Manufacturing method of LED display panel, display panel and electronic equipment

Abstract

The application discloses a manufacturing method of an LED display panel, a display panel and electronic equipment. The manufacturing method of the LED display panel comprises the following steps: providing an LED display mother board, wherein the LED display mother board comprises a substrate and a plurality of LED luminophores arranged on the substrate, and the substrate drives the plurality of LED luminophores to emit light; manufacturing an encapsulation layer on the substrate, wherein the encapsulation layer covers the substrate and encapsulates the plurality of LED luminophores; and manufacturing a compensation film on the encapsulation layer, which is used for correcting the emitted light reflected from the substrate. The application can reduce the brightness unevenness and / or color unevenness of the LED display panel.

Description

Technical Field

[0001] This application relates to the field of LED display device technology, specifically to a method for manufacturing an LED display panel, the display panel, and an electronic device. Background Technology

[0002] An LED display panel is an active light-emitting display device that consists of several LED light-emitting units arranged at a certain spacing. When an LED display panel includes red, green, and blue LED light-emitting units, it can form a full-color LED display panel. LED display panels have advantages such as high brightness, low energy consumption, and long lifespan, and are widely used in daily life.

[0003] Because LED display panels contain numerous LED light-emitting units and it is difficult to maintain consistency in process parameters, the light-emitting parameters of each LED light-emitting unit are difficult to keep consistent. As a result, uneven display of the LED display panel will occur. This uneven display phenomenon is more likely to occur in large LED display panels that are spliced ​​together from multiple small LED display panels. Summary of the Invention

[0004] This application provides a method for manufacturing an LED display panel, the display panel itself, and an electronic device, which can improve the problem of uneven display in LED display panels.

[0005] In a first aspect, embodiments of this application provide a method for manufacturing an LED display panel, comprising:

[0006] An LED display motherboard is provided, wherein the LED display motherboard includes a substrate and a plurality of LED light emitters disposed on the substrate, and the substrate drives the plurality of LED light emitters to emit light;

[0007] An encapsulation layer is fabricated on the substrate, wherein the encapsulation layer covers the substrate and encapsulates the plurality of LED light emitters;

[0008] A compensation film is fabricated on the encapsulation layer to correct the outgoing light reflected from the substrate.

[0009] Further, the fabrication of the compensation film on the encapsulation layer includes:

[0010] The encapsulation layer is divided into multiple sub-regions;

[0011] Each sub-region is illuminated by an external light source with a first light parameter, and the second light parameter of the reflected light penetrating from each sub-region is obtained.

[0012] The first target optical parameters are determined based on the second optical parameters of all sub-regions;

[0013] The parameters of the compensation film in the current sub-region are determined based on the first target light parameters and the second light parameters corresponding to the current sub-region.

[0014] Fabricate a compensation film of the target thickness in the current sub-region, and complete the fabrication of compensation films in all sub-regions.

[0015] Further, the step of fabricating the compensation film in the current sub-region includes:

[0016] The compensation film is fabricated in the current sub-region using 3D printing, spraying, casting, or lamination processes.

[0017] Furthermore, before fabricating the encapsulation layer on the substrate, the method further includes:

[0018] A light-absorbing layer is formed on the substrate at the gap between the plurality of LED light emitters.

[0019] Furthermore, the encapsulation layer is formed by curing liquid optical adhesive, wherein the liquid optical adhesive is doped with scattering particles.

[0020] Furthermore, after fabricating the compensation film on the encapsulation layer, the method further includes:

[0021] Adjust the driving voltage of each LED to make the luminous parameters of each LED reach the second target light parameters.

[0022] Secondly, embodiments of this application provide an LED display panel, comprising:

[0023] LED display motherboard, wherein the LED display motherboard includes a substrate and a plurality of LED light emitters disposed on the substrate, and the substrate drives the plurality of LED light emitters to emit light;

[0024] An encapsulation layer covers the substrate and encapsulates the plurality of LED light emitters;

[0025] A compensation film, disposed on the encapsulation layer, is used to correct the emitted light reflected from the substrate.

[0026] Furthermore, the LED display panel also includes:

[0027] A light-absorbing layer is disposed on the substrate in the gap between the plurality of LED light emitters.

[0028] The LED display panel, wherein the compensation film and / or the light-absorbing layer is a black adhesive layer.

[0029] The LED display panel has an encapsulation layer formed by curing liquid optical adhesive, wherein the liquid optical adhesive is doped with scattering particles.

[0030] Thirdly, embodiments of this application provide an electronic device, including an LED display panel as described in any of the above embodiments.

[0031] In this embodiment, an encapsulation layer is fabricated on the substrate of the LED display motherboard, and then a compensation film is fabricated on the encapsulation layer to correct the emitted light reflected from the substrate. By fabricating a compensation film on the encapsulation layer, this application can correct the emitted light reflected from the substrate, so that the emitted light reflected from the substrate can tend to be uniform, thereby reducing the unevenness of brightness and / or color of the LED display panel. Attached Figure Description

[0032] The technical solution and its beneficial effects will become apparent from the following detailed description of specific embodiments of this application, in conjunction with the accompanying drawings.

[0033] Figure 1 This is a flowchart illustrating a method for manufacturing an LED display panel according to an embodiment of this application.

[0034] Figure 2 This is a schematic diagram of the structure of an LED display motherboard provided in an embodiment of this application.

[0035] Figure 3 This is a schematic diagram of the structure of an LED display panel provided in an embodiment of this application.

[0036] Figure 4 This is a schematic diagram of a process for fabricating a compensation film on an encapsulation layer, provided in an embodiment of this application.

[0037] Figure 5 This is a schematic diagram of a structure that divides the encapsulation layer into multiple sub-regions, as provided in an embodiment of this application.

[0038] Figure 6 This is a schematic diagram of another structure provided in this application embodiment, which divides the encapsulation layer into multiple sub-regions;

[0039] Figure 7 This is a schematic diagram of another LED display panel provided in an embodiment of this application. Detailed Implementation

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention and should not be regarded as limiting other specific embodiments not detailed herein. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Please see Figure 1 , Figure 1 This is a flowchart illustrating a method for manufacturing an LED display panel according to an embodiment of this application. The method may include steps S110-S130.

[0042] S110. An LED display motherboard is provided, wherein the LED display motherboard includes a substrate and a plurality of LED light emitters disposed on the substrate, and the substrate drives the plurality of LED light emitters to emit light.

[0043] As an example, a structural schematic diagram of the LED display motherboard 10 is shown below. Figure 2 As shown, the system includes a substrate 101 and a plurality of LED light emitters 102 disposed on the substrate 101. The LED light emitters 102 are arranged in a preset spacing on the substrate 101 and are electrically connected to the substrate 101.

[0044] As examples, substrate 101 can be a PCB circuit board on which necessary electronic components are soldered to form a driving circuit. LED light emitter 102 can be an LED bead or an LED chip. Therefore, LED display motherboard 10 can be a general LED display motherboard, a mini LED display motherboard, or a micro LED display motherboard; this application does not impose any particular limitation.

[0045] When the LED display motherboard 10 is connected to an external power source, the driving circuit of the substrate 101 can provide a driving voltage to each LED light emitter 102, driving the LED light emitter 102 to emit light. The light emitted by the LED light emitter 102 can be white light, forming a white LED display motherboard, or it can be red light, green light, or blue light. The three different colored LED light emitters 102 constitute a pixel, forming a color LED display motherboard.

[0046] S120. An encapsulation layer is fabricated on a substrate, wherein the encapsulation layer covers the substrate and encapsulates multiple LED light emitters.

[0047] It should be noted that after the LED light-emitting element 102 is electrically connected to the substrate 101, the LED light-emitting element 102 can be encapsulated by forming an encapsulation layer 20 on the substrate 101, such as... Figure 2 As shown, the encapsulation layer 20 encapsulates all LED light emitters 102 to protect the electronic components on the substrate 101 and the electrical connection between the substrate 101 and the LED light emitters 102.

[0048] As an example, a liquid optical adhesive can be coated on the side of the substrate 101 facing the LED light emitter 102, covering the substrate 101 and encapsulating all the LED light emitters 102. The liquid optical adhesive can be a high-transmittance optical adhesive such as acrylic resin or epoxy resin, and then the encapsulation layer 20 is formed by photocuring or thermal curing. Preferably, scattering particles, such as Al2O3, can be doped into the liquid optical adhesive, so that after the LED light emitter 102 shines towards the encapsulation layer 20, the light is scattered by the scattering particles, resulting in more uniform emitted light.

[0049] S130. A compensation film is fabricated on the encapsulation layer to correct the outgoing light reflected from the substrate.

[0050] Because an LED display panel contains numerous LED light emitters 102, and because it is difficult to maintain absolute consistency in process parameters, the light emission parameters of each LED light emitter 102 are difficult to keep consistent, resulting in uneven display of the LED display panel.

[0051] Please see Figure 3 After in-depth research and analysis, the applicant determined that the uneven display of the LED display panel is mainly due to the inconsistent color of the substrate 101 surface. This results in differences in the intensity and / or color of the emitted light L1, generated by the diffuse reflection of light emitted by the LED light source 102 after passing through the surface of the substrate 101. This is particularly true when the LED display panel is composed of multiple LED display motherboards 10, where the color differences on the substrate 101 surfaces of different LED display motherboards 10 are significant. For example, when manufacturing a black substrate 101, as the number of printing cycles increases, the ink thickens and its relative composition changes, leading to significant differences in the blackness of substrates 101 produced in earlier and later batches. This is currently unavoidable in actual production.

[0052] For the reasons mentioned above, any means that can overcome the aforementioned technical problems can correct the emitted light reflected from the substrate 101 to reduce the unevenness of brightness and / or color in the LED display panel. For example, a compensation film 30 can be fabricated on the encapsulation layer 20. Through the absorption of light or partial destructive interference by the compensation film 30, the emitted light L1 reflected from the substrate 101 can be corrected so that the emitted light L1 reflected from the substrate can become more uniform, thereby reducing the unevenness of brightness and / or color in the LED display panel.

[0053] As an example, the compensation film 30 can be a black adhesive layer. For instance, a black adhesive layer can be coated on the encapsulation layer 20. One way to achieve this is by adding graphite powder to a transparent resin. The black graphite powder dispersed in the transparent resin has a certain absorption effect on the reflected light, thereby reducing the impact of reflected light on the uneven display of the LED display panel and achieving the effect of correcting the emitted light reflected from the substrate 101. In some examples, the transparent resin can be epoxy resin or black silicone resin, such as organosilicon, methyl silicone resin, fluorosilicone resin, etc.

[0054] In addition, applying a black adhesive layer to the encapsulation layer 20 can improve the color consistency of the LED display panel.

[0055] In one embodiment, such as Figure 4 Step S130 may include:

[0056] S131. Divide the encapsulation layer into multiple sub-regions.

[0057] For example, the encapsulation layer 20 can be divided into multiple sub-regions 201 according to the type or size of the LED display panel.

[0058] As an example, such as Figure 5 As shown, for a white LED display panel, every four LED emitters 102 can be considered as a sub-region 201. Of course, a sub-region 201 can also include one, two, three or more adjacent LED emitters 102.

[0059] As another example, such as Figure 6 As shown, a color LED display panel includes red-emitting LEDs 102, blue-emitting LEDs 102, and green-emitting LEDs 102, with each of the three colors constituting a pixel. Every three pixels can be considered as a sub-region 201; however, a sub-region 201 can also include one, two, three, or more adjacent pixels.

[0060] In other examples, for a large LED display panel assembled from multiple LED display motherboards 10, each LED display motherboard 10 can be considered as a sub-region 201. During manufacturing, each LED display motherboard 10 can be classified according to its optical parameters; for example, LEDs of the same level have substantially the same brightness and / or color. The same LED display motherboard 10 can be manufactured using LEDs of the same level to maintain the uniformity of the display across individual LED display motherboards 10. Therefore, during optical parameter correction, each LED display motherboard 10 can be considered as a sub-region 201.

[0061] It is understandable that the fewer LED emitters 102 contained in sub-region 201, the higher the calibration accuracy, but the manufacturing cost will also increase. Since the unevenness of large LED display panels often comes from the differences between different LED display motherboards 10, this embodiment uses each LED display motherboard 10 as a sub-region 201 to avoid the subsequent tedious calculation processing, greatly reducing the manufacturing difficulty and improving the calibration efficiency.

[0062] S132. Illuminate each sub-region with an external light source having a first light parameter, and obtain the second light parameter of the reflected light penetrating from each sub-region.

[0063] After dividing the encapsulation layer 20 into multiple sub-regions 201, each sub-region 201 can be illuminated by an external light source with a first optical parameter (denoted as C0) to obtain the second optical parameter C of the reflected light penetrating from each sub-region 201. i (i = 1, 2, 3, ...).

[0064] As an example, the external light source can be a surface light source with a first optical parameter, which may include, but is not limited to, information such as brightness and color. It is understood that the brightness / color of this surface light source is uniform. The external light source illuminates each sub-region 201, penetrates the encapsulation layer 20, illuminates the substrate 101, and is reflected. The reflected light, after penetrating each sub-region 201, has a second optical parameter. The second optical parameter may include, but is not limited to, information such as brightness and color. For example, if the first and second optical parameters are both brightness, it is understood that the emitted light corresponding to each sub-region 201 is lower than the brightness value of the external light source.

[0065] As an example, the area of ​​the external light source can cover one sub-region 201. By moving the external light source to illuminate each sub-region 201 in turn, the second optical parameters of the corresponding reflected light are obtained. In another example, the area of ​​the external light source can cover two or more sub-regions 201.

[0066] As an example, the area of ​​the external light source can cover the entire encapsulation layer 20, and can illuminate all sub-regions 201 at once, and then obtain the second optical parameters of the corresponding reflected light in sequence.

[0067] S133. Determine the first target optical parameters based on the second optical parameters of all sub-regions.

[0068] After determining the second optical parameters of the reflected light in all sub-regions 201, the first target optical parameter C can be determined. aim1 The first target light parameter is the light parameter of the reflected light after 201 correction for all sub-regions. It can be understood that C...aim1 ≤C i .

[0069] As an example, the second optical parameter with the smallest value among all the second optical parameters can be used as the first target optical parameter, i.e., C. aim1 =min{C1,C2,C3,…}. For example, the emitted light intensities (in nits) of the four sub-regions 201 are 310, 315, 318, and 320, respectively. The first target light parameter can be 310, or it can be a value less than 310, such as 300.

[0070] S134. Determine the parameters of the compensation film in the current sub-region based on the first target light parameters and the second light parameters corresponding to the current sub-region.

[0071] After determining the first target optical parameter C aim1 Then, the parameters of the compensation film 30 of the current sub-region 201 can be determined based on the first target light parameter and the second light parameter corresponding to the current sub-region 201, such as the target thickness H of the compensation film 30. aimi (i = 1, 2, 3, ...). For a known material (compensation film 30), after determining the incident light parameters (first optical parameters) and the reflected light parameters (second optical parameters) at the i-th sub-region 201, the required thickness of the compensation film 30 (target thickness H) for the i-th sub-region 201 can be calculated. aimi ).

[0072] For example, in the aforementioned embodiment, if the emitted light intensity of all four sub-regions 201 needs to be corrected to 300, then the compensation film of the first sub-region 201 needs to absorb 10 nits of light intensity, the compensation film of the second sub-region 201 needs to absorb 15 nits of light intensity, the compensation film of the third sub-region 201 needs to absorb 18 nits of light intensity, and the compensation film of the fourth sub-region 201 needs to absorb 20 nits of light intensity.

[0073] Color compensation can be achieved by correcting the R / G / B values, based on the same principle as above, and will not be elaborated further in this application.

[0074] S135. Create a compensation membrane in the current sub-region and complete the creation of compensation membranes in all sub-regions.

[0075] After determining the parameters of the compensation membrane 30 for all sub-regions 201 (e.g., target thickness H), aimi After that, a compensation film of corresponding thickness can be fabricated in each sub-region 201. That is, when the thickness of the compensation film 30 fabricated in the i-th sub-region 201 is H... aimiWhen incident light enters the compensation film 30 and encapsulation layer 20 at this location, and is reflected by the substrate 101 before passing through the encapsulation layer 20 and compensation film 30, the light parameters are attenuated from the first light parameter to the second light parameter. This makes the ambient light emitted from the LED display panel more uniform, improving the problem of uneven display brightness of the LED display panel.

[0076] As examples, compensation films can be fabricated in the current sub-region using processes such as 3D printing, spraying, casting, or lamination. It should be noted that after calculating parameters such as the thickness and color of the compensation film, 3D printing can achieve precise control over the thickness and color of the compensation film in each sub-region.

[0077] In this embodiment, an external light source with a first light parameter directly illuminates the LED display panel, and the second light parameter of the reflected outgoing light is obtained. Based on the second light parameter, the first target light parameter is determined, and then the parameters of the compensation film for each sub-region of the LED display panel are calculated. Finally, the compensation film can be fabricated using methods such as 3D printing. This embodiment uses an external light source to correct the display unevenness of the display panel. Furthermore, when ambient light enters the LED display motherboard 10, the reflected light L2 formed after reaching the substrate 101 will tend to be uniform, thereby improving the color consistency of the LED display panel.

[0078] In one embodiment, prior to step S120, the following may also be included:

[0079] S111. A light-absorbing layer is formed in the gap between multiple LED light emitters on the substrate.

[0080] Please see Figure 3 and Figure 7 A light-absorbing layer 40 can be formed in the gap between multiple LED light emitters on the substrate 101 to absorb the light incident on the substrate 101. For example, most of the light incident on the substrate 101 by the LED light emitters is absorbed by the light-absorbing layer 40, which can reduce the diffuse reflection of the substrate 101 and generate reflected light of varying intensity, thereby further improving the display uniformity of the LED display panel.

[0081] In some examples, the light-absorbing layer 40 can be made of a light-absorbing material. For example, the light-absorbing material can be a material that has good absorption properties for LED light of a specific wavelength; the light-absorbing material can also be a general black ink material. The black glue layer formed by black ink can absorb most of the light and has a low reflectivity, thereby reducing the interference of reflected light L1 on the LED display panel and improving the display uniformity of the LED display panel. In this embodiment, the reflected light L1 is absorbed by the light-absorbing layer 40, which can greatly reduce the intensity of the reflected light. Then, after being absorbed by the compensation film, the emitted reflected light L1 is almost zero, which can greatly reduce the intensity of the reflected light and alleviate the unevenness of brightness and / or color of the LED display panel; at the same time, the reflected light L2 generated by ambient light incident on the substrate 101 is also greatly reduced, thereby simultaneously improving the contrast of the LED display panel.

[0082] In one embodiment, after step S130, the following may also be included:

[0083] S140. Adjust the driving voltage of each LED to make the luminous parameters of each LED reach the second target light parameters.

[0084] Due to manufacturing errors, the luminous parameters of each LED 102 cannot be kept consistent. Under the same driving voltage, LEDs 102 of the same specifications (brightness and / or luminous color) may exhibit inconsistent luminous brightness and color. Therefore, in this embodiment, the second target light parameter (C) of the LED 102 can be predetermined. aim2 Then, by adjusting the driving voltage of each LED 102 to achieve the second target light parameter, the light emission parameters of all LEDs 102 tend to be consistent, thereby improving the display uniformity of the LED display panel.

[0085] It should be noted that in the above embodiments, the first optical parameter, the second optical parameter, the first target optical parameter, and the second target optical parameter can be a fixed value or a range of values. This application does not impose any particular limitation.

[0086] Please see Figure 7 This application embodiment also provides an LED display panel, including an LED display motherboard 10, an encapsulation layer 20, and a compensation film 30.

[0087] The LED display motherboard 10 includes a substrate 101 and a plurality of LED light emitters 102 disposed on the substrate 101, wherein the substrate 101 drives the plurality of LED light emitters 102 to emit light.

[0088] The encapsulation layer 20 covers the substrate 101 and encapsulates multiple LED light emitters 102;

[0089] A compensation film 30 is disposed on the encapsulation layer 20 and is used to correct the outgoing light reflected from the substrate 101.

[0090] In one embodiment, the LED display panel may further include:

[0091] The light-absorbing layer 40 is disposed in the gap between multiple LED light emitters 102 on the LED display motherboard 10.

[0092] In one embodiment, the compensation film and / or light-absorbing layer is a black adhesive layer.

[0093] In one embodiment, the encapsulation layer is formed by curing a liquid optical adhesive, wherein the liquid optical adhesive is doped with scattering particles.

[0094] This application also provides an electronic device that includes the LED display panel described in the above embodiments.

[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed description of the chip above, which will not be repeated here.

[0096] The LED display panel provided in this application embodiment and the LED display panel manufacturing method in the above embodiment belong to the same concept. Any of the methods in the LED display panel manufacturing method can be used to manufacture the corresponding LED display panel. For the specific structure of the LED display panel, please refer to the LED display panel manufacturing method embodiment, which will not be repeated here.

[0097] The foregoing has provided a detailed description of a method for manufacturing an LED display panel, the display panel itself, and an electronic device, as provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. At the same time, those skilled in the art will recognize that there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing an LED display panel, characterized in that, include: An LED display motherboard is provided, wherein the LED display motherboard includes a substrate and a plurality of LED light emitters disposed on the substrate, and the substrate drives the plurality of LED light emitters to emit light; An encapsulation layer is fabricated on the substrate, wherein the encapsulation layer covers the substrate and encapsulates the plurality of LED light emitters; A compensation film is fabricated on the encapsulation layer to correct the outgoing light reflected from the substrate; On the encapsulation layer Fabrication of the compensation membrane includes: The encapsulation layer is divided into multiple sub-regions; Each sub-region is illuminated by an external light source with a first light parameter, and the second light parameter of the reflected light penetrating from each sub-region is obtained. The first target optical parameters are determined based on the second optical parameters of all sub-regions; The parameters of the compensation film in the current sub-region are determined based on the first target light parameters and the second light parameters corresponding to the current sub-region. The compensation film is fabricated in the current sub-region using 3D printing, spraying, casting, or lamination processes, and the fabrication of compensation films in all sub-regions is completed.

2. The method for manufacturing an LED display panel according to claim 1, characterized in that, Before fabricating the encapsulation layer on the substrate, the method further includes: A light-absorbing layer is formed on the substrate at the gap between the plurality of LED light emitters.

3. The method for manufacturing an LED display panel according to claim 1, characterized in that, The encapsulation layer is formed by curing liquid optical adhesive, wherein the liquid optical adhesive is doped with scattering particles.

4. The method for manufacturing an LED display panel according to claim 1, characterized in that, After fabricating the compensation film on the encapsulation layer, the method further includes: Adjust the driving voltage of each LED to make the luminous parameters of each LED reach the second target light parameters.

5. An LED display panel, characterized in that, include: LED display motherboard, wherein the LED display motherboard includes a substrate and a plurality of LED light emitters disposed on the substrate, and the substrate drives the plurality of LED light emitters to emit light; An encapsulation layer covers the substrate and encapsulates the plurality of LED light emitters; A compensation film, disposed on the encapsulation layer, is used to correct the outgoing light reflected from the substrate; The manufacturing process of the compensation membrane is as follows: The encapsulation layer is divided into multiple sub-regions; Each sub-region is illuminated by an external light source with a first light parameter, and the second light parameter of the reflected light penetrating from each sub-region is obtained. The first target optical parameters are determined based on the second optical parameters of all sub-regions; The parameters of the compensation film in the current sub-region are determined based on the first target light parameters and the second light parameters corresponding to the current sub-region. The compensation film is fabricated in the current sub-region using 3D printing, spraying, casting, or lamination processes, and the fabrication of compensation films in all sub-regions is completed.

6. The LED display panel according to claim 5, characterized in that, Also includes: A light-absorbing layer is disposed on the substrate in the gap between the plurality of LED light emitters.

7. The LED display panel according to claim 6, characterized in that, The compensation film and / or the light-absorbing layer are black adhesive layers.

8. An electronic device, characterized in that, Includes the LED display panel as described in any one of claims 5-7.

Images