An optical module

Abstract

The present invention relates to the field of optical communication technology, and provides an optical module, including a shell composed of an upper cover and a base, and an optical fiber arranged in the shell, the head and tail ends of the optical fiber are respectively connected to an optical port adapter and a circuit board, and the middle part of the optical fiber is clamped by conductive soft glue arranged above and below, and the two sides of the conductive soft glue facing away from the optical fiber are respectively in contact with the upper cover and the base. An optical module of the present invention can clamp the optical fiber through the designed conductive soft glue, and contact with the shell to form an effective conductive seal, effectively solving the electromagnetic radiation problem on the optical port side.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of the Internet, new requirements have been put forward for long-distance and high-bandwidth signal transmission. In the past, cables were used as transmission media. Cables were affected by the skin effect, which would lead to increased signal loss and could not meet the requirements of long-distance transmission. However, optical signals transmitted through optical fibers are not affected by the skin effect and can meet the requirements of long-distance transmission. At the same time, the signal transmission inside the switch is an electrical signal, and current technology cannot support all-optical transmission. Therefore, a device for photoelectric signal conversion is required, one end of which is connected to the switch and the other end is connected to the optical fiber. This device is an optical module.

[0003] During the photoelectric conversion process, the optical module will generate electromagnetic signals, which will radiate outward, interfere with the normal use of peripheral equipment, and affect the accuracy of signal transmission and processing. In actual use scenarios, the optical module will be inserted into a shielding cage, and the electromagnetic radiation will mainly radiate outward through the optical port side. The electromagnetic shielding design of the optical port side is very critical. At the same time, the optical fiber needs to be output on the optical port side, so the outer shell cannot avoid the need for slots. The slots in the outer shell will cause electromagnetic waves to leak from the optical port side. In addition, the upper and lower shells are matched, and they cannot be fully in contact. The slits in the middle will cause interference effects on the light, and the leaked electromagnetic waves will be amplified.

[0004] In addition, the current data center does not have high requirements for the airtightness of optical modules. As the society's requirements for bandwidth continue to increase, the optical modules of data centers will have the need to be replaced every 3-5 years, and the service life requirements are not high. Therefore, the low-cost COB (Chip onboard) solution optical modules have become the main choice of various manufacturers. The main structure of the existing COB solution optical module is as follows: circuit components such as resistors, capacitors and inductors are mounted on the PCB through SMT patches, the optoelectronic chip is bonded to the PCB board through silver glue, the lens is coupled with the optical chip and fixed by glue, and then other components and the shell are assembled to complete the assembly process of the optical module. Among them, the optoelectronic chip is one of the main heat sources and a heat-sensitive device. Corresponding thermal design is required to ensure the reliability of the optical module. The conventional heat conduction path of the current optoelectronic chip position is as follows: chip-PCB top copper sheet-PCB through-hole copper-PCB reverse copper sheet-thermal pad-shell. However, the fixation of the PCB and the shell is pressed by the bosses of the upper and lower covers of the shell, which is a hard connection. And the thermal pad must have a compression amount between the PCB and the shell, and this compression amount will cause an upward squeezing force on the PCB. Conventional PCBs are made of FR4, which is easily deformed by stress. PCB deformation can cause the optical chip to shift. The precision of the optical chip is at the micron level. The displacement of the optical chip can cause the optical path to shift, and in severe cases, the optical module will fail. In addition, PCBs are generally designed as multi-layer boards with a lamination process, and the thickness tolerance can only be controlled within + / -10%. The conventional PCB thickness of optical modules is defined as 1mm, that is, the normal thickness tolerance is + / -0.1mm. When the PCB board thickness is below the tolerance, the board will become loose and skewed, affecting the reliability of module plug-in and pull-out. At present, the plug-in risk is reduced by tightening the shell size tolerance, but tightening the tolerance means higher costs. Summary of the invention

[0005] The object of the present invention is to provide an optical module, which can at least solve some of the defects in the prior art.

[0006] To achieve the above-mentioned purpose, an embodiment of the present invention provides the following technical solution: an optical module, comprising a shell consisting of an upper cover and a base, and an optical fiber arranged in the shell, the head and tail ends of the optical fiber are respectively connected to an optical port adapter and a circuit board, and the middle part of the optical fiber is clamped by conductive soft glue arranged above and below, and the two sides of the conductive soft glue facing away from the optical fiber are respectively in contact with the upper cover and the base.

[0007] Furthermore, the conductive soft glue is a cubic structure.

[0008] Furthermore, the conductive soft glue is a hollow cubic structure.

[0009] Furthermore, there is a gap between the optical port adapter and the circuit board, the middle of the optical fiber is suspended in the air, and the two conductive soft glues clamp the optical fiber in the suspended position.

[0010] Furthermore, both the upper cover and the base are provided with a placement position for placing the conductive soft glue.

[0011] Furthermore, the placement position is in a step-like shape, and the step-like placement position includes a platform for the conductive soft glue to be placed and a retaining wall for blocking the conductive soft glue.

[0012] Furthermore, the placement position on the base is provided with a notch for the optical fiber to pass through.

[0013] Furthermore, two sides of the notch are provided with slots, and the upper cover has two ridges that can be respectively inserted into the two slots.

[0014] Furthermore, a soft pad is provided on one side of the circuit board facing the upper cover.

[0015] Furthermore, there are four soft pads, each of which is arranged at the four corners of the circuit board.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The designed conductive soft glue can clamp the optical fiber and contact the outer shell to form an effective conductive seal, effectively solving the electromagnetic radiation problem on the optical port side.

[0018] 2. By designing the conductive soft glue into a hollow structure, the stress generated by the interference fit between the upper cover and the base cover can be absorbed, avoiding damage to the optical fiber due to excessive stress.

[0019] 3. The gap between the shell and the optical fiber is filled with conductive soft glue, and the electrical connection effect is good.

[0020] 4. The designed placement position can block the soft glue connection position, and the combination of the slot and the ridge can prevent electromagnetic waves from passing through narrow gaps and causing interference enhancement problems.

[0021] 5. By providing a soft pad on the circuit board, the deformation of the circuit board can be reduced; it can also absorb the thickness tolerance of the circuit board to avoid the adaptation problem with the connector. In addition, it can also reduce the processing accuracy requirements of the shell and reduce material costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of an optical module provided by an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of a first-viewing angle of view of an optical module provided by an embodiment of the present invention with the upper cover and sheet metal removed;

[0024] Figure 3 for Figure 2 A partial enlarged schematic diagram of

[0025] Figure 4 A schematic diagram of an optical port adapter, an optical fiber, a conductive soft glue, an optoelectronic chip, and a circuit board assembly of an optical module provided by an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of a circuit board and a soft pad of an optical module provided by an embodiment of the present invention;

[0027] Figure 6 A partial enlarged schematic diagram of an optical module provided by an embodiment of the present invention with the base and sheet metal removed;

[0028] Figure 7 A schematic diagram from a second viewing angle of an optical module provided by an embodiment of the present invention with the upper cover and sheet metal removed;

[0029] Figure 8 for Figure 7 A partial enlarged schematic diagram of

[0030] Fig. 9 Figure 7 A partial enlarged schematic diagram (without the conductive soft glue);

[0031] Fig.10 A schematic diagram of an upper cover of an optical module provided by an embodiment of the present invention;

[0032] In the accompanying drawings: 1-upper cover; 2-base; 3-circuit board; 4-soft pad; 5-convex column; 6-avoidance position; 7-optoelectronic chip; 8-optical port adapter; 9-thermal pad; 10-hole; 11-optical fiber; 12-conductive soft glue; 13-platform; 14-retaining wall; 15-notch; 16-card slot; 17-convex ridge; 18-sheet metal part; 19-handle. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figures 1 to 6The embodiment of the present invention provides an optical module, comprising a housing composed of an upper cover 1 and a base 2, a circuit board 3 is provided on the base 2, and the circuit board 3 is located in the housing, a plurality of soft pads 4 are provided on the side of the circuit board 3 facing the upper cover 1, and the upper cover 1 extends a convex column 5 which can be pressed on the soft pad 4 in the direction of the base 2, and the convex column 5 corresponds to each of the soft pads 4, and each of the convex columns 5 presses on the corresponding soft pad 4. In this embodiment, by providing the soft pad 4 on the circuit board 3 and pressing the soft pad 4 with the convex column 5, the deformation of the circuit board 3 can be reduced; the thickness tolerance of the circuit board 3 can also be absorbed to avoid the problem of matching with the connector, and the processing accuracy requirements of the housing can also be reduced to reduce the material cost. Specifically, the soft pad 4 has a certain deformation ability. When the upper cover 1 is covered on the base 2, the convex column 5 of the upper cover 1 presses on the soft pad 4, and the soft pad 4 is deformed by force to absorb the stress that should be borne by the circuit board 3, so that the deformation of the circuit board 3 can be reduced. Providing multiple soft pads 4 can balance the force on the circuit board 3. Preferably, there are four soft pads 4, which are respectively arranged at the four corners of the circuit board 3. Preferably, the optical module also includes an unlocking structure, which also includes a handle 19 and a sheet metal part 18. The sheet metal part 18 is driven to move by pulling the handle 19 to complete the unlocking.

[0035] As an optimization solution of the embodiment of the present invention, please refer to Figures 1 to 6 The protrusions 5 are arranged on both sides of the upper cover 1, with two protrusions 5 on each side; there is an avoidance position 6 between the two protrusions 5 on each side, and there is a gap between the upper cover 1 and the circuit board 3 through the avoidance position 6. In this embodiment, the avoidance position 6 is designed so that the upper cover 1 does not contact the circuit board 3 at this position, thereby reducing the pressure on the circuit board 3.

[0036] As an optimization solution of the embodiment of the present invention, please refer to Figures 1 to 6 The soft pad 4 is a cubic structure with thickness, the surface of the cubic structure in contact with the circuit board 3 is a plane, and the four corners of the upper part of the cubic structure are chamfered. In this embodiment, the soft pad 4 has a certain thickness, which can play a better role in stress elimination. The soft pad 4 is attached to the circuit board 3, and the bottom plane design facilitates it to better fit the circuit board 3. The designed chamfered corners facilitate cooperation with the protrusion 5.

[0037] As an optimization solution of the embodiment of the present invention, please refer to Figures 1 to 6, an optoelectronic chip 7 is provided on the circuit board 3. In the present embodiment, the optoelectronic chip 7 includes a light-emitting chip, a light-receiving chip, a driving chip, and a transimpedance amplifier, all of which are heat-generating devices. Therefore, they need to be cooled. The heat dissipation method is: the optoelectronic chip 7 transfers the heat to the base 2 through the thermal pad 9, and the thermal pad 9 is arranged on the side of the circuit board 3 away from the upper cover 1. The circuit board 3 has a hole 10, and a copper column is plugged in the hole 10. The optoelectronic chip 7 is connected to the thermal pad 9 through the copper column. In the above embodiment, the stress on the circuit board 3 caused by the heat dissipation method here is solved by adopting the soft pad 4.

[0038] The above embodiments are about the method of eliminating stress of the optical module. The following will introduce the method of improving the electromagnetic protection performance of the optical module.

[0039] See also Figure 1 , Figures 7 to 10 The embodiment of the present invention provides an optical module, comprising a housing composed of an upper cover 1 and a base 2 and an optical fiber 11 arranged in the housing, the ends of the optical fiber 11 are respectively connected to an optical port adapter 8 and a circuit board 3, and the middle of the optical fiber 11 is clamped by conductive soft glue 12 arranged above and below, and the two sides of the conductive soft glue 12 facing away from the optical fiber 11 are respectively in contact with the upper cover 1 and the base 2. In this embodiment, the designed conductive soft glue 12 can clamp the optical fiber 11 and contact with the housing to form an effective conductive seal, which effectively solves the electromagnetic radiation problem on the optical port side. Specifically, the two ends of the optical fiber 11 are respectively connected to the optical port adapter 8 and the optoelectronic chip 7 on the circuit board 3. The optical fiber 11 has a certain length. This embodiment cleverly utilizes the length of the optical fiber 11, arranges a conductive soft glue in the middle position, and clamps the optical fiber 11 by two conductive soft glues 12. Then, it is only necessary to design the size of the conductive soft glue 12, such as its width and thickness, to ensure that an effective conductive seal is formed between it and the housing, thereby effectively solving the electromagnetic radiation problem. Preferably, there is a gap between the optical port adapter 8 and the circuit board 3, the middle of the optical fiber 11 is suspended, and the two conductive soft glues 12 clamp the optical fiber 11 in the suspended position. The conductive soft glue 12 is arranged in the suspended position, which can be conveniently placed in the housing without changing the standard space in the housing.

[0040] As an optimization solution of the embodiment of the present invention, please refer to Figure 4 , the conductive soft glue 12 is a cubic structure. Specifically, it can be a hollow cubic structure. The hollow structure can absorb the stress generated by the interference fit between the upper cover 1 and the base 2, and avoid excessive stress from damaging the optical fiber 11. This is because when the hollow soft glue is compressed, its cavity part can be deformed to absorb pressure, thereby protecting the optical fiber 11.

[0041] As an optimization solution of the embodiment of the present invention, please refer to Figure 7 , Figure 8 and Fig. 9 , the upper cover 1 and the base 2 are both provided with a placement position for placing the conductive soft glue 12. The placement position is in a step-like shape, and the step-shaped placement position includes a platform 13 for placing the conductive soft glue 12 and a retaining wall 14 for blocking the conductive soft glue 12. In this embodiment, placement positions are formed on the base 2 and the upper cover 1 for placing the respective conductive soft glue 12, and the position of the conductive soft glue 12 can be limited. The platform 13 can contact the conductive soft glue 12, and the retaining wall 14 can block the conductive soft glue 12 to prevent it from moving.

[0042] As an optimization solution of the embodiment of the present invention, please refer to Figure 8 and Fig. 9 , the placement position on the base 2 is provided with a notch 15 for the optical fiber 11 to pass through. In this embodiment, the notch 15 is provided at the placement position, specifically on the side of the retaining wall 14, to facilitate the passage of the optical fiber 11 without interfering with the optical fiber 11. Preferably, a card slot 16 is provided on both sides of the notch 15, and the upper cover 1 has two ridges 17 that can be respectively inserted into the two card slots 16. The designed placement position can block the soft glue connection position, and the card slot 16 and the ridge 17 cooperate to prevent electromagnetic waves from passing through the slender slit and causing interference enhancement.

[0043] As an optimization solution of the embodiment of the present invention, a conductive glue is provided at the gap between the housing and the optical fiber 11. The designed conductive glue can fill the gap between the housing and the optical fiber 11, and the electrical connection effect is good.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical module, comprising a housing consisting of an upper cover and a base and an optical fiber arranged in the housing, characterized in that: The head and tail ends of the optical fiber are respectively connected to the optical port adapter and the circuit board, and the middle part of the optical fiber is clamped by conductive soft glue arranged above and below, and the two sides of the conductive soft glue facing away from the optical fiber are respectively abutted against the upper cover and the base, and the conductive soft glue is a cubic structure, and the conductive soft glue is a hollow cubic structure. A soft pad is provided on the side of the circuit board facing the upper cover, and there are four soft pads, each of which is respectively arranged at the four corners of the circuit board, and the upper cover extends a convex column that can be pressed on the soft pad toward the base, and the convex column corresponds to each soft pad one by one, and each convex column presses on its corresponding soft pad.

2. An optical module according to claim 1, characterized in that: There is a gap between the optical port adapter and the circuit board, the middle of the optical fiber is suspended in the air, and the two conductive soft glues clamp the optical fiber in the suspended position.

3. An optical module according to claim 1, characterized in that: The upper cover and the base are both provided with a placement position for placing the conductive soft glue.

4. An optical module as claimed in claim 3, characterized in that: The placement position is in a step shape, and the step-shaped placement position includes a platform for the conductive soft glue to be placed and a retaining wall for blocking the conductive soft glue.

5. An optical module as claimed in claim 3, characterized in that: The placement position on the base is provided with a notch for the optical fiber to pass through.

6. An optical module as claimed in claim 5, characterized in that: The two sides of the notch are provided with card slots, and the upper cover has two convex edges which can be respectively inserted into the two card slots.

Images