A method for evaluating inter-stage decoupling of millimeter wave integrated circuits

Abstract

The present invention provides an inter-stage decoupling evaluation method for a millimeter wave integrated circuit, which belongs to the technical field of semiconductor devices, and specifically comprises: building a target circuit based on a PCB of an integrated circuit, and using HFSS to model the coupling condition of the target circuit to obtain an electric field coupling condition; determining stacking information, glass fiber cloth parameters, and wiring information of a PCB board stack of the integrated circuit, building a stacking simulation module based on the stacking information, and building a glass fiber cloth simulation module based on the glass fiber cloth parameters; building a basic coupling model based on the stacking simulation module, the glass fiber cloth simulation module, and the wiring information, and obtaining a basic coupling condition based on the basic coupling model; obtaining an overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and performing decoupling processing on the integrated circuit based on the overall coupling result, thereby combining the two, which has a good guiding significance for decoupling evaluation.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to an inter-stage decoupling evaluation method for a millimeter wave integrated circuit. Background Art

[0002] Millimeter waves generally refer to electromagnetic waves with a frequency range of 30 to 300 GHz, that is, their wavelength is in the millimeter range. At present, millimeter wave technology is widely used in radio astronomy, space communications, and weapon systems. With the development and maturity of millimeter wave design and processing technology, large-capacity, high-speed, and short-wavelength millimeter wave technology will be further used in mobile communications, consumer electronics, biomedicine, industrial detection, and other fields, and will have a significant impact on human life. For example, the fifth-generation mobile communication technology (5th generation mobile networks, 5G) will use millimeter wave technology in micro base stations to achieve broadband high-speed communication, thereby improving user experience; vehicle-mounted millimeter wave radars can detect driving environments in extreme weather environments such as night and fog, and improve the rapid and accurate detection and information processing capabilities of intelligent driving sensing parts; millimeter wave imaging technology can use the different millimeter wave absorption and reflection characteristics of various materials to complete the detection of obstructed objects and tiny cracks in objects, and realize applications in security inspection and flaw detection.

[0003] In the master's thesis "Analysis and Modeling of Transition and Parasitic Modes of LTCC Millimeter-wave Integrated Transmission Lines", the author Xu Xin proposed the concept of parasitic modes in order to achieve decoupling between different chips and communication channels between levels of integrated circuits, summarized the types of various parasitic modes, and systematically and detailedly discussed and analyzed various electromagnetic field parasitic modes. The types, mechanisms and propagation characteristics of parasitic modes excited by the discontinuity of the transmission circuit structure were derived using relevant theories and formulas, and the influence of parasitic modes on circuits and methods of suppression were discussed. A specific analysis model was established using the three-dimensional electromagnetic field simulation software HFSS to concretize the problem, focusing on the analysis of parasitic surface wave modes and parallel plate waveguide modes. Using the powerful modeling and data functions of the software, parameters were extracted and field diagrams were drawn, and the propagation characteristics and influence of parasitic modes were qualitatively and quantitatively analyzed. The corresponding parasitic mode suppression structure was discussed and the feasibility of the model was verified. These structures can be used in actual LTCC circuits to improve the RF performance of millimeter-wave integrated circuits. However, they do not take into account the stacking information and glass fiber cloth parameters in the integrated circuits, and do not build an overall decoupling model based on all factors. The analysis of the decoupling situation of the integrated circuit does not have a good guiding significance.

[0004] In view of the above technical problems, the present invention provides an inter-stage decoupling evaluation method for millimeter wave integrated circuits. Summary of the invention

[0005] To achieve the purpose of the present invention, the present invention adopts the following technical solutions:

[0006] According to one aspect of the present invention, a method for evaluating inter-stage decoupling of a millimeter wave integrated circuit is provided.

[0007] A method for evaluating inter-stage decoupling of a millimeter wave integrated circuit, characterized by comprising:

[0008] S1 builds a target circuit based on the PCB of the integrated circuit, and uses the electromagnetic field simulation software HFSS to model the coupling condition of the target circuit to obtain the electric field coupling condition;

[0009] S2 determines the stacking information, glass fiber cloth parameters, and wiring information of the PCB board stack of the integrated circuit, builds a stacking simulation module based on the stacking information of the PCB board stack of the integrated circuit, and builds a glass fiber cloth simulation module based on the glass fiber cloth parameters;

[0010] S3: building a basic coupling model based on the stacking simulation module, the glass fiber cloth simulation module, and wiring information, and obtaining a basic coupling condition based on the basic coupling model;

[0011] S4: obtaining an overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and performing a decoupling process on the integrated circuit based on the overall coupling result.

[0012] By using a PCB based on an integrated circuit to build a target circuit, and using electromagnetic field simulation software to simulate and analyze the circuit coupling situation, different coupling values ​​between chip signal transmission lines can be obtained for the integrated circuit under different millimeter waves, and then the final electric field coupling situation is obtained by analyzing the coupling values ​​between different chip signal transmission lines. By constructing a stacking simulation module of the integrated circuit, the glass fiber cloth simulation module, and wiring information to build a basic coupling model, the basic coupling situation under the premise of basic wiring and materials can be obtained. After superimposing the electric field coupling situation under the electromagnetic field and the basic coupling situation, the overall coupling result of the integrated circuit can be obtained. When the overall coupling result is greater than the threshold setting or is too large, the overall coupling situation can be reduced by decoupling means, thereby solving the problem of not considering the stacking information and glass fiber cloth parameters in the integrated circuit, and not building an overall decoupling model based on all factors to analyze the decoupling situation of the integrated circuit, thereby further improving the overall decoupling analysis accuracy, which has a good guiding significance for further reducing the overall decoupling situation.

[0013] By using a PCB based on an integrated circuit to build a target circuit, and using the electromagnetic field simulation software HFSS to model the coupling of the target circuit, the electric field coupling is obtained, so that the analysis of the PCB of the integrated circuit is not limited to hardware conditions such as wiring, but is also combined with the working environment, further improving the accuracy of the overall coupling analysis. By using the stacking simulation module, the glass fiber cloth simulation module, and wiring information to build a basic coupling model, and based on the basic coupling model, the basic coupling is obtained, so that the basic factors affecting the circuit coupling in the basic circuit are fully considered, and the accuracy of the overall coupling analysis is further improved. By using the overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and decoupling the integrated circuit based on the overall coupling result, the final result not only considers the basic factors, but also considers the actual impact of the electromagnetic field, and is combined with the on-site working environment, so that the coupling evaluation result becomes more accurate and the overall guiding significance becomes higher.

[0014] A further technical solution is that the target circuit includes the PCB board stacking information of the integrated circuit, the wiring information, the setting information of the grounding metal sheet connected by metal through holes of the PCB board of the integrated circuit, and the setting information of the metal signal through holes.

[0015] By comprehensively considering the board base information, wiring information, and the grounding metal sheets and metal signal vias that affect the electromagnetic field distribution, the accuracy of the overall coupling analysis is further improved, and the electromagnetic field analysis can accurately analyze multiple factors, not only the basic factors but also the various factors that affect the electromagnetic field distribution, thereby further making the final result more instructive.

[0016] A further technical solution is that the wiring information includes the number of routing lines, routing layout, guide angle, and routing width.

[0017] Multiple factors of routing are taken into consideration, so that the impact of wiring information on the final coupling situation can be fully considered, further enhancing the overall guiding significance.

[0018] A further technical solution is that the setting information of the grounding metal sheet connected by the metal through-holes on the PCB board of the integrated circuit includes the number of the metal through-holes, the area of ​​the metal through-holes, the position of the grounding metal sheet, and the area of ​​the grounding metal sheet.

[0019] A further technical solution is that the setting information of the metal signal through hole includes the position of the metal signal through hole and the area of ​​the metal signal through hole.

[0020] A further technical solution is that the PCB board stacking information includes the number of layers of the PCB board and the material of the PCB board.

[0021] A further technical solution is that the electric field coupling condition is to select two sets of characteristic frequencies of 50 Hz and 300 Hz at least at the frequency of millimeter waves, and the 50 Hz sum and 300 Hz sum of the coupling decibel values ​​of different routings at the frequencies of 50 Hz and 300 Hz are averaged to obtain the 50 Hz sum and the 300 Hz sum.

[0022] The frequency of millimeter waves is between 50 and 300 GHz. It is obtained by selecting the highest and lowest two groups of frequencies and averaging the coupling decibel values ​​of different characteristic values. It can also be obtained by randomly selecting one or two groups of characteristic frequencies between 50 and 300 GHz and averaging them with the above electric field coupling conditions. This allows the obtained electric field coupling conditions to be combined with the actual situation, which is more instructive.

[0023] A further technical solution is that the basic coupling condition is the sum of coupling decibel values ​​of different routings.

[0024] A further technical solution is that it also includes a first threshold value, and when the overall coupling result is greater than the first threshold value, the integrated circuit is decoupled.

[0025] A further technical solution is that the decoupling process uses a guide angle process, adds a grounding metal sheet connected by a metal through hole, adds one or more metal signal through holes, and confirms the decoupling result through the electromagnetic field simulation software HFSS. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

[0027] Figure 1 It is a flow chart of an inter-stage decoupling evaluation method of a millimeter wave integrated circuit according to Example 1.

[0028] Figure 2 It is a composition diagram of the setting information of the grounding metal sheet connected by the metal through-holes of the PCB board of the integrated circuit according to the first embodiment. DETAILED DESCRIPTION

[0029] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0030] The terms "a", "an", "the", and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0031] Millimeter waves generally refer to electromagnetic waves with a frequency range of 30 to 300 GHz, that is, their wavelength is in the millimeter range. At present, millimeter wave technology is widely used in radio astronomy, space communications, and weapon systems. With the development and maturity of millimeter wave design and processing technology, large-capacity, high-speed, and short-wavelength millimeter wave technology will be further used in mobile communications, consumer electronics, biomedicine, industrial detection, and other fields, and will have a significant impact on human life. For example, the fifth-generation mobile communication technology (5th generation mobile networks, 5G) will use millimeter wave technology in micro base stations to achieve broadband high-speed communication, thereby improving user experience; vehicle-mounted millimeter wave radars can detect driving environments in extreme weather environments such as night and fog, and improve the rapid and accurate detection and information processing capabilities of intelligent driving sensing parts; millimeter wave imaging technology can use the different millimeter wave absorption and reflection characteristics of various materials to complete the detection of obstructed objects and tiny cracks in objects, and realize applications in security inspection and flaw detection.

[0032] In the master's thesis "Analysis and Modeling of Transition and Parasitic Modes of LTCC Millimeter-wave Integrated Transmission Lines", the author Xu Xin proposed the concept of parasitic modes in order to achieve decoupling between different chips and communication channels between levels of integrated circuits, summarized the types of various parasitic modes, and systematically and detailedly discussed and analyzed various electromagnetic field parasitic modes. The types, mechanisms and propagation characteristics of parasitic modes excited by the discontinuity of the transmission circuit structure were derived using relevant theories and formulas, and the influence of parasitic modes on circuits and methods of suppression were discussed. A specific analysis model was established using the three-dimensional electromagnetic field simulation software HFSS to concretize the problem, focusing on the analysis of parasitic surface wave modes and parallel plate waveguide modes. Using the powerful modeling and data functions of the software, parameters were extracted and field diagrams were drawn, and the propagation characteristics and influence of parasitic modes were qualitatively and quantitatively analyzed. The corresponding parasitic mode suppression structure was discussed and the feasibility of the model was verified. These structures can be used in actual LTCC circuits to improve the RF performance of millimeter-wave integrated circuits. However, they do not take into account the stacking information and glass fiber cloth parameters in the integrated circuits, and do not build an overall decoupling model based on all factors. The analysis of the decoupling situation of the integrated circuit does not have a good guiding significance.

[0033] Example 1

[0034] To solve the above problems, according to one aspect of the present invention, Figure 1 As shown, a method for evaluating inter-stage decoupling of a millimeter-wave integrated circuit is provided.

[0035] A method for evaluating inter-stage decoupling of a millimeter wave integrated circuit, characterized by comprising:

[0036] S1 builds a target circuit based on the PCB of the integrated circuit, and uses the electromagnetic field simulation software HFSS to model the coupling condition of the target circuit to obtain the electric field coupling condition;

[0037] S2 determines the stacking information, glass fiber cloth parameters, and wiring information of the PCB board stack of the integrated circuit, builds a stacking simulation module based on the stacking information of the PCB board stack of the integrated circuit, and builds a glass fiber cloth simulation module based on the glass fiber cloth parameters;

[0038] S3: building a basic coupling model based on the stacking simulation module, the glass fiber cloth simulation module, and wiring information, and obtaining a basic coupling condition based on the basic coupling model;

[0039] S4: obtaining an overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and performing a decoupling process on the integrated circuit based on the overall coupling result.

[0040] To give a specific example, if the electric field coupling is 300dB and the basic coupling is 200dB, the overall coupling result is 500dB, and decoupling can be performed through decoupling means.

[0041] By using a PCB based on an integrated circuit to build a target circuit, and using electromagnetic field simulation software to simulate and analyze the circuit coupling situation, different coupling values ​​between chip signal transmission lines can be obtained for the integrated circuit under different millimeter waves, and then the final electric field coupling situation is obtained by analyzing the coupling values ​​between different chip signal transmission lines. By constructing a stacking simulation module of the integrated circuit, the glass fiber cloth simulation module, and wiring information to build a basic coupling model, the basic coupling situation under the premise of basic wiring and materials can be obtained. After superimposing the electric field coupling situation under the electromagnetic field and the basic coupling situation, the overall coupling result of the integrated circuit can be obtained. When the overall coupling result is greater than the threshold setting or is too large, the overall coupling situation can be reduced by decoupling means, thereby solving the problem of not considering the stacking information and glass fiber cloth parameters in the integrated circuit, and not building an overall decoupling model based on all factors to analyze the decoupling situation of the integrated circuit, thereby further improving the overall decoupling analysis accuracy, which has a good guiding significance for further reducing the overall decoupling situation.

[0042] By using a PCB based on an integrated circuit to build a target circuit, and using the electromagnetic field simulation software HFSS to model the coupling of the target circuit, the electric field coupling is obtained, so that the analysis of the PCB of the integrated circuit is not limited to hardware conditions such as wiring, but is also combined with the working environment, further improving the accuracy of the overall coupling analysis. By using the stacking simulation module, the glass fiber cloth simulation module, and wiring information to build a basic coupling model, and based on the basic coupling model, the basic coupling is obtained, so that the basic factors affecting the circuit coupling in the basic circuit are fully considered, and the accuracy of the overall coupling analysis is further improved. By using the overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and decoupling the integrated circuit based on the overall coupling result, the final result not only considers the basic factors, but also considers the actual impact of the electromagnetic field, and is combined with the on-site working environment, so that the coupling evaluation result becomes more accurate and the overall guiding significance becomes higher.

[0043] In another possible embodiment, the target circuit includes the PCB board stacking information of the integrated circuit, the wiring information, the setting information of the grounding metal sheet connected by metal through holes of the PCB board of the integrated circuit, and the setting information of the metal signal through holes.

[0044] By comprehensively considering the board base information, wiring information, and the grounding metal sheets and metal signal vias that affect the electromagnetic field distribution, the accuracy of the overall coupling analysis is further improved, and the electromagnetic field analysis can accurately analyze multiple factors, not only the basic factors but also the various factors that affect the electromagnetic field distribution, thereby further making the final result more instructive.

[0045] In another possible embodiment, the wiring information includes the number of routing lines, routing layout, guide angle, and routing width.

[0046] Multiple factors of routing are taken into consideration, so that the impact of wiring information on the final coupling situation can be fully considered, further enhancing the overall guiding significance.

[0047] In another possible embodiment, the setting information of the grounding metal sheet connected by the metal through-holes on the PCB board of the integrated circuit includes the number of the metal through-holes, the area of ​​the metal through-holes, the position of the grounding metal sheet, and the area of ​​the grounding metal sheet.

[0048] In another possible embodiment, the setting information of the metal signal via includes the position of the metal signal via and the area of ​​the metal signal via.

[0049] In another possible embodiment, the PCB board stacking information includes the number of layers of the PCB board and the material of the PCB board.

[0050] In another possible embodiment, the electric field coupling condition is to select two sets of characteristic frequencies of 50 Hz and 300 Hz at least at the frequency of millimeter waves, and the 50 Hz sum and 300 Hz sum of the coupling decibel values ​​of different routings at the frequencies of 50 Hz and 300 Hz are averaged to obtain the 50 Hz sum and the 300 Hz sum.

[0051] The frequency of millimeter waves is between 50 and 300 GHz. It is obtained by selecting the highest and lowest two groups of frequencies and averaging the coupling decibel values ​​of different characteristic values. It can also be obtained by randomly selecting one or two groups of characteristic frequencies between 50 and 300 GHz and averaging them with the above electric field coupling conditions. This allows the obtained electric field coupling conditions to be combined with the actual situation, which is more instructive.

[0052] In another possible embodiment, the basic coupling condition is the sum of coupling decibel values ​​of different routing lines.

[0053] In another possible embodiment, a first threshold is further included, and when the overall coupling result is greater than the first threshold, decoupling processing is performed on the integrated circuit.

[0054] In another possible embodiment, the decoupling process uses a guide angle process, adds a grounding metal sheet connected by a metal through hole, adds one or more metal signal through holes, and confirms the decoupling result through the electromagnetic field simulation software HFSS.

[0055] In the embodiments of the present invention, the term "plurality" refers to two or more than two, unless otherwise clearly defined. The terms "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to the specific circumstances.

[0056] In the description of the embodiments of the present invention, it needs to be understood that the directions or positional relationships indicated by the terms "upper" and "lower" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the embodiments of the present invention.

[0057] In the description of this specification, the description of the terms "one embodiment", "a preferred embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for evaluating inter-stage decoupling of a millimeter wave integrated circuit, characterized in that: Specifically include: S1. Build a target circuit based on the PCB of the integrated circuit, and use the electromagnetic field simulation software HFSS to model the coupling condition of the target circuit to obtain the electric field coupling condition; S2: Determine the stacking information, glass fiber cloth parameters, and wiring information of the PCB board stacking of the integrated circuit, construct a stacking simulation module based on the stacking information of the PCB board stacking of the integrated circuit, and construct a glass fiber cloth simulation module based on the glass fiber cloth parameters; S3: building a basic coupling model based on the stacking simulation module, the glass fiber cloth simulation module, and wiring information, and obtaining a basic coupling condition based on the basic coupling model; S4: obtaining an overall coupling result of the integrated circuit based on the basic coupling condition and the electric field coupling condition, and performing a decoupling process on the integrated circuit based on the overall coupling result; The electric field coupling condition is to select two sets of characteristic frequencies of 50 Hz and 300 Hz at least at the frequency of millimeter wave, and the 50 Hz sum and 300 Hz sum of the coupling decibel values ​​of different routings at the frequencies of 50 Hz and 300 Hz are averaged to obtain the 50 Hz sum and the 300 Hz sum.

2. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 1, characterized in that: The wiring information includes the number of routing lines, routing layout, guide angle, and routing width.

3. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 2, characterized in that: The target circuit includes the PCB board stacking information of the integrated circuit, the wiring information, the setting information of the grounding metal sheet connected by the metal through hole of the PCB board of the integrated circuit, and the setting information of the metal signal through hole.

4. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 3, characterized in that: The setting information of the grounding metal sheet connected by the metal through-holes on the PCB board of the integrated circuit includes the number of the metal through-holes, the area of ​​the metal through-holes, the position of the grounding metal sheet, and the area of ​​the grounding metal sheet.

5. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 3, characterized in that: The arrangement information of the metal signal via includes the position of the metal signal via and the area of ​​the metal signal via.

6. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 3, characterized in that: The PCB board stacking information includes the number of layers of the PCB board and the material of the PCB board.

7. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 1, characterized in that: The basic coupling condition is the sum of coupling decibel values ​​of different routings.

8. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 1, characterized in that: It also includes a first threshold. When the overall coupling result is greater than the first threshold, decoupling processing is performed on the integrated circuit.

9. The method for evaluating inter-stage decoupling of a millimeter wave integrated circuit as claimed in claim 1, characterized in that: The decoupling process adopts guide angle processing, adds one or more grounding metal sheets connected by metal through holes, and adds one or more metal signal through holes, and confirms the decoupling result through the electromagnetic field simulation software HFSS.

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