Semi-automatic chip code writing and reading device and method

Abstract

The semi-automatic chip writing and reading equipment provided by the present invention drives the probe module to complete the writing and reading operation of the chip on the chip tray through the z-axis driving module, and completes the work of changing rows or columns through the x-axis driving module, which greatly improves the production efficiency; at the same time, the probe module is detachably mounted on the z-axis slide table through the probe fixing plate. Once the chip model to be written and read changes, it only needs to replace the probe module alone to adapt to the writing and reading of chips of different models without replacing the entire equipment, which greatly improves the production efficiency; the chip that fails to be written and read is automatically marked by the marking device in the marking module, so as to avoid the problem of marking errors, and at the same time improve the production efficiency. At the same time, the present invention also discloses a semi-automatic chip writing and reading method.

Description

Technical Field

[0001] The present invention relates to the field of chip writing and reading technology, and in particular to a semi-automatic chip writing and reading device and method. Background Art

[0002] In embedded devices, such as printers, scanners and other smart devices, communication with the device controller is achieved by installing chips on the components to realize intelligent control of the devices. The program content in these chips needs to be written by a code writing and reading device. The chip usually adopts a contact design when in contact. The code writing and reading device contacts the chip contacts through a metal probe to complete the write and read operations. In actual production, it is usually necessary to write and read a batch of chips at the same time. The whole board of chips is arranged in rows and columns, and the code writing and reading device is used to write and read each chip on the chip board.

[0003] In the prior art, there are also devices that can write and read chips. However, because the existing chip writing and reading equipment is designed according to different chip models, each time the product model on the production line is changed, the entire set of equipment needs to be replaced, which greatly reduces production efficiency. At the same time, once the existing writing and reading equipment fails to write or read, it is necessary to manually use a marking pen to mark the chip that failed to write or read, which is prone to errors and has low efficiency. Summary of the invention

[0004] In order to solve the problem in the prior art that the manually operated code writing and reading equipment writes and reads the entire chip, and the equipment is not compatible with chips of different models, resulting in reduced production efficiency, the present invention provides a semi-automatic chip code writing and reading equipment, which can automatically complete the chip code writing and reading process, can flexibly use the chip reading and writing requirements of different models, and greatly improve the work efficiency. At the same time, the present invention also discloses a semi-automatic chip code writing and reading method.

[0005] The technical solution of the present invention is as follows: a semi-automatic chip writing and reading device, comprising: a probe module, a chip tray, the chip tray is arranged on a base, the chip to be written and read is arranged on the chip tray, the probe module is arranged above the chip tray, and is characterized in that it also includes: a control unit, a driving module of the probe module and a marking module;

[0006] The probe module comprises: a probe, a probe adapter plate and a probe fixing plate, wherein the probe fixing plate is arranged along the row or column direction of the chip tray, and a probe hole is opened according to the position of the contact point of the chip to be written or read on the chip tray; the probe is fixed on the probe fixing plate after passing through the probe hole from top to bottom, and the probe adapter plate is connected to the probe by soldering;

[0007] The control unit comprises: a main control board and a motor control board, wherein the motor control board is communicatively connected with the main control board; the main control board is electrically connected with the probe adapter board via a main board adapter board;

[0008] The driving module comprises: an x-axis driving module and a z-axis driving module; the chip tray is mounted on the x-axis driving module, and the probe module is detachably mounted on the z-axis driving module through the probe fixing plate; the x-axis driving module drives the chip tray to move in the horizontal direction, and the z-axis driving module drives the probe module to move in the vertical direction;

[0009] The marking module comprises: a marking device driving module and a marking device, and the marking device driving module comprises: a horizontal driving module;

[0010] The horizontal drive module includes: a horizontal drive motor and a marking screw slide module; the marking screw slide module includes: a marking screw and a marking slide, the marking screw is connected to the output shaft of the horizontal drive motor; the horizontal drive motor is electrically connected to the motor control board through a motor driver;

[0011] The marking screw rod is parallel to the probe fixing plate and is disposed above the chip tray adjacent to the probe fixing plate;

[0012] The marking device is arranged on the bottom end surface of the marking slide.

[0013] It is further characterized by:

[0014] The marking device driving module further includes: a marking vertical direction driving module, the marking vertical direction driving module includes: a vertical screw and a vertical stepping motor, the vertical stepping motor is arranged on the bottom end surface of the marking slide, and the vertical screw is arranged vertically downward on the output shaft of the vertical stepping motor;

[0015] The marking device comprises: a marking pen; the tip of the marking pen is downwardly arranged at the bottom end of the vertical screw rod;

[0016] The marking device also includes: an ink dropping device and a glue spraying device;

[0017] The ink drop device comprises: an ink cartridge, a pen tube and a pen tip whose inner cavity is interconnected with a switch structure; the switch structure comprises: a switch baffle and a stepping motor for the switch;

[0018] The switch baffle is rotatably arranged in the inner cavity of the pen tube, and the shape of the switch baffle is adapted to the cross-sectional shape of the inner cavity of the pen tube; the switch stepping motor is arranged outside the pen tube, and the output shaft of the switch stepping motor passes through the tube wall of the pen tube to connect with the switch baffle;

[0019] The switch is electrically connected to the motor control board by a stepper motor;

[0020] The ink dropping device is arranged on the bottom end surface of the marking slide table;

[0021] In the driving module, the x-axis driving module includes: an x-axis stepping motor and an x-axis screw slide module; the x-axis screw slide module includes: an x-axis slide and an x-axis screw; the x-axis screw is fixedly arranged on a base and connected to the output shaft of the x-axis stepping motor;

[0022] The z-axis drive module includes: a z-axis stepper motor, a z-axis screw slide module; the z-axis screw slide module includes: a z-axis slide, a z-axis screw;

[0023] The chip tray is arranged on the x-axis slide; the probe module is detachably mounted on the z-axis slide through the probe fixing plate; the z-axis slide is arranged above the chip tray; the z-axis slide is slidably connected to the z-axis lead screw, and the z-axis lead screw is connected to the output shaft of the z-axis stepping motor;

[0024] The z-axis stepper motor and the x-axis stepper motor are electrically connected to the motor control board through motor drivers respectively;

[0025] It also includes an interactive module, which includes: a display module, a menu selection button, a power button, and a start button, and the display module, the menu selection button, the power button, and the start button are electrically connected to the main control board through a flat cable;

[0026] It also includes a reset module, the reset module includes: an x-axis reflection sensor and a z-axis reflection sensor, the x-axis reflection sensor and the z-axis reflection sensor;

[0027] The x-axis reflection sensor is set at a preset initial position of the tray; the z-axis reflection sensor is set at a preset initial position of the probe;

[0028] The tray initial position is the starting position of the x-axis slide in the horizontal direction when the chip to be written or read on the chip tray has not yet started the writing or reading operation;

[0029] The initial position of the probe is the reset position of the z-axis slide table after the probe performs a write and read operation in the numerical direction;

[0030] A semi-automatic chip writing and reading method, characterized in that it comprises the following steps:

[0031] S1: The chip to be written and read is placed on the chip tray. After power-on, the main control board checks the sensor signal sent back by the reset module to determine whether a reset operation needs to be performed;

[0032] If resetting is required, the main control board will drive the slide that needs to be reset to move to the initial position through the motor control board;

[0033] Otherwise, directly execute step S2;

[0034] S2: The main control board sends a write-read start instruction to the motor control board, and the motor control board outputs a motor signal, and the x-axis stepper motor drives the x-axis slide to move until the first row of chip contacts on the chip tray are aligned with the probe at the initial position, and the z-axis stepper motor drives the probe to move downward until it is completely in contact with the contacts of the chip to be written or read;

[0035] S3: The motor control board sends the next step instruction to the main control board. After receiving the instruction, the main control board starts to execute the code writing and reading operation on the chip of the current row. After the writing and reading operation is completed, the screen will display the code writing and reading result of the current row.

[0036] If the result of writing and reading the code of the chip is failed, execute step S4; otherwise, execute step S5;

[0037] S4: rewrite operation, that is, re-write and read code operation for the entire row of chips with failed read / write chips;

[0038] The system has a preset upper limit of N number of rewrites;

[0039] If the rewriting is successful in the rewriting operation less than or equal to N times, then execute step S5;

[0040] If there are still chips that fail to read or write after the Nth rewrite, the coordinates of all chips that fail to read or write are recorded, and the preset marking module startup mark is set to startup, and then step S5 is executed;

[0041] S5: The main control board sends the next line of instructions to the motor control board. After receiving the instructions, the motor control board outputs a motor signal, and the z-axis stepper motor drives the probe module to move to completely separate from the contacts of the chip to be written or read; the x-axis stepper motor drives the x-axis slide to move to the next row of chip contacts to align with the probe;

[0042] S6: The z-axis stepper motor drives the probe to move until it is in full contact with the contact point of the chip to be written or read, and performs the writing or reading operation;

[0043] S7: Execute steps S3 to S6 in a loop to complete the code writing and reading operation of the whole chip board;

[0044] S8: the main control board sends an end command to the motor control board to reset the x-axis slide and the z-axis slide to their initial positions;

[0045] S9: confirm whether the coordinates of the chip that failed to write or read are saved in the system. If not, end the write or read operation.

[0046] If it exists, execute step S10;

[0047] S10: read the coordinates of all chips that failed to be written or read one by one, and record them as: marked coordinates;

[0048] S11: the main control board sends a command to the x-axis stepper motor through the motor control board, driving the x-axis slide to move to the row or column where the marked coordinate is located;

[0049] The main control board sends a command to the horizontal drive motor through the motor control board, and the marking slide drives the marking device to the top of the chip that fails to read the code, so as to mark the chip;

[0050] S12: Repeat steps S10 to S11 until all chips that have failed to be written or read are marked;

[0051] After marking is completed, reset the x-axis slide to its initial position;

[0052] S13: Display the result of the write and read operation of each chip in the chips to be written and read.

[0053] The present invention provides a semi-automatic chip writing and reading equipment, which drives the probe module through the z-axis driving module to complete the writing and reading operations on the chip on the chip tray, and completes the work of changing rows or columns through the x-axis driving module, thereby greatly improving the production efficiency; at the same time, the probe module is detachably mounted on the z-axis slide table through the probe fixing plate, and once the chip model to be written and read changes, it is only necessary to replace the probe module alone to adapt to the writing and reading of chips of different models, without replacing the entire equipment, thereby greatly improving the production efficiency; the chips that fail to be written and read are automatically marked by the marking device in the marking module, thereby avoiding the problem of marking errors and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a schematic diagram of the main structure of the semi-automatic chip writing and reading device of the present invention;

[0055] Figure 2 It is a schematic diagram of the main right view of the semi-automatic chip writing and reading device of the present invention;

[0056] Figure 3 It is a top view of the structure of the semi-automatic chip writing and reading device of the present invention;

[0057] Figure 4 A schematic diagram of the structure of a vertical driving module for marking;

[0058] Figure 5 is a structural schematic diagram of an ink dropping device;

[0059] Figure 6 for Figure 5 A schematic structural diagram of a cross-section taken along the AA direction;

[0060] Figure 7 for Figure 5 A schematic structural diagram of a cross-section taken along the BB direction. DETAILED DESCRIPTION

[0061] like Figure 1~Figure 3 As shown, the present invention provides a semi-automatic chip writing and reading device, which includes: a probe module, a chip tray 105, a control unit, a driving module and a marking module of the probe module, a power module 212, a reset module and an interaction module. Figure 2 As shown, the power module 212 is fixed at the rear of the code writing and reading device, and a baffle 111 is used in the middle to isolate the power module 212, thereby improving the safety of the device.

[0062] The chip tray 105 is arranged on the base 1, the chip to be written and read is arranged on the chip tray 105, and the probe module is arranged above the chip tray 105. The power module 212 inputs 220V AC power through a three-core power line, converts it into 24V DC power output, and provides it to each module.

[0063] The control unit includes: a main control board 208 and a motor control board 209. The motor control board 209 is connected to the main control board 208 in communication; the main control board 208 is electrically connected to the probe adapter board 214 via the main board adapter board 210. The main control board 208 is provided with an ESP8266 module, which can be connected to a WiFi hotspot, and can flexibly realize remote firmware updates for different chips.

[0064] The interactive module includes: a display module 102, a menu selection button 103, a power button 101, and a start button 104. The display module 102, the menu selection button 103, the power button 101, and the start button 104 are electrically connected to the main control board 208 via a flat cable.

[0065] In this embodiment, the main control board 208 is a single-chip microcomputer with STM32F407ZG as the control center, which can realize the chip writing and reading operation of a row or a column on the chip tray 105 each time. The motor control board 209 is a single-chip microcomputer with STM32F030K6Tx as the control center, which mainly outputs motor control signals. The motor control board 209 and the main control board 208 use 485 communication and are connected by two signal lines. The motor control board 209 is fixed on the top of the main control board adapter board 210 by a plastic screw column. The design of the upper and lower layers greatly saves the internal space and optimizes the layout.

[0066] The main control board 208 is connected to the main board adapter board 210, and the main board adapter board 210 is connected to the probe adapter board 214 through a flat cable to realize the communication between the main control board 208 and the chip to be written and read to complete the data writing and reading operations; the 2.8-inch LCD screen 102, the menu selection button 103, the power button 101, and the start button 104 are all connected to the main control board 208 through a flat cable.

[0067] The probe module includes: a probe 213, a probe adapter plate 214 and a probe fixing plate 215. The probe fixing plate 215 is arranged along the row or column direction of the chip tray 105, and a probe hole 2150 is opened according to the position of the contact of the chip to be written or read on the chip tray 105; the probe 213 passes through the probe hole 2150 from top to bottom and is fixed on the probe fixing plate 215, and the probe adapter plate 214 is connected to the probe 213 by soldering.

[0068] In specific implementation, the probe fixing plate 215 is implemented based on an acrylic plate. The probe fixing plate 215 made of acrylic plate has holes opened according to the positions of the chip contacts. The probe 213 passes through the probe hole 2150 on the probe fixing plate 215 and is fixed to the probe fixing plate 215. The probe adapter plate has the same circular hole opened and is connected to the probe through soldering.

[0069] In the present invention, a probe fixing plate 215, a probe 213, and a probe adapter plate 214 are integrated and fixed to the aluminum sheet 108 by screws. During production, the probe modules for different chips can be flexibly replaced according to different chip signals, which greatly improves the compatibility of the equipment.

[0070] The driving module includes: an x-axis driving module and a z-axis driving module; the x-axis driving module drives the probe module to move in the horizontal direction, and the z-axis driving module drives the probe module to move in the vertical direction.

[0071] In the driving module, the x-axis driving module includes: an x-axis stepper motor 204 and an x-axis screw slide module; the x-axis screw slide module includes: an x-axis slide 206 and an x-axis screw 205; the x-axis screw 205 is fixedly arranged on the upper end surface of the base 1 and connected to the output shaft of the x-axis stepper motor 204.

[0072] The z-axis driving module includes: a z-axis stepping motor 201, a z-axis screw slide module; the z-axis screw slide module includes: a z-axis slide 203, a z-axis screw 202;

[0073] The chip tray 105 is arranged on the x-axis slide 206; the probe module is detachably mounted on the z-axis slide 203 through the probe fixing plate 215; the z-axis slide 203 is arranged above the chip tray 105; the z-axis slide 203 is slidably connected to the z-axis lead screw 202, and the z-axis lead screw 202 is connected to the output shaft of the z-axis stepping motor 201;

[0074] The z-axis stepper motor 201 and the x-axis stepper motor 204 are electrically connected to the motor control board 209 through motor drivers respectively.

[0075] In this embodiment, two drivers are used: an x-axis stepper motor driver 207 and a z-axis stepper motor driver 211 to control the x-axis stepper motor 204 and the z-axis stepper motor 201 respectively, the signal input end of the stepper motor driver is connected to the PWM signal output of the main control board 208, and the output signal of the stepper motor driver is connected to the x-axis stepper motor 204 and the z-axis stepper motor 201. The x-axis lead screw slide module and the z-axis lead screw slide module can be realized based on the linear lead screw slide module in the prior art.

[0076] like Figure 1 and 2 As shown, an H-shaped bracket 2 is set on the base 1, the x-axis stepper motor 204 and the x-axis lead screw slide module are set between the two vertical sides of the bracket 2 and fixed on the base 1, and the z-axis stepper motor 201 and the z-axis lead screw slide module are fixed above the chip tray 105 through the horizontal side of the bracket 2.

[0077] In the horizontal direction, the chip tray 105 is fixed to the x-axis slide 206 by screws, and the x-axis slide 206 carries the chip tray 105 to move in the horizontal direction; in the vertical direction, the aluminum sheet 108 is fixed to the z-axis slide 203 by screws, and the z-axis slide 203 moves vertically with the aluminum sheet 108; the probe module is installed on the aluminum sheet 108.

[0078] The present invention adopts two stepper motors: the x-axis stepper motor 204 and the z-axis stepper motor 201 respectively control the movement of the tray in the horizontal direction and the probe in the vertical direction. Compared with the pneumatic control method in the prior art, the present invention does not require a cylinder, reduces the volume, and improves portability; the motor can withstand a higher load, has a higher transmission efficiency, and moves more smoothly and evenly when the load changes; based on the programmability of motor control, the movement accuracy is greatly improved, and the overall stability and practicality are increased.

[0079] At the same time, compared with the traditional manual line-changing test frame, the present invention adopts a stepper motor transmission structure. The chip tray 105 is fixed on the x-axis slide 206 by screws, and moves horizontally through the transmission of the stepper motor. The probe module is fixed on the slide by screws and moves vertically through the transmission of the stepper motor. The transmission structure improves the stability and accuracy of the operation. During the writing and reading operation, the chip tray 105 and the probe 213 move according to the program settings. The operator only needs to press the start button 104, and the semi-automatic chip writing and reading equipment of the present invention can automatically complete the writing and reading of the whole board of chips. Compared with the manual line-changing test frame, only the whole board of chips needs to be manually replaced, which reduces the steps that the operator needs to repeat, and greatly improves the convenience.

[0080] The marking module includes: a marking device driving module and a marking device, the marking device driving module includes: a horizontal driving module; the horizontal driving module includes: a horizontal driving motor 112, a marking screw slide module; the marking screw 113 slide module includes: a marking screw 113, a marking slide 114, the marking screw 113 is connected to the output shaft of the horizontal driving motor 112; the horizontal driving motor 112 is electrically connected to the motor control board 209 through the motor driver; the marking screw 113 is parallel to the probe fixing plate 215, and is arranged adjacent to the probe fixing plate 215 above the chip tray 105; the marking device 216 is arranged on the bottom end surface of the marking slide 114.

[0081] The marking device 216 in the technical solution of the present invention can be implemented based on a marking pen, a glue spraying device, or an ink dropping device.

[0082] When the marking device 216 is implemented based on a marking pen, it can be implemented using an existing technology such as SMAX AUTOMATICPAINT MARKER automatic paint marking pen. Figure 4 As shown, a marking vertical direction driving module is set on the bottom end surface of the marking slide 114, and the marking vertical direction driving module includes: a vertical screw rod 218 and a vertical stepping motor 217, the vertical stepping motor 217 is set on the bottom end surface of the marking slide, and the vertical screw rod 218 is set vertically downward on the output shaft of the vertical stepping motor 217; the tip of the automatic paint marking pen is connected downward by a thread and is set at the bottom end of the vertical screw rod 218.

[0083] When a chip needs to be marked, the vertical stepper motor 217 moves in the horizontal direction following the marking slide 114. The vertical stepper motor 217 drives the vertical screw 218 to rotate, driving the automatic paint marker to rise or fall. When the steel ball of the automatic paint marker contacts the chip, the ink flows out and adheres to the chip. When the pen tip is not in contact, the steel ball resets to close the ink flow, thereby realizing the marking operation on the chip.

[0084] When the marking device 216 is implemented based on an ink drop device, it can be used as Figures 5 to 7 The ink dropping device 3 shown in the figure is realized. The ink dropping device 3 comprises: an ink cartridge 30-1, a pen tube 302, and a pen tip 303, the switch structure comprising: a switch baffle 305, and a stepping motor 304 for switching;

[0085] The switch baffle 305 is rotatably arranged in the inner cavity of the pen tube 302, and the shape of the switch baffle 305 is adapted to the cross-sectional shape of the inner cavity of the pen tube 302. In this embodiment, the cross-sectional shape of the inner cavity of the pen tube 302 is circular; the switch stepper motor 304 is arranged outside the pen tube 302, and the output end of the switch stepper motor 304 passes through the tube wall of the pen tube 302 to connect the switch baffle 305; in this embodiment, the output end of the switch stepper motor 304 is located on the diameter of the switch baffle 305 and the extension line of the diameter, so that the switch baffle 305 can be turned along its diameter;

[0086] The switch stepper motor 304 is electrically connected to the motor control board 209;

[0087] The ink drop device 3 is vertically arranged downward on the bottom end surface of the marking slide 114;

[0088] When performing the marking operation, the marking slide 114 drives the ink drop device 3 to move above the chip. At this time, the switch on the ink drop device 3 is started by the stepper motor 304, driving the switch baffle 305 to rotate, and the ink in the ink cartridge 301 flows out from the pen tip 303 along the inner cavity of the pen tube 302 and the pen tip 303 to achieve marking of the chip.

[0089] When the marking device 216 is implemented based on a glue spraying device, it can be implemented using a pneumatic glue spraying device of the type of back-suction pneumatic glue dispensing valve in the prior art. The continuous air inlet of the back-suction pneumatic glue dispensing valve is directly connected to the cylinder, and a solenoid valve is connected between the control air inlet and the cylinder. The solenoid valve is electrically connected to the motor control board 209 to control the opening and closing of the air hole. When performing the marking operation, the slide 114 drives the back-suction pneumatic glue dispensing valve to move above the chip. At this time, the motor control board 209 controls the solenoid valve to close, and the air pressure in the back-suction pneumatic glue dispensing valve sprays the marking glue onto the chip surface to achieve the marking operation on the chip.

[0090] When the ink drop device and the glue spray device are used as the marking device, there is no need to set up a separate vertical driving module. Only the horizontal driving module needs to be used to realize the marking operation of the chips on each row or column, which simplifies the equipment structure and is more practical.

[0091] During the process of writing and reading the code of the whole chip, if a chip fails to write or read the code, the main control board 208 drives the marking device 216 to mark the failed chip through the motor control board 209, which facilitates the subsequent selection of defective chips. Automatically marking defective chips saves the operator's time to check the results and mark manually, and improves the practicality and production efficiency of the equipment.

[0092] The reset module includes: an x-axis reflection sensor 107 and a z-axis reflection sensor 109; the x-axis reflection sensor 107 is set at a preset initial position of the tray through an x-axis mounting plate 106; the z-axis reflection sensor 109 is set at a preset initial position of the probe through a z-axis mounting plate 110;

[0093] The tray initial position is the starting position of the x-axis slide 206 in the horizontal direction when the chip to be written and read on the chip tray 105 has not yet started the writing and reading operation; the probe initial position is the reset position of the z-axis slide 203 in the vertical direction after the probe has completed a writing and reading operation. The sensor signal output is connected to the port of the motor control board 209.

[0094] The optical fibers of the x-axis reflection sensor 107 and the z-axis reflection sensor 109 are fixed at the initial positions of the chip tray 105 and the probe 213, respectively. When the tray 205 and the probe 213 move to the initial positions, the light reflection causes the output signals of the x-axis reflection sensor 107 and the z-axis reflection sensor 109 to produce a potential change. The motor control board 209 controls the stepper motor according to the sensor signal to achieve position resetting of the tray and the probe, thereby improving the accuracy of the position during resetting, preventing error accumulation and amplification, and improving the stability of the system.

[0095] The use of the semi-automatic chip code writing and reading device of the present invention to perform chip writing and reading operations includes the following steps.

[0096] Before the device is powered on, the chips to be written and read on the whole board are placed on the chip tray 105, and then the power button 101 is pressed to power on the device, and then the writing and reading of the chips on the whole board is started:

[0097] S1: The main control board 208 checks the sensor signals sent back by the z-axis reflection sensor 109 and the x-axis reflection sensor 107 to determine whether a reset operation needs to be performed; if reset is required, the main control board 208 will drive the x-axis slide 206 or the z-axis slide 203 that needs to be reset to move to the initial position through the motor control board 209; because the z-axis reflection sensor 109 and the x-axis reflection sensor 107 are respectively set at the initial positions of the x-axis slide 206 or the z-axis slide 203, when the x-axis slide 206 or the z-axis slide 203 reaches the initial position, the sensor potential signals sent back by the z-axis reflection sensor 109 and the x-axis reflection sensor 107 change, and the main control board 208 stops outputting the motor signal after receiving the signal, and the reset operation is completed.

[0098] S2: Select the program to be written into the chip in the boot program through the display module 102 and the menu selection button 103, and press the confirmation button to enter; then select the chip model and color data of the chip to be written or read, and then press the start button 104, the main control board 208 sends a start instruction to the motor control board 209, the motor control board 209 outputs a motor signal, the x-axis stepper motor 204 drives the x-axis slide 206 to move until the first row of chip contacts on the chip tray 105 are aligned with the probe 213 at the initial position, and the z-axis stepper motor 201 drives the probe 213 to move downward until it is completely in contact with the contacts of the chip to be written or read.

[0099] S3: The motor control board 209 sends the next instruction to the main control board 208. After receiving the instruction, the main control board 208 starts to execute the write and read code operation of the chip in the current row. After the write and read operation is completed, the screen will display the write and read code result of the current row. If the write and read code is successful, "Y" will be displayed, and if it fails, an error code will be displayed. If the write and read code result of the chip is failed, execute step S4; otherwise, execute step S5;

[0100] S4: rewrite operation, that is, re-write and read code operation for the entire row of chips with failed read / write chips;

[0101] The system has a preset upper limit of N number of rewrites;

[0102] If the rewriting is successful in the rewriting operation less than or equal to N times, then execute step S5;

[0103] If there are still chips with failed writing or reading after the Nth rewriting, the coordinates of all chips with failed reading or writing are recorded, and after the preset marking module startup mark is set to startup, step S5 is executed.

[0104] S5: The main control board 208 sends the next row of instructions to the motor control board 209. After receiving the instructions, the motor control board 209 outputs a motor signal, and the z-axis stepper motor 201 drives the probe module to move to completely separate from the contacts of the chip to be written or read; the x-axis stepper motor 204 drives the x-axis slide 206 to move to the next row of chip contacts to align with the probe 213;

[0105] S6: The z-axis stepper motor 201 drives the probe 213 to move until it is in full contact with the contact point of the chip to be written or read, and performs a write or read operation;

[0106] S7: Execute steps S3 to S6 in a loop to complete the code writing and reading operation of the whole chip board;

[0107] S8: the main control board 208 sends an end command to the motor control board 209 to reset the x-axis slide 206 and the z-axis slide 203 to their initial positions; and the results of the write and read operations of each chip in the chips to be written and read are displayed on the screen of the display module 102.

[0108] S9: confirm whether the coordinates of the chip that failed to write or read are saved in the system. If not, end the write or read operation.

[0109] If it exists, execute step S10;

[0110] S10: read the coordinates of all chips that failed to be written or read one by one, and record them as: marked coordinates;

[0111] S11: The main control board 208 sends a command to the x-axis stepper motor 204 through the motor control board 209, driving the x-axis slide 206 to move to the row or column where the marked coordinate is located;

[0112] The main control board 208 sends a command to the horizontal drive motor 112 through the motor control board 209, and the marking slide 114 drives the marking device 216 to the top of the chip that failed to read the code, and marks the chip;

[0113] S12: Repeat steps S10 to S11 until all chips that have failed to be written or read are marked;

[0114] After marking is completed, reset the x-axis slide to its initial position;

[0115] S13: Displaying the result of the write / read operation of each chip in the chips to be written / read on the screen of the display module 102 .

[0116] The x-axis stepper motor drives the slide to move, and the horizontal drive motor in the marking module drives the marking pen to move, so that the marking pen is just above the chip that failed to write or read the code, and the chip is marked. Then the remaining chips that failed to write or read the code are marked. After marking, the x-axis slide is reset to the initial position

[0117] In the actual production process, chips with black glue are mostly used. Corresponding grooves are opened on the chip tray 105 according to the position of the black glue. This can avoid damaging the components and black glue on the chip when force is applied, and also make the chip flatter when writing and reading codes, thereby improving the fault tolerance rate.

Claims

1. A semi-automatic chip writing and reading device, comprising: A probe module and a chip tray, wherein the chip tray is arranged on a base, the chip to be written and read is arranged on the chip tray, and the probe module is arranged above the chip tray, characterized in that it also includes: a control unit, a driving module of the probe module, a marking module and a reset module; The probe module comprises: a probe, a probe adapter plate and a probe fixing plate, wherein the probe fixing plate is arranged along the row or column direction of the chip tray, and a probe hole is opened according to the position of the contact point of the chip to be written or read on the chip tray; the probe is fixed on the probe fixing plate after passing through the probe hole from top to bottom, and the probe adapter plate is connected to the probe by soldering; The control unit comprises: a main control board and a motor control board, wherein the motor control board is communicatively connected with the main control board; the main control board is electrically connected with the probe adapter board via a main board adapter board; The driving module comprises: an x-axis driving module and a z-axis driving module; the chip tray is mounted on the x-axis driving module, and the probe module is detachably mounted on the z-axis driving module through the probe fixing plate; the x-axis driving module drives the chip tray to move in the horizontal direction, and the z-axis driving module drives the probe module to move in the vertical direction; The marking module comprises: a marking device driving module and a marking device, and the marking device driving module comprises: a horizontal driving module; The horizontal drive module includes: a horizontal drive motor and a marking screw slide module; the marking screw slide module includes: a marking screw and a marking slide, the marking screw is connected to the output shaft of the horizontal drive motor; the horizontal drive motor is electrically connected to the motor control board through a motor driver; The marking screw rod is parallel to the probe fixing plate and is disposed above the chip tray adjacent to the probe fixing plate; The marking device is arranged on the bottom end surface of the marking slide; In the driving module, the x-axis driving module includes: an x-axis stepping motor and an x-axis screw slide module; the x-axis screw slide module includes: an x-axis slide and an x-axis screw; the x-axis screw is fixedly arranged on a base and connected to the output shaft of the x-axis stepping motor; The z-axis drive module includes: a z-axis stepper motor, a z-axis screw slide module; the z-axis screw slide module includes: a z-axis slide, a z-axis screw; The chip tray is arranged on the x-axis slide; the probe module is detachably mounted on the z-axis slide through the probe fixing plate; the z-axis slide is arranged above the chip tray; the z-axis slide is slidably connected to the z-axis lead screw, and the z-axis lead screw is connected to the output shaft of the z-axis stepping motor; The z-axis stepper motor and the x-axis stepper motor are electrically connected to the motor control board through motor drivers respectively; The reset module includes: an x-axis reflection sensor and a z-axis reflection sensor; The x-axis reflection sensor is arranged at a preset initial position of the tray; and the z-axis reflection sensor is arranged at a preset initial position of the probe.

2. According to claim 1, a semi-automatic chip writing and reading device is characterized in that: The marking device driving module also includes: a marking vertical direction driving module, and the marking vertical direction driving module includes: a vertical screw and a vertical stepping motor, the vertical stepping motor is arranged on the bottom end surface of the marking slide, and the vertical screw is arranged vertically downward on the output shaft of the vertical stepping motor.

3. According to claim 2, a semi-automatic chip writing and reading device is characterized in that: The marking device comprises: a marking pen; the tip of the marking pen is downwardly arranged at the bottom end of the vertical screw rod.

4. The semi-automatic chip writing and reading device according to claim 1, characterized in that: The marking device also includes: an ink dropping device and a glue spraying device.

5. The semi-automatic chip writing and reading device according to claim 4, characterized in that: The ink drop device comprises: an ink cartridge, a pen tube and a pen tip whose inner cavity is interconnected with a switch structure; the switch structure comprises: a switch baffle and a stepping motor for the switch; The switch baffle is rotatably arranged in the inner cavity of the pen tube, and the shape of the switch baffle is adapted to the cross-sectional shape of the inner cavity of the pen tube; the switch stepping motor is arranged outside the pen tube, and the output shaft of the switch stepping motor passes through the tube wall of the pen tube to connect with the switch baffle; The switch is electrically connected to the motor control board by a stepper motor; The ink dropping device is arranged on the bottom end surface of the marking slide table.

6. The semi-automatic chip writing and reading device according to claim 1, characterized in that: It also includes an interactive module, which includes: a display module, a menu selection button, a power button, and a start button. The display module, the menu selection button, the power button, and the start button are electrically connected to the main control board through a flat cable.

7. The semi-automatic chip writing and reading device according to claim 1, characterized in that: The tray initial position is the starting position of the x-axis slide in the horizontal direction when the chip to be written or read on the chip tray has not yet started the writing or reading operation; The initial position of the probe is the reset position of the z-axis slide table after the probe performs a write-read operation in the numerical direction.

8. A semi-automatic chip writing and reading method, characterized in that: It includes the following steps: S1: Place the chip to be written or read on the chip tray. After power-on, the main control board checks the sensor signal sent back by the reset module to determine whether a reset operation is required. If resetting is required, the main control board will drive the slide that needs to be reset to move to the initial position through the motor control board; Otherwise, directly execute step S2; S2: The main control board sends a write-read start instruction to the motor control board, and the motor control board outputs a motor signal, and the x-axis stepper motor drives the x-axis slide to move until the first row of chip contacts on the chip tray are aligned with the probe at the initial position, and the z-axis stepper motor drives the probe to move downward until it is completely in contact with the contacts of the chip to be written or read; S3: The motor control board sends the next step instruction to the main control board. After receiving the instruction, the main control board starts to execute the code writing and reading operation on the chip of the current row. After the writing and reading operation is completed, the screen will display the code writing and reading result of the current row. If the result of writing and reading the code of the chip is failure, execute step S4; Otherwise, execute step S5; S4: rewrite operation, that is, re-write and read code operation for the entire row of chips with failed read / write chips; The system has a preset upper limit of N number of rewrites; If the rewriting is successful in the rewriting operation less than or equal to N times, then execute step S5; If there are still chips that fail to read or write after the Nth rewrite, the coordinates of all chips that fail to read or write are recorded, and the preset marking module startup mark is set to startup, and then step S5 is executed; S5: The main control board sends the next line of instructions to the motor control board. After receiving the instructions, the motor control board outputs a motor signal, and the z-axis stepper motor drives the probe module to move to completely separate from the contacts of the chip to be written or read; the x-axis stepper motor drives the x-axis slide to move to the next row of chip contacts to align with the probe; S6: The z-axis stepper motor drives the probe to move until it is in full contact with the contact point of the chip to be written or read, and performs the writing or reading operation; S7: Execute steps S3 to S6 in a loop to complete the code writing and reading operation of the whole chip board; S8: the main control board sends an end command to the motor control board to reset the x-axis slide and the z-axis slide to their initial positions; S9: confirm whether the coordinates of the chip that failed to write or read are saved in the system. If not, end the write or read operation. If it exists, execute step S10; S10: read the coordinates of all chips that failed to be written or read one by one, and record them as: marked coordinates; S11: the main control board sends a command to the x-axis stepper motor through the motor control board, driving the x-axis slide to move to the row or column where the marked coordinate is located; The main control board sends a command to the horizontal drive motor through the motor control board, and the marking slide drives the marking device to the top of the chip that fails to read the code, so as to mark the chip; S12: Repeat steps S10 to S11 until all chips that have failed to be written or read are marked; After marking is completed, reset the x-axis slide to its initial position; S13: Display the result of the write and read operation of each chip in the chips to be written and read.

Images