Display module and display device

Abstract

The present invention provides a display module and a display device. The display module includes a display panel, the display panel includes a display area and a non-display area arranged around the display area, one side of the non-display area has a binding area; binding pads are arranged in multiple rows and columns, and the binding pads are arranged in the binding area. Therefore, in the present invention, the binding pads are arranged on one side of the non-display area, that is, the binding pads are arranged on a single side of the display module, and multiple rows of binding pads are arranged on the single side, thereby effectively reducing the arrangement size of COF or COG on the single side of the non-display area of ​​the display module, greatly reducing the size of the appearance frame of the display module, and thus helping to achieve a narrow frame design.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the rise of naked-eye 3D and AR / VR technologies, the industry has put forward very high requirements for the resolution of display screens. The original pixel benchmark of 326PPI can no longer meet the demand, and a display density of several thousand PPI has become an urgent need. Then corresponding to such a high PPI, the existing COF (chip on film) or COG (chip on glass) bonding method cannot match it, because under the premise of a significant increase in the amount of information, the number of channels has also increased significantly, and the current bonding process also has a limit size between pins, resulting in the final COF or COG size being much larger than the display area size. Even bilateral bonding cannot solve the problem of the appearance size of the display module, which greatly reduces the overall aesthetics of the display module. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art to at least some extent. To this end, one object of the present invention is to provide a display module that can effectively reduce the arrangement size of COF or COG on one side of the non-display area of ​​the display module, thereby significantly reducing the size of the external frame of the display module.

[0004] In one aspect of the present invention, the present invention provides a display module. According to an embodiment of the present invention, the display module includes a display panel, the display panel includes a display area and a non-display area arranged around the display area, one side of the non-display area has a binding area; binding pads are arranged in multiple rows and columns, and the binding pads are arranged in the binding area. Therefore, in the present invention, the binding pads are arranged on one side of the non-display area, that is, the binding pads are arranged on a single side of the display module, and multiple rows of binding pads are arranged on the single side, thereby effectively reducing the arrangement size of the COF or COG on the single side of the non-display area of ​​the display module, greatly reducing the size of the appearance frame of the display module, and thus helping to achieve a narrow frame design.

[0005] According to an embodiment of the present invention, the binding area includes: a base substrate; a plurality of first conductive layers arranged at intervals, the first conductive layer being located on one side of the base substrate; a first insulating layer, the first insulating layer being arranged on a side of the first conductive layer away from the base substrate; a plurality of second conductive layers arranged at intervals, the second conductive layer being arranged on a side of the first insulating layer away from the base substrate, and being in contact with and connected to the first conductive layer through a first through hole; a second insulating layer, the second insulating layer being arranged on a side of the second conductive layer away from the base substrate; a plurality of binding pads being arranged on the surface of the second insulating layer, and being in contact with and connected to the first conductive layer through a second through hole, the binding pads being located on a side of the second conductive layer away from the display area.

[0006] According to an embodiment of the present invention, the bonding pads in the same column share one first conductive layer.

[0007] According to an embodiment of the present invention, the column of the binding pads corresponds to one second conductive layer.

[0008] According to an embodiment of the present invention, the first conductive layer is disposed in the same layer as the gate electrode layer of the thin film transistor in the display area, and the second conductive layer is disposed in the same layer as the source / drain electrode layer of the thin film transistor.

[0009] According to an embodiment of the present invention, the display area includes pixels arranged in multiple columns, the display module includes m rows and n columns of binding pads, including n groups of data line sets, each group of data line sets includes m*k data lines, at least one column of sub-pixels is bound to one of the binding pads through one of the data lines, wherein the n groups of data line sets are arranged sequentially in the arrangement direction of the binding pad rows, the data lines of the i-th group are bound to the binding pads of the i-th column, m and n are both positive integers greater than or equal to 2, 1≤i≤n, i is an integer, and k is a positive integer.

[0010] According to an embodiment of the present invention, the m*k data lines of the i-th group are respectively bound to the m binding pads in the i-th column, each of the binding pads is bound to k data lines, and in the arrangement direction of the binding pad row, the m*k data lines are alternately bound to the m binding pads in the i-th column.

[0011] According to an embodiment of the present invention, the sub-pixels in two adjacent columns are bound to the one binding pad via one data line.

[0012] According to an embodiment of the present invention, the display module further includes m data selectors, all the data lines in the n groups of data line sets are alternately connected to the m data selectors in sequence, and the data selectors are located between the display area and the binding area.

[0013] According to an embodiment of the present invention, the display module further includes a COF or a COG, a driver IC is disposed on the COF or the COG, the COF or the COG is bound and connected to the binding pad, and the driver IC does not overlap with the display panel.

[0014] In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the display module described above. As a result, the frame size of the display device is narrow and has a large screen-to-body ratio. It can be understood by those skilled in the art that the display device has all the features and advantages of the display module described above, and no further elaboration is given here. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic structural diagram of a display module in one embodiment of the present invention;

[0017] Figure 2 yes Figure 1 Schematic diagram of the cross section along AA';

[0018] Figure 3 yes Figure 1 Schematic diagram of the cross section along BB';

[0019] Figure 4 is a structural schematic diagram of a display module in another embodiment of the present invention;

[0020] Figure 5 is a structural schematic diagram of a display module in another embodiment of the present invention;

[0021] Figure 6 is a corresponding relationship diagram between data lines and COF in another embodiment of the present invention;

[0022] Figure 7 is a corresponding relationship diagram between data lines and COF in another embodiment of the present invention;

[0023] Figure 8 is a corresponding relationship diagram between data lines and COF in another embodiment of the present invention;

[0024] Fig. 9 is a corresponding relationship diagram between data lines and COF in another embodiment of the present invention;

[0025] Fig.10 is a corresponding relationship diagram between data lines and COF in another embodiment of the present invention;

[0026] Fig.11 It is a structural schematic diagram of a display module in yet another embodiment of the present invention. DETAILED DESCRIPTION

[0027] The scheme of the present invention will be explained below in conjunction with embodiments. It will be appreciated by those skilled in the art that the following embodiments are only used to illustrate the present invention and should not be considered as limiting the scope of the present invention. Where specific techniques or conditions are not indicated in the embodiments, the techniques or conditions described in the literature in this area or the product specifications are followed.

[0028] The present invention is described below with reference to specific embodiments. It should be noted that these embodiments are merely illustrative and do not limit the present invention in any way.

[0029] In one aspect of the present invention, the present invention provides a display module. According to an embodiment of the present invention, the display module includes a display panel, referring to Figure 1 The display panel includes a display area 100 and a non-display area 200 arranged around the display area 100, and one side of the non-display area 200 has a binding area; binding pads 210 are arranged in multiple rows and columns, and the binding pads 210 are arranged in the binding area. Therefore, in the present invention, the binding pads are arranged on one side of the non-display area, that is, the binding pads are arranged on a single side of the display module, and multiple rows of binding pads are arranged on the single side, thereby effectively reducing the arrangement size of the COF or COG on the single side of the non-display area of ​​the display module, greatly reducing the size of the appearance frame of the display module, and thus helping to achieve a narrow frame design.

[0030] According to an embodiment of the present invention, referring to Figure 2 ( Figure 1 The cross-sectional view along AA' in the middle) and Figure 3 ( Figure 1), the binding area includes: a base substrate 310; a plurality of first conductive layers 321 arranged at intervals, the first conductive layer 321 is located on one side of the base substrate 310; a first insulating layer 331, the first insulating layer 331 is arranged on a side of the first conductive layer 321 away from the base substrate 310; a plurality of second conductive layers 322 arranged at intervals, the second conductive layer 322 is arranged on a side of the first insulating layer 331 away from the base substrate 310, and is in contact with and connected to the first conductive layer 321 through a first through hole 301; a second insulating layer 332, the second insulating layer 332 is arranged on a side of the second conductive layer 322 away from the base substrate 310; a plurality of binding pads 210 are arranged on the surface of the second insulating layer 332, and are in contact with and connected to the first conductive layer 321 through a second through hole 302, and the binding pads 210 are located on a side of the second conductive layer 322 away from the display area 100. Thus, the bonding pad 210 is overlapped with the display area 100 through the first conductive layer 321 and the second conductive layer 322 overlapped with the display area 100 .

[0031] According to an embodiment of the present invention, referring to Figure 2 As shown, the bonding pads 210 in the same column share a first conductive layer 321. Figure 2 As shown, one column of binding pads 210 corresponds to one second conductive layer 322. Therefore, the above arrangement is conducive to the arrangement of multiple binding pads, and the binding pads arranged in multiple rows and columns are more reasonably arranged in a limited space.

[0032] According to the embodiment of the present invention, the first conductive layer 321 is provided in the same layer as the gate electrode of the thin film transistor in the display area, and the second conductive layer 322 is provided in the same layer as the source-drain electrode layer of the thin film transistor. Therefore, in the manufacturing process, the first conductive layer 321 and the gate electrode of the thin film transistor in the display area are obtained through the same manufacturing step, and the second conductive layer 322 and the source-drain electrode layer of the thin film transistor are obtained through the same manufacturing step, thereby greatly simplifying the process flow without increasing the process time and cost.

[0033] According to an embodiment of the present invention, referring to Figure 4 ( Figure 4(In the example, m=2, n=4 are taken as examples), the display area includes pixels arranged in multiple columns, the display module includes m rows and n columns of binding pads 210, including n groups of data line sets 10, each group of data line sets (lane) 10 includes m*k data lines 11, at least one column of sub-pixels is bound to a binding pad 210 through a data line 11, wherein the n groups of data line sets 10 are arranged in sequence in the direction of the binding pad row arrangement, the data line of the i-th group is bound to the binding pad of the i-th column, m and n are both positive integers greater than or equal to 2, 1≤i≤n, and i is an integer, and k is a positive integer. Thus, the data lines connecting the sub-pixels of the display area are arranged in sequence in the row direction and overlapped with the binding pads, and alternately overlapped with the binding pads of different rows, that is, multiple data lines are cross-arranged, thereby making it possible to arrange the data lines more reasonably in a limited space, saving space, and thus helping to achieve a narrow frame design of the display module.

[0034] According to an embodiment of the present invention, referring to Figure 4 , the m*k data lines of the i-th group are respectively bound to the m binding pads in the i-th column, each binding pad is bound to k data lines, and in the row arrangement direction of the binding pads, the m*k data lines are alternately bound to the m binding pads in the i-th column. Thus, the data lines connecting the sub-pixels of the display area are sequentially arranged in the row direction and overlapped with the binding pads, and alternately overlapped with the binding pads of different rows, that is, multiple data lines are cross-arranged, thereby making it possible to arrange the data lines more reasonably in a limited space, saving space, and thus helping to realize the narrow frame design of the display module. Moreover, the vertical layout design of the leads and the signal cross supply method are used in the present invention to realize the transmission of a large amount of information.

[0035] According to the embodiment of the present invention, sub-pixels in two adjacent columns are bound to one binding pad via one data line, thereby making it possible to better and more reasonably arrange the layout of the data lines and to lay out more data lines in a limited space.

[0036] According to an embodiment of the present invention, referring to Figure 5 The display module also includes m data selectors (MUX) 410, all data lines in the n data line sets are alternately connected to the m data selectors in sequence, and the data selector 410 is located between the display area 100 and the binding area. Figure 5 The sub-pixels 101 in the middle display area 100 are connected to the data selector 410 in turn and then bonded to the pad.

[0037] According to an embodiment of the present invention, referring to Figure 4 and Figure 6The display module also includes COF or COG (COF is used as an example in the figure), COF is bound to the pad, one pad binding corresponds to one COF, one COF corresponds to one data line set 10, and one data line set includes k data lines. Among them, multiple pads in the same column can be bound to bundle, that is, multiple COFs in the same column can be bundled, such as Figure 6 , split the data line sets of the upper and lower COFs into 4 bundled blocks, and filter the data of each bundled block based on MUX and Channel, such as COF1&COF2 blocks, refer to Figure 7 , data line A1 / A2 is split through MUX1 / MUX2, but the data all passes through the first channel of COF1, so it belongs to COF1, and the adjacent A3 / A4 is also split through MUX1 / MUX2, and the data all passes through the first channel of COF2, so it belongs to COF2. It can be seen that the data of each bundled block belongs to the upper and lower COFs in a cycle of 4, and to MUX1 / MUX2 in a cycle of 2; based on this, the corresponding data table of the upper and lower COFs and MUX1 / MUX2 of each bundled block can be screened out as follows Figure 8 As shown; the bundled and filtered data is merged according to Lane, as shown Fig. 9 As shown; finally, the bundled block data is merged to form 8Lane image data for transmission and display, as shown Fig.10 Therefore, the present invention utilizes the vertical layout design of the leads and the signal cross supply method to achieve the transmission of a large amount of information; at the same time, through the above-mentioned screening signal processing method, the chaotic data signals are arranged in an orderly manner to achieve accurate and effective information transmission.

[0038] According to an embodiment of the present invention, referring to Fig.11 The display module further includes a COF 500 or a COG 500, a driving IC 510 is arranged on the COF 500 or the COG 500, and the COF 500 or the COG 500 is bound and connected to the binding pad 210, and the driving IC 510 does not overlap with the display panel, that is, there is a gap d between the driving IC 510 and the display panel. Thus, it is possible to avoid interference between the driving IC 510 and the edge of the display panel, which causes a decrease in the yield of the binding between the COF 500 or the COG 500 and the binding pad 210.

[0039] In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the display module described above. As a result, the frame size of the display device is narrow and has a large screen-to-body ratio. It can be understood by those skilled in the art that the display device has all the features and advantages of the display module described above, and no further elaboration is given here.

[0040] According to the embodiments of the present invention, there are no special requirements for the specific type of the display device, and those skilled in the art can flexibly select according to actual conditions. For example, the display device can be any display device with a display function, such as a mobile phone, iPad, notebook, game console, etc.

[0041] Those skilled in the art will appreciate that, in addition to the above-mentioned structures, the display device may also have some structures or components necessary for a conventional display device. Taking a mobile phone as an example, it may also include necessary structures and components such as a camera module, an audio module, a back cover, a middle frame and a fingerprint module.

[0042] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0044] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a display area and a non-display area arranged around the display area, one side of the non-display area having a binding area; Binding pads are arranged in multiple rows and columns at intervals, and the binding pads are arranged in the binding area; The binding area includes: substrate substrate; A plurality of first conductive layers arranged at intervals, wherein the first conductive layers are located on one side of the base substrate; A first insulating layer, wherein the first insulating layer is disposed on a side of the first conductive layer away from the substrate; a plurality of second conductive layers arranged at intervals, wherein the second conductive layers are arranged on a side of the first insulating layer away from the base substrate and are in contact with and connected to the first conductive layer through first through holes; a second insulating layer, the second insulating layer being arranged on a side of the second conductive layer away from the base substrate; A plurality of bonding pads are arranged on the surface of the second insulating layer and are in contact with and connected to the first conductive layer through second through holes, and the bonding pads are located on a side of the second conductive layer away from the display area; The bonding pads in the same column share one first conductive layer; The display area includes pixels arranged in multiple columns, the display module includes m rows and n columns of binding pads, including n groups of data line sets, each group of data line sets includes m*k data lines, at least one column of sub-pixels is bound to one of the binding pads through one of the data lines, the data lines connecting the sub-pixels in the display area are arranged in sequence in the row direction and overlapped with the binding pads, and are alternately overlapped with the binding pads of different rows.

2. The display module according to claim 1, characterized in that: One column of the bonding pads corresponds to one second conductive layer.

3. The display module according to claim 1, characterized in that: The first conductive layer is disposed in the same layer as the gate electrode layer of the thin film transistor in the display area, and the second conductive layer is disposed in the same layer as the source / drain electrode layer of the thin film transistor.

4. The display module according to claim 1, characterized in that: The n groups of data lines are arranged in sequence in the row arrangement direction of the binding pads, the data line of the i-th group is bound to the binding pad of the i-th column, m and n are both positive integers greater than or equal to 2, 1≤i≤n, and i is an integer, and k is a positive integer.

5. The display module according to claim 4, characterized in that: The m*k data lines of the i-th group are respectively bound to the m binding pads in the i-th column, each binding pad is bound to k data lines, and in the arrangement direction of the binding pad row, the m*k data lines are alternately bound to the m binding pads in the i-th column.

6. The display module according to claim 4, characterized in that: The sub-pixels in two adjacent columns are bound to one of the binding pads via one of the data lines.

7. The display module according to claim 4, characterized in that: It also includes m data selectors, all the data lines in the n groups of data line sets are alternately connected to the m data selectors in sequence, and the data selectors are located between the display area and the binding area.

8. The display module according to claim 4, characterized in that: It also includes a COF or a COG, on which a driving IC is arranged, the COF or the COG is bound and connected to the binding pad, and the driving IC does not overlap with the display panel.

9. A display device, characterized in that: A display module comprising any one of claims 1 to 8.

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