holes and irregular film holes according to their geometric characteristics. The geometric structure of film holes has a significant impact on cooling efficiency. Irregular film holes have higher cooling efficiency than cylindrical holes and have gradually become a commonly used hole type in recent years. Among them, irregular film holes have various shapes, mainly including dustpan-shaped film holes, conical film holes, etc. Figure 1 shown.

[0004] However, the shapes of the irregular film holes are complex and numerous, and the blade material is made of high-strength and high-hardness materials. Traditional mechanical processing methods cannot meet the processing requirements of irregular film holes. It is impossible to process irregular film hole groups efficiently and at low cost. Therefore, it is necessary to seek a process method with higher processing efficiency and lower processing cost. Summary of the invention

[0005] Based on this, it is necessary to provide an electrode path planning method for EDM of special-shaped air film holes with high processing efficiency and low cost to address the problem that traditional processing methods cannot process special-shaped air film holes efficiently and at low cost.

[0006] The embodiment of the present invention provides an electrode path planning method for electrospark machining of special-shaped air film holes, comprising the following steps:

[0007] The set air film hole model to be processed area is processed to obtain the mesh model M, and the mesh model M is offset to obtain the mesh model M offset ;

[0008] According to the grid model M offset Determine the layering plane;

[0009] For layered plane and mesh model M offset Perform intersection processing to obtain multiple intersection lines;

[0010] Offset the intersection lines and arrange the offset intersection lines.

[0011] In one embodiment of the present invention, the step of processing the to-be-processed area of ​​the air film hole model to obtain the mesh model M specifically includes:

[0012] Divide each surface of the processing area into triangular meshes to obtain several triangular mesh models;

[0013] The plurality of triangular mesh models are spliced ​​and merged to obtain a mesh model M.

[0014] In one embodiment of the present invention, the mesh model M includes all vertices of the mesh and vertex indices constituting triangles.

[0015] In one embodiment of the present invention, the grid model M is biased to obtain the grid model M offset The method is:

[0016] Calculate the offset distance D, D = G + C, where G is the discharge gap and C is the machining allowance;

[0017] Set the bias direction to the normal direction of the mesh model M.

[0018] In one embodiment of the present invention, the grid model M offset The steps for determining the layering plane specifically include:

[0019] Set the electrode axis direction to L and the grid model to M offset The set of vertices included is Where L is the unit vector, j represents the point index, P j is the vertex coordinate;

[0020] Traverse all vertices and calculate the lowest point P along the electrode axis direction L l , the highest point P h , where l, h represent point indices, P l , P h satisfy:

[0021]

[0022]

[0023] In (1), the equality holds if and only if l = j, and in (2), the equality holds if and only if h = j. l and P h The grid model M is limited offset The span boundary along the axial direction of the electrode;

[0024] The mesh model M offsetDivided into N layered planes,

[0025]

[0026] Each layered plane is represented as:

[0027]

[0028] Among them, the symbol Indicates rounding up to an integer, P xyz represents any point on the plane, P O Indicates the origin position of the layer.

[0029] In one embodiment of the present invention, the layered plane and the grid model M offset The steps of performing intersection processing to obtain multiple intersection lines specifically include:

[0030] Traverse the mesh model M offset For each triangle in, we get the mesh model M offset All intersections with the stratification planes;

[0031] Merge all intersection points and perform duplicate removal;

[0032] Arrange all processed intersection points counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

[0033] In one embodiment of the present invention, the layered plane and the grid model M offset The steps of performing intersection processing to obtain multiple intersection lines specifically include:

[0034] Mesh Model M offset It is composed of several surfaces, and the intersection line between each surface and the layered plane is calculated separately;

[0035] Sample each intersection line evenly, merge the sampling points of all intersection lines and perform duplicate removal;

[0036] Arrange all processed intersection points counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

[0037] In one embodiment of the present invention, the intersection line is a polygon. According to the different positions of the layered planes, the polygon can be divided into an open polygon and a closed polygon.

[0038] In one embodiment of the present invention, the offset intersection line method is:

[0039] Set the offset distance to the radius of the tool, i.e. the electrode;

[0040] The intersection line points after the offset correction are arranged counterclockwise in the layered plane.

[0041] In one embodiment of the present invention, the method of arranging the offset intersection lines is that the arrangement sequence is unidirectional arrangement or reciprocating arrangement.

[0042] The above technical solution of the present invention has the following advantages compared with the prior art:

[0043] The present invention discloses an electrode path planning method for special-shaped air film hole electrospark machining. The method comprises: processing a selected air film hole model to be machined in an area to obtain a mesh model M, offsetting the mesh model M to obtain a mesh model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Intersection processing is performed to obtain multiple intersection lines; the intersection lines are offset and the offset intersection lines are arranged. The present invention meshes the processing area and plans the path of the electrode for the electrospark machining of the special-shaped air film hole in the mesh model, thereby reducing the process of making the forming electrode, effectively improving the processing efficiency of the air film hole, and greatly reducing the processing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments. By referring to the drawings, the features and advantages of the present invention will be more clearly understood. The drawings are schematic and should not be understood as limiting the present invention in any way. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0045] Figure 1 Schematic diagrams of three hole structures: cylindrical hole, conical hole, and dustpan hole;

[0046] Figure 2 The lower part is a cylindrical surface, and the upper part is composed of a free-form surface or a plurality of planes or free-form surfaces spliced ​​together to form a special-shaped air film hole;

[0047] Figure 3 It is a flow chart of an electrode path planning method for EDM machining of special-shaped air film holes according to an embodiment of the present invention;

[0048] Figure 4 M is the mesh model of the upper part of the air film hole offset Schematic diagram;

[0049] Figure 5 For the layered plane and mesh model M offset Schematic diagram of the intersection line and its offset line;

[0050] Figure 6 Sort schematic diagrams for all toolpaths;

[0051] Figure 7 This is a schematic diagram of the three-dimensional model of the air film hole in the CAM software;

[0052] Figure 8 This is a schematic diagram of setting the tool (electrode size) in the CAM software;

[0053] Fig. 9 Schematic diagram for setting component allowance in CAM software;

[0054] Fig.10 Schematic diagram for setting cutting depth in CAM software;

[0055] Fig.11 This is a schematic diagram of the tool path obtained by simulation in CAM software;

[0056] Fig.12 The figure is a schematic block diagram of a network device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0057] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0058] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0059] Embodiment 1

[0060] The electrode path planning method for EDM machining of special-shaped air film holes of the present invention can be used for machining such as Figure 2 However, based on the same processing concept as the present invention, the electrode path planning method of the electrospark machining can also be used to process other complex shaped special-shaped holes.

[0061] like Figure 2 As shown, the irregular air film hole includes a cylindrical opening 200 and an irregular opening 201. The present invention will discuss in detail below how to use an efficient and low-cost processing method to process the irregular opening 201 of the air film hole.

[0062] When planning the cylindrical electrode trajectory for the upper irregular opening 201 of the air film hole, the cylindrical electrode is regarded as a tool, and the path form of top feed, layered processing, and gradual deepening is adopted. The tool axis direction is parallel to the axis direction of the lower cylindrical opening 200 and remains fixed. Therefore, this path belongs to the category of 2.5-axis machining path planning. Considering the area to be processed, such as Figure 2The middle special-shaped opening 201 gradually opens from the bottom to the top and the direction of the tool axis remains fixed. On the premise of ensuring that the tool does not over-cut the processing area, there is no possibility of interference between the tool and the processing area.

[0063] like Figure 3 As shown, the steps of processing the special-shaped opening 201 of the air film hole in the embodiment of the present invention include:

[0064] S301, inputting the air film hole model, processing the area to be processed of the air film hole model to obtain a mesh model M, and offsetting the mesh model M to obtain a mesh model M offset ;

[0065] S302, according to the grid model M offset Determine the layering plane;

[0066] S303, layered plane and grid model M offset Perform intersection processing to obtain multiple intersection lines;

[0067] S304, offset the intersection lines, and arrange the offset intersection lines.

[0068] The embodiment of the present invention grid models the processing area, and plans the electrode path of the air film hole in the grid model, so that the processing efficiency of the air film hole is effectively improved and the processing cost is greatly reduced.

[0069] In this way, by using the processing method of the special-shaped air film hole of this embodiment, both the cylindrical opening 200 and the special-shaped opening 201 of the air film hole are processed by the electric spark processing technology, and the processing of the air film hole can be completed on one device.

[0070] Furthermore, in step S301, it specifically includes:

[0071] The processing area (special-shaped opening 201) is a complete curved surface or a spliced ​​surface composed of several faces. This step first divides each face of the special-shaped opening 201 into a triangular mesh to obtain several triangular mesh models; then the several triangular mesh models are spliced ​​and merged to obtain a mesh model M. The mesh model contains all the vertices of the mesh and the vertex indexes that constitute the triangles. The discharge gap G and the machining allowance C both represent the distance from the electrode to the processing area, which can be combined and processed. The distance from the electrode to the processing area is D=G+C. The mesh model M is offset, the offset distance is D, and the offset direction is the normal direction of the mesh model M to obtain the offset mesh model M offset , mesh model M offset like Figure 4 shown.

[0072] Furthermore, in step S302, it specifically includes:

[0073] First, set the electrode axis direction to L and the grid model to M offset The set of vertices included is Where L is the unit vector, j represents the point index, P j is the vertex coordinate;

[0074] Then, traverse all vertices and calculate the lowest point P along the electrode axis direction L l , the highest point P h , where l, h represent point indices, P l , P h satisfy:

[0075]

[0076]

[0077] In (1), the equality holds if and only if l = j, and in (2), the equality holds if and only if h = j. l and P h The grid model M is limited offset The span boundary along the axial direction of the electrode;

[0078] Finally, the mesh model M offset Divided into N layered planes,

[0079]

[0080] Each layered plane is represented as:

[0081]

[0082] Among them, the symbol Indicates rounding up to an integer, P xyz represents any point on the plane, P O Indicates the origin position of the layer.

[0083] Furthermore, in step S303, it specifically includes:

[0084] First, traverse the mesh model M offset For each triangle in, we get the mesh model M offset All intersections with the stratification planes;

[0085] Then, merge all intersection points and perform duplicate removal;

[0086] Finally, all processed intersection points are arranged counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

[0087] Furthermore, in step S303, the layered plane and the grid model M offsetAnother method to obtain multiple intersection lines is:

[0088] First, the mesh model M offset It is composed of several surfaces, and the intersection line between each surface and the layered plane is calculated separately;

[0089] Then, each intersection line is sampled evenly, the sampling points of all intersection lines are merged and deduplication is performed;

[0090] Finally, all processed intersection points are arranged counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

[0091] Among them, the intersection line is a polygon. According to the different positions of the layered plane, the polygon can be divided into an open polygon and a closed polygon.

[0092] Furthermore, in step S304, it specifically includes:

[0093] In the layered plane, the obtained intersection line is offset, and the offset distance is set to the radius of the tool, i.e. the electrode. The order of the intersection line points after the offset correction is arranged counterclockwise in the layered plane. Figure 5 For the layered plane and mesh model M offset Schematic diagram of the intersection line and its offset line.

[0094] Furthermore, in step S305, the following steps are specifically included:

[0095] After completing the intersection line offset for all layered planes, arrange the intersection lines between layers. The arrangement order can be unidirectional or reciprocating. Figure 6 Sort schematics for all toolpaths.

[0096] The present invention has been applied to the blade finishing strategy of CAM software. The electrode path planning method for film hole electrospark machining is specifically described below in conjunction with various drawings and examples.

[0097] Select the air film hole 3D model, such as Figure 7 As shown;

[0098] Create an "air film hole processing" operation and set the necessary parameters such as tool (electrode size), component allowance, cutting depth, etc.

[0099] (1) Setting tool (electrode size):

[0100] Assembly ID: ASMB00001, No.: 1, Type: Flat bottom cutter, Diameter: 0.52mm, Corner radius 0mm, Taper: 0., Blade length: 2mm, Knife length: 5mm, Spindle speed: 3000r / min, Feed rate: 250mm / min, Figure 8 As shown;

[0101] (2) Set component allowance:

[0102] Component allowance: 0.05, component allowance is the sum of the machining allowance and the discharge gap described in the present invention, such as Fig. 9 As shown;

[0103] (3) Setting cutting depth:

[0104] Output point density: 500, calculation error: 0.01, advance and retract distance: 10, cutting depth direction-type: cutting depth, cutting depth direction-value: 0.05, cutting depth direction-value is the processing layer distance H described in the embodiment of the invention. Fig.10 shown.

[0105] Input the following calculation strategy: process the processing area to obtain the mesh model M, offset the mesh model M to obtain the mesh model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Perform intersection processing to obtain multiple intersection lines; offset the intersection lines and arrange the offset intersection lines.

[0106] By performing simulation, the tool path can be obtained. The gray line in area 1100 is the final tool path. Fig.11 shown.

[0107] In the embodiment of the present invention, the following calculation strategy is performed on the air film hole model on the CAM software: the selected air film hole model to be processed area is processed to obtain a mesh model M, and the mesh model M is offset to obtain a mesh model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Perform intersection processing to obtain multiple intersection lines; offset the intersection lines and arrange the offset intersection lines to obtain the final tool path, which effectively improves the processing efficiency of the air film hole and greatly reduces the processing cost.

[0108] Embodiment 2

[0109] An embodiment of the present invention further provides a computer storage medium, wherein the computer storage medium stores a computer software product. The computer software product includes several instructions for enabling a computer device to execute the method described in Embodiment 1, which will not be described in detail herein.

[0110] Embodiment 3

[0111] like Fig.12As shown, an embodiment of the present invention further provides a network device, the device 1200 includes a processor 1210, a memory 1220 and a bus system 1230, the processor 1210 and the memory 1220 are connected through the bus system 1230, the memory 1220 is used to store instructions, and the processor 1210 is used to execute the instructions stored in the memory 1220.

[0112] The processor 1210 is used to: process the selected air film hole model to be processed area to obtain a grid model M, and offset the grid model M to obtain a grid model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Perform intersection processing to obtain multiple intersection lines; offset the intersection lines and arrange the offset intersection lines.

[0113] Therefore, the network device 1200 of the embodiment of the present invention meshes the processing area and performs path planning for the electrode of the EDM machining of the special-shaped air film holes in the mesh model, so that the machining efficiency of the air film holes is effectively improved and the machining cost is greatly reduced.

[0114] It should be understood that in the embodiment of the present invention, the processor 1210 may be a central processing unit (CPU), and the processor 1210 may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0115] The memory 1220 may include a read-only memory and a random access memory, and provide instructions and data to the processor 1210. A portion of the memory 1220 may also include a nonvolatile random access memory. For example, the memory 1220 may also store information on the device type.

[0116] The bus system 1230 may include, in addition to the data bus, a power bus, a control bus, a status signal bus, etc. However, for the sake of clarity, various buses are labeled as the bus system 1230 in the figure.

[0117] In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware in the processor 1210 or an instruction in the form of software. The steps of the method disclosed in conjunction with the embodiment of the present invention can be directly embodied as being executed by a hardware processor, or can be executed by a combination of hardware and software modules in the processor. The software module can be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 1220, and the processor 1210 reads the information in the memory 1220 and completes the steps of the above method in conjunction with its hardware. To avoid repetition, it will not be described in detail here.

[0118] Therefore, the network device of the embodiment of the present invention processes the selected air film hole model to be processed area to obtain a grid model M, and biases the grid model M to obtain a grid model M offset ; According to the grid model M offset Determine the layering plane; compare the layering plane with the grid model M offset Intersection processing is performed to obtain multiple intersection lines; the intersection lines are offset and the offset intersection lines are arranged. The present invention meshes the processing area and plans the path of the electrode for the EDM of the special-shaped air film hole in the mesh model, so that the processing efficiency of the air film hole is effectively improved and the processing cost is greatly reduced.

[0119] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0120] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0121] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0122] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices or units, or may be an electrical, mechanical or other form of connection.

[0123] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0124] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0125] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0126] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. An electrode path planning method for EDM machining of special-shaped air film holes, characterized in that: The following steps are involved: The selected air film hole model to be processed area is processed to obtain a mesh model M, and the mesh model M is offset to obtain a mesh model M offset ; According to the grid model M offset Determine the layering plane, including: First, set the electrode axis direction to L and the grid model to M offset The set of vertices included is Where L is the unit vector, j represents the point index, P j is the vertex coordinate; Then, traverse all vertices and calculate the lowest point P along the electrode axis direction L l , the highest point P h , where l, h represent point indices, P l , P h satisfy: (1) In the formula, the equality holds if and only if l = j, (2) In the formula, the equality holds if and only if h = j, P l and P h The grid model M is limited offset The span boundary along the axial direction of the electrode; Finally, the mesh model M offset Divided into N hierarchical planes: Each layered plane is represented as: Among them, the symbol Indicates rounding up to an integer, P xyz represents any point on the plane, P O Indicates the origin position of the sub-level; For layered plane and mesh model M offset Perform intersection processing to obtain multiple intersection lines; Offset the intersection lines and arrange the offset intersection lines.

2. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 is characterized in that: The step of processing the selected air film hole model to be processed area to obtain the grid model M specifically includes: Divide each surface of the processing area into triangular meshes to obtain several triangular mesh models; The plurality of triangular mesh models are spliced ​​and merged to obtain a mesh model M.

3. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 or 2, characterized in that: The mesh model M includes all vertices of the mesh and vertex indices constituting triangles.

4. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 is characterized in that: The grid model M is biased to obtain the grid model M offset The method is: Calculate the offset distance D, D = G + C, where G is the discharge gap and C is the machining allowance; Set the bias direction to the normal direction of the mesh model M.

5. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 is characterized in that: The layered plane and grid model M offset The steps of performing intersection processing to obtain multiple intersection lines specifically include: Traverse the mesh model M offset For each triangle in, we get the mesh model M offset All intersections with the stratification planes; Merge all intersection points and perform duplicate removal; Arrange all processed intersection points counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

6. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 is characterized in that: The layered plane and grid model M offset The steps of performing intersection processing to obtain multiple intersection lines specifically include: Mesh Model M offset It is composed of several surfaces, and the intersection line between each surface and the layered plane is calculated separately; Sample each intersection line evenly, merge the sampling points of all intersection lines and perform duplicate removal; Arrange all processed intersection points counterclockwise along the direction of the tool axis vector L on the plane to obtain a complete intersection line.

7. The electrode path planning method for EDM of special-shaped air film holes according to claim 1, 5 or 6, characterized in that: The intersection line is a polygon. According to the different positions of the layered planes, the polygon can be divided into an open polygon and a closed polygon.

8. The electrode path planning method for EDM machining of special-shaped air film holes according to claim 1 is characterized in that: The offset intersection line method is: Set the offset distance to the radius of the electrode; The offset intersection point sequence is arranged counterclockwise in the layered plane.

9. The electrode path planning method for EDM of special-shaped air film holes according to claim 1 is characterized in that: The method for arranging the offset intersection lines is that the arrangement sequence is unidirectional arrangement or reciprocating arrangement.

10. A computer storage medium, characterized in that: The computer storage medium stores a computer software product, and the computer software product includes several instructions for causing a computer device to execute the method according to any one of claims 1 to 9.

11. A network device, characterized in that: It comprises a processor, a memory and a bus system, wherein the processor and the memory are connected via the bus system, the memory is used to store instructions, and the processor is used to execute the instructions stored in the memory to implement the method described in any one of claims 1 to 9.

Images